A semiconductor chip encapsulation mechanism

Abstract

This invention discloses a semiconductor chip capping and packaging mechanism, relating to the field of semiconductor device packaging technology. The invention includes a frame, with a base plate and a substrate fixedly mounted at the bottom and middle of the frame, respectively. A first loading platform and a second loading platform are slidably mounted on the base plate and the base plate via slide rails. The base plate is equipped with a station alternation component that works in conjunction with the first and second loading platforms. Both the first and second loading platforms have a synchronous positioning component at their top center. By setting the synchronous positioning component, when the first and second loading platforms alternate, the guide wheel moves along the corresponding guide positioning frame and guide positioning plate and touches the trapezoidal block, pushing the spiral shaft and guide frame to move, thereby driving the circular plate to rotate. The inclined groove, along with the rotation of the circular plate, drives the guide shaft and the moving block to slide radially synchronously, causing the positioning rod to reciprocate and converge towards the center along the straight groove, completing the positioning operation during the transfer of the metal cover plate and the chip casing.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device packaging technology, specifically to a semiconductor chip capping and packaging mechanism. Background Technology

[0002] Semiconductor device packaging refers to the process of assembling semiconductor chips (bare dies) into practical semiconductor devices through processes such as fixing, sealing, and electrical connection. It is a key intermediate link in the semiconductor manufacturing process that connects chip wafer processing and end product applications. The housings used for semiconductor chip packaging are mainly divided into two categories: metal housings and ceramic housings. Both require welding metal cover plates during the packaging process to achieve high airtightness and reliability of the packaging structure. Existing equipment often relies on manual positioning for workpiece positioning. This manual positioning is not only labor-intensive and inefficient, but also prone to operational errors that can lead to misalignment between the metal cover and the chip housing. This misalignment results in inconsistent gaps between the metal cover and the housing, which can cause insufficient solder filling and cold solder joints during welding, affecting welding quality. Furthermore, chip capping and packaging processes commonly employ a single loading platform welding mode. Operators must first place the metal cover and chip housing to be packaged on the loading platform and complete the positioning, then start the welding equipment for the packaging operation. After welding is complete, the machine must be stopped to remove the finished workpiece, and a new workpiece must be placed before starting the next production cycle. This operation mode has a significant efficiency bottleneck, resulting in low equipment utilization. To address these issues, the inventor proposes a semiconductor chip capping and packaging mechanism to solve these problems. Summary of the Invention

[0003] To address the issues of chip capping positioning and improving production efficiency, the present invention aims to provide a semiconductor chip capping and packaging mechanism.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a semiconductor chip capping and packaging mechanism, including a frame, a base plate and a substrate are fixedly installed at the bottom and middle of the frame respectively, the substrate and the surface of the base plate are slidably mounted with a first loading platform and a second loading platform via slide rails, the base plate is provided with a station alternation component that works in conjunction with the first loading platform and the second loading platform, the top center of the first loading platform and the second loading platform are provided with a synchronous positioning component, the synchronous positioning component is provided with a vacuum adsorption component, a driving component is provided on one side of the substrate surface, and a welding machine body is provided on one side of the top of the frame.

