A cable semi-conductive layer stripping tool

Abstract

This invention discloses a cable semiconductor layer stripping tool, relating to the field of cable processing tools. It includes a linear drive mechanism, a mounting base, a hollow shaft, a drive mechanism, a stripping blade mechanism, and at least three sets of positioning mechanisms. The mounting base is fixedly installed on the moving end of the linear drive mechanism, enabling the linear drive mechanism to drive the mounting base to move along the cable length direction. One end of the hollow shaft is rotatably mounted on the mounting base, and the other end is fitted with a rotating disk. The inner cavity of the hollow shaft allows the cable to pass through. This invention uses a drive motor to drive the hollow shaft and rotating disk to rotate via a transmission assembly. During the rotation of the rotating disk, the blade moves in a circular motion with the rotating disk, continuously circumferentially cutting the cable semiconductor layer. Simultaneously, the linear drive mechanism drives the mounting base to feed at a uniform speed along the cable length direction, achieving synchronous circumferential cutting and axial feeding, completing efficient and continuous stripping of the semiconductor layer, thereby reducing labor intensity and improving stripping efficiency.

Description

Technical Field

[0001] This invention belongs to the field of cable processing tools, and specifically relates to a cable semiconductor stripping tool. Background Technology

[0002] In the cable head manufacturing process, the stripping of the outer semiconductive layer of the cable is a critical step, and the quality of the stripping directly affects the insulation performance and operational safety of the cable joint.

[0003] Currently, the industry commonly uses manual stripping tools. During operation, workers need to hold a simple stripping device and repeatedly rotate it along the circumference of the cable to cut it, while simultaneously advancing it axially to remove the semiconducting layer. This method relies entirely on manual rotation, is labor-intensive, and takes a long time to strip a single cable, making it unsuitable for batch construction and rapid on-site operations.

[0004] Therefore, we propose a cable semiconductor stripping tool to solve the above problems. Summary of the Invention

[0005] To address the problems of manual stripping tools, which rely entirely on manual rotation, resulting in high labor intensity and long stripping time for a single cable, this invention provides a cable semiconductor layer stripping tool.

[0006] The solution adopted by the present invention to solve its technical problem is: a cable semiconducting layer stripping tool, including a linear drive mechanism, a mounting base, a hollow shaft, a drive mechanism, a stripping blade mechanism, and at least three sets of positioning mechanisms. The mounting base is fixedly installed on the moving end of the linear drive mechanism, so that the linear drive mechanism can drive the mounting base to move along the length of the cable. One end of the hollow shaft is rotatably mounted on the mounting base, and the other end is fitted with a rotating disk. The inner cavity of the hollow shaft is for the cable to pass through. The drive mechanism includes a drive motor and a transmission assembly. The drive motor is fixedly mounted on the mounting base, and its output shaft is connected to the hollow shaft through the transmission assembly to drive the hollow shaft to rotate. The stripper assembly includes a blade holder fixed to the front side of the rotary disk and a blade head slidably mounted on the blade holder. The position of the blade head is adjustable and locked, and it is used to cut the cable semiconducting layer. The three sets of positioning mechanisms are distributed along the circumferential direction on the front side of the rotating disk. The positioning mechanism includes a rolling abutment and an adjustment assembly fixed on the front side of the rotating disk. The rolling abutment is installed at the end of the adjustment assembly and is used to abut against the cable sheath.

[0007] Preferably, the linear drive mechanism is any one of a manual lead screw slide, a rodless cylinder, or an electric slide.

[0008] Preferably, the transmission assembly includes a driving wheel, a driven wheel, and a timing belt. The driving wheel is mounted and fixed on the outside of the hollow shaft, the driven wheel is mounted on the output shaft of the drive motor, and the timing belt is tensioned and sleeved between the driving wheel and the driven wheel.

[0009] Preferably, the transmission assembly includes a driven gear fixed on a hollow shaft and a driving gear fixed on the output shaft of a drive motor, wherein the driving gear and the driven gear mesh with each other.

[0010] Preferably, the adjusting assembly includes a nut seat and an adjusting bolt, the nut seat being fixedly installed on the front side of the rotating disk, and the adjusting bolt being threaded into the internal thread hole of the nut seat.

[0011] Preferably, the rolling abutment is a bullseye wheel mounted on the end of the adjusting bolt.

[0012] Preferably, the tool holder has a vertically formed tool groove, the tool head is slidably embedded in the tool groove, the tool head has a plurality of positioning holes spaced apart along its sliding direction, the tool holder has a corresponding threaded locking hole, and the threaded locking hole and the corresponding positioning hole are provided with the same fixing screw.

[0013] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention uses a drive motor to drive a hollow shaft and a rotating disk to rotate via a transmission assembly. During the rotation of the rotating disk, the cutter head moves in a circular motion with the rotating disk to continuously cut the cable semiconducting layer. At the same time, the linear drive mechanism drives the mounting base to feed at a constant speed along the length of the cable, realizing the synchronous operation of circumferential cutting and axial feeding, completing the efficient and continuous stripping of the semiconducting layer, thereby reducing labor intensity and improving stripping efficiency.

