Voltage regulation module, control mode, intelligent power module layout and pin arrangement

Abstract

This invention proposes a high-efficiency module structure with good heat dissipation performance. By integrating a heat sink, the heat dissipation capacity of the VRM module is improved, thereby increasing the output power of the VRM module. By adjusting the device layout in the VRM module, parasitic parameters on the power transmission path are reduced, thereby improving the conversion efficiency of the VRM module. Furthermore, the dynamic performance of the VRM module is improved through TLVR technology.

Description

Technical Field

[0001] This invention belongs to the field of high-frequency power supply technology, and in particular relates to a high-efficiency voltage regulation module with good heat dissipation performance. Background Technology

[0002] In recent years, with the development of technologies such as data centers, artificial intelligence, and supercomputers, more and more powerful ASICs have been applied, such as CPUs, GPUs, TPUs, NPUs, ML, AI accelerators, network switches, and servers. These ASICs consume large amounts of current, reaching thousands of amperes; and the dynamic response requirements of their power supplies are becoming increasingly stringent. Traditionally, multiphase voltage regulator modules (VRMs) have been used to supply these loads. With the advancement of semiconductor technology, the power supply capacity of ASICs has further increased, while the required supply voltage has decreased, thus the supply current of ASICs has continued to increase. As the supply current of ASICs increases, the output power and output current of VRMs also increase; therefore, improving VRM conversion efficiency and heat dissipation capabilities has become key to increasing VRM power.

[0003] As current continues to increase, ASICs place increasingly higher demands on the dynamic performance of VRMs. Anti-coupling inductors have relatively low leakage inductance, resulting in a relatively fast transient response. Simultaneously, anti-coupling inductors have higher steady-state equivalent inductance, which is beneficial for efficiency improvement. In other words, anti-coupling inductor technology can meet both transient performance requirements and efficiency improvements, making it a hot topic in VRM design. However, manufacturing multi-phase anti-coupling inductors is difficult. Trans-inductor voltage regulators (TLVRs), which offer similar performance, can achieve coupling between physically uncoupled multi-phase independent inductors by adding auxiliary windings; they can also achieve the dynamic response performance of anti-coupling inductors. Therefore, TLVRs are currently a design hotspot in this field.

[0004] This invention addresses the requirements of high-power VRMs for dynamic performance and steady-state efficiency of output voltage. It proposes a VRM with low parasitic parameters, built-in heat sink, and high conversion efficiency, while also enabling TLVR technology. Summary of the Invention

[0005] In view of this, one of the objectives of the present invention is to provide a voltage regulation module, including a top component and a middle component; the top component includes a top substrate, N intelligent power modules and a metal block, where N is a natural number greater than 1; the top substrate includes opposing top and bottom surfaces; the intelligent power modules are disposed on the bottom surface of the top substrate or embedded within the top substrate; the metal block is disposed on the top surface of the top substrate; the intelligent power modules include opposing top and bottom surfaces, and the top surface of the intelligent power modules is electrically connected to the top substrate; the middle component is disposed adjacent to the bottom surface of the top substrate and is electrically connected to the intelligent power modules.

[0006] Preferably, the middle component includes opposing top and bottom surfaces, a magnetic core, windings, and electrical connectors. The magnetic core includes opposing first and third sides, opposing second and fourth sides, and opposing top and bottom surfaces. The first end of the winding is electrically connected to the bottom surface of the smart power module. The electrical connectors are disposed on the side of the magnetic core and are electrically connected to the metal block via a top substrate.

[0007] Preferably, the electrical connector includes a first power electrical connector and a second power electrical connector, and the metal block includes a first metal block and a second metal block, wherein the first power electrical connector is electrically connected to the first metal block, and the second power electrical connector is electrically connected to the second metal block.

[0008] Preferably, the intelligent power module includes a high-end power switch and a low-end power switch, both of which are vertical power switches, and are connected in series.

[0009] Preferably, the drain of the high-end power switch and the source of the low-end power switch are both disposed on the top surface of the vertical switch, the source of the high-end power switch and the drain of the low-end power switch are both disposed on the bottom surface of the vertical switch, and the source of the high-end power switch and the drain of the low-end power switch are connected in series to the SW terminal.

[0010] Preferably, the electrical connector includes a first power electrical connector and a second power electrical connector, the drain of the high-end power switch is electrically connected to the first power electrical connector, the source of the low-end power switch is electrically connected to the second power electrical connector, and the first end of the winding is electrically connected to the SW terminal.

[0011] Preferably, it further includes a bottom component, the bottom component including a bottom substrate, the bottom substrate including opposing top and bottom surfaces and pins, the bottom surface of the bottom substrate being electrically connected to an external load.

[0012] Preferably, the middle component further includes a signal electrical connector, which is electrically connected to the intelligent power module and is disposed on the side of the magnetic core.

[0013] Preferably, the first power electrical connector is disposed on the first and third sides of the magnetic core, and the second power electrical connector is disposed on the second and fourth sides of the magnetic core.

[0014] Preferably, the first power electrical connector and the second power electrical connector are both disposed on the second side and the fourth side of the magnetic core, with the first power electrical connector located on both sides of the second power electrical connector.

[0015] Preferably, the metal block includes at least two first metal blocks and at least one second metal block, the second metal block being disposed between the first metal blocks, and the top assembly further includes an input capacitor disposed between the first metal blocks and the second metal blocks, the first metal blocks, the second metal blocks and the input capacitor being arranged in the order of first metal block, input capacitor, second metal block, input capacitor and first metal block.

[0016] Preferably, the bottom surface of the top component is provided with pins, including an input pin VIN, a ground pin GND, and a switch midpoint pin SW. The metal block includes a first metal block and a second metal block. The electrical connector includes a first power electrical connector and a second power electrical connector. The input pin VIN is electrically connected to the first metal block and the first power electrical connector. The ground pin GND is electrically connected to the second metal block and the second power electrical connector. The switch midpoint pin SW is electrically connected to the bottom surface of the intelligent power module.

[0017] Preferably, the top assembly further includes a metal pillar disposed on the bottom surface of the top substrate, the smart power module and the metal pillar are encapsulated together by a molding compound, the metal pillar is electrically connected to the metal block through the top substrate, the pins are disposed on the surface of the molding compound, and the pins are electrically connected to the winding and the electrical connector.

[0018] Preferably, the pins are disposed on the bottom surface of the top substrate, and the pins on the bottom surface of the top substrate are electrically connected to the metal block and the smart power module through wiring or metal pillars.

[0019] Preferably, the pins of the top substrate assembly further include signal pins, and the middle assembly further includes a signal electrical connector, the signal pins being electrically connected to the signal electrical connector and the smart power module.

[0020] Preferably, the signal electrical connector is a vertical plate structure.

[0021] Preferably, the signal pins are implemented through drilling and electroplating.

[0022] Preferably, the N intelligent power modules are arranged in an array, wherein the low-end power switches of the N intelligent power modules are arranged adjacent to each other, and the high-end power switch of each intelligent power module is arranged adjacent to the corresponding low-end power switch. The switches in the intelligent power modules located in the same row are arranged in the order of high-end power switch, low-end power switch, low-end power switch and high-end power switch.

[0023] Preferably, the intelligent power module further includes a drive / logic circuit, which is arranged in parallel with the high-end power switch and is located on the same outer side of the low-end power switch.

[0024] Preferably, the winding includes a main winding and an auxiliary winding, and the electrical connector includes a first power electrical connector, a second power electrical connector and an auxiliary winding electrical connector. The main winding and the auxiliary winding are coupled to each other. The first power electrical connector and the second power electrical connector are electrically connected to the top surface of the smart power module through a top substrate, and the bottom surface of the smart power module is electrically connected to the main winding.

[0025] Preferably, the first power electrical connector is disposed on the first and third sides of the magnetic core, and the second power electrical connector and the auxiliary winding electrical connector are both disposed on the second and fourth sides of the magnetic core, with the auxiliary winding electrical connector and the second power electrical connector being disposed alternately.

[0026] Preferably, the assembly further includes a bottom component, which includes a bottom substrate. The bottom substrate includes opposing top and bottom surfaces and pins. The pins are disposed on the top and bottom surfaces of the bottom substrate. The first power connector, the second power connector, the main winding, and the auxiliary winding connector are all electrically connected to the pins on the top surface of the bottom substrate. The auxiliary winding forms an auxiliary winding circuit through the auxiliary winding connector, the top substrate, and the bottom substrate. The bottom surface of the bottom component is electrically connected to an external load.

[0027] Preferably, the pins on the top surface of the bottom substrate include a first power pin, a second power pin, and an output pin. The output pin is located in the middle of the bottom substrate or adjacent to the first side of the magnetic core. The first power pin and the second power pin surround the output pin on all four sides or three sides. The first power pin is adjacent to the first side and / or the third side of the magnetic core. The second power pin is adjacent to the second side and the fourth side of the magnetic core. The first power pin is adjacent to the second power pin.

[0028] Preferably, the output pins include two first output pins and two second output pins, and the four output pins are arranged in a 2*2 array. The two first output pins are located near the second side of the magnetic core, and the two second output pins are located near the fourth side of the magnetic core.

[0029] Preferably, there are three second power pins arranged sequentially on the three sides of the output pin, and the first power pin is arranged on the fourth side of the output pin, and the three second power pins are electrically connected in sequence.

[0030] Preferably, the output pins include a first output pin and a second output pin, both of which are rectangular.

[0031] Preferably, the pins on the top surface of the bottom substrate include signal pins, which are disposed adjacent to the first side and / or the third side of the magnetic core.

[0032] Preferably, the pins on the top surface of the bottom substrate include TLG extension pins and TLC extension pins, which are respectively located near the corner of the first side of the magnetic core close to the second side and the corner of the first side close to the fourth side.

[0033] Preferably, the pins on the bottom surface of the bottom substrate include an output pin, a first power pin, and a second power pin. The output pin is disposed in the middle of the bottom surface of the bottom substrate, and the first power pin and the second power pin are disposed around the output pin. The first power pin and the second power pin are disposed adjacent to each other.

[0034] Preferably, the pins on the bottom surface of the bottom substrate further include signal pins, which are adjacent to the first side and / or the third side of the magnetic core and located outside the first power pin.

[0035] Preferably, the pins on the bottom surface of the substrate further include TLG extension pins and TLC extension pins, which are located near two or four corners of the bottom surface of the substrate.

[0036] Preferably, the pins on the bottom surface of the bottom substrate include an output pin, a first power pin, and a second power pin. The output pin, the first power pin, and the second power pin are arranged sequentially in the same direction in the order of first power pin, output pin, second power pin, output pin, and first power pin. The pins on the bottom substrate also include signal pins. The signal pins are adjacent to the first side and / or the third side of the magnetic core. Some of the signal pins are TLG extension pins and TLC extension pins.

[0037] Preferably, the bottom surface of the bottom substrate has m*n LGA pins, where m and n are both integers greater than or equal to 1.

[0038] Preferably, the pins on the bottom surface of the bottom substrate include a first power pin, a second power pin, and an output pin. The first power pin, the second power pin, and the output pin are arranged in two columns. Each column is arranged in the order of the first power pin, the second power pin, the output pin, the second power pin, and the first power pin. Signal pins, TLG extension pins, TLC extension pins, and auxiliary output pins are also distributed around the two columns of pins. The auxiliary output pins are respectively located near the second side and the fourth side of the magnetic core. The TLG extension pins are located between the auxiliary output pins on the second side. The TLC extension pins are located between the auxiliary output pins on the fourth side. The signal pins are located on the first side and the third side of the magnetic core.

