Display module and display device

Abstract

This application discloses a display module and display device, belonging to the field of display technology. The display module includes a display panel, a flexible circuit board, and a first circuit board. Since the first signal layer in the first main body and the second ground layer in the second main body are disposed on the same layer, and the second signal layer in the second main body and the first ground layer in the first main body are also disposed on the same layer, the conductive layer to which the first ground layer belongs not only contains the first ground layer but also the second signal layer belonging to the second main body. Similarly, the conductive layer to which the second ground layer belongs not only contains the second ground layer for grounding but also the first signal layer belonging to the first main body. Therefore, it is unnecessary to provide a ground layer covering the entire first circuit board in the first circuit board, thereby effectively reducing the number of conductive layers in the first circuit board while ensuring that the first circuit board can achieve normal function, resulting in a lower overall thickness of the first circuit board.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the development of display technology, the demand for and application range of display devices are constantly expanding. Commonly used display devices include mobile phones, televisions, tablets, laptops, and monitors.

[0003] Display devices typically include a display module and a frame (often referred to as a mid-frame). The display module may include a display panel, a flexible circuit board bonded to the display panel, and a printed circuit board bonded to the flexible circuit board.

[0004] Printed circuit boards (PCBs) typically contain a large number of electronic components and signal lines. However, to avoid interference between different signal lines on a PCB, multiple layers are usually used to arrange the different signal lines on different conductive layers. Therefore, current PCBs generally have a large number of conductive layers, resulting in a relatively thick overall display device. Summary of the Invention

[0005] This application provides a display module and a display device. It can solve the problem of the overall thickness of the display device. The technical solution is as follows:

[0006] On the one hand, a display module is provided, including: a display panel, a flexible circuit board, and a first circuit board;

[0007] One end of the flexible circuit board is bonded to the non-display portion of the display panel;

[0008] The first circuit board is located on the back of the display panel. The first circuit board includes: a first main body and a second main body, and a connecting part located between the first main body and the second main body. The connecting part is bonded to one end of the flexible circuit board away from the display panel.

[0009] The first main body has multiple alternating first signal layers and multiple alternating first ground layers; the second main body has multiple alternating second signal layers and multiple alternating second ground layers.

[0010] The first signal layer and the second ground layer are disposed on the same layer, and the second signal layer and the first ground layer are disposed on the same layer.

[0011] Optionally, the orthographic projection of the flexible circuit board on the display panel overlaps with the orthographic projection of the first main body on the display panel, but does not coincide with the orthographic projection of the second main body on the display panel;

[0012] A portion of the flexible circuit board is disposed in contact with the side of the first main body that is away from the display panel;

[0013] The first circuit board further includes components connected to the side of the second main body opposite to the display panel.

[0014] Optionally, the second main body has a first connection electrode electrically connected to the component on the side opposite to the display panel; the first main body has a test electrode on the side opposite to the display panel, and the test electrode is electrically connected to at least one first signal layer and / or at least one second signal layer.

[0015] The first connecting electrode and the test electrode are disposed in the same layer.

[0016] Optionally, the connecting portion has a second connecting electrode, which is bonded to one end of the flexible circuit board away from the display panel;

[0017] The second connecting electrode is disposed in the same layer as the first connecting electrode.

[0018] Optionally, the first main body portion has a third signal layer on the side facing the display panel, and the second main body portion has a fourth signal layer on the side facing the display panel;

[0019] In the first main body, the multilayer first signal layer and the multilayer first ground layer are located between the test electrode and the third signal layer;

[0020] In the second main body, the multilayer second signal layer and the multilayer second ground layer are located between the first connection electrode and the fourth signal layer.

[0021] Optionally, the first main body portion further includes: a first insulating layer located between the first signal layer and the first ground layer; the second main body portion further includes: a second insulating layer located between the second signal layer and the second ground layer;

[0022] The first insulating layer and the second insulating layer are disposed in the same layer; and for the first insulating layer and the second insulating layer disposed in the same layer, the first signal layer located on one side of the first insulating layer is disposed in the same layer as the second ground layer located on one side of the second insulating layer; the first ground layer located on the other side of the first insulating layer is disposed in the same layer as the second signal layer located on the other side of the second insulating layer.

