Sound absorbing structure and server

Abstract

This invention provides a sound-absorbing structure comprising at least one sound-absorbing unit. The sound-absorbing unit includes multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each sub-unit includes multiple sound-absorbing chambers and multiple connecting channels, which are interconnected. At least one of the connecting channels of at least one of the sub-units is connected to the sound-permeable groove. The sound-absorbing structure provided by this invention effectively prevents noise generated by a fan from affecting the storage device.

Description

Technical Field

[0001] This invention relates to a sound-absorbing structure and a server. Background Technology

[0002] To cope with the ever-increasing computing demands, server hardware performance is constantly improving, which also brings considerable heat dissipation. As a common solution in cooling systems, the increased cooling efficiency of cooling fans is accompanied by increased fan noise, and noise at certain frequencies can affect the performance of storage devices.

[0003] Currently, most noise reduction methods involve attaching low-cost passive noise-reducing components to the inside of the chassis and the backplate of the storage device to reduce the impact of noise on the performance of the storage device. However, the noise reduction effect of these components is often unsatisfactory and cannot effectively reduce noise in specific frequency bands, especially sensitive frequency bands that can easily affect hard drive read and write performance. Therefore, researchers in this field are currently working to solve the aforementioned problems. Summary of the Invention

[0004] The present invention provides a sound-absorbing structure and server that can effectively prevent noise generated by the fan from affecting the storage device.

[0005] An embodiment of the present invention discloses a sound-absorbing structure comprising at least one sound-absorbing unit. The sound-absorbing unit comprises multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each sub-unit comprises multiple sound-absorbing chambers and multiple connecting channels, which are interconnected. At least one of the connecting channels of at least one of the sub-units is connected to the sound-permeable groove.

[0006] Another embodiment of the present invention discloses a server comprising a chassis, a hard disk module, a fan module, and a sound-absorbing structure. The chassis includes a hard disk housing area and a fan housing area. The hard disk module is disposed in the hard disk housing area. The fan module is disposed in the fan housing area. The sound-absorbing structure is disposed between the hard disk housing area and the fan housing area and includes at least one sound-absorbing unit. The sound-absorbing unit includes multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each sub-unit includes multiple sound-absorbing chambers and multiple connecting channels, which are interconnected. At least one of the connecting channels of at least one of the sub-units is connected to the sound-permeable groove.

[0007] According to the sound-absorbing structure and server disclosed in the above embodiments, by setting the sound-absorbing structure between the hard disk housing area and the fan housing area, the sub-units of the sound-absorbing unit of the sound-absorbing structure are arranged in an array and connected to each other to form a sound-permeable groove. The sound-absorbing chambers and connecting channels of each sub-unit are connected. One of the connecting channels of at least one of these sub-units is connected to the sound-permeable groove, which allows the sound generated by the fan module to enter the sound-absorbing chamber through the connecting channel of the sub-unit and dissipate. Therefore, the noise transmitted from the fan module to the hard disk module is effectively reduced to avoid the noise affecting the performance of the hard disk module.

[0008] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0009] Figure 1 This is a plan view of a server disclosed according to a first embodiment of the present invention.

[0010] Figure 2 for Figure 1 A partial planar schematic diagram of the sound-absorbing structure.

[0011] Figure 3 for Figure 2 A planar schematic diagram of the sound-absorbing unit of the sound-absorbing structure.

[0012] Figure 4 for Figure 3 A planar schematic diagram of the deformation of the sound-absorbing unit.

