High power chip heat spreader

Abstract

This invention discloses a high-power chip heat sink, relating to the field of heat sink technology. It includes a cold plate with internal coolant channels, wherein the cold plate is an adaptive microvalve cold plate. It also includes a biomimetic fractal channel system constituting the main body of the channel and at least one adaptive microvalve integrated onto the cold plate substrate. The adaptive microvalve includes a sealed cavity and a phase change material filled therein. The top of the cavity is composed of a flexible membrane, which partially forms the wall of the coolant channel. When a hot spot appears on the chip, the phase change material undergoes a phase change upon heating and expands in volume, driving the flexible membrane to bulge and deform into the channel. This actively and in real-time changes the local channel shape and flow characteristics, achieving dynamic enhanced heat transfer for hot spots. This heat sink effectively solves the problem that traditional fixed channel structures cannot adapt to local heat loads, improving heat dissipation efficiency and temperature uniformity.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat sinks, in particular to a high-power chip heat sink. BACKGROUND

[0002] With the rapid development of integrated circuit technology, the power consumption and heat flux density of high-power chips continue to rise, and the local "hot spots" generated thereby have become a core bottleneck restricting performance improvement and system reliability. An efficient and uniform thermal management solution is the key to ensuring the stable operation of such chips. Currently, the heat dissipation solutions for high-power chips are mainly divided into air cooling and liquid cooling. Traditional air-cooled heat sinks rely on copper heat plates and dense fins, and their heat dissipation capacity has gradually approached the physical limit, making it difficult to cope with the local heat flux density of higher-power chips, and the poor targeting of "hot spots" easily leads to uneven temperatures of the entire chip

[0003] Liquid cooling heat dissipation technology based on microchannels or biomimetic fractal cooling liquid channels is a current research hotspot. Such technology uses the high specific heat capacity of the cooling liquid to improve the overall heat exchange efficiency by constructing a fine cooling liquid channel network inside the heat sink substrate. Among them, the biomimetic fractal cooling liquid channel simulates the efficient transport system in nature, aiming to achieve uniform distribution of cooling liquid on the surface of the heat dissipation base, thereby obtaining a more balanced temperature field. However, such advanced cooling liquid channel design is essentially a static, pre-optimized geometric structure. While it can improve the overall flow distribution uniformity, it cannot cope with the dynamically changing, non-uniform heat load distribution during chip operation. Specifically, the fixed cooling liquid channel structure cannot actively and real-time strengthen the heat dissipation in the "hot spot" area. When a core of the chip is in a high-load state and forms a local high-temperature area, the cooling liquid flow and flow rate through this area are not enhanced due to its higher heat load, resulting in the heat exchange capacity of this area becoming a system shortcoming, causing the local temperature to be too high (i.e., the "hot spot" problem), which may cause the chip to reduce the frequency, performance loss, or even thermal failure. Therefore, the present application proposes a high-power chip heat sink. SUMMARY

[0004] The present application provides a high-power chip heat sink to solve the problems in the background art by setting an adaptive micro-valve structure to achieve heat-driven cooling liquid channel shape adaptive adjustment according to the local temperature changes of the chip.

[0005] To achieve the above-mentioned purposes, the present application adopts the following technical solutions:

[0006] A high-power chip heat sink includes a cold plate with internal coolant channels; the cold plate is an adaptive micro-valve cold plate, which further includes: a biomimetic fractal coolant channel forming the main body of the coolant channel; at least one adaptive micro-valve integrated on the substrate of the cold plate; wherein, the adaptive micro-valve includes a sealed cavity and a phase change material filled therein, the top of the sealed cavity is composed of a flexible membrane, and the flexible membrane partially forms the wall of the coolant channel; when the phase change material undergoes a phase change due to heat, its volume expansion drives the flexible membrane to bulge and deform into the coolant channel, thereby locally changing the geometry of the coolant channel to enhance heat transfer.

[0007] Preferably, the wall of the coolant flow channel is provided with multiple micron-scale elastic cantilever structures. The elastic cantilever structure is a sheet-like elastic piece, one end of which is fixed to the wall of the coolant flow channel, and the other end is free in the coolant. It is used to generate high-frequency micro-amplitude vibration under the action of fluid to prevent deposits from adhering.