[0023] Optionally, the connecting portion includes: multiple layers of third insulating layers stacked together, at least a portion of the third insulating layers being located between multiple layers of first insulating layers and multiple layers of second insulating layers;

[0024] Specifically, for the third insulating layer distributed between the first insulating layer and the second insulating layer in the same layer, both sides of the third insulating layer are respectively connected to the first insulating layer and the second insulating layer.

[0025] Optionally, at least one of the interconnected first insulating layer, the third insulating layer, and the second insulating layer is a printed insulating layer.

[0026] Optionally, the display panel includes: a first panel portion and a second panel portion, and a panel bending portion located between the first panel portion and the second panel portion, wherein the first panel portion has a display area;

[0027] The flexible circuit board is bonded to the side of the second panel that is opposite to the first panel.

[0028] On the other hand, a display device is provided, the device comprising: a frame, and a display module connected to the frame, the display module being any of the display modules described above.

[0029] The beneficial effects of the technical solutions provided in this application include at least the following:

[0030] A display module includes a display panel, a flexible circuit board, and a first circuit board. The first main body has multiple alternating layers of first signal layers and multiple alternating layers of first ground layers, and the second main body has multiple alternating layers of second signal layers and multiple alternating layers of second ground layers. The first signal layers and second ground layers can be disposed on the same layer, and the second signal layers and first ground layers can also be disposed on the same layer. In this case, for the conductive layer to which the first ground layer belongs in the first main body, not only can the first ground layer for grounding be distributed within this conductive layer, but also the second signal layer belonging to the second main body can be distributed within it. Similarly, for the conductive layer to which the second ground layer belongs in the second main body, not only can the second ground layer for grounding be distributed within this conductive layer, but also the first signal layer belonging to the first main body can be distributed within it. Therefore, it is unnecessary to provide a ground layer covering the entire first circuit board in the first circuit board. This effectively reduces the number of conductive layers in the first circuit board while ensuring that the first circuit board can perform its normal functions, resulting in a lower overall thickness of the first circuit board. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the film layer structure of a display module provided in an embodiment of this application;

[0033] Figure 2 This is a schematic diagram of the film layer structure of a first circuit board provided in an embodiment of this application;

[0034] Figure 3 This is a schematic diagram of the film layer structure of another display module provided in an embodiment of this application;

[0035] Figure 4 This is a top view of a first circuit board provided in an embodiment of this application;

[0036] Figure 5 This is a schematic diagram of another film layer structure of the first circuit board provided in an embodiment of this application;

[0037] Figure 6 This is a schematic diagram of the film layer structure of another display module provided in the embodiments of this application. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0039] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the film layer structure of a display module provided in an embodiment of this application. The display module 000 may include: a display panel 100, a flexible circuit board 200, and a first circuit board 300.

[0040] The display panel 100 in the display module 000 can be used to display images. The display surface of the display panel 100 is the side of the display panel 100 used to display images.

[0041] One end of the flexible circuit board 200 in the display module 000 can be bonded to the non-display portion of the display panel 100.

[0042] It should be noted that signal traces are integrated within the non-display portion of the display panel 100. After the flexible circuit board 200 is bonded to the non-display portion of the display panel 100, the flexible circuit board 200 can be electrically connected to these signal traces, and these signal traces can also be electrically connected to the sub-pixels within the display portion of the display panel 100. In this way, the flexible circuit board 200 can send driving signals to the sub-pixels within the display portion of the display panel 100 through these signal traces, enabling the sub-pixels of the display portion of the display panel 100 to emit light outwards, thereby allowing the display surface of the display panel 100 to display the corresponding image.

[0043] The first circuit board 300 in the display module 000 can be located on the back side of the display panel 100. The back side of the display panel 100 is the side opposite to the display surface. The first circuit board 300 may include a first main body portion 301 and a second main body portion 302, and a connecting portion 303 located between the first main body portion 301 and the second main body portion 302. The connecting portion 303 in the first circuit board 300 can be bonded to the end of the flexible circuit board 200 facing away from the display panel 100. Thus, the first circuit board 300 can be electrically connected to the flexible circuit board 200 through the connecting portion 303, and the flexible circuit board 200 can be bonded to the display panel 100, thereby enabling the first circuit board 300 to be electrically connected to the display panel 100 via the flexible circuit board 200.

