Heat sink bus bar

Abstract

An electronic component is disclosed. The electronic component may include a component substrate with one or more electrical connections and electronic devices mounted to a first surface of the component substrate. The electronic devices may include a plurality of electronic modules mounted on and electrically connected to the first surface of the device substrate. The device substrate may have one or more traces. The electronic devices may also include a busbar having a first portion and a second portion, the first portion extending along at least a portion of the lateral dimension of the substrate, and the second portion having at least two fins extending non-parallel and away from the first portion and between the plurality of electronic modules, to be electrically and mechanically connected to the one or more traces disposed on the first surface of the substrate. The one or more fins may include a thermally conductive material.

Description

Technical Field

[0001] This field relates to an electronic component, and more specifically, to an electronic component that includes the use of a heat sink as a busbar. Background Technology

[0002] Various electronic devices (e.g., high-power regulators) experience conduction losses and generate significant heat in order to achieve higher power and output performance. However, increasing the number of substrates to reduce conduction losses increases the overall cost of the substrate, and the presence of thermal resistance reduces heat transfer to the ambient air. Summary of the Invention

[0003] For the purpose of summarizing this disclosure and the advantages achieved relative to the prior art, certain objects and advantages of this disclosure are described herein. Not all such objects or advantages can be achieved in any particular embodiment. Therefore, for example, those skilled in the art will recognize that the invention may be embodied or practiced in a manner that achieves or optimizes one or more advantages as taught herein, without necessarily achieving other objects or advantages as taught or suggested herein.

[0004] All these embodiments are intended to be within the scope of the invention disclosed herein. These and other embodiments will become apparent to those skilled in the art from the following detailed description of preferred embodiments with reference to the accompanying drawings, and the invention is not limited to any particular preferred embodiment disclosed.

[0005] In one embodiment, the electronic component may include a component substrate including one or more electrical connections. The electronic component may include electronic devices mounted to a first surface of the component substrate. The electronic devices may include a plurality of electronic modules mounted on and electrically connected to the first surface of the component substrate, the component substrate having one or more traces and busbars. The busbar may include: a first portion extending along at least a portion of a lateral dimension of the component substrate; and a second portion having one or more protrusions extending non-parallel and away from the first portion and between the plurality of electronic modules, for electrical and mechanical connection to one or more traces disposed on the first surface of the component substrate, the one or more protrusions comprising a thermally conductive material.

[0006] In some embodiments, one or more protrusions may include at least two protrusions. In some embodiments, an electronic component may include a second electronic device mounted on and electrically connected to a second surface opposite to a first surface of a component substrate. In some embodiments, the second electronic device includes a processor. In some embodiments, the first portion extends to at least partially cover the plurality of electronic modules. In some embodiments, the electronic device and the second electronic device are electrically connected to each other via one or more electrical connections. In some embodiments, the one or more electrical connections include at least one of traces and vias. In some embodiments, the one or more protrusions are located above the plurality of electronic modules. In some embodiments, the one or more protrusions are soldered to the one or more traces. In some embodiments, the first portion includes a flat surface. In some embodiments, a busbar includes a top surface that is substantially flat. In some embodiments, the top surface includes an insulating layer that electrically isolates the top surface. In some embodiments, the top surface is attached to the top of the one or more protrusions with an adhesive. In some embodiments, the adhesive includes a non-conductive adhesive. In some embodiments, the second portion includes a lead frame. In some embodiments, the top surface is soldered to the lead frame. In some embodiments, the lead frame includes one or more tie rods connecting protrusions of the lead frame. In some embodiments, the one or more tie rods are curved with a profile based on the ratio of the gap between adjacent protrusions to the height of the protrusion. In some embodiments, the electronic component may include multiple lead frames to provide multiple channels. In some embodiments, the one or more protrusions include a protrusion insulation layer near the substrate. In some embodiments, the protrusion insulation layer reduces potential solder uptake. In some embodiments, the multiple protrusions correspond to multiple traces disposed on the substrate. In some embodiments, the one or more protrusions may include at least one of thin blades or thick pillars. In some embodiments, the busbar includes two or more segments connected to corresponding current paths (e.g., corresponding high-current paths for each package). In some embodiments, the electronic component may include metal clips soldered to the busbar, wherein the metal clips are connected to a power source and thereby provide power to the electronic component. In some embodiments, the metal clips are connected to a power source and provide power to the electronic component. In some embodiments, the multiple electronic modules include integrated circuit field-effect transistors. In some embodiments, the multiple electronic modules are soldered to the substrate. In some embodiments, the one or more protrusions have an aspect ratio of at least 2:1. In some embodiments, a first portion of the busbar includes a heat sink portion configured to absorb heat from (i) the device substrate and (ii) the top side of the multiple electronic modules. In some embodiments, the busbar reduces current path resistance.In some embodiments, the electronic component may include a first terminal and a second terminal connected to one or more traces. In some embodiments, a first voltage is supplied to the first terminal during operation. In some embodiments, a second voltage is supplied from the second terminal during operation of the electronic component. In some embodiments, the plurality of electronic modules include a package and a passive element connected to the package, wherein the package includes a molding compound. In some embodiments, the package includes a molding compound. In some embodiments, the component includes a passive device. In some embodiments, the passive device includes at least one of an inductor and a transformer. In some embodiments, the busbar includes a thermally and electrically conductive material. In some embodiments, the busbar includes a metal (e.g., copper or aluminum in various embodiments).

