A semiconductor device support base with heat sink

Abstract

This utility model relates to the field of support bases, and more particularly to a semiconductor device support base with heat sink. It includes a support base body, a top plate mounted on the upper surface of the support base body, an adjustment structure on the inner wall of the top plate, the adjustment structure including a turntable, the turntable being rotatably connected to the top plate, a plurality of connecting grooves on the upper surface of the turntable, connecting columns slidably connected to the inner walls of the connecting grooves, a positioning plate fixedly connected to the upper surface of the connecting columns, an auxiliary disk rotatably connected to the lower surface of the turntable, a plurality of sliding grooves on the upper surface of the auxiliary disk, the sliding grooves being slidably connected to the connecting columns, and a rotating ring rotatably connected to the lower surface of the support base body. The semiconductor device support base with heat sink provided by this utility model has the advantage of being able to fix and clamp semiconductor devices of different sizes and volumes, ensuring that the equipment is stable and does not shift during operation, greatly enhancing its flexibility.

Description

Technical Field

[0001] This utility model relates to the field of support bases, and more particularly to a semiconductor device support base with heat sink. Background Technology

[0002] Semiconductor devices typically have heat sinks installed inside to increase the heat exchange area and improve heat dissipation efficiency. In practical applications, semiconductor devices are generally used in conjunction with support bases. Support bases are a crucial component in semiconductor devices, used to support and fix different parts of the device to ensure its stability and accuracy during operation. Semiconductor devices often need to withstand complex working environments and high-precision operations, and the design and material selection of the support base directly affect the performance and lifespan of the device.

[0003] Existing technologies, such as the utility model patent with publication number CN214274958U, disclose a support base, which includes a vertical column, a load-bearing structure, and a clamping structure. The vertical column comprises an outer tube and a telescopic tube, the telescopic tube being telescopically disposed within the outer tube; the load-bearing structure is linked to the telescopic tube and connected to the electronic device; the clamping structure includes a stop sleeve and a locking member. The stop sleeve is fitted over the telescopic tube and has an interference section, while the locking member has a clamping plate sandwiched between the outer tube and the stop sleeve. When an external force is applied to rotate the locking member, the clamping plate rotates accordingly, pushing against the interference section of the stop sleeve. The interference section interferes with the telescopic tube, thus restricting the telescopic tube's extension and retraction relative to the outer tube.

[0004] In daily use, it has been found that when using a support base to fix semiconductor devices, the support base is usually used in conjunction with the semiconductor device and installed by fixing it with screws. However, this fixing method limits the support base's adaptability to semiconductor devices of different sizes and volumes, resulting in a lack of sufficient flexibility in practical applications and an inability to meet diverse equipment needs and the requirement for rapid adjustment.

[0005] Therefore, it is necessary to provide a new type of semiconductor device support with heat sink to solve the above-mentioned technical problems. Utility Model Content

[0006] The purpose of this invention is to address the problem that in the existing technology, when using a support base to fix semiconductor devices, the support base is usually used in conjunction with the semiconductor device and installed by fixing it with screws. However, this fixing method limits the adaptability of the support base to semiconductor devices of different sizes and volumes, resulting in a lack of sufficient flexibility in practical applications and an inability to meet diverse equipment needs and the requirement for rapid adjustment. Therefore, this invention proposes a semiconductor device support base with a heat sink.

[0007] To solve the above-mentioned technical problems, this utility model provides a semiconductor device support base with heat sink, comprising: a support base body, a top plate mounted on the upper surface of the support base body, an adjustment structure provided on the inner wall of the top plate, the adjustment structure including a turntable, the turntable and the top plate being rotatably connected, a plurality of connecting grooves being formed on the upper surface of the turntable, connecting columns being slidably connected to the inner wall of the connecting grooves, a positioning plate being fixedly connected to the upper surface of the connecting columns, an auxiliary disk being rotatably connected to the lower surface of the turntable, a plurality of sliding grooves being formed on the upper surface of the auxiliary disk, the sliding grooves being slidably connected to the connecting columns, a rotating ring being rotatably connected to the lower surface of the support base body, a fixing frame being fixedly connected to the upper surface of the rotating ring, a servo motor being fixedly connected to the upper surface of the fixing frame, and the output end of the servo motor being fixedly connected to the auxiliary disk.