[0039] Preferably, the pins on the bottom surface of the bottom substrate are arranged in the form of a pin array or a BGA array. The pins on the bottom surface of the bottom substrate include output pins, a first power pin, a second power pin, a signal pin, a TLG extension pin, and a TLC extension pin. The output pins are arranged in an m*n pin array, where m and n are natural numbers greater than 1, and are located in the central region of the bottom substrate. The second power pins are arranged in two columns along the second and fourth sides of the magnetic core, respectively. The first power pins are arranged in two rows along the first side of the magnetic core. The TLG extension pins and TLC extension pins are disposed adjacent to the first side of the magnetic core and are respectively located between the first power pins and the second power pin. The signal pins are arranged along the third side of the magnetic core.

[0040] Preferably, the bottom surface of the top substrate is provided with other passive components, and the top surface of the magnetic core is provided with a groove for accommodating the other passive components.

[0041] Preferably, the top component further includes a drive / logic circuit, wherein one drive / logic circuit controls two smart power modules simultaneously, the drive / logic circuit is disposed between the two smart power modules, or the drive / logic circuit is disposed on the same side of two low-end power switches of the two smart power modules, the low-end power switches of adjacent smart power modules are disposed adjacent to each other, and the high-end power switch is disposed outside the low-end power switch.

[0042] Preferably, it further includes N drive / logic circuits, each drive / logic circuit, each high-side power switch and each low-side power switch constitutes a sub-unit, the drive / logic circuits and the high-side power switches are arranged side by side on one side of the low-side power switches, and the low-side power switches of the N sub-units are arranged adjacent to each other.

[0043] Preferably, it further includes N drive / logic circuits, each drive / logic circuit, each high-side power switch and each low-side power switch constitutes a sub-unit. The drive / logic circuits and the high-side power switches are arranged side by side on one side of the low-side power switch. Each sub-unit and its neighboring sub-units overlap after being rotated clockwise or counterclockwise by a certain angle.

[0044] Preferably, the bottom surface of the top substrate is provided with an input pin VIN, a ground pin GND, a switch midpoint pin SW, an auxiliary winding pin, and an auxiliary winding electrical connector pin. The switch midpoint pin SW corresponds one-to-one with the position of the main winding of the central component and is electrically connected. The auxiliary winding pin corresponds one-to-one with the position of the auxiliary winding and is electrically connected. The auxiliary winding electrical connector pin corresponds one-to-one with the position of the auxiliary winding electrical connector and is electrically connected. The input pin VIN corresponds one-to-one with the position of the first power electrical connector and is electrically connected. The ground pin GND corresponds one-to-one with the position of the second power electrical connector and is electrically connected.

[0045] Preferably, the bottom surface of the top substrate is further provided with a first signal pin and a second signal pin, and the electrical connector further includes a first signal electrical connector and a second signal electrical connector. The first signal pin corresponds to the position of the first signal electrical connector and is electrically connected, and the second signal pin corresponds to the second signal electrical connector and is electrically connected.

[0046] Preferably, the first signal electrical connector is a vertical plate structure and is disposed adjacent to the third side of the magnetic core, and the second signal electrical connector is disposed adjacent to the first side and the third side of the magnetic core respectively, and the second signal electrical connector is electrically connected to the TLG extension pin and the TLC extension pin.

[0047] Preferably, the metal block includes a plurality of first metal blocks and a plurality of second metal blocks, each of the first metal blocks being electrically connected to the drain of a high-end power switch, and each of the second metal blocks being electrically connected to the source of two adjacent low-end power switches.

[0048] Preferably, the N low-end power switches are arranged adjacent to each other, and the top assembly further includes an input capacitor disposed between the plurality of second metal blocks and located at the center of the plurality of low-end power switches.

[0049] Preferably, a high-frequency capacitor is provided inside the top substrate or on the bottom surface of the top substrate, and the high-frequency capacitor is disposed adjacent to the intelligent power module.

[0050] Preferably, the high-efficiency power supply module includes an input positive terminal, an input negative terminal, an output positive terminal, and an output negative terminal, wherein the input negative terminal and the output negative terminal are shorted to form a GND terminal; the first metal block is electrically connected to the input positive terminal, and the second metal block is electrically connected to the GND terminal.

[0051] Another aspect of the present invention provides a control method for a 4-phase VRM, including a four-phase Buck circuit; the four-phase Buck circuits are connected in parallel; it also includes a first control signal PWM1, a second control signal PWM2, a first current detection signal, a second current detection signal, a first control logic circuit, a second control logic circuit, and a multi-phase controller, wherein the first control signal PWM1 and the second control signal PWM2 have the same period but are out of phase by 180°; the first control signal PWM1 generates two drive signals through the first control logic circuit, the period of each of the two drive signals is twice that of the first control signal PWM1, and the two drive signals drive two Buck circuits respectively; the first current detection signal generates a first summed current detection signal through the first control logic circuit, the first summed current detection signal... The frequency and phase are the same as the first control signal PWM1. The first control signal PWM1 and the first sum-up current detection signal are respectively connected to the control signal pin and the current detection signal pin of the multiphase controller with the same phase. The second control signal PWM2 generates two drive signals through the second control logic circuit. The two drive signals drive two other Buck circuits respectively. The second current detection signal generates a second sum-up current detection signal through the second control logic circuit. The period of the two drive signals is twice that of the second control signal PWM2. The frequency and phase of the second sum-up current detection signal are the same as the second control signal PWM2. The second control signal PWM2 and the second sum-up current detection signal are respectively connected to the control signal pin and the current detection signal pin of the multiphase controller with the same phase.

[0052] In another aspect, the present invention provides a voltage regulation module, including a top assembly and a middle assembly. The top assembly includes a top substrate, an input positive pin, a ground pin, and a smart power module. The middle assembly includes a magnetic core, a winding, and an electrical connector. The smart power module is disposed on the bottom surface of the top substrate or embedded within the top substrate. The input positive pin and the ground pin are disposed on the top surface of the top substrate. The top surface of the smart power module is electrically connected to the input positive pin and the ground pin through the top substrate. The bottom surface of the smart power module is electrically connected to a first end of the winding, and a second end of the winding is electrically connected to an external load. The first end of the winding is disposed on the top surface of the middle assembly, and the second end of the winding is disposed on the bottom surface of the middle assembly. The electrical connector includes a power connector disposed on the side of the magnetic core, and the power connector is electrically connected to the ground pin.

[0053] Preferably, the top assembly further includes a plurality of metal blocks disposed on the top surface of the top substrate and electrically connected to the input positive pin and the ground pin, respectively.

[0054] Preferably, the top component further includes an input capacitor connected between the positive input pin and the ground pin.

[0055] Preferably, the intelligent power module includes a high-end power switch and a low-end power switch, both of which are vertical switches. The drain of the high-end power switch and the source of the low-end power switch are located on the top surface of the vertical switch, and the source of the high-end power switch and the drain of the low-end power switch are located on the bottom surface of the vertical switch and short-circuited to the middle terminal SW of the switch. The drain of the high-end power switch is located adjacent to and electrically connected to the positive input pin, and the source of the low-end power switch is located adjacent to and electrically connected to the ground pin. The middle terminal SW of the switch is located adjacent to the winding and electrically connected to the first end of the winding.

[0056] Preferably, it further includes a bottom component; the bottom surface of the bottom component is provided with an output pin and a power pin; the output pin is electrically connected to the second end of the winding; the power pin is electrically connected to a power connector; the output pin and the power pin constitute the output terminal of the voltage regulation module.

[0057] Another aspect of the present invention provides a smart power module layout, the smart power module layout including a plurality of smart power modules, each smart power module including a high-end power switch and a low-end power switch; the high-end power switch and the low-end power switch are connected in series; the plurality of low-end power switches are arranged adjacent to each other; the plurality of high-end power switches are arranged around the plurality of low-end power switches and are respectively arranged adjacent to the corresponding low-end power switches; the plurality of smart power modules are arranged symmetrically along a symmetry axis or in a windmill shape.

[0058] Preferably, both the high-end power switch and the low-end power switch are vertical power switches. The drain of the high-end power switch and the source of the low-end power switch are both located on the top surface of the vertical switch, and the source of the high-end power switch and the drain of the low-end power switch are both located on the bottom surface of the vertical switch. The source of the high-end power switch and the drain of the low-end power switch are connected in series to the SW terminal.

[0059] Preferably, the switches in the intelligent power modules located in the same row are arranged in the order of high-end power switch, low-end power switch, low-end power switch and high-end power switch.

[0060] Preferably, each of the intelligent power modules further includes a drive / logic circuit, which is arranged in parallel with the high-end power switch and is located on the same outer side of the low-end power switch.

[0061] Preferably, it further includes at least one drive / logic circuit, which simultaneously controls two smart power modules. The drive / logic circuit is disposed between the two smart power modules, or the drive / logic circuit is disposed on the same side of the two low-end power switches of the two smart power modules.

[0062] Preferably, each of the intelligent power modules further includes a drive / logic circuit, which is arranged side by side with the high-end power switch on one side of the low-end power switch, and each intelligent power module overlaps with its neighboring intelligent power module after being rotated clockwise or counterclockwise by a certain angle.

[0063] Another aspect of the present invention provides a pin arrangement for a voltage regulation module, the voltage regulation module including an intelligent power module and a central component; the voltage regulation module further includes opposing top and bottom surfaces, opposing first and third side surfaces, and opposing second and fourth side surfaces; the central component includes a magnetic core and a winding; the intelligent power module is electrically connected to one end of the winding; the pins are disposed on the bottom surface of the voltage regulation module; the pins include an output pin, a first power pin, and a second power pin; the output pin is disposed in the middle of the bottom surface of the voltage regulation module, and the first power pin and the second power pin are disposed around the output pin; the output pin is electrically connected to the other end of the winding, and the first power pin and the second power pin are electrically connected to the intelligent power module.

[0064] Preferably, the first power pin is disposed adjacent to the first side and / or the third side of the voltage regulation module; the second power pin is disposed adjacent to the second side and / or the fourth side of the voltage regulation module; and a signal pin is further included, which is disposed on the first side and / or the third side of the voltage regulation module and located outside the first power pin.

[0065] Preferably, it also includes TLG extension pins and TLC extension pins, which are located near two or four corners on the bottom surface of the voltage regulation module.

[0066] Preferably, the first power pin, the second power pin, and the output pin are arranged in two columns, with each column arranged in the order of first power pin, second power pin, output pin, second power pin, and first power pin. Signal pins, TLG extension pins, TLC extension pins, and auxiliary output pins are also distributed around the two columns of pins. The auxiliary output pins are respectively located on the second side and the fourth side of the voltage regulation module. The TLG extension pins are located between the auxiliary output pins on the second side, the TLC extension pins are located between the auxiliary output pins on the fourth side, and the signal pins are located on the first side and the third side.

[0067] Preferably, the pins are arranged in the form of a pin array or a BGA array, and the output pins are arranged in an m*n pin array, where m and n are natural numbers greater than 1; the second power pins are arranged in two columns along the second side and the fourth side respectively, and the first power pins are arranged in two rows along the first side; the pins also include signal pins, TLG extension pins and TLC extension pins; the TLG extension pins and TLC extension pins are disposed adjacent to the first side and are respectively located between the first power pins and the second power pins, and the signal pins are arranged along the third side.

[0068] The beneficial effects of this invention are:

[0069] (1) This invention proposes a module structure with high efficiency and good heat dissipation performance. By designing a built-in heat sink, the heat dissipation capacity of the VRM is improved, thereby increasing the output power of the VRM. By arranging the components in the VRM, the parasitic impedance parameters on the power transmission path are reduced, thereby improving the conversion efficiency of the VRM. Furthermore, the dynamic performance of the VRM is improved by using TLVR technology.

[0070] (2) The present invention also proposes a VRM control method, which controls the four-phase VRM to work alternately with a phase difference of 90 degrees by a two-phase staggered control signal of 180 degrees, which can reduce the input / output current ripple and reduce the number of input / output capacitors.

