A new pin full-exposed power diode package forming method

Abstract

This invention belongs to the field of diode packaging technology, specifically a novel method for packaging and forming a power diode with fully exposed leads. The method includes step one: die bonding. The chip is placed in a mold pit on a carrier stage with an independent vacuum negative pressure device, with the negative terminal facing upwards and the positive terminal downwards. The independent vacuum negative pressure device ensures close contact between the chip and the carrier stage, improving bonding accuracy and efficiency. By modifying the design of the graphite carrier stage and the die bonding arm, reverse die bonding on the wafer can be achieved, exposing all packaging leads and laying the foundation for subsequent top heat dissipation design. This novel method for packaging and forming a power diode with fully exposed leads involves setting up a lead-cutting machine. An electric suction cup adsorbs the wafer on the conveyor stage, driving the wafer to perform X, Y, and Z axis movement and rotation. The center distance of the detection field of multiple vision sensors corresponds one-to-one with the positioning pin distance of the mold under the lead-cutting unit of the frame.

Description

Technical Field

[0001] This invention relates to the field of diode packaging technology, and in particular to a novel method for packaging power diodes with fully exposed leads. Background Technology

[0002] Diode packaging is the process of encapsulating a bare, fragile semiconductor chip with specific materials and methods, making it a robust, reliable, easy-to-install, and easy-to-use electronic component.

[0003] In existing technologies, although the pins of traditional packages can help dissipate heat, they are usually partially or completely encased in molding compound, resulting in a small contact area with air and low heat dissipation efficiency. Furthermore, after molding, multiple packages are connected to a long strip of lead frame sheet. During lead cutting, the sheet is not in the same position on the conveying mechanism, causing the sheet to deviate significantly when entering the mold, thus affecting the cutting accuracy. Summary of the Invention

[0004] In the prior art, traditional packaging is partially or completely encapsulated in molding compound, resulting in a small contact area with air, low heat dissipation efficiency, and inconsistent positions of the die on the conveying mechanism during lead cutting, causing serious deviation of the die position when entering the mold, thus affecting the cutting accuracy. This invention proposes a novel method for packaging and molding power diodes with fully exposed leads.

[0005] This invention proposes a novel method for packaging and molding power diodes with fully exposed leads, including step one: die bonding: placing the chip in a mold pit on a carrier stage with an independent vacuum negative pressure device, with the negative terminal of the chip facing up and the positive terminal facing down. The independent vacuum negative pressure device ensures that the chip is in close contact with the carrier stage, improving the die bonding accuracy and efficiency. By changing the design of the graphite carrier stage and die bonding swing arm, reverse die bonding on the wafer can be achieved, making the package leads fully exposed, laying the foundation for subsequent top heat dissipation design. Step 2: Welding: Place the die-bonded carrier stage in the welding furnace and set up a gas concentration detection device. When the gas concentration exceeds the standard, the exhaust device is turned on simultaneously to quickly adjust the gas in the furnace to a suitable nitrogen and oxygen concentration to ensure welding quality. The welding furnace is heated to melt the solder between the chip and the carrier stage and form a solder joint, so that the chip and the carrier stage are reliably connected together. Step 3: Molding: Place the welded carrier in a molding machine and use a mold to form an exposed window on the top of the package, so that the top surface of the diode chip or the heat-conducting component connected to the upper electrode of the diode is exposed at the exposed window, forming a top exposed heat dissipation interface. Use the same slope demolding process for the left and right colloids to achieve demolding treatment of complex appearance. Apply pressure to the mold to form the package and ensure that the shape and size of the exposed window meet the design requirements. Step 4: Lead cutting: After molding, multiple packages are connected to a long strip of lead frame sheet. During lead cutting, the lower die of the lead cutting machine is fixed by inserting positioning pins into the positioning holes of the sheet, and the upper die is used to press down to separate the individual package from the sheet and bend the leads. Step 5: Testing: Perform electrical performance testing on the package to ensure it meets design requirements. An AOI high-definition image recognition system can be used to automatically distinguish surface foreign objects and defects, improving the accuracy and efficiency of appearance defect detection.

