Solar cell silicon wafer drying and curing integrated device

Abstract

This invention discloses an integrated drying and curing device for solar cell silicon wafers, relating to the field of solar cell production technology. It includes a frame for mounting components for drying and curing solar cells. Multiple fixing rods are symmetrically arranged at the bottom of the frame, and support feet are respectively installed at the bottom of each fixing rod. A heating chamber is located above the frame, comprising a top plate and a bottom plate. This invention uses a fan to blow hot air onto the surface of the solar cell silicon wafers, which can quickly remove moisture and solvents from the wafer surface. Simultaneously, it can preheat the silicon wafers, reducing the impact of sudden temperature changes and achieving high drying efficiency. Furthermore, it allows for gas circulation within the heating chamber, ensuring a uniform gas environment and reducing temperature differences between different areas. It also removes organic gases volatilized from slurry and coating materials, preventing contamination of the heating chamber and ensuring the quality of the silicon wafer drying and curing.

Description

Technical Field

[0001] This invention relates to the field of solar cell manufacturing technology, and in particular to an integrated equipment for drying and curing silicon wafers for solar cells. Background Technology

[0002] Silicon wafers are one of the core components of solar cells. They play a crucial role in photoelectric conversion. When sunlight shines on a silicon wafer, the semiconductor material in the wafer absorbs photon energy, causing electrons to jump and generating photogenerated charge carriers (electrons and holes). These charge carriers separate under the influence of an internal electric field, forming current and voltage, thus realizing the conversion of solar energy into electrical energy.

[0003] Drying and curing silicon wafers is a crucial step in the solar cell production process. Its main purpose is to remove moisture and solvents from the silicon wafer surface and to solidify the pastes and coatings on the surface, ensuring the performance and quality of the solar cells. However, existing solar cell silicon wafer drying equipment suffers from uneven temperature distribution within the oven due to factors such as the distribution of heating elements and the structural design of the oven. This uneven heating of different parts of the silicon wafer affects the curing effect of the pastes and coatings, leading to inconsistent performance of the solar cell silicon wafers. Therefore, this application proposes an integrated equipment for drying and curing solar cell silicon wafers. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an integrated drying and curing device for solar cell silicon wafers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An integrated equipment for drying and curing solar cell silicon wafers includes a frame for mounting components for drying and curing solar cell wafers. Multiple fixing rods are symmetrically arranged at the bottom of the frame, and support feet are respectively installed at the bottom of the multiple fixing rods.

[0007] A heating chamber is located above the frame. The heating chamber includes a top plate and a bottom plate. The two sides of the bottom plate are fixedly connected to the side walls of the frame. Two side plates are connected between the top plate and the bottom plate. A door panel is connected to the top plate and the two side plates. The bottom of the door panel is fixedly connected to the side walls of the frame.

[0008] A conveying mechanism, which is arranged between the frames, is used to transport solar cell silicon wafers;

[0009] A baffle is provided on one side of the heating chamber, and the bottom of the baffle is fixedly connected to the frame.

[0010] A valve plate is connected through the top plate. A cylinder is provided on one side of the valve plate, and the bottom of the cylinder is fixedly connected to a baffle. The telescopic end of the cylinder is connected to the side wall of the valve plate by multiple sets of bolts.

[0011] A movable plate and an assembly box are slidably connected through each other, and both the movable plate and the assembly box are located in a heating chamber;

[0012] The pressing mechanism is located below the assembly box and is used to press the solar cell silicon wafer during transportation to increase the friction between the solar cell silicon wafer and the transportation mechanism.

[0013] The heating wire, located inside the heating chamber and fixedly installed below the top plate, is used to provide the heat required for drying and curing.

[0014] Preferably, the top plate has a through groove, and the through groove corresponds to the position of the valve plate;

[0015] A groove is provided on one side of the through groove, and the position of the groove corresponds to the position of the cylinder.

[0016] Preferably, the door panel has multiple air inlets, and a discharge port is provided below the multiple air inlets. The height of the discharge port is equal to the height of the baffle, and multiple sets of baffles are installed at the discharge port.

[0017] Preferably, the conveying mechanism includes multiple conveyor belts, which are connected by a drive shaft, and one side of one of the drive shafts is connected to a motor via a coupling.

[0018] Preferably, limiting plates are slidably connected to both sides of the valve plate, and the two limiting plates are respectively fixedly connected to the corresponding side plates;

[0019] The bottom of the two limiting plates is connected to a sealing plate. The bottom of the sealing plate is fixedly connected to the base plate. The top of the sealing plate is provided with a positioning groove, and the width of the positioning groove is equal to the width of the valve plate.