[0071] (3) The present invention also proposes a smart power module layout and pin layout. By adjusting the position of the switches and drive / logic circuits in the smart power module and the pin layout, the VRM volume is reduced and the power transmission path is shortened, thereby further improving the VRM conversion efficiency. Attached Figure Description

[0072] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0073] Figure 1A The circuit principle of a four-phase VRM module;

[0074] Figure 1B The circuit principle of a four-phase VRM module with TLVR;

[0075] Figures 2A to 2E This is an example of a VRM module;

[0076] Figures 3A to 3B This is another embodiment of the VRM module;

[0077] Figures 4A to 4B This is another embodiment of the VRM module;

[0078] Figures 5A to 5D This is another embodiment of the VRM module;

[0079] Figures 6A to 6G This is another embodiment of the VRM module;

[0080] Figures 7A to 7D Extended implementation of the internal layout of the top substrate;

[0081] Figure 8 An extended implementation of the top surface layout for the top component;

[0082] Figures 9A to 9D An extended implementation of the top surface layout for the bottom component;

[0083] Figures 9E to 9F This describes an implementation method for the bottom surface layout of the bottom component;

[0084] Figures 10A to 10B This is a functional block diagram and timing diagram for a four-phase VRM module with TLVR. Detailed Implementation

[0085] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0086] Figure 1AThe diagram illustrates the circuit schematic of a four-phase voltage regulator module (VRM) according to this invention. The four-phase VRM circuit includes four parallel-connected Buck circuits. Each Buck circuit includes an intelligent power module 11 (hereinafter referred to as an IPM, such as a Dr. MOS), an output inductor, and a shared input capacitor Cin for all four Buck circuits. Each intelligent power module 11 includes a high-side switching device SxH, a low-side switching device SxL, and a driver and logic circuit (not shown in the diagram); here, x is related to the number of parallel phases of the Buck circuit. The drain of the high-side switching device is electrically connected to the positive input terminal VIN+, and the source of the low-side switching device is electrically connected to the negative input terminal VIN- (i.e., GND). The connection between the source of the high-side switching device and the drain of the low-side switching device serves as the output terminal of the IPM, denoted as the Switching Node (SW point). The input terminal of the main winding Lx of the output inductor is electrically connected to the SW point. The output terminal of the main winding Lx of the output inductor serves as the positive output terminal VO+ of the VRM, which is connected to one end of the load to provide energy to the load. In this invention, the switching device is described using a MOSFET as an example, but it is not limited to this.

[0087] The four output inductors in the four-phase voltage regulation module described in this invention can be four independent inductors, meaning that there is no magnetic coupling or weak positive coupling between the main windings L1, L2, L3, and L4 of the four output inductors, such as a coupling coefficient less than 0.2. Here, the number of phases in the parallel Buck circuit is not limited to four phases; as long as it is a module with two or more phases, the same technical effect can be achieved. Figure 1A The 4-phase IPM in the dashed box 10 shown is controlled by 4-phase PWM control signals. The phase difference between two adjacent PWM control signals is 360 degrees / 4, or 90 degrees. When the module uses N-phase Buck circuits in parallel (N is a natural number greater than 1), the phase difference between two adjacent PWM control signals is 360 degrees / N.

[0088] like Figure 1A As shown, the drain electrode of the high-side switch in the intelligent power module 11 is electrically connected to the positive input terminal VIN+, and the source electrode of the low-side switch is electrically connected to the negative input terminal VIN- (i.e., GND terminal). In the loop from the positive input terminal VIN+, through the IPM, to the negative input terminal VIN-, there are parasitic resistance and parasitic inductance. Reducing the parasitic resistance and appropriately selecting the parasitic inductance can help improve efficiency.

[0089] Figure 1AIn the VRM, the IPM has the greatest loss and is the largest heat source; therefore, the most effective way to increase the output power of the VRM is to improve the heat dissipation performance of the IPM, that is, to reduce the thermal resistance of the IPM, thereby reducing the upward thermal resistance Rthj_top of the VRM.

[0090] Figure 1B Is Figure 1A Based on this, an auxiliary winding L10, L20, L30, and L40 are added to the main windings L1, L2, L3, and L4 of each phase output inductor, respectively. These auxiliary windings are strongly coupled to the corresponding main windings, i.e., L10 is strongly coupled to L1, L20 to L2, L30 to L3, and L40 to L4. Furthermore, the auxiliary windings of each phase are connected in series to form a loop to achieve TLVR technology. This makes the main windings L1, L2, L3, and L4, which were originally physically uncoupled, equivalent to four anti-coupled windings. This results in a smaller dynamic inductance to improve the dynamic performance of the module output voltage, while also achieving a higher steady-state inductance for higher efficiency.

[0091] In practical applications, the first end of auxiliary winding L10 is the same as the input end of main winding L1, and is marked as a dot end; the first end of auxiliary winding L20 is the same as the input end of main winding L2, and is marked as a dot end; the first end of auxiliary winding L30 is the same as the input end of main winding L3, and is marked as a dot end; the first end of auxiliary winding L40 is the same as the input end of main winding L4, and is marked as a dot end. Connecting the first and last ends of auxiliary windings L10, L20, L30, and L40 forms a series branch of auxiliary windings, i.e., the second end of L10 connects to the first end of L20, the second end of L20 connects to the first end of L30, and the second end of L30 connects to the first end of L40. One end of the series branch of auxiliary windings, i.e., the first end of L10, is marked as TLG; the other end of the series branch of auxiliary windings, i.e., the second end of L40, is marked as TLC. Corresponding TLG and TLC pins can be set on each four-phase voltage regulation module to allow the series branches of the auxiliary windings of multiple TLVR modules to be further interconnected, thereby realizing a multi-phase TLVR power supply scheme. Figure 1B In this configuration, TLG is connected to one end of the external inductor Le; the other end of Le is connected to the GND terminal; and TLC is also connected to the GND terminal. This creates a closed loop for the series branch of the auxiliary winding through the external inductor Le and the GND terminal. The external inductor Le is used to enhance the steady-state and dynamic inductance of the four-phase voltage regulation module.

[0092] This invention also discloses the structure of a four-phase VRM, such as Figures 2A to 2B As shown, Figure 2B for Figure 2A A diagram showing the breakdown of the diagram. (See diagram below.) Figure 2Aand Figure 2B As shown, the four-phase VRM includes a top component 100, a middle component 200, and a bottom component 300; the top component 100 includes a top substrate 110, and driver MOSFETs 121, 122, 123, and 124 (i.e., Figure 1A and Figure 1B The system includes an intelligent power module 11 (hereinafter referred to as IPM), an input capacitor 140, first heat sinks 131 and 132, and a second heat sink 141. The top substrate 110 has opposing top and bottom surfaces. IPMs 121, 122, 123, and 124 are disposed on the bottom surface of the top substrate 110; IPMs 121, 122, 123, and 124 include opposing top and bottom surfaces, and the top surface of the IPM is electrically connected to the bottom surface of the top substrate 110. The input capacitor 140 and the heat sinks 131, 132, and 141 are disposed on the top surface of the top substrate 110, and both the input capacitor and the heat sinks are mounted together with and electrically connected to the top substrate. IPMs 121, 122, 123, and 124 are arranged in a 2x2 array; the second heat sink 141 is disposed between the first heat sinks 131 and 132.

[0093] The central assembly 200 includes a magnetic core 210, a first winding 221, a second winding 222, a third winding 223, a fourth winding 224, first power electrical connectors 231 and 232, second power electrical connectors 241 and 242, and signal electrical connectors 251 and 252. The aforementioned windings correspond to... Figure 1A and Figure 1BThe four output inductors have main windings. The first pin of the first winding 221 is electrically connected to the bottom surface of the first IPM 121, the first pin of the second winding 222 is electrically connected to the bottom surface of the second IPM 122, the first pin of the third winding 223 is electrically connected to the bottom surface of the third IPM 123, and the first pin of the fourth winding 224 is electrically connected to the bottom surface of the fourth IPM 124. The second pins of the first winding 221 to the fourth winding 224 are all shorted together through the bottom substrate 310 in the bottom assembly 300 and electrically connected to the load to provide energy to the load. First power electrical connectors 231 and 232 are disposed on two opposite sides of the magnetic core, adjacent to the first heat dissipation copper blocks 131 and 132 respectively, and their first pins are electrically connected to the first heat dissipation copper blocks 131 and 132 above the top substrate via the top substrate 110. Second power electrical connectors 241 and 242 are disposed on the other two opposite sides of the magnetic core, and their first pins are electrically connected to the second heat dissipation copper block 141 above the top substrate via the top substrate 110. Signal electrical connectors 251 and 252 are disposed adjacent to the first power electrical connectors 231 and 232 respectively, and their first pins are electrically connected to the IPM via the top substrate, while their second pins are electrically connected to the bottom substrate 310 in the bottom assembly 300.

[0094] Figure 2C The diagram shows the structure of an IPM bare chip within the encapsulation material or embedded in the encapsulation substrate. Figure 2D yes Figure 2C Side view. (Refer to...) Figure 2C and Figure 2DAs shown, the first IPM 121 includes a high-side MOSFET 121H, a low-side MOSFET 121L, and a drive / logic circuit 121C; the second IPM 122 includes a high-side MOSFET 122H, a low-side MOSFET 122L, and a drive / logic circuit 122C; the third IPM 123 includes a high-side MOSFET 123H, a low-side MOSFET 123L, and a drive / logic circuit 123C; and the fourth IPM 124 includes a high-side MOSFET 124H, a low-side MOSFET 124L, and a drive / logic circuit 124C. Both the high-end and low-end MOSFETs are vertical MOSFETs. The drain of the high-end MOSFET is located on the top surface of the MOSFET, such as 121HD, 122HD, 123HD, and 124HD, while the source is located on the bottom surface, such as 121HS, 122HS, 123HS, and 124HS. Similarly, the drain of the low-end MOSFET is located on the bottom surface, such as 121LD, 122LD, 123LD, and 124LD, while the source is located on the top surface, such as 121LS, 122LS, 123LS, and 124LS. In the horizontal layout, the four low-end MOSFETs of the four IPMs are arranged adjacent to each other, allowing the sources of the four low-end MOSFETs to be shorted together on the top substrate 110. Furthermore, the four low-end MOSFETs can be integrated onto a single wafer. The high-side MOSFET of each IPM is adjacent to its respective low-side MOSFET, so that the source of the high-side MOSFET and the drain of the low-side MOSFET of each IPM can be shorted together nearby; the drive / logic circuit of each IPM is placed side by side with the high-side MOSFET and adjacent to the low-side MOSFET, so that the drive / logic circuit can drive the high-side MOSFET and the low-side MOSFET nearby. Figure 2C In some cases, the driver and logic circuits are placed to the right of the high-side MOSFET, as shown in IPM 123; others can be placed to the left of the high-side MOSFET, as shown in IPM 121. The advantage of this is that the driver / logic circuits 123C and 121C are adjacent, and furthermore, 123C and 121C can be integrated onto a single wafer.

[0095] like Figure 1AAs shown, the drain of the high-side MOSFET is electrically connected to the positive input terminal VIN+, and the source of the low-side MOSFET is electrically connected to the negative input terminal Vin-. The sources of the high-side MOSFET and the drains of the low-side MOSFET are both electrically connected to the input terminal of the output inductor. Therefore, in this embodiment, the first power connector 231 is electrically connected to the drains 121HD and 123HD of the high-side MOSFET via the top substrate 110, and the first power connector 232 is electrically connected to the drains 122HD and 124HD of the high-side MOSFET via the top substrate 110. The second power connectors 241 and 242 are electrically connected to the sources 121LS, 122LS, 123LS, and 124LS of the low-side MOSFET via the top substrate 110, respectively.