[0005] Preferably, the synchronous positioning component includes a reference positioning frame. Two reference positioning frames are respectively and securely installed in the middle of the corresponding No. 1 and No. 2 loading platforms by bolts. A positioning platform is fixedly installed on the inner wall of the reference positioning frame. Eight symmetrically distributed circular plates are rotatably installed on the bottom of the inner wall of the reference positioning frame. Four inclined grooves are formed in a ring array on the circular plates. A guide shaft is slidably installed in the inclined groove. A moving block is fixedly installed at the top of the guide shaft and is slidably connected to the bottom of the positioning platform. Two symmetrically distributed positioning rods are fixedly installed at the top of the moving block. A straight groove is formed on the positioning platform to cooperate with the positioning rods and the positioning rods slide in the straight groove. A guide frame is slidably installed in the reference positioning frame. Push plates are fixedly installed at both ends of the guide frame. A spline is fixedly installed in the middle of the outer wall of the push plate and is slidably connected to the middle of the reference positioning frame through a spline. A guide wheel is rotatably installed at the end of the spline on one side of the lead screw. The base plate is close to the lead screw. One side is fixedly installed with guide positioning frames and guide positioning plates that cooperate with the No. 1 and No. 2 feeding platforms. The corresponding guide wheels in the No. 1 and No. 2 feeding platforms slide on the outer walls of the corresponding guide positioning frames and guide positioning plates. Two symmetrically distributed trapezoidal blocks are fixedly installed in the middle of the outer walls of the guide positioning frames and guide positioning plates. A return spring is sleeved on the outer wall of the spindle on the side away from the guide wheels. The two ends of the return spring are fixedly connected to the push plate and the inner wall of the reference positioning frame, respectively. A limit plate is fixedly installed at the end of the spindle on the side of the return spring. Four arc-shaped grooves are distributed in a ring array on the circular plate. A fixing rod that cooperates with the arc-shaped groove is fixedly installed on the inner wall of the reference positioning frame. The fixing rod slides in the arc-shaped groove. A push rod is fixedly installed on the side of the circular plate near the guide frame. A guide pin is fixedly installed at the end of the push rod. A sliding groove that cooperates with the guide pin is opened in the guide frame. The guide pin slides in the sliding groove.

[0006] Preferably, the workstation alternation component includes two symmetrically distributed support plates and guide plates. The two support plates are respectively located on both sides of the guide plate, and both the support plates and the guide plates are fixedly installed on the base plate. A movable platform that cooperates with the second loading platform is slidably installed on the top of the support plate via a slide rail. Guide columns are fixedly installed at the four corners of the bottom surface of the second loading platform, and the guide columns are vertically slidably installed on the movable platform. A synchronous wheel transmission group is provided on the side of the base plate away from the lead screw, and the second loading platform and the workstation alternation component are respectively fixedly connected to the synchronous belt in the synchronous wheel transmission group via support plates. A guide groove is opened on the guide plate, and a guide frame is fixedly installed in the middle of the bottom end of the second loading platform. A pulley is rotatably installed at the bottom end of the guide frame, and the pulley slides in the guide groove.

[0007] Preferably, the vacuum adsorption assembly includes eight air holes, which are respectively opened on the positioning platform and located at the center of the circular plate. The positioning platform has an air guide channel that cooperates with the corresponding air holes, and the air holes and the air guide channel are connected. Two symmetrically distributed No. 1 diversion frames are fixedly installed on one side of the outer wall of the reference positioning frame. The air inlet end of the No. 1 diversion frame is connected to the corresponding air guide channel. No. 2 diversion frames are fixedly installed on one side of the table surface of the No. 1 and No. 2 feeding platforms. The two air inlet ends of the No. 2 diversion frames are connected to the exhaust ends of the corresponding No. 1 diversion frames. A vacuum pump is fixedly installed on the top of the bottom plate near the No. 1 diversion frame, and the two suction ends of the vacuum pump are connected to the exhaust ends of the corresponding No. 1 diversion frames.

[0008] Preferably, the drive assembly includes a lead screw, which is rotatably mounted on the side of the base plate away from the vacuum pump via a bearing seat. A sliding block is threaded on the outer wall of the lead screw, and the sliding block is fixedly connected to one side of the first loading platform via a support plate. A servo motor is fixedly mounted on the side of the base plate near the lead screw via a support, and the drive end of the servo motor is connected to the lead screw via a coupling.