[0007] In another embodiment, an electronic package may include: a substrate including one or more traces disposed on a surface of the substrate and voltage inputs and voltage outputs connected to the one or more traces; a plurality of electronic modules configured to be mounted on and electrically connected to the substrate, wherein the one or more traces are disposed between the modules of the plurality of electronic modules; and a busbar extending along at least a portion of the length of the substrate, the busbar including one or more protrusions electrically connected and mechanically connected to the one or more traces.

[0008] In some embodiments, the one or more protrusions are soldered to the one or more traces. In some embodiments, the busbar includes a top surface that is substantially flat. In some embodiments, the top surface includes an insulating layer that electrically isolates the top surface. In some embodiments, the top surface is attached to the top side of the one or more protrusions with an adhesive. In some embodiments, the adhesive includes glue. In some embodiments, the busbar includes a lead frame. In some embodiments, the top surface is soldered to the lead frame. In some embodiments, the lead frame includes one or more tie rods connecting one or more protrusions of the lead frame. In some embodiments, the one or more tie rods are curved with a profile based on the ratio of the gap between adjacent protrusions to the height of the protrusion. In some embodiments, the electronic package may include multiple lead frames to provide multiple channels. In some embodiments, the one or more protrusions include a protrusion insulating layer near the substrate. In some embodiments, the protrusion insulating layer near the substrate reduces potential solder uptake. In some embodiments, the multiple protrusions correspond to multiple traces disposed on the substrate. In some embodiments, the one or more protrusions may include at least one of thin blades, thick pillars, or custom shapes. In some embodiments, the busbar includes two or more segments that connect to multiple high-current paths of each package. In some embodiments, the electronic package may include metal clips soldered to a busbar for lateral power delivery. In some embodiments, the metal clips are connected to a power source and provide power to the electronic package. In some embodiments, the plurality of electronic modules include integrated circuits. In some embodiments, the plurality of electronic modules are soldered to the substrate. In some embodiments, the one or more protrusions have an aspect ratio of 2:1. In some embodiments, the busbar includes a heat sink portion configured to absorb heat from the top side of the substrate and the plurality of electronic modules. In some embodiments, the busbar includes a thermally and electrically conductive material. In some embodiments, the busbar includes metal.

[0009] In another embodiment, a method of manufacturing an electronic component may include: providing a substrate including one or more traces and voltage inputs and voltage outputs connected to the one or more traces; mounting an electronic device package including a plurality of electronic modules to mechanically secure the electronic device package to a first surface of the substrate and electrically connect the electronic device package to the first surface of the substrate, wherein the one or more traces are disposed between modules of the plurality of electronic modules; mounting a second electronic device package to mechanically secure the second electronic device package to a second surface of the substrate opposite to the first surface and electrically connect the second electronic device package to the second surface of the substrate opposite to the first surface; and mounting a busbar extending along the length of the substrate to the substrate, the busbar including one or more protrusions for electrical and mechanical connection to the one or more traces.

