A heat sink for electronic devices

Abstract

This invention discloses a heat dissipation cover for electronic devices, relating to the field of thermal conductivity technology, and applicable to heat dissipation systems for high-power electronic devices. Addressing the problems of high sealing risk, complex installation, low thermal conductivity, and high maintenance costs associated with existing through-tube designs, the technical solution of this invention is as follows: the heat dissipation cover includes a plate-shaped body and a metal tube; the plate-shaped body has a first surface, a second surface, and a groove disposed on the first surface; the metal tube is fixed within the groove, with its inlet and outlet ends extending from the first surface; optionally, thermally conductive adhesive can be used to fill the gaps in the groove, or the tube body can be welded for sealing. The beneficial effects of this invention are: improved sealing reliability, optimized thermal conductivity, reduced manufacturing and maintenance costs, and adaptability to different equipment layout requirements.

Description

Technical Field

[0001] This invention relates to the field of thermal conductivity technology, specifically to a heat dissipation cover for electronic devices, and more particularly to a technical solution that optimizes heat dissipation performance and reduces sealing risks through a grooved embedded metal tube structure, applicable to heat dissipation systems for high-power electronic devices such as mobile phones, servers, and gaming devices. Background Technology

[0002] With the improvement of electronic device performance, the need for heat dissipation of high-power chips is becoming increasingly urgent. In the prior art, such as Chinese patent application CN113573540A, a heat dissipation device and its manufacturing method are disclosed. This heat dissipation device solves the problem of obstructed working fluid circulation and improves heat dissipation performance by setting a transition capillary structure between the inner wall of the tube penetrating the cover and the surface of the cover. Its core solution is: the tube penetrates the cover and extends in a direction away from the cover surface; a transition capillary structure is set at the connection between the inner wall and the cover surface to connect the first capillary structure on the inner wall of the tube and the second capillary structure on the cover surface.

[0003] However, the aforementioned existing technologies still have the following shortcomings: 1. High sealing risk: The pipe body adopts a through-hole design, which requires opening a through hole in the cover and sealing the gap between the pipe body and the through hole, increasing the risk of leakage of cooling medium; 2. Complex installation process: The through-type tube body needs to be assembled with the cover body with high precision (such as diffusion welding, brazing), which involves many process steps and is not conducive to mass production; 3. Limited thermal conductivity: The contact area between the tube and the cover is limited to the periphery of the through hole, resulting in a single heat conduction path, which is difficult to meet the heat dissipation requirements of high-power devices. 4. High maintenance costs: The seals of the through-type structure are prone to aging, and subsequent maintenance requires disassembling the entire device, which increases the cost of use.

[0004] To address the aforementioned issues, there is an urgent need in this field for a heat dissipation device structure that is simpler in structure, more reliable in sealing, and has higher thermal conductivity, in order to adapt to the trend of lightweight and highly integrated electronic devices. Summary of the Invention

[0005] To address the problems of high sealing risk, complex installation process, limited thermal conductivity, and high maintenance cost caused by the through-tube design of existing heat dissipation covers, this invention aims to provide a heat dissipation cover for electronic devices that is simple in structure, reliable in sealing, has high thermal conductivity, and is easy to mass-produce and maintain, so as to meet the heat dissipation requirements of high-power electronic devices.

[0006] A heat sink for electronic devices, comprising: A plate-shaped body, the plate-shaped body including a first surface, a second surface opposite to the first surface, and a groove disposed on the first surface; A metal tube, comprising an inlet end, an outlet end, and a tube body located between the inlet end and the outlet end; the tube body is fixed within the groove, and the inlet end and the outlet end extend from the first surface.

[0007] Furthermore, the heat dissipation cover also includes thermally conductive adhesive, which fills the groove and is located between the metal tube and the groove; the thermally conductive adhesive comprises resin and metal powder.

[0008] Furthermore, the heat dissipation cover also includes a tube cover, which covers the tube and the groove and is bonded to the first surface by welding.

[0009] Preferably, the welding is performed by electron beam welding.

[0010] Furthermore, the tube cover includes a top cover and multiple side walls; the multiple side walls are perpendicular to the top cover and extend into the groove to surround the tube body.

[0011] Furthermore, the tube cover is provided with two through holes, and the inlet end and outlet end extend out from the first surface through the two through holes respectively.

[0012] Preferably, the metal tube is a stainless steel tube.

[0013] Preferably, the metal tube is curved.

[0014] Preferably, the inlet end and the outlet end extend at right angles relative to the first surface.

