Semiconductor electronic package dual path wire bonding apparatus

Abstract

This invention relates to the field of wire bonding technology, and more particularly to a dual-path wire bonding device for semiconductor electronic packaging. The device includes a movable frame and a pressure bonding unit mounted at the bottom of the movable frame. The pressure bonding unit consists of a first wedge body and a second wedge body, which respectively perform pressure bonding on both ends of the lead. This invention effectively solves the problems of low efficiency and cumbersome operation in traditional single-bonding methods. By utilizing the first and second wedge bodies, pressure bonding can be applied to both ends of the lead simultaneously, facilitating a shorter bonding cycle for a single lead and improving welding efficiency. Furthermore, the welding path is transformed from complex movements between two solder points on a single lead and between different leads to movements only between different leads, effectively simplifying the device's movement trajectory and operation.

Description

Technical Field

[0001] This invention relates to the field of wire bonding technology, and more particularly to a dual-path wire bonding device for semiconductor electronic packaging. Background Technology

[0002] Wire bonding is a core interconnection process in semiconductor electronic packaging. Its basic principle is to use metal wires (such as gold, aluminum, or silver wires) to electrically connect the pads on the chip to the corresponding pads on the lead frame or substrate, thereby enabling the transmission of electrical signals between the internal circuitry of the chip and the external package pins. Traditional wire bonding methods generally use a single-blade point-by-point bonding process. The bonding equipment drives the blade to output the wire outward. First, one end of the wire is pressed onto the first pad, and ultrasonic vibration, mechanical pressure, and auxiliary heating (usually thermo-ultrasonic bonding) are applied at the same time to cause interatomic diffusion at the interface between the wire and the pad, forming a strong metallurgical bond. After the first solder joint is completed, the blade is lifted and moved along a preset trajectory to the second pad, and the pressure bonding operation is performed again, thereby forming an arc-shaped wire between the two pads.

[0003] However, traditional wire bonding methods have certain drawbacks. The wedge must be moved sequentially and one by one to each pad to be soldered, making it impossible to bond two pads at the same time, resulting in low soldering efficiency. In addition, the movement path of the wedge between the two pads of a single wire and between different wires is complex, making the equipment operation cumbersome. Summary of the Invention

[0004] This invention provides a dual-path wire bonding device for semiconductor electronic packaging, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A semiconductor electronic packaging dual-path wire bonding device includes a movable frame and a pressure bonding unit installed at the bottom of the movable frame. The pressure bonding unit is composed of a first wedge body and a second wedge body, and the first wedge body and the second wedge body respectively perform pressure bonding on both ends of the lead wire. The first chopping blade includes a support rod and a pressing body installed at the bottom of the support rod; The second chopping body includes a horizontally arranged crossbeam, a power column that pushes the crossbeam to move in the vertical direction, a vertical tube arranged on the crossbeam, and a second pressing body arranged at the bottom of the vertical tube. The support rod is slidably arranged on the crossbeam laterally. The second pressing body has a wire hole in the middle, through which the lead wire passes and extends out. The first pressing body is provided with a clamping structure for holding the end of the lead wire. The first pressing body and the second pressing body are pressure welded to both ends of the lead wire.

[0006] Furthermore, the second pressing body is disc-shaped, and several embossed patterns are provided on the bottom surface of the second pressing body.

[0007] Furthermore, the pressing body two is provided with a threaded disc, and the bottom of the vertical tube is provided with a threaded sleeve that cooperates with the threaded disc, and the pressing body two and the threaded sleeve are connected by several spring pieces.

[0008] Furthermore, the inner wall of the wire hole is provided with several cutting blades for cutting the lead wire.

[0009] Furthermore, the second splitting body also includes a guide groove for guiding the lead wire output from the wire hole toward the first splitting body. One end of the guide groove is aligned with the wire hole, and the other end of the guide groove is inclined upward, so that the lead wire between the first splitting body and the second splitting body is an upward arc shape.

