Transport system and transport method

Abstract

The conveying system includes: a conveying module extending along a first direction; a plurality of processing modules disposed along the extending direction of the conveying module; and a loading module connected to the conveying module and extending along a second direction perpendicular to the first direction. The loading module has: a main housing including a loading port for loading a conveyed object into the loading module; and a sub-housing separate from the main housing and formed smaller than the main housing, connected to and attached to the conveying module in the second direction of the main housing. The second direction is parallel to the carrier conveyor line that conveys the carrier containing the conveyed object.

Description

Technical Field

[0001] This invention relates to a conveying system and a conveying method. Background Technology

[0002] Patent Document 1 discloses a transport system (probe system) that uses a transport mechanism to transport a carrier containing multiple wafers as transport objects and transfers the wafers to each of multiple processing modules (probe devices). This transport system is equipped with a loading module (transfer mechanism) for each processing module. The loading module removes the wafer from the carrier transported by the transport mechanism and transfers the wafer to the processing module, whereby each processing module inspects the wafer.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 6-69295 Summary of the Invention The problem that the invention aims to solve This invention provides a technology that can efficiently transfer materials to multiple processing modules while improving the floor space required.

[0004] Methods for solving problems According to one aspect of the present invention, a conveying system is provided, comprising: a conveying module extending along a first direction; a plurality of processing modules connected to the conveying module and disposed along the extending direction of the conveying module; and a loading module connected to the conveying module and extending along a second direction perpendicular to the first direction. The loading module has: a main housing including a loading port for moving a conveyed object into the loading module; and a secondary housing separate from the main housing and formed smaller than the main housing, connected to the main housing and connected to the conveying module in the second direction. The second direction is parallel to a carrier conveying line for conveying a vehicle containing the conveyed object.

[0005] The effects of the invention One method allows for efficient transfer of materials to multiple processing modules while improving the footprint. Attached Figure Description

[0006] 【 Figure 1 [Image 1] is a floor plan showing an example of a work site where the conveying system according to the embodiment is installed.

[0007] 【 Figure 2 [This is an enlarged plan view showing the substrate inspection unit and the top conveyor.]

[0008] 【 Figure 3 [This is a further enlarged plan view showing the loading module and inspection device.]

[0009] 【 Figure 4 [This is a perspective view showing the main housing and sub-housing of the loading module.]

[0010] 【 Figure 5 [This is a magnified perspective view showing the negative X-axis side of the conveying module and the inspection device.]

[0011] 【 Figure 6A The diagram above is a floor plan illustrating the function of adjusting the extension length of the conveying module.

[0012] 【 Figure 6B The image shown is an enlarged plan view illustrating the interconnectedness of the segmented frames.

[0013] 【 Figure 6C The image shown is an enlarged side view illustrating how the segmented frames are connected to each other.

[0014] 【 Figure 7A The image shown is the main view of the energy management device.

[0015] 【 Figure 7B [ ] is a side view showing the energy management device.

[0016] 【 Figure 8 [Illustration 1] is a flowchart illustrating the conveying method involved in the implementation. Detailed Implementation

[0017] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the drawings, the same symbol is sometimes used to refer to the same structural part, and repeated descriptions are omitted.

[0018] Figure 1 This is a floor plan showing an example of a work area 2 where the conveying system 1 according to the embodiment is installed. (See attached image.) Figure 1 As shown, the conveying system 1 is constructed in a workplace 2, such as a semiconductor manufacturing facility or a semiconductor inspection facility. In this embodiment, the system is used to inspect the substrate W (see reference 1) which is being conveyed. Figure 2 The inspection apparatus 50 describes the transport system 1 for transporting the substrate W. The substrate W, which is inspected by the inspection apparatus 50, can be, for example, a wafer (test wafer) in which multiple semiconductor devices (DUTs) are arranged in a matrix. Furthermore, the substrate W is not limited to wafers; it can also be a carrier containing semiconductor devices, a glass substrate, a chip unit, an electronic circuit board, etc.

[0019] The transport system 1 includes an overhead hoist transport (OHT) 10 for a transport carrier C and multiple substrate inspection units 20. The carrier C is a container capable of holding multiple (e.g., 25) substrates W. As an example of this carrier C, a FOUP (Front Opening Unified Pod) with one side freely openable and closable can be cited. The overhead hoist transport 10 transports the carrier C in either a state containing multiple substrates W or an empty state.

[0020] The top conveyor 10 includes a track 11 fixed to the ceiling of the work area 2, and a lifting mechanism (not shown) that carries the vehicle C along the track 11 while allowing the vehicle C to move up and down. For example, the lifting mechanism has the function of suspending the vehicle C and raising and lowering the vehicle C via a belt. In addition, the top conveyor 10 has a control device 19 at an appropriate location in the work area 2 to control the operation of the top conveyor 10.

[0021] exist Figure 1 For ease of understanding, the diagram shows that track 11 is located away from each substrate inspection unit 20, but track 11 is basically configured to pass above the loading module 30 of each substrate inspection unit 20 (see also...). Figure 2 The lifting mechanism, which moves along track 11, can automatically place the carrier C onto the loading module 30 by moving directly above the loading module 30 of the target substrate inspection unit 20 and lowering the carrier C. Conversely, the lifting mechanism can remove the carrier C from the substrate inspection unit 20 by moving directly above the carrier C of the loading module 30, holding and lifting the carrier C.

[0022] For example, track 11 extends along the long side from the center of the short side of work area 2, turns back at one end of the long side, and then extends again along the long side from the center of the short side of work area 2, forming a vehicle transport line. Additionally, in Figure 1 In this context, the long side of work area 2 refers to the horizontal direction of the paper, and the short side of work area 2 refers to the vertical direction of the paper. By concentrating the track 11 in the center of the short side direction, the top conveying device 10 can efficiently transport the carriers C to all the substrate inspection units 20 in work area 2 while shortening the travel distance of multiple carriers C.

