An electronic device

Abstract

This application provides an electronic device, relating to the field of terminal device technology. It addresses the problem that reduced internal space in electronic devices leads to a decreased distance between the antenna and adjacent conductive components, affecting antenna signal quality. The electronic device includes a mid-frame, a circuit board, an adapter board, and an antenna radiator. The mid-frame includes a frame and a mid-plate, with the mid-plate fixed within the frame. The circuit board is disposed on the mid-plate. A portion of the adapter board is stacked and electrically connected to the circuit board. The antenna radiator includes a first plate and a second plate. The first plate is fixedly connected to the frame, and the second plate is stacked and electrically connected to a portion of the adapter board. The electronic device provided by this application can increase the distance between the antenna radiator and conductive components, thereby improving signal quality.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the trend towards thinner and lighter electronic devices, the internal space of these devices is becoming increasingly smaller. Since antennas within electronic devices require sufficient clearance, the reduced internal space leads to a decrease in the distance between the antenna and adjacent conductive components, affecting antenna signal strength. Summary of the Invention

[0003] This application provides an electronic device to address the problem that reduced internal space in the electronic device leads to a decrease in the distance between the antenna and adjacent conductive components, thus affecting the antenna signal.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, an electronic device is provided, comprising a mid-frame, a circuit board, an adapter board, and an antenna radiator. The mid-frame includes a frame and a mid-plate, the mid-plate being fixed within the frame. The circuit board is disposed on the mid-plate. A portion of the adapter board is stacked and electrically connected to the circuit board. The antenna radiator includes a first plate and a second plate, the first plate being fixedly connected to the frame, and the second plate being stacked and electrically connected to a portion of the adapter board.

[0006] The electronic device provided in the first aspect of this application achieves electrical connection between the antenna radiator and the circuit board through an adapter board. Compared with the spring clips provided in related technologies, this is advantageous in reducing the size along the thickness direction of the electronic device. Furthermore, a portion of the adapter board is stacked with the circuit board, and a portion of the adapter board is stacked with the second plate of the antenna radiator, meaning that there is no need for stacking between the circuit board and the second plate. Therefore, this is advantageous in reducing the space occupied by the circuit board and the second plate along the thickness direction of the electronic device.

[0007] Furthermore, the adapter board acts as a bridge between the circuit board and the antenna radiator, meaning it does not need to abut against the circuit board and the second board. Therefore, the circuit board and the adapter board are connected by bonding or surface mount technology, requiring the circuit board to withstand greater external forces. This allows for thinning of the circuit board, which is beneficial for further reducing the dimensions along the thickness direction of the electronic device.

[0008] In one possible implementation of the first aspect of this application, the total dimensions of the circuit board, the second board, and the adapter board along the thickness direction of the electronic device are less than or equal to 0.4 mm. This structure allows the antenna radiator to be kept as far away as possible from nearby conductive components, thereby ensuring stable antenna signals.

[0009] In one possible implementation of the first aspect of this application, the adapter board includes a first part and a second part, the first part extending along the edge of the second part, the first part being stacked with a circuit board, and the second part being stacked with a second board body. This structure ensures that there is no overlapping area between the circuit board and the second board body, thereby reducing the space occupied along the thickness direction of the electronic device.

[0010] In one possible implementation of the first aspect of this application, the second board and the circuit board are disposed on the same side of the adapter board along the thickness direction of the electronic device. With this structure, the position of the adapter board can be flexibly set according to actual needs.

[0011] In one possible implementation of the first aspect of this application, the distance between the second part and the second plate body along the thickness direction of the electronic device is smaller than the distance between the first part and the second plate body. This structure allows for a certain height difference between the circuit board and the second plate body to adapt to different design scenarios.

[0012] In one possible implementation of the first aspect of this application, the adapter board is located between the second board and the circuit board along the thickness direction of the electronic device. In this structure, the adapter board is positioned between the second board and the circuit board to avoid contact between the circuit board and the second board, which helps improve structural reliability.

[0013] In one possible implementation of the first aspect of this application, a first notch is provided on the circuit board. In this structure, the first notch can serve as a deformation space. For example, when soldering the adapter plate and the second plate, since heat may cause deformation of the adapter plate, a tensile force is applied to the circuit board by the adapter plate. The first notch can serve as a deformation space, reducing stress concentration and thus protecting the circuit board.

[0014] In one possible implementation of the first aspect of this application, the first notch extends along the distribution direction of the first plate and the circuit board.