[0044] In the embodiments of this application, please refer to Figure 2 , Figure 2This is a schematic diagram of the film layer structure of a first circuit board according to an embodiment of this application. The first main body 301 in the first circuit board 300 may have multiple alternating first signal layers 301a and multiple first ground layers 301b. For example, a first ground layer 301b may be distributed between every two adjacent first signal layers 301a, and a first signal layer 301a may be distributed between every two adjacent first ground layers 301b.

[0045] It should be noted that each first signal layer 301a in the first main body 301 can contain signal traces capable of transmitting signals, and the signals transmitted by these signal traces are highly susceptible to mutual interference. Therefore, a first ground layer 301b for grounding can be provided between two adjacent first signal layers 301a in the first main body 301. In this way, by distributing the first ground layer 301b between two adjacent first signal layers 301a, the parasitic capacitance generated between these two first signal layers 301a can be effectively reduced, resulting in less interference experienced by these two first signal layers 301a when transmitting data signals.

[0046] The second main body 302 in the first circuit board 300 may have multiple alternating layers of second signal layers 302a and multiple layers of second ground layers 302b. For example, a second ground layer 302b may be distributed between every two adjacent second signal layers 302a, and a second signal layer 302a may be distributed between every two adjacent second ground layers 302b.

[0047] It should be noted that each of the second signal layers 302a in the second main body 302 can contain signal traces capable of transmitting signals, and the signals transmitted by these signal traces are highly susceptible to mutual interference. Therefore, a second ground layer 302b for grounding can be provided between two adjacent second signal layers 302a in the second main body 302. In this way, by distributing the second ground layer 302b between two adjacent second signal layers 302a, the parasitic capacitance generated between these two second signal layers 302a can be effectively reduced, resulting in less interference to these two second signal layers 302a when transmitting data signals.

[0048] In this embodiment, the first signal layer 301a in the first main body 301 and the second ground layer 302b in the second main body 302 can be disposed on the same layer. Here, the materials of the first signal layer 301a and the second ground layer 302b can also be the same. Therefore, the first signal layer 301a and the second ground layer 302b can be formed by a single patterning process.

[0049] The second signal layer 302a in the second main body 302 and the first ground layer 301b in the first main body 301 can be disposed in the same layer. Here, the materials of the second signal layer 302a and the first ground layer 301b can also be the same. Therefore, the second signal layer 302a and the first ground layer 301b can be formed by a single patterning process. It should be noted that the single patterning process can include: photoresist coating, exposure, development, etching, and photoresist stripping.

[0050] In this configuration, the conductive layer belonging to the first ground layer 301b in the first main body 301 can contain not only the first ground layer 301b for grounding but also the second signal layer 302a belonging to the second main body 302. Similarly, the conductive layer belonging to the second ground layer 302b in the second main body 302 can contain not only the second ground layer 302b for grounding but also the first signal layer 301b belonging to the first main body 301. Therefore, it is unnecessary to provide a ground layer covering the entire first circuit board 300 in the first circuit board 300. This effectively reduces the number of conductive layers in the first circuit board 300 while ensuring its normal function, resulting in a lower overall thickness of the first circuit board 300.

[0051] In summary, the display module provided in this application includes a display panel, a flexible circuit board, and a first circuit board. Since the first main body has alternating layers of first signal layers and multiple layers of first ground layers, and the second main body has alternating layers of second signal layers and multiple layers of second ground layers, and the first signal layers and second ground layers can be disposed on the same layer, and the second signal layers and first ground layers can also be disposed on the same layer. In this case, for the conductive layer to which the first ground layer belongs in the first main body, not only can the first ground layer for grounding be distributed within this conductive layer, but also the second signal layer belonging to the second main body can be distributed within it. Similarly, for the conductive layer to which the second ground layer belongs in the second main body, not only can the second ground layer for grounding be distributed within this conductive layer, but also the first signal layer belonging to the first main body can be distributed within it. Therefore, it is unnecessary to provide a ground layer covering the entire first circuit board in the first circuit board, thereby effectively reducing the number of conductive layers in the first circuit board while ensuring that the first circuit board can achieve normal function, resulting in a lower overall thickness of the first circuit board.