[0008] The effect achieved by the above components is that, by setting an adjustment structure, semiconductor devices of different sizes can be fixedly clamped, ensuring that the devices are stable and do not shift during operation, greatly enhancing their flexibility.

[0009] Preferably, a soft pad, which is a rubber pad, is fixedly connected to one side of the positioning plate.

[0010] The effect achieved by the above components is that the soft pad can prevent the positioning plate from directly contacting the semiconductor equipment, thus preventing wear and tear on the semiconductor equipment.

[0011] Preferably, a limiting rod is fixedly connected to the inner wall of the connecting groove, and the limiting rod and the connecting column are slidably connected.

[0012] The effect achieved by the above components is that the limiting rod can limit the connecting column, preventing the connecting column from shifting during movement.

[0013] Preferably, the servo motor is fitted with a protective cover, and the protective cover and the fixing frame are fixedly connected.

[0014] The effect achieved by the above components is that the protective cover can protect the servo motor and prevent dust and other debris from entering the servo motor.

[0015] Preferably, the upper surface of the turntable is provided with an auxiliary structure, the auxiliary structure including a positioning frame, the positioning frame being fixedly connected to the turntable, a screw being rotatably connected to the inner wall of the positioning frame, a limit plate being fixedly connected to the arc surface of the screw, an arc rod being fixedly connected to the lower surface of the limit plate, a fixing plate being threadedly connected to the arc surface of the screw, the center of the arc rod coinciding with the axis of the screw, and a plurality of fixing holes being provided on the upper surface of the top plate, the size of the fixing holes being adapted to the size of the arc rod.

[0016] The effect achieved by the above components is that by setting up auxiliary structures, semiconductor devices can be easily rotated in multiple directions to adapt to different spatial layouts, avoid occupying too much workspace, and help improve the utilization rate of the overall working environment.

[0017] Preferably, the arc surface of the fixing plate is provided with anti-slip texture, and the anti-slip texture is evenly distributed on the fixing plate.

[0018] The effect achieved by the above components is that the anti-slip texture increases the friction of the fixed plate, preventing the hands from slipping when the fixed plate is rotated.

[0019] Preferably, a pull ring is fixedly connected to one side of the limiting plate, and the pull ring has a circular cross-section.

[0020] The effect achieved by the above components is that the pull ring can drive the limit plate to rotate, thus facilitating the control of the limit plate.

[0021] Compared with related technologies, the semiconductor device support base with heat sink provided by this utility model has the following advantages:

[0022] This invention provides a semiconductor device support base with heat sink. By setting an adjustment structure, it can accurately fix and clamp semiconductor devices of different sizes and volumes, ensuring that the device is stable and does not shift during operation, effectively improving the stability and flexibility of the device fixation.

[0023] By setting up auxiliary structures, semiconductor devices can rotate flexibly in multiple directions, optimize spatial layout, reduce floor space, thereby improving the space utilization of the working environment and enhancing operational convenience. Attached Figure Description

[0024] Figure 1 A schematic diagram of the structure of a semiconductor device support base with heat sink provided by this utility model;

[0025] Figure 2 for Figure 1 The diagram shows the structural schematic of the adjustment structure.

[0026] Figure 3 for Figure 2 A partial structural schematic diagram of the adjustment structure shown;

[0027] Figure 4 for Figure 1 The diagram shows the structure of the auxiliary structure.

[0028] Figure 5 for Figure 1 A partial structural diagram of the auxiliary structure shown;

[0029] Figure 6for Figure 5 Enlarged diagram of point A.

[0030] The following are the labeling elements in the diagram: 1. Support base body; 2. Top plate; 3. Adjustment structure; 301. Turntable; 302. Connecting groove; 303. Connecting column; 304. Positioning plate; 305. Auxiliary plate; 306. Slide groove; 307. Rotary ring; 308. Fixing frame; 309. Servo motor; 310. Soft pad; 311. Limiting rod; 312. Protective cover; 4. Auxiliary structure; 41. Positioning frame; 42. Screw; 43. Limiting plate; 44. Arc rod; 45. Fixing plate; 46. Pull ring; 47. Fixing hole; 48. Anti-slip texture. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0032] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0033] Please see Figures 1 to 6 The present invention provides a semiconductor device support base with heat sink, comprising: a support base body 1, a top plate 2 mounted on the upper surface of the support base body 1, an adjustment structure 3 provided on the inner wall of the top plate 2, and an auxiliary structure 4 provided on the upper surface of the turntable 301.