[0015] In one possible implementation of the first aspect of this application, the circuit board includes a first region and a second region, an electronic device is disposed on the first region, the second region is connected between the two first regions, and a first notch is disposed at the end where the second region connects with the first region.

[0016] In one possible implementation of the first aspect of this application, the included angle between the first plate and the second plate is an obtuse angle. This structure allows the first plate to be tilted, which helps to keep the first plate away from the electrical connection area of ​​the outer screen of the electronic device.

[0017] In one possible implementation of the first aspect of this application, the included angle between the first plate and the second plate is greater than or equal to 100°.

[0018] In one possible implementation of the first aspect of this application, the electronic device includes a foldable screen and an outer screen. The electronic device includes multiple mid-frames, with adjacent mid-frames rotatably connected, and the foldable screen fixedly connected to the multiple mid-frames. The outer screen is disposed on the side of any mid-frame away from the foldable screen, and the circuit board and antenna radiator are both disposed within the mid-frame fixedly connected to the outer screen. In this case, the electronic device is a foldable screen terminal, and the circuit board and antenna radiator are disposed between the foldable screen and the outer screen.

[0019] In one possible implementation of the first aspect of this application, the sub-screen includes a display area and an electrical connection area, the electrical connection area being disposed at the edge of the display area; the first plate is fixed to the area on the frame opposite to the electrical connection area.

[0020] In one possible implementation of the first aspect of this application, a receiving groove is provided on the inner wall of the frame, and the first plate is fixed in the receiving groove.

[0021] In one possible implementation of the first aspect of this application, multiple antenna radiators are disposed, and the multiple antenna radiators are spaced apart along the extension direction of the frame.

[0022] In one possible implementation of the first aspect of this application, the circuit board is an FPC board. With this structure, the FPC board has a smaller thickness, which helps to reduce the space occupied along the thickness direction of the electronic device and helps to keep the antenna radiator away from adjacent conductive components.

[0023] In one possible implementation of the first aspect of this application, the electronic device further includes a motherboard, at least a portion of which is located on the side of the circuit board away from the antenna radiator, and the circuit board is electrically connected to the motherboard. Attached Figure Description

[0024] Figure 1 A structural diagram of an electronic device provided in an embodiment of this application;

[0025] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0026] Figure 3 This is a front view of an electronic device in a folded state, as provided in an embodiment of this application.

[0027] Figure 4 for Figure 3 A cross-sectional view of the provided electronic device;

[0028] Figure 5 A front view of another electronic device in a folded state provided in an embodiment of this application;

[0029] Figure 6 for Figure 5 A cross-sectional view of the provided electronic device;

[0030] Figure 7 A cross-sectional view of another electronic device in a folded state, provided as an embodiment of this application;

[0031] Figure 8 An exploded view of a portion of the structure of an electronic device provided in an embodiment of this application;

[0032] Figure 9 for Figure 8 Enlarged view of the structure of region A;

[0033] Figure 10 for Figure 8 A cross-sectional view of a portion of the structure of the provided electronic device;

[0034] Figure 11 A partial structural cross-sectional view of an outer screen and a foldable screen provided for an embodiment of this application;

[0035] Figure 12 This is a structural diagram of an antenna radiator provided in an embodiment of this application;

[0036] Figure 13 for Figure 12 Enlarged view of the structure of region B;

[0037] Figure 14 The structural diagram of the antenna radiator, circuit board, and adapter board provided in the embodiments of the application;

[0038] Figure 15 A partial cross-sectional view of the antenna radiator, circuit board, adapter board, and middle frame provided in the embodiments of the application;

[0039] Figure 16 for Figure 15 The provided section view shows the outer screen and foldable screen mounted on the mid-frame.

[0040] Figure 17 A partial structural diagram of another circuit board and middle frame provided in an embodiment of this application;

[0041] Figure 18 A structural diagram of another circuit board and antenna radiator provided in an embodiment of this application;

[0042] Figure 19 This is a structural diagram of another circuit board and antenna radiator provided in an embodiment of this application.

[0043] Reference numerals: 10-Electronic device; 100-Folding screen; 110-First display area; 120-Second display area; 200-Support device; 210-Middle frame; 211-Border; 211a-Receiving slot; 212-Middle plate; 220-Hinge mechanism; 230-Back cover; 300-Outer screen; 310-Display area; 320-Electrical connection area; 400-Main board; 500-Electronic component; 600-Antenna radiator; 610-First plate; 620-Second plate; 630-Second notch; 700-Spring; 800-Circuit board; 810-First notch; 820-First area; 830-Second area; 900-Adapter board; 910-First part; 920-Second part; Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0045] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0046] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0047] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0048] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), monitor, camera, personal computer, laptop computer, wearable device, etc.