[0010] Furthermore, the second chopping body also includes a clearance structure for driving the guide groove to deviate from the second pressing body. The clearance structure includes a side beam located on the side of the vertical tube and capable of relative sliding. A curved arm is rotatably mounted on the side beam. One end of the curved arm is connected to the guide groove, and the other end of the curved arm is provided with a sliding groove. A sliding column is provided on the side wall of the vertical tube and slidably connected to the sliding groove.

[0011] Furthermore, the guide groove and the pressing body two can move relative to each other, and when the guide groove and the pressing body two approach each other, the guide groove will bend the end of the lead wire output from the wire hole or press the lead wire to adhere to the bottom of the pressing body two. A slider is vertically slidably mounted on the side wall of the vertical tube, and a sliding column is mounted on the slider. The slider and the vertical tube are connected by a spring, and a protrusion for limiting the movement of the crank arm is provided on the side beam.

[0012] Furthermore, the side beam is slidably mounted on the movable frame via an auxiliary slide block.

[0013] Furthermore, the clamping structure is a slot formed on one side of the pressing body; The first chopping body also includes a filler body. The filler body is rotatably connected to the first pressing body via a connecting frame. The filler body can move into or out of the slot. When the filler body moves into the slot, the filler body and the first pressing body form a complete disc shape. Several embossed patterns are provided on the bottom surface of both the filler body and the bottom surface of the first pressing body.

[0014] Furthermore, the first chopping blade also includes a vertical rod disposed on the movable frame and a sliding sleeve slidably sleeved on the vertical rod. The sliding sleeve and the support rod are rotatably connected by two parallel guide arms, and the guide arms and the sliding sleeve are connected by an elastic body.

[0015] The technical solution of this invention can achieve the following technical effects: It effectively solves the problems of low working efficiency and cumbersome operation in the traditional single bonding mode. By using the first and second wedge bodies, pressure welding operations can be applied to both ends of the lead wire at the same time, which can shorten the bonding cycle of a single lead wire and improve welding efficiency. At the same time, the welding path is changed from the complex movement between two solder points of a single lead wire and between different leads to only the movement between different leads, which effectively simplifies the equipment movement trajectory and operation mode.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a dual-path wire bonding device for semiconductor electronic packaging. Figure 2 for Figure 1 Schematic diagram of the medium-pressure welding unit; Figure 3 for Figure 2 Schematic diagram of the structure of the middle splitting blade body 1; Figure 4 for Figure 2 Schematic diagram of the structure of the second body of the middle splitting blade; Figure 5 for Figure 4 A schematic diagram of the second compressed body and its structure; Figure 6 for Figure 5 Schematic diagram of the structure of the second type of compressed body; Figure 7 for Figure 4 A schematic diagram of the guide channel and its upper structure; Attached reference numerals: 100, movable frame; 200. Pressure welding unit; 300. Cleaver body 1; 301. Support rod; 302. Pressing body 1; 303. Slot; 304. Filler; 305. Connecting frame; 306. Vertical rod; 307. Sliding sleeve; 308. Guide arm; 309. Elastic body; 400. Cleaver body two; 401. Crossbeam; 402. Power column; 403. Vertical tube; 404. Pressing body two; 405. Threaded disc; 406. Threaded sleeve; 407. Spring piece; 408. Cutting blade; 409. Guide groove; 410. Side beam; 411. Crank arm; 412. Slide groove; 413. Slide column; 414. Slider; 415. Spring; 416. Protrusion; 417. Auxiliary slide. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] like Figures 1 to 4 As shown, this application provides a semiconductor electronic packaging dual-path wire bonding device, including a movable frame 100 and a pressure bonding unit 200 installed at the bottom of the movable frame 100. The pressure bonding unit 200 is composed of a first cleaver body 300 and a second cleaver body 400, and the first cleaver body 300 and the second cleaver body 400 respectively perform pressure bonding on both ends of the lead wire. The chopping blade body 300 includes a support rod 301 and a pressing body 302 installed at the bottom of the support rod 301; The second chopping body 400 includes a horizontally arranged crossbeam 401, a power column 402 that pushes the crossbeam 401 to move in the vertical direction, a vertical tube 403 arranged on the crossbeam 401, and a second pressing body 404 arranged at the bottom of the vertical tube 403. The support rod 301 is slidably arranged on the crossbeam 401. Among them, the second pressing body 404 has a wire hole in the middle, and the lead wire extends through the vertical tube 403 and the wire hole. The first pressing body 302 is provided with a clamping structure for clamping the end of the lead wire. The first pressing body 302 and the second pressing body 404 are pressure welded to both ends of the lead wire.

