Circuit board and solid state drive

Abstract

This utility model relates to the field of circuit board packaging technology, and in particular to a circuit board and a solid-state drive. The circuit board provided by this utility model sets high-speed differential line pairs as inner layer traces, and uses vias / through holes through the pads of the high-speed differential lines to electrically connect the high-speed connector and the controller. Since the vias / through holes only need to pass through the pads, the number of wiring layers through which the vias / through holes pass is greatly reduced, which makes it possible to use back drilling process to better reduce the number of residual posts and shorten the length of residual posts, effectively reduce signal reflection or crosstalk, and improve signal quality.

Description

Technical Field

[0001] This utility model relates to the field of circuit board packaging technology, and in particular to a circuit board and a solid-state drive. Background Technology

[0002] With the development of electronic information technology and the increasing demand for signal transmission rates, R&D designers need to consider and handle many issues in the design process of motherboard PCBs (Printed Circuit Boards) more meticulously.

[0003] In related technologies, in order to meet the routing requirements of different wiring layers on a PCB board, vias need to be set to pass through each wiring layer. This via design usually leaves a large section of residual studs, which requires the application of back drilling technology to shorten the studs. However, this increases production costs. Moreover, this method is limited by the back drilling technology and can only reduce a portion of the studs. A section of studs remains that is not easy to eliminate, which is not conducive to reducing signal reflection or crosstalk. Utility Model Content

[0004] In view of this, one objective of this utility model is to provide a circuit board and a solid-state drive to solve the technical problem of long and numerous residual stubs left by vias passing through various wiring layers in the prior art.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solutions:

[0006] In a first aspect, embodiments of the present invention provide a circuit board, comprising:

[0007] A high-speed differential pair, a high-speed connector, and a controller are provided. The high-speed connector is electrically connected to the controller via the high-speed differential pair. The high-speed differential pair includes a TX differential pair and an RX differential pair. The TX differential pair includes a coupling capacitor and a target TX differential pair. The target TX differential pair and the RX differential pair are disposed on the inner layer of the circuit board.

[0008] The circuit board has a first TX pad and a second TX pad. The coupling capacitor is located directly below the back of the first TX pad and the second TX pad. The first TX pad and the second TX pad are respectively provided with a first TX through hole and a second TX through hole. The first end of the target TX differential line pair is electrically connected to the high-speed connector. The first end of the coupling capacitor passes through the first TX through hole and is electrically connected to the second end of the target TX differential line pair. The second end of the coupling capacitor passes through the second TX through hole and is electrically connected to the third end of the target TX differential line pair. The fourth end of the target TX differential line pair is electrically connected to the controller.

[0009] The circuit board is also provided with a first RX pad and a second RX pad. The first RX pad and the second RX pad are respectively provided with a first RX through hole and a second RX through hole. The first end of the RX differential line pair passes through the first RX through hole and is electrically connected to the high-speed connector. The second end of the RX differential line pair passes through the second RX through hole and is electrically connected to the controller.

[0010] In some embodiments, the circuit board further includes a third TX pad disposed on the controller, the third TX pad having a third TX through hole, the fourth end of the target TX differential line pair passing through the third TX through hole and electrically connected to the controller.

[0011] In some embodiments, the circuit board further includes a fourth TX pad disposed on the high-speed connector, the fourth TX pad having a fourth TX through hole, the first end of the target TX differential line pair passing through the fourth TX through hole and electrically connected to the high-speed connector.

[0012] In some embodiments, the diameter of the first TX pad, the second TX pad, the first RX pad, the second RX pad, the third TX pad, and / or the fourth TX pad is 0.4 mm, and the outer diameter of the first TX via, the second TX via, the first RX via, the second RX via, the third TX via, and / or the fourth TX via is 7 mil.

[0013] In some embodiments, the circuit board further includes standard speed differential pairs, and the high-speed connector includes a first portion of differential pairs and a second portion of differential pairs. The first portion of differential pairs includes multiple sets of the high-speed differential pairs and multiple sets of the standard speed differential pairs, and the second portion of differential pairs includes multiple sets of the standard speed differential pairs.

[0014] In some embodiments, the high-speed differential line pairs are elliptical or substantially elliptical, and the conventional speed differential line pairs are rectangular or substantially rectangular.