[0049] When the electronic device is a mobile phone, it can be either a candybar phone or a foldable phone. For ease of explanation, the following examples will use a foldable phone as an example.

[0050] Specifically, please refer to Figure 1 and Figure 2 , Figure 1 This is a structural diagram of an electronic device 10 provided in an embodiment of this application. Figure 2 This is an exploded view of an electronic device 10 provided in an embodiment of this application. The electronic device 10 may include a foldable screen 100 and a support device 200. The foldable screen 100 is supported and attached to the support device 200, and the support device 200 is capable of rotating the foldable screen 100 between an unfolded state and a folded state. It is understood that... Figure 1 and Figure 2 Only some components of the electronic device 10 are shown schematically; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 The limitations of the structure shown.

[0051] The aforementioned foldable screen 100 is used to display images, videos, etc. The foldable screen 100 may include at least two first display areas 110 and at least one second display area 120, with a second display area 120 located between two adjacent first display areas 110. When the electronic device 10 is in a folded state, the second display area 120 of the foldable screen 100 is bent, and the first display areas 110 are stacked. At least the second display area 120 of the foldable screen 100 uses a flexible screen. The first display area 110 of the foldable screen 100 may use a flexible screen, a non-flexible screen, or a combination of both. Therefore, this application does not impose specific limitations in this regard.

[0052] Among them, the aforementioned foldable screen 100 can be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a micro organic light-emitting diode (MOLED) display, a quantum dot light-emitting diode (QLED) display, a liquid crystal display (LCD), etc.

[0053] The aforementioned support device 200 is used to support the foldable screen 100. The support device 200 may include at least two mid-frames 210 and at least one pivot mechanism 220, with a pivot mechanism 220 disposed between two adjacent mid-frames 210. The first display area 110 of the foldable screen 100 is correspondingly fitted and fixedly connected to the mid-frames 210. The second display area 120 of the foldable screen 100 is correspondingly fitted and connected to the pivot mechanism 220. Adjacent mid-frames 210 are rotatably connected via a rotating mechanism, thereby enabling the electronic device 10 to rotate between the unfolded and folded states.

[0054] For ease of description in the following embodiments, an XYZ coordinate system is established, defining the width direction of the middle frame 210 as the X-axis, the length direction of the middle frame 210 as the Y-axis, and the thickness direction of the middle frame 210 as the Z-axis. When the electronic device 10 is in the unfolded state, the distribution direction of the multiple middle frames 210 is the X-axis, the thickness direction of the electronic device 10 is the Z-axis, and the direction perpendicular to the X-axis and Z-axis is the Y-axis. It should be noted that this XYZ coordinate system can be flexibly transformed according to actual needs. The embodiments in this application only provide one possible example and should not be considered as a special limitation of this application.

[0055] The aforementioned support device 200 also includes a rear cover 230. Each middle frame 210 is fixedly provided with a rear cover 230. The rear cover 230 is stacked with the middle plate 212, and the rear cover 230 is located on the side of the middle plate 212 away from the folding screen 100. Thus, the rear cover 230, the middle frame 210 and the first display area 110 of the folding screen 100 together enclose the internal space of the electronic device 10.

[0056] For example, two mid-frames 210 and one hinge mechanism 220 may be provided; correspondingly, the folding screen 100 includes two first display areas 110 and one second display area 120, so that the electronic device 10 forms a two-fold structure. Alternatively, three mid-frames 210 and two hinge mechanisms 220 may be provided; correspondingly, the folding screen 100 includes three first display areas 110 and two second display areas 120, so that the electronic device 10 forms a three-fold structure. In the following embodiments, the three-fold structure of the electronic device 10 will be used as an example for explanation.

[0057] With electronic device 10 in the unfolded state, please continue reading. Figure 1 and Figure 2 , Figure 1 and Figure 2 The diagram shows the structure of the electronic device 10 in its unfolded state. In this state, the foldable screen 100 is fully unfolded, meaning the first display area 110 and the second display area 120 of the foldable screen 100 are on the same plane, ensuring the flatness of the foldable screen 100. In this state, the electronic device 10 can achieve a large-screen display, providing a better user experience. For example, when watching a movie, the large screen provides a better visual effect and enhances the viewing experience.

