POP Packaging Structure and Manufacturing Method

Abstract

This invention relates to the field of semiconductor manufacturing technology and discloses a POP (Position-on-Package) packaging structure and manufacturing method, including a stacking mechanism. A frame mechanism is mounted on the surface of the stacking mechanism, and a locking mechanism is provided at the top of the frame mechanism. The frame mechanism includes a top layer component, the bottom of which contacts the top of the stacking mechanism. A support component is provided at the bottom of the top layer component, and a heat dissipation component is mounted on the side of the support component. The stacking mechanism includes a base component, which is disposed at the bottom of the frame mechanism, and a stacked component is mounted on the top of the base component. In this invention, the integrated design of the main chip, connecting layer, and substrate enhances the overall rigidity and structural stability of the packaging structure, while simplifying the initial assembly process. The stacked layers adopt a modular design of chip and board frame, improving production assembly efficiency and effectively avoiding direct contact between the chip body and other functional structures.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to POP packaging structure and manufacturing method. Background Technology

[0002] With the rapid development of technologies such as 5G communication, artificial intelligence, and automotive electronics, electronic devices have an increasingly urgent need for highly integrated, miniaturized, and high-performance semiconductor chips. As a core type of semiconductor three-dimensional packaging technology, stacked packaged chips have become a key solution to meet this need. POP chips, or stacked packaged chips, are integrated chip components formed by vertically stacking two or more semiconductor chips with different functions. Their core function is to achieve a high degree of chip functionality within a limited space.

[0003] POP packaging structures only have a single top or side heat dissipation channel, and the heat from the top of the chip, the side of the stack, the interconnect layer and other areas cannot be dissipated in a coordinated manner, which can easily lead to heat accumulation and reduced chip stability. In addition, the top layer package is mostly an integrated non-removable structure, so when the chip fails later, it is difficult to repair and replace the core components such as the stacked sub-chips individually, and the whole chip must be scrapped, which greatly increases the cost of use and maintenance. Summary of the Invention

[0004] To overcome the above deficiencies, this invention provides a POP packaging structure and manufacturing method, aiming to improve the problems in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a POP packaging structure, including a stacking mechanism, a frame mechanism mounted on the surface of the stacking mechanism, a locking mechanism provided on the top of the frame mechanism, the frame mechanism including a top layer component, the bottom of the top layer component contacting the top of the stacking mechanism, a support component provided on the bottom of the top layer component, a heat dissipation component mounted on the side of the support component, and the support component located at the bottom of the top layer component to provide rigid support for the entire frame mechanism.

[0006] As a further description of the above technical solution: The stacking mechanism includes a base component disposed at the bottom of the frame mechanism, and a stacking component mounted on top of the base component.

[0007] As a further description of the above technical solution: The base component includes a motherboard, the surface of which has a groove, a substrate is fixedly connected to the top of the motherboard, and a main chip is fixedly connected to the inner wall of the substrate.

[0008] As a further description of the above technical solution: The stacked component includes a connecting plate, a material plate frame is fixedly connected to the top of the connecting plate, a stacked sub-chip is fixedly connected to the inner wall of the material plate frame, a pad and a guide post are fixedly connected to the top of the connecting plate, and the surface of the guide post is provided with a groove. The pad on the top of the connecting plate has a dual function: it fixes the connecting plate and the material plate frame to form a stable whole, and it also supports the air passage between the connecting plate and the material plate frame.

[0009] As a further description of the above technical solution: The inner wall of the material plate frame slides against the outer surface of the guide post, the bottom of the connecting layer plate is fixed to the top of the stacked sub-chip and the pad, and the outer surface of the pad is fixed to the outer surface of the material plate frame.