[0006] The present invention proposes a novel molding equipment for fully exposed lead power diode packages. The lead cutting machine in step four includes a frame with a lead cutting unit. An adjustment mechanism is provided on the upper surface of the frame. The adjustment mechanism includes an electric suction cup, which adsorbs and fixes the material sheet by vacuum adsorption.

[0007] The upper surface of the frame is provided with a conveying mechanism, which includes a conveying table. The movement of the conveying table conveys the material sheet.

[0008] Preferably, the adjustment mechanism further includes a movable motor, which is fixedly installed on the inner wall of the rear groove of the frame, and the output shaft of the movable motor is rotatably connected to the inner wall of the rear groove of the frame through a bearing seat.

[0009] Preferably, the output shaft of the mobile motor is fixedly mounted with a screw, which is rotatably connected to the inner wall of the rear groove of the frame via a bearing. A movable frame is threadedly connected to the outer surface of the screw, and the movable frame is slidably connected to the inner wall of the rear groove of the frame.

[0010] Preferably, a lifting electric push rod is fixedly installed on the top wall of the groove of the movable frame, and an L-shaped lifting frame is fixedly installed on one end of the telescopic rod of the lifting electric push rod. The lifting frame is slidably connected to the inner wall of the groove of the movable frame.

[0011] Preferably, a movable electric push rod is fixedly installed on the inner wall of the groove of the lifting frame, and an adjustment frame is fixedly installed on one end of the telescopic rod of the movable electric push rod, the adjustment frame being slidably connected to the inner wall of the groove of the lifting frame.

[0012] Preferably, a rotary motor is fixedly installed on the inner wall of the groove of the adjustment frame, the output shaft of the rotary motor is rotatably connected to the inner wall of the groove of the adjustment frame through a bearing seat, a rotary table is fixedly installed on the output shaft of the rotary motor, the rotary table is rotatably connected to the lower surface of the adjustment frame through a bearing, and the electric suction cup is fixedly installed on the lower surface of the rotary table.

[0013] Preferably, the conveying mechanism further includes vision sensors, a plurality of vision sensors are fixedly mounted on the upper surface of the base plate of the frame, the center distance of the detection field of the plurality of vision sensors corresponds one-to-one with the positioning pin distance of the lower mold of the frame cutting unit, and the conveying table is slidably connected to the electric linear guide rail of the frame.

[0014] The beneficial effects of this invention are as follows: 1. By setting step three: molding: the welded carrier is placed in a molding machine, and an exposed window is formed on the top of the package using a mold, so that the top surface of the diode chip or the heat-conducting component connected to the upper electrode of the diode is exposed at the exposed window, forming a top exposed heat dissipation interface. The left and right colloids are demolded at the same slope to achieve demolding treatment of complex appearance. The mold is pressurized to form the package, and the shape and size of the exposed window are ensured to meet the design requirements. This solves the technical problem in the existing technology that although the pins of traditional packages can assist in heat dissipation, they are usually partially or completely wrapped in plastic material, with a small contact area with air and low heat dissipation efficiency.

[0015] 2. By setting up a rebar cutting machine, a movable motor drives the screw to rotate. The screw rotation drives the movable frame to rotate and move. However, due to the sliding connection between the movable frame and the machine frame, it is limited to move only along the X-axis. This achieves the overall X-axis movement of the entire subsequent lifting and rotating substructures. The extension and retraction of the lifting electric push rod can drive the lifting frame to move smoothly up and down on the movable frame, providing linear motion of the adjustment mechanism in the Z-axis direction, thereby adjusting the height of the electric suction cup gripping the material. The extension and retraction of the movable electric push rod can drive the adjustment frame to move along the Y-axis on the lifting frame, used for fine-tuning the position of the material on the horizontal plane. The rotary motor drives the rotary table. The material is rotated to adjust its angle. An electric suction cup picks up the material from the conveyor table, causing it to move and rotate along the X, Y, and Z axes. The center distance between the detection fields of multiple vision sensors corresponds one-to-one with the positioning pin distance of the lower mold of the frame cutting unit. Precise pre-positioning ensures that the positioning hole of the material is perfectly aligned with the positioning pin of the lower mold when it enters the mold. This solves the technical problem in the prior art where, after molding, multiple packages are connected to a long strip of lead frame material. During cutting, the material is not in the same position on the conveyor mechanism, which causes the material to deviate significantly when it enters the mold, thus affecting the cutting accuracy. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a novel pin-exposed power diode packaging method proposed in this invention; Figure 2 This is a perspective view of a mobile motor structure based on a novel pin-exposed power diode packaging molding method proposed in this invention. Figure 3This is a perspective view of the vision sensor structure based on a novel pin-exposed power diode packaging molding method proposed in this invention. Figure 4 This is a perspective view of the screw structure of a novel fully exposed pin power diode packaging molding method proposed in this invention; Figure 5 This is a perspective view of the movable electric push rod structure of a novel power diode packaging molding method with fully exposed pins proposed in this invention. Figure 6 This is a perspective view of the adjustment frame structure of a novel fully exposed pin power diode packaging molding method proposed in this invention; Figure 7 This is a perspective view of the electric chuck structure of a novel power diode packaging molding method with fully exposed pins proposed in this invention.