[0022] Specifically, the movable frame 100 can move in three-dimensional space through an external driving structure, thereby synchronously driving the pressure welding unit 200 to move and adjust its working position. At the same time, the movable frame 100 can provide support for the pressure welding unit 200. The pressure welding unit 200 can perform simultaneous welding work on both ends of the lead wire. Therefore, it is only necessary to move the equipment along several lead wire arrangement directions, without having to move the pressure welding unit 200 between the two welding points at both ends of the lead wire. This simplifies the movement method, reduces the difficulty of equipment operation, and improves work efficiency.

[0023] The first wedge body 300 and the second wedge body 400 in the pressure welding unit 200 can be arranged horizontally or vertically, corresponding to the distribution of the two solder points at both ends of the lead wire. Alternatively, the relative positions of the first wedge body 300 and the second wedge body 400 can be adjusted by rotating the movable frame 100 along its vertical axis. Taking the horizontal arrangement of the first wedge body 300 and the second wedge body 400 as an example, the support rod 301 on the first wedge body 300 supports the first pressing body 302, which presses one end of the lead wire onto the first solder pad. The crossbeam 401 in the second wedge body 400 supports the support rod 301, and allows the support rod 301 and the crossbeam 401 to... The length of the lead wire between the first chopper body 300 and the second chopper body 400 is adjusted by moving them closer or further apart. This allows the first chopper body 300 to pull out the lead wire from the second chopper body 400 via its clamping structure when the first chopper body 300 moves away from the second chopper body 400, thus forming a lead wire segment of a specified length between the first chopper body 300 and the second chopper body 400. The power column 402 provides power for the vertical movement of the crossbeam 401. The power column 402 can be connected to external power devices such as cylinders or hydraulic cylinders, thereby enabling the first pressing body 302 and the second pressing body 404 to move synchronously in the vertical direction. The vertical pipe 403 provides support for the second pressing body 404, which can be used to press the other end of the lead wire onto the second solder pad.

[0024] In use, the movable frame 100 and the pressure welding unit 200 are moved to the welding position. The support rod 301 approaches the vertical tube 403, the second pressing body 404 corresponds to the second pad, and the first pressing body 302 is offset from the first pad. The lead wire passes through the wire hole in the middle of the vertical tube 403 and the second pressing body 404 and extends out. The clamping structure on the first pressing body 302 clamps and fixes the end of the lead wire. The support rod 301 is pushed to slide on the crossbeam 401 and the first pressing body 302 and the second pressing body 404 are separated. At this time, the first pressing body 302 pulls out the lead wire through its clamping structure, thus forming a lead wire segment of a specified length between the first pressing body 302 and the second pressing body 404. The first pressing body 302 and the first pad Correspondingly, the power column 402 pushes the crossbeam 401 downward. The crossbeam 401 pushes the pressing body 302 and the pressing body 404 downward synchronously through the support rod 301 and the vertical pipe 403. The pressing body 302 and the pressing body 404 press the corresponding positions of the lead wire onto the two pads respectively. By using ultrasonic vibration, mechanical pressure and auxiliary heating, atomic diffusion occurs at the interface between the lead wire and the pad, thereby firmly welding the lead wire to the two pads together. During pressure welding, the lead wire is stopped from being fed. After welding is completed, the moving frame 100 is lifted and the lead wire is pulled off by the cutting blade 400. Then the moving frame 100 and the pressure welding unit 200 are moved to the next position to be welded and the welding is repeated.