[0010] As a further description of the above technical solution: The top-level component includes a packaging board with a flow channel on its surface. An outward expansion spring is fixedly connected to the inner wall of the packaging board. A flexible pad and convection fins are fixedly connected to the bottom of the packaging board. The convection fins are disposed inside the flexible pad. The bottom of the flexible pad is movably connected to the top of the stacked sub-chip. The inner wall of the packaging board is slidably connected to the outer surface of the material board frame. The outward expansion spring on the inner wall of the packaging board provides a basis for elastic expansion and contraction.

[0011] As a further description of the above technical solution: The supporting component includes a supporting column, an inner retractable column slidably connected to the inner wall of the supporting column, an end of the inner retractable column fixed to the end of the outer expansion spring, an outer surface of the inner retractable column sliding against the inner wall of the encapsulation plate, a connecting rod and a sliding member fixedly connected to the outer surface of the supporting column, a bottom of the sliding member fixed to the outer surface of the connecting rod, an end of the sliding member fixed to the bottom of the supporting column, and an outer surface of the supporting column movably connected to the inner wall of the groove. The supporting column and the groove are movably connected, providing a bottom-level rigid support for the entire frame mechanism.

[0012] As a further description of the above technical solution: The heat dissipation component includes a flow guide square tube with air grooves on its surface. A heat exchange block and a partition are fixedly connected to the outer surface of the flow guide square tube. The heat exchange block is located inside the partition, and its outer surface is in contact with the outer surface of the material plate frame. A shrink member is fixedly connected to the top of the flow guide square tube, and the top of the shrink member is fixed to the bottom of the encapsulation plate. A heat dissipation groove is formed on the surface of the flow guide square tube, and the position of the heat dissipation groove is the same as the height of the pad. The flow guide square tube of the heat dissipation component is fixed to the bottom of the encapsulation plate via the shrink member, and the heat dissipation groove on the surface is aligned with the height of the pad, realizing linkage with the air channel of the connecting layer.

[0013] As a further description of the above technical solution: The locking mechanism includes a cover, a knob rotatably connected to the outer surface of the cover, a rotating shaft fixedly connected to the end of the knob, the outer surface of the rotating shaft rotating relative to the inner wall of the cover, a cam block fixedly connected to the outer surface of the rotating shaft, a locking plate drivingly connected to the outer surface of the cam block, an outwardly expanding leaf spring fixedly connected to the outer surface of the locking plate, a guide rod slidably connected to the inner wall of the locking plate, the ends of the guide rod and the outwardly expanding leaf spring being fixed to the inner wall of the cover, the outer surface of the locking plate sliding relative to the inner wall of the cover, and the outer surface of the locking plate movably connected to the inner wall of the column groove. The cam block pushes the locking plate to slide along the guide rod fixed to the inner wall of the cover and the inner wall of the cover.

[0014] In addition, a method for manufacturing a POP packaging structure is also provided, comprising the following steps: S1. First, fix the main chip to the inner wall of the substrate, and then fix the assembled substrate to the top of the motherboard to complete the overall assembly of the base components. Ensure that the pre-drilled groove on the surface of the motherboard is exposed as the positioning basis for the subsequent assembly of the support components, forming the bottom load-bearing base of the packaging structure. S2. Fix the connecting layer plate above the substrate of the base component to form an integrated structure of the main chip, substrate and connecting layer plate. Fix the pad and guide post on the top of the connecting layer plate. Pre-fix the stacked sub-chip to the inner wall of the material board frame to form a module. Slide the module down along the outer surface of the guide post to make the inner wall of the material board frame fit with the guide post. At the same time, fix the material board frame to the connecting layer plate and the pad respectively to complete the stacking assembly of the stacked component and the integrated base. S3. Position the support column of the support component by embedding the bottom of the support column into the slot of the motherboard. Fix the inner shrink column of the support column to the outer expansion spring of the inner wall of the top component packaging board. Slide the packaging board down along the outer surface of the material board frame until the flexible pad at the bottom of the packaging board makes contact with the top of the stacked sub-chip. Fix the heat dissipation component's flow guide square tube to the bottom of the packaging board through the shrink part, so that the heat exchange block is in close contact with the outer surface of the material board frame, and the heat dissipation groove of the flow guide square tube is aligned with the height of the pad strip, thus completing the overall installation of the frame mechanism. S4. Fix the cover of the locking mechanism above the top component of the frame mechanism, ensuring that the card plate inside the cover is precisely aligned with the groove on the surface of the guide post. Turn the knob outside the cover to drive the rotating shaft and cam block to rotate, pushing the card plate to slide along the guide rod and embed into the groove. With the help of the elastic return force of the outward expansion leaf spring, the card plate and the groove are tightly fitted, completing the locking of the entire encapsulation structure and achieving a rigid connection of each component.