[0015] In some embodiments, the candidate ordinary speed differential line pair is spaced apart from the TX differential line pair by a preset distance value. The candidate ordinary speed differential line pair is the ordinary speed differential line pair that corresponds to the position of the TX differential line pair among the multiple sets of ordinary speed differential line pairs in the second part of the differential line pairs.

[0016] In some embodiments, the preset distance value includes a reference distance and an outward expansion distance. The reference distance is the standard distance between the first portion of the differential line pairs and the second portion of the differential line pairs, and the outward expansion distance is the distance the candidate ordinary speed differential line pairs move in a direction away from the first portion of the differential line pairs.

[0017] In some embodiments, the first TX through hole and the second TX through hole are located within a preset distance range between the candidate ordinary speed differential line pair and the TX differential line pair.

[0018] Secondly, this utility model embodiment provides a solid-state drive, comprising:

[0019] The first aspect proposes any one of the circuit boards.

[0020] The present invention has the following advantages: Unlike existing technologies, the circuit board provided in this invention includes high-speed differential pairs, a high-speed connector, and a controller. The high-speed connector is electrically connected to the controller via the high-speed differential pairs. The high-speed differential pairs include TX differential pairs and RX differential pairs. Each TX differential pair includes a coupling capacitor and a target TX differential pair. The target TX differential pair and RX differential pair are disposed on the inner layer of the circuit board. The circuit board has a first TX pad and a second TX pad. The coupling capacitor is located directly below the back of the first TX pad and the second TX pad. The first TX pad and the second TX pad respectively have a first TX through-hole and a second TX through-hole. The first end of the target TX differential pair is electrically connected to the high-speed connector. The first end of the coupling capacitor passes through the first TX via and is electrically connected to the second end of the target TX differential pair. The second end of the coupling capacitor passes through the second TX via and is electrically connected to the third end of the target TX differential pair. The fourth end of the target TX differential pair is electrically connected to the controller. The circuit board also has a first RX pad and a second RX pad. The first RX pad and the second RX pad have first RX vias and second RX vias respectively. The first end of the RX differential pair passes through the first RX via and is electrically connected to the high-speed connector. The second end of the RX differential pair passes through the second RX via and is electrically connected to the controller.

[0021] The circuit board provided in this embodiment of the utility model sets high-speed differential line pairs as inner layer traces, and uses vias / through holes through the pads of the high-speed differential lines to electrically connect the high-speed connector and the controller. Since the vias / through holes only need to pass through the pads, the number of wiring layers through which the vias / through holes pass is greatly reduced, which makes it possible to use back drilling process to better reduce the number of residual posts and shorten the length of residual posts, effectively reduce signal reflection or crosstalk, and improve signal quality. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below only show some embodiments of this utility model and should not be considered as limiting the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the circuit board structure provided in some embodiments of this utility model;

[0024] Figure 2 This is a schematic diagram of the circuit board structure provided in some embodiments of this utility model;

[0025] Figure 3 yes Figure 2 A schematic diagram of the circuit board structure from another perspective, as shown in the embodiment;

[0026] Figure 4a yes Figure 2 A schematic diagram of the circuit board structure from another perspective shown in the embodiment;

[0027] Figure 4b This is a wiring diagram of high-speed differential pairs in some embodiments of this utility model;

[0028] Figure 4c This is a wiring diagram of high-speed differential pairs in some other embodiments of this utility model;

[0029] Figure 5 This is a schematic diagram of the connection between the target TX differential line pair and the controller in a circuit board provided in some embodiments of this utility model;

[0030] Figure 6 This is a schematic diagram showing the connection between the target TX differential line pair and the high-speed connector in a circuit board provided in some embodiments of this utility model;

[0031] Figure 7 This is a schematic diagram of the structure of a high-speed connector in a circuit board provided in some embodiments of this utility model;

[0032] Figure 8 yes Figure 7 Enlarged view of a portion of the structural region in the high-speed connector shown in the embodiment;

[0033] Figure 9 This is a schematic diagram of the structure of a solid-state drive provided in some embodiments of this utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100. Circuit board;

[0036] 10. High-speed differential pair; 11. TX differential pair; 111. Coupling capacitor; 112. Target TX differential pair; 12. RX differential pair;