[0025] It should be noted that since both the first cleaver body 300 and the second cleaver body 400 use pressure welding to weld the lead wire, auxiliary structures such as ultrasonic vibration and auxiliary heating can be set on the movable frame 100. When the two pads are on the same horizontal plane or at different heights, the relative positions between the first pressing body 302 and the second pressing body 404 need to be adjusted synchronously to facilitate the simultaneous contact of the first pressing body 302 and the second pressing body 404 with the two pads. Since the lead wire thickness decreases when it is pressed and welded on the pad, it is easier to break the lead wire at that position.

[0026] To facilitate the breakage of the lead wire, the bottom edge of the wire hole in the middle of the pressing body 404 can be set as a vertical surface. To avoid the pressing body 404 edge pressing the lead wire and causing it to break easily, the pressing body 404 edge can be set as an arc shape.

[0027] The technical solution of this invention effectively solves the problems of low working efficiency and cumbersome operation in the traditional single bonding mode. By using the first cleaver body 300 and the second cleaver body 400, pressure welding operations can be applied to both ends of the lead wire simultaneously, which can shorten the bonding cycle of a single lead wire and improve welding efficiency. At the same time, the welding path is transformed from the complex movement between two welding points of a single lead wire and between different leads to only the movement between different leads, which effectively simplifies the movement trajectory of the equipment. This not only reduces the programming and control difficulty of the CNC system, but also reduces the mechanical vibration and positioning deviation caused by frequent acceleration, deceleration and turning.

[0028] Furthermore, such as Figure 6 As shown, the second pressing body 404 is disc-shaped, and several embossing patterns are provided on the bottom surface of the second pressing body 404.

[0029] When the disc-shaped pressing body 404 is used to press the lead, the contact area between it and the lead and pad is relatively large. This allows for a large area of ​​atomic diffusion between the lead and the pad, improving the welding strength and facilitating the pressing of the lead into a flat shape. The embossing on the bottom surface of the pressing body 404 can create multiple stress concentration areas on the lead. This allows multiple corresponding positions between the lead and the pad to be heated first and undergo atomic diffusion. Then, the heat is transferred to other positions between the lead and the pad, enabling the lead and the pad to be quickly welded together and improving the heat generation efficiency. At the same time, the embossing can increase the friction between the pressing body 404 and the lead, preventing slippage between the pressing body 404 and the lead.

[0030] Furthermore, such as Figures 5 to 6 As shown, a threaded disc 405 is provided on the pressing body 2 404, and a threaded sleeve 406 that works with the threaded disc 405 is provided at the bottom of the vertical tube 403, and the pressing body 2 404 and the threaded sleeve 406 are connected by several spring pieces 407.

[0031] A wire hole is also provided in the middle of the threaded disc 405. The lead wire passes through the vertical tube 403, the wire hole in the middle of the threaded disc 405, and the wire hole in the middle of the pressing body 404 and extends out. Since the pressing body 404 and the vertical tube 403 are connected by the threaded disc 405 and the threaded sleeve 406, when the vertical tube 403 moves and presses the pressing body 404 onto the pad, the pressing body 404 stops moving. At this time, the vertical tube 403 can continue to move, so that the threaded disc 405 and the threaded sleeve 406 rotate relative to each other, thereby driving the pressing body 404 to rotate a certain angle on the pad. At this time, the pressing body 404 can roll the lead wire and make it easier to deform and thin the lead wire, increase the contact area between the lead wire and the pad, and improve the welding strength.