[0023] The track 11 can also be in a ring shape that allows multiple lifting mechanisms to circulate. For example, the top conveying device 10 has a vehicle changing section (not shown) at the other end of the long side of the ring track 11 for retrieving or changing the vehicle C. Alternatively, the top conveying device 10 can also have a turnout track that branches off at the middle of the track 11, and have a vehicle changing section on the turnout track.

[0024] The control unit 19 of the top conveying device 10 employs a computer including a processor (not shown), memory, input / output interfaces, and communication interfaces. The processor is a device that combines one or more of the following: CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), or circuits composed of multiple discrete semiconductors, and executes programs stored in the memory. The memory includes a main storage device composed of semiconductor memory and the like, and auxiliary storage devices composed of disks, drives, semiconductor memory (flash memory), etc.

[0025] The control device 19 moves the lifting mechanism to the target position on the track 11 and controls the lifting, holding, and disengagement of the carrier C. Furthermore, the control device 19 controls the carrier changing unit to perform the retrieval and replacement of the carrier C, and manages the status of each base plate W within the carrier C. Additionally, the control device 19 can be installed alongside a management computer that manages the entire transport system 1 (workplace 2).

[0026] On the other hand, each substrate inspection unit 20 of the conveying system 1 is configured to extend in a direction perpendicular to the extension direction of the track 11, which is located at the center of the short side. That is, the long side direction of each substrate inspection unit 20 extends from the center of the short side direction of the work area 2 to the end of the short side direction (side of the work area 2). In the work area 2, each substrate inspection unit 20 is arranged in pairs with the track 11 sandwiching the center, and is spaced apart and arranged side by side in the extension direction of the track 11 (the long side direction of the work area 2).

[0027] Each substrate inspection unit 20 is constructed by combining multiple modules to efficiently transport substrates W from the carrier C and perform substrate W inspection. Specifically, each substrate inspection unit 20 includes: a loading module 30; a transport module 40 connected to the loading module 30; and multiple inspection devices 50 connected to the transport module 40. Each substrate inspection unit 20 removes the substrate W from the carrier C, which is transported to the loading module 30 by the top transport device 10, and transports the substrate W to the target inspection device 50 via the transport module 40, where the substrate W is inspected.

[0028] Figure 2 This is an enlarged plan view showing the substrate inspection unit 20 and the top conveying device 10. Next, refer to... Figure 2An example of the substrate inspection unit 20 will be described. In the description of the substrate inspection unit 20, based on... Figure 2 The arrows indicate the location and direction of each structure. Figure 2 The X-axis direction is the horizontal direction of the paper, which is the direction along the extension direction of the conveying module 40. Figure 2 The Y-axis direction is the longitudinal direction of the paper, which is the direction along the extension of the loading module 30. Figure 2 The Z-axis direction is the near and deep direction of the paper surface, and is the height direction of the substrate inspection unit 20.

[0029] The loading module 30 of the substrate inspection unit 20 is positioned vertically below the track 11 of the top conveying device 10. The long side of the loading module 30 is along the Y-axis. In other words, the long side of the loading module 30 is aligned with the track 11 extending along the Y-axis.

[0030] Figure 3 This is a further enlarged plan view showing the loading module 30 and the inspection device 50. Figure 4 This is a perspective view showing the main housing 35 and the secondary housing 36 of the loading module 30. (See diagram below.) Figure 3 and Figure 4 As shown, multiple loading modules 30 are arranged side-by-side along the Y-axis. Figure 2 There are 4 loading ports 31, which can accommodate multiple vehicles C respectively.

[0031] The loading port 31 of the loading module 30 receives the carrier C from the lifting mechanism of the top conveying device 10 and transfers the carrier C to the lifting mechanism. The carrier C, placed on the loading port 31, is secured by a locking mechanism (not shown) of the loading port 31. As the shutter 32 of the loading port 31 opens, the surface of the carrier C in the positive X-axis direction is opened, thereby enabling the loading and unloading of the substrate W.

[0032] The loading module 30 internally includes a loading-side conveying device 33 for removing the base plate W of the carrier C from each loading port 31 and conveying it to the conveying module 40. This loading-side conveying device 33 is not particularly limited, but may include, for example: a base 331 movable along the long side of the loading module 30; multiple arms 332 freely rotatable, extendable, and retractable relative to the base 331; and forks (end effectors) 333 mounted on the end arms 332. Additionally, Figure 3 An example of a loading-side conveying device 33 with two forks 333 is given, but it is not limited thereto; the loading-side conveying device 33 may also have a structure with one or more forks 333.

[0033] Inside the loading module 30, there is a channel 30s for the loading-side conveying device 33 to move in the Y-axis direction. The loading module 30 can also be configured to allow clean air to flow downward in the channel 30s. In addition, inside the loading module 30, there can also be an alignment device 34, which detects the position and circumferential orientation (posture) of the substrate W, and works in conjunction with the loading-side conveying device 33 to adjust the position offset and posture of the substrate W. Figure 3 The loading module 30 is equipped with an alignment device 34 on the positive Y-axis side and the negative X-axis side connected to the conveying module 40.

[0034] Furthermore, the loading module 30 is configured to include: a main housing 35 having loading ports 31; and a sub-housing 36 formed separately from the main housing 35 and serving as a relay between the main housing 35 and the transfer module 40. The main housing 35 and the sub-housing 36 are arranged in the Y-axis direction. For example, the sub-housing 36 is connected to one end of the main housing 35 in the long side direction (positive Y-axis direction). Alternatively, the loading module 30 may be formed by separately forming the internal frames of the main housing 35 and the sub-housing 36, but the cover plates covering the internal frames are integrally continuous.

[0035] The main housing 35 is assembled from multiple frames (not shown) to form a box that is rectangular in shape when viewed from the X-axis and L-shaped when viewed from the Y-axis. The main housing 35 has loading ports 31 on the upper surface of the L-shaped stepped portion. Furthermore, a door 35d is provided on the side of the main housing 35 in the negative Y-axis direction, providing access to the main housing 35 during maintenance and other purposes. The door 35d is a single-leaf door that opens and closes the main housing 35 through a door panel. During maintenance and other purposes, personnel can easily access the loading-side conveyor 33 by opening this door 35d.