[0037] 20. High-speed connector; 21. First part differential pair; 22. Second part differential pair; 221. Candidate standard speed differential pair;

[0038] 30. Controller;

[0039] 40. First TX pad; 41. First TX via;

[0040] 50. Second TX pad; 51. Second TX via;

[0041] 60. First RX pad; 61. First RX via;

[0042] 70. Second RX pad; 71. Second RX via;

[0043] 80. Third TX pad; 81. Third TX via;

[0044] 90. Fourth TX pad; 91. Fourth TX via; 95. Standard speed differential pair. Detailed Implementation

[0045] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. The detailed description of the embodiments of this utility model in the accompanying drawings is not intended to limit the scope of protection claimed by this utility model, but only to represent selected embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0046] It should be noted that when an element is referred to as being "fixed to" another element, it means that it can be directly attached to the other element or that an intervening element may be present. When an element is considered to be "connected to" another element, it can be directly connected to the other element or that an intervening element may be present simultaneously. The terms "vertical," "horizontal," "left," "right," "up," and "down," etc., used in this specification indicate orientation or position based on the orientation or position shown in the accompanying drawings.

[0047] It should be noted that the terms "first," "second," and other similar expressions used in this specification are for illustrative purposes and to distinguish between identical or similar items with substantially the same function and effect, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality of" means two or more items, unless otherwise explicitly defined. It is worth noting that although functional modules are divided in the device or structural diagram, in some cases, a different module division may be used than that shown in the device or structure.

[0048] Unless otherwise defined, the technical and scientific terms used in this specification have the same meanings as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items. It should be understood that the technical features involved in the various embodiments of the invention described below can be combined with each other, provided that no conflict is established.

[0049] Please refer to the following: Figures 1 to 4a , Figure 1 The schematic diagram illustrates the structure of a circuit board provided in some embodiments of the present invention.

[0050] Specifically, such as Figure 1 As shown, the circuit board 100 includes a high-speed differential pair 10, a high-speed connector 20, and a controller 30. The high-speed connector 20 is electrically connected to the controller 30 through the high-speed differential pair 10, that is, the high-speed differential pair 10 is electrically connected between the high-speed connector 20 and the controller 30.

[0051] Among them, the high-speed differential pair 10 includes a TX differential pair 11 and an RX differential pair 12, and the TX differential pair 11 includes a coupling capacitor 111 (i.e. Figure 1 The capacitor (TX_CAP) and the target TX differential pair 112 are shown. Both the target TX differential pair 112 and the RX differential pair 12 are located on the inner layer of the circuit board 100. That is, the target TX differential pair 112 and the RX differential pair 12 are configured to be routed / wired on the inner layer of the circuit board 100, thereby electrically connecting the various components of the circuit board 100 through the target TX differential pair 112 and the RX differential pair 12.

[0052] Please see Figure 2 and Figure 3 The circuit board 100 is provided with a first TX pad 40 and a second TX pad 50, and a coupling capacitor 111 (i.e., Figure 2The coupling capacitor (shown in the red box) is located directly below the back of the first TX pad 40 and the second TX pad 50. A first TX through hole 41 is provided in the middle of the first TX pad 40, and a second TX through hole 51 is provided in the middle of the second TX pad 50.

[0053] For example, the target TX differential line pair 112 includes a positive TX signal line and a negative TX signal line. The first end of the target TX differential line pair 112 is electrically connected to the high-speed connector 20, that is, the first end of the positive TX signal line is electrically connected to the pin PTXP of the high-speed connector 20, and the first end of the negative TX signal line is electrically connected to the pin PTXN of the high-speed connector 20.

[0054] The first end of coupling capacitor 111 passes through the first TX via 41 and is electrically connected to the second end of the target TX differential line pair 112, meaning the first end of coupling capacitor 111 is electrically connected to the second end of either the positive or negative TX signal line. The second end of coupling capacitor 111 passes through the second TX via 51 and is electrically connected to the third end of the target TX differential line pair 112, meaning the second end of coupling capacitor 111 is electrically connected to the third end of either the positive or negative TX signal line. The fourth end of the target TX differential line pair 112 is electrically connected to controller 30, meaning the fourth end of the positive TX signal line is electrically connected to pin PTXP of controller 30, and the fourth end of the negative TX signal line is electrically connected to pin PTXN of controller 30.