[0020] Preferably, the assembly box has a connecting groove, and the bottom of the movable plate extends into the connecting groove;

[0021] Two fans are symmetrically installed on the side wall of the assembly box, and the two fans are connected by a fixed base.

[0022] Preferably, a bushing is connected to one end of the movable plate extending outside the assembly box, a connecting rod is connected through the bushing, and the bushing and the connecting rod are rotatably connected, while the connecting rod is fixedly connected to the side wall of the valve plate.

[0023] The movable plate has multiple guide grooves equidistantly spaced on one side wall of the assembly box relative to the interior.

[0024] Preferably, the two sides of the assembly box are respectively connected to bearing seats, and the ends of the two bearing seats away from the assembly box are respectively rotatably connected to support rods, and the two support rods are respectively fixedly connected to the corresponding side plates.

[0025] Preferably, the pressing mechanism includes a connecting seat fixedly connected to the bottom of the assembly box, a spring is provided below the connecting seat, an extension plate is connected to the bottom of the spring, and a roller is installed on the extension plate.

[0026] Compared with the prior art, the beneficial effects of this invention are as follows:

[0027] 1. Compared with the prior art, the present invention solves the problem of uneven drying and curing caused by temperature differences. By setting a valve plate to drive the movable plate to move, the size of the air outlet on one side of the assembly box is adjusted. In conjunction with the rotation of the assembly box itself, the wind speed and direction of the hot air are adjusted. Finally, the fan blows the hot air onto the surface of the solar cell silicon wafer, which can quickly remove the moisture and solvent on the surface of the silicon wafer. At the same time, it can preheat the silicon wafer and reduce the impact of sudden temperature changes, resulting in high drying efficiency.

[0028] 2. Compared with the prior art, the present invention also solves the problem of the impact of the exhaust gas volatilized during the drying process on the gas environment inside the heating chamber. By setting up a fan to blow air onto the surface of the battery silicon wafer, and in conjunction with multiple air inlets opened on the other side, the gas inside the heating chamber is circulated, ensuring that the gas environment inside the heating chamber changes uniformly, reducing the temperature difference between different areas, and at the same time, expelling the organic gases volatilized from the slurry and coating materials, avoiding contamination inside the heating chamber that would affect the drying and fixing quality of the silicon wafer.

[0029] 3. Furthermore, through the set pressing mechanism, when the solar cell silicon wafers are transported on the conveyor belt, the rollers abut against the upper surface of the carrier plate, which can increase the friction between the bottom of the carrier plate and the conveyor belt. When the chain is baked by the heat of the heating wire for a long time, causing the pitch to change, it can reduce the jumping and slipping of the silicon wafers, and prevent the silicon wafers from shifting or shaking during the drying and curing process, thus affecting the drying and curing effect and improving the stability of the transmission. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the main view structure in this invention;

[0031] Figure 2 This is a schematic diagram of the lower view portion of the structure in this invention;

[0032] Figure 3 This is a schematic diagram of the conveying mechanism in this invention;

[0033] Figure 4This is a schematic diagram of the top plate and heating wire in this invention;

[0034] Figure 5 This is a schematic diagram of the structure of the valve plate, the movable plate, and the assembly box in this invention;

[0035] Figure 6 This is a schematic diagram of the structure of the movable plate and the assembly box in this invention;

[0036] Figure 7 This is a schematic diagram of the main structure of the movable plate in this invention;

[0037] Figure 8 This is a schematic diagram of the pressing mechanism in this invention.

[0038] In the diagram: 1. Frame; 11. Fixing rod; 12. Supporting leg;

[0039] 2. Heating chamber; 21. Top plate; 211. Through slot; 212. Groove; 22. Bottom plate; 23. Side plate; 24. Door panel; 241. Air inlet; 242. Discharge outlet; 243. Curtain;

[0040] 3. Conveying mechanism; 31. Conveyor belt; 32. Drive shaft; 33. Motor;

[0041] 4. Baffle;

[0042] 5. Valve plate; 51. Limiting plate; 52. Sealing plate; 53. Positioning groove;

[0043] 6. Movable plate; 61. Bushing; 62. Connecting rod; 63. Guide groove;

[0044] 7. Assembly box; 71. Connecting groove; 72. Shaft seat; 73. Support rod; 74. Fan; 75. Fixed seat;

[0045] 8. Pressing mechanism; 81. Connecting seat; 82. Spring; 83. Extension plate; 84. Roller;

[0046] 9. Heating wire. Detailed Implementation

[0047] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0048] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0049] Example 1:

[0050] Reference Figure 1 and Figure 2 An integrated equipment for drying and curing solar cell silicon wafers includes a frame 1 for mounting components for drying and curing solar cell wafers. Multiple fixing rods 11 are symmetrically arranged at the bottom of the frame 1, and support feet 12 are respectively installed at the bottom of the multiple fixing rods 11.

