Deposition method and apparatus
By using an indirect transfer method and combining a transfer plate with a heat supply device, the problems of long process time and misalignment of patterns in thermally induced deposition were solved, achieving efficient and accurate functional material deposition.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FRONTEK HOLDINGS LTD
- Filing Date
- 2024-09-12
- Publication Date
- 2026-06-02
AI Technical Summary
In existing thermally induced deposition techniques, when functional materials are directly transferred from the donor plate to the target surface, there are problems such as long processing time and misalignment and pattern distortion caused by shear force during high-resolution pattern deposition.
An indirect transfer method is adopted, in which functional materials are indirectly transferred from the donor plate to the target surface through a transfer plate. The positioning of the transfer plate and the heat supply equipment are used to achieve accurate deposition of functional materials, avoiding the influence of shear force during direct transfer.
It achieves higher throughput and more efficient functional material deposition, reduces process time, and improves the accuracy and consistency of high-resolution patterns.
Smart Images

Figure CN122138909A_ABST