[0032] Since the threaded disc 405 and the pressing body 404 can rotate relative to the threaded sleeve 406, the inner wall of the wire hole in the threaded disc 405 can rotate out of alignment with the inner wall of the vertical tube 403 and squeeze the lead wire out of alignment, thereby achieving the locking and clamping of the lead wire and stopping the lead wire from being conveyed; the spring 407 can provide the threaded disc 405 with the reset spring force.

[0033] Furthermore, such as Figure 6 As shown, several cutting blades 408 for cutting the lead wire are arranged opposite each other on the inner wall of the wire hole.

[0034] When the pressing body 404 presses the lead wire and rotates relative to the threaded sleeve 406, the cutting edge 408 in the wire hole in the middle of the pressing body 404 will approach the lead wire on the pad and squeeze out a cut on the side wall of the lead wire. When the moving frame 100 is lifted, the cutting body 400 pulls the lead wire and uses the cut to break the lead wire.

[0035] It should be noted that when the lead wire is pulled, the second cleaver body 400 can move laterally relative to the pad. This allows the lead wire to be broken while the inner wall of the wire hole on the threaded disc 405 is kept in pressure and fixed. At the same time, this method can also be used to directly cut the lead wire using the corresponding cutting blade 408 or the vertical surface in the wire hole in the middle of the pressing body 404.

[0036] Furthermore, such as Figure 4 and Figure 7 As shown, the second splitter body 400 also includes a guide groove 409 for guiding the lead wire output from the wire hole toward the first splitter body 300. One end of the guide groove 409 is aligned with the wire hole, and the other end of the guide groove 409 is inclined upward, so that the lead wire between the first splitter body 300 and the second splitter body 400 is an upward arc shape.

[0037] The guide groove 409 is located below the pressing body 2 404 and its opening faces upward. When the lead wire from the wire hole in the middle of the pressing body 2 404 is output downward, the lead wire enters the guide groove 409 through one end. The inner wall of the guide groove 409 bends and guides the lead wire, so that the lead wire is inclined upward and transported to the clamping structure on the pressing body 1 302, thereby facilitating the pulling of the lead wire by the splitting body 1 300.

[0038] When the lead wire is pulled by the first cleaver body 300, the guiding direction of the lead wire by the guide groove 409 remains unchanged. The lead wire forms an upward arc between the first cleaver body 300 and the second cleaver body 400, which makes it easier to suspend other positions on the lead wire and separate it from other structures on the chip.

[0039] Furthermore, such as Figure 4 , Figure 5 and Figure 7As shown, the second chopping body 400 also includes a clearance structure for driving the guide groove 409 to deviate from the second pressing body 404. The clearance structure includes a side beam 410 located on the side of the vertical tube 403 and capable of relative sliding. A crank arm 411 is rotatably mounted on the side beam 410. One end of the crank arm 411 is connected to the guide groove 409, and the other end of the crank arm 411 is provided with a sliding groove 412. A sliding column 413 is provided on the side wall of the vertical tube 403 and is slidably connected to the sliding groove 412.

[0040] The side beam 410 is mounted on the movable frame 100, and the vertical tube 403 can slide relative to the side beam 410. The side beam 410 is mainly used to support the curved arm 411 and the guide groove 409. The slide groove 412 is located in the upper area of ​​the curved arm 411. When the vertical tube 403 moves relative to the side beam 410, the vertical tube 403 pushes the upper side of the curved arm 411 to rotate downward through its upper sliding column 413. The curved arm 411 rotates on the side beam 410, and the bottom of the curved arm 411 pushes the guide groove 409 to rotate to the side of the pressing body 404, so that the guide groove 409 avoids the pressing body 404, making it easier for the pressing body 404 to press the lead wire onto the corresponding pad. When the vertical tube 403 moves, the sliding column 413 slides synchronously in the slide groove 412.