[0051] Heating chamber 2 is located above frame 1. Heating chamber 2 includes top plate 21 and bottom plate 22. The two sides of bottom plate 22 are fixedly connected to the side wall of frame 1. Two side plates 23 are connected between top plate 21 and bottom plate 22. Door panel 24 is connected between top plate 21 and the two side plates 23. The bottom of door panel 24 is fixedly connected to the side wall of frame 1.

[0052] Conveying mechanism 3 is installed between the frame bodies 1 and is used to transport solar cell silicon wafers;

[0053] Baffle 4 is set on one side of heating chamber 2, and the bottom of baffle 4 is fixedly connected to frame 1;

[0054] Valve plate 5 is connected through to top plate 21. A cylinder is provided on one side of valve plate 5, and the bottom of the cylinder is fixedly connected to baffle 4. The telescopic end of the cylinder is connected to the side wall of valve plate 5 by multiple sets of bolts.

[0055] The movable plate 6 and the assembly box 7 are slidably connected, and both the movable plate 6 and the assembly box 7 are located inside the heating chamber 2.

[0056] Pressing mechanism 8 is located below assembly box 7 and is used to press the solar cell silicon wafer during transportation to increase the friction between the solar cell silicon wafer and the transportation mechanism 3.

[0057] The heating wire 9 is located inside the heating chamber 2 and fixedly installed below the top plate 21 to provide the heat required for drying and curing.

[0058] In this embodiment, the pre-processor places the solar cell silicon wafers onto the carrier plate and moves the carrier plate onto the conveyor mechanism 3. Under the transport of the conveyor belt 31, the silicon wafers are moved under the baffle 4. At this time, the valve plate 5 is opened and the carrier plate enters the heating chamber 2. It is dried and cured under the heat provided by the heating wire 9. Finally, it is transported to the outside of the heating chamber 2 through the discharge port 242 opened on the door plate 24 for subsequent processing.

[0059] Example 2:

[0060] Unlike Example 1, referring to Figure 2 and Figure 4 This embodiment also has the following further features: a through groove 211 is provided on the top plate 21, and the position of the through groove 211 corresponds to that of the valve plate 5. A groove 212 is provided on one side of the through groove 211, and the position of the groove 212 corresponds to that of the cylinder. It should be noted that when the solar cell silicon wafer is being transported, the extension end of the control cylinder drives the valve plate 5 to move upward. Through the through groove 211, the top of the valve plate 5 moves above the top plate 21. The groove 212 can prevent the top plate 21 from obstructing the extension end of the cylinder during the operation of the cylinder.

[0061] The door panel 24 has multiple air inlets 241, and a discharge port 242 is provided below the multiple air inlets 241. The height of the discharge port 242 is equal to the height of the baffle 4. Multiple sets of baffle curtains 243 are installed at the discharge port 242. Specifically, the heating chamber 2 is composed of a top plate 21, a bottom plate 22, a side plate 23, a door panel 24, and a valve plate 5. With the movement of the valve plate 5 and the setting of multiple baffle curtains 243, the heating chamber 2 forms a closed space, which facilitates the maintenance of the internal temperature of the heating chamber 2 and shortens the time required to raise it to the drying temperature.

[0062] Implementation Three:

[0063] Compared to Embodiment 1 and Embodiment 2, refer to Figure 3 The conveying mechanism 3 includes multiple conveyor belts 31, which are connected by a drive shaft 32. One side of the drive shaft 32 is connected to a motor 33 via a coupling. Furthermore, the output shaft of the motor 33 drives the drive shaft 32 to rotate, thereby driving multiple sets of conveyor belts 31 to operate synchronously, ensuring that all parts of the carrier plate maintain consistency during movement.

[0064] Specifically, refer to Figure 5 Limiting plates 51 are slidably connected to both sides of the valve plate 5. The two limiting plates 51 are fixedly connected to the corresponding side plates 23 respectively. The bottom of the two limiting plates 51 is connected to a sealing plate 52. The bottom of the sealing plate 52 is fixedly connected to the bottom plate 22. The top of the sealing plate 52 is provided with a positioning groove 53, and the width of the positioning groove 53 is equal to the width of the valve plate 5.