[0014] 2. This invention employs at least three sets of circumferentially distributed positioning mechanisms, which, through the rolling abutment component adhering to the cable sheath, form a stable multi-point centering support. This effectively prevents the cable from shifting during the cutting process, ensuring a uniform and consistent cutting trajectory of the cutter head. Furthermore, the cutter head position is adjustable and lockable, enabling precise control of the cutting depth, preventing damage to the cable insulation layer, improving the quality of semiconductor layer stripping, and ensuring the insulation performance and operational safety of the cable joint.

[0015] 3. The present invention allows for adjustment of the extension length of the bullseye wheel by setting an adjusting bolt, which can be adapted to the centering and clamping requirements of cables of different diameters. The adjustment is simple, convenient and quick. Attached Figure Description

[0016] Figure 1 This is one of the three-dimensional structural schematic diagrams of the present invention; Figure 2 This is the second schematic diagram of the three-dimensional structure of the present invention.

[0017] In the diagram: 1 Manual lead screw slide, 2 Mounting base, 31 Driven wheel, 32 Drive wheel, 33 Synchronous belt, 34 Drive motor, 4 Hollow shaft, 5 Rotary disc, 61 Nut seat, 62 Adjusting bolt, 63 Bullseye wheel, 71 Tool holder, 72 Tool head, 73 Fixing screw. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Please see Figure 1-2 This invention provides a technical solution for a cable semiconductor layer stripping tool: Example 1: according to Figure 1 and Figure 2 As shown, it includes a linear drive mechanism, a mounting base 2, a hollow shaft 4, a drive mechanism, a peeling mechanism, and at least three sets of positioning mechanisms.

[0020] In this embodiment, the linear drive mechanism is preferably a manual lead screw slide 1. Of course, it can also be replaced with a rodless cylinder or an electric slide according to actual needs. The mounting base 2 is fixedly installed on the moving end (sliding block) of the manual lead screw slide 1, so that the manual lead screw slide 1 can drive the mounting base 2 to move linearly along the cable length direction.

[0021] One end of the hollow shaft 4 is fitted with a bearing 1, which is mounted on the mounting base 2. The other end of the hollow shaft 4 is fitted with a rotating disk 5. The inner cavity of the hollow shaft 4 is designed as a hollow structure for the cable to be processed to pass through.

[0022] The drive mechanism includes a drive motor 34 and a transmission assembly. The drive motor 34 is fixedly mounted on the mounting base 2, and its output shaft passes through the bearing 2 mounted on the mounting base 2. In this embodiment, the transmission assembly adopts a synchronous belt drive method, specifically including a drive pulley 32, a driven pulley 31, and a synchronous belt 33. The drive pulley 32 is fixedly mounted on the output shaft of the drive motor 34, and the driven pulley 31 is fixedly mounted on the outside of the hollow shaft 4. The synchronous belt 33 is tensioned and sleeved between the drive pulley 32 and the driven pulley 31. When the drive motor 34 is working, it drives the driven pulley 31 and the hollow shaft 4 to rotate through the synchronous belt 33, thereby driving the rotating disk 5 to rotate.

[0023] The stripping mechanism includes a blade holder 71 fixed to the front side of the rotating disk 5 and a blade head 72 slidably mounted on the blade holder 71. The blade holder 71 has a vertically formed blade groove, and the blade head 72 is slidably embedded in the blade groove. The blade head 72 has multiple positioning holes spaced apart along its sliding direction, and the blade holder 71 has corresponding threaded locking holes. A fixing screw 73 passes through the corresponding positioning hole and is screwed into the threaded locking hole to adjust and lock the position of the blade head 72. The cutting edge of the blade head 72 faces the cable surface and is used to cut the cable semiconducting layer.

[0024] Three sets of positioning mechanisms are evenly distributed along the circumference of the front side of the rotating disk 5. Each positioning mechanism includes a rolling support and an adjustment component fixed to the front side of the rotating disk 5. By using at least three sets of circumferentially distributed positioning mechanisms, the rolling support is in contact with the cable sheath to form a stable multi-point centering support, which effectively prevents the cable from deviating during the cutting process, ensures that the cutting trajectory of the cutter head 72 is uniform and consistent, and the position of the cutter head 72 can be adjusted and locked to accurately control the cutting depth, prevent damage to the cable insulation layer, improve the quality of the semiconductor layer stripping, and ensure the insulation performance and operational safety of the cable joint.

[0025] The adjustment assembly includes a nut seat 61 and an adjusting bolt 62. The nut seat 61 is fixedly welded to the front side of the rotating disk 5. The adjusting bolt 62 is threaded into the internal threaded hole of the nut seat 61. The rolling abutment is specifically a bullseye wheel 63 installed at the end of the adjusting bolt 62. The bullseye wheel 63 is used to abut against the cable sheath. By setting the adjusting bolt 62, the extension length of the bullseye wheel 63 can be adjusted to adapt to the centering and clamping requirements of cables of different diameters. The adjustment is simple, convenient and quick.