[0036] The sub-shell 36 is formed by assembling multiple frames (not shown) to create a cuboid that is longer in the X-axis direction and shorter in the Y-axis direction when viewed from above, and has a predetermined height in the Z-axis direction. This sub-shell 36 is smaller than the main shell 35. In the embodiment, the loading module 30 ensures that the length of the sub-shell 36 in the long side direction (X-axis direction) is consistent with the width of the main shell 35 in the short side direction (X-axis direction). Furthermore, the width of the sub-shell 36 in the Y-axis direction is set to be the same as (or greater than) the width of the transfer module 40.

[0037] The aforementioned alignment device 34 is provided inside the sub-housing 36. Furthermore, a door 36d is provided on the side of the sub-housing 36 in the positive Y-axis direction, allowing the interior of the sub-housing 36 to be exposed during maintenance, etc. The door 36d is a double door that opens and closes the sub-housing 36. Specifically, the door 36d has a first door panel 36d1 located on the negative X-axis side and a second door panel 36d2 located on the positive X-axis side. The first door panel 36d1 is supported by a hinge axis on its negative X-axis side and opens and closes by rotation. The second door panel 36d2 is supported by a hinge axis on its positive X-axis side and opens and closes by rotation. A locking mechanism that can switch between being closed and open is provided at the boundary between the first door panel 36d1 and the second door panel 36d2.

[0038] In addition, such as Figure 3 and Figure 4 As shown, the width of the second door panel 36d2 (its length along the X-axis when closed) is shorter than the width of the first door panel 36d1 (its length along the X-axis when closed). That is, the first door panel 36d1 can open the sub-shell 36 to a large extent, while the second door panel 36d2 can open the sub-shell 36 to a smaller extent. Therefore, the second door panel 36d2 will not protrude significantly outwards when open, effectively avoiding interference with the testing machine moving mechanism 54 described later. Furthermore, the door 36d is not limited to the aforementioned double door; it can also be a folding door, etc.

[0039] Furthermore, a controller 90 is provided inside the sub-housing 36 to control the operation of each structure of the substrate inspection unit 20. For example, by arranging the controller 90 at an adjacent position to the door 36d (on the positive Y-axis side of the sub-housing 36), the operator can easily access the controller 90 when opening the door 36d.

[0040] Furthermore, the sub-housing 36 has a user-operable control panel 37 on the side in the positive Y-axis direction. By placing the control panel 37 on the side in the positive Y-axis direction, the opportunity for operators to work on the negative X-axis side where each loading port 31 is located can be reduced, thus reducing contact between the carrier C transported by the top conveyor 10 and the operators.

[0041] The main housing 35 and the sub-housing 36 each have a channel 30s for the loading-side conveying device 33. The main housing 35 has an opening 35o on its side in the positive Y-axis direction that communicates with the channel 30s. Similarly, the sub-housing 36 has an opening 36o on its side in the negative Y-axis direction that communicates with the channel 30s. The loading module 30 is connected to allow the openings 35o of the main housing 35 and 36o of the sub-housing 36 to communicate with each other, thereby enabling the loading-side conveying device 33 to move between the housings.

[0042] The loading module 30, comprising two housings, allows the main housing 35 to be universally applicable to various substrate inspection units 20. That is, even if the type of substrate inspection unit 20 changes, the same main housing 35 can still be used. Furthermore, the loading module 30 also allows the secondary housing 36 to be customized in terms of structure and shape to meet the needs of each customer. For example, if the customer does not require the alignment device 34, a secondary housing 36 without the alignment device 34 can be used. By making the main housing 35 uniform while allowing the secondary housing 36 to be customized, the loading module 30 can suppress changes in the overall module specifications and meet the needs of various customers.

[0043] The conveying module 40 is connected to the side of the sub-housing 36 in the loading module 30 along the positive X-axis direction, and extends in a straight line along the X-axis. That is, the extension direction of the long side of the conveying module 40 intersects perpendicularly with the extension direction of the long side of the loading module 30. Figure 2 As shown, multiple (3) inspection devices 50 are connected to both sides of the extension direction of the conveying module 40 (i.e., the side in the positive Y-axis direction and the side in the negative Y-axis direction). Each inspection device 50 is connected perpendicularly to the extension direction of the conveying module 40 (at an angle of 90°). However, each inspection device 50 may also be connected relative to the conveying module 40 at an angle of approximately 45° to 90°.

[0044] The transfer module 40 receives and transfers the substrate W between itself and the loading module 30, and simultaneously transfers the substrate W to the target inspection device 50 among the multiple inspection devices 50, and transfers and receives the substrate W to the stage 52 of the target inspection device 50.

[0045] Specifically, the transfer module 40 includes: a transfer housing 41 extending along the X-axis direction; a buffer portion 42 disposed on the negative X-axis side of the transfer housing 41; and a transfer device 43 that reciprocates within the transfer housing 41 along the X-axis direction. Alternatively, the transfer module 40 can also be a vacuum transfer module that transfers the substrate W while the transfer space 41s of the transfer housing 41 is depressurized to a vacuum atmosphere.

[0046] Figure 5 This is an enlarged perspective view showing the negative X-axis side of the conveying module 40 and the inspection device 50. (See image below.) Figure 5 As shown, the transport housing 41 forms its skeleton by assembling a base plate 411 and multiple frames 412. The transport housing 41 constructs a closed transport space 41s by installing panels (not shown) on these base plates 411 and multiple frames 412.

[0047] The base plate 411 of the conveying housing 41 is fixed to the floor of the work area 2 via multiple legs 413. Each of the multiple legs 413 has a level adjuster (not shown) that can adjust the height in the Z-axis direction. By adjusting each level adjuster when setting up the conveying module 40, the upper surface of the base plate 411 is adjusted to a horizontal plane.