[0058] When the electronic device 10 is in a folded state, please refer to Figure 3 and Figure 4 , Figure 3 This is a front view of an electronic device 10 in a folded state, as provided in an embodiment of this application. Figure 4 for Figure 3 A cross-sectional view of the provided electronic device 10. In this configuration, the mid-frames 210 are stacked, the first display areas 110 of the foldable screen 100 are stacked, and the second display area 120 of the foldable screen 100 is bent. At least a portion of the foldable screen 100 is located between two adjacent mid-frames 210, meaning at least a portion of the foldable screen 100 is not visible to the user.

[0059] In this state, the foldable screen 100 is invisible to the user, preventing scratches or damage and thus providing effective protection for the foldable screen 100. For example, when the phone is not in use, the electronic device 10 can be folded to reduce the risk of damage to the foldable screen 100.

[0060] For example, please continue reading Figure 3 and Figure 4The aforementioned middle frame 210 can be provided in three parts: a first middle frame 210a, a second middle frame 210b, and a third middle frame 210c. The first middle frame 210a and the second middle frame 210b are rotatably connected by a first pivot mechanism 220a, and the second middle frame 210b and the third middle frame 210c are rotatably connected by a second pivot mechanism 220b. The foldable screen 100 includes three first display areas 110 and two second display areas 120, which are respectively attached to the middle frame 210 and the pivot mechanism 220.

[0061] When the rotation directions of the first rotating mechanism 220a and the second rotating mechanism 220b are the same, that is, the rotation directions of the first middle frame 210a and the third middle frame 210c relative to the second middle frame 210b are the same. When the electronic device 10 is in a folded state, the first middle frame 210a and the third middle frame 210c are respectively stacked on both sides of the second middle frame 210b. At this time, a portion of the foldable screen 100 is protected within the support device 200, thereby enabling small-screen display and facilitating one-handed operation.

[0062] For example, during the process of rotating the electronic device 10 from an unfolded state to a folded state, both the first middle frame 210a and the third middle frame 210c rotate clockwise. When the electronic device 10 reaches the folded state, the two first display areas 110 attached to the first middle frame 210a and the second middle frame 210b are positioned opposite each other and located between the first middle frame 210a and the second middle frame 210b. The two first display areas 110 attached to the third middle frame 210c and the second middle frame 210b are positioned opposite each other, that is, the first display area 110 attached to the third middle frame 210c faces away from the second middle frame 210b. At this time, a small screen display can be achieved through the first display area 110 attached to the third middle frame 210c. Since the overall volume of the electronic device 10 in the folded state is small, it is convenient for users to operate with one hand.

[0063] Please see Figure 5 and Figure 6 , Figure 5 This is a front view of another electronic device 10 provided in an embodiment of this application in a folded state. Figure 6 for Figure 5 A cross-sectional view of the provided electronic device 10. During the rotation of the electronic device 10 from an unfolded state to a folded state, the first middle frame 210a and the third middle frame 210c rotate in opposite directions relative to the second middle frame 210b. For example, Figure 5 and Figure 6 During the process of the electronic device 10 rotating from the unfolded state to the folded state, the first middle frame 210a rotates clockwise and the third middle frame 210c rotates counterclockwise.

[0064] When the electronic device 10 is rotated to the folded state, the first middle frame 210a and the third middle frame 210c are both stacked on the same side of the second middle frame 210b. At this time, the folded screen 100 is completely protected within the support device 200, thereby providing effective protection for the folded screen 100.

[0065] In some embodiments, please refer to Figure 7 , Figure 7 This is a cross-sectional view of another electronic device 10 in a folded state, provided in an embodiment of this application. The electronic device 10 may further include an outer screen 300 (also referred to as a secondary screen), which is disposed on the side of a middle frame 210 away from the folded screen 100, i.e., the outer screen 300 replaces the back cover 230 disposed on the middle frame 210. For example, the outer screen 300 is disposed on the side of the second middle frame 210b away from the folded screen 100. When the electronic device 10 is in a folded state, the folded screen 100 is completely protected within the support device 200. At this time, images can be displayed on the outer screen 300 to achieve small-screen display, thereby facilitating one-handed operation by the user.

[0066] Based on this, please refer to Figure 8 , Figure 9 as well as Figure 10 , Figure 8 This is an exploded view of a portion of the structure of the electronic device 10 provided in the embodiments of this application. Figure 9 for Figure 8 Enlarged view of the structure of region A. Figure 10 for Figure 8 A cross-sectional view of a portion of the structure of the provided electronic device 10. The electronic device 10 also includes a motherboard 400 and electronic components 500. The motherboard 400 is disposed within the aforementioned middle frame 210. Exemplarily, the middle frame 210 may include a side frame 211 and a middle plate 212. The motherboard 400 can be fixed to the middle plate 212, for example, by means of adhesive, bolt fixing, welding, snap-fitting, etc.