[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention, by setting up a synchronous positioning component, allows the guide wheel to move along the corresponding guide positioning frame and guide positioning plate and touch the trapezoidal block when the No. 1 and No. 2 loading stations are alternately switched. This pushes the flower shaft and guide frame to move, thereby driving the circular plate to rotate. The inclined groove drives the guide shaft and the moving block to slide radially synchronously with the rotation of the circular plate, so that the positioning rod reciprocates and retracts towards the center along the straight groove, completing the positioning operation during the transfer of the metal cover plate and the chip shell. This improves the positioning accuracy and consistency, ensures the fit of the packaging seam, and significantly improves the product packaging yield. 2. This invention sets up a driving component and a station alternation component. The driving component drives the first loading platform to move. During this process, the station alternation component drives the second loading platform to move in the opposite direction, thereby realizing the alternation of two stations. The support plate, moving table and guide column of the station alternation component cooperate to realize the vertical fine adjustment of the second loading platform. During the alternation process, the second loading platform avoids the first loading platform, ensuring the stability of the alternation while greatly improving production efficiency. 3. This invention uses a vacuum adsorption component to generate negative pressure through a vacuum pump. This negative pressure is then transmitted through a distribution frame and an air guide channel to the air holes of the positioning stage. This vacuum adsorption fixes the chip shell that has been centered and positioned, effectively preventing the workpiece from shifting due to vibration or external force during transportation and welding, and ensuring the fitting accuracy of the welding joint. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the overall front structure of the present invention; Figure 2 This is a schematic diagram of the front substrate structure of the present invention; Figure 3 This is a schematic diagram of the overall frame structure in this invention; Figure 4 This is a schematic diagram of the structure of the workstation alternation component in this invention; Figure 5 This is a schematic diagram of the overall structure of the workstation alternation component in this invention; Figure 6 This is a schematic diagram of the positioning platform, air vent, and air guide channel in this invention. Figure 7 This is a schematic diagram of the synchronous positioning component in this invention; Figure 8 This is a schematic diagram of the structure of the base plate and synchronous wheel transmission assembly in this invention; Figure 9 for Figure 4 Enlarged structural diagram at point A; Figure 10 for Figure 7 Enlarged structural diagram at point B; Figure 11 for Figure 7 Enlarged schematic diagram of the structure at point C.

[0012] In the diagram: 1. Frame; 2. Base plate; 3. Base plate; 4. No. 1 loading platform; 5. No. 2 loading platform; 6. Station alternation assembly; 601. Support plate; 602. Guide plate; 603. Moving table; 604. Guide frame; 605. Pulley; 606. Guide groove; 607. Guide column; 608. Synchronous pulley transmission group; 7. Synchronous positioning assembly; 701. Reference positioning frame; 702. Positioning table; 703. Circular plate; 704. Inclined groove; 705. Guide shaft; 706. Moving block; 707. Positioning rod; 708. Straight groove; 7 9. Push rod; 710. Guide frame; 711. Flower shaft; 712. Guide wheel; 713. Guide positioning frame; 714. Guide positioning plate; 715. Push plate; 716. Return spring; 717. Arc groove; 718. Fixed rod; 719. Limiting plate; 8. Vacuum adsorption assembly; 801. Air hole; 802. Air guide channel; 803. No. 1 diversion frame; 804. No. 2 diversion frame; 805. Vacuum pump; 9. Drive assembly; 901. Lead screw; 902. Sliding block; 903. Servo motor; 10. Welding machine body. Detailed Implementation

[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0014] Example: Figures 1-11 As shown, the present invention provides a technical solution: a semiconductor chip capping and packaging mechanism, including a frame 1, a base plate 2 and a substrate 3 are fixedly installed at the bottom and middle of the frame 1 respectively, the substrate 3 and the surface of the base plate 2 are respectively slidably installed with a first loading platform 4 and a second loading platform 5 via slide rails, the base plate 2 is provided with a station alternation component 6 that works in conjunction with the first loading platform 4 and the second loading platform 5, the top center of the first loading platform 4 and the second loading platform 5 are provided with a synchronous positioning component 7, the synchronous positioning component 7 is provided with a vacuum adsorption component 8, a driving component 9 is provided on one side of the surface of the substrate 3, and a welding machine body 10 is provided on one side of the top of the frame 1; The synchronous positioning component 7 includes a reference positioning frame 701. Two reference positioning frames 701 are respectively fixedly installed in the middle of the corresponding No. 1 loading platform 4 and No. 2 loading platform 5 by bolts. A positioning platform 702 is fixedly installed on the inner wall of the reference positioning frame 701. Eight symmetrically distributed circular plates 703 are rotatably installed on the bottom of the inner wall of the reference positioning frame 701. Four inclined grooves 704 are distributed in a ring array on the circular plates 703. A guide shaft 705 is slidably installed in the inclined grooves 704. A moving block 706 is fixedly installed at the top of the guide shaft 705 and is slidably connected to the bottom of the positioning platform 702. Two symmetrically distributed positioning rods 707 are fixedly installed at the top of the moving block 706. A straight groove 708 is opened on the positioning platform 702 to cooperate with the positioning rods 707 and the positioning rods 707 slide in the straight groove 708.