[0048] A sliding mechanism 44 for a conveying device 43 is provided on the base plate 411 of the conveying housing 41. The sliding mechanism 44 includes: a pair of tracks 441 extending along the X-axis; an annular belt 442 extending laterally from the tracks 441; a drive source 443 for rotating the belt 442; and a movable body 444 that moves with the belt 442. The movable body 444 is mounted between the pair of tracks 441 and serves as a base supporting the conveying device 43 by providing the conveying device 43 on its upper surface. The drive source 443 is connected to the controller 90 of the substrate inspection unit 20, and the controller 90 controls the drive to rotate the belt 442, causing the movable body 444 to reciprocate along the extension direction of the pair of tracks 441. In addition, the conveying device 43 is not limited to the sliding mechanism 44 including the belt 442 and the drive source 443, and various mechanisms can be used. As an example, the sliding mechanism 44 can adopt a structure in which the movable body 444 is slidable by a linear motor.

[0049] Figure 6A This is a plan view illustrating the function of adjusting the extension length of the conveying module 40. Figure 6B This is an enlarged plan view showing the interconnected segments 415. Figure 6C This is an enlarged side view showing the interconnectedness of the segmented frames 415. (As shown) Figure 6A As shown, the conveying module 40 involved in the embodiment is configured to extend in the extension direction (X-axis direction).

[0050] Specifically, the conveying housing 41 houses the base plate 411 and the frame 412 (see reference). Figure 5 The number of segmented frames 415 configured to match the inspection device 50 is set, and a series of continuous configurations are formed by connecting multiple segmented frames 415. Furthermore, by replacing the belt 442 of the sliding mechanism 44 with a belt that matches the movement range (number of segmented frames 415) of the conveying device 43, the conveying device 43 can move approximately its entire length in the X-axis direction. Additionally, a pair of tracks 441 are configured to be arranged in a straight line relative to adjacent segmented frames 415, for example, by being pre-installed at predetermined positions on the base plate 411 of the segmented frames 415. The tracks 441 of one segmented frame 415 are connected to the tracks 441 of the other segmented frame 415, for example, by connecting tracks 454.

[0051] Adjacent partition frames 415 are connected by appropriate connection structures 45. For example, the connection structure 45 could be... Figure 6B As shown, a V-block 451 is provided on one of the dividing frames 415, while a pin 452 for inserting the V-block 451 is provided on the other dividing frame 415. In this case, the dividing frames 415 can be easily positioned by inserting the pin 452 into the V-shaped space of the V-block 451. Furthermore, the height of each dividing frame 415 (base plate 411 and frame 412) can be adjusted using the level adjuster of the legs 413 described above.

[0052] Furthermore, such as Figure 6C As shown, the connecting structure 45 includes a connecting plate 453 to eliminate the seams between the base plates 411 supporting a pair of rails 441. The connecting structure 45 can be configured to use the connecting plate 453 pre-installed with the connecting rails 454, and by fixing the connecting plate 453 to each base plate 411, the rails 441 and the connecting rails 454 are connected in a series.

[0053] Back Figure 5 The buffer section 42, provided on the aforementioned transport housing 41, is positioned at an appropriate height via a platform 421 placed on the base plate 411. This buffer section 42 temporarily accommodates the substrate W transported by the loading-side transport device 33 of the loading module 30 and transfers it to the transport device 43. Furthermore, the buffer section 42 temporarily accommodates the substrate W transported by the transport device 43 and transfers it to the loading-side transport device 33. The buffer section 42 may also have a loading locking function capable of switching the internal space between atmospheric and vacuum atmospheres.

[0054] A gate valve 46 is provided on the side of the buffer section 42 in the negative X-axis direction to open and close the opening of the buffer section 42. The gate valve may also be provided on the side of the buffer section 42 in the positive X-axis direction. The substrate inspection unit 20 allows the substrate W to be transported between the loading module 30 and the buffer section 42 by opening the gate valve 46 on the negative X-axis direction side, and depressurization is achieved in the transport module 40 containing the buffer section 42 by closing each gate valve 46. In addition, the substrate inspection unit 20 allows the substrate W to be transported between the transport device 43 and the buffer section 42 by opening the gate valve on the positive X-axis direction side.

[0055] Furthermore, the substrate W is moved in and out between the conveying device 43 and the buffer section 42 of the conveying module 40. The conveying device 43 moves in the X-axis direction via the movable body 444 of the sliding mechanism 44, thereby moving to the relative position of the target inspection device 50 among the plurality of inspection devices 50 connected to the conveying module 40. The conveying device 43 enters and exits the interior of the opposing inspection device 50, and moves the substrate W in and out between the inspection device 50.

[0056] The conveying device 43 is not particularly limited and can be a device having an end effector 431 that holds the base plate W and a moving part 432 that moves the end effector 431. As an example, the moving part 432 has a retractable arm (not shown) and a shaft (not shown) that can rotate about an axis with the base of the arm as a base point. Furthermore, the moving part 432 is configured to have a lifting mechanism 433 that can be raised and lowered in the Z-axis direction, allowing adjustment of the height position of the end effector 431. The moving part 432 of the conveying device 43 rotates the arm and the end effector 431 within a range of 180° or more. Thus, the conveying device 43 can allow the end effector 431 to enter and exit the inspection devices 50 respectively connected to both sides of the conveying module 40.

[0057] Furthermore, the conveying device 43 may also include a receiving body 47 that travels integrally on a pair of tracks 441 and temporarily houses the substrate W. For example, the receiving body 47 is mounted on the movable body 444 of the sliding mechanism 44 and is positioned on the positive X-axis side of the moving part 432. The receiving body 47 has one or more openings 471 on its side facing the negative X-axis opposite to the moving part 432, for loading and unloading the substrate W. After the conveying device 43 rotates and lifts the moving part 432 to align the end effector 431 with the opening 471, it uses a telescopic arm to load and unload the substrate W between itself and the interior of the receiving body 47 via the opening 471.