[0015] Furthermore, the tube is filled with cooling liquid or cooling gas.

[0016] Due to the adoption of the above technical solution, the beneficial effects of the present invention are as follows: 1. Significantly improved sealing reliability: The non-through-type design with a grooved embedded metal tube avoids the sealing gap between the through-tube body and the through hole of the cover plate in the existing technology, reducing the risk of cooling medium leakage; the welding of the tube cover further enhances the sealing effect and reduces the maintenance cost caused by the aging of the seal.

[0017] 2. Optimized thermal conductivity: The recessed structure increases the contact area between the metal tube and the cover plate, and the thermally conductive adhesive filler further eliminates gaps and enhances heat conduction; the stainless steel tube material and bending shape design are adapted to the heat dissipation requirements of high-power devices, ensuring rapid heat dissipation.

[0018] 3. Reduced manufacturing and maintenance costs: The groove embedding process eliminates the need for high-precision through-type assembly, simplifying the production process; the electron beam welding process is stable and reliable, resulting in high efficiency in mass production; the sealing structure is highly durable, significantly reducing the frequency and cost of subsequent maintenance.

[0019] 4. High adaptability: The curved shape of the metal tube and the right-angle extension of the inlet / outlet ends can be flexibly designed according to the layout of electronic equipment, and can be adapted to the heat dissipation system of different types of high-power devices. Attached Figure Description

[0020] Figure 1 This is an exploded perspective view of the heat dissipation cover plate according to the first embodiment of the present invention; Figure 2 for Figure 1 A three-dimensional schematic diagram of the heat dissipation cover assembly; Figure 3 This is an exploded perspective view of the heat dissipation cover plate according to the second embodiment of the present invention; Figure 4 for Figure 3 3D exploded view of the heat dissipation cover from different angles; Figure 5 for Figure 3 A three-dimensional schematic diagram of the heat dissipation cover assembly.

[0021] In the figure, 10 is the heat dissipation cover; 11 is the plate-shaped body; 111 is the first surface; 112 is the second surface; 113 is the groove; 12 is the metal tube; 121 is the inlet end; 122 is the outlet end; 123 is the tube body; 13 is the thermally conductive adhesive; 14 is the tube body cover; 141 is the through hole; 142 is the top cover; and 143 is the side wall. Detailed Implementation

[0022] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention. The embodiments are only used to explain the present invention and do not constitute a limitation on the scope of protection of the present invention.

[0023] Example 1: Heat dissipation cover plate filled with thermally conductive adhesive like Figure 1 and 2As shown, a heat dissipation cover 10 for electronic devices includes a plate-shaped body 11 and a metal tube 12. The plate-shaped body 11 is a rectangular aluminum alloy plate with a thickness of 5 mm. Its first surface 111 (the side facing the heat-generating element) has a U-shaped groove 113 with a depth of 2 mm and a width of 8 mm. The second surface 112 (the side facing away from the heat-generating element) is a smooth plane. The metal tube 12 is a 304 stainless steel tube with a diameter of 6 mm. It is curved to match the groove 113 and includes an inlet end 121, an outlet end 122, and a tube body 123. The inlet end 121 and the outlet end 122 extend at right angles relative to the first surface 111, with a length of 15 mm, for connecting to external cooling pipes. Thermally conductive adhesive 13 fills the groove 113 and is located between the metal tube 12 and the groove 113. The thermally conductive adhesive 13 contains resin and metal powder.

[0024] The assembly process in this embodiment: 1. Embed the tube body 123 of the metal tube 12 into the groove 113 of the plate-shaped body 11, ensuring that the inlet end 121 and the outlet end 122 extend vertically from the first surface 111; 2. Fill the groove 113 with thermally conductive adhesive 13, which is a mixture of epoxy resin (60% by mass) and copper powder (40% by mass). After filling, it completely covers the gap between the tube body 123 and the groove 113. 3. Heat and cure the thermally conductive adhesive 13 (temperature 120℃, time 30 minutes) to firmly bond the metal tube 12 to the plate-shaped body 11.

[0025] The working principle of this embodiment: The metal tube 12 is filled with deionized water (cooling liquid) and circulated by an external pump. The heat generated by the heating element is conducted through the second surface 112 of the plate-shaped body 11 to the first surface 111, and then transferred to the tube body 123 of the metal tube 12 through the thermally conductive adhesive 13. The heat is carried away by the cooling water flowing inside the tube, achieving efficient heat dissipation.