[0052] In the embodiments of this application, please refer to Figure 3 , Figure 3This is a schematic diagram of the film layer structure of another display module provided in an embodiment of this application. The orthographic projection of the flexible circuit board 200 in the display module 000 onto the display panel 100 can overlap with the orthographic projection of the first main body 301 onto the display panel 100. For example, the orthographic projection of the flexible circuit board 200 onto the display panel 100 can cover the orthographic projection of the first main body 301 onto the display panel 100. Here, a portion of the flexible circuit board 200 can be in contact with the side of the first main body 301 opposite to the display panel 100.

[0053] The first circuit board 300 may further include components 400 connected to the side of the second main body 302 opposite to the display panel 100. For example, components 400 may include processor chips, connectors, resistors, capacitors, inductors, etc. Here, the orthographic projection of the flexible circuit board 200 in the display module 000 onto the display panel 100 may not coincide with the orthographic projection of the second main body 302 onto the display panel 100. This ensures that the flexible circuit board 200 does not affect the distribution of components 400 on the second main body 302, thereby ensuring that components 400 can function normally.

[0054] In the embodiments of this application, please refer to Figure 4 , Figure 4 This is a top view of a first circuit board provided in an embodiment of this application. The second main body 302 of the first circuit board 300 may have a first connection electrode 3021 on the side opposite to the display panel 100, which is electrically connected to the component 400. In this way, the component 400 can be electrically connected to the second main body 302 through the first connection electrode 3021.

[0055] The first main body portion 301 of the first circuit board 300 may have a test electrode 3011 on the side opposite to the display panel 100. Here, the test electrode 3011 may be electrically connected to at least one first signal layer 301a and / or at least one second signal layer 302a.

[0056] The first connecting electrode 3021 can be disposed in the same layer as the test electrode 3011. Here, the first connecting electrode 3021 and the test electrode 3011 can also be made of the same material. Therefore, the first connecting electrode 3021 and the test electrode 3011 can be formed in a single patterning process.

[0057] In the embodiments of this application, such as Figure 4As shown, the connecting portion 303 in the first circuit board 300 may have a second connecting electrode 3031, which may be bonded to the end of the flexible circuit board 200 facing away from the display panel 100. In this way, the first circuit board 300 and the flexible circuit board 200 can be electrically connected through the second connecting electrode 3031 in the connecting portion 303, thereby enabling the first circuit board 300 to be electrically connected to the display panel 100 through the flexible circuit board 200.

[0058] In this design, the second connecting electrode 3031 in the connecting portion 303 can be disposed in the same layer as the first connecting electrode 3021 in the second main body portion 302; that is, the second connecting electrode 3031, the first connecting electrode 3021, and the test electrode 3011 can be disposed in the same layer. Here, the materials of the second connecting electrode 3031, the first connecting electrode 3021, and the test electrode 3011 can also be the same. Therefore, the second connecting electrode 3031, the first connecting electrode 3021, and the test electrode 3011 can be formed in a single patterning process.

[0059] In the embodiments of this application, please refer to Figure 5 , Figure 5 This is a schematic diagram of another film layer structure of a first circuit board provided in an embodiment of this application. The first main body 301 of the first circuit board 300 may have a third signal layer 301c on the side facing the display panel 100. For example, the third signal layer 301c may include a low-level power signal line (i.e., a VSS power signal line). In the first main body 301, multiple first signal layers 301a and multiple first ground layers 301b may be located between the test electrode 3011 and the third signal layer 301c.

[0060] The second main body 302 of the first circuit board 300 may have a fourth signal layer 302c on the side facing the display panel 100. For example, the fourth signal layer 302c may include a high-level power signal line (i.e., a VDD power signal line). In the second main body 302, multiple layers of second signal layers 302a and multiple layers of second ground layers 302b may be located between the first connection electrode 3021 and the fourth signal layer 302c.

[0061] In the embodiments of this application, please refer to Figure 5 The first main body 301 in the first circuit board 300 may further include a first insulating layer 301d located between the first signal layer 301a and the first ground layer 301b. Here, the first signal layer 301a and the first ground layer 301b can be insulated from each other by the first insulating layer 301d.