[0058] Furthermore, the housing 47 may also have an internal attitude adjustment device (alignment device: not shown) that works in conjunction with the conveying device 43 to adjust the position and orientation of the contained substrate W. By equipping the attitude adjustment device at an adjacent position to the conveying device 43, the time lost due to the movement of the conveying device 43 and the readjustment of the substrate W's position by the alignment device 34 can be reduced when the substrate W experiences positional shifts. Alternatively, the substrate inspection unit 20 may not be equipped with the alignment device 34 of the loading module 30.

[0059] In addition to moving integrally with the conveying device 43, the housing 47 can also be configured to be positioned at an appropriate location on the conveying module 40. For example, the conveying module 40 may also have the housing 47 at the end on the positive X-axis side (the end opposite to the loading module 30).

[0060] In addition, such as Figure 2As shown, the conveying module 40 includes multiple detection sensors 48 to enable the conveying device 43 to identify its position in the X-axis direction. These multiple detection sensors 48 are, for example, positioned by the conveying device 43 at the location of each conveying substrate W of the multiple inspection devices 50. However, the positions of the detection sensors 48 are not limited to this; for example, they can be arranged at equal intervals along the X-axis direction. Furthermore, the detection sensors 48 are not limited to multiple sensors; only one sensor can be provided along the path of the conveying device 43. This is because even if only one detection sensor 48 detects the position of the conveying device 43, the position of the conveying device 43 in the X-axis direction can be calibrated.

[0061] Each detection sensor 48 can be fixed at any location on the ceiling, side wall, floor, etc., of the conveying housing 41. As this detection sensor 48, an optical sensor capable of optically detecting the presence or absence of the conveying device 43 can be used. For example, the detection sensor 48 has a light-emitting section that illuminates inspection light and a light-receiving section that receives reflected light from the inspection light, and outputs information about the presence or absence of the conveying device 43 by detecting a detection surface (not shown) provided on the conveying device 43. Furthermore, the type of detection sensor 48 is not particularly limited as long as it can detect the position of the conveying device 43; it can be a distance sensor or a contact sensor.

[0062] The controller 90 stores information on the X-axis position (X-axis coordinate) corresponding to the setting positions of the multiple detection sensors 48. Based on the timing of acquiring information about the presence of the conveying device 43 from the detection sensors 48 and the stored X-axis coordinate information, the controller 90 identifies the X-axis coordinate of the conveying device 43 moving within the conveying housing 41. Based on this position identification of the conveying device 43, the controller 90 can perform high-precision position control of the conveying device 43 during its movement.

[0063] like Figure 5 As shown, the inspection device 50 connected to the aforementioned conveying module 40 inspects the electrical characteristics of the substrate W conveyed by the conveying module 40. This inspection device 50 has an inspection device housing 51 (… Figure 5 (Only the frame is shown) and a stage 52 that supports the substrate W inside the housing 51 of the inspection device. The stage 52 has a movement mechanism (not shown) that moves the substrate W to a 3D coordinate position of the target.

[0064] Back Figure 2 The inspection device 50 has, above the inspection device housing 51, a probe card (not shown) that holds a plurality of probes having contact with the substrate W, and a tester 53 that performs inspection of the substrate W. Furthermore, the inspection device 50 has a tester moving mechanism 54 that holds the tester 53 in the test position (see reference 50). Figure 2 (dashed line) and retreat position (reference) Figure 2The test machine 53 moves between the double-dotted lines. A support platform 55 is provided to support the test machine 53 in the retracted position. In addition, the inspection device 50 includes a cooler (not shown) for adjusting the temperature of the substrate W during inspection, and a suction mechanism (not shown) for depressurizing the inside of the inspection device housing 51, etc., which are provided around the inspection device housing 51 and the test machine moving mechanism 54.

[0065] Furthermore, the inspection device 50 is connected to the transport module 40 via the connecting buffer 60 in a perpendicular intersecting direction (90° angle). The connecting buffer 60, by positioning the inspection device housing 51 away from the transport housing 41, allows the testing machine moving mechanism 54 and the like to be installed without interfering with the transport housing 41. Figure 5 As shown, the connecting buffer section 60 is constructed by assembling multiple frames 61 and a panel (not shown). This connecting buffer section 60 is formed as a cuboid smaller than the moving part 432 of the conveying device 43 of the conveying module 40, allowing it to enter the moving part 432. Furthermore, although not shown, a gate valve for closing the inspection device housing 51 may be provided inside the connecting buffer section 60.

[0066] The length of the dividing frame 415 is set according to the overall dimensions of the inspection device 50, including the inspection device housing 51 connected to the connecting buffer section 60 and the testing machine moving mechanism 54. Therefore, by connecting the dividing frame 415 along the X-axis direction, the conveying module 40 can arrange each inspection device 50 at equal intervals.

[0067] Furthermore, the loading module 30, conveying module 40, and various inspection devices 50 of the substrate inspection unit 20 require energy sources such as electricity, gas supply (positive pressure), and gas suction (negative pressure) during the conveying and inspection of the substrate W. Electricity is used to operate various structures of the substrate inspection unit 20 and to supply power and signals to the substrate W during inspection. Gas suction is used to fix the substrate W. Gas supply is used for cleaning the loading module 30 and adjusting the pressure within the space. Therefore, the substrate inspection unit 20 has sources of electricity, gas suction, and gas supply, and also... Figure 2 As shown, an energy management device 70 is provided for the unified management (distribution, supply, cut-off, etc.) of various required energy sources. That is, each power source and each structure of the board inspection unit 20 are connected via a path through the energy management device 70.

[0068] For example, one energy management device 70 is provided for each of the multiple substrate inspection units 20, and is located near the outer side of the area where the multiple inspection devices 50 are arranged (see also...). Figure 1However, the system in work site 2 can also be structured so that one energy management device 70 manages the required energy of multiple (e.g., two) substrate inspection units 20. Furthermore, the location of the energy management device 70 is not particularly limited; for example, it can be located on the loading module 30 side.

[0069] Figure 7A This is a front view showing an example of an energy management device 70. Figure 7B This is a side view showing an example of an energy management device 70. Additionally, in Figure 7A and Figure 7B For ease of explanation, the diagram shows the device with the closable door removed. The energy management device 70 includes a management device housing 71 and an operating panel 72 located within the management device housing 71 and accessible to an operator when the door is open.