[0013] Component designation explanation

[0014] 1: Server

[0015] 10: Chassis

[0016] 11: Hard drive storage area

[0017] 12: Fan housing area

[0018] 13: Motherboard Compartment Area

[0019] 14: Power Supply Area

[0020] 20: Hard disk module

[0021] 30: Fan Module

[0022] 40: Sound-absorbing structure

[0023] 41: Sound Absorption Unit

[0024] 411: Subunit

[0025] 4111: Sound-absorbing chamber

[0026] 4112: Connecting Channel

[0027] 412: Connecting part

[0028] 413: Sound-transparent slot

[0029] 4131: First side

[0030] 4132: Second side

[0031] 4133: Third side

[0032] 4134: Fourth side

[0033] 4135:End

[0034] 4136: Central Department

[0035] 50: Motherboard

[0036] 60: Power Supply Module

[0037] L: Length direction

[0038] H: Height direction

[0039] W1, W2: Width

[0040] T: Thickness Detailed Implementation

[0041] Please see Figure 1 and Figure 2 , Figure 1 This is a plan view of a server disclosed according to a first embodiment of the present invention. Figure 2 for Figure 1 A partial planar schematic diagram of the sound-absorbing structure.

[0042] In this embodiment, server 1 includes a chassis 10, at least one hard disk module 20, a fan module 30, and a sound-absorbing structure 40. Furthermore, server 1 may also include, for example but not limited to, a motherboard 50 and a power supply module 60.

[0043] The chassis 10 includes a hard drive housing 11, a fan housing 12, a motherboard housing 13, and a power supply housing 14. The hard drive housing 11, fan housing 12, motherboard housing 13, and power supply housing 14 are arranged sequentially along the length of the chassis 10. The hard drive module 20, fan module 30, motherboard 50, and power supply module 60 are respectively disposed in the hard drive housing 11, fan housing 12, motherboard housing 13, and power supply housing 14. A sound-absorbing structure 40 is disposed within the chassis 10 and located between the hard drive housing 11 and the fan housing 12.

[0044] The sound-absorbing structure 40, for example, is a monolithic planar auxetic metamaterial (PAM). Through precisely designed microstructures, rather than relying on the chemical composition of ordinary materials, it can impart unique physical properties (such as negative mass density, negative Poisson's ratio, and negative refractive index) to block sound waves of specific frequencies. The sound-absorbing structure 40 can elastically deform along its length L and height H, and its thickness T is, for example, greater than or equal to 5 mm and less than or equal to 10 mm. The sound-absorbing structure 40 comprises multiple sound-absorbing units 41 arranged in a matrix and interconnected. This design allows the sound-absorbing structure 40 to adjust its sound-absorbing performance by applying different strains, effectively reducing noise at different frequencies. Since these sound-absorbing units 41 have identical structures, only one will be described in detail below.

[0045] Next, please refer to the following: Figure 2 and Figure 3 . Figure 3 for Figure 2 A planar schematic diagram of the sound-absorbing unit of the sound-absorbing structure.

[0046] The sound-absorbing unit 41 includes multiple sub-units 411 and multiple connecting portions 412. These sub-units 411 are arranged in an array and connected to each other through the connecting portions 412 to form a sound-permeable groove 413. For example, the sound-permeable groove 413 is rectangular and includes a first side 4131, a second side 4132, a third side 4133, a fourth side 4134, two ends 4135, and a central portion 4136. The first side 4131 and the second side 4132 are opposite to each other, and the third side 4133 and the fourth side 4134 are opposite to each other. The two ends 4135 and the central portion 4136 are located between the third side 4133 and the fourth side 4134, and the central portion 4136 is located between the two ends 4135. The sound-absorbing unit 41 is, for example, a 20mm × 20mm block and includes four sub-units 411 and four connecting portions 412. The four sub-units 411 are arranged in a 2×2 array. Two of the four sub-units 411 and one of the four connecting parts 412 are located on the first side 4131 of the sound-permeable groove 413. The other two sub-units of the four sub-units 411 and the other connecting part 412 are located on the second side 4132 of the sound-permeable groove 413. The remaining two connecting parts 412 are located on the third side 4133 and the fourth side 4134 of the sound-permeable groove 413, respectively.