[0026] In practical use, the cable semiconducting layer stripping tool of the present invention first passes the cable to be processed through the inner cavity of the hollow shaft 4. Then, according to the outer diameter of the cable, the adjusting bolts 62 in the three sets of positioning mechanisms are rotated respectively to adjust the extension length of the bullseye wheels 63, so that the three bullseye wheels 63 are tightly attached to the outer sheath of the cable, forming a stable three-point centering support, ensuring that the cable is located on the central axis of the hollow shaft 4. Then loosen the fixing screw 73, slide the cutter head 72 along the cutter groove, so that the cutting edge of the cutter head 72 contacts the surface of the cable semiconducting layer and reaches the preset cutting depth. Then pass the fixing screw 73 through the corresponding positioning hole and screw it into the threaded locking hole to lock the position of the cutter head 72. Finally, the drive motor 34 is started. The output shaft of the drive motor 34 drives the drive wheel 32 to rotate. Through the synchronous belt 33, the driven wheel 31 and the hollow shaft 4 are driven to rotate. At this time, the rotary disk 5 drives the cutter head 72 to make a circular motion around the cable to cut the semiconductor layer. At the same time, the operator turns the handwheel of the manual screw slide table 1 to drive the mounting base 2 and the cutter head 72 to feed at a constant speed along the cable axis. Under the combined motion of circumferential rotary cutting and axial linear feed, the cutter head 72 spirally peels off the cable semiconducting layer until the specified length of peeling is completed.

[0027] Example 2: Based on Embodiment 1, this embodiment mainly changes the structure of the transmission component, while other structures are the same as in Embodiment 1.

[0028] In this embodiment, the transmission component adopts a gear meshing transmission method, specifically including a driven gear fixed on the hollow shaft 4 and a driving gear fixed on the output shaft of the drive motor 34, with the driving gear and the driven gear meshing directly with each other.

Claims

1. A cable semiconductor layer stripping tool, comprising a linear drive mechanism, a mounting base, a hollow shaft, a drive mechanism, a stripping blade mechanism, and at least three sets of positioning mechanisms, characterized in that: The mounting base is fixedly installed on the moving end of the linear drive mechanism, enabling the linear drive mechanism to drive the mounting base to move along the length of the cable. One end of the hollow shaft is rotatably mounted on the mounting base, and the other end is fitted with a rotating disk. The inner cavity of the hollow shaft is for the cable to pass through. The drive mechanism includes a drive motor and a transmission assembly. The drive motor is fixedly mounted on the mounting base, and its output shaft is connected to the hollow shaft through the transmission assembly to drive the hollow shaft to rotate. The stripper assembly includes a blade holder fixed to the front side of the rotary disk and a blade head slidably mounted on the blade holder. The position of the blade head is adjustable and locked, and it is used to cut the cable semiconducting layer. The three sets of positioning mechanisms are distributed along the circumferential direction on the front side of the rotating disk. The positioning mechanism includes a rolling abutment and an adjustment assembly fixed on the front side of the rotating disk. The rolling abutment is installed at the end of the adjustment assembly and is used to abut against the cable sheath.

2. The cable semiconductor stripping tool according to claim 1, characterized in that: The linear drive mechanism is any one of a manual lead screw slide, a rodless cylinder, or an electric slide.

3. The cable semiconductor stripping tool according to claim 1, characterized in that: The transmission assembly includes a driving pulley, a driven pulley, and a timing belt. The driving pulley is mounted and fixed on the outside of the hollow shaft, the driven pulley is mounted on the output shaft of the drive motor, and the timing belt is tensioned and sleeved between the driving pulley and the driven pulley.

4. The cable semiconductor stripping tool according to claim 1, characterized in that: The transmission assembly includes a driven gear fixed on a hollow shaft and a driving gear fixed on the output shaft of a drive motor, with the driving gear and the driven gear meshing with each other.

5. The cable semiconductor stripping tool according to claim 1, characterized in that: The adjusting assembly includes a nut seat and an adjusting bolt. The nut seat is fixedly installed on the front side of the rotating disk, and the adjusting bolt is threaded into the internal thread hole of the nut seat.

6. The cable semiconductor stripping tool according to claim 5, characterized in that: The rolling abutment is a bullseye wheel installed at the end of the adjusting bolt.

7. The cable semiconductor stripping tool according to claim 1, characterized in that: The tool holder has a vertically formed tool groove, and the tool head is slidably embedded in the tool groove. The tool head has multiple positioning holes spaced apart along its sliding direction. The tool holder has corresponding threaded locking holes, and the same fixing screw is installed in the threaded locking holes and the corresponding positioning holes.

Images