[0017] In the diagram: 1. Frame; 2. Moving motor; 3. Screw; 31. Moving frame; 4. Lifting electric push rod; 41. Lifting frame; 5. Moving electric push rod; 51. Adjustment frame; 6. Rotary motor; 61. Rotary table; 62. Electric suction cup; 7. Vision sensor; 71. Conveyor table. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] Reference Figures 1-7 A novel method for packaging and molding a power diode with fully exposed leads includes step one: die bonding: placing the chip in a mold pit on a carrier stage with an independent vacuum negative pressure device, with the negative terminal of the chip facing up and the positive terminal facing down. The independent vacuum negative pressure device ensures that the chip is in close contact with the carrier stage, improving the die bonding accuracy and efficiency. By changing the design of the graphite carrier stage and die bonding swing arm, reverse die bonding on the wafer can be achieved, making the package leads fully exposed, laying the foundation for subsequent top heat dissipation design. Step 2: Welding: Place the die-bonded carrier stage in the welding furnace and set up a gas concentration detection device. When the gas concentration exceeds the standard, the exhaust device is turned on simultaneously to quickly adjust the gas in the furnace to a suitable nitrogen and oxygen concentration to ensure welding quality. The welding furnace is heated to melt the solder between the chip and the carrier stage and form a solder joint, so that the chip and the carrier stage are reliably connected together. Step 3: Molding: Place the welded carrier in a molding machine and use a mold to form an exposed window on the top of the package, so that the top surface of the diode chip or the heat-conducting component connected to the upper electrode of the diode is exposed at the exposed window, forming a top exposed heat dissipation interface. Use the same slope demolding process for the left and right colloids to achieve demolding treatment of complex appearance. Apply pressure to the mold to form the package and ensure that the shape and size of the exposed window meet the design requirements. Step 4: Lead cutting: After molding, multiple packages are connected to a long strip of lead frame sheet. During lead cutting, the lower die of the lead cutting machine is fixed by inserting positioning pins into the positioning holes of the sheet, and the upper die is used to press down to separate the individual package from the sheet and bend the leads. Step 5: Testing: Perform electrical performance testing on the package to ensure it meets design requirements. An AOI high-definition image recognition system can be used to automatically distinguish surface foreign objects and defects, improving the accuracy and efficiency of appearance defect detection.

[0020] The present invention proposes a novel molding equipment for fully exposed lead power diode packages. The lead cutting machine in step four includes a frame 1 with a lead cutting unit. An adjustment mechanism is provided on the upper surface of the frame 1. The adjustment mechanism includes an electric suction cup 62, which adsorbs and fixes the material sheet by vacuum adsorption.

[0021] Specifically, in order to ensure the stability of the rotation of the output shaft of the mobile motor 2, the adjustment mechanism also includes the mobile motor 2. The mobile motor 2 is fixedly installed on the inner wall of the rear groove of the frame 1. The output shaft of the mobile motor 2 is rotatably connected to the inner wall of the rear groove of the frame 1 through a bearing seat. The mobile motor 2 is fixedly installed on the frame 1 and fixed thereto. The output shaft of the mobile motor 2 is rotatably connected to the frame 1 through a bearing to ensure the stability of the rotation of the output shaft of the mobile motor 2.

