A rotary clamping module for wafer transfer
By designing a rotating hand-holding module and using a servo motor-driven transmission system, the automated hand-holding and position adjustment of wafers are achieved, solving the problems of low efficiency and contamination in traditional methods, reducing costs and simplifying maintenance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- VISINO TECH (XIAMEN) CO LTD
- Filing Date
- 2026-02-09
- Publication Date
- 2026-06-02
AI Technical Summary
Traditional wafer transfer methods are inefficient and prone to introducing particulate contamination. High-precision robotic arms are expensive to configure and complex to debug, making them difficult to promote in single-process-cavity equipment.
Design a rotating gripping module that includes a gripping robot, a rotating component, and a lifting component. The module uses a servo motor to drive the transmission wheel and transmission belt to achieve automated gripping and position adjustment of the wafer, avoiding manual contact.
It has enabled automated and pollution-free wafer transfer, improved production efficiency, reduced equipment costs, and simplified maintenance procedures.
Smart Images

Figure CN122138663A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to auxiliary equipment for the wafer manufacturing process, and more particularly to a transport module for wafer hand-holding and transfer. Background Technology
[0002] In the semiconductor wafer manufacturing industry, single-process-cavity equipment typically requires a transfer cavity to achieve pressure isolation between the process cavity and the external environment.
[0003] Traditional single-process-cavity equipment relies heavily on manual handling to feed wafers into or remove them from the transfer cavity. This operation is not only inefficient but also prone to introducing particulate contamination. Furthermore, the large positional deviations caused by manual placement can significantly affect wafer yield.
[0004] Although large-scale equipment integrating multiple process cavities uses high-precision robotic arms, its configuration cost is high and the debugging and maintenance process is complex, making it difficult to promote its application in single-process-cavity equipment. Summary of the Invention
[0005] To address the aforementioned problems, this invention provides a rotary hand-holding module for wafer transfer, which solves the hand-holding transfer requirement in the wafer manufacturing process.
[0006] To solve the above-mentioned technical problems, the technical solution adopted by the invention is: a rotating interlocking module for wafer transfer, including a rack body, an interlocking robot, a rotating assembly mounted on the upper end plate of the rack body, and a lifting assembly mounted on the side end plate of the rack body. The interlocking robot, the rotating assembly, and the lifting assembly are sequentially provided with a first connector, a second connector, and a third connector. Guide posts are connected in series between the interlocking robot, the rotating assembly, and the lifting assembly. The rotating assembly also includes a first rotating disk that mates with the second connector, a rotating transmission assembly, and a first servo motor. The rotating transmission assembly includes a first main transmission wheel that is coupled to the first servo motor, a first transmission belt, and a first transmission wheel that mates with the second connector. The first servo motor is coupled to the first main transmission wheel and has a detection wheel extending from its shaft. That is, the shaft passes through the upper end plate, the detection wheel is located on the upper end surface of the upper end plate, and is equipped with a rotation sensor. The lifting assembly also includes a second servo motor, a lifting transmission assembly, a second rotary disk cooperating with a third connector, and a lifting frame. The second rotary disk is fixed to the upper end of the lifting frame. The lifting transmission assembly is located on one side of the lifting frame and includes a second main transmission wheel, a second transmission belt, and a second transmission wheel that are coupled to the second servo motor. The second transmission belt has a transmission block that connects to the lifting frame. The frame body has an auxiliary side plate on the other side away from the lifting transmission assembly. The auxiliary side plate has two sets of lifting limit switches and a slide rail that cooperates with the lifting frame. The lifting frame has a lifting limit rod that cooperates with the lifting limit switches and a slider that cooperates with the slide rail.
[0007] Furthermore, a bearing is provided between the second connector and the first rotating disk, and a bearing is provided between the third connector and the second rotating disk.
[0008] Furthermore, the first connector at the bottom of the grasping robot and the second connector on the lifting assembly are located at the upper and lower ends of the guide post, respectively, and the third connector on the rotating assembly is located in the middle section of the guide post.
[0009] Furthermore, the upper plate is also equipped with a limiter, which includes a limit plate and a limit rod installed on the limit plate. The limit rod is positioned above the second connector along the tangential direction of the robot's rotation, and the second connector is equipped with a rotary limit switch that cooperates with the limit rod.
[0010] Furthermore, the interlocking robot is a dual-station robot.