[0047] Each of these sub-units 411 contains multiple sound-absorbing chambers 4111 and multiple connecting channels 4112, wherein the sound-absorbing chambers 4111 are polygonal chambers. Taking one sub-unit 411 as an example, the sub-unit 411 is a hollow cube containing four sound-absorbing chambers 4111 and four connecting channels 4112. The four sound-absorbing chambers 4111 are square chambers of the same size and arranged in a 2×2 array. The width W1 of these sound-absorbing chambers 4111 is greater than the width W2 of these connecting channels 4112, and these sound-absorbing chambers 4111 and these connecting channels 4112 are connected alternately. That is, any two adjacent sound-absorbing chambers 4111 are connected through a connecting channel 4112, and these sound-absorbing chambers 4111 form a series arrangement through these connecting channels 4112. One of the connecting channels 4112 of each subunit 411 is connected to the sound-permeable groove 413, and the sound-absorbing chambers 4111 of each subunit 411 are connected to opposite ends 4135 of the sound-permeable groove 413 through the connecting channels 4112. One of the connecting channels 4112 on the first side 4131 and one of the connecting channels 4112 on the second side 4132 are open to each other. These subunits 411 are, for example, Helmholtz resonators (HR). When sound waves pass through the sound-permeable groove 413 and enter the sound-absorbing chamber 4111 via the connecting channels 4112, the sound waves will resonate at a specific frequency, thereby absorbing and dissipating sound energy.

[0048] In this embodiment, the sound-absorbing structure 40 is disposed between the hard disk accommodating area 11 and the fan accommodating area 12. The sub-units 411 of the sound-absorbing unit 41 of the sound-absorbing structure 40 are arranged in an array and connected to each other to form a sound-permeable groove 413. The sound-absorbing chambers 4111 and the connecting channels 4112 of each sub-unit 411 are connected. At least one of the connecting channels 4112 of each sub-unit 411 is connected to the sound-permeable groove 413. When the sound generated by the fan module 30 enters the sound-absorbing chamber through the connecting channel 4112 of the sub-unit 411, the sound is absorbed through the fan module 30. In chamber 4111, because these sound-absorbing chambers 4111 and these connecting channels 4112 are connected in series to form a continuous sound wave absorption structure, sound waves are transmitted between these sound-absorbing chambers 4111, increasing the sound absorption path. Specifically, when a sound wave enters the first sound-absorbing chamber 4111, it resonates within the first chamber 4111, converting sound energy into heat energy through resonance, thereby dissipating the sound. Sound waves not absorbed by the first chamber 4111 will enter the next sound-absorbing chamber 4111 through the connecting channel 4112 and continue to be absorbed. In this process, sound waves will resonate within these sound-absorbing chambers 4111, and this resonance can further enhance the sound absorption effect. The resonance phenomenon amplifies the sound waves at specific frequencies, thereby increasing the propagation path and absorption time of the sound waves in the sound-absorbing material, achieving a better sound absorption effect. The multi-absorption and resonance mechanism achieved through the series design of these sound-absorbing chambers 4111 can significantly reduce the reflection and propagation of sound waves, achieving a better acoustic control effect. Therefore, the sound-absorbing structure 40 can effectively reduce the noise transmitted from the fan module 30 to the hard disk module 20, so as to avoid the noise affecting the performance of the hard disk module 20.

[0049] Furthermore, the sound-absorbing chambers 4111 and connecting channels 4112 of each subunit 411 are connected, and the configuration of one connecting channel 4112 on the first side 4131 and one connecting channel 4112 on the second side 4132 opening to each other, under different strains, the resonant frequency decreases and the range of resonant frequency that can be adjusted increases, thereby increasing the resonant frequency adjustment capability.

[0050] Furthermore, the connecting channel 4112 between each subunit 411 and the sound-permeable groove 413 is located on one side of the sound-permeable groove 413, and the sound-absorbing chamber 4111 is designed as a square chamber, which can improve the noise reduction capability. In addition, the square chamber design of the sound-absorbing chamber 4111 can increase the utilization rate of the structural space.