[0067] The aforementioned electronic components 500 are disposed within the aforementioned internal space to realize different functions of the electronic device 10. The electronic components 500 can be disposed on and electrically connected to the motherboard 400, so that the various electronic components 500 are electrically connected to each other through the motherboard 400. For example, the electronic components 500 may include control chips (e.g., system-on-chip, SOC), graphics processing units (GPUs), universal flash storage (UFS), camera modules, flash modules, capacitors, inductors, etc.

[0068] In addition, to enable the electronic device 10 to communicate with other devices, various antennas are installed inside the electronic device 10. These include, for example, a Wi-Fi antenna, a Bluetooth antenna, a communication antenna, and a GPS antenna. The antennas can transmit communication signals to the surrounding environment through the antenna radiator 600, and the antenna radiator 600 is grounded through the motherboard 400.

[0069] For example, the antenna radiator 600 can be a spring, which includes a first plate 610 and a second plate 620. The first plate 610 is fixedly connected to the inner wall of the frame 211, for example, by welding or bonding. The second plate 620 and the main plate 400 are distributed along the thickness direction of the middle frame 210. A spring piece 700 is provided between the second plate 620 and the main plate 400. The spring piece 700 abuts against the main plate 400 and the second plate 620 to realize the electrical connection between the antenna radiator 600 and the main plate 400, thereby realizing the grounding of the antenna radiator 600.

[0070] To ensure that the antenna radiator 600 can transmit signals normally, the antenna radiator 600 needs to be as far away as possible from conductive components inside the middle frame 210 to avoid interference from conductive components with the signals transmitted by the antenna radiator 600. For example, the distance between the antenna radiator 600 and adjacent conductive components can be 0.85mm-0.9mm.

[0071] Therefore, as long as the distance between the antenna radiator 600 and the adjacent conductive component is at least greater than or equal to 0.85 mm, the signal quality emitted by the antenna radiator 600 can be guaranteed. For example, the conductive component can be the outer screen 300 and the folding screen 100, which are located on both sides of the middle frame 210, respectively.

[0072] As the thickness of the electronic device 10 continues to decrease, the distance between the outer screen 300 and the foldable screen 100 along the thickness direction of the electronic device 10 becomes smaller. Please refer to... Figure 11 , Figure 11 This is a partial structural cross-sectional view of an outer screen 300 and a folding screen 100 provided in an embodiment of this application. For example, the distance L between the outer screen 300 and the folding screen 100 can be 2.1 mm. In this case, a distance of at least 0.85 mm is required between the antenna radiator 600 and the outer screen 300, and between the antenna radiator 600 and the folding screen 100. Therefore, only a distance of 2.1 - 0.85 - 0.85 = 0.4 mm is required between the outer screen 300 and the folding screen 100 to accommodate the antenna radiator 600.

[0073] However, as can be seen from the above embodiments, Figure 10The second plate 620 of the antenna radiator 600 shown needs to be electrically connected to the main board 400 via a spring contact 700 to achieve grounding. Along the thickness direction of the electronic device 10, i.e., along the Z-axis, the sum of the dimensions of the main board 400, the spring contact 700, and the second plate 620 is much greater than 0.4 mm. Therefore, the grounding structure of this antenna radiator 600 cannot be located between the outer screen 300 and the folding screen 100.

[0074] Based on this, this application provides an electronic device 10. The electronic device 10 may include the aforementioned mid-frame 210 and antenna radiator 600. Please refer to... Figure 12 and Figure 13 , Figure 12 This is a structural diagram of an antenna radiator 600 provided in an embodiment of this application. Figure 13 for Figure 12 Enlarged view of the structure of region B.

[0075] In addition, the electronic device 10 also includes a circuit board 800 and an adapter board 900. The circuit board 800 can be an FPC (Flexible Printed Circuit) board, or other circuit boards 800 with a smaller thickness. The circuit board 800 can be disposed between the main board 400 and the antenna radiator 600, for example, along the length of the electronic device 10, the circuit board 800 is located between the main board 400 and the antenna radiator 600. In the following embodiments, the circuit board 800 is described as an FPC board.

[0076] Please see Figure 14 , Figure 14 This is a structural diagram of the antenna radiator 600, circuit board 800, and adapter plate 900 provided in the embodiment of the application. The adapter plate 900 can be a metal steel sheet. A portion of the adapter plate 900 is stacked and electrically connected to the circuit board 800, and a portion of the adapter plate 900 is stacked and electrically connected to the second plate 620 of the antenna radiator 600. That is, a portion of the adapter plate 900 is attached to and fixedly connected to the circuit board 800, and a portion of the adapter plate 900 is attached to and fixedly connected to the second plate 620.