[0062] The second main body portion 302 in the first circuit board 300 may further include a second insulating layer 302d located between the second signal layer 302a and the second ground layer 302b. Here, the second signal layer 302a and the second ground layer 302b can be insulated from each other by the second insulating layer 302d.

[0063] The first insulating layer 301d and the second insulating layer 302d are disposed in the same layer, and the materials of the first insulating layer 301d and the second insulating layer 302d can also be the same. Therefore, the first insulating layer 301d and the second insulating layer 302d can be formed by a single patterning process.

[0064] Here, for the first insulating layer 301d and the second insulating layer 302d arranged in the same layer, the first signal layer 301a located on one side of the first insulating layer 301d can be arranged in the same layer as the second ground layer 302b located on one side of the second insulating layer 302d. That is, the second ground layer 302b belonging to the second main body 302 can also be distributed within the conductive layer to which the first signal layer 301a on the first insulating layer 301d belongs. Similarly, the first ground layer 301b located on the other side of the first insulating layer 301d can be arranged in the same layer as the second signal layer 302a located on the other side of the second insulating layer 302d. That is, the second signal layer 302a belonging to the second main body 302 can also be distributed within the conductive layer to which the first ground layer 301b on the other side of the first insulating layer 301d belongs.

[0065] In the embodiments of this application, such as Figure 5 As shown, the connection portion 303 in the first circuit board 300 may include: multiple layers of third insulating layers 3032 stacked together, at least a portion of the third insulating layers 3032 being located between multiple layers of first insulating layers 301d and multiple layers of second insulating layers 302d. For example, the first insulating layers 301d and the second insulating layers 302d disposed on the same layer can be connected by at least a portion of the third insulating layers 3032.

[0066] Specifically, a third insulating layer 3032, distributed between the first insulating layer 301d and the second insulating layer 302d in the same layer, can be connected to both sides of the third insulating layer 3032 with respect to the first insulating layer 301d and the second insulating layer 302d, respectively. That is, one side of the third insulating layer 3032 can be connected to the first insulating layer 301d, and the other side of the third insulating layer 3032 can be connected to the second insulating layer 302d. Thus, the first insulating layer 301d and the second insulating layer 302d in the same layer can be connected through the third insulating layer 3032.

[0067] Please refer to the following in this application: Figure 5 The first circuit board 300 may further include: a first protective layer 304 and a second protective layer 305.

[0068] The first protective layer 304 in the first circuit board 300 can be located on the side of the first connection electrode 3021 and the test electrode 3011 that are disposed on the same layer and face the display panel 100. For example, the first protective layer 304 can be solder resist ink. Here, the first protective layer 304 can protect the first circuit board 300 to ensure that water and oxygen in the external environment are not easily corroded by the first circuit board 300, and to ensure that the first circuit board 300 is not prone to short circuits.

[0069] The second protective layer 305 in the first circuit board 300 can be located on the side of the third signal layer 301c and the fourth signal layer 302c facing away from the display panel 100. For example, the second protective layer 305 can be solder resist ink. Here, the second protective layer 305 can protect the first circuit board 300 to ensure that water and oxygen in the external environment are not easily corroded by the first circuit board 300, and to ensure that the first circuit board 300 is not prone to short circuits.

[0070] In the embodiments of this application, such as Figure 5 As shown, the first main body 301 in the first circuit board 300 may further include: a fourth insulating layer 301e located between the third signal layer 301c and the first signal layer 301a, and a sixth insulating layer 301f located between the first ground layer 301b and the test electrode 3011. Here, the third signal layer 301c and the first signal layer 301a can be insulated by the fourth insulating layer 301e. The first ground layer 301b and the test electrode 3011 can be insulated by the sixth insulating layer 301f.

[0071] The second main body 302 in the first circuit board 300 may further include: a fifth insulating layer 302e located between the fourth signal layer 302c and the second ground layer 302b, and a seventh insulating layer 302f located between the second signal layer 302a and the first connection electrode 3021. Here, the fourth signal layer 302c and the second ground layer 302b can be insulated by the fifth insulating layer 302e. The second signal layer 302a and the first connection electrode 3021 can be insulated by the seventh insulating layer 302f.