[0015] The present invention has the following beneficial effects: 1. In this invention, an integrated and modular structural design is adopted. The integrated design of the main chip, connection layer and substrate reduces the gap between components, improves the overall rigidity and stability of the packaging structure, and provides a stable benchmark for assembly. The modular design of the stacked chip and board frame can be pre-fabricated and tested in advance, improving mass production efficiency. The board frame can protect the core area of ​​the chip. The guiding and sliding structure makes the docking of each layer of components more precise. The flexible fixing structure can also avoid damage to the chip from hard contact.

[0016] 2. In this invention, the padding strip constructs a stable air passage between the connecting layer and the board frame while fixing the two. The air passage is precisely connected to the heat dissipation components on the top and sides, allowing the heat flow in each area of ​​the chip to be efficiently guided and exchanged, avoiding heat accumulation. The heat dissipation paths work together to improve the overall heat dissipation efficiency.

[0017] 3. In this invention, a detachable locking design is adopted. The locking mechanism is easy to operate and has a good anti-loosening effect, which enables the top package to be disassembled without damage, reducing subsequent repair and maintenance costs. At the same time, the top package is equipped with an elastic buffer structure, which can adapt to structural deformation caused by temperature changes and vibrations. The telescopic structure of the supporting components also improves the assembly adaptability and further enhances the reliability of the package structure. Attached Figure Description

[0018] Figure 1 This is a front perspective view of the POP packaging structure proposed in this invention; Figure 2 This is a structural illustration of the POP packaging structure proposed in this invention; Figure 3 This is a partial cross-sectional view of the POP packaging structure proposed in this invention; Figure 4 This is a partial cross-sectional view of the POP packaging structure proposed in this invention; Figure 5 This is a partial cross-sectional view of the POP packaging structure proposed in this invention; Figure 6 This is a partial structural schematic diagram of the POP packaging stacking mechanism proposed in this invention; Figure 7 This is a partial cross-sectional schematic diagram of the POP packaging stacking mechanism proposed in this invention; Figure 8 This is a partial structural diagram of the POP packaging structure frame mechanism proposed in this invention; Figure 9 This is a partially enlarged schematic diagram of the locking mechanism of the POP packaging structure proposed in this invention; Figure 10 This is a schematic flowchart illustrating the manufacturing method of the locking mechanism for the POP packaging structure proposed in this invention.