[0008] Preferably, the closed cavity of the adaptive microvalve is connected to a visualization indicator mechanism; the visualization indicator mechanism includes a capillary tube and a micro pointer column communicating with the closed cavity; a closed piston is slidably disposed inside the capillary tube, the bottom of the micro pointer column is fixed to the top of the closed piston, the top of the micro pointer column penetrates the upper surface of the cold plate, and multiple color scale areas are set on the outside of the micro pointer column to convert the volume change of the phase change material into a visible position signal to characterize the thermal state.

[0009] Preferably, the biomimetic fractal coolant channel is a tree-like fractal structure, including a main channel and multiple branch channels branching out from it. The sum of the cross-sectional areas of each coolant channel is equal to the cross-sectional area of ​​the previous channel, and the last branch channel covers the main heat exchange area of ​​the substrate. The inlet and outlet of the biomimetic fractal coolant channel are located on opposite sides of the cold plate.

[0010] Preferably, the sealed cavity of the adaptive microvalve is cylindrical, with its axis perpendicular to the substrate.

[0011] Preferably, there are multiple adaptive microvalves, which are correspondingly set on the final branch channel of the biomimetic fractal coolant flow channel, and their positions match the preset hot spot area of ​​the chip to be cooled.

[0012] Preferably, the flexible cantilever structure is located in the coolant flow channel near the outlet.

[0013] Preferably, the flexible film is a high thermal conductivity alloy film.

[0014] Preferably, the phase change material is a paraffin alloy.

[0015] Preferably, the bottom of the adaptive micro-valve cold plate is provided with a flexible thermal interface layer, which is a high thermal conductivity silicone grease layer; the substrate of the cold plate is in close contact with the heat-generating surface of the high-power chip to be cooled through the flexible thermal interface layer.

[0016] Preferably, multiple sets of heat dissipation fins are provided on the upper surface of the cold plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] This invention employs an adaptive microvalve structure. When a "hot spot" occurs on the chip, the phase change material in that area expands due to heat, pushing the flexible film to bulge into the coolant channel. This locally reduces the cross-sectional area of ​​the coolant channel, increases the coolant flow rate and turbulence, and actively enhances the heat transfer efficiency in that area. This dynamic response mechanism effectively overcomes the shortcomings of traditional static coolant channels in responding to hot spots, achieving real-time, targeted enhanced heat dissipation for locally high-temperature areas, reducing hot spot temperatures, and improving the stability and reliability of chip operation.

[0019] This invention combines a biomimetic fractal coolant channel with distributed adaptive microvalve, achieving uniform overall flow distribution while further introducing local adjustability to optimize the uniformity of the overall temperature field. The tree-like fractal coolant channel ensures coolant coverage of the main heat exchange areas, while the adaptive microvalve, positioned at key locations within the coolant channel, can precisely regulate preset hot spots. The combined effect of these two components enables the cooling system to achieve both globally balanced heat dissipation and dynamic enhancement of high-load areas. This structural design improves the cooling system's adaptability to non-uniform thermal loads, which helps extend chip lifespan and maintain high-performance operation.

[0020] This invention converts the volume change of phase change material into an externally visible signal through capillary tubes and pointer posts, providing a direct reflection of the chip's thermal state and facilitating real-time monitoring and fault early warning. Simultaneously, the elastic cantilever structure within the coolant flow channel generates high-frequency micro-vibrations under fluid action, effectively preventing particle deposition, maintaining coolant flow channel cleanliness, and reducing the degradation of heat dissipation performance caused by dirt accumulation. This further enhances the overall practicality and long-term operational reliability of the heat dissipation system. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the overall structure of the present invention from another perspective;

[0024] Figure 3 This is a schematic diagram of the biomimetic fractal coolant flow channel structure of the present invention;

[0025] Figure 4 This is a schematic diagram showing the installation position of the adaptive microvalve of the present invention;

[0026] Figure 5 This is a schematic diagram of the installation position of the elastic cantilever structure of the present invention;

[0027] Figure 6 This is a cross-sectional schematic diagram of the adaptive microvalve structure of the present invention;

[0028] Figure 7 for Figure 6 Enlarged view of point A in the middle;

[0029] Figure 8 This is a schematic diagram of the miniature pointer post structure of the present invention.

[0030] Figure number explanation: 1. Cold plate; 2. Bionic fractal coolant channel; 3. Adaptive microvalve; 4. Sealed cavity; 5. Flexible membrane; 6. Phase change material; 7. Elastic cantilever structure; 8. Visual indicator mechanism; 9. Capillary channel; 10. Miniature pointer column; 11. Sealed piston; 12. Color scale area; 13. Inlet; 14. Outlet; 15. Final branch channel; 16. Substrate; 17. Flexible thermally conductive interface layer; 18. Heat dissipation fins. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings.