[0055] Please see Figure 2 and Figure 4a The circuit board 100 is also provided with a first RX pad 60 and a second RX pad 70. A first RX through hole 61 is opened in the middle of the first RX pad 60, and a second RX through hole 71 is opened in the middle of the second RX pad 70.

[0056] For example, the RX differential pair 12 includes a positive RX signal line and a negative RX signal line. The first end of the RX differential pair 12 passes through the first RX through-hole 61 and is electrically connected to the high-speed connector 20, that is, the first end of the positive RX signal line is electrically connected to the PRXP pin of the high-speed connector 20, and the first end of the negative RX signal line is electrically connected to the PRXN pin of the high-speed connector 20. The second end of the RX differential pair 12 passes through the second RX through-hole 71 and is electrically connected to the controller 30, that is, the second end of the positive RX signal line is electrically connected to the PRXP pin of the controller 30, and the second end of the negative RX signal line is electrically connected to the PRXN pin of the controller 30.

[0057] Please see Figure 4b and Figure 4c , Figure 4b and Figure 4cThis diagram illustrates the wiring schematic of high-speed differential pairs in a circuit board provided in some embodiments of the present invention.

[0058] For example, such as Figure 4b As shown, the target TX differential line pair 112 includes a positive TX signal line PTXP2 and a negative TX signal line PTXN2. The first end of the positive TX signal line PTXP2 is electrically connected to the pin PTXP of the high-speed connector 20, and the first end of the negative TX signal line PTXN2 is electrically connected to the pin PTXN of the high-speed connector 20. The first end of the coupling capacitor 111 passes through the first TX through-hole 41 and is electrically connected to the second ends of the positive TX signal line PTXP2 and the negative TX signal line PTXN2. The second end of the coupling capacitor 111 passes through the second TX through-hole 51 and is electrically connected to the third ends of the positive TX signal line PTXP2 and the negative TX signal line PTXN2. The fourth ends of the positive TX signal line PTXP2 and the negative TX signal line PTXN2 are electrically connected to the pin PTXP and the pin PTXN of the controller 30, respectively.

[0059] For example, such as Figure 4c As shown, the RX differential pair 12 includes a positive RX signal line PRXP2 and a negative RX signal line PRXN2. The first end of the positive RX signal line PRXP2 passes through the first RX through-hole 61 and is electrically connected to the PRXP pin of the high-speed connector 20. The first end of the negative RX signal line PRXN2 passes through the first RX through-hole 61 and is electrically connected to the PRXN pin of the high-speed connector 20. The second end of the positive RX signal line PRXP2 passes through the second RX through-hole 71 and is electrically connected to the PRXP pin of the controller 30. The second end of the negative RX signal line PRXN2 passes through the second RX through-hole 71 and is electrically connected to the PRXN pin of the controller 30.

[0060] Understandably, after the TX differential pair 11 and RX differential pair 12 pass through the vias / through holes opened on the corresponding pads, the residual stubs left at the vias / through holes can be treated by back drilling. Finally, PCB resin is used to plug / seal the holes to complete the packaging of the corresponding components.

[0061] The circuit board provided in this embodiment of the utility model is configured with high-speed differential line pairs as inner layer traces. The high-speed connector and controller are electrically connected by vias / through holes through the pads of the high-speed differential lines. Since the vias / through holes only need to pass through the pads, the number of wiring layers through which the vias / through holes pass is greatly reduced. This allows for a better reduction in the number and length of residual posts using back drilling technology, effectively reducing signal reflection or crosstalk and improving signal quality.

[0062] Please see Figure 2 and Figure 5In some embodiments, the circuit board 100 further includes a third TX pad 80 disposed on the controller 30. A third TX through hole 81 is provided in the middle of the third TX pad 80. The fourth end of the target TX differential line pair 112 passes through the third TX through hole 81 and is electrically connected to the controller 30. That is, the fourth end of the positive TX signal line passes through the third TX through hole 81 and is electrically connected to the PTXP pin of the controller 30, and the fourth end of the negative TX signal line passes through the third TX through hole 81 and is electrically connected to the PTXN pin of the controller 30.