[0019] Legend: 1. Stacking mechanism; 11. Base component; 111. Main board; 112. Substrate; 113. Insert slot; 114. Main chip; 12. Stacked component; 121. Connecting layer; 122. Material board frame; 123. Stacked sub-chip; 124. Spacer strip; 125. Guide post; 126. Post slot; 2. Frame mechanism; 21. Top layer component; 211. Packaging board; 212. Channel; 213. Outward expansion spring; 214. 215. Flexible pad; 22. Convection fins; 22. Support component; 221. Support column; 222. Retractable column; 223. Connecting rod; 224. Sliding component; 23. Heat dissipation component; 231. Guide square tube; 232. Air groove; 233. Heat exchange block; 234. Baffle; 235. Retractable component; 3. Locking mechanism; 31. Cover; 32. Knob; 33. Clamping plate; 34. Guide rod; 35. Cam block; 36. Outwardly expanding leaf spring. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see the appendix Figure 1 Appendix Figure 2 and attached Figure 3 An embodiment of the present invention includes a stacking mechanism 1, a frame mechanism 2 mounted on the surface of the stacking mechanism 1, a locking mechanism 3 provided on the top of the frame mechanism 2, the frame mechanism 2 including a top layer component 21, the bottom of the top layer component 21 contacting the top of the stacking mechanism 1, a support component 22 provided on the bottom of the top layer component 21, and a heat dissipation component 23 mounted on the side of the support component 22. Specifically, the frame mechanism 2 is installed on the surface of the stacking mechanism 1. The bottom of its top component 21 contacts the top of the stacking mechanism 1, so as to achieve a close connection between the frame mechanism and the stacking mechanism. The top component 21 also serves as the mounting carrier for the support component 22, providing it with a vertical fixed foundation. The support component 22 is located at the bottom of the top component 21, providing rigid support for the entire frame mechanism 2 and ensuring the relative position stability between the frame mechanism 2 and the stacking mechanism 1.

[0022] Please see the appendix Figure 6 Appendix Figure 7The stacking mechanism 1 includes a base component 11, which is disposed at the bottom of the frame mechanism 2. A stacking component 12 is mounted on the top of the base component 11. The base component 11 includes a main board 111, with a groove 113 formed on the surface of the main board 111. A substrate 112 is fixedly connected to the top of the main board 111, and a main chip 114 is fixedly connected to the inner wall of the substrate 112. The stacking component 12 includes a connecting layer 121, and a component is fixedly connected to the top of the connecting layer 121. The inner wall of the plate frame 122 is fixedly connected to the stacked sub-chip 123. The top of the connecting plate 121 is fixedly connected to the pad strip 124 and the guide post 125. The surface of the guide post 125 is provided with a post groove 126. The inner wall of the plate frame 122 slides against the outer surface of the guide post 125. The bottom of the connecting plate 121 is fixed to the top of the stacked sub-chip 123 and the pad strip 124. The outer surface of the pad strip 124 is fixed to the outer surface of the plate frame 122. Specifically, the base component 11 is located at the bottom of the frame mechanism 2, serving as the underlying foundation of the entire stacking mechanism 1. The groove 113 on the surface of its main board 111 is used to achieve positioning and cooperation with the subsequent support component 22. The substrate 112 fixed on the top of the main board 111 provides an installation carrier for the core main chip 114, ensuring the stable placement and operation of the main chip 114. The stacked component 12 is installed on the top of the base component 11. The connecting layer plate 121 is the core carrier of the stacked component 12. The guide post 125 fixed on its top provides a sliding guide for the material plate frame 122, allowing the material plate frame 122 to slide smoothly along the outer surface of the guide post 125, realizing the precise assembly of the material plate frame 122 and the stacked sub-chip 123 fixed on its inner wall. The groove 126 on the surface of the guide post 125 is a reserved structure for subsequent locking and fastening with the locking mechanism.