[0032] The following description is intended to disclose the invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious modifications will be apparent to those skilled in the art. The basic principles of the invention defined in the following description can be used in other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0033] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or position based on the orientation or positional relationship shown in the accompanying drawings. They are merely simplifications for the convenience of describing this invention and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on this invention.

[0034] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0035] Example 1:

[0036] Please see Figures 1-8 A high-power chip heat sink includes a cold plate 1 with internal coolant channels; the cold plate 1 is an adaptive microvalve cold plate, which further includes: a biomimetic fractal coolant channel 2, constituting the main body of the coolant channel, designed to achieve efficient and uniform distribution of coolant across the entire heat dissipation substrate 16; at least one adaptive microvalve 3, integrated on the substrate 16 of the cold plate 1; wherein, the adaptive microvalve 3 includes a sealed cavity 4 and a phase change material 6 filled therein, the top of the sealed cavity 4 is composed of a flexible membrane 5, which partially forms the wall of the coolant channel; during operation, when a local "hot spot" occurs on the high-power chip below the cold plate 1, heat is conducted to the area of ​​the adaptive microvalve 3, causing the phase change material 6 inside to undergo a solid-liquid phase change upon heating, accompanied by significant volume expansion. The pressure generated by this expansion acts on the upper flexible membrane 5, forcing it to bulge and deform into the coolant channel. This deformation actively and in real time changes the geometry and cross-sectional area of ​​the local coolant flow channel. On the one hand, it increases fluid disturbance and turbulence intensity, and on the other hand, it may also increase the flow velocity locally due to the smaller flow cross section. The two work together to enhance the heat exchange efficiency of the hot spot area and realize intelligent adjustment of heat dissipation capacity dynamically increasing with heat load.

[0037] To maintain the long-term stable and efficient operation of the heat dissipation system and prevent performance degradation, multiple micron-scale elastic cantilever structures 7 are provided on the wall of the coolant flow channel. Each elastic cantilever structure 7 is a sheet-like elastic plate, with one end fixed to the wall of the coolant flow channel and the other end floating in the coolant. When an external coolant pump drives fluid through the coolant flow channel, the fluid exerts a continuous force on the free end of the cantilever, causing it to undergo high-frequency, micro-amplitude periodic vibrations or tremors. This continuous micro-vibration acts on the boundary layer of the coolant flow channel wall and the nearby fluid, effectively disturbing any tiny particles or impurities that may deposit on the wall, preventing their adhesion and accumulation to form a fouling layer, and avoiding a decrease in heat transfer performance due to fouling thermal resistance; it also slightly enhances the local fluid disturbance, providing a certain auxiliary strengthening effect on basic heat transfer.

[0038] To achieve direct and intuitive external monitoring of the chip's thermal state, especially the temperature of hot spots, the adaptive microvalve 3's sealed cavity 4 is connected to a visualization indicator mechanism 8. The visualization indicator mechanism 8 includes a capillary tube 9 communicating with the sealed cavity 4 and a miniature pointer post 10. A sealed piston 11 slides within the capillary tube 9, and the bottom of the miniature pointer post 10 is fixed to the top of the sealed piston 11, with its top penetrating the upper surface of the cold plate 1. Multiple color-coded scale areas 12 are set on the outer side of the miniature pointer post 10 to convert the volume change of the phase change material 6 into a visible position signal to characterize the thermal state. When the phase change material 6 inside the adaptive microvalve 3 expands due to heat, it not only drives the flexible membrane 5 to deform but also directly pushes the sealed piston 11 within the capillary tube 9 to produce a linear displacement. The miniature pointer post 10, fixed to the top of the piston, moves with the piston, its top penetrating the upper surface of the cold plate 1 and exposed to the outside. The different colored scale areas on the outer side of the pointer post correspond to normal, warning, and overheating states, respectively. As the internal heat load changes, causing the volume of the phase change material 6 to change, the extension height of the pointer column and the color-coded scale area it points to also change, thus transforming the internal, invisible thermal state into a clearly visible external position color signal. This provides system maintenance personnel with direct status indication without the need for external sensors, facilitating rapid identification of hotspot activation status and the working efficiency of the cooling system.