[0010] In some embodiments, the method may include mounting a top surface to a busbar. In some embodiments, the method may include insulating the top surface. In some embodiments, the method may include plating the top surface. In some embodiments, the method may include stamping the busbar to form the one or more protrusions and one or more tie rods on either side of one or more gaps, thereby forming the one or more protrusions. In some embodiments, the method may include bending the one or more tie rods. In some embodiments, the method may include insulating the one or more protrusions to electrically insulate them. In some embodiments, the method may include mounting a second busbar to a substrate. Attached Figure Description

[0011] Various embodiments will be described below with reference to the accompanying drawings. These embodiments are illustrative and descriptive by way of example only and are not intended to limit the scope of this disclosure. In the drawings, similar elements have similar reference numerals.

[0012] Figure 1 The illustration shows a schematic side view of the electronic component.

[0013] Figure 2 This is a schematic perspective view of the first electronic device.

[0014] Figure 3 yes Figure 2 A schematic side view of the first electronic device.

[0015] Figure 4 When the busbar is installed Figure 2 and Figure 3 An exploded perspective view of the first electronic component, which is assembled in the previous part of the electronic device assembly.

[0016] Figure 5 yes Figures 2-4 A schematic perspective view of an exemplary first electronic device after assembly.

[0017] Figure 6 This is a schematic front view of the first electronic device.

[0018] Figure 7 It is a schematic front view of a first electronic device having an insulating layer disposed above the top surface of the busbar.

[0019] Figures 8-9 This is a schematic perspective view of a first electronic device, in which another embodiment of the busbar includes a lead frame.

[0020] Figures 10-13 Various examples of busbars according to various implementations are shown.

[0021] Figures 14-16 Another example of the first electronic device is shown, in which busbars are used for the input current path and the output current path.

[0022] Figure 17 Further examples including metal clips are shown. Figure 14-16 A schematic perspective view of the first electronic device.

[0023] Figure 18 A metal clip is shown that is electrically and mechanically connected to a busbar for lateral power transmission.

[0024] Figure 19 Another embodiment of a metal clip that is electrically and mechanically connected to a busbar for lateral power transmission is shown.

[0025] Figures 20-21 Various schematic perspective views are shown illustrating embodiments of the tie rod of the lead frame.

[0026] Figure 22 An example method for processing busbars according to an implementation is shown.

[0027] Figure 23 This is a schematic perspective view of the lead frame used in low-profile electrical modules.

[0028] Figure 24 This is a schematic perspective view of the lead frame used in high-profile electrical modules.

[0029] Figure 25 A schematic perspective view of the busbar positioned above the even-numbered row electrical modules is shown.

[0030] Figure 26 A schematic perspective view of the busbar positioned above the odd-numbered busbar modules is shown.

[0031] Figure 27 Another embodiment of the first electronic device is shown, in which the busbar operates as a heat sink. Detailed Implementation

[0032] This disclosure can be understood by referring to the following detailed description. It should be noted that, for purposes of clarity of illustration, some elements in the various drawings may not be drawn to scale, may be represented schematically or conceptually, or may not precisely correspond to certain physical configurations of the embodiments.

[0033] This relates to implementations of busbars that can be used as heat sinks. The high current capability of the busbar and the heat exchange performance of the heat sink can be combined to create a busbar that also functions as a heat sink. With voltage regulators demanding significantly more output current (e.g., currents in the 800A-1000A range), vertical power modules can be a novel approach to power delivery. Current solutions place the voltage regulator on the opposite side of a substrate (e.g., a PCB) beneath an integrated circuit (IC) on the top side, such as an application-specific integrated circuit (ASIC). As a result, conduction losses due to ultra-high output currents can be reduced due to the short connection between the vertical power module and the top-side IC via through-holes in the pads. Conduction losses can occur due to the resistance of various components through which current flows, and this lost current can generate heat in the component. However, conduction losses due to input current are often overlooked. Electrical components can suffer excessive conduction losses due to excessive trace resistance on the substrate used for the input current path. Modifications to the substrate can reduce power losses, in some cases by half, but this reduction is insufficient. Another approach could involve adding an extra layer to the PCB to reduce losses, but the trade-off is that substrate costs can increase by more than 30%.