[0023] Please see the appendix Figure 4 Appendix Figure 5 and attached Figure 7The top-layer component 21 includes a packaging plate 211. A flow channel 212 is formed on the surface of the packaging plate 211. An outward expansion spring 213 is fixedly connected to the inner wall of the packaging plate 211. A flexible pad 214 and convection fins 215 are fixedly connected to the bottom of the packaging plate 211. The convection fins 215 are disposed inside the flexible pad 214. The bottom of the flexible pad 214 is movably connected to the top of the stacked sub-chip 123. The inner wall of the packaging plate 211 is slidably connected to the outer surface of the material board frame 122. The support component 22 includes a support column 221. An inward retraction column 222 is slidably connected to the inner wall of the support column 221. The end of the inward retraction column 222 is fixed to the end of the outward expansion spring 213. The outer surface of the inward retraction column 222 slides against the inner wall of the packaging plate 211. A connecting rod 223 is fixedly connected to the outer surface of the support column 221. The sliding member 224 is fixed to the bottom of the connecting rod 223 and the end of the sliding member 224 is fixed to the bottom of the support column 221. The outer surface of the support column 221 is movably connected to the inner wall of the groove 113. The heat dissipation component 23 includes a flow guide square tube 231. The surface of the flow guide square tube 231 is provided with an air groove 232. The outer surface of the flow guide square tube 231 is fixedly connected with a heat exchange block 233 and a partition plate 234. The heat exchange block 233 is located inside the partition plate 234 and the outer surface of the heat exchange block 233 is in contact with the outer surface of the material plate frame 122. The top of the flow guide square tube 231 is fixedly connected with a shrink member 235. The top of the shrink member 235 is fixed to the bottom of the encapsulation plate 211. The surface of the flow guide square tube 231 is provided with a heat dissipation groove, and the position of the heat dissipation groove is the same as the height of the pad strip 124. Specifically, the top component 21 is based on the encapsulation plate 211, whose inner wall is slidably connected to the outer surface of the material plate frame 122 to achieve precise assembly docking with the stacking mechanism 1. The bottom flexible pad 214 is movably connected to the top of the stacked sub-chip 123 to form flexible fixation and protection for the chip. The inner convection fins 215 can efficiently guide the hot airflow on the top of the stacked sub-chip 123, which is finally discharged through the guide groove 212 on the surface of the encapsulation plate 211. The outward expansion spring 213 on the inner wall of the encapsulation plate 211 provides the basis for elastic expansion and contraction. The support column 221 of the support component 22 is movably connected to the groove 113 to provide the bottom rigid support for the entire frame mechanism 2. The connecting rod 223 and the sliding part 224 are fixed to each other and connected to the support column 221 to enhance the stability of the support structure. The inward expansion column 222 on its inner wall is fixed to the outward expansion spring 213 and slides with the inner wall of the encapsulation plate 211 to form an elastic expansion and contraction, which can adapt to the assembly process and structural deformation caused by temperature changes and vibrations.

[0024] Please see the appendix Figure 9The locking mechanism 3 includes a cover 31. A knob 32 is rotatably connected to the outer surface of the cover 31. A rotating shaft is fixedly connected to the end of the knob 32. The outer surface of the rotating shaft rotates with the inner wall of the cover 31. A cam block 35 is fixedly connected to the outer surface of the rotating shaft. A locking plate 33 is drivenly connected to the outer surface of the cam block 35. An outwardly expanding leaf spring 36 is fixedly connected to the outer surface of the locking plate 33. A guide rod 34 is slidably connected to the inner wall of the locking plate 33. The ends of the guide rod 34 and the outwardly expanding leaf spring 36 are fixed with the inner wall of the cover 31. The outer surface of the locking plate 33 slides with the inner wall of the cover 31. The outer surface of the locking plate 33 is movably connected to the inner wall of the column groove 126.

[0025] Specifically, when the knob 32 on the outer surface of the cover 31 is turned, the rotating shaft fixed at its end will rotate synchronously with the knob 32 on the inner wall of the cover 31, thereby driving the cam block 35 on the outer surface of the rotating shaft to rotate. The cam block 35 is connected to the card plate 33 and will push the card plate 33 to slide along the guide rod 34 fixed to the inner wall of the cover 31 and the inner wall of the cover 31, so that the outer surface of the card plate 33 is embedded in the inner wall of the groove 126 of the guide post 125, realizing the locking mechanism 3 and the stacking mechanism 1 to lock together and complete the locking of the entire packaging structure.