[0051] Previous studies observed that the performance of the hard drive module 20 degraded most significantly at a noise level of 3000Hz. This is likely because noise at this frequency causes resonance within the hard drive, thus affecting its read / write performance. In this embodiment, the sound-absorbing structure 40, without deformation in its original state, achieves noise reduction for sounds at approximately 3150Hz, resulting in a sound transmission loss (STL) greater than 5dB, with a frequency bandwidth of 47Hz. Furthermore, utilizing the negative Poisson's ratio of planar tensile metamaterials, different strains are applied to elastically deform the sound-absorbing structure 40. Under different stretching or compressing conditions, the applicable sound frequency of the sound-absorbing structure 40 is adjusted. For example, please refer to... Figure 2 and Figure 4 , Figure 4 for Figure 3 A planar schematic diagram of the deformation of the sound-absorbing unit. Applying a strain of -0.1 to the sound-absorbing structure 40 compresses and deforms the shape of the sound-permeable groove 413 of the sound-absorbing unit 41, allowing the sound-absorbing structure 40 to reduce noise for sounds with a frequency of approximately 3040Hz, achieving an STL greater than 5dB, and extending its frequency bandwidth to 103Hz. Applying a strain of 0.1 to the sound-absorbing structure 40 stretches and deforms the shape of the sound-permeable groove 413 of the sound-absorbing unit 41, allowing the sound-absorbing structure 40 to reduce noise for sounds with a frequency of approximately 3060Hz, achieving an STL greater than 5dB, and reducing its frequency bandwidth to 33Hz. Specifically, applying different strains affects the resonant frequency and frequency bandwidth of the sound-absorbing structure 40. Applying a positive strain reduces the effective frequency range of the sound-absorbing structure, while applying a negative strain shifts the resonant frequency of the sound-absorbing structure to lower frequencies and significantly increases its effective frequency range. The sound-absorbing structure 40 can be configured to elastically deform along the length direction L and the height direction H. This flexibility allows the sound-absorbing structure 40 to adjust its noise reduction performance according to specific needs, thereby providing the best noise reduction effect in different application scenarios.

[0052] In this embodiment, the design of the sound-absorbing structure 40 is based on theoretical calculations and verified by numerical simulations. This allows for the rapid design of a suitable sound-absorbing structure 40, thereby reducing costs. In this embodiment, the sound-absorbing structure 40 utilizes a planar tensile metamaterial combined with a Helmholtz resonator, offering several advantages over conventional sound-absorbing structures, including resonant frequency modulation capabilities, adjustable noise reduction bandwidth, and equivalent stress required for strain. Furthermore, the sound-absorbing structure 40 is a monolithic structure, simplifying assembly and further reducing costs.

[0053] In this embodiment, by combining these sub-units 411 as Helmholtz resonance units with planar tensile metamaterials with negative Persson ratios, the advantages of planar tensile metamaterials being more easily deformable than general structures can be utilized. Furthermore, the ventilation rate of the structure can be adjusted, and the thickness of the structure is not affected by deformation, making it more suitable for application in the internal space of servers.

[0054] It should be noted that the sound-absorbing structure 40 in the above embodiments is not limited to being elastically deformable. In other embodiments, the sound-absorbing structure may be a non-deformable structure.

[0055] On the other hand, while the sound-absorbing chambers 4111 of the sub-units 411 of the sound-absorbing unit 41 in the above embodiment are connected to the same sound-permeable groove 413, this is not a limitation. In other embodiments, the sound-absorbing chambers of the sub-units of the sound-absorbing unit may be connected to different sound-permeable grooves respectively.

[0056] Furthermore, the shape of the sound-absorbing unit 41 of the sound-absorbing structure 40 in the above embodiment is not intended to limit the present invention, but can be adjusted according to requirements.