[0034] The busbar design of this heatsink can be similar to that of an extruded fin heatsink. Unlike traditional heatsinks, the heatsink busbars disclosed herein provide both electrical connectivity and heat dissipation. The heatsink can have as many protrusions (e.g., fins, pillars, blades, etc.) as possible to increase surface area and optimize thermal performance. However, it can also depend on the number of contact points refined down to the substrate to reduce current path resistance. For example, in a fin heatsink, fins can be inserted into the gaps between electrical modules. Therefore, the size of the fin gaps can depend on the module size. The busbar can be positioned such that the fins can form solder connections with exposed busbars and / or traces on the substrate and positioned on top of the electrical modules using an adhesive that fills the air gaps. Direct connection of the busbar to the substrate reduces the effective resistance of high current paths, reducing conduction losses and excessive substrate heating. Furthermore, the busbar can also act as a heatsink to draw heat from the top side of the substrate and electrical modules to surfaces exposed to the surrounding environment.

[0035] Other embodiments of the busbar can include a lead frame to form blades that function similarly to the fins of a radiator busbar. Ties between the blades of the lead frame can hold the blades together vertically and ensure their coplanarity. To further reduce the effective resistance of the lead frame, a solid and / or flat metal sheet can be soldered downwards to the top of the lead frame. Flat pieces can be adhered to the lead frame to provide electrical isolation, as the adhesive acts as a thermal interface and insulation.

[0036] The presence of multiple electrical modules with slightly varying heights can pose challenges for pick-and-place during the testing and assembly of vertical power modules, as the vacuum seal applied to the modules may not be robust enough. Therefore, heatsink busbars can include flat top surfaces to help improve vacuum sealing. Heatsink busbars can also be used for multiple high-current paths within a vertical power module. Without insulation, the flat top surface can be connected to another bus in another system via soldered metal clips. The metal clips can extend onto the PCB to reduce conduction losses in high-current paths within the system. The metal clip extensions can also function as heat sinks.

[0037] Heatsink busbars can also be used in lateral power systems. Optimizing both the input and output current paths with busbars can reduce conduction losses due to lateral power delivery. If the IC package has a top-up power path, metal clips can be soldered between the IC and the power module.

[0038] Figure 1 An example electronic component 100 is illustrated, including a component substrate 102, a first electronic device package 200 (also referred to herein as a first electronic device) mounted to a first side 102a of the component substrate 102, and a second electronic device package 104 (also referred herein as a second electronic device) mounted to a second side 102b opposite to the first side 102a of the component substrate 102. The electronic device 200 and the second electronic device package 104 may be attached to the component substrate 102 using conductive adhesives such as solder, conductive epoxy, etc. The component substrate 102 may include one or more electrical connections 106 (e.g., traces and / or vias). In some embodiments, the electronic device 200 and the second electronic device 104 may be electrically connected to each other via one or more electrical connections 106. In some embodiments, the second electronic device package 104 may include a processor, such as an application-specific integrated circuit, a graphics processing unit (GPU), a central processing unit (CPU), or any high-power device utilizing low input voltage and therefore requiring high input current.

[0039] Figure 2 and Figure 3 Example electronic device 200 is shown. (Figure) Figure 2 This is a schematic perspective view of example electronic device 200. Figure 3This is a schematic side view of electronic device 200. Electronic device 200 may include a plurality of electronic modules 202 mounted on and electrically connected to a first surface 204a of device substrate 204. Electronic modules 202 may be attached to device substrate 204 using a conductive adhesive such as solder, conductive epoxy resin, etc. Electronic modules 202 may include a package 202a and a component 202b attached to the top surface of package 202a. Package 202a may include any suitable type of electronic component, such as an integrated device die, other types of active components, passive components (e.g., resistors, capacitors, inductors, integrated circuits, field-effect transistors (FETs), transformers, etc.), sensors, microelectromechanical systems (MEMS) components, or any other suitable type of component embedded in a sealant. In some embodiments, electronic module 202... Component 202b may include any suitable type of electronic component, such as an integrated device die, other types of active components, passive components (e.g., resistors, capacitors, inductors, integrated circuits, field-effect transistors (FETs), transformers, etc.), sensors, microelectromechanical systems (MEMS) components, or any other suitable type of component. Electronic module 202 may be and / or include modules similar to or identical to those discussed in U.S. Application No. 16 / 681,136, filed November 12, 2019, entitled "Electronic Module for High Power Applications," now U.S. Patent No. 11,410,977, and / or U.S. Application No. 17 / 325,080, filed May 19, 2021, entitled "Electronic Components," the disclosures of which are incorporated herein by reference in their entirety. In some embodiments, electronic module 202 may include field-effect transistors (FETs).