[0077] For example, the adapter board 900 can be bonded to the circuit board 800, or it can be fixedly connected by SMT (Surface Mount Technology), that is, the adapter board 900 is fixed to the circuit board 800 by SMT. Furthermore, the adapter board 900 can be soldered to the second plate 620 of the antenna radiator 600.

[0078] Please refer to this. Figure 15 and Figure 16 , Figure 15 This is a partial cross-sectional view of the antenna radiator 600, circuit board 800, adapter board 900, and middle frame 210 provided in the embodiments of the application. Figure 16 for Figure 15 A partial cross-sectional view of the outer screen 300 and the foldable screen 100 mounted on the provided mid-frame 210.

[0079] Therefore, the adapter plate 900 enables the electrical connection between the antenna radiator 600 and the circuit board 800, thus grounding the antenna radiator 600. Compared to the spring clip 700 with a certain height, the adapter plate 900 reduces the space occupied along the thickness direction of the electronic device 10. Furthermore, a portion of the adapter plate 900 is stacked and bonded to the circuit board 800, and another portion is stacked and bonded to the second plate 620 of the antenna radiator 600, eliminating gaps between the adapter plate 900 and the circuit board 800, and between the adapter plate 900 and the second plate 620. This further reduces the space occupied along the thickness direction of the electronic device 10, allowing for a larger distance between the antenna radiator 600 and both the outer screen 300 and the folding screen 100, thereby ensuring the signal quality transmitted by the antenna radiator 600.

[0080] Furthermore, the circuit board 800 is an FPC board. Compared with other circuit boards 800, the FPC board has a smaller thickness, which is beneficial to further reduce the size of the second board 620 of the circuit board 800, the adapter board 900 and the antenna radiator 600 along the thickness direction of the electronic device 10. This can further ensure that there is sufficient distance between the second board 620 and the outer screen 300, and between the second board 620 and the folding screen 100.

[0081] For example, along the thickness direction (i.e., the Z-axis direction) of the electronic device 10, the total dimension D of the circuit board 800, the second plate 620, and the adapter plate 900 can be less than or equal to 0.4 mm. For instance, this distance can be 0.39 mm, 0.38 mm, 0.37 mm, 0.36 mm, 0.35 mm, 0.33 mm, etc. This allows for a larger distance between the outer screen 300 and the folding screen 100 of the electronic device 10 and the second plate 620 of the antenna radiator 600, thereby reducing the risk of interference from the outer screen 300 and the folding screen 100 to the transmitted signals of the antenna radiator 600.

[0082] In some embodiments, please continue reading Figure 15 and Figure 16The adapter board 900 may include a first portion 910 and a second portion 920. The first portion 910 extends along the edge of the second portion 920. The first portion 910 is stacked with the circuit board 800, and the second portion 920 is stacked with the second board body 620. This eliminates the overlapping area between the circuit board 800 and the second board body 620. In other words, the total dimension of the circuit board 800 and the second board body 620 along the thickness direction of the electronic device 10 can be less than the sum of the thickness dimensions of the circuit board 800 and the second board body 620, thereby further saving space.

[0083] In some examples, the second plate 620 and the circuit board 800 can be disposed on the same side of the adapter plate 900 along the thickness direction of the electronic device 10. That is, a portion of the circuit board 800 extends along the edge of the second plate 620. On the one hand, this ensures that there is no overlapping area between the circuit board 800 and the second plate 620 along the thickness direction of the electronic device 10. On the other hand, while maintaining a compact overall structure, it helps to increase the contact area between the circuit board 800 and the adapter plate 900, and between the circuit board 800 and the second plate 620, thereby improving the connection strength between the circuit board 800 and the adapter plate 900, and between the adapter plate 900 and the second plate 620.

[0084] Furthermore, along the thickness direction of the electronic device 10, the distance between the second part 920 and the second plate 620 can be smaller than the distance between the first part 910 and the second plate 620. That is, there can be a height difference between the second part 920 and the first part 910, which facilitates the adaptation to the height difference between the circuit board 800 and the second plate 620, and helps to improve the reliability of the overall structure.