[0015] By adopting the above technical solution, when the circular plate 703 rotates, the guide shaft 705 and the moving block 706 can be driven to slide synchronously in the radial direction through the inclined groove 704, thereby driving the positioning rod 707 to move centripetally along the straight groove 708, so as to realize the automatic centering and positioning of the metal cover plate and the chip shell.

[0016] The workstation alternation component 6 includes two symmetrically distributed support plates 601 and guide plates 602. The two support plates 601 are respectively located on both sides of the guide plate 602, and both the support plates 601 and the guide plates 602 are fixedly installed on the surface of the base plate 2. The top of the support plate 601 is slidably mounted with a movable table 603 that cooperates with the second loading platform 5 via a slide rail. Guide columns 607 are fixedly installed at the four corners of the bottom surface of the second loading platform 5, and the guide columns 607 are vertically slidably mounted on the movable table 603.

[0017] By adopting the above technical solution, the moving table 603 and the guide column 607 cooperate to realize the vertical fine adjustment of the second loading table 5. Combined with the lateral sliding of the support plate 601, it meets the vertical position compensation requirements when the first loading table 4 and the second loading table 5 work alternately.

[0018] The vacuum adsorption assembly 8 includes eight air holes 801, which are respectively opened on the positioning stage 702 and located at the axis of the circular plate 703. The positioning stage 702 has an air guide channel 802 that cooperates with the corresponding air holes 801, and the air holes 801 and the air guide channel 802 are connected in a continuous manner. Two symmetrically distributed first-order diversion frames 803 are fixedly installed on one side of the outer wall of the reference positioning frame 701. The air inlet end is connected to the corresponding air guide channel 802. The No. 2 diversion frame 804 is fixedly installed on one side of the table surface of the No. 1 loading platform 4 and the No. 2 loading platform 5. The two air inlet ends of the No. 2 diversion frame 804 are connected to the exhaust end of the corresponding No. 1 diversion frame 803. The vacuum pump 805 is fixedly installed on the top of the base plate 2 near the No. 1 diversion frame 803, and the two suction ends of the vacuum pump 805 are connected to the exhaust end of the corresponding No. 1 diversion frame 803.

[0019] By adopting the above technical solution, the vacuum pump 805 evacuates the air hole 801 through the first flow divider 803, the second flow divider 804 and the air guide channel 802, thereby achieving stable adsorption of the bottom of the chip shell, avoiding displacement during positioning and welding, and improving the packaging yield.

[0020] The drive assembly 9 includes a lead screw 901, which is rotatably mounted on the side of the substrate 3 away from the vacuum pump 805 via a bearing seat. A sliding block 902 is threaded on the outer wall of the lead screw 901, and the sliding block 902 is fixedly connected to one side of the first loading platform 4 via a support plate. A servo motor 903 is fixedly mounted on the side of the substrate 3 near the lead screw 901 via a support, and the drive end of the servo motor 903 is connected to the lead screw 901 via a coupling.

[0021] By adopting the above technical solution, the servo motor 903 drives the lead screw 901 to rotate, which in turn drives the sliding block 902 to move precisely with the first loading platform 4. In conjunction with the synchronous wheel transmission group 608, the dual-station synchronous switching is realized, ensuring the stability of the operation cycle.

[0022] The substrate 3 is provided with a synchronous wheel transmission group 608 on the side away from the lead screw 901, and the second loading platform 5 and the station alternation component 6 are respectively fixedly connected to the synchronous belt in the synchronous wheel transmission group 608 through support plates.

[0023] By adopting the above technical solution, the synchronous wheel transmission group 608 can enable the No. 1 loading platform 4 and the No. 2 loading platform 5 to move synchronously in opposite directions, thereby achieving efficient alternation between the welding station and the loading / unloading station.

[0024] A guide groove 606 is provided on the guide plate 602. A guide frame 604 is fixedly installed at the bottom center of the second loading platform 5. A pulley 605 is rotatably installed at the bottom of the guide frame 604, and the pulley 605 slides in the guide groove 606.