[0039] Furthermore, in order to improve the reset efficiency of the miniature pointer post 10, a compression spring is fitted on the outside of the miniature pointer post 10, and the compression spring is installed in the space of the capillary tube 9 above the sealed piston 11.

[0040] To further optimize the thermal response characteristics and structural reliability of the adaptive microvalve 3, this invention designs its sealed cavity 4 as a column with its axis perpendicular to the cold plate 1 substrate 16. This geometry allows the bottom of the sealed cavity 4 to have a relatively large heat-receiving area, which is beneficial for quickly sensing heat from the chip. Simultaneously, the sides of the cylindrical sealed cavity 4 are firmly bonded to the material of the cold plate 1 substrate 16, while the top is smoothly connected to the flexible membrane 5. When the internal phase change material 6 expands, the pressure mainly acts upward along the axial direction on the central region of the flexible membrane 5, generating more concentrated and effective bulging deformation, thereby more precisely controlling the shape of the coolant flow channel.

[0041] To achieve precise dynamic thermal management of multiple known or potential hot spots on the chip surface, this invention employs a strategy of distributed deployment of multiple adaptive microvalves 3. These adaptive microvalves 3 are positioned according to preset hot spots determined by chip design or thermal simulation analysis. They are specifically integrated into the final branch channel of the biomimetic fractal coolant flow channel 2. The advantages of this arrangement are: the final branch channel 15 directly covers the heat exchange surface, allowing the adaptive microvalves 3 to sense temperature changes in the corresponding area most directly and sensitively; simultaneously, the local regulation of the small coolant flow channel by the adaptive microvalves 3 can most effectively enhance heat dissipation in that tiny area without causing excessive disturbance to the global flow field. The collaborative work of multiple adaptive microvalves 3 enables the heat dissipation system to simultaneously cope with multiple dynamically changing local hot spots, achieving multi-point adaptive temperature balance control within the surface region.

[0042] Considering that the coolant's temperature rises after flowing through the entire coolant channel and exchanging heat with the chip's heat source, potentially making dissolved minerals or impurities more likely to precipitate and deposit, and that the flow rate and pressure may change when flowing to the outlet 14 region, this invention preferably concentrates micron-scale elastic cantilever structures 7 in the coolant channel near the outlet 14 region. The high-frequency, micro-amplitude vibrations generated by the cantilever structures in this region under fluid action can effectively prevent and eliminate the risk of fouling deposits exacerbated by temperature rise and flow regime changes, ensuring unobstructed coolant flow at outlet 14 and maintaining stable system flow resistance and pumping efficiency.

[0043] To ensure the responsiveness and heat transfer efficiency of the adaptive microvalve 3, the flexible membrane 5, which forms its top and serves as part of the coolant flow channel wall, is made of a high thermal conductivity alloy thin film material. Its high thermal conductivity ensures that the heat generated by the chip quickly passes through the film and is transferred to the internal phase change material 6, triggering its phase change and reducing thermal response delay. Furthermore, this alloy material possesses good flexibility while exhibiting excellent mechanical strength and fatigue resistance, enabling it to withstand the periodic deformation caused by the repeated expansion and contraction of the phase change material 6, ensuring the reliability and service life of the adaptive microvalve 3 during long-term operation.

[0044] To achieve a stable and reliable thermally driven function for the adaptive microvalve 3, the phase change material 6 filling it is preferably a paraffin alloy. Paraffin itself has advantages such as large latent heat of phase change, significant volume expansion rate, and stable chemical properties. By forming an alloy with other materials, its phase change temperature point can be precisely adjusted to match the target temperature threshold where enhanced heat dissipation is needed for the chip's hot spots. When the local temperature reaches or exceeds this threshold, the paraffin alloy undergoes a phase change and expands significantly, driving the adaptive microvalve 3 to operate; after the temperature decreases, it solidifies and contracts, allowing the flexible membrane 5 to return to its original position. This characteristic enables the paraffin alloy-based adaptive microvalve 3 to possess intelligent response characteristics with temperature threshold triggering and an action amplitude positively correlated with heat input.