[0072] In this embodiment, at least one interconnected first insulating layer 301d, third insulating layer 3032, and second insulating layer 302d can be a printed insulating layer. This printed insulating layer strengthens the first circuit board 300, providing support and preventing deformation. It should be noted that the number of conductive layers on one side of the printed insulating layer can be equal to the number of conductive layers on the other side.

[0073] In related technologies, the conductive layers of the printed circuit board (PCB) in a display module typically have eight layers. The first conductive layer usually contains connection electrodes and test electrodes; the second conductive layer usually contains a ground plane covering the entire PCB; the third conductive layer usually contains signal traces for transmitting high-speed signals; the fourth conductive layer usually contains a ground plane covering the entire PCB; the fifth conductive layer usually contains power signal traces; the sixth conductive layer usually contains signal traces for transmitting gate drive signals; the seventh conductive layer usually contains a ground plane covering the entire PCB; and the eighth conductive layer usually contains signal traces for transmitting touch signals. The sum of the thicknesses of these conductive layers is usually large, resulting in a relatively thick PCB. For example, the overall thickness of the PCB is generally above 0.55 mm.

[0074] In this application, the first circuit board 300 in the display module 000 typically has only six conductive layers. The first conductive layer in the first circuit board 300 typically includes a second connection electrode 3031, a first connection electrode 3021, and a test electrode 3011. The second conductive layer typically includes a first ground layer 301b for grounding and a second signal layer 302a containing a first touch signal. The third conductive layer typically includes a second ground layer 302b for grounding and a first signal layer 301a containing a high-speed signal. The fourth conductive layer typically includes a first ground layer 301b for grounding and a second signal layer 302a containing a second touch signal. The fifth conductive layer typically includes a second ground layer 302b for grounding and a first signal layer 301a containing a gate drive signal. The sixth conductive layer typically includes a third signal layer 301c containing a low-level power signal line and a fourth signal layer 302c containing a high-level power signal line. Therefore, there is no need to include a ground layer covering the entire first circuit board 300. This allows for an effective reduction in the number of conductive layers in the first circuit board 300 while ensuring its normal functionality, resulting in a lower overall thickness. For example, the overall thickness of the first circuit board 300 is typically 0.42 mm.

[0075] In the embodiments of this application, please refer to Figure 6 , Figure 6This is a schematic diagram of the film layer structure of another display module provided in this application embodiment. The display panel 100 in the display module 000 may include: a first panel portion 101 and a second panel portion 102, and a panel bending portion 103 for connecting the first panel portion 101 and the second panel portion 102. That is, the panel bending portion 103 may be located between the first panel portion 101 and the second panel portion 102, and one side of the panel bending portion 103 may be connected to the first panel portion 101, and the other side of the panel bending portion 103 may be connected to the second panel portion 102. Here, the first panel portion 101 in the display panel 100 may have a display area. The flexible circuit board 200 in the display module 000 is bonded to the side of the second panel portion 102 opposite to the first panel portion 101.

[0076] In this application, as Figure 6 As shown, the display module 000 may further include: a driver chip 500, a support pad 600, a heat dissipation film layer 700, and a first adhesive layer 800.

[0077] The driver chip 500 in the display module 000 can be bonded to the side of the second panel portion 102 opposite to the first panel portion 101. It should be noted that signal traces are integrated in both the panel bending portion 103 and the second panel portion 102 of the display panel 100. After the driver chip 500 is bonded to the second panel portion 102 of the display panel 100, the driver chip 500 can be electrically connected to these signal traces, and these signal traces can also be electrically connected to the sub-pixels in the first panel portion 101. In this way, the driver chip 500 can send driving signals to the sub-pixels in the first panel portion 101 through these signal traces, causing the sub-pixels in the first panel portion 101 to emit light outwards, thereby enabling the first panel portion 101 to display the corresponding image.

[0078] It should also be noted that the driver chip 500 in the display module 000 can typically be packaged using COP (Chip-On-Pi) packaging technology, COG (Chip-On-Glass) packaging technology, or COF (Chip-On-film) packaging technology. This application embodiment does not limit this. The embodiments in this application are all illustrated using COP packaging technology as an example.