[0025] By adopting the above technical solution, the No. 2 loading platform 5 moves under the guidance of the guide frame 604 during the movement, avoiding the No. 1 loading platform 4, and ensuring the stability of the workstation switching.

[0026] A guide frame 710 is slidably provided in the reference positioning frame 701. Push plates 715 are fixedly installed at both ends of the guide frame 710. A spline 711 is fixedly installed in the middle of the outer wall of the push plate 715. The spline 711 is slidably connected to the middle of the reference positioning frame 701 through a spline. A guide wheel 712 is rotatably installed at the end of the spline 711 on one side of the lead screw 901. A guide positioning frame 713 and a guide positioning plate 714 are fixedly installed on the side of the base plate 3 near the lead screw 901. They are used in conjunction with the first loading platform 4 and the second loading platform 5. The corresponding guide wheels 712 in the first loading platform 4 and the second loading platform 5 slide on the outer wall of the corresponding guide positioning frame 713 and guide positioning plate 714. Two symmetrically distributed trapezoidal blocks are fixedly installed in the middle of the outer wall of the guide positioning frame 713 and the guide positioning plate 714.

[0027] By adopting the above technical solution, the guide wheels 712 slide on the corresponding guide positioning frames 713 and guide positioning plates 714 during the alternating movement of the No. 1 loading platform 4 and the No. 2 loading platform 5, respectively. During the sliding process, they come into contact with each other and drive the guide frame 710 to move, thereby realizing the automatic triggering of the positioning action without the need for an additional drive source.

[0028] A push rod 709 is fixedly installed on the side of the circular plate 703 near the guide frame 710. A guide pin is fixedly installed at the end of the push rod 709. A slide groove is opened in the guide frame 710 to cooperate with the guide pin, and the guide pin slides in the slide groove.

[0029] By adopting the above technical solution, during the movement of the guide frame 710, the guide pin slides in the slide groove, and then drives the circular plate 703 to rotate through the push rod 709, thus converting the linear motion of the guide frame 710 into the rotational motion of the circular plate 703.

[0030] A return spring 716 is sleeved on the outer wall of the flower shaft 711 on the side away from the guide wheel 712, and the two ends of the return spring 716 are fixedly connected to the push plate 715 and the inner wall of the reference positioning frame 701, respectively. A limit plate 719 is fixedly installed at the end of the flower shaft 711 on the side of the return spring 716. The limit plate 719 can prevent the flower shaft 711 from sliding excessively.

[0031] By adopting the above technical solution, the guide wheel 712 is pressed tightly against the outer wall of the guide positioning frame 713 and the guide positioning plate 714 by the push plate 715 and the flower shaft 711 pushed by the reset spring 716.

[0032] The circular plate 703 has four arc-shaped grooves 717 arranged in a ring array. The inner wall of the reference positioning frame 701 is fixedly installed with a fixing rod 718 that cooperates with the arc-shaped grooves 717, and the fixing rod 718 slides in the arc-shaped grooves 717.

[0033] By adopting the above technical solution, the circular plate 703 can rotate stably under the guidance of the fixed rod 718 and the arc groove 717, effectively improving the rotational stability.