[0085] In other examples, please refer to Figure 17 and Figure 18 , Figure 17 This is a partial structural diagram of another circuit board 800 and middle frame 210 provided in an embodiment of this application. Figure 18 This is a structural diagram of another circuit board 800 and antenna radiator 600 provided in an embodiment of this application. The adapter plate 900 can also be located between the second plate 620 and the circuit board 800. In this structure, since the circuit board 800 is a flexible circuit board 800, it can be bent to achieve mutual contact with the surface of the adapter plate 900. In this case, the adapter plate 900 can adopt a flat plate structure, meaning there does not need to be a height difference between the first part 910 and the second part 920, thereby achieving electrical connection between the circuit board 800 and the antenna radiator 600.

[0086] Therefore, the relative positions of the circuit board 800, the second plate 620 of the antenna radiator 600, and the adapter plate 900 provided in this application embodiment can be flexibly changed based on actual needs, thereby helping to reduce the difficulty of component installation.

[0087] Furthermore, the circuit board 800 and the adapter board 900 can form a single structural unit. That is, during the assembly of the electronic device 10, the circuit board 800 and the adapter board 900 can be installed as a single component within the middle frame 210. Then, the adapter board 900 can be soldered and fixed to the second plate 620.

[0088] In other embodiments, please refer to Figure 19 , Figure 19 This is a structural diagram of another circuit board 800 and antenna radiator 600 provided in an embodiment of this application. The circuit board 800 may have a first notch 810. In the event of deformation of the circuit board 800, the first notch 810 provides deformation space to reduce stress concentration and the risk of damage to the circuit board 800. For example, when the adapter plate 900 and the second plate 620 are soldered together, the temperature change of the adapter plate 900 may cause deformation, potentially exerting a certain tensile force on the circuit board 800. In this case, the first notch 810 can serve as deformation space to reduce the risk of localized stress concentration on the circuit board 800, thus reducing the risk of damage to the circuit board 800.

[0089] The first notch 810 can extend along the distribution direction of the first plate 610 and the circuit board 800 so that the first notch 810 will not affect the placement of the electronic device 500 on the circuit board 800, which is beneficial to bring the electronic device 500 closer to the antenna slot on the frame 211.

[0090] For example, the circuit board 800 may include a first region 820 and a second region 830. An electronic device 500 is disposed on the first region 820, and the second region 830 connects two adjacent first regions 820. A first notch 810 is disposed at the end of the second region 830 that connects to the first region 820. That is, the end of the second region 830 may be bent and extended to form the first notch 810 between the second region 830 and the first region 820.

[0091] Furthermore, the electronic device 500 can be positioned at the edge of the first region 820 near the second plate 620, reducing the distance between the electronic device 500 and the second plate 620. This improves the signal quality emitted by the electronic device 500 through the antenna radiator 600.

[0092] Furthermore, a second notch 630 may be provided at the connection between the first plate 610 and the second plate 620 of the antenna radiator 600. The second notch 630 can form a clearance space or a deformation space between the first plate 610 and the second plate 620. For example, when the first plate 610 is welded to the frame 211, or when the second plate 620 is welded to the adapter plate 900, the second notch 630 can provide deformation space, which helps to improve structural reliability.

[0093] Based on this, please return to continue reading. Figure 16 The outer screen 300 is a flat screen, and it may include a display area 310 and an electrical connection area 320. The electrical connection area 320 is located at the edge of the display area 310. For example, the electrical connection area 320 and the display area 310 can be an integral structure, that is, the edge of the outer screen 300 is bent to form the electrical connection area 320. Alternatively, the electrical connection area 320 can also be an independent component from the display area 310; for example, the electrical connection area 320 can be an FPC board.

[0094] The display area 310 is used to display images. The electrical connection area 320 can be configured with a display driver integrated circuit (DDIC) using different packaging processes, thereby controlling the display area 310 to display images. For example, the packaging process can include COG (Chip On Glass) packaging, COF (Chip On Film) packaging, or COP (Chip On Plastic) packaging.

[0095] Therefore, in order to avoid the electrical connection area 320 being bent and damaged, the electrical connection area 320 will have a certain curvature after being bent, that is, its cross-section (along the extension direction parallel to the thickness direction of the electronic device 10 and perpendicular to the edge where the electrical connection area 320 is provided) is approximately arc-shaped.

[0096] When the first plate 610 of the antenna radiator 600 is fixed in the area within the frame 211 opposite to the electrical connection area 320, that is, when the first plate 610 is fixed to the portion of the frame 211 along the extension direction of the first edge, the first plate 610 needs to be far away from the electrical connection area 320 of the outer screen 300. That is, the distance H between the electrical connection area 320 and the first plate 610 needs to be large to reduce the risk of interference when the first plate 610 radiates signals.