[0041] Furthermore, the guide groove 409 and the pressing body 2 404 can move relative to each other, and when the guide groove 409 and the pressing body 2 404 approach each other, the guide groove 409 bends the end of the lead wire output from the wire hole or presses the lead wire to the bottom of the pressing body 2 404. A slider 414 is vertically slidably mounted on the side wall of the vertical tube 403. A sliding column 413 is mounted on the slider 414. The slider 414 and the vertical tube 403 are connected by a spring 415. A protrusion 416 for limiting the movement of the crank arm 411 is provided on the side beam 410.

[0042] The guide groove 409 is located below the pressing body 2 404, and the guide groove 409 and the pressing body 2 404 can move closer or further apart. When the distance between the guide groove 409 and the pressing body 2 404 is small, the lead wire output from the wire hole in the middle of the pressing body 2 404 will be bent by the direct guidance of the guide groove 409. At this time, the end of the lead wire forms a hook shape. When the end of the lead wire is delivered to the clamping structure position, the clamping structure can form a more effective clamping effect on the lead wire through the hook at the end of the lead wire. When the first splitting body 300 and the second splitting body 400 are separated from each other, there will be a lead wire segment of a specified shape between them. At this time, the guide groove 409... 09. Approaching the bottom of the second pressing body 404 from a position away from the pressing body 404, the guide groove 409 presses the lead between itself and the pressing body 404 onto the bottom surface of the pressing body 404. This prevents excess lead from being generated on the bottom surface of the pressing body 404. The pressing body 404 can directly press the lead on its bottom surface onto the pads. This avoids the situation where, when the guide groove 409 deviates directly from the pressing body 404, there is still a certain length of lead between the original position of the guide groove 409 and the pressing body 404. When the pressing body 404 moves down and presses the lead, this section of lead will contact other positions besides the pads, resulting in circuit connection errors.

[0043] like Figures 4 to 5 As shown, spring 415 provides elastic tension to slider 414 and slide column 413, and protrusion 416 provides a limit for crank arm 411. In the initial state, the side wall of crank arm 411 is in contact with protrusion 416. When vertical tube 403 moves downward relative to side beam 410, spring 415 pulls slider 414 to slide on vertical tube 403. The position of guide groove 409 and side beam 410 remains unchanged, and pressing body 2 404 approaches guide groove 409. When slider 414 moves to the specified position on vertical tube 403, vertical tube 403 and slider 414 move synchronously. At this time, slide column 413 pushes crank arm 411 to rotate, guide groove 409 deviates laterally from pressing body 2 404, and crank arm 411 separates from protrusion 416, so that guide groove 409 avoids pressing body 2 404. Pressing body 2 404 can press the lead wire onto the pad.

[0044] Using the above structure, the guide groove 409 and the pressing body 404 can be controlled to move closer or further apart, thereby facilitating bending the end of the lead wire or pressing the lead wire onto the bottom surface of the pressing body 404.

[0045] Furthermore, such as Figure 4 As shown, the side beam 410 is slidably mounted on the movable frame 100 via an auxiliary slide block 417.

[0046] The auxiliary slide 417 is fixed on the movable frame 100, and the side beam 410 slides on the auxiliary slide 417. The sliding distance is within the specified range. When the vertical tube 403 initially moves downward, the side beam 410 moves down synchronously by a specified distance due to the mutual contact between the protrusion 416 and the curved arm 411. The pressing body 2 404 and the guide groove 409 move down synchronously. During this process, the first chopping body 300 moves laterally away from the second chopping body 400, and a sufficiently long lead segment is generated between the first chopping body 300 and the second chopping body 400.

[0047] Using the above structure, the lateral movement of the first chopper body 300, the output of the lead wire, and the downward movement of the second chopper body 400 can be carried out simultaneously, thereby effectively saving time, avoiding the time waste of individual control or sequential control, and facilitating the integration of multiple steps into the same time period.