[0079] The support pad 600 in the display module 000 can be bonded to the side of the second panel 102 facing the first panel 101. Here, the support pad 600 can provide support and buffer for the driver chip 500 bonded to the second panel 102, so as to ensure that the driver chip 500 is protected from damage by the buffer of the support pad 600 after being subjected to external force.

[0080] The heat dissipation film layer 700 in the display module 000 can be located on the side of the support pad 600 opposite to the second panel portion 102. Here, the heat dissipation film layer 700 can be used to dissipate the heat generated by the driver chip 500. In this way, the operating temperature of the driver chip 500 can be effectively reduced, so that the signal traces electrically connected to the driver chip 500 in the display panel 100 will not be burned, thereby improving the display effect of the display panel 100.

[0081] The first adhesive layer 800 in the display module 000 can be located between the first circuit board 300 and the heat dissipation film layer 700. In this way, the first circuit board 300 and the heat dissipation film layer 700 can be connected together through the first adhesive layer 800.

[0082] The display module 000 may also include: an optical adhesive layer 1000, a circular polarizer 900, a protective cover plate 1100, and a protective adhesive layer 1200.

[0083] In the display module 000, the circular polarizer 900 is located on the side of the first panel portion 101 away from the first support layer 700, the protective cover plate 1100 is located on the side of the circular polarizer 900 away from the first panel portion 101, and the optical adhesive layer 1000 is located between the circular polarizer 900 and the protective cover plate 1100.

[0084] The protective cover 1100 in the display module 000 can be a glass cover. The protective cover 1100 can protect the first panel portion 101 in the display panel 100, so as to ensure that the protective cover 1100 can withstand the impact force after the front of the display module 000 is hit, thereby reducing the probability that the first panel portion 101 in the display panel 100 will be broken.

[0085] The optical adhesive layer 1000 in the display device 000 is used to bond the protective cover 1100 between the circular polarizers 900, and the optical adhesive layer 1000 is typically made of transparent adhesive (e.g., acrylic adhesive). This ensures that light emitted from the first panel portion 101 in the display panel 100 passes through the optical adhesive layer 1000 and the protective cover 1100 before exiting. Furthermore, the optical adhesive layer 1000 also has good cushioning properties, thus reducing the probability of the protective cover 1100 breaking after the front of the display module 000 is subjected to impact.

[0086] The circular polarizer 900 in the display module 000 can reduce the reflectivity of the first panel 101 to ambient light, so as to ensure that the display area in the first panel 101 displays a better image.

[0087] The protective adhesive layer 1200 in the display module 000 can be used to strengthen the panel bending portion 103 in the display panel 100, so as to ensure that the panel bending portion 103 is not easily damaged.

[0088] In summary, the display module provided in this application includes a display panel, a flexible circuit board, and a first circuit board. Since the first main body has alternating layers of first signal layers and multiple layers of first ground layers, and the second main body has alternating layers of second signal layers and multiple layers of second ground layers, and the first signal layers and second ground layers can be disposed on the same layer, and the second signal layers and first ground layers can also be disposed on the same layer. In this case, for the conductive layer to which the first ground layer belongs in the first main body, not only can the first ground layer for grounding be distributed within this conductive layer, but also the second signal layer belonging to the second main body can be distributed within it. Similarly, for the conductive layer to which the second ground layer belongs in the second main body, not only can the second ground layer for grounding be distributed within this conductive layer, but also the first signal layer belonging to the first main body can be distributed within it. Therefore, it is unnecessary to provide a ground layer covering the entire first circuit board in the first circuit board, thereby effectively reducing the number of conductive layers in the first circuit board while ensuring that the first circuit board can achieve normal function, resulting in a lower overall thickness of the first circuit board.

[0089] This application also provides a display device, which can be any product or component with display function, such as a mobile phone, tablet computer, television, advertising machine, display screen, digital photo frame, or vehicle terminal. The display device may include a frame and a display module connected to the frame, wherein the display module is any of the display modules described in the above embodiments.