[0063] In this embodiment, pads are provided at the controller, and through holes are made on the pads. In this way, the controller can be firmly connected and fixed to the circuit board through the through holes of the pads. The controller is electrically connected by a hole-in-pad method. Compared with the dog-bone method, the main advantages of the hole-in-pad method are that the impedance fluctuation is smaller and the insertion loss is smaller, thereby reducing signal reflection or crosstalk and improving signal quality.

[0064] Please see Figure 2 and Figure 6 In some embodiments, the circuit board 100 further includes a fourth TX pad 90 disposed on the high-speed connector 20. A fourth TX through hole 91 is provided in the middle of the fourth TX pad 90. The first end of the target TX differential line pair 112 passes through the fourth TX through hole 91 and is electrically connected to the high-speed connector 20. That is, the first end of the positive TX signal line passes through the fourth TX through hole 91 and is electrically connected to the pin PTXP of the high-speed connector 20, and the first end of the negative TX signal line passes through the fourth TX through hole 91 and is electrically connected to the pin PTXN of the high-speed connector 20.

[0065] In this embodiment, pads are provided at the high-speed connector, and through holes are formed in the pads. In this way, the high-speed connector can be firmly connected and fixed to the circuit board through the through holes of the pads. Moreover, the high-speed connector is electrically connected by using a through hole in the pad, which reduces impedance fluctuation and insertion loss, thereby effectively reducing signal reflection or crosstalk and improving signal quality.

[0066] In some embodiments, the diameter of the first TX pad 40, the second TX pad 50, the first RX pad 60, the second RX pad 70, the third TX pad 80 and / or the fourth TX pad 90 is 0.4 mm, and the outer diameter of the first TX via 41, the second TX via 51, the first RX via 61, the second RX via 71, the third TX via 81 and / or the fourth TX via 91 is 7 mil.

[0067] It is understood that in the above figure, the through hole is opened in the middle position of the pad. The middle position is not the absolute middle position of the pad. In actual production applications, the through hole can be opened at a certain distance off the exact center of the pad. Alternatively, the through hole can be opened at any suitable position on the pad according to actual needs. This utility model embodiment does not make any specific limitation in this regard.

[0068] In PCB manufacturing industry standards, 6mil and 8mil diameter through-hole drills are common types of drills used to drill vias / through holes with outer diameters of 6mil and 8mil. Manufacturers typically use the aspect ratio (AR) of vias / through holes to measure the effective copper plating capacity within the hole. The aspect ratio (AR) is the ratio of the depth of the via / through hole to its outer diameter. A 10:1 aspect ratio is a reference value for electroplating quality standards used by manufacturers, meaning that the aspect ratio of vias / through holes should be greater than or equal to 10:1.

[0069] Generally, the thickness of a PCB board / circuit board is 63 mil. When drilling with a 6 mil diameter through-hole drill bit, the aspect ratio of the drilled vias / through holes is less than 10:1. Drilling with a 6 mil diameter through-hole drill bit will increase the size of the pads and the outer diameter of the vias / through holes, resulting in a decrease in the via / through hole impedance.

[0070] In this embodiment, based on the requirements for measuring manufacturing and via impedance performance, a 7mil diameter through-hole drill bit is used to drill through holes and surrounding ground holes for high-speed differential pairs, thereby obtaining through holes / vias with an outer diameter of 7mil (i.e., the first TX through hole 41, the second TX through hole 51, the first RX through hole 61, the second RX through hole 71, the third TX through hole 81, and the fourth TX through hole 91, etc. in this embodiment of the present invention). This achieves the purpose of optimizing impedance performance while also meeting electroplating quality standards and improving product quality.

[0071] Please see Figure 7 In some embodiments, the circuit board 100 also includes a standard speed differential pair 95, which is also used to transmit differential signals, but its transmission speed is slower than that of the high speed differential pair 10. The high speed connector 20 includes a first portion of differential pair 21 and a second portion of differential pair 22.

[0072] The first part of the differential line pair 21 includes multiple sets of high-speed differential line pairs 10 (i.e., TX differential line pair 11 and RX differential line pair 12) and multiple sets of conventional speed differential line pairs 95. The second part of the differential line pair 22 includes multiple sets of conventional speed differential line pairs 95.