[0097] Therefore, the included angle C formed between the first plate 610 and the second plate 620 provided in this embodiment can be an obtuse angle, so that the first plate 610 is inclined relative to the second plate 620. In some examples, the included angle between the first plate 610 and the second plate 620 can be greater than or equal to 100°. For example, the included angle can be 105°, 110°, 115°, or 120°.

[0098] Furthermore, a receiving groove 211a may be formed on the inner wall of the frame 211. The inner wall of the receiving groove 211a is inclined and parallel to the first plate 610. The first plate 610 is disposed in the receiving groove 211a and is in close contact with and fixedly connected to the inner wall of the receiving groove 211a. For example, the first plate 610 and the frame 211 can be fixedly connected by welding, bonding, snap-fitting, or other methods.

[0099] In other possible embodiments, multiple antenna radiators 600 may be provided, and all multiple antenna radiators 600 may be electrically connected to the same circuit board 800. That is, each radiator is electrically connected to the circuit board 800 through an adapter plate 900. Alternatively, multiple circuit boards 800 may be provided, and each circuit board 800 may be electrically connected to at least one antenna radiator 600. Or, the number of circuit boards 800 and antenna radiators 600 may be the same, and they may be arranged in a one-to-one correspondence. Therefore, the embodiments of this application do not impose any special limitations on this.

[0100] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0101] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: The middle frame includes a border and a middle plate, wherein the middle plate is fixed inside the border; A circuit board is mounted on the middle plate; An adapter board, wherein a portion of the adapter board is stacked with and electrically connected to the circuit board; The antenna radiator includes a first plate and a second plate. The first plate is fixedly connected to the frame, and the second plate is stacked and electrically connected to a portion of the adapter plate.

2. The electronic device according to claim 1, characterized in that, Along the thickness direction of the electronic device, the total dimension of the circuit board, the second board body, and the adapter board is less than or equal to 0.4 mm.

3. The electronic device according to claim 2, characterized in that, The adapter board includes a first part and a second part, the first part extends along the edge of the second part, the first part is stacked with the circuit board, and the second part is stacked with the second board body.

4. The electronic device according to claim 2 or 3, characterized in that, Along the thickness direction of the electronic device, the second plate and the circuit board are disposed on the same side of the adapter plate.

5. The electronic device according to claim 4, characterized in that, Along the thickness direction of the electronic device, the distance between the second part and the second plate is less than the distance between the first part and the second plate.

6. The electronic device according to claim 2 or 3, characterized in that, Along the thickness direction of the electronic device, the adapter plate is located between the second plate and the circuit board.

7. The electronic device according to any one of claims 1-6, characterized in that, The circuit board has a first notch.

8. The electronic device according to claim 7, characterized in that, The first notch extends along the distribution direction of the first plate and the circuit board.

9. The electronic device according to claim 8, characterized in that, The circuit board includes a first region and a second region. Electronic devices are disposed on the first region, and the second region is connected between the two first regions. The first notch is disposed at the end of the second region where it connects with the first region.

10. The electronic device according to any one of claims 1-9, characterized in that, The angle formed between the first plate and the second plate is an obtuse angle.

11. The electronic device according to claim 10, characterized in that, The included angle between the first plate and the second plate is greater than or equal to 100°.

12. The electronic device according to any one of claims 1-11, characterized in that, The electronic device includes a foldable screen and an outer screen. The electronic device includes multiple middle frames, with two adjacent middle frames rotatably connected. The foldable screen is fixedly connected to the multiple middle frames. The outer screen is disposed on the side of any middle frame away from the foldable screen. The circuit board and the antenna radiator are both disposed within the middle frame fixedly connected to the outer screen.

13. The electronic device according to claim 12, characterized in that, The secondary screen includes a display area and an electrical connection area, with the electrical connection area located at the edge of the display area; the first plate is fixed to the frame in the area opposite to the electrical connection area.

14. The electronic device according to claim 13, characterized in that, A receiving groove is provided on the inner wall of the frame, and the first plate is fixed in the receiving groove.

15. The electronic device according to any one of claims 1-14, characterized in that, The antenna radiators are arranged in multiple locations, and the multiple antenna radiators are distributed at intervals along the extension direction of the frame.

16. The electronic device according to any one of claims 1-15, characterized in that, The circuit board is an FPC board.

17. The electronic device according to any one of claims 1-16, characterized in that, The electronic device also includes a motherboard, at least a portion of which is located on the side of the circuit board away from the antenna radiator, and the circuit board is electrically connected to the motherboard.

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