[0070] The management device housing 71 is formed into a cuboid with a length along the Z-axis (vertical direction) by assembling multiple frames and multiple panels. At the bottom of the management device housing 71, multiple casters 71a are provided to facilitate its movement, and multiple fixing bodies 71b are provided to secure the management device housing 71 to the installation location. Inside the management device housing 71, portions of cables and conduits connected to the required energy source are housed, as well as portions of cables and conduits connected to multiple inspection devices 50. Furthermore, the management device housing 71 has openable and closable doors (not shown) on the front and sides. The doors of the energy management device 70 are closed during operation and are opened by operators during installation or maintenance.

[0071] The control panel 72 is equipped with various devices operated by the operator. With the door on the front of the management device housing 71 open, the control panel 72 exposes these devices. To facilitate operator access when the front door is open, the control panel 72 is fixed to the front side of the management device housing 71 (see reference). Figure 7B The control panel 72 includes a power distribution panel 73 for distributing power, a gas supply distribution panel 74 for distributing supplied gas, and a gas suction distribution panel 75 for distributing suction force. Furthermore, the location of the control panel 72 is not limited to the front of the management device housing 71; it can also be on the back, or both the front and back.

[0072] The distribution panel 73 is positioned, for example, approximately at the center of the vertical direction of the management device housing 71. The distribution panel 73 is connected to a power source (power supply) via a main cable 76 and to various structures of the board inspection unit 20 via multiple distribution cables. Furthermore, on the front of the distribution panel 73, power cut-off devices such as circuit breakers are provided on the main cable 76 and each distribution cable. The main cable 76 and each distribution cable, housed within the management device housing 71, are guided to the space to the side of the operation panel 72 via a partition wall 711 that divides the operation panel 72 vertically. This reduces interference between the cables and gas piping in the energy management device 70.

[0073] The gas supply distribution panel 74 is, for example, located adjacent to the lower side of the distribution panel 73. The gas supply distribution panel 74 is connected to a gas generation source (supply pump, etc.) via a primary-side pipe 741, and to various structures of the substrate inspection unit 20 via multiple secondary-side pipes 742. Furthermore, on the front side of the gas supply distribution panel 74, there are valves 743 for opening and closing the flow paths of the primary-side pipe 741 and each of the secondary-side pipes 742, and connectors (not shown) for connecting each of the secondary-side pipes 742. The primary-side pipe 741 and each of the secondary-side pipes 742 extend outwards through the bottom of the management device housing 71.

[0074] The gas suction distribution plate 75 is, for example, located adjacent to the gas supply distribution plate 74 below it. The gas suction distribution plate 75 is connected to a suction source (suction pump, etc.) via a primary side pipe 751, and to various structures of the substrate inspection unit 20 via multiple secondary side pipes 752. Furthermore, on the front side of the gas suction distribution plate 75, there are valves 753 for opening and closing the flow paths of the primary side pipe 751 and each of the secondary side pipes 752, and connectors (not shown) for connecting each of the secondary side pipes 752. The primary side pipe 751 and each of the secondary side pipes 752 extend outwards through the bottom of the management device housing 71.

[0075] The aforementioned energy management device 70 can centrally manage the required energy (electricity, gas supply, gas extraction). For example, before the main unit is installed, operators can connect all cables and pipes by contacting the control panel 72 once. This reduces working hours and shortens the initial setup time. Furthermore, the energy management device 70 can manage the disconnection and supply of hazardous energy sources such as electricity and gas in one location. Moreover, in case of malfunctions in any module, the energy management device 70 can disconnect only that module, preventing a decrease in operational efficiency due to maintenance or troubleshooting.

[0076] Back Figure 3The controller 90, located in the loading module 30, is configured as a computer having a processor (not shown), memory, input / output interfaces, and a communication interface. The controller 90 is connected to the aforementioned control panel 37, which serves as the user interface, via the input / output interfaces.

[0077] The control panel 37 serves as an input device for user operation, including a touchscreen, buttons, and a keyboard. Furthermore, the control panel 37 also serves as an output device, including a display with a touchscreen, speakers, and lights.

[0078] Based on the input from the operator via the control panel 37, the controller 90 controls the various structures of the loading module 30 and the transport module 40, thereby transporting the substrate W within the substrate inspection unit 20. Furthermore, the controller 90 issues commands to the inspection device 50, which has transported the substrate W, to perform inspection of the substrate W by the inspection device 50.

[0079] The conveying system 1 involved in the implementation method has basically the structure described above, and will be referred to below. Figure 8 Explain the actions (transfer methods). Figure 8 This is a flowchart illustrating the conveying method involved in the implementation.

[0080] The conveying system 1 executes operations based on the control device 19 of the top conveying device 10 and the controller 90 of the substrate inspection unit 20. Figure 8 The processing flow of steps S101 to S110 is shown.

[0081] Specifically, the control device 19 of the top conveying device 10 conveys the carrier C via a lifting mechanism and places the carrier C on the loading port 31 of the target substrate inspection unit 20 (loading module 30) (step S101). For example, the control device 19 has pre-stored the coordinate positions of each loading port 31 of each substrate inspection unit 20, reads the coordinate position of the target loading port 31, controls the movement of the lifting mechanism, and moves the carrier C directly above the loading port 31. Subsequently, the control device 19 lowers the carrier C via the lifting mechanism, places the carrier C on the target loading port 31, and then releases the carrier C from its position. Furthermore, the controller 90 of the substrate inspection unit 20 obtains information that the carrier C has been placed from the loading port 31 (or the control device 19) where the carrier C is located, thereby transferring the substrate W within the substrate inspection unit 20 for conveying.