[0073] In this embodiment, by equipping the high-speed connector with standard-speed differential pairs, when it is not necessary to use high-speed differential pairs to transmit differential signals quickly, the system can switch to standard-speed differential pairs to transmit differential signals at a normal speed. This enhances the flexibility and practicality of signal transmission and improves the user experience.

[0074] Please continue reading. Figure 7 In some embodiments, the high-speed differential pair 10 is elliptical or substantially elliptical, while the standard-speed differential pair 95 is rectangular or substantially rectangular. In this embodiment, the pin length of the high-speed differential pair 10 is compressed by using elliptical pads to make the high-speed differential pair 10 elliptical or substantially elliptical, thereby reducing signal line branches and improving signal quality.

[0075] Please see Figure 7 as well as Figure 8 In some embodiments, among the multiple sets of conventional speed differential line pairs 95 included in the second portion of the differential line pair 22, there is a conventional speed differential line pair 95 corresponding to the position of the TX differential line pair 11. The conventional speed differential line pair 95 corresponding to the position of the TX differential line pair 11 among the multiple sets of conventional speed differential line pairs 95 in the second portion of the differential line pair 22 is selected as a candidate conventional speed differential line pair 221. For example, Figure 7 and Figure 8 The candidate common speed difference line pair 221 is shown.

[0076] Specifically, the candidate ordinary speed differential line pair 221 and the TX differential line pair 11 are spaced at a preset distance. This preset distance includes a baseline distance and an outward extension distance. The baseline distance is the standard distance between the first part of the differential line pair 21 and the second part of the differential line pair 22. For example, the baseline distance is... Figure 8 The distance d1 shown is a reference distance that can be set by the designer based on empirical data and actual needs. The expansion distance is the distance the candidate standard speed differential pair 221 moves along a direction away from the first differential pair 21; for example, the expansion distance is... Figure 8 The distance d2 shown. In some embodiments, the outward extension distance is 15 mil, that is, the candidate normal speed differential line pair 221 is located at a position moved 15 mil away from the first part of the differential line pair 21.

[0077] The first TX via 41 and the second TX via 51 are positioned within a preset distance (i.e., the base distance and the outward extension distance) between the candidate standard speed differential pair 221 and the TX differential pair 11. In this embodiment, the candidate standard speed differential pair 221 is moved outward by a distance away from the first differential pair 21 to provide more space for the first TX via 41 and the second TX via 51. This allows for more flexible placement of the first TX via 41 and the second TX via 51 in suitable locations, enhancing the flexibility and practicality of wiring / route and improving the user experience.

[0078] In summary, the circuit board provided in this embodiment of the present invention includes high-speed differential pairs, a high-speed connector, and a controller. The high-speed connector is electrically connected to the controller via the high-speed differential pairs. The high-speed differential pairs include TX differential pairs and RX differential pairs. Each TX differential pair includes a coupling capacitor and a target TX differential pair. The target TX differential pair and the RX differential pair are disposed on the inner layer of the circuit board. The circuit board has a first TX pad and a second TX pad. The coupling capacitor is disposed directly below the back of the first TX pad and the second TX pad. The first TX pad and the second TX pad are respectively provided with a first TX through-hole and a second TX through-hole. The first end of the target TX differential pair... Electrically connected to the high-speed connector, the first end of the coupling capacitor passes through the first TX through-hole and is electrically connected to the second end of the target TX differential pair. The second end of the coupling capacitor passes through the second TX through-hole and is electrically connected to the third end of the target TX differential pair. The fourth end of the target TX differential pair is electrically connected to the controller. The circuit board also has a first RX pad and a second RX pad. The first RX pad and the second RX pad have first RX through-holes and second RX through-holes respectively. The first end of the RX differential pair passes through the first RX through-hole and is electrically connected to the high-speed connector. The second end of the RX differential pair passes through the second RX through-hole and is electrically connected to the controller.

[0079] The circuit board provided in this embodiment of the utility model sets high-speed differential line pairs as inner layer traces, and uses vias / through holes through the pads of the high-speed differential lines to electrically connect the high-speed connector and the controller. Since the vias / through holes only need to pass through the pads, the number of wiring layers through which the vias / through holes pass is greatly reduced, which makes it possible to use back drilling process to better reduce the number of residual posts and shorten the length of residual posts, effectively reduce signal reflection or crosstalk, and improve signal quality.