[0040] In some embodiments, the electronic module 202 may be arranged on the first surface 204a. In some embodiments, the device substrate 204 may further include electrical terminals 240 formed on the second surface 204b of the device substrate 204. In some embodiments, the electrical terminals 240 may be molded ball grid array (BGA) packages, pad grid arrays, and / or vertical interconnect PCB connections. The device substrate 204 may be mounted on the component substrate 102 via the electrical terminals 240.

[0041] like Figure 4As shown, the device substrate 204 may also have one or more laterally extending traces 206 providing horizontal electrical communication within the electronic device 200. One or more laterally extending traces 206 may be electrically connected to a first terminal 208 and a second terminal 210. The first terminal 208 may be located on a first edge 212 of the device substrate 204, and the second terminal 210 may be located on a second edge 214 different from the first edge 212. During operation of the electronic assembly 100, a first voltage may be provided to the first terminal 208. Additionally or alternatively, during operation of the electronic assembly 100, a second voltage may be supplied from the second terminal 210 to another device. In some embodiments, a molding and / or sealing compound 216 may be molded onto at least a portion of the electronic module 202 (e.g., molded onto a first surface 204a of the electronic device 200 to protect the electronic module 202).

[0042] Electronic device 200 may also include, for example Figure 4-7 The radiator busbar 220 shown. Figure 4 This is a schematic perspective view of the example electronic device 200 before assembly. Figure 5 This is a schematic perspective view of the assembled example electronic device 200. Figure 6 This is a schematic side view of electronic device 200. Figure 7This is a schematic side view of an electronic device 200 having an insulating layer 230 disposed above the top surface of a heat sink busbar 220. The heat sink busbar 220 may include a first portion 222 extending along at least a portion of the lateral dimension of a device substrate 204 and a second portion 224 having at least two protrusions (e.g., fins 226) extending non-parallel and away from the first portion 222. Although the illustrated embodiment includes protrusions with fins 226, in some embodiments, the protrusions may include pillars, blades, or other protruding tabs. In some embodiments, the heat sink busbar 220 may be positioned above an electronic module 202 such that the heat sink busbar 220 rests on the top surface of the electronic module 202. Adhesive and / or epoxy resin may fill the gap between the top surface of the electronic module 202 and the heat sink busbar 220. In some embodiments, a thermally conductive material (e.g., a thermal interface material) may be disposed between the first portion 222 and the module 202. In some embodiments, the first portion 222 of the heat sink busbar 220 may include a heat sink portion to draw heat from the top side of the device substrate 204 and the electronic module 202 during operation of the electronic components, thereby dissipating the heat to the surrounding environment. The number of fins 226 may be based on at least the number of traces 206. The fins 226 may be shaped as at least one of thin blades, thick pillars, or custom shapes. The heat sink busbar 220 may use a variety of shapes other than thin blade and / or fin shapes to contact the device substrate 204. In some embodiments, as described below, thin blades and / or fins 226 may be used in high aspect ratio applications and reduce their footprint. The heat sink busbar 220 may be a solid piece, such that the first portion 222 and the second portion 224 are of a unified structure.

[0043] Fins 226 may extend between electronic modules 202, and a first end 226a of the fin 226 may be electrically and mechanically connected to a trace 206 disposed on a first surface 204a. In some embodiments, the fins 226 may be attached to the trace 206 using a conductive adhesive such as solder, conductive epoxy, etc. A heat sink busbar 220 may be attached to the trace 206, allowing the fins 226 to form a connection with the trace 206 on the device substrate 204. The direct connection between the busbar 220 and the trace 206 on the device substrate 204 allows for a significant reduction in the effective resistance along the high current path of the trace 206, thereby minimizing conduction losses and excessive substrate heating. The busbar is a conductive structure with low resistance and high current carrying capacity. By integrating the busbar 220 directly with the trace 206, this combination improves power distribution and grounding, resulting in improved electrical performance and heat dissipation. Busbar 220 can be connected to trace 206 at specific points to form a robust and efficient conductive network. These connection points facilitate low-resistance paths for power and ground signals.