[0048] Furthermore, such as Figure 3 As shown, the clamping structure is a slot 303 formed on the side of the pressing body 302; The first splitting body 300 also includes a filler body 304. The filler body 304 is rotatably connected to the first pressing body 302 via a connecting bracket 305. The filler body 304 can move into or out of the slot 303. When the filler body 304 moves into the slot 303, the filler body 304 and the first pressing body 302 form a complete disc shape. Several embossed patterns are provided on the bottom surface of both the filler body 304 and the bottom surface of the first pressing body 302.

[0049] The slot 303 is located on the side of the pressing body 302 away from the pressing body 404. When the lead wire end on the lower side of the pressing body 404 is guided and transported into the slot 303 through the guide groove 409, the hook at the end of the lead wire can be engaged with the slot 303. Thus, when the splitting body 300 moves laterally, the pressing body 302 can directly pull the lead wire using the slot 303 and the hook at the end of the lead wire, thereby forming a lead wire segment of a specified length and shape between the splitting body 300 and the splitting body 400. This structure is simple and easy to operate.

[0050] The support rod 301 can be equipped with a power structure such as a cylinder or hydraulic cylinder to provide power for the movement of the filler 304. When the lead wire is pulled, the filler 304 is located outside the slot 303. When the pressing body 302 presses the lead wire onto the pad, the power structure pushes the filler 304 to rotate and move into the slot 303. At this time, the filler 304 flattens the hook position at the end of the lead wire and presses the lead wire onto the pad, realizing the welding connection between the lead wire and the pad.

[0051] The embossing of the disc-shaped body composed of pressing body 302 and filling body 304 and its bottom can have the same effect as the embossing of the disc-shaped pressing body 404 and its bottom, which will not be elaborated here.

[0052] Furthermore, such as Figure 3 As shown, the chopping blade body 300 also includes a vertical rod 306 disposed on the movable frame 100 and a sliding sleeve 307 slidably sleeved on the vertical rod 306. The sliding sleeve 307 and the support rod 301 are rotatably connected by two parallel guide arms 308, and the guide arms 308 and the sliding sleeve 307 are connected by an elastic body 309.

[0053] The elastic body 309 provides elastic force to the guide arm 308. When the crossbeam 401 moves downward, the support rod 301 is guided by the two guide arms 308 and pushed by the elastic body 309, causing it to tilt downward. The distance between the support rod 301 and the vertical tube 403 increases, and the support rod 301 slides relative to the crossbeam 401. The support rod 301 and the pressing body 302 remain vertical. When the guide arm 308 rotates at a specified angle, the force of the elastic body 309 on the guide arm 308 and the support rod 301 decreases. The crossbeam 401 pushes the sliding sleeve 307 to slide on the vertical rod 306 through the support rod 301 and the two guide arms 308. At this time, the pressing body 302 moves vertically downward and presses the lead wire onto the solder pad.

[0054] The rotation of the guide arm 308 and the arc-shaped movement of the pressing body 302 can be carried out simultaneously with the vertical downward movement of the pressing body 404 and the guide groove 409. The vertical downward movement of the pressing body 302 can be carried out simultaneously with the guide groove 409 avoiding the pressing body 404 and the pressing body 404 moving vertically downward.

[0055] After welding is completed, the crossbeam 401 moves upward, the sliding sleeve 307 slides upward on the vertical rod 306 and contacts the bottom of the moving frame 100, the sliding sleeve 307 stops moving, the crossbeam 401 continues to move and overcomes the elastic force of the elastic body 309 to pull the guide arm 308 to rotate, the guide arm 308 pushes the support rod 301 and the pressing body 1 302 to move in an arc, and the pressing body 1 302 moves laterally closer to the pressing body 2 404.

[0056] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of this application as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from its scope. Thus, if such modifications and modifications fall within the scope of this application and its equivalents, this application intends to include such modifications and modifications.