[0065] Furthermore, when the solar cell silicon wafers are transported into the heating chamber 2 by multiple sets of conveyor belts 31, the valve plate 5 set between the two sets of conveyor mechanisms 3 opens, so that the interior of the heating chamber 2 is connected to the bottom of the baffle 4. With the fixation of the limit plates 51 on both sides, the valve plate 5 remains vertically upward and finally the top of the valve plate 5 is moved above the top plate 21 by the extension end of the cylinder. This is suitable for carrier plates and solar cell silicon wafers of different thicknesses.

[0066] Example 4:

[0067] Reference Figure 6 and Figure 7 Compared to embodiments one to three, in order to improve the drying and curing efficiency, the following improvements are made: a connecting groove 71 is provided on the assembly box 7, and the bottom of the movable plate 6 extends into the connecting groove 71. Two fans 74 are symmetrically installed on the side wall of the assembly box 7, and a fixed seat 75 is connected between the two fans 74. A bushing 61 is connected to one end of the movable plate 6 extending outside the assembly box 7. A connecting rod 62 is connected through the bushing 61, and the bushing 61 and the connecting rod 62 are rotatably connected. The connecting rod 62 is fixedly connected to the side wall of the valve plate 5. Multiple guide grooves 63 are equidistantly provided on the side wall of the movable plate 6 opposite to the inside of the assembly box 7. It should be noted that as the movable plate 6 moves, the angle between the assembly box 7 and the feed port below the baffle 4 can be adjusted simultaneously, so that the angle of the gas discharged from the assembly box 7 can be flexibly adjusted as needed, and the coverage area of ​​the gas on the battery silicon wafer on the carrier plate can be adjusted.

[0068] In addition, two bearing seats 72 are connected to the two sides of the assembly box 7 respectively. The two bearing seats 72 are rotatably connected to the ends away from the assembly box 7. The two support rods 73 are fixedly connected to the corresponding side plates 23 respectively. It should be noted that when the movable plate 6 moves, the top of the movable plate 6 moves vertically along the direction of the valve plate 5. With the connection between the bearing seat 72 and the support rod 73, the assembly box 7 rotates synchronously at this time, so that the bottom of the movable plate 6 moves in the connecting groove 71, adjusting the distance between the movable plate 6 and the bottom of the assembly box 7, thereby achieving different air outlet rates and coverage areas.

[0069] In this embodiment, when the valve plate 5 moves upward, the upper end of the movable plate 6 moves upward synchronously via the connecting rod 62. At this time, the bushing 61 and the connecting rod 62 rotate. With the rotation of the bearing seat 72, the movable plate 6 forms an air outlet on one side of the assembly box 7, allowing the airflow blown by the fan 74 to be discharged from inside the assembly box 7 to the outside. Finally, the airflow blows onto the surface of the battery silicon wafer, which can quickly remove moisture and solvent from the surface of the battery silicon wafer. Under the guidance of the airflow, the thicker coating can spread outwards, improving the uniformity after curing. At the same time, the fan 74, together with the air inlet 241 opened in the door plate 24, can drive the gas flow inside the heating chamber 2, making the heat distribution more uniform. The fan 74 drives the gas to flow to the bottom of the baffle 4, discharging the organic gas that evaporates in the heating chamber 2, thus avoiding affecting the curing reaction of the battery silicon wafer.

[0070] Based on the above embodiments one to three, in order to improve the stability of solar cell silicon wafers during transportation, refer to... Figure 8 The pressing mechanism 8 includes a connecting seat 81 fixedly connected to the bottom of the assembly box 7. A spring 82 is provided below the connecting seat 81, and an extension plate 83 is connected to the bottom of the spring 82. A roller 84 is installed on the extension plate 83. Specifically, when the assembly box 7 rotates, it drives the roller 84 below to move synchronously. The roller 84 abuts against the gap between the solar cell silicon wafer on the carrier plate. The pressure between the roller 84 and the carrier plate can be adjusted by the spring 82. When the conveyor belt 31 moves the carrier plate, the friction between the conveyor belt 31 and the carrier plate is increased because the roller 84 abuts against the carrier plate, avoiding jumping and slipping. This prevents the silicon wafer from shifting or shaking during the drying and curing process, thus affecting the drying and curing effect and improving the production quality of solar cell silicon wafers.