[0045] To minimize the contact thermal resistance between the chip package surface and the cold plate 1 substrate 16, and to ensure efficient heat transfer from the chip to the heat sink, this invention adds a flexible thermally conductive interface layer 17, preferably a high thermal conductivity silicone grease layer, to the bottom of the cold plate 1. During installation, this layer is applied or pre-attached between the cold plate 1 substrate 16 and the chip. The high thermal conductivity silicone grease fills the air gaps caused by microscopic unevenness at the contact surface, and its high thermal conductivity ensures efficient heat transfer. Simultaneously, its flexibility adapts to installation pressure and small surface deformations, ensuring large-area uniform and tight contact. This interface layer is crucial for fully utilizing the overall heat dissipation performance of the adaptive microvalve cold plate of this invention, establishing an effective path for heat transfer from the chip hotspot to the corresponding adaptive microvalve 3 and the surrounding coolant channels.

[0046] In this solution, the adaptive micro-valve cold plate and the biomimetic fractal coolant channel 2 are integrally formed using additive manufacturing technology to ensure the overall strength of the cold plate 1.

[0047] The working principle of this device is as follows:

[0048] When the device is in operation, an external coolant pump drives coolant to flow from inlet 13 on one side of the cold plate 1 into the biomimetic fractal coolant channel 2. This coolant channel has a tree-like structure, with each branch evenly distributing the coolant to a dense network of terminal branch channels 15 covering the entire heating surface of the chip. As the coolant flows through these fine coolant channels, it continuously absorbs heat conducted from the chip to the substrate 16 of the cold plate 1 through contact with the channel walls, achieving basic, large-area, and efficient heat exchange. The heated coolant finally flows out from outlet 14 on the other side of the cold plate 1, completing one cycle.

[0049] When a localized surge in power consumption in a chip area creates a "hot spot," the corresponding heat is rapidly transferred to the substrate 16 of the cold plate 1 directly above it. In this area, the pre-integrated adaptive microvalve 3 plays a crucial role: heat is efficiently conducted through a flexible thermal interface layer 17 and a flexible membrane 5 made of a high thermal conductivity alloy film to the phase change material 6 inside the adaptive microvalve 3. Upon heating, the phase change material 6 undergoes a solid-liquid phase change, significantly expanding in volume. The resulting pressure acts on the top flexible membrane 5, driving it to bulge and deform into the coolant flow channel. This deformation locally alters the geometry and cross-sectional area of ​​the coolant flow channel, enhancing fluid turbulence and potentially increasing local flow velocity, thereby actively and in real-time significantly enhancing heat transfer efficiency in this specific hot spot area. The hot spot temperature is thus effectively suppressed. When the hot spot disappears and the temperature drops, the phase change material 6 condenses and contracts, and the flexible membrane 5 resets under fluid pressure and its own elasticity, restoring the system to normal. Multiple adaptive microvalve 3s can independently respond to different hot spots, achieving distributed and precise temperature control.

[0050] To ensure long-term stable operation, the device integrates self-cleaning and status indication functions. In the area of ​​the coolant flow channel near the outlet 14, a micron-scale elastic cantilever structure 7 generates high-frequency micro-vibrations under fluid scouring, continuously agitating the coolant flow channel wall, effectively preventing scale or impurity deposition and maintaining unobstructed coolant flow and heat exchange performance. Simultaneously, the sealed cavity 4 of the adaptive micro-valve 3 is connected to the visual indicator mechanism 8. The volume change of the phase change material 6 pushes the piston inside the capillary, causing the external micro pointer column 10 to move. Through a specific color scale area 12 displayed on the micro pointer column 10, the internally invisible thermal state is converted into a directly observable visual signal, providing an intuitive basis for system monitoring and maintenance.

[0051] The micron-scale elastic cantilever structure 7 mentioned in this solution is a mature technology in this field, with its specific fabrication process (such as microelectromechanical systems processing, photolithography, electroforming, or injection molding for integrated molding or subsequent assembly on the coolant channel wall). Those skilled in the art can select a suitable method from various known micromachining or precision manufacturing methods to fabricate the structure based on the chosen material, target size, and vibration frequency requirements, without needing to elaborate on the manufacturing steps in this application. The functionality of this structure depends on its existing mechanical properties and the interaction with the fluid environment, rather than on a specific, unknown fabrication method.

[0052] The working principle of this device is based on forced circulation of coolant. Those skilled in the art will understand that to achieve coolant circulation, an external coolant pump, a possible reservoir, and connecting pipes are required to form a complete cooling circulation system. The coolant pump is connected to the inlet 13 and outlet 14 on the cold plate 1 of this device via a standard fluid interface. This is a common, necessary, and technically straightforward connection method used in implementing liquid cooling solutions. Its specific selection, arrangement, and connection details can be directly determined based on the actual system flow rate, head, and space constraints; therefore, no additional illustrations or detailed structural descriptions are required in this application.