[0096] The first pin of the first winding 221 is electrically connected at the bottom of the first IPM 121 to the source 121HS of the high-side MOSFET and the drain 121LD of the low-side MOSFET. The first pin of the second winding 222 is electrically connected at the bottom of the second IPM 122 to the source 122HS of the high-side MOSFET and the drain 122LD of the low-side MOSFET. The first pin of the third winding 223 is electrically connected at the bottom of the third IPM 123 to the source 123HS of the high-side MOSFET and the drain 123LD of the low-side MOSFET. The first pin of the fourth winding 224 is electrically connected at the bottom of the fourth IPM 124 to the source 124HS of the high-side MOSFET and the drain 124LD of the low-side MOSFET.

[0097] According to the aforementioned layout and connection method, the input power is transmitted to the high-side MOSFET of Dr. MOS through the first power electrical connector, and then the low-side MOSFET is electrically connected to the second power electrical connector. The output inductor is vertically positioned, and its input terminal is electrically connected to the SW pin of Dr. MOS, thereby reducing the DC impedance of the input and output circuits and improving the efficiency of the VRM module. At the same time, the first heat dissipation copper blocks 131 and 132 on the top surface of the top component are electrically connected to the drain of the high-side MOSFET on the top substrate, and the second heat dissipation copper block 141 is electrically connected to the source of the low-side MOSFET on the top substrate. The placement of the copper blocks reduces the DC impedance of the power path in the top substrate, further reducing the losses of the VRM module.

[0098] Furthermore, a VIA (via) or copper pillar is provided in the top substrate. The first heat dissipation copper block and the second heat dissipation copper block are vertically electrically connected to the high-end MOSFET and low-end MOSFET of the IPM through the VIA or copper pillar, thereby further reducing the thermal resistance from the MOSFET to the top surface of the module. Specifically, the first heat dissipation copper block 131 is vertically electrically connected to the drain of the high-end MOSFET 121H and the drain of 123H, and the first heat dissipation copper block 132 is vertically electrically connected to the drain of the high-end MOSFET 122H and the drain of 124H. The first heat dissipation copper blocks 131 and 132 are shorted together inside the top substrate 110. The second heat dissipation copper block 141 is vertically electrically connected to the source of the four low-end MOSFETs 121L, 122L, 123L and 124L. The height of the aforementioned heat dissipation copper block is close to or slightly higher than the height of the input capacitor 140, making the top components of the four-phase VRM approximately uniform in height. This reduces the thermal resistance between the Dr. MOS and the thermal pad in applications where a thermal pad and heat sink are added to the top of the four-phase VRM. Furthermore, the heat dissipation copper block can bear most of the pressure transferred from the heat sink and thermal pad to the four-phase VRM, thereby reducing the stress on the input capacitor 140. This configuration provides a low-thermal-resistance heat dissipation path for the heat source MOSFET, further improving the output power of the VRM module; that is, it can provide a larger output current at the same output voltage. Since the low-side MOSFET has a longer conduction time in the BUCK circuit, its losses are greater. Therefore, the design allows the second heat dissipation copper block 141, which is electrically connected to the low-side MOSFET, to have a larger volume, facilitating more balanced heat dissipation of the VRM module.

[0099] The input capacitor 140 is located on the top surface of the top component. The input capacitor 140 is connected across the positive input terminal VIN+ and the negative input terminal Vin- (i.e., GND terminal). That is, the positive terminal of the input capacitor is electrically connected to the positive input terminal VIN+, which is close to the drain of the high-side MOSFET, and its negative terminal is electrically connected to the GND terminal, which is close to the source of the low-side MOSFET. With this electrical connection method, the loop between the input capacitor and the MOSFET is minimized, which further reduces the parasitic inductance on the loop path and improves the high-frequency filtering effect. At the same time, due to the small parasitic inductance, the voltage spikes caused by high-frequency oscillations are small, which is beneficial to the reliability of the module operation. In addition, it also reduces the energy loss caused by high-frequency oscillations and further improves the conversion efficiency of the VRM module. The above arrangement causes the input capacitor 140 to be located between the first heat dissipation copper block 131 and the second heat dissipation copper block 141, or to be located between the first heat dissipation copper block 132 and the second heat dissipation copper block 141; thereby forming a layout on the surface of the four-phase VRM in which the first heat dissipation copper block, the input capacitor, the second heat dissipation copper block, the input capacitor, and the first heat dissipation copper block are arranged in sequence.

[0100] Figure 2EThis is a pin diagram of the bottom substrate 310 in the bottom assembly. The bottom surface of the bottom substrate 310 has first power pins 331 and 332, second power pins 341 and 342, an output pin 371, and signal pins 351 and 352. The first power pins 331 and 332 are electrically connected to the second pins of the first power connectors 231 and 232 on the top surface of the bottom substrate 310. The second power pins 341 and 342 are electrically connected to the second pins of the second power connectors 241 and 242 on the top surface of the bottom substrate 310. The output pin is electrically connected to the second pins of four windings on the top surface of the bottom substrate 310. The output pin 371 is surrounded by the first power pins 331 and 332 and the second power pins 341 and 342 on all four sides. Signal pins 351 and 352 are electrically connected to the second pins of signal connectors 251 and 252 on the top surface of the bottom substrate 310; and the signal pins 351 and 352 are located outside the first power pins 331 and 332, respectively, and are parallel to the first power pins 331 and 332. In practical applications, at least one first power connector, at least one second power connector, and at least one signal connector can be selected to achieve the same technical effect.

[0101] In this embodiment, the signal electrical connectors are implemented using printed circuit boards in the form of vertical boards; the first pins of the power electrical connectors and the signal electrical connectors are directly electrically connected to the bottom surface of the substrate in the top assembly, and the first pin of the windings is electrically connected to the bottom surface of the Dr. MOS on the bottom surface of the top substrate. Therefore, the first pins of the power electrical connectors 231, 232, 241 and 242 and the first pins of the signal electrical connectors 251 and 252 have the same height, and the upper end surface of the electrical connectors is higher than the end surface of the first pin of the windings 221, 222, 223 and 224.

[0102] In this embodiment, the first power electrical connectors 231 and 232 are located on opposite sides of the magnetic core 210 in the first direction; the second power electrical connectors 241 and 242 are located on opposite sides of the magnetic core 210 in the second direction; the first direction of the magnetic core 210 is perpendicular to the second direction of the magnetic core 210; the signal electrical connectors 251 and 252 are also located on opposite sides of the magnetic core 210 in the first direction, and are located outside the first power electrical connectors 231 and 232. This arrangement results in a relatively large distance between the first power electrical connectors 231 and 232 and the second power electrical connectors 241 and 242, i.e., a larger loop between the first and second power electrical connectors and a larger parasitic inductance. In other embodiments, it is desirable that the first power connectors 231 and 232 be moved to opposite sides in the second direction of the magnetic core 210, such that the first power connectors 231 and 232 are adjacent to the second power connectors 241 and 242 respectively, resulting in a smaller loop and lower parasitic inductance between the first and second power connectors. Furthermore, the first power connector 231 can also be positioned on both sides of the second power connector 241; and the first power connector 232 can be positioned on both sides of the second power connector 242.

[0103] Example 2

[0104] Figure 3A and Figure 3B A schematic diagram of another embodiment is shown, in which module 10 and Figure 2A The modules shown have the same technical effect. For example... Figure 3A As shown, module 10 includes a top component 100, a middle component 200, and a bottom component 300. Figure 3B for Figure 3AThe exploded view of the top component 100 shows that the top component 100 includes a top substrate 110, IPMs 121, 122, 123 and 124, an input capacitor 140, first heat dissipation copper blocks 131 and 132, second heat dissipation copper block 141, copper pillars 131a, 132a, 141a and 141b, and molding compound 160. The top substrate 110 has opposing top and bottom surfaces. The bottom surface of the top substrate 110 is provided with IPMs 121, 122, 123 and 124, each of which also has opposing top and bottom surfaces. The top surfaces of IPMs 121, 122, 123 and 124 are electrically connected to the bottom surface of the top substrate 110. The top surface of the top substrate 110 is provided with the input capacitor 140 and the heat dissipation copper blocks 131, 132 and 141, and the input capacitor and the heat dissipation copper blocks are electrically connected to the top substrate. Copper pillars 131a, 132a, 141a, and 141b are disposed on the bottom surface of the top substrate 110. Copper pillars 131a and 132a are electrically connected to copper blocks 131 and 132 respectively through the substrate 110, and copper pillars 141a and 141b are electrically connected to copper block 141 through the substrate 110. A high-frequency capacitor 180 is also disposed on the bottom surface of the substrate, adjacent to IPMs 121, 122, 123, and 124. This arrangement can further filter out high-frequency ripple, eliminate voltage spikes caused by high-frequency oscillations, and further improve the reliability of the module operation.

[0105] In this embodiment, IPMs 121, 122, 123, 124 and copper pillars 131a, 132a, 141a, 141b are encapsulated together using molding compound 160. The surface of molding compound 160 is metallized to form pins (or pads) 121a, 122a, 123a, 124a, 131a1, 132a1, 141a1, 141b1, 151a, and 152a. Pins 121a, 122a, 123a, 124a, 131a1, 132a1, 141a1, 141b1, 151a, and 152a. Pins 123a and 124a are electrically connected to the bottom of IPM121, 122, 123 and 124 respectively, that is, electrically connected to the source of the high-side MOSFET and the drain of the low-side MOSFET; pins 131a1, 132a1, 141a1 and 141b1 are electrically connected to copper pillars 131a, 132a, 141a and 141b respectively; pins 151a and 152a are electrically connected to the top substrate 110 through drilling and electroplating.

[0106] This implementation uses a molding process to place all pins on the same plane. Therefore, the pins of the power electrical connectors, windings, and signal electrical connectors of the mid-section component only need to be placed on the same plane, simplifying the manufacturing process of the mid-section component, thereby improving the manufacturability of the product and reducing manufacturing costs.

[0107] Example 3

[0108] Figure 4AThis is a schematic diagram of another embodiment of the present invention. In this embodiment, module 10 and... Figure 2A The described embodiments have the same technical effects. For example... Figure 4A As shown, the module in this embodiment also includes a top component 100, a middle component 200, and a bottom component 300. This embodiment is similar to... Figure 2A The difference in the illustrated embodiment lies in the top component 100. Figure 4B yes Figure 4A Exploded view of the structure of the top component 100; as shown Figure 4B As shown, the top assembly 100 includes a top substrate 110, IPMs 121, 122, 123 and 124, an input capacitor 140, first heat dissipation copper blocks 131 and 132, and a second heat dissipation copper block 141; IPMs 121, 122, 123 and 124 are embedded in the substrate 110 (the layout of the IPMs is as follows). Figure 2C and Figure 2D(As shown in the diagram, but not shown in this embodiment). The IPM disposed in the top substrate 110 is electrically connected to the heat dissipation copper block and capacitor on the top surface of the substrate 110 via RDL; and pins 121a, 122a, 123a and 124a are formed on the bottom surface of the substrate 110 via RDL. Pins 121a, 122a, 123a and 124a are electrically connected to the bottom of IPMs 121, 122, 123 and 124 respectively, that is, electrically connected to the source of the high-side MOSFET and the drain of the low-side MOSFET, and pins 121a, 122a, 123a and 124a are electrically connected to the first pin of the main winding in the middle assembly. The bottom surface of the top substrate is also provided with pins 131a1, 132a1, 141a1, 141b1, 151a, and 152a; pins 131a1 and 132a are electrically connected to the first heat sink copper blocks 131 and 132, respectively; pins 141a1 and 141b1 are electrically connected to the second heat sink copper block 141; pins 151a and 152a are electrically connected to the signal pins of Dr. MOS through drilling and electroplating. Pins 131a1 and 132a1 are electrically connected to the first pins of the first power electrical connectors 231 and 232 in the middle assembly, respectively; pins 141a1 and 141b1 are electrically connected to the first pins of the second power electrical connectors 241 and 242 in the middle assembly, respectively; pins 151a and 152a are electrically connected to the first pins of the signal electrical connectors 151 and 152 in the middle assembly, respectively. In this embodiment, the MOSFET is embedded in the substrate. The connection method between the MOSFET and the top surface devices and the middle component of the substrate is the same as in Embodiment 1, and will not be repeated here. In this embodiment, the connection path of the input capacitor on the top surface is greatly reduced, the loop area between the MOSFETs is reduced, the parasitic inductance of the loop is reduced, the high-frequency filtering effect is further improved, the voltage spikes caused by high-frequency oscillation are further reduced, and the reliability of the module operation is improved. In addition, the energy loss caused by oscillation is also reduced, which is beneficial to the efficiency of the VRM module. In this embodiment, the pins for electrical connection or soldering between the top component and the middle component are set on the same plane, thus reducing the manufacturing difficulty of the middle component and facilitating mass production.