[0044] The heat sink busbar 220 also enables low-loss power distribution, minimizes voltage drop, and ensures consistent power delivery to the electronic modules 202 on the device substrate 204, which can lead to improved performance and / or reduced sensitivity to signal interference. Trace 206 provides power and ground connections to the input and output terminals of the electronic modules 202. The electronic modules 202 at the front of the electronic device 200 can receive 100% of the load current. As the load current continues along trace 206 and through subsequent electronic modules 202, the current gradually decreases. The electronic modules 202 can regulate the power entering along trace 206, which may result in power loss. The electronic modules 202 can be used as a voltage regulator to maintain a stable output voltage, independent of changes in input voltage, load current, or temperature. The voltage regulator can be used to ensure that sensitive electronic components receive a stable and consistent power supply. During operation, the voltage regulator regulates the input voltage to provide a constant output voltage. This regulation process involves dissipating excess energy as heat. The generated heat can be proportional to the voltage drop between the input and output multiplied by the current flowing through the regulator. The internal resistance of the regulator causes a voltage drop, resulting in heat generation. The heat generated by the electronic module 202 can be significant, depending on factors such as the voltage difference between the input and output, the regulated current, and / or the efficiency of the voltage regulator itself. Therefore, heat dissipation mechanisms, such as heat sinks or thermal pads, can be employed to ensure that the temperature of the voltage regulator remains within safe operating limits.

[0045] Epoxy resins with a low coefficient of thermal expansion (CTE) can also be used to attach the fins 226 to the device substrate 204. In some embodiments, the fins 226 may include a fin insulating layer 232 located near the first surface 204a to reduce potential solder uptake. In some embodiments, the heat sink busbars 220 reduce current path resistance. In addition to the reduced resistance, the inductance of the high current path is also significantly reduced, which is crucial in high-current applications.

[0046] The fin 226 can have an aspect ratio defined by the ratio of the height or length L of the fin 226 to the width W or diameter of the fin 226. The aspect ratio can be greater than 1:1, for example, at least 2:1, for example, in the range of 1:1 to 10:1, in the range of 1:1 to 5:1, in the range of 1:1 to 3:1, in the range of 2:1 to 7:1, or in the range of 2:1 to 5:1. In some embodiments, the aspect ratio can be less than 1:1, for example, in the range of 0.2:1 to 1:1. In various embodiments, the width of the fin 226 can be in the range of 0.05 mm to 8 mm, in the range of 0.075 mm to 7 mm, in the range of 0.095 mm to 5 mm, or in the range of 0.1 mm to 3 mm. Figure 23 and Figure 24 Example leadframe designs for electronic devices 200 with different aspect ratios according to various embodiments are shown. Figure 23 This is a schematic perspective view of the heat sink busbar 220 used for the low-profile electronic module 202. Conversely, Figure 24 A heat sink busbar 220 is shown located above a high-profile electronic module 202. In some embodiments, the tie rod 252 may be as follows: Figure 24 The bend is shown.

[0047] Fins 226 extend above the electronics module 202. The gap 234 between the electronics module 202 and the first portion 222 may be filled with an adhesive, such as glue, which may be thermally conductive to enhance heat transfer to the first portion 222. The heat sink busbar 220 may include a thermally and / or electrically conductive material (e.g., copper, gold, silver, etc.) that is highly conductive for both heat and electricity. The first portion 222 may include a top surface 228. In some embodiments, the top surface 228 may be a flat surface for placement using surface mount technology (SMT). In some embodiments, the top surface 228 may include an insulating layer 230 that electrically isolates the top surface 228 (see [link to relevant documentation]). Figure 7 ).

[0048] Figures 8-9 A schematic perspective view of electronic device 200 is shown, in which another embodiment of heat sink busbar 220 may include lead frame 250. The lead frame may include a sheet of metal (e.g., copper) that can be bent, stamped, and / or otherwise shaped into a desired form or configuration. Lead frame 250 provides electrical connectivity to trace 206 and a thermal path to transfer heat away from electronic module 202. Lead frame 250 may form a second portion 224. In such embodiments, first portion 222 and second portion 224 (e.g., lead frame 250) may be separate pieces attached together to form heat sink busbar 220. For example, first portion 222 may be attached to a second end 226b of fin 226 of second portion 224 using a conductive adhesive such as solder, conductive epoxy, etc., to further reduce the resistance and / or inductance of heat sink busbar 220. In other embodiments, first portion 222 may be attached to fin 226 using a non-conductive adhesive such as glue to electrically isolate top surface 228. In some implementations, the heat sink busbar 220 may include a plurality of lead frames 250 for multiple channels.