[0034] In the embodiments of this utility model, please refer to Figure 2 and Figure 3The adjustment structure 3 includes a turntable 301, which is rotatably connected to the top plate 2. The upper surface of the turntable 301 has several connecting grooves 302, and connecting columns 303 are slidably connected to the inner walls of the connecting grooves 302. A positioning plate 304 is fixedly connected to the upper surface of the connecting columns 303. An auxiliary disk 305 is rotatably connected to the lower surface of the turntable 301. Several sliding grooves 306 are formed on the upper surface of the auxiliary disk 305, and the sliding grooves 306 are slidably connected to the connecting columns 303. A rotating ring 307 is rotatably connected to the lower surface of the support base body 1. A fixed frame 308 is fixedly connected to the upper surface of the rotating ring 307, and a servo motor 309 is fixedly connected to the upper surface of the fixed frame 308. The output end of the servo motor 309 is fixedly connected to the auxiliary disk 305. By setting the adjustment structure 3, semiconductor devices of different sizes and volumes can be adjusted. The fixed clamping ensures that the equipment is stable and does not shift during operation, greatly enhancing its flexibility. A soft pad 310 is fixedly connected to one side of the positioning plate 304. The soft pad 310 is a rubber pad, which can prevent the positioning plate 304 from directly contacting the semiconductor equipment and avoid wear on the semiconductor equipment. A limit rod 311 is fixedly connected to the inner wall of the connecting groove 302. The limit rod 311 and the connecting column 303 are slidably connected. The limit rod 311 can limit the connecting column 303 and prevent the connecting column 303 from shifting during movement. A protective cover 312 is fitted on the outside of the servo motor 309. The protective cover 312 is fixedly connected to the fixing frame 308. The protective cover 312 can protect the servo motor 309 and prevent dust and other debris from entering the servo motor 309.

[0035] In the embodiments of this utility model, please refer to Figures 4 to 6 The auxiliary structure 4 includes a positioning frame 41, which is fixedly connected to a turntable 301. A screw 42 is rotatably connected to the inner wall of the positioning frame 41. A limit plate 43 is fixedly connected to the arc surface of the screw 42. An arc rod 44 is fixedly connected to the lower surface of the limit plate 43. A fixing plate 45 is threadedly connected to the arc surface of the screw 42. The center of the arc rod 44 coincides with the axis of the screw 42. Several fixing holes 47 are provided on the upper surface of the top plate 2. The size of the fixing holes 47 and the arc rod 44 are adapted to each other. By setting the auxiliary structure 4, semiconductor equipment can be easily inserted into the machine. The device can rotate in multiple directions to adapt to different spatial layouts, avoiding excessive occupation of workspace and helping to improve the utilization rate of the overall work environment. The arc surface of the fixed plate 45 is provided with anti-slip texture 48, which is evenly distributed on the fixed plate 45. The anti-slip texture 48 can increase the friction of the fixed plate 45 and prevent the personnel from slipping their hands when rotating the fixed plate 45. A pull ring 46 is fixedly connected to one side of the limiting plate 43. The pull ring 46 has a circular cross section and can drive the limiting plate 43 to rotate, achieving the effect of convenient control of the limiting plate 43.

[0036] The working principle of the semiconductor device support base with heat sink provided by this utility model is as follows: By setting the adjustment structure 3, the semiconductor device is first placed on the turntable 301, and then the auxiliary structure 4 keeps the turntable 301 in a fixed position. Next, the rotating ring 307 is held by hand to prevent it from rotating. Then, the servo motor 309 on the fixed frame 308 is started, so that the servo motor 309 drives the auxiliary disk 305 to rotate. When the auxiliary disk 305 rotates, it will drive the connecting column 303 to slide in the slide groove 306. At the same time, the connecting column 303 will also move along the connecting plate of the turntable 301. The connecting post 303 moves within the slot 302, and as it moves, it drives the positioning plate 304 to move until the positioning plate 304 is fixed and limited to the semiconductor device. The soft pad 310 can prevent the positioning plate 304 from directly contacting the semiconductor device, thus preventing wear on the semiconductor device. The limiting rod 311 can limit the connecting post 303, preventing it from shifting during movement. The protective cover 312 can protect the servo motor 309, preventing dust and other debris from entering the servo motor 309.