[0022] Specifically, to ensure the stability of the screw 3's rotation, the output shaft of the moving motor 2 is fixedly mounted with the screw 3. The screw 3 is rotatably connected to the inner wall of the rear groove of the frame 1 via a bearing. The outer surface of the screw 3 is threadedly connected to the moving frame 31, which is slidably connected to the inner wall of the rear groove of the frame 1. The output shaft of the moving motor 2 is fixedly mounted with the screw 3, driving the screw 3 to rotate. The screw 3 is rotatably connected to the frame 1 via a bearing, ensuring the stability of the screw 3's rotation. The moving frame 31 is threadedly connected to the screw 3, and the rotation of the screw 3 can drive the moving frame 31 to rotate and move. However, since the moving frame 31 is slidably connected to the frame 1, it is limited, so that it only moves along the X-axis, thereby realizing the overall X-axis movement of the entire subsequent lifting, rotating and other substructures.

[0023] Specifically, a lifting electric push rod 4 is fixedly installed on the top wall of the groove of the movable frame 31. An L-shaped lifting frame 41 is fixedly installed at one end of the telescopic rod of the lifting electric push rod 4. The lifting frame 41 is slidably connected to the inner wall of the groove of the movable frame 31. The lifting electric push rod 4 is fixedly installed to the movable frame 31, and while fixing it, it drives the frame to move synchronously. The telescopic rod of the lifting electric push rod 4 is fixedly installed to the lifting frame 41. The extension and retraction of the telescopic rod can drive the lifting frame 41 to rise and fall smoothly on the movable frame 31, providing linear motion of the adjustment mechanism in the Z-axis direction, thereby adjusting the height of the material picked up by the electric suction cup 62.

[0024] Specifically, in order to move the adjustment frame 51 along the Y-axis on the lifting frame 41, a movable electric push rod 5 is fixedly installed on the inner wall of the groove of the lifting frame 41. One end of the telescopic rod of the movable electric push rod 5 is fixedly installed with the adjustment frame 51. The adjustment frame 51 is slidably connected to the inner wall of the groove of the lifting frame 41. It is fixedly installed with the lifting frame 41 through the movable electric push rod 5. While it is fixed, the lifting of the lifting frame 41 can drive the movable electric push rod 5 to rise and fall synchronously. It is fixedly installed with the adjustment frame 51 through the telescopic rod of the movable electric push rod 5. The extension and retraction of the telescopic rod can drive the adjustment frame 51 to move along the Y-axis on the lifting frame 41, which is used to fine-tune the position of the material piece on the horizontal plane.

[0025] Specifically, to ensure the stability of the rotation of the output shaft of the rotary motor 6, the rotary motor 6 is fixedly installed on the inner wall of the groove of the adjusting frame 51. The output shaft of the rotary motor 6 is rotatably connected to the inner wall of the groove of the adjusting frame 51 through a bearing seat. The output shaft of the rotary motor 6 is fixedly installed on a rotary table 61, which is rotatably connected to the lower surface of the adjusting frame 51 through a bearing. An electric suction cup 62 is fixedly installed on the lower surface of the rotary table 61. The rotary motor 6 is fixedly installed on the adjusting frame 51, which moves synchronously while being fixed. The output shaft of the rotary motor 6 is rotatably connected to the adjusting frame 51 through a bearing seat to ensure the stability of the rotation of the output shaft of the rotary motor 6. The rotary motor 6 is fixedly installed on the rotary table 61 to drive the rotary table 61 to rotate, thereby adjusting the angle of the material sheet. The rotary table 61 is rotatably connected to the adjusting frame 51 through a bearing to ensure the stability of the rotation of the rotary table 61. The electric suction cup 62 is fixedly installed on the rotary table 61 to fix it. The electric suction cup 62 picks up the material sheet and drives the material sheet to perform X, Y, and Z axis movement and rotation, thereby adjusting the position and angle of the material sheet.

[0026] In order to transport the sheet material, a conveying mechanism is provided on the upper surface of the frame 1. The conveying mechanism includes a conveying table 71, and the movement of the conveying table 71 transports the sheet material.