[0011] As can be seen from the above description of the invention structure, compared with the prior art, the invention has the following advantages: it is suitable for the hand-to-hand transfer process required in the wafer production process, and the height and transfer direction can be adjusted by the lifting component and the rotating component, which can transfer the wafer in a timely manner without manual touch and avoid wafer contamination. Attached Figure Description
[0012] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the invention; Figure 2 A three-dimensional structural diagram of the invention; Figure 3 This is a side view schematic diagram of the invention; Figure 4 This is a cross-sectional structural diagram of the invention; Figure 5 A partial structural diagram of the lifting component of the invention; Figure 6 This is a schematic diagram of the upper end plate structure of the invention. Detailed Implementation
[0013] To make the objectives, technical solutions, and advantages of the invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Example
[0014] refer to Figures 1-6A rotating hand-holding module for wafer transfer, suitable for hand-holding transfer required in wafer production process, includes a frame body, a hand-holding robot 1, a rotating assembly mounted on the upper end plate of the frame body, and a lifting assembly mounted on the side end plate of the frame body. The clasping manipulator, the rotating component, and the lifting component are sequentially provided with a first connector 2, a second connector 3, and a third connector 4. A guide post 5 is connected in series between the clasping manipulator 1, the rotating component, and the lifting component. The first connector 2 at the bottom of the clasping manipulator 1 and the second connector 3 at the lifting component are located at the upper and lower ends of the guide post, respectively. The third connector 4 at the rotating component is located in the middle section of the guide post. The rotating assembly also includes a first rotating disk 6 that mates with the second connector, a rotating transmission assembly, and a first servo motor 7. The rotating transmission assembly includes a first main transmission wheel 11 that is coupled to the first servo motor, a first transmission belt 12, and a first transmission wheel 13 that mates with the second connector. The first servo motor 7 is coupled to the first main transmission wheel 11 and has a detection wheel 14 extending from its shaft. That is, the shaft passes through the upper end plate, the detection wheel 14 is located on the upper end surface of the upper end plate, and is equipped with a rotation sensor 15. The lifting assembly also includes a second servo motor 8, a lifting transmission assembly, a second rotary disk 9 that cooperates with a third connector, and a lifting frame 10. The second rotary disk 9 is fixed to the upper end of the lifting frame 10. The lifting transmission assembly is located on one side of the lifting frame 10 and includes a second main drive wheel 20, a second drive belt 21, and a second drive wheel 22 that are coupled to the second servo motor. The second drive belt 21 is provided with a drive block 23 that connects to the lifting frame. The frame body is provided with an auxiliary side plate 24 on the other side away from the lifting transmission assembly. The auxiliary side plate is provided with two sets of lifting limit switches 25 and a slide rail 26 that cooperates with the lifting frame. The lifting frame is provided with a lifting limit rod 27 that cooperates with the lifting limit switches and a slider 28 that cooperates with the slide rail.
[0015] A bearing is provided between the second connector 3 and the first rotating disk 6, and a bearing is provided between the third connector 4 and the second rotating disk 9.
[0016] The upper plate is also equipped with a limiter, which includes a limit plate 16 and a limit rod 17 installed on the limit plate. The limit rod 17 is located above the second connector 3 along the tangential direction of the robot's rotation, and the second connector is equipped with a rotary limit switch 19 that cooperates with the limit rod.
[0017] The interlocking robot 1 is a dual-station robot.
[0018] In use, the hand-holding robot 1 is a dual-station robot, facing different process directions, and handing over wafers with robots in different positions.