[0082] Specifically, the controller 90 controls the loading-side conveying device 33 of the loading module 30 to remove the substrate W from the carrier C and move it into the interior of the main housing 35 (step S102). Then, the controller 90 moves the loading-side conveying device 33 to the sub-housing 36, conveying the held substrate W to the alignment device 34 (step S103). Next, the controller 90 controls the alignment device 34 and the loading-side conveying device 33 to perform position offset and attitude adjustment of the substrate W (step S104).

[0083] Subsequently, the controller 90 removes the substrate W from the alignment device 34 via the loading-side conveying device 33 and conveys the substrate W to the buffer section 42 of the conveying module 40 (step S105). Therefore, the substrate W, whose position has shifted and whose orientation has been adjusted, is housed inside the buffer section 42.

[0084] Next, the controller 90 controls the conveying device 43 and sliding mechanism 44 of the conveying module 40 to move the substrate W out of the buffer section 42 and transport the substrate W to the relative position of the target inspection device 50 (step S106). During the movement of the conveying device 43, each detection sensor 48 arranged along the X-axis detects the presence or absence of the conveying device 43 and sends the detection information to the controller 90. Based on the detection information of each detection sensor 48, the controller 90 accurately identifies the position of the conveying device 43, thereby appropriately controlling the movement of the conveying device 43.

[0085] Then, at the relative position of the inspection device 50, the controller 90 uses the conveying device 43 to move the substrate W into and out of the interior of the inspection device housing 51 and place the substrate W on the stage 52 of the inspection device 50 (step S107).

[0086] After the substrate W is placed, the controller 90 activates the tester 53 of the inspection device 50 to inspect the substrate W (step S108).

[0087] After the substrate W is inspected, the controller 90 again causes the end effector 431 of the transfer device 43 to enter and receive the substrate W on the stage 52, and removes the substrate W from the inspection device 50 (step S109). Then, the controller 90 moves the transfer device 43 to transport the substrate W to the buffer section 42, and at the same time causes the loading-side transfer device 33 to operate, receive the substrate W from the buffer section 42, and move the substrate W into the appropriate carrier C (step S110). Thus, the inspection of the substrate W by the substrate inspection unit 20 ends.

[0088] The substrate inspection unit 20 collects the inspected substrates W in the carrier C by transferring multiple substrates W housed in the carrier C to each inspection device 50 and inspecting them repeatedly. Then, the control device 19 of the top conveying device 10 controls the lifting mechanism to hold the carrier C containing the inspected substrates W, so that the carrier C rises (detaches) from the substrate inspection unit 20 and is transported along the track 11.

[0089] The aforementioned conveying system 1, by arranging the loading module 30 of the substrate inspection unit 20 along the extension direction of the track 11, enables the carrier C to be smoothly positioned on the loading port 31 at the target location. In particular, by using the same specifications for the main housing 35, the loading module 30 reduces structural changes on the top conveying device 10 side, thus stabilizing the conveying of the carrier C. On the other hand, by making the sub-housing 36 customizable, the loading module 30 can easily meet customer needs.

[0090] Furthermore, the conveying system 1 and conveying method of the present invention are not limited to the above-described embodiments, and various modifications can be adopted. For example, in the embodiments, a conveying system 1 is described that is configured with a substrate inspection unit 20 having multiple inspection devices 50 as processing modules. However, it is not limited to this, and in the conveying system 1, a substrate processing unit having a substrate processing apparatus may be used instead of part or all of the substrate inspection unit 20. As a substrate processing apparatus, for example, a processing module that performs substrate processing such as film formation, etching, cleaning, bonding, and peeling on the substrate W can be listed. In addition, the substrate processing apparatus may also be an apparatus that processes the substrate W in a process after the substrate W is manufactured, such as a repair apparatus, a marking apparatus, a reflow soldering apparatus, or a visual inspection apparatus. In other words, the conveying system 1 can be adapted to a structure that conveys the substrate W to a processing module that performs various operations on the substrate W during the manufacturing process of the substrate W.

[0091] Furthermore, the transported items are not limited to the substrate W; for example, they can be probe cards, polishing plates, etc. Moreover, the transported items can also be consumable components used in the processing module. As an example of such consumable components, a ring (focusing ring, edge ring, etc.) disposed around the substrate W within the processing module can be cited.

[0092] Furthermore, the device for transporting the carrier C is not limited to the top transport device 10 that transports directly above the loading module 30, but can also be a device that slides horizontally adjacent to the loading module 30. Additionally, the transport module 40 is not limited to being connected to the positive X-axis side of the sub-housing 36, but can also be connected to the positive Y-axis side of the sub-housing 36.

[0093] The technical concept and effects of the present invention described in the above embodiments are as follows.

[0094] The first aspect of the present invention includes: a conveying module 40 extending along a first direction; a plurality of processing modules (inspection devices 50) connected to the conveying module 40 and arranged along the extending direction of the conveying module 40; and a loading module 30 connected to the conveying module 40 and extending along a second direction perpendicular to the first direction. The loading module 30 has: a main housing 35 including a loading port 31 for loading a substrate W into the loading module 30; and a sub-housing 36 separate from the main housing 35 and formed smaller than the main housing 35, connected to and attached to the conveying module 40 in the second direction of the main housing 35. The second direction is parallel to the carrier conveying line (track 11) of the carrier C containing the substrate W.

[0095] Based on the above, the transfer system 1 can efficiently transfer substrates W to multiple processing modules (inspection devices 50). Specifically, the transfer system 1 can stably transfer the carrier C containing the substrates W to the loading port 31 of the main housing 35 of the loading module 30. Then, by transferring the substrates W to the transfer module 40 via the sub-housing 36 connected in the second direction of the main housing 35, they can smoothly reach the target processing module. In particular, the transfer system 1 does not require a mechanism for transferring substrates W from the carrier C to multiple processing modules separately, thus improving the overall system footprint. Furthermore, by having a sub-housing 36 that is smaller than the main housing 35, the transfer system 1 allows the loading module 30 to be easily and within a small range of customization, making it convenient for application in various systems.