[0057] According to the sound-absorbing structure and server disclosed in the above embodiments, by setting the sound-absorbing structure between the hard disk housing area and the fan housing area, the sub-units of the sound-absorbing unit of the sound-absorbing structure are arranged in an array and connected to each other to form a sound-permeable groove. The sound-absorbing chambers and connecting channels of each sub-unit are connected. One of the connecting channels of at least one of these sub-units is connected to the sound-permeable groove, which allows the sound generated by the fan module to enter the sound-absorbing chamber through the connecting channel of the sub-unit and dissipate. Therefore, the noise transmitted from the fan module to the hard disk module can be effectively reduced, and the noise can be prevented from affecting the performance of the hard disk module.

[0058] In addition, the sound-absorbing structure can be configured to elastically deform along the length and height directions, allowing it to provide noise reduction for sounds of different frequencies.

[0059] Furthermore, the design of the sound-absorbing structure utilizes theoretical calculations combined with numerical simulations for verification, enabling the rapid design of a suitable sound-absorbing structure and thus reducing costs. Additionally, the monolithic nature of the sound-absorbing structure facilitates assembly, further minimizing costs.

[0060] In one embodiment of the present invention, the server of the present invention can be used for artificial intelligence (AI) computing, edge computing (EC), and can also be used as a 5G server, cloud server or vehicle networking server.

[0061] Although the present invention has been disclosed above with reference to the preferred embodiments described above, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the claims defined in the appended patent application.

Claims

1. A sound-absorbing structure, characterized in that, Include: At least one sound-absorbing unit, comprising multiple sub-units, wherein the multiple sub-units are arranged in an array and connected to each other to form a sound-transmitting groove; Each of the sub-units includes multiple sound-absorbing chambers and multiple connecting channels, the multiple sound-absorbing chambers and the multiple connecting channels are connected to each other, and one of the multiple connecting channels of at least one of the multiple sub-units is connected to the sound-transmitting groove.

2. The sound-absorbing structure according to claim 1, wherein one of the plurality of connecting channels of each of the sub-units is connected to the sound-transmitting groove.

3. The sound-absorbing structure according to claim 2, wherein the number of the plurality of sub-units is four, the four sub-units are arranged in a 2×2 array, two of the four sub-units are located on one side of the sound-permeable groove, and the other two sub-units are located on the other side of the sound-permeable groove.

4. The sound-absorbing structure according to claim 3, wherein each subunit has four sound-absorbing chambers and four connecting channels, the four sound-absorbing chambers are arranged in a 2×2 array, and the plurality of sound-absorbing chambers and the plurality of connecting channels are alternately connected.

5. The sound-absorbing structure according to claim 1, wherein the width of the plurality of sound-absorbing chambers of each subunit is greater than the width of the plurality of connecting channels.

6. The sound-absorbing structure according to claim 1, wherein the plurality of sound-absorbing chambers of each of the sub-units are of the same size.

7. The sound-absorbing structure according to claim 1, wherein the plurality of sound-absorbing chambers of each subunit are square chambers.

8. The sound-absorbing structure according to claim 1, wherein each of the sub-units is a Helmholtz resonant unit.

9. The sound-absorbing structure according to claim 1, wherein the sound-absorbing structure is elastically deformable along the length and height directions.

10. A server comprising: A chassis, comprising a hard drive storage area and a fan storage area; A hard disk module is disposed in the hard disk accommodating area; A fan module is disposed in the fan receiving area; and A sound-absorbing structure is disposed between the hard disk accommodating area and the fan accommodating area, and includes: At least one sound-absorbing unit, comprising multiple sub-units, wherein the multiple sub-units are arranged in an array and connected to each other to form a sound-transmitting groove; in, Each of the sub-units includes multiple sound-absorbing chambers and multiple connecting channels, the multiple sound-absorbing chambers and the multiple connecting channels being connected to each other, and one of the multiple connecting channels of at least one of the multiple sub-units being connected to the sound-transmitting groove.

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