[0026] In addition, this invention also provides a method for manufacturing a POP package structure, including the following steps: S1, firstly, the main chip 114 is fixedly connected to the inner wall of the substrate 112, and then the assembled substrate 112 is fixed as a whole on the top of the motherboard 111 to complete the overall assembly of the base component 11, ensuring that the pre-opened groove 113 on the surface of the motherboard 111 remains exposed, serving as the positioning basis for the subsequent assembly of the support component 22, forming the bottom load-bearing base of the package structure; S2. Fix the connecting layer plate 121 above the substrate 112 of the base component 11 to form an integrated structure of the main chip 114, the substrate 112, and the connecting layer plate 121. Fix the pad strip 124 and the guide post 125 on the top of the connecting layer plate 121. Pre-fix the stacked sub-chip 123 to the inner wall of the material plate frame 122 to form a module. Slide the module down along the outer surface of the guide post 125 so that the inner wall of the material plate frame 122 fits against the guide post 125. At the same time, fix the material plate frame 122 to the connecting layer plate 121 and the pad strip 124 respectively to complete the stacking assembly of the stacked component 12 and the integrated base. S3. Position the support column 221 of the support component 22 by embedding it into the groove 113 of the motherboard 111. Fix the inner shrink column 222 of the inner wall of the support column 221 to the outer expansion spring 213 of the inner wall of the top component 21 encapsulation plate 211. Slide the encapsulation plate 211 down along the outer surface of the material plate frame 122 until the flexible pad 214 at the bottom of the encapsulation plate 211 makes contact with the top of the stacked sub-chip 123. Fix the flow guide square tube 231 of the heat dissipation component 23 to the bottom of the encapsulation plate 211 through the shrink part 235, so that the heat exchange block 233 is in close contact with the outer surface of the material plate frame 122, and the heat dissipation groove of the flow guide square tube 231 is aligned with the height of the pad 124, thus completing the overall installation of the frame mechanism 2. S4. Fix the cover 31 of the locking mechanism 3 above the top component 21 of the frame mechanism 2, ensuring that the card plate 33 inside the cover 31 corresponds precisely to the groove 126 on the surface of the guide post 125. Turn the knob 32 outside the cover 31 to drive the rotating shaft and cam block 35 to rotate, push the card plate 33 to slide along the guide rod 34 and embed it into the groove 126. With the help of the elastic return force of the outward expansion leaf spring 36, the card plate 33 and the groove 126 are tightly fitted, completing the locking of the entire encapsulation structure and realizing the rigid connection of each component.

[0027] Working principle: The integration of the main chip 114, connecting layer 121, and substrate 112 reduces the connection gaps between components, improves the overall rigidity and stability of the packaging structure, simplifies the initial assembly process, and avoids assembly positioning deviations. The stacked sub-chip 123 and the board frame 122 adopt a modular design. The stacked sub-chip 123 is fixed to the inner wall of the board frame 122 to form an integrated module, improving assembly efficiency. The board frame 122 serves as the carrier of the stacked sub-chip 123, preventing the chip body from directly contacting other functional structures and effectively protecting it. In the core chip area, the board frame 122 can slide along the guide post 125 to achieve quick docking with the connecting layer board 121, reducing the risk of misalignment and facilitating subsequent maintenance and replacement of the stacked sub-chip 123. The top packaging and support component 22 and heat dissipation component 23 adopt an integrated design. The inner wall of the packaging board 211 can slide to connect with the outer surface of the board frame 122, and the bottom of the flexible pad 214 is movably connected to the top of the stacked sub-chip 123, ensuring both close contact and heat dissipation with the chip and avoiding damage to the chip from hard contact. Meanwhile, the top packaging... Equipped with a locking mechanism 3, it can lock and unlock the guide post 125, making the top package detachable and improving the efficiency of subsequent repairs and maintenance. The outward expansion spring 213 can also form an elastic fit with the inward retraction post 222 of the support component 22, providing flexible buffer for the top package and adapting to structural deformation caused by temperature changes and vibrations. This structure achieves full-area heat dissipation through the coordinated operation of the top, side, and connecting layer heat dissipation channels. After the material board frame 122 absorbs the heat from the side of the stacked sub-chip 123, it is transferred to the heat exchange block 233 that is tightly attached to the outer surface. Heat is quickly transferred to the flow guide tube 231. The surface of the flow guide tube 231 has air grooves 232 to allow air circulation and form convective heat exchange with the heat exchange block 233. The surface of the flow guide tube 231 has heat dissipation grooves of the same height as the pad strip 124, realizing heat linkage with the pad strip 124. The heat of the connecting layer can be introduced into the side heat dissipation channel through the heat dissipation grooves. At the same time, the flow guide tube 231 is fixed to the bottom of the encapsulation board 211 through the shrink part 235, so that the components of the triple heat dissipation channel are integrated and linked, ensuring that the heat conduction and airflow guidance paths are continuous.