[0109] Example 4

[0110] Figure 5A This is a schematic diagram of another embodiment of the present invention, as shown below. Figure 5A As shown, the module described in this embodiment includes a top component 100, a middle component 200, and a bottom component 300; the top component 100 and... Figure 4A The top component 100 in the above embodiment has the same technical effect; Figure 5B for Figure 5A A structural schematic diagram of the central component 200 is shown below. Figure 5BAs shown, the central assembly 200 includes a magnetic core 210, a first main winding 221, a second main winding 222, a third main winding 223, a fourth main winding 224, a first auxiliary winding 221a, a second auxiliary winding 222a, a third auxiliary winding 223a, a fourth auxiliary winding 224a, first power electrical connectors 231 and 232, second power electrical connectors 241 and 242, auxiliary winding electrical connectors 271, 272, 273 and 274, and signal electrical connectors. 251 and 252; the first main winding 221 and the first auxiliary winding 221a are coupled to each other and are located parallel to each other in the same magnetic core hole; the second main winding 222 and the second auxiliary winding 222a are coupled to each other and are located parallel to each other in the same magnetic core hole; the third main winding 223 and the third auxiliary winding 223a are coupled to each other and are located parallel to each other in the same magnetic core hole; the fourth main winding 224 and the fourth auxiliary winding 224a are coupled to each other and are located parallel to each other in the same magnetic core hole. The connection method of the power electrical connector and the signal electrical connector in this embodiment is the same as in the previous embodiment, and will not be repeated here. Auxiliary winding electrical connectors 271, 272, 273, and 274 connect auxiliary windings 221a, 222a, 223a, and 224a in series via traces on the top substrate 110 and bottom substrate 310, forming an auxiliary winding series loop and ensuring positive coupling between each phase auxiliary winding and its corresponding main winding. The auxiliary winding electrical connectors and the second power electrical connectors 241 and 242 are located on the same side and are alternately spaced. Specifically, auxiliary winding electrical connectors 271 and 272 are located on either side of the second power electrical connector 241, and auxiliary winding electrical connectors 273 and 274 are located on either side of the second power electrical connector 242. This arrangement improves the coupling between the main winding and auxiliary winding loops, helps reduce the dynamic inductance of the multiphase TLVR, and improves the dynamic performance of the output voltage of the multiphase TLVR power supply scheme.

[0111] Figure 5C for Figure 5A A schematic diagram of the pinout of the bottom substrate 310 is shown below. Figure 5CAs shown, the bottom surface of the bottom substrate is provided with first power pins 331 and 332, second power pins 341 and 342, output pin 371, TLVR function extension pins 381 and 382, ​​and signal pins 351 and 352. The first power pins 331 and 332 are electrically connected to the second pins of the first power connectors 231 and 232 on the top surface of the bottom substrate. The second power pins 341 and 342 are electrically connected to the second pins of the second power connectors 241 and 242 on the top surface of the bottom substrate. The signal pins 351 and 352 are electrically connected to the second pins of the signal connectors 251 and 252 on the top surface of the bottom substrate. The TLVR function extension pins 381 and 382 are electrically connected to the two end pins of the auxiliary winding series branch on the top surface of the bottom substrate. These TLVR function extension pins 381 and 382 can also be configured as TLG pins and TLC pins, used for connecting the auxiliary windings of multiple modules in series to form a multi-phase TLVR power supply scheme. In this embodiment, the TLVR extension pins are located on the same side, which makes the connection path of the auxiliary winding between modules shorter and the parasitic inductance in the auxiliary winding loop smaller, which is more conducive to reducing the dynamic inductance of the multiphase TLVR power supply scheme.

[0112] Figure 5D yes Figure 5C Another embodiment of the bottom component shown; Figure 5D The embodiments and Figure 5C The embodiments described above have the same technical effects. Figure 5D The embodiments and Figure 5C The difference lies in that the bottom substrate also has TLVR function expansion pins 383 and 384. The TLVR function expansion pins 381, 382, ​​383 and 384 are located near the four corners of the bottom substrate. Two or more of these pins can be arbitrarily set as TLG and TLC to meet the needs of different application scenarios for different module placement methods; ensuring that the parasitic inductance of the auxiliary winding series connection path is minimized.

[0113] Figure 6A This is a schematic diagram of another embodiment of the present invention. Figure 6B for Figure 6A The structural explosion diagram, Figure 6C This is a structural diagram of the central component; for reference. Figure 6A and Figure 6BThe module described in this embodiment includes a top component 100, a middle component 200, and a bottom component 300. The top component 100 includes a top substrate 110, an input capacitor 140, other passive components 140a, a second heat dissipation copper block 141, and an IPM embedded inside the top substrate 110. The second heat dissipation copper block 141 is disposed in the middle of the top surface of the top substrate 110, and the input capacitors 140 are respectively disposed on both sides of the second heat dissipation copper block 141. The middle component 200 includes a magnetic core 210, multiple winding assemblies, first power electrical connectors 231, 232, 233, and 234, second power electrical connectors 241 and 242, auxiliary winding electrical connectors 271, 272, 273, and 274, and signal electrical connectors 251, 252, and 253. (Refer to...) Figure 6C As shown, the multiple winding assemblies are a first winding assembly, a second winding assembly, a third winding assembly, and a fourth winding assembly; the first winding assembly includes a first main winding 221 and a first auxiliary winding 221a, the second winding assembly includes a second main winding 222 and a second auxiliary winding 222a, the third winding assembly includes a third main winding 223 and a third auxiliary winding 223a, and the fourth winding assembly includes a fourth main winding 224 and a fourth auxiliary winding 224a.

[0114] Other passive components 140a are disposed on the bottom surface of the top substrate 110, and a groove 260 is disposed on the top of the magnetic core 210 for accommodating the other passive components 140a. The magnetic core 210 also includes four windows extending from the top surface to the bottom surface, respectively for arranging the first to fourth winding assemblies. These winding assemblies and the magnetic core can be integrally pressed together or assembled from the magnetic core and winding assemblies. First power electrical connectors 231 and 232 are disposed on the third side 213 of the magnetic core 210, and first power electrical connectors 233 and 234 are disposed on the first side 211 of the magnetic core 210; second power electrical connectors 241 and 242 are disposed on the second side 212 and the fourth side 214 of the magnetic core, respectively. Auxiliary winding electrical connectors 271 and 272 are disposed on the second side 212, and auxiliary winding electrical connectors 273 and 274 are disposed on the fourth side 214. The first signal electrical connector 251 is disposed on the vertical plate 250, the second signal electrical connector 252 is disposed on the third side 213 of the magnetic core, and the second signal electrical connector 253 is disposed on the first side 211 of the magnetic core. The second signal electrical connectors can be assembled with the magnetic core, or they can be pressed together by integral pressing.

[0115] like Figure 6BAs shown, the bottom component 300 includes a top surface and a bottom surface facing each other. The top surface of the bottom component 300 is fitted to the bottom surface of the middle component 200, and the bottom surface of the bottom component 300 is fixed and electrically connected to an external component (such as a system board). The bottom surface of the bottom component also has a first power pin 331, second power pins 341 and 342, output pins 371 and 372, and signal pins 351 and 352. The signal pin 352 can be used as an extension pin for TLVR, TLG, and / or TLC. The first power pin, second power pin, and output pin are all power pins, arranged in a line in the order of second power pin, output pin, first power pin, output pin, and second power pin, forming a power pin array. Signal pins 351 and 352 are respectively located on opposite sides of the power pin array and adjacent to the opposite sides of the second power pins 341 and 342. In detail, these power pins are all rectangular in shape. Signal pin 351 is located near the first side 211 of the magnetic core, and signal pin 352 is located near the third side 213 of the magnetic core. Second power pin 341 is located near the fourth side 214, and second power pin 342 is located near the second side 212.

[0116] Figure 6D This diagram illustrates the layout of the bottom surface of the bottom component 300. M*N LGA (Land Grid Array) pins are positioned on the bottom surface of the bottom component 300. The definition of each LGA pin can be designed according to the customer's actual needs, and the LGA pins are electrically connected to the pins on the top surface of the bottom component via the bottom component. Using LGA pins facilitates soldering on the system board, further improving the module's product yield and reliability.

[0117] Figure 6E The bottom pin layout diagram of the top component 100 is shown, while referring to... Figure 6B and Figure 6CThe top surface layout of the middle component 200 is shown. The bottom surface of the top component 100 has four SW pins and four T1 pins. The SW pins correspond one-to-one with the positions of windings 221, 222, 223, and 224 of the middle component, and are used to realize the electrical connection between the windings and the Dr. MOS. The T1 pins correspond one-to-one with the positions of auxiliary windings 221a, 222a, 223a, and 224a, and are used to realize the electrical connection between the auxiliary windings and the internal wiring of the top component. The bottom surface of the top component 100 also has four T2 pins. The positions of the four T2 pins correspond one-to-one with the positions of the four auxiliary winding electrical connectors 271, 272, 273, and 274, and are used to realize the electrical connection between the auxiliary winding electrical connectors and the internal wiring of the top component. The bottom surface of the top component 100 is also provided with four VIN pins, two GND pins, a first signal pin Sig-A, and a second signal pin Sig-B. The positions of the four VIN pins correspond one-to-one with the first power electrical connectors 231, 232, 233, and 234 on the top surface of the middle component, and are used for electrical connection to the first power electrical connectors. The positions of the two GND pins correspond one-to-one with the second power electrical connectors 241 and 242, and are used for electrical connection to the second power electrical connectors. The position of the first signal pin Sig-A corresponds to the position of the vertical plate 250, and is used for electrical connection to the first signal electrical connector 251. The position of the second signal pin Sig-B corresponds one-to-one with the second signal electrical connectors 252 and 253, and is used for electrical connection to the second signal electrical connectors 252 and 253.

[0118] like Figure 6F This is a schematic diagram of the interior of the top component after the substrate is removed in this embodiment. Figure 6G The diagram shown is an internal layout of the substrate 110; see also reference to... Figure 6F and Figure 6G The first IPM includes a high-side MOSFET 121H and a low-side MOSFET 121L; the second IPM includes a high-side MOSFET 122H and a low-side MOSFET 122L; the third IPM includes a high-side MOSFET 123H and a low-side MOSFET 123L; and the fourth IPM includes a high-side MOSFET 124H and a low-side MOSFET 124L. The four low-side MOSFETs are arranged in a 2x2 array, and the four IPMs are also arranged in a 2x2 array. The source and drain arrangements of the high-side and low-side MOSFETs can be found in [reference needed]. Figure 2C and Figure 2DAs shown, details will not be repeated here. Drive / logic circuits 125C and 126C are disposed between the IPMs, and each drive / logic circuit controls any two of the four IPMs. Each IPM is electrically connected to a via, and the via extends to the surface of the substrate, electrically connecting to surface wiring. The first high-side MOSFET 121H, the first low-side MOSFET 121L, the second low-side MOSFET 122L, and the second high-side MOSFET 122H are arranged sequentially from the third side 213 to the first side 211. The third high-side MOSFET 123H, the third low-side MOSFET 123L, the fourth low-side MOSFET 124L, and the fourth high-side MOSFET 124H are arranged sequentially from the third side 213 to the first side 211. Drive / logic circuit 125C is disposed between the first and third IPMs, and drive / logic circuit 126C is disposed between the second and fourth IPMs.