[0090] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0091] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0092] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized by include: Display panel (100), flexible circuit board (200) and first circuit board (300); One end of the flexible circuit board (200) is bonded to the non-display portion of the display panel (100); The first circuit board (300) is located on the back of the display panel (100). The first circuit board (300) includes: a first main body (301) and a second main body (302), and a connecting part (303) located between the first main body (301) and the second main body (302). The connecting part (303) is bonded to one end of the flexible circuit board (200) away from the display panel (100). The first main body (301) has multiple alternating first signal layers (301a) and multiple alternating first ground layers (301b), with a first ground layer (301b) distributed between two adjacent first signal layers (301a); the second main body (302) has multiple alternating second signal layers (302a) and multiple alternating second ground layers (302b), with a second ground layer (302b) distributed between two adjacent second signal layers (302a). The first signal layer (301a) and the second ground layer (302b) are disposed on the same layer, and the second signal layer (302a) and the first ground layer (301b) are disposed on the same layer.

2. The display module of claim 1, wherein, The orthographic projection of the flexible circuit board (200) on the display panel (100) overlaps with the orthographic projection of the first main body (301) on the display panel (100), but does not overlap with the orthographic projection of the second main body (302) on the display panel (100). A portion of the flexible circuit board (200) is disposed in contact with the side of the first main body (301) opposite to the display panel (100); The first circuit board (300) further includes: a component (400) connected to the side of the second main body (302) opposite to the display panel (100).

3. The display module of claim 2, wherein, The second main body (302) has a first connection electrode (3021) electrically connected to the component (400) on the side opposite to the display panel (100); the first main body (301) has a test electrode (3011) on the side opposite to the display panel (100), and the test electrode (3011) is electrically connected to at least one first signal layer (301a) and / or at least one second signal layer (302a); The first connecting electrode (3021) and the test electrode (3011) are disposed in the same layer.

4. The display module of claim 3, wherein, The connecting part (303) has a second connecting electrode (3031), which is bonded to one end of the flexible circuit board (200) away from the display panel (100); The second connecting electrode (3031) is disposed in the same layer as the first connecting electrode (3021).

5. The display module of claim 3, wherein, The first main body (301) has a third signal layer (301c) on the side facing the display panel (100), and the second main body (302) has a fourth signal layer (302c) on the side facing the display panel (100). In the first main body (301), the multilayer first signal layer (301a) and the multilayer first ground layer (301b) are located between the test electrode (3011) and the third signal layer (301c); In the second main body (302), the multilayer second signal layer (302a) and the multilayer second ground layer (302b) are located between the first connecting electrode (3021) and the fourth signal layer (302c).

6. The display module of any one of claims 1-5, wherein, The first main body (301) further includes a first insulating layer (301d) located between the first signal layer (301a) and the first ground layer (301b); the second main body (302) further includes a second insulating layer (302d) located between the second signal layer (302a) and the second ground layer (302b). The first insulating layer (301d) and the second insulating layer (302d) are disposed in the same layer; and for the first insulating layer (301d) and the second insulating layer (302d) disposed in the same layer, the first signal layer (301a) located on one side of the first insulating layer (301d) is disposed in the same layer as the second ground layer (302b) located on one side of the second insulating layer (302d); the first ground layer (301b) located on the other side of the first insulating layer (301d) is disposed in the same layer as the second signal layer (302a) located on the other side of the second insulating layer (302d).

7. The display module of claim 6, wherein, The connecting portion (303) includes: multiple layers of third insulating layers (3032) stacked together, at least a portion of the third insulating layers (3032) being located between multiple layers of first insulating layers (301d) and multiple layers of second insulating layers (302d); Among them, the third insulating layer (3032) distributed between the first insulating layer (301d) and the second insulating layer (302d) in the same layer is connected to the first insulating layer (301d) and the second insulating layer (302d) on both sides respectively.

8. The display module of claim 7, wherein, At least one interconnected first insulating layer (301d), third insulating layer (3032) and second insulating layer (302d) are printed insulating layers.

9. The display module of any of claims 1-5, 7-8, wherein, The display panel (100) includes: a first panel portion (101) and a second panel portion (102), and a panel bending portion (103) located between the first panel portion (101) and the second panel portion (102), wherein the first panel portion (101) has a display area; The flexible circuit board (200) is bonded to the side of the second panel (102) opposite to the first panel (101).

10. A display device, characterized by comprising: include: A frame, and a display module connected to the frame, wherein the display module is the display module according to any one of claims 1 to 9.

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