[0080] This utility model embodiment also provides a solid-state drive (SSD). Please refer to [link / reference]. Figure 9The solid-state drive 200 includes a circuit board 210, wherein the circuit board 210 is any of the circuit boards provided in the foregoing embodiments, and has the same modular structure and functional applications as the circuit boards provided in the foregoing embodiments, which will not be described in detail here. It should be understood that the solid-state drive 200 may also include any other suitable components as required, such as storage units for storing data, and the present invention does not limit this in any way.

[0081] Those skilled in the art will understand that the above-mentioned technical features can be used in any combination without limitation. The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to more clearly understand the technical features, purpose and effects of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, should also be included within the scope of protection of the claims of this utility model.

Claims

1. A circuit board, characterized by, include: A high-speed differential pair, a high-speed connector, and a controller are provided. The high-speed connector is electrically connected to the controller via the high-speed differential pair. The high-speed differential pair includes a TX differential pair and an RX differential pair. The TX differential pair includes a coupling capacitor and a target TX differential pair. The target TX differential pair and the RX differential pair are disposed on the inner layer of the circuit board. The circuit board has a first TX pad and a second TX pad. The coupling capacitor is located directly below the back of the first TX pad and the second TX pad. The first TX pad and the second TX pad are respectively provided with a first TX through hole and a second TX through hole. The first end of the target TX differential line pair is electrically connected to the high-speed connector. The first end of the coupling capacitor passes through the first TX through hole and is electrically connected to the second end of the target TX differential line pair. The second end of the coupling capacitor passes through the second TX through hole and is electrically connected to the third end of the target TX differential line pair. The fourth end of the target TX differential line pair is electrically connected to the controller. The circuit board is also provided with a first RX pad and a second RX pad. The first RX pad and the second RX pad are respectively provided with a first RX through hole and a second RX through hole. The first end of the RX differential line pair passes through the first RX through hole and is electrically connected to the high-speed connector. The second end of the RX differential line pair passes through the second RX through hole and is electrically connected to the controller.

2. The circuit board of claim 1, wherein The circuit board also includes a third TX pad disposed on the controller. The third TX pad has a third TX through hole. The fourth end of the target TX differential line pair passes through the third TX through hole and is electrically connected to the controller.

3. The circuit board of claim 2, wherein, The circuit board also includes a fourth TX pad disposed on the high-speed connector. The fourth TX pad has a fourth TX through hole. The first end of the target TX differential line pair passes through the fourth TX through hole and is electrically connected to the high-speed connector.

4. The circuit board of claim 3, wherein The diameter of the first TX pad, the second TX pad, the first RX pad, the second RX pad, the third TX pad, and / or the fourth TX pad is 0.4 mm, and the outer diameter of the first TX via, the second TX via, the first RX via, the second RX via, the third TX via, and / or the fourth TX via is 7 mil.

5. The circuit board according to any one of claims 1 to 3, characterized in that, The circuit board also includes standard speed differential pairs, and the high-speed connector includes a first portion of differential pairs and a second portion of differential pairs. The first portion of differential pairs includes multiple sets of high-speed differential pairs and multiple sets of standard speed differential pairs, and the second portion of differential pairs includes multiple sets of standard speed differential pairs.

6. The circuit board of claim 5, wherein, The high-speed differential line pairs are elliptical or roughly elliptical, while the conventional speed differential line pairs are rectangular or roughly rectangular.

7. The circuit board of claim 5, wherein The candidate ordinary speed differential line pair is spaced at a preset distance from the TX differential line pair. The candidate ordinary speed differential line pair is the ordinary speed differential line pair among the multiple sets of ordinary speed differential line pairs in the second part of the differential line pairs that corresponds to the position of the TX differential line pair.

8. The circuit board of claim 7, wherein, The preset distance value includes a baseline distance and an outward expansion distance. The baseline distance is the standard distance between the first part of the differential line pairs and the second part of the differential line pairs. The outward expansion distance is the distance that the candidate ordinary speed differential line pairs move in a direction away from the first part of the differential line pairs.

9. The circuit board of claim 8, wherein, The first TX through hole and the second TX through hole are located within a preset distance range between the candidate ordinary speed differential line pair and the TX differential line pair.

10. A solid state drive, comprising: include: The circuit board as described in any one of claims 1-9.

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