[0071] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An integrated drying and curing equipment for solar cell silicon wafers, characterized in that, Includes a frame (1) for installing components for drying and curing solar cells. The bottom of the frame (1) is symmetrically provided with multiple fixing rods (11), and the bottom of each of the multiple fixing rods (11) is respectively equipped with a support foot (12). A heating chamber (2) is set above the frame (1). The heating chamber (2) includes a top plate (21) and a bottom plate (22). The two sides of the bottom plate (22) are fixedly connected to the side walls of the frame (1). The top plate (21) and the bottom plate (22) are connected together by two side plates (23). The top plate (21) and the two side plates (23) are connected together by a door panel (24). The bottom of the door panel (24) is fixedly connected to the side wall of the frame (1). A conveying mechanism (3) is arranged between the frames (1) for transporting solar cell silicon wafers; A baffle (4) is provided on one side of the heating chamber (2), and the bottom of the baffle (4) is fixedly connected to the frame (1); Valve plate (5), the valve plate (5) is connected through the top plate (21), a cylinder is provided on one side of the valve plate (5), and the bottom of the cylinder is fixedly connected to the baffle (4). The telescopic end of the cylinder is connected to the side wall of the valve plate (5) by multiple sets of bolts. The movable plate (6) and the assembly box (7) are slidably connected, and both the movable plate (6) and the assembly box (7) are located inside the heating chamber (2). The pressing mechanism (8) is located below the assembly box (7) and is used to press the solar cell silicon wafer during the transportation process to increase the friction between the solar cell silicon wafer and the transportation mechanism (3). A heating wire (9) is located inside the heating chamber (2) and fixedly installed below the top plate (21) to provide the heat required for drying and curing.

2. The solar cell silicon wafer drying and curing integrated equipment according to claim 1, characterized in that, The top plate (21) is provided with a through groove (211), and the through groove (211) corresponds to the position of the valve plate (5); A groove (212) is provided on one side of the through groove (211), and the position of the groove (212) corresponds to the position of the cylinder.

3. The solar cell silicon wafer drying and curing integrated equipment according to claim 1, characterized in that, The door panel (24) has multiple air inlets (241), and a discharge port (242) is provided below the multiple air inlets (241). The height of the discharge port (242) is equal to the height of the baffle (4), and multiple sets of baffle curtains (243) are installed at the discharge port (242).

4. The solar cell silicon wafer drying and curing integrated equipment according to claim 1, characterized in that, The conveying mechanism (3) includes multiple conveyor belts (31), which are connected by a drive shaft (32), and one side of the drive shaft (32) is connected to a motor (33) via a coupling.

5. The solar cell silicon wafer drying and curing integrated equipment according to claim 1, characterized in that, Limiting plates (51) are slidably connected to both sides of the valve plate (5), and the two limiting plates (51) are respectively fixedly connected to the corresponding side plates (23); The bottom of the two limiting plates (51) are connected to a sealing plate (52). The bottom of the sealing plate (52) is fixedly connected to the bottom plate (22). The top of the sealing plate (52) is provided with a positioning groove (53), and the width of the positioning groove (53) is equal to the width of the valve plate (5).

6. The solar cell silicon wafer drying and curing integrated equipment according to claim 1, characterized in that, The assembly box (7) is provided with a connecting groove (71), and the bottom of the movable plate (6) extends into the connecting groove (71); Two fans (74) are symmetrically installed on the side wall of the assembly box (7), and the two fans (74) are connected by a fixed base (75).

7. The solar cell silicon wafer drying and curing integrated equipment according to claim 6, characterized in that, The movable plate (6) extends to one end outside the assembly box (7) and is connected to a bushing (61). A connecting rod (62) is connected through the bushing (61), and the bushing (61) and the connecting rod (62) are rotatably connected. The connecting rod (62) is fixedly connected to the side wall of the valve plate (5). The movable plate (6) has multiple guide grooves (63) equidistantly spaced on one side wall of the assembly box (7) relative to the inside of the assembly box (7).

8. The solar cell silicon wafer drying and curing integrated equipment according to claim 1, characterized in that, The assembly box (7) is connected to two bearing seats (72) on both sides respectively. The two bearing seats (72) are rotatably connected to the ends away from the assembly box (7) with support rods (73) respectively. The two support rods (73) are fixedly connected to the corresponding side plates (23) respectively.

9. The solar cell silicon wafer drying and curing integrated equipment according to claim 1, characterized in that, The pressing mechanism (8) includes a connecting seat (81) fixedly connected to the bottom of the assembly box (7), a spring (82) is provided below the connecting seat (81), an extension plate (83) is connected to the bottom of the spring (82), and a roller (84) is installed on the extension plate (83).

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