A targeted immersion phase change heat sink

By using the microchannel and porous layer structure design of the targeted immersion phase change radiator, the problems of large coolant consumption and safety hazards in immersion cooling systems are solved, achieving efficient and stable high heat flux density heat dissipation.

CN122138377APending Publication Date: 2026-06-02BEIJING JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING JIAOTONG UNIV
Filing Date
2026-03-26
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing immersion cooling systems consume large amounts of coolant and pose safety hazards, especially the risk of leakage and compatibility issues with other electronic components.

Method used

A targeted immersion phase change radiator is designed, which adopts a microchannel heat dissipation structure and a porous layer structure. By increasing the flow boiling and vaporization core density of the high-flow-rate cooling working fluid, local immersion heat dissipation is achieved, reducing the amount of coolant used and improving the heat exchange efficiency.

Benefits of technology

It significantly improves heat dissipation efficiency, reduces the wall temperature of components to be cooled, reduces coolant consumption, avoids the risk of leakage, and provides a stable thermal management environment.

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Abstract

This application provides a targeted immersion phase change heat sink, relating to the field of electronic device heat dissipation technology, to address the problems of large coolant consumption and potential safety hazards. It includes a housing and a microchannel heat dissipation structure. The housing is equipped with cooling medium pipelines and vapor pipelines. The microchannel heat dissipation structure is disposed within the housing, with its cooling medium inlet connected to the cooling medium pipelines. The cooling medium is introduced into the microchannel heat dissipation structure, where it undergoes flow and boiling. The resulting two-phase fluid, after absorbing heat, exits from the cooling medium outlet of the microchannel heat dissipation structure into the immersion chamber of the housing. Vapor enters the gas phase space and exits through the vapor pipeline, while liquid remains in the liquid phase space of the immersion chamber and flows over the outer surface of the microchannel heat dissipation structure, which has a porous layer. By concentrating two-phase immersion cooling and flow boiling cooling within a single housing, only localized cooling of the chip is achieved, reducing coolant consumption and providing a stable and reliable thermal management environment.
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