[0119] Figures 7A to 7D This describes other embodiments of the internal IPM layout in the substrate 110. Specifically, Figure 7A The diagram shows another embodiment of the internal layout of the substrate 110. Four low-end MOSFETs are arranged in a 2x2 array and are located in the center of the substrate 110. Four high-end MOSFETs are respectively located at the four corners of the 2x2 low-end MOSFET array and are respectively located adjacent to the corresponding low-end MOSFETs. A drive / logic circuit 125C is located between the first high-end MOSFET 121H and the second high-end MOSFET 122H and is used to drive the first IPM and the second IPM to turn on and off. A drive / logic circuit 126C is located between the third high-end MOSFET 123H and the fourth high-end MOSFET 124H and is used to drive the third IPM and the fourth IPM to turn on and off. These two drive / logic circuits are respectively located adjacent to the second side surface 212 and the fourth side surface 214.

[0120] Figure 7B Another embodiment of the internal IPM layout in the substrate 110 shown is similar to... Figure 7A The difference lies in the inclusion of four driver / logic circuits 121C, 122C, 123C, and 124C. Two of these four driver / logic circuits are grouped together and positioned on opposite sides of a 2x2 low-side MOSFET array. Figure 7BFor example, the first drive / logic circuit 121C and the third drive / logic circuit 123C are disposed between the first high-side MOSFET and the third high-side MOSFET, and are used to drive the first IPM and the third IPM to turn on and off, respectively; the second drive / logic circuit 122C and the fourth drive / logic circuit 124C are disposed between the second high-side MOSFET and the fourth high-side MOSFET, and are used to drive the second IPM and the fourth IPM to turn on and off, respectively.

[0121] Figure 7C Another embodiment of the internal IPM layout in substrate 110, and Figure 6G The difference in the internal layout diagram shown is that the two drive / logic circuits 125C and 126C are respectively located on opposite sides of the 2x2 low-side MOSFET array (i.e., there are no high-side MOSFETs on either side). Drive / logic circuit 125C is used to drive the first IPM and the second IPM to turn on and off, and drive / logic circuit 126C is used to drive the third IPM and the fourth IPM to turn on and off.

[0122] Figure 7D In another embodiment of the internal layout of the substrate 110, a high-end MOSFET, a low-end MOSFET and a drive / logic circuit constitute a sub-unit; within each sub-unit, the high-end MOSFET and the drive / logic circuit are arranged along the same side of the low-end MOSFET (i.e., arranged in a "2+1" manner); the four sub-units are arranged in a windmill blade manner; that is, each sub-unit can overlap with the adjacent sub-unit after being rotated a certain angle in a clockwise or counterclockwise direction.

[0123] Figure 8 This is another embodiment of the top layout of the top component 100, which is similar to... Figure 7AThe difference lies in the inclusion of first heat dissipation copper blocks 133, 134, 135, and 136, and second heat dissipation copper blocks 142 and 143. The first heat dissipation copper blocks 133, 134, 135, and 136 are used for heat dissipation of the first high-side MOSFET, the second high-side MOSFET, the third high-side MOSFET, and the fourth high-side MOSFET, respectively, thereby reducing the upward thermal resistance of the power module. Furthermore, the first heat dissipation copper blocks 133, 134, 135, and 136 are electrically connected to the drain electrodes of the first high-side MOSFET, the second high-side MOSFET, the third high-side MOSFET, and the fourth high-side MOSFET, respectively, thereby reducing the DC resistance of the wiring layer on the top substrate 110. Therefore, these first heat dissipation copper blocks improve both the heat dissipation performance and the conversion efficiency of the power module. The second heat dissipation copper block 142 is used for heat dissipation of the first low-side MOSFET and the second low-side MOSFET, and the second heat dissipation copper block 142 is electrically connected to the source electrodes of the first low-side MOSFET and the second low-side MOSFET, thereby reducing the thermal resistance of the power module and reducing the DC resistance of the wiring layer on the bottom substrate, improving the heat dissipation capacity and conversion efficiency of the power module. The second heat sink 143 is used for heat dissipation of the third and fourth low-side MOSFETs. The second heat sink 143 is electrically connected to the sources of the third and fourth low-side MOSFETs, achieving the same technical effect as the second heat sink 142, which will not be elaborated further here. In addition, an input capacitor 140 is provided between the second heat sinks 142 and 143. The input capacitor 140 is positioned symmetrically at the center of the four low-side MOSFETs. This input capacitor helps to cancel out the input ripple current of the four-phase voltage regulation module, further improving the conversion efficiency of the power supply module.

[0124] Figures 9A to 9D This is an extended embodiment of the top surface pin layout of the bottom component 300. (See attached diagram.) Figure 9A Two output pins 371 and two output pins 372 are arranged in a 2x2 array. Second power pins (i.e., GND pins) 341 and 342 are respectively located on opposite sides of the output pin array, and first power pins 331 and 332 are located on the other opposite sides of the output pin array. Signal pins 351 and 352 are respectively located adjacent to the first power pins 331 and 332. Specifically, signal pin 351 is located adjacent to the first side 211 of the magnetic core, and signal pin 352 is located adjacent to the third side 213 of the magnetic core; second power pin 341 is located adjacent to the fourth side 214 of the magnetic core, and second power pin 342 is located adjacent to the second side 212 of the magnetic core; output pin 371 is located adjacent to the second power pin 341, and output pin 372 is located adjacent to the second power pin 342. The pin layout diagram of this embodiment is consistent with... Figure 6B The pin layout diagram shown has the same technical effect.

[0125] Figure 9B In another embodiment of the top pin layout of the bottom component 300, two output pins 371 and two output pins 372 are arranged in a 2x2 array; second power pins 341 and 342, second power pin 343 and first power pin 331 are respectively disposed on the four sides of the 2x2 output pin array, and GND pins 341 and 342 are respectively disposed on two opposite sides of the 2x2 output pin array, and GND pin 343 is electrically connected to GND pins 341 and 342; the first power pin 331 is disposed adjacent to the first side 211 of the magnetic core, and GND pins 341 and 342 are disposed adjacent to the fourth side 214 and the second side 212 of the magnetic core, respectively, and the two output pins 371 are adjacent to GND pin 341, and the two output pins 372 are adjacent to GND pin 342. The top surface of the bottom component 300 also features a TLVR function extension TLG pin 353 and a function extension TLC pin 354. The TLG pin 353 is positioned adjacent to the first side 211 and the fourth side 214 of the magnetic core, while the TLC pin 354 is positioned adjacent to the first side 211 and the second side 212 of the magnetic core. The signal pin 351 is positioned adjacent to the third side 213 of the magnetic core. This pin layout further optimizes the power flow loop and improves the conversion efficiency of the power module.

[0126] Figure 9C This is another embodiment of the top surface pin layout diagram of the bottom component 300. This embodiment is similar to... Figure 9B The implementation differs in that it includes only one output pin 371 and one output pin 372, both of which are rectangular and extend to the first side 211 of the magnetic core. The first power pin 331 is located adjacent to the third side 213 of the magnetic core; the second power pin 341 is located adjacent to the fourth side 214 of the magnetic core and the output pin 371; and the second power pin 342 is located adjacent to the second side 212 of the magnetic core and the output pin 372. Other technical features are the same as... Figure 9B The same applies as shown, so it will not be repeated here.

[0127] Figure 9D This is another embodiment of the top surface pin layout diagram of the bottom component 300. This embodiment is similar to... Figure 9C The implementation differs in that output pins 371 and 372 extend to the third side 213 of the magnetic core; the first power pin 331 is positioned adjacent to the first side 211 of the magnetic core; other technical features are the same. Figure 9C The methods are the same as those shown, and both offer the same technical benefits, so they will not be elaborated upon here.

[0128] Figure 9EIn one embodiment of the bottom pin layout of the bottom component 300, the output pins, the first power pin, and the second power pin are arranged in two columns. Each column is arranged in the order of first power pins 331 / 332, second power pins 341 / 342, output pins 371 / 372, second power pins 341 / 342, and first power pins 331 / 332, i.e., these pins are arranged symmetrically along the horizontal and vertical axes. Additionally, multiple output pins 371 are arranged in two groups along the fourth side surface 214; multiple output pins 372 are arranged in two groups along the second side surface 212. The extended TLC pin 354 and the TLG pin 353 are respectively located adjacent to the second side surface 212 and the fourth side surface 214 of the magnetic core, with the extended TLC pin 354 positioned between the two groups of output pins 372 on the second side surface 212, and the extended TLG pin 353 positioned between the two groups of output pins 371 on the fourth side surface 214. Multiple signal pins are arranged along the first side surface 211 and the third side surface 213.

[0129] Figure 9F In another embodiment of the bottom surface pin layout of the bottom component 300, the bottom surface pins are arranged in the form of a pin array or a BGA array; this embodiment uses a pin array. Multiple output pins 371 and 372 are arranged in a 5x6 pin array and are located in the central region of the bottom surface of the bottom component 300. Multiple second power pins 341 are arranged in two columns along the fourth side 214; multiple second power pins 342 are arranged in two columns along the second side 212; multiple first power pins 331 and 332 are arranged in two rows along the first side 211; functional extension TLC pins 354 and TLG pins 353 are disposed adjacent to the first side 211, with the functional extension TLC pin 354 disposed between the multiple first power pins 331 / 332 and the multiple second power pins 342, and the functional extension TLG pin 353 disposed between the multiple first power pins 331 / 332 and the multiple first power pins 341; multiple signal pins are arranged along the third side 213. The bottom pins of the bottom component 300 are used for fixed electrical connection with external components, which can make the input or output power evenly distributed on the bottom component, reduce the power transmission path and power loop area, reduce the impact of interference, and further ensure the working reliability of the power module.

[0130] Figures 7A to 7D An extended embodiment of the internal layout of the substrate 110 shown. Figure 8 An extended implementation of the top layout of the top component shown. Figures 9A to 9D An extended implementation of the top surface pin layout diagram of the bottom component 300 and Figure 9E and Figure 9FThe implementation methods of the bottom pin layout diagram can be freely combined and applied to the power module, and can all be applied to the aforementioned embodiments to obtain the same technical benefits.

[0131] Figure 10A A functional block diagram of a 4-phase VRM is provided, where PWM1 and PWM2 are control signals from an external controller to turn the VRM on and off; the periods of control signals PWM1 and PWM2 are Ts1, as shown below. Figure 10B As shown; preferably, the control signals PWM1 and PWM2 are out of phase by 180 degrees. The control signal PWM1 is extended and processed by the control logic circuit C / L-1 to generate two drive signals. The period of these two drive signals is Ts2, and they are out of phase by 180 degrees. Here, the period Ts2 is twice the period Ts1. These two drive signals drive two half-bridge circuits respectively. The current detection signals of the two half-bridge circuits are used by the control logic circuit C / L-1 to generate a summed current detection signal Imon1. The frequency and phase of the control signal PWM1 and the summed current detection signal Imon1 are the same. The control signal PWM1 and the summed current detection signal Imon1 are connected to the control signal and current detection signal pins of the multiphase controller with the same phase, respectively. The control signal PWM2 is extended and processed by the control logic circuit C / L-2 to generate two additional drive signals. These two additional drive signals also have a period of Ts2 and are 180 degrees out of phase with each other. Similarly, these two drive signals drive two half-bridge circuits respectively. The current detection signals of these two half-bridge circuits are used by the control logic circuit C / L-2 to generate a summed current detection signal Imon2. The control signal PWM2 and the summed current detection signal Imon2 have the same frequency and phase, and are respectively connected to the in-phase control signal and current detection signal pins of the multiphase controller. These four drive signals can control the four-phase VRM to turn on and off. In this invention, the four-phase VRM uses two-phase control signals PWM1 and PWM2, which are 180 degrees out of phase, to control the four-phase VRM to work alternately with a 90-degree phase difference, which can reduce input / output current ripple and the number of input / output capacitors. Figure 10B The timing diagram shown represents the voltages at the connection points SW of the four-phase bucks, where SW1, SW2, SW3, and SW4 are 90 degrees out of phase.