[0034] Working Principle: In the initial state of actual production, the No. 1 loading platform 4 is located at the loading and unloading station, and the No. 2 loading platform 5 is located at the welding station. The operator places a set of eight chip shells to be packaged (the shells can be metal or ceramic shells depending on actual production needs) and a metal cover plate in sequence at the corresponding air hole 801 position of the positioning table 702 in the No. 1 loading platform 4. Then, the operator controls the start of the servo motor 903, which drives the lead screw 901 to rotate, causing the sliding block 902 and the No. 1 loading platform 4 to move towards the welding machine body 10. At the same time, the synchronous wheel transmission group 608 drives the No. 2 loading platform 5 to move synchronously in the opposite direction, realizing the alternation of the two stations. During the movement of loading platform 4 and loading platform 5, the two guide wheels 712 slide along the outer walls of the corresponding guide positioning frame 713 and guide positioning plate 714 respectively. When the guide wheel 712 moves to the middle, it is pushed after contacting the trapezoidal block. It drives the guide frame 710 to slide in the reference positioning frame 701 through the flower shaft 711. When the guide frame 710 moves, the guide pin in its groove pushes the push rod 709, which drives the circular plate 703 to rotate. The inclined groove 704 on the circular plate 703 drives the guide shaft 705 and the moving block 706 to slide radially and synchronously towards the center. This causes the positioning rod 707 to retract towards the center along the straight groove 708, thus completing the automatic centering and positioning of the metal cover plate and the chip metal shell. After positioning is completed, vacuum pump 805 starts, and vacuum is drawn through the air holes 801 on positioning stage 702 through first flow divider 803, second flow divider 804 and air guide channel 802, so that the chip shell is stably adsorbed on positioning stage 702, avoiding displacement during subsequent welding process. When first loading platform 4 moves to the welding station of welding machine body 10, drive component 9 stops, triggers welding process, welding machine body 10 starts, heat source is applied to the bonding part of metal cover plate and chip shell for heating welding, so that the two form a strong and sealed connection structure, and the sealing and encapsulation is completed. At the same time, second loading platform 5 moves to loading and unloading station, and the operator can remove the encapsulated chip and place new workpiece to be encapsulated, realizing synchronous operation of welding and loading and unloading. During the movement of the No. 2 loading platform 5, with the guidance of the guide frame 604 and the pulley 605, it completes the action process of first moving horizontally, then moving downward, continuing to move horizontally for a distance, and finally rising to reset and resume horizontal movement along the guide groove 606. During the horizontal movement, it avoids the movement path of the No. 1 loading platform 4.

[0035] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A semiconductor chip encapsulation mechanism, comprising a frame (1), characterized in that: The bottom and middle parts of the frame (1) are respectively fixedly installed with a base plate (2) and a base plate (3). The base plate (3) and the surface of the base plate (2) are respectively slidably installed with a first loading platform (4) and a second loading platform (5) via slide rails. The base plate (2) is provided with a station alternation component (6) that works in conjunction with the first loading platform (4) and the second loading platform (5). The top and middle of the first loading platform (4) and the second loading platform (5) are both provided with a synchronous positioning component (7). The synchronous positioning component (7) is provided with a vacuum adsorption component (8). A drive component (9) is provided on one side of the surface of the base plate (3). The top side of the frame (1) is provided with a welding machine body (10). The synchronous positioning component (7) includes a reference positioning frame (701). Two reference positioning frames (701) are respectively fixedly installed in the middle of the table surface of the corresponding No. 1 loading platform (4) and No. 2 loading platform (5) by bolts. A positioning platform (702) is fixedly installed on the inner wall of the reference positioning frame (701). Eight symmetrically distributed circular plates (703) are rotatably installed on the bottom of the inner wall of the reference positioning frame (701). Four inclined grooves (704) are opened on the circular plates (703). A guide shaft (705) is slidably installed in the inclined groove (704). A moving block (706) is fixedly installed at the top of the guide shaft (705). The moving block (706) is slidably connected to the bottom of the positioning platform (702). Two symmetrically distributed positioning rods (707) are fixedly installed at the top of the moving block (706). A straight groove (708) is opened on the positioning platform (702) to cooperate with the positioning rods (707). The positioning rods (707) slide in the straight groove (708).

2. The semiconductor chip encapsulation mechanism as described in claim 1, characterized in that, The alternating work station component (6) includes two symmetrically distributed support plates (601) and guide plates (602). The two support plates (601) are respectively located on both sides of the guide plate (602), and the support plates (601) and guide plates (602) are both fixedly installed on the bottom plate (2). The top of the support plate (601) is slidably mounted with a movable table (603) that works in conjunction with the second loading platform (5) via a slide rail. Guide columns (607) are fixedly installed at the four corners of the bottom surface of the second loading platform (5), and the guide columns (607) are vertically slidably mounted on the movable table (603).