[0037] By setting the auxiliary structure 4, the turntable 301 is first rotated inside the top plate 2. When the turntable 301 rotates, it will drive the semiconductor equipment to rotate. After the rotation is completed, the limiting plate 43 is rotated with the help of the pull ring 46, so that the limiting plate 43 drives the screw 42 to rotate inside the positioning frame 41 until the limiting plate 43 drives the arc rod 44 to insert into the fixing hole 47 of the top plate 2 on the support body 1. Then, the fixing plate 45 is rotated with the help of the anti-slip texture 48, so that the fixing plate 45 is fixed to the positioning frame 41. At this time, the fixing of the turntable 301 is completed. The anti-slip texture 48 can increase the friction of the fixing plate 45 and prevent the personnel from slipping their hands when rotating the fixing plate 45.

[0038] The circuits and controls involved in this utility model are all existing technologies, and will not be described in detail here.

[0039] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A heat sink-equipped semiconductor device support base, characterized by comprising: include: A support body (1) is provided, and a top plate (2) is installed on the upper surface of the support body (1). An adjustment structure (3) is provided on the inner wall of the top plate (2). The adjustment structure (3) includes a turntable (301). The turntable (301) and the top plate (2) are rotatably connected. A plurality of connecting grooves (302) are opened on the upper surface of the turntable (301). A connecting column (303) is slidably connected to the inner wall of the connecting groove (302). A positioning plate (304) is fixedly connected to the upper surface of the connecting column (303). The turntable (301) The lower surface of the support base body (1) is rotatably connected to an auxiliary disk (305). The upper surface of the auxiliary disk (305) is provided with several sliding grooves (306). The sliding grooves (306) and the connecting column (303) are slidably connected. The lower surface of the support base body (1) is rotatably connected to a rotating ring (307). The upper surface of the rotating ring (307) is fixedly connected to a fixing frame (308). The upper surface of the fixing frame (308) is fixedly connected to a servo motor (309). The output end of the servo motor (309) is fixedly connected to the auxiliary disk (305).

2. The finned semiconductor device support of claim 1, wherein: A soft pad (310) is fixedly connected to one side of the positioning plate (304), and the soft pad (310) is a rubber pad.

3. The finned semiconductor device support of claim 1 wherein, A limiting rod (311) is fixedly connected to the inner wall of the connecting groove (302), and the limiting rod (311) and the connecting column (303) are slidably connected.

4. The finned semiconductor device support of claim 1 wherein, The servo motor (309) is covered with a protective cover (312), and the protective cover (312) and the fixing frame (308) are fixedly connected.

5. A semiconductor device support base with heat sink according to claim 1, characterized in that, The upper surface of the turntable (301) is provided with an auxiliary structure (4), which includes a positioning frame (41). The positioning frame (41) and the turntable (301) are fixedly connected. The inner wall of the positioning frame (41) is rotatably connected with a screw (42). The arc surface of the screw (42) is fixedly connected with a limiting plate (43). The lower surface of the limiting plate (43) is fixedly connected with an arc rod (44). The arc surface of the screw (42) is threadedly connected with a fixing plate (45). The center of the arc rod (44) coincides with the axis of the screw (42). The upper surface of the top plate (2) is provided with several fixing holes (47). The size of the fixing holes (47) and the arc rod (44) are compatible.

6. The finned semiconductor device support of claim 5 wherein, The arc surface of the fixed plate (45) is provided with anti-slip texture (48), which is evenly distributed on the fixed plate (45).

7. The finned semiconductor device support of claim 5 wherein: A pull ring (46) is fixedly connected to one side of the limiting plate (43), and the pull ring (46) has a circular cross-section.

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