[0132] Figure 10A and Figure 10BThe control function shown applies to the four-phase VRM disclosed in the foregoing embodiments, but is not limited to it. It can be used with any four-phase Buck circuit, employing parallel input and parallel output connections. This invention uses a four-phase VRM as an example, but it is not limited to four-phase applications; the structure can be used for VRMs of any phase. The copper pillars or blocks disclosed in this invention are not limited to copper; they can also be aluminum, copper-aluminum alloys, or other metals or metal alloys, as long as they possess good electrical and thermal conductivity.

[0133] The switching transistor disclosed in this invention can be a Si MOSFET, SiC MOSFET, GaN device, or IGBT, etc., all of which can realize the switching function disclosed in this invention.

[0134] The power module described in the above embodiments can also be part of an electronic device, as long as it meets the technical features and benefits disclosed in this invention.

[0135] The terms "equal to," "identical to," or "equal to" disclosed in this invention must take into account the parameter distribution of the engineering process, with an error distribution within ±30%. "Parallel" is defined as the angle between two line segments or lines being less than or equal to 45 degrees. "Perpendicular" is defined as the angle between two line segments or lines being within the range of [60, 120] degrees. The definition of "phase misalignment" also needs to consider the parameter distribution of the engineering process, with an error distribution of the phase misalignment degree within ±30%.

[0136] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0137] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A voltage regulation module, characterized in that, The system includes a top component and a middle component. The top component includes a top substrate, N smart power modules, and a metal block, where N is a natural number greater than 1. The top substrate includes opposing top and bottom surfaces. The smart power modules are disposed on the bottom surface of the top substrate or embedded within the top substrate. The metal block is disposed on the top surface of the top substrate. Each smart power module has opposing top and bottom surfaces, and the top surface of the smart power module is electrically connected to the top substrate. The middle component is disposed adjacent to the bottom surface of the top substrate and is electrically connected to the smart power modules.

2. The voltage regulation module according to claim 1, characterized in that, The central component includes opposing top and bottom surfaces, a magnetic core, windings, and electrical connectors. The magnetic core includes opposing first and third sides, opposing second and fourth sides, and opposing top and bottom surfaces. The first end of the winding is electrically connected to the bottom surface of the smart power module. The electrical connectors are disposed on the side of the magnetic core and are electrically connected to a metal block via a top substrate.

3. The voltage regulation module according to claim 2, characterized in that, The electrical connector includes a first power electrical connector and a second power electrical connector, and the metal block includes a first metal block and a second metal block. The first power electrical connector is electrically connected to the first metal block, and the second power electrical connector is electrically connected to the second metal block.

4. The voltage regulation module according to claim 2, characterized in that, The intelligent power module includes a high-end power switch and a low-end power switch, both of which are vertical power switches and are connected in series.

5. The voltage regulation module according to claim 4, characterized in that, The drain of the high-end power switch and the source of the low-end power switch are both located on the top surface of the vertical switch, and the source of the high-end power switch and the drain of the low-end power switch are both located on the bottom surface of the vertical switch. The source of the high-end power switch and the drain of the low-end power switch are connected in series to the SW terminal.

6. The voltage regulation module according to claim 5, characterized in that, The electrical connectors include a first power connector and a second power connector. The drain of the high-end power switch is electrically connected to the first power connector, the source of the low-end power switch is electrically connected to the second power connector, and the first end of the winding is electrically connected to the SW terminal.

7. The voltage regulation module according to claim 2, characterized in that, It also includes a bottom assembly, which includes a bottom substrate, the bottom substrate including opposing top and bottom surfaces and pins, the second end of the winding and the electrical connector being electrically connected to the pins on the top surface of the bottom substrate, and the bottom surface of the bottom substrate being electrically connected to an external load.

8. The voltage regulation module according to claim 3, characterized in that, The central component also includes a signal electrical connector, which is electrically connected to the intelligent power module and is disposed on the side of the magnetic core.

9. The voltage regulation module according to claim 3, characterized in that, The first power electrical connector is disposed on the first and third sides of the magnetic core, and the second power electrical connector is disposed on the second and fourth sides of the magnetic core.

10. The voltage regulation module according to claim 3, characterized in that, The first power electrical connector and the second power electrical connector are both disposed on the second side and the fourth side of the magnetic core, with the first power electrical connector located on both sides of the second power electrical connector.

11. The voltage regulation module according to claim 3, characterized in that, The metal block includes at least two first metal blocks and at least one second metal block, with the second metal block disposed between the first metal blocks. The top assembly also includes an input capacitor disposed between the first metal blocks and the second metal blocks. The first metal blocks, the second metal blocks, and the input capacitor are arranged in the order of first metal block, input capacitor, second metal block, input capacitor, and first metal block.

12. The voltage regulation module according to claim 1, characterized in that, The bottom surface of the top component is provided with pins, including an input pin VIN, a ground pin GND, and a switch midpoint pin SW. The metal block includes a first metal block and a second metal block. The electrical connector includes a first power electrical connector and a second power electrical connector. The input pin VIN is electrically connected to the first metal block and the first power electrical connector. The ground pin GND is electrically connected to the second metal block and the second power electrical connector. The switch midpoint pin SW is electrically connected to the bottom surface of the intelligent power module.

13. The voltage regulation module according to claim 12, characterized in that, The top assembly also includes a metal pillar disposed on the bottom surface of the top substrate. The smart power module and the metal pillar are encapsulated together by a molding compound. The metal pillar is electrically connected to the metal block through the top substrate. The pins are disposed on the surface of the molding compound and are electrically connected to the winding and the electrical connector.

14. The voltage regulation module according to claim 12, characterized in that, The pins are disposed on the bottom surface of the top substrate, and the pins on the bottom surface of the top substrate are electrically connected to the metal block and the smart power module through wiring or metal pillars.

15. The voltage regulation module according to claim 12, characterized in that, The pins on the bottom surface of the top component also include signal pins, and the middle component also includes a signal electrical connector, the signal pins being electrically connected to the signal electrical connector and the intelligent power module.

16. The voltage regulation module according to claim 15, characterized in that, The signal electrical connector has a vertical plate structure.

17. The voltage regulation module according to claim 15, characterized in that, The signal pins are implemented through drilling and electroplating.

18. The voltage regulation module according to claim 5, characterized in that, The N intelligent power modules are arranged in an array, with the low-end power switches of the N intelligent power modules arranged adjacent to each other, and the high-end power switch of each intelligent power module arranged adjacent to the corresponding low-end power switch. The switches in the intelligent power modules located in the same row are arranged in the order of high-end power switch, low-end power switch, low-end power switch and high-end power switch.

19. The voltage regulation module according to claim 18, characterized in that, The intelligent power module also includes a drive / logic circuit, which is arranged in parallel with the high-end power switch and is located on the same outer side of the low-end power switch.

20. The voltage regulation module according to claim 2, characterized in that, The winding includes a main winding and an auxiliary winding. The electrical connectors include a first power connector, a second power connector, and an auxiliary winding connector. The main winding and the auxiliary winding are coupled to each other. The first power connector and the second power connector are electrically connected to the top surface of the smart power module through a top substrate. The bottom surface of the smart power module is electrically connected to the main winding.

21. The voltage regulation module according to claim 20, characterized in that, The first power electrical connector is disposed on the first and third sides of the magnetic core, and the second power electrical connector and the auxiliary winding electrical connector are both disposed on the second and fourth sides of the magnetic core, with the auxiliary winding electrical connector and the second power electrical connector being disposed alternately.

22. The voltage regulation module according to claim 20, characterized in that, It also includes a bottom component, which includes a bottom substrate, the bottom substrate including opposing top and bottom surfaces and pins, the pins being disposed on the top and bottom surfaces of the bottom substrate; the first power electrical connector, the second power electrical connector, the main winding and the auxiliary winding electrical connector are all electrically connected to the pins on the top surface of the bottom substrate, and the auxiliary winding forms an auxiliary winding circuit through the auxiliary winding electrical connector, the top substrate and the bottom substrate connected in series, and the bottom surface of the bottom component is electrically connected to an external load.

23. The voltage regulation module according to claim 22, characterized in that, The pins on the top surface of the bottom substrate include a first power pin, a second power pin, and an output pin. The output pin is located in the middle of the bottom substrate or adjacent to the first side of the magnetic core. The first power pin and the second power pin surround the output pin on all four sides or three sides. The first power pin is adjacent to the first side and / or the third side of the magnetic core. The second power pin is adjacent to the second side and the fourth side of the magnetic core. The first power pin is adjacent to the second power pin.

24. The voltage regulation module according to claim 23, characterized in that, The output pins include two first output pins and two second output pins. The four output pins are arranged in a 2*2 array. The two first output pins are located near the second side of the magnetic core, and the two second output pins are located near the fourth side of the magnetic core.

25. The voltage regulation module according to claim 23, characterized in that, The second power pin has three pins arranged sequentially on the three sides of the output pin, and the first power pin is arranged on the fourth side of the output pin. The three second power pins are electrically connected in sequence.

26. The voltage regulation module according to claim 23, characterized in that, The output pins include a first output pin and a second output pin, both of which are rectangular.

27. The voltage regulation module according to claim 23, characterized in that, The pins on the top surface of the bottom substrate include signal pins, which are disposed adjacent to the first side and / or the third side of the magnetic core.

28. The voltage regulation module according to claim 23, characterized in that, The pins on the top surface of the bottom substrate include TLG extension pins and TLC extension pins, which are respectively located near the corner of the first side of the magnetic core close to the second side and the corner of the first side close to the fourth side.

29. The voltage regulation module according to claim 22, characterized in that, The bottom surface of the bottom substrate has pins including an output pin, a first power pin, and a second power pin. The output pin is located in the middle of the bottom surface of the bottom substrate. The first power pin and the second power pin are arranged around the output pin and are adjacent to each other.

30. The voltage regulation module according to claim 29, characterized in that, The bottom surface of the bottom substrate also includes signal pins, which are adjacent to the first side and / or the third side of the magnetic core and located outside the first power pin.

31. The voltage regulation module according to claim 29, characterized in that, The pins on the bottom surface of the substrate also include TLG extension pins and TLC extension pins, which are located near two or four corners on the bottom surface of the substrate.

32. The voltage regulation module according to claim 22, characterized in that, The pins on the bottom surface of the bottom substrate include an output pin, a first power pin, and a second power pin. The output pin, the first power pin, and the second power pin are arranged sequentially in the same direction in the order of first power pin, output pin, second power pin, output pin, and first power pin. The pins on the bottom substrate also include signal pins. The signal pins are adjacent to the first side and / or the third side of the magnetic core. Some of the signal pins are TLG extension pins and TLC extension pins.

33. The voltage regulation module according to claim 22, characterized in that, The bottom surface of the substrate has m*n LGA pins, where m and n are both integers greater than or equal to 1.

34. The voltage regulation module according to claim 22, characterized in that, The pins on the bottom surface of the substrate include a first power pin, a second power pin, and an output pin. The first power pin, the second power pin, and the output pin are arranged in two columns. Each column is arranged in the order of the first power pin, the second power pin, the output pin, the second power pin, and the first power pin. Signal pins, TLG extension pins, TLC extension pins, and auxiliary output pins are also distributed around the two columns of pins. The auxiliary output pins are respectively located near the second side and the fourth side of the magnetic core. The TLG extension pins are located between the auxiliary output pins on the second side. The TLC extension pins are located between the auxiliary output pins on the fourth side. The signal pins are located on the first side and the third side of the magnetic core.