[0096] Furthermore, the carrier conveyor line (track 11) extends along the second direction, and multiple units (substrate inspection units 20) having a conveying module 40, multiple processing modules (inspection devices 50), and a loading module 30 are provided on both sides of the carrier conveyor line. As a result, the conveying system 1 can shorten the conveying distance of the carrier C and can convey the carrier C to the unit more efficiently.

[0097] Furthermore, the sub-housing 36 has an alignment device 34 inside for adjusting the position or orientation of the substrate W. Thus, the transfer system 1 can transfer the substrate W, whose position or orientation has been adjusted in the sub-housing 36, to the transfer module 40.

[0098] Furthermore, the secondary housing 36 has a control panel 37 operable by an operator on the opposite side of the connection point with the main housing 35. This reduces the need for operators to move to the loading port 31, and minimizes contact between the carrier C and the operators.

[0099] Furthermore, the sub-housing 36 has a door 36d on the opposite side of the connection point with the main housing 35, allowing the interior of the sub-housing 36 to be exposed. This allows the conveying system 1 to easily access the loading module 30, enabling efficient maintenance and other operations.

[0100] Furthermore, multiple processing modules (inspection devices 50) are respectively connected to both sides of the conveying module 40 in the second direction. Therefore, the conveying system 1 can have more processing modules relative to the conveying module 40, further improving the floor space required.

[0101] Furthermore, the multiple processing modules (inspection devices 50) respectively provided on both sides of the second direction are staggered and connected to each other in the first direction of the conveying module 40. As a result, even when the test machine moving mechanism 54 that moves the test machine 53 between the test position and the retraction position is arranged with the test machine 53 in the first direction, the footprint in the first direction can be further improved compared to the case where the inspection devices 50 are set to face each other on both sides of the conveying module 40.

[0102] Furthermore, multiple processing modules constitute the inspection device 50 for inspecting the substrate W, which is being transported. Thus, the transport system 1 is able to efficiently inspect the substrate W using the inspection device 50.

[0103] Furthermore, a second aspect of the present invention is a conveying method of a conveying system 1, the conveying system 1 comprising: a conveying module 40 extending along a first direction; a plurality of processing modules (inspection devices 50) connected to the conveying module 40 and arranged along the extending direction of the conveying module 40; and a loading module 30 connected to the conveying module 40 and extending along a second direction perpendicular to the first direction. The method comprises: (A) a step of transporting a carrier C containing a substrate W along a direction parallel to a second direction via a carrier transport line (track 11) and placing the carrier on a loading port 31 provided on the main housing 35 of the loading module 30; (B) after step (A), a step of removing the substrate W from the carrier C at the loading port 31 and transporting the substrate W to a sub-housing 36, which is separate from the main housing 35 and formed to be smaller than the main housing 35, connected to the main housing 35 in the second direction and connected to the transport module 40, and moving the substrate W into the transport module 40; and (C) after step (B), a step of transporting the substrate W in the transport module 40 and transporting the substrate W to a processing module. Even in this case, the transport method can efficiently transport the substrate W to multiple processing modules while improving the floor space.

[0104] The conveying system 1 and conveying method disclosed herein are exemplary and not limiting in all respects. The embodiments can be modified and altered in various forms without departing from the scope and spirit of the appended claims. The items described in the foregoing embodiments can be adopted in other structures or combined without contradiction.

[0105] This application claims priority to Basic Application No. 2023-196164 filed with the Japan Patent Office on November 17, 2023, and Japan Patent Application No. 2024-110534 filed with the Japan Patent Office on July 9, 2024, as a domestic priority claim, the entire contents of which are incorporated herein by reference.

[0106] Explanation of reference numerals in the attached figures 1. Transport System 11 orbits 30 Loading Module 35 main housing 36 Sub-shell 40 Transfer Modules 50 Inspection device W substrate

Claims

1. A conveying system comprising, The conveying module extends along the first direction. Multiple processing modules connected to the conveying module and arranged along the extending direction of the conveying module, and A loading module connected to the conveying module and extending along a second direction perpendicular to the first direction. The loading module includes: The main housing has a loading port for feeding materials into the loading module. A secondary housing, separate from and smaller than the main housing, connected to the main housing in the second direction and connected to the conveying module, is also included. The second direction is a direction parallel to the vehicle transport line of the vehicle that carries the transported item.

2. The conveying system according to claim 1, wherein the carrier conveying line extends along the second direction. The unit having the conveying module, the plurality of processing modules and the loading module is provided in multiple positions on both sides of the carrier conveying line.

3. The conveying system according to claim 1 or 2, wherein the sub-housing has an alignment device inside for adjusting the position offset or attitude of the conveyed object.

4. The conveying system according to claim 1 or 2, wherein the secondary housing has a control panel operable by an operator on the opposite side of the connection position with the main housing.

5. The conveying system according to claim 1 or 2, wherein the sub-housing has a door on the opposite side of the connection position with the main housing, through which the interior of the sub-housing can be exposed.

6. The conveying system according to claim 1 or 2, wherein the plurality of processing modules are respectively connected to the two sides of the conveying module in the second direction.

7. The conveying system according to claim 6, wherein the plurality of processing modules respectively disposed on both sides of the second direction are offset from each other and connected in the first direction of the conveying module.

8. The conveying system according to claim 1 or 2, wherein the plurality of processing modules are inspection devices that inspect the substrate serving as the conveyed object.

9. A conveying method, which is a conveying method of a conveying system, the conveying system comprising: The conveying module extends along the first direction. Multiple processing modules connected to the conveying module and arranged along the extending direction of the conveying module, and A loading module connected to the conveying module and extending along a second direction perpendicular to the first direction. The method has the following characteristics: (A) In the process of transporting the carrier containing the transported item through a carrier transport line in a direction parallel to the second direction, the carrier is placed on the loading port located on the main housing of the loading module. (B) Step: After step (A), the transported item is removed from the carrier at the loading port, transported to a sub-shell that is separate from the main shell and smaller than the main shell, connected to the main shell in the second direction, and connected to the transport module, and the transported item is then loaded into the transport module. (C) Step: After step (B), the transported item is transported in the transport module and then to the processing module.

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