[0027] Specifically, to ensure precise pre-positioning and perfect alignment of the positioning holes of the sheet material with the positioning pins of the lower mold when it enters the mold, the conveying mechanism also includes vision sensors 7. Multiple vision sensors 7 are fixedly mounted on the upper surface of the base plate of the frame 1. The center distance between the detection fields of the multiple vision sensors 7 corresponds one-to-one with the positioning pin distance of the lower mold of the cutting unit of the frame 1. The conveying table 71 is slidably connected to the electric linear guide rail of the frame 1. The multiple vision sensors 7 fixedly mounted on the frame 1 act as eyes, taking pictures of the positioning holes on the sheet material before it enters the cutting mold, calculating the X, Y coordinates and angular deviation of the current position of the sheet material. The precise pre-positioning ensures that the positioning holes of the sheet material are perfectly aligned with the positioning pins of the lower mold when it enters the mold. The conveying table 71 is slidably connected to the electric linear guide rail of the frame 1 to convey the sheet material for subsequent suction cup adsorption and fixation.

[0028] Working principle: Driven by an electric linear guide rail, the conveyor table 71 of the conveying mechanism smoothly transports the long strip of lead frame material from the equipment inlet to the working area of ​​the tendon cutting machine. The control system issues a command, and the conveyor table 71 moves at a preset speed until the material reaches the detection range of the vision sensor 7 and stops. The vision sensor 7 takes a high-speed picture of the positioning hole on the material sheet. The image processing software in the control system analyzes the image and accurately calculates the deviation between the actual position and angle of the material sheet and the theoretical position. Based on the calculated deviation, the control system sends motion commands to each motor and electric push rod of the adjustment mechanism for coordinated adjustment. X-axis adjustment: The moving motor 2 drives the screw 3 to rotate, causing the moving frame 31 to move in the X-axis direction for coarse adjustment; Z-axis adjustment: The lifting electric push rod 4 extends and retracts, causing the L-shaped lifting frame 41 to rise and fall, adjusting the height of the suction cup gripping the material; Y-axis adjustment: The moving electric push rod 5 extends and retracts, causing the adjusting frame 51 to make fine adjustments in the Y-axis direction for horizontal position compensation; Angle adjustment: The rotary motor 6 drives the rotary table 61 to rotate, precisely correcting the angle deviation of the material. The adjustment mechanism, carrying the electric suction cup 62 with the material sheet adsorbed, moves to directly above the lower mold of the cutting unit. At this time, the positioning hole on the material sheet is theoretically perfectly aligned with the positioning pin of the lower mold. The control system confirms through encoder feedback that each axis has reached the target position and may perform a final visual confirmation to ensure that the alignment is correct. The lifting electric push rod 4 moves again, driving the entire adjustment mechanism to descend smoothly. The material sheet descends accordingly, and the positioning hole on it is precisely fitted into the positioning pin of the lower mold to achieve physical fixation. The descent speed and stop position are precisely controlled by the control system to ensure that the positioning pin is inserted smoothly without impact. The positioning pin is made of galvanized rapid heating. Taking advantage of the high thermal expansion coefficient and higher hardness of zinc than copper, it is rapidly heated in 0.5-1 second to expand and prevent displacement. The vacuum of the electric suction cup 62 is released, and the sheet is firmly held on the lower mold. Then, the upper mold of the lead cutting unit is driven by power to press downward, separating the individual package from the sheet and completing the lead bending. The actions of suction cup release and upper mold pressing are triggered by the control system in strict sequence to ensure safety. The upper mold rises, and the adjustment mechanism drives the suction cup to rise and return to the initial position, ready to receive the next sheet. The conveyor table 71 can also send out the processed sheet or start the next cycle.