Claims

1. A dual-path wire bonding device for semiconductor electronic packaging, characterized in that, The device includes a movable frame and a pressure welding unit installed at the bottom of the movable frame. The pressure welding unit consists of a first cutting blade and a second cutting blade, and the first cutting blade and the second cutting blade respectively perform pressure welding on both ends of the lead wire. The first chopping blade includes a support rod and a pressing body installed at the bottom of the support rod; The second chopping body includes a horizontally arranged crossbeam, a power column that pushes the crossbeam to move in the vertical direction, a vertical tube arranged on the crossbeam, and a second pressing body arranged at the bottom of the vertical tube. The support rod is slidably arranged on the crossbeam laterally. The second pressing body has a wire hole in the middle, through which the lead wire passes and extends out. The first pressing body is provided with a clamping structure for holding the end of the lead wire. The first pressing body and the second pressing body are pressure welded to both ends of the lead wire.

2. The semiconductor electronic packaging dual-path wire bonding device according to claim 1, characterized in that, The second pressing body is disc-shaped, and has several embossed patterns on its bottom surface.

3. The semiconductor electronic packaging dual-path wire bonding device according to claim 1, characterized in that, The pressing body 2 is provided with a threaded disc, and the bottom of the vertical tube is provided with a threaded sleeve that works with the threaded disc. The pressing body 2 and the threaded sleeve are connected by several spring pieces.

4. The semiconductor electronic packaging dual-path wire bonding device according to claim 3, characterized in that, The inner wall of the wire hole is provided with several cutting blades for cutting the lead wire.

5. The semiconductor electronic packaging dual-path wire bonding device according to claim 1, characterized in that, The second splitting body also includes a guide groove for guiding the lead wire output from the wire hole toward the first splitting body. One end of the guide groove is aligned with the wire hole, and the other end of the guide groove is inclined upward, so that the lead wire between the first splitting body and the second splitting body is an upward arc shape.

6. A semiconductor electronic packaging dual-path wire bonding device according to claim 5, characterized in that, The second chopping body also includes a clearance structure for driving the guide groove to deviate from the second pressing body. The clearance structure includes a side beam located on the side of the vertical tube and capable of relative sliding. A curved arm is rotatably provided on the side beam. One end of the curved arm is connected to the guide groove, and the other end of the curved arm is provided with a sliding groove. A sliding column is provided on the side wall of the vertical tube and slidably connected to the sliding groove.

7. A semiconductor electronic packaging dual-path wire bonding device according to claim 6, characterized in that, The guide groove and the pressing body 2 can move relative to each other, and when the guide groove and the pressing body 2 approach each other, the guide groove will bend the end of the lead wire output from the wire hole or press the lead wire to stick to the bottom of the pressing body 2. A slider is vertically slidably mounted on the side wall of the vertical tube, and a sliding column is mounted on the slider. The slider and the vertical tube are connected by a spring, and a protrusion for limiting the movement of the crank arm is provided on the side beam.

8. A semiconductor electronic packaging dual-path wire bonding apparatus according to claim 7, characterized in that, The side beam is slidably mounted on the movable frame via an auxiliary slide.

9. A semiconductor electronic packaging dual-path wire bonding device according to claim 1, characterized in that, The clamping structure is a slot formed on one side of the pressing body; The first chopping body also includes a filler body. The filler body is rotatably connected to the first pressing body via a connecting frame. The filler body can move into or out of the slot. When the filler body moves into the slot, the filler body and the first pressing body form a complete disc shape. Several embossed patterns are provided on the bottom surface of both the filler body and the bottom surface of the first pressing body.

10. A semiconductor electronic packaging dual-path wire bonding device according to claim 9, characterized in that, The first chopping blade also includes a vertical rod disposed on the movable frame and a sliding sleeve slidably sleeved on the vertical rod. The sliding sleeve and the support rod are rotatably connected by two parallel guide arms, and the guide arms and the sliding sleeve are connected by an elastic body.

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