[0053] Example 2:

[0054] This embodiment describes Embodiment 1. Optionally, multiple sets of heat dissipation fins 18 are provided on the upper surface of the cold plate 1 to increase the contact area between the cold plate 1 and the air. The coolant carries away the heat from the chip in the coolant flow channels, causing the cold plate 1 to heat up. At this time, the air flowing between the fins (whether through natural convection or forced convection driven by a fan) can effectively dissipate the heat accumulated in the cold plate 1 back into the environment, further reducing the total thermal resistance of the system. For chips with extremely high transient power peaks or average power consumption, this design can provide additional heat dissipation margin, thereby supporting higher chip power density and more extreme performance release.

[0055] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments, and any modifications or variations of the implementation of the present invention may be made without departing from the principles.

Claims

1. A high-power chip heat sink, comprising a cold plate (1) with internal coolant channels. Its features are, The cold plate (1) is an adaptive micro-valve cold plate, which also includes: The biomimetic fractal coolant channel (2) constitutes the main body of the coolant channel; At least one adaptive microvalve (3) is integrated on the substrate (16) of the cold plate (1); The adaptive microvalve (3) includes a sealed cavity (4) and a phase change material (6) filled therein. The top of the sealed cavity (4) is composed of a flexible membrane (5), which partially forms the wall of the coolant flow channel. When the phase change material (6) undergoes a phase change due to heat, its volume expansion drives the flexible membrane (5) to bulge and deform into the coolant flow channel, thereby locally changing the geometry of the coolant flow channel to enhance heat transfer.

2. The high-power chip heat sink according to claim 1, characterized in that: The wall of the coolant channel is provided with multiple micron-scale elastic cantilever structures (7). The elastic cantilever structure (7) is a sheet-like elastic piece, one end of which is fixed to the wall of the coolant channel, and the other end is free in the coolant. It is used to generate high-frequency micro-amplitude vibration under the action of fluid to prevent deposits from adhering.

3. The high-power chip heat sink according to claim 1, characterized in that: The closed cavity (4) of the adaptive microvalve (3) is connected to the visualization indicator mechanism (8); the visualization indicator mechanism (8) includes a capillary tube (9) and a micro pointer column (10) communicating with the closed cavity (4); a closed piston (11) is slidably provided in the capillary tube (9), the bottom of the micro pointer column (10) is fixed to the top of the closed piston (11), and the top penetrates the upper surface of the cold plate (1). Multiple color scale areas (12) are provided on the outside of the micro pointer column (10) to convert the volume change of the phase change material (6) into a visible position signal to characterize the thermal state.

4. The high-power chip heat sink according to claim 2, characterized in that: The biomimetic fractal coolant channel (2) is a tree-like fractal structure, including a main channel and multiple branch channels branching out from it. The sum of the cross-sectional areas of each channel is equal to the cross-sectional area of ​​the previous channel, and the last branch channel (15) covers the main heat exchange area of ​​the substrate (16). The inlet (13) and outlet (14) of the biomimetic fractal coolant channel (2) are located on opposite sides of the cold plate (1).

5. The high-power chip heat sink according to claim 1, characterized in that: The sealed cavity (4) of the adaptive microvalve (3) is cylindrical, and its axis is perpendicular to the substrate (16).

6. The high-power chip heat sink according to claim 4, characterized in that: The number of adaptive microvalves (3) is multiple, and they are correspondingly set on the final branch channel (15) of the biomimetic fractal coolant channel (2), and their positions match the preset hot spot area of ​​the chip to be cooled.

7. The high-power chip heat sink according to claim 4, characterized in that: The elastic cantilever structure (7) is disposed in the region of the coolant flow channel near the outlet (14).

8. The high-power chip heat sink according to claim 1, characterized in that: The flexible film (5) is a high thermal conductivity alloy film.

9. The high-power chip heat sink according to claim 1, characterized in that: The phase change material (6) is a paraffin alloy.

10. The high-power chip heat sink according to claim 1, characterized in that: The bottom of the adaptive micro-valve cold plate is provided with a flexible thermal interface layer (17), which is a high thermal conductivity silicone grease layer; the substrate (16) of the cold plate (1) is in close contact with the heat-generating surface of the high-power chip to be cooled through the flexible thermal interface layer (17).

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