[0029] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A novel method for packaging and molding a power diode with fully exposed leads, characterized in that: Step 1: Chip bonding: The chip is placed in the mold pit on the carrier stage with an independent vacuum negative pressure device. When placed, the negative terminal of the chip is facing up and the positive terminal is facing down. The independent vacuum negative pressure device ensures that the chip is in close contact with the carrier stage, improving bonding accuracy and efficiency. By changing the design of the graphite carrier stage and the bonding arm, reverse bonding of the wafer can be achieved on the wafer, exposing the packaging leads and laying the foundation for subsequent top heat dissipation design. Step 2: Welding: Place the die-bonded carrier stage in the welding furnace and set up a gas concentration detection device. When the gas concentration exceeds the standard, the exhaust device is turned on simultaneously to quickly adjust the gas in the furnace to a suitable nitrogen and oxygen concentration to ensure welding quality. The welding furnace is heated to melt the solder between the chip and the carrier stage and form a solder joint, so that the chip and the carrier stage are reliably connected together. Step 3: Molding: Place the welded carrier in a molding machine and use a mold to form an exposed window on the top of the package, so that the top surface of the diode chip or the heat-conducting component connected to the upper electrode of the diode is exposed at the exposed window, forming a top exposed heat dissipation interface. Use the same slope demolding process for the left and right colloids to achieve demolding treatment of complex appearance. Apply pressure to the mold to form the package and ensure that the shape and size of the exposed window meet the design requirements. Step 4: Lead cutting: After molding, multiple packages are connected to a long strip of lead frame sheet. During lead cutting, the lower die of the lead cutting machine is fixed by inserting positioning pins into the positioning holes of the sheet, and the upper die is used to press down to separate the individual package from the sheet and bend the leads. Step 5: Testing: Perform electrical performance testing on the package to ensure it meets design requirements. An AOI high-definition image recognition system can be used to automatically distinguish surface foreign objects and defects, improving the accuracy and efficiency of appearance defect detection.

2. A novel molding apparatus for a fully exposed lead power diode package, and a method for molding a novel fully exposed lead power diode package according to claim 1, characterized in that: The rebar cutting machine in step four includes a frame (1) with a rebar cutting unit. An adjustment mechanism is provided on the upper surface of the frame (1). The adjustment mechanism includes an electric suction cup (62). The electric suction cup (62) adsorbs and fixes the material sheet by vacuum adsorption. The upper surface of the frame (1) is provided with a conveying mechanism, which includes a conveying table (71) and the movement of the conveying table (71) conveys the material sheet.

3. The molding equipment for a novel fully exposed pin power diode package according to claim 2, characterized in that: The adjustment mechanism also includes a moving motor (2), which is fixedly installed on the inner wall of the rear groove of the frame (1). The output shaft of the moving motor (2) is rotatably connected to the inner wall of the rear groove of the frame (1) through a bearing seat.

4. The molding equipment for a novel fully exposed pin power diode package according to claim 3, characterized in that: The output shaft of the mobile motor (2) is fixedly mounted with a screw (3). The screw (3) is rotatably connected to the inner wall of the rear groove of the frame (1) through a bearing. The outer surface of the screw (3) is threadedly connected to a movable frame (31). The movable frame (31) is slidably connected to the inner wall of the rear groove of the frame (1).

5. The molding equipment for a novel fully exposed pin power diode package according to claim 4, characterized in that: A lifting electric push rod (4) is fixedly installed on the top wall of the groove of the movable frame (31). One end of the telescopic rod of the lifting electric push rod (4) is fixedly installed with an L-shaped lifting frame (41). The lifting frame (41) is slidably connected to the inner wall of the groove of the movable frame (31).

6. The molding equipment for a novel fully exposed pin power diode package according to claim 5, characterized in that: A movable electric push rod (5) is fixedly installed on the inner wall of the groove of the lifting frame (41). An adjustment frame (51) is fixedly installed on one end of the telescopic rod of the movable electric push rod (5). The adjustment frame (51) is slidably connected to the inner wall of the groove of the lifting frame (41).

7. The molding equipment for a novel fully exposed pin power diode package according to claim 6, characterized in that: A rotary motor (6) is fixedly installed on the inner wall of the groove of the adjustment frame (51). The output shaft of the rotary motor (6) is rotatably connected to the inner wall of the groove of the adjustment frame (51) through a bearing seat. A rotary table (61) is fixedly installed on the output shaft of the rotary motor (6). The rotary table (61) is rotatably connected to the lower surface of the adjustment frame (51) through a bearing. The electric suction cup (62) is fixedly installed on the lower surface of the rotary table (61).

8. The molding equipment for a novel fully exposed pin power diode package according to claim 2, characterized in that: The conveying mechanism also includes vision sensors (7), a plurality of vision sensors (7) are fixedly installed on the upper surface of the base plate of the frame (1), the center distance of the detection field of the plurality of vision sensors (7) corresponds one-to-one with the positioning pin distance of the lower mold of the rib cutting unit of the frame (1), and the conveying table (71) is slidably connected to the electric linear guide rail of the frame (1).

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