[0019] The wafer is transported by a rotating assembly. The first servo motor 7 drives the first main drive wheel 11, the first drive belt 12 and the first drive wheel 13 that cooperates with the second connector to move, so that the guide post 5 rotates, that is, it drives the gripping robot 1 to rotate. The first servo motor 7 is coupled to the first main drive wheel 11 and the shaft extends to provide a detection wheel 14. That is, the shaft passes through the upper end plate, the detection wheel 14 is located on the upper end surface of the upper end plate, and is provided with a rotation sensor 15. That is, the movement of the rotating assembly can be viewed by the rotation sensor 15. During rotation, the module is set to rotate at 180°. The rotation is limited by the limiting plate 16 and the limiting rod 17 mounted on the limiting plate. The limiting rod 17 is positioned above the second connector 3 along the tangent of the robot's rotation. The second connector is equipped with a rotary limit switch 19 that cooperates with the limiting rod. The rotary limit switch 19 provides limit protection. The rotary limit switch 19 is mounted on the second connector. As the rotation occurs, it will contact the limiting rod 17 at the extreme position and then stop rotating. Furthermore, different processes may result in different levels of the wafer, which necessitates a lifting assembly. The lifting assembly includes a second servo motor 8, a second main drive wheel 20 coupled to the second servo motor, a second drive belt 21, a second drive wheel 22, a second rotating disk 9 that cooperates with a third connector, and a lifting frame 10. The second rotating disk 9 is fixed to the upper end of the lifting frame 10. The lifting transmission assembly is located on one side of the lifting frame 10. The second drive belt 21 has a transmission block 23 connected to the lifting frame to control the lifting of the lifting frame 10. The frame body has an auxiliary side plate 24 on the other side away from the lifting transmission assembly. The auxiliary side plate has two sets of lifting limit switches 25 and a slide rail 26 that cooperates with the lifting frame. The lifting frame has a lifting limit rod 27 that cooperates with the lifting limit switches and a slider 28 that cooperates with the slide rail to improve the stability of the lifting transmission assembly during ascent.
Claims
1. A rotary hand-holding module for wafer transfer, suitable for hand-holding transfer required in wafer manufacturing processes, comprising a frame body, characterized in that: It also includes a gripping manipulator (1), a rotating assembly mounted on the upper end plate of the frame body, and a lifting assembly mounted on the side end plate of the frame body. The gripping manipulator, the rotating assembly, and the lifting assembly are provided with a first connector (2), a second connector (3), and a third connector (4) in sequence. A guide post (5) is connected in series between the gripping manipulator (1), the rotating assembly, and the lifting assembly. The rotating assembly also includes a first rotating disk (6) that cooperates with the second connector, a rotating transmission assembly, and a first servo motor (7). The lifting assembly also includes a second servo motor (8), a lifting transmission assembly, a second rotating disk (9) that cooperates with the third connector, and a lifting frame (10). The second rotating disk (9) is fixed on the upper end of the lifting frame (10).
2. The rotary interlocking module for wafer transfer according to claim 1, characterized in that: A bearing is provided between the second connector (3) and the first rotating disk (6), and a bearing is provided between the third connector (4) and the second rotating disk (9).
3. A rotary interlocking module for wafer transfer according to claim 1, characterized in that: The first connector (2) at the bottom of the hand-holding manipulator (1) and the second connector (3) at the lifting assembly are located at the upper and lower ends of the guide post, respectively. The third connector (4) at the rotating assembly is located in the middle section of the guide post.
4. A rotary interlocking module for wafer transfer according to claim 1, characterized in that: The rotary transmission assembly includes a first main drive wheel (11) coupled to the first servo motor, a first drive belt (12) and a first drive wheel (13) cooperating with the second connector. The first servo motor (7) is coupled to the first main drive wheel (11) and the shaft extends to provide a detection wheel (14), that is, the shaft passes through the upper end plate. The detection wheel (14) is located on the upper end surface of the upper end plate and is provided with a rotation sensor (15).
5. A rotary interlocking module for wafer transfer according to claim 4, characterized in that: The upper end plate is also provided with a limiter, which includes a limit plate (16) and a limit rod (17) installed on the limit plate. The limit rod (17) is located above the second connector (3) along the tangential direction of the robot's rotation, and the second connector is provided with a rotary limit switch (19) that cooperates with the limit rod.
6. A rotary interlocking module for wafer transfer according to claim 1, characterized in that: The lifting transmission assembly is located on one side of the lifting frame (10), including a second main transmission wheel (20) coupled to the second servo motor, a second transmission belt (21) and a second transmission wheel (22). The second transmission belt (21) is provided with a transmission block (23) connected to the lifting frame.
7. A rotary interlocking module for wafer transfer according to claim 1, characterized in that: The frame body is provided with an auxiliary side plate (24) on the side away from the lifting transmission assembly. The auxiliary side plate is provided with two sets of lifting limit switches (25) and a slide rail (26) that cooperates with the lifting frame. The lifting frame is provided with a lifting limit rod (27) that cooperates with the lifting limit switch and a slider (28) that cooperates with the slide rail.
8. A rotary interlocking module for wafer transfer according to claim 1, characterized in that: The interlocking manipulator (1) is a dual-station manipulator.