Claims

1. A POP packaging structure, comprising a stacking mechanism (1), characterized in that: The stacking mechanism (1) is equipped with a frame mechanism (2), and a locking mechanism (3) is provided on the top of the frame mechanism (2). The frame mechanism (2) includes a top component (21), the bottom of which is in contact with the top of the stacking mechanism (1). A support component (22) is provided on the bottom of the top component (21), and a heat dissipation component (23) is installed on the side of the support component (22).

2. The POP packaging structure according to claim 1, characterized in that: The stacking mechanism (1) includes a base component (11) disposed at the bottom of the frame mechanism (2), and a stacking component (12) is mounted on the top of the base component (11).

3. The POP packaging structure according to claim 2, characterized in that: The base component (11) includes a motherboard (111), the surface of which is provided with a groove (113), a substrate (112) is fixedly connected to the top of the motherboard (111), and a main chip (114) is fixedly connected to the inner wall of the substrate (112).

4. A POP packaging structure according to claim 3, characterized in that: The stacked component (12) includes a connecting plate (121), a material plate frame (122) is fixedly connected to the top of the connecting plate (121), a stacked sub-chip (123) is fixedly connected to the inner wall of the material plate frame (122), a pad strip (124) and a guide post (125) are fixedly connected to the top of the connecting plate (121), and a post groove (126) is opened on the surface of the guide post (125).

5. A POP packaging structure according to claim 4, characterized in that: The inner wall of the material plate frame (122) slides against the outer surface of the guide post (125), the bottom of the connecting plate (121) is fixed to the top of the stacked sub-chip (123) and the pad (124), and the outer surface of the pad (124) is fixed to the outer surface of the material plate frame (122).

6. A POP packaging structure according to claim 1, characterized in that: The top-level component (21) includes a packaging plate (211), the surface of which is provided with a flow guide groove (212), the inner wall of which is fixedly connected with an outward expansion spring (213), the bottom of which is fixedly connected with a flexible pad (214) and a convection fin (215), the convection fin (215) being disposed on the inner side of the flexible pad (214), the bottom of which is movably connected to the top of the stacked sub-chip (123), and the inner wall of which is slidably connected to the outer surface of the material plate frame (122).

7. A POP packaging structure according to claim 6, characterized in that: The support component (22) includes a support column (221), an inner retractable column (222) is slidably connected to the inner wall of the support column (221), the end of the inner retractable column (222) is fixed to the end of the outer expansion spring (213), the outer surface of the inner retractable column (222) slides against the inner wall of the encapsulation plate (211), a connecting rod (223) and a sliding member (224) are fixedly connected to the outer surface of the support column (221), the bottom of the sliding member (224) is fixed to the outer surface of the connecting rod (223), the end of the sliding member (224) is fixed to the bottom of the support column (221), and the outer surface of the support column (221) is movably connected to the inner wall of the groove (113).