35. The voltage regulation module according to claim 22, characterized in that, The pins on the bottom surface of the bottom substrate are arranged in the form of a pin array or a BGA array. The pins on the bottom surface of the bottom substrate include output pins, a first power pin, a second power pin, a signal pin, a TLG extension pin, and a TLC extension pin. The output pins are arranged in an m*n pin array, where m and n are natural numbers greater than 1, and are located in the central area of ​​the bottom substrate. The second power pins are arranged in two columns along the second side and the fourth side of the magnetic core, respectively. The first power pins are arranged in two rows along the first side of the magnetic core. The TLG extension pins and the TLC extension pins are located adjacent to the first side of the magnetic core and are respectively located between the first power pins and the second power pin. The signal pins are arranged along the third side of the magnetic core.

36. The voltage regulation module according to claim 2, characterized in that, The bottom surface of the top substrate is provided with other passive components, and the top surface of the magnetic core is provided with a groove for accommodating the other passive components.

37. The voltage regulation module according to claim 4, characterized in that, The top component also includes a drive / logic circuit, which simultaneously controls two smart power modules. The drive / logic circuit is disposed between the two smart power modules, or the drive / logic circuit is disposed on the same side of two low-end power switches of the two smart power modules. The low-end power switches of adjacent smart power modules are disposed adjacent to each other, and the high-end power switch is disposed outside the low-end power switch.

38. The voltage regulation module according to claim 4, characterized in that, It also includes N drive / logic circuits, each drive / logic circuit, each high-side power switch and each low-side power switch constitutes a sub-unit. The drive / logic circuits and the high-side power switches are arranged side by side on one side of the low-side power switches, and the low-side power switches of the N sub-units are arranged adjacent to each other.

39. The voltage regulation module according to claim 4, characterized in that, It also includes N drive / logic circuits. Each drive / logic circuit, each high-side power switch and each low-side power switch constitute a sub-unit. The drive / logic circuits and the high-side power switches are arranged side by side on one side of the low-side power switch. Each sub-unit and its neighboring sub-units are rotated clockwise or counterclockwise by a certain angle to coincide.

40. The voltage regulation module according to claim 21, characterized in that, The bottom surface of the top substrate is provided with an input pin VIN, a ground pin GND, a switch mid-terminal pin SW, an auxiliary winding pin, and an auxiliary winding electrical connector pin. The switch mid-terminal pin SW corresponds one-to-one with the position of the main winding of the central component and is electrically connected. The auxiliary winding pin corresponds one-to-one with the position of the auxiliary winding and is electrically connected. The auxiliary winding electrical connector pin corresponds one-to-one with the position of the auxiliary winding electrical connector and is electrically connected. The input pin VIN corresponds one-to-one with the position of the first power electrical connector and is electrically connected. The ground pin GND corresponds one-to-one with the position of the second power electrical connector and is electrically connected.

41. The voltage regulation module according to claim 21, characterized in that, The bottom surface of the top substrate is also provided with a first signal pin and a second signal pin. The electrical connector also includes a first signal electrical connector and a second signal electrical connector. The first signal pin corresponds to the position of the first signal electrical connector and is electrically connected. The second signal pin corresponds to the second signal electrical connector and is electrically connected.

42. The voltage regulation module according to claim 41, characterized in that, The first signal electrical connector is a vertical plate structure and is disposed adjacent to the third side of the magnetic core. The second signal electrical connector is disposed adjacent to the first side and the third side of the magnetic core, respectively. The second signal electrical connector is electrically connected to the TLG extension pin and the TLC extension pin.

43. The voltage regulation module according to claim 4, characterized in that, The metal block includes multiple first metal blocks and multiple second metal blocks. Each first metal block is electrically connected to the drain of a high-end power switch, and each second metal block is electrically connected to the source of two adjacent low-end power switches.

44. The voltage regulation module according to claim 43, characterized in that, The N low-end power switches are arranged adjacent to each other, and the top assembly also includes an input capacitor disposed between the plurality of second metal blocks and located at the center of the plurality of low-end power switches.

45. The voltage regulation module according to claim 1, characterized in that, A high-frequency capacitor is provided inside the top substrate or on the bottom surface of the top substrate, and the high-frequency capacitor is located adjacent to the intelligent power module.

46. ​​The voltage regulation module according to claim 3, characterized in that, The high-efficiency power supply module includes an input positive terminal, an input negative terminal, an output positive terminal, and an output negative terminal, wherein the input negative terminal and the output negative terminal are shorted to form the GND terminal; the first metal block is electrically connected to the input positive terminal, and the second metal block is electrically connected to the GND terminal.

47. A control method for a 4-phase VRM, characterized in that, The system includes a four-phase Buck circuit connected in parallel; it also includes a first control signal PWM1, a second control signal PWM2, a first current detection signal, a second current detection signal, a first control logic circuit, a second control logic circuit, and a multi-phase controller. The first control signal PWM1 and the second control signal PWM2 have the same period but are out of phase by 180°. The first control signal PWM1 generates two drive signals through the first control logic circuit. The period of each of the two drive signals is twice that of the first control signal PWM1, and the two drive signals drive two Buck circuits respectively. The first current detection signal generates a first summed current detection signal through the first control logic circuit. The frequency and phase of the first summed current detection signal are the same as those of the first control signal PWM1. The first control signal PWM1 and the first total current detection signal are connected to the control signal pin and current detection signal pin of the multiphase controller in the same phase, respectively. The second control signal PWM2 generates two drive signals through the second control logic circuit. The two drive signals drive two other Buck circuits respectively. The second current detection signal generates a second total current detection signal through the second control logic circuit. The period of the two drive signals is twice that of the second control signal PWM2. The frequency and phase of the second total current detection signal are the same as those of the second control signal PWM2. The second control signal PWM2 and the second total current detection signal are connected to the control signal pin and current detection signal pin of the multiphase controller in the same phase, respectively.

48. A voltage regulation module, characterized in that, The device includes a top assembly and a middle assembly. The top assembly includes a top substrate, a positive input pin, a ground pin, and a smart power module. The middle assembly includes a magnetic core, a winding, and electrical connectors. The smart power module is disposed on the bottom surface of the top substrate or embedded within the top substrate. The positive input pin and the ground pin are disposed on the top surface of the top substrate. The top surface of the smart power module is electrically connected to the positive input pin and the ground pin through the top substrate. The bottom surface of the smart power module is electrically connected to the first end of the winding, and the second end of the winding is electrically connected to an external load. The first end of the winding is disposed on the top surface of the middle assembly, and the second end of the winding is disposed on the bottom surface of the middle assembly. The electrical connectors include power connectors disposed on the side of the magnetic core and electrically connected to the ground pin.

49. The voltage regulation module according to claim 48, characterized in that, The top assembly also includes a plurality of metal blocks disposed on the top surface of the top substrate and electrically connected to the positive input pin and the ground pin, respectively.

50. The voltage regulation module according to claim 49, characterized in that, The top component also includes an input capacitor that is connected between the positive input pin and the ground pin.

51. The voltage regulation module according to claim 48, characterized in that, The intelligent power module includes a high-end power switch and a low-end power switch. Both the high-end power switch and the low-end power switch are vertical switches. The drain of the high-end power switch and the source of the low-end power switch are located on the top surface of the vertical switch. The source of the high-end power switch and the drain of the low-end power switch are located on the bottom surface of the vertical switch and short-circuited to the middle terminal SW of the switch. The drain of the high-end power switch is located near the positive input pin and is electrically connected to the positive input pin. The source of the low-end power switch is located near the ground pin and is electrically connected to the ground pin. The middle terminal SW of the switch is located near the winding and is electrically connected to the first end of the winding.

52. The voltage regulation module according to claim 51, characterized in that, It also includes a bottom component; the bottom surface of the bottom component is provided with an output pin and a power pin; the output pin is electrically connected to the second end of the winding; the power pin is electrically connected to a power connector; the output pin and the power pin constitute the output terminal of the voltage regulation module.

53. A smart power module layout, characterized in that, The intelligent power module layout includes multiple intelligent power modules, each of which includes a high-end power switch and a low-end power switch; the high-end power switch and the low-end power switch are connected in series; the multiple low-end power switches are arranged adjacent to each other; the multiple high-end power switches are arranged around the multiple low-end power switches and are respectively arranged adjacent to their corresponding low-end power switches; the multiple intelligent power modules are arranged symmetrically along an axis of symmetry or in a windmill shape.

54. The intelligent power module layout according to claim 53, characterized in that, Both the high-end power switch and the low-end power switch are vertical power switches. The drain of the high-end power switch and the source of the low-end power switch are both located on the top surface of the vertical switch, and the source of the high-end power switch and the drain of the low-end power switch are both located on the bottom surface of the vertical switch. The source of the high-end power switch and the drain of the low-end power switch are connected in series to the SW terminal.

55. The intelligent power module layout according to claim 53, characterized in that, The switches in the intelligent power modules located in the same row are arranged in the order of high-end power switch, low-end power switch, low-end power switch and high-end power switch.

56. The intelligent power module layout according to claim 53, characterized in that, Each of the intelligent power modules also includes a drive / logic circuit, which is arranged side by side with the high-end power switch and is located on the same outer side of the low-end power switch.

57. The intelligent power module layout according to claim 53, characterized in that, It also includes at least one drive / logic circuit, which simultaneously controls two smart power modules. The drive / logic circuit is located between the two smart power modules, or the drive / logic circuit is located on the same side of the two low-end power switches of the two smart power modules.

58. The intelligent power module layout according to claim 53, characterized in that, Each of the intelligent power modules also includes a drive / logic circuit, which is arranged side by side with the high-end power switch on one side of the low-end power switch. Each intelligent power module and its neighboring intelligent power module are rotated clockwise or counterclockwise by a certain angle to overlap.

59. A pin arrangement for a voltage regulation module, characterized in that, The voltage regulation module includes an intelligent power module and a central component; the voltage regulation module also includes opposing top and bottom surfaces, opposing first and third side surfaces, and opposing second and fourth side surfaces; the central component includes a magnetic core and windings; the intelligent power module is electrically connected to one end of the windings; the pins are disposed on the bottom surface of the voltage regulation module; the pins include an output pin, a first power pin, and a second power pin; the output pin is disposed in the middle of the bottom surface of the voltage regulation module, and the first and second power pins are disposed around the output pin; the output pin is electrically connected to the other end of the windings, and the first and second power pins are electrically connected to the intelligent power module.

60. The pin arrangement according to claim 59, characterized in that, The first power pin is disposed adjacent to the first side and / or the third side of the voltage regulation module; the second power pin is disposed adjacent to the second side and / or the fourth side of the voltage regulation module; and a signal pin is also included, which is disposed on the first side and / or the third side of the voltage regulation module and located outside the first power pin.

61. The pin arrangement according to claim 59, characterized in that, It also includes TLG extension pins and TLC extension pins, which are located near two or four corners on the bottom surface of the voltage regulation module.

62. The pin arrangement according to claim 59, characterized in that, The first power pin, the second power pin, and the output pin are arranged in two columns. Each column is arranged in the order of first power pin, second power pin, output pin, second power pin, and first power pin. Signal pins, TLG extension pins, TLC extension pins, and auxiliary output pins are also distributed around the two columns of pins. The auxiliary output pins are respectively located on the second side and the fourth side of the voltage regulation module. The TLG extension pins are located between the auxiliary output pins on the second side, the TLC extension pins are located between the auxiliary output pins on the fourth side, and the signal pins are located on the first side and the third side.

63. The pin arrangement according to claim 59, characterized in that, The pins are arranged in the form of a pin array or a BGA array. The output pins are arranged in an m*n pin array, where m and n are natural numbers greater than 1. The second power pins are arranged in two columns along the second side and the fourth side, respectively, and the first power pins are arranged in two rows along the first side. The pins also include signal pins, TLG extension pins, and TLC extension pins. The TLG extension pins and TLC extension pins are located adjacent to the first side and between the first power pins and the second power pins, respectively. The signal pins are arranged along the third side.

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