3. The semiconductor chip encapsulation mechanism as described in claim 1, characterized in that, The vacuum adsorption assembly (8) includes eight air holes (801), which are respectively opened on the positioning platform (702) and are located at the axis of the circular plate (703). The positioning platform (702) is provided with a guide channel (802) that cooperates with the corresponding air holes (801), and the air holes (801) and the guide channel (802) are connected in a continuous manner. Two symmetrically distributed No. 1 diversion frames (803) are fixedly installed on one side of the outer wall of the reference positioning frame (701). 803) The air inlet end is connected to the corresponding air guide channel (802) respectively. The No. 1 feeding platform (4) and the No. 2 feeding platform (5) are both fixedly installed with the No. 2 diversion frame (804) on one side of the platform. The two air inlet ends of the No. 2 diversion frame (804) are connected to the exhaust end of the corresponding No. 1 diversion frame (803) respectively. The top of the bottom plate (2) is fixedly installed with a vacuum pump (805) on the side near the No. 1 diversion frame (803), and the two suction ends of the vacuum pump (805) are connected to the exhaust end of the corresponding No. 1 diversion frame (803) respectively.

4. The semiconductor chip encapsulation mechanism as described in claim 1, characterized in that, The drive assembly (9) includes a lead screw (901), which is rotatably mounted on the side of the base plate (3) away from the vacuum pump (805) via a bearing seat. A sliding block (902) is threaded on the outer wall of the lead screw (901), and the sliding block (902) is fixedly connected to one side of the first loading platform (4) via a support plate. A servo motor (903) is fixedly mounted on the side of the base plate (3) near the lead screw (901) via a support, and the drive end of the servo motor (903) is connected to the lead screw (901) via a coupling.

5. The semiconductor chip encapsulation mechanism as described in claim 1, characterized in that, The substrate (3) is provided with a synchronous wheel transmission group (608) on the side away from the lead screw (901), and the second loading platform (5) and the station alternation component (6) are respectively fixedly connected to the synchronous belt in the synchronous wheel transmission group (608) through the support plate.

6. The semiconductor chip encapsulation mechanism as described in claim 2, characterized in that, The guide plate (602) has a guide groove (606), and a guide frame (604) is fixedly installed at the bottom center of the second loading platform (5). A pulley (605) is rotatably installed at the bottom of the guide frame (604), and the pulley (605) slides in the guide groove (606).

7. The semiconductor chip encapsulation mechanism as described in claim 1, characterized in that, A guide frame (710) is slidably provided in the reference positioning frame (701). Push plates (715) are fixedly installed at both ends of the guide frame (710). A flower shaft (711) is fixedly installed in the middle of the outer wall of the push plate (715). The flower shaft (711) is slidably connected to the middle of the reference positioning frame (701) through a spline. A guide wheel (712) is rotatably installed at the end of the flower shaft (711) on one side of the lead screw (901). The base plate (3) is located on the side near the lead screw (901). Each of the first loading platform (4) and the second loading platform (5) is fixedly installed with a guide positioning frame (713) and a guide positioning plate (714) for use in conjunction with each other. The guide wheels (712) in the first loading platform (4) and the second loading platform (5) slide on the outer wall of the corresponding guide positioning frame (713) and guide positioning plate (714), respectively. Two symmetrically distributed trapezoidal blocks are fixedly installed in the middle of the outer wall of the guide positioning frame (713) and the guide positioning plate (714).

8. The semiconductor chip encapsulation mechanism as described in claim 1, characterized in that, A push rod (709) is fixedly installed on the side of the circular plate (703) near the guide frame (710). A guide pin is fixedly installed at the end of the push rod (709). A sliding groove is provided in the guide frame (710) to cooperate with the guide pin, and the guide pin slides in the sliding groove.

9. The semiconductor chip encapsulation mechanism as described in claim 7, characterized in that, A reset spring (716) is sleeved on the outer wall of the flower shaft (711) on the side away from the guide wheel (712), and the two ends of the reset spring (716) are fixedly connected to the inner wall of the push plate (715) and the reference positioning frame (701), respectively. A limit plate (719) is fixedly installed at the end of the flower shaft (711) on the side of the reset spring (716).

10. The semiconductor chip encapsulation mechanism as described in claim 1, characterized in that, The circular plate (703) has four arc-shaped grooves (717) arranged in a ring array. The inner wall of the reference positioning frame (701) is fixedly installed with a fixing rod (718) that cooperates with the arc-shaped grooves (717), and the fixing rod (718) slides in the arc-shaped grooves (717).

Images