8. A POP packaging structure according to claim 7, characterized in that: The heat dissipation component (23) includes a flow guide square tube (231), the surface of which is provided with an air groove (232), and a heat exchange block (233) and a partition plate (234) are fixedly connected to the outer surface of the flow guide square tube (231). The heat exchange block (233) is located inside the partition plate (234), and the outer surface of the heat exchange block (233) is in contact with the outer surface of the material plate frame (122). A shrink member (235) is fixedly connected to the top of the flow guide square tube (231), and the top of the shrink member (235) is fixed to the bottom of the encapsulation plate (211). A heat dissipation groove is provided on the surface of the flow guide square tube (231), and the position of the heat dissipation groove is the same as the height of the pad (124).

9. A POP packaging structure according to claim 8, characterized in that: The locking mechanism (3) includes a cover (31), a knob (32) is rotatably connected to the outer surface of the cover (31), a rotating shaft is fixedly connected to the end of the knob (32), the outer surface of the rotating shaft rotates with the inner wall of the cover (31), a cam block (35) is fixedly connected to the outer surface of the rotating shaft, a locking plate (33) is drivenly connected to the outer surface of the cam block (35), an outwardly expanding leaf spring (36) is fixedly connected to the outer surface of the locking plate (33), a guide rod (34) is slidably connected to the inner wall of the locking plate (33), the ends of the guide rod (34) and the outwardly expanding leaf spring (36) are fixed with the inner wall of the cover (31), the outer surface of the locking plate (33) slides with the inner wall of the cover (31), and the outer surface of the locking plate (33) is movably connected with the inner wall of the column groove (126).

10. A POP packaging structure and manufacturing method, applied to the manufacturing method of a POP packaging structure as described in claims 1-9, characterized in that, Includes the following steps: S1. First, fix the main chip (114) to the inner wall of the substrate (112), and then fix the assembled substrate (112) to the top of the motherboard (111) to complete the overall assembly of the base component (11). Ensure that the pre-opened groove (113) on the surface of the motherboard (111) remains exposed, serving as the positioning basis for subsequent support component assembly, and forming the bottom load-bearing base of the packaging structure. S2. Fix the connecting plate (121) above the substrate (112) of the base component (11) to form an integrated structure of the main chip (114), the substrate (112) and the connecting plate (121). Fix the pad (124) and the guide post (125) on the top of the connecting plate (121). Pre-fix the stacked sub-chip (123) to the inner wall of the material board frame (122) to form a module. Slide the module down along the outer surface of the guide post (125) so that the inner wall of the material board frame (122) fits against the guide post (125). At the same time, fix the material board frame (122) to the connecting plate (121) and the pad (124) respectively to complete the stacking assembly of the stacked component (12) and the integrated base. S3. Position the support column (221) of the support component (22) by embedding the bottom of the support column (221) into the groove (113) of the motherboard (111). Fix the inner shrink column (222) of the inner wall of the support column (221) to the outer expansion spring (213) of the inner wall of the top component (21) encapsulation plate (211). Slide the encapsulation plate (211) down along the outer surface of the material plate frame (122) until the flexible pad (214) at the bottom of the encapsulation plate (211) makes contact with the top of the stacked sub-chip (123). Fix the flow guide square tube (231) of the heat dissipation component (23) to the bottom of the encapsulation plate (211) through the shrink part (235). Make the heat exchange block (233) in close contact with the outer surface of the material plate frame (122), and the heat dissipation groove of the flow guide square tube (231) and the pad (124) are aligned in height. Complete the overall installation of the frame mechanism (2). S4. Fix the cover (31) of the locking mechanism (3) above the top part (21) of the frame mechanism (2), ensuring that the card plate (33) inside the cover (31) is precisely aligned with the groove (126) on the surface of the guide post (125). Turn the knob (32) outside the cover (31) to drive the rotating shaft and cam block (35) to rotate, push the card plate (33) to slide along the guide rod (34) and embed it into the groove (126). With the help of the elastic return force of the outer expansion leaf spring (36), the card plate (33) and the groove (126) are tightly fitted, completing the locking of the entire encapsulation structure and realizing the rigid connection of each component.

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