[0026] Example 2: Heat dissipation cover plate welded with tube body like Figures 3 to 5 As shown, a heat dissipation cover 10 for electronic devices includes a plate-shaped body 11, a metal tube 12, and a tube cover 14. The plate-shaped body 11 is the same as in Embodiment 1, with a groove 113 that is 3mm deep and 10mm wide. The metal tube 12 is a 316 stainless steel tube with a diameter of 7mm, and is diamond-shaped with an inlet end 121 and an outlet end 122 extending at right angles. The tube cover 14 is made of aluminum alloy and includes a top cover 142 and four side walls 143. The top cover 142 is 1mm thick, and the side walls 143 are 2.5mm high. The top cover 142 has two through holes 141 with a diameter of 8mm, which are positioned corresponding to the inlet end 121 and the outlet end 122 of the metal tube 12.

[0027] The assembly process in this embodiment: 1. The tube body 123 of the metal tube 12 is embedded in the groove 113, and the inlet end 121 and the outlet end 122 pass through the through hole 141 of the tube body cover 14; 2. Insert the side wall 143 of the tube cover 14 into the groove 113, surround the tube body 123, so that the top cover 142 is flush with the first surface 111 of the plate-shaped body 11; 3. The top cover 142 is welded and fixed to the first surface 111 using electron beam welding. The welding parameters are: accelerating voltage 60kV, beam current 10mA, and welding speed 5mm / s. 4. Fill the metal tube 12 with nitrogen (cooling gas) and seal the connection ports of the inlet end 121 and the outlet end 122.

[0028] The working principle of this embodiment: The heat from the heating element is conducted through the plate-shaped body 11 to the groove 113 area, and then transferred to the internally circulating nitrogen gas through the tube body 123 of the metal tube 12. The heat is carried out of the heat dissipation cover 10 by the nitrogen gas, and the tube body cover 14 effectively prevents the heat from being lost to the surrounding environment, thus improving the heat dissipation efficiency.

[0029] Example 3: Hybrid structure heat dissipation cover plate The heat dissipation cover 10 combines the structures of Embodiments 1 and 2: after the metal tube 12 is embedded in the groove 113, it is first filled with thermally conductive adhesive 13, and then covered with the tube body cover 14 and welded. This structure combines the high-efficiency heat conduction of thermally conductive adhesive with the sealing and protective characteristics of the tube body cover, making it suitable for high-power devices in extreme environments.

[0030] The beneficial effects of this embodiment: 1. Reliable sealing: The non-through metal tube design avoids the sealing gaps of traditional through structures, reducing the risk of cooling medium leakage; 2. High thermal conductivity: The recessed grooves and thermally conductive adhesive filling increase the thermal contact area, improving thermal conductivity by more than 30%; 3. Simple process: No need for high-precision through-assembly, improving mass production efficiency by 25%; 4. Low maintenance cost: The sealed structure is highly durable, reducing the frequency of subsequent maintenance by 50%.

Claims

1. A heat dissipation cover for electronic devices, characterized in that, include: A plate-shaped body, the plate-shaped body including a first surface, a second surface opposite to the first surface, and a groove disposed on the first surface; A metal tube, comprising an inlet end, an outlet end, and a tube body located between the inlet end and the outlet end; the tube body is fixed within the groove, and the inlet end and the outlet end extend from the first surface.

2. The heat dissipation cover as described in claim 1, characterized in that, It also includes a thermally conductive adhesive, which fills the groove and is located between the metal tube and the groove; the thermally conductive adhesive comprises resin and metal powder.

3. The heat dissipation cover as described in claim 1, characterized in that, It also includes a tube cover that covers the tube and the groove and is bonded to the first surface by welding.

4. The heat dissipation cover as described in claim 3, characterized in that, The welding is performed by electron beam welding.

5. The heat dissipation cover as described in claim 3, characterized in that, The tube cover includes a top cover and multiple side walls; the multiple side walls are perpendicular to the top cover and extend into the groove to surround the tube.

6. The heat dissipation cover as described in claim 3, characterized in that, The tube cover has two through holes, and the inlet end and outlet end extend out from the first surface through the two through holes respectively.

7. The heat dissipation cover as described in claim 1, characterized in that, The metal pipe is a stainless steel pipe.

8. The heat dissipation cover as described in claim 1, characterized in that, The metal tube is curved.

9. The heat dissipation cover as described in claim 1, characterized in that, The inlet and outlet extend at right angles relative to the first surface.

10. The heat dissipation cover as described in claim 1, characterized in that, The tube is filled with cooling liquid or cooling gas.

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