[0049] The leadframe 250 may include tie rods 252 extending between each of the fins 226. In cases where the height and width of the electronic modules 202 are not uniform, the tie rods 252 may be bent to allow the fins 226 to have the same height. The number of tie rods 252 may be increased to better secure the leadframe 250. In some embodiments, the leadframe 250 may be attached to the device substrate 204 before the electronic modules 202 are attached to the device substrate 204. If an open-frame design is used, the leadframe 250 may be further secured to the device substrate 204 using a non-conductive adhesive such as epoxy resin.

[0050] Figures 10-13 Various examples of radiator busbars 220 according to various embodiments are shown. For example, Figure 10 A lead frame 250 without the first portion 222 is shown in one embodiment, which can form the heat sink busbar 220. In another embodiment, such as Figure 11 As shown, another embodiment of the lead frame 250 without the first part 222 can form another embodiment of the heat sink busbar 220. (See diagram) Figure 12 As seen in another embodiment shown, Figure 11 The lead frame 250 may include a first portion 222 having a top surface 228. Finally, Figure 13 A solid radiator busbar 220 with a first portion 222 and a second portion 224 is shown (e.g.) Figure 4-7 (As shown).

[0051] Figures 14 to 16 Another example of electronic device 200 is shown, in which busbar 220 can be used for both input and output current paths. In some embodiments, heat sink busbar 220 may include two or more segments. The two or more segments may be connected to multiple high-current paths for each component. For example, busbar 220a can be used for voltage in a high-current path, and busbar 220b can be used for voltage in a high-current path. Figure 17 It shows Figure 14-16 A schematic perspective view of an electronic device 200, which also includes a metal clip 254. If the voltage drop through the component substrate 102 and / or device substrate 204 is too high, the metal clip 254 can be mechanically and / or electrically attached to the heat sink busbars 220 (e.g., busbars 220a and 220b) using a conductive adhesive (e.g., solder, conductive epoxy, etc.). In another embodiment, as... Figure 18As shown, if the second electronic device package 104 is attached to the same side of the component substrate 102 as the electronic device 200, the metal clip 254 can be electrically and mechanically connected to the heat sink busbar 220 for lateral power delivery. For example, if both the input and output current paths are optimized by the heat sink busbar 220, conduction losses due to lateral power delivery can be reduced. Alternatively, as... Figure 19 As shown, if the second electronics package 104 has a power path on its top side, then conductive material can be attached between the electronics 200 and the second electronics package 104. Therefore, direct power delivery from the electronics 200 to the second electronics package 104 can be achieved using a metal clip 254. In some embodiments, the metal clip 254 is connected to a power source (not shown) and supplies power to the electronics 100.

[0052] In the embodiments disclosed herein, the heat sink busbar 220 may comprise any suitable type of conductive material, such as metal. In some embodiments, the heat sink busbar 220 may comprise copper. In some embodiments, the heat sink busbar 220 may comprise aluminum, which may be plated with a solderable material. For example, in Figure 17-19 In some embodiments, the top surface may include copper or aluminum plated with a weldable material to facilitate welding.

[0053] Figures 20-21 Various embodiments of the tie rod 252 are shown. Figure 20 In this configuration, tie rod 252 can be a straight tie rod, ensuring that there is no bending in the tie rods between the fins 226. Figure 21 In this embodiment, the tie rod 252 can be a curved tie rod to accommodate different aspect ratios between the fins 226 and to facilitate coplanarity. As described above, when the height and width of the electronic module 202 are not the same, the tie rod 252 can be bent to allow the fins 226 to have the same height. In various embodiments, the tie rod 252 can be profiled based on the ratio of the gap between adjacent protrusions (e.g., fins 226) to the height of the protrusions (e.g., fins 226).

[0054] Figure 22An example method 2200 for processing a busbar according to an embodiment is shown. At (A), the lead frame 250 can be manipulated (e.g., bent) along one or more edges 256 to form a first set of fins 226. At (B), the lead frame 250 can be further manipulated (e.g., stamped, cut, and / or bent) to form one or more internal fins 226. The fins 226 in steps (A) and (B) can have similar or different heights, depending on the size of the electronic module 202 surrounded by the fins 226. The fins 226 in steps (A) and (B) can be formed by stamping the heat sink busbar 220. The tie rod 252 can also be bent at least based on the height of the electronic module 202 and / or other factors. In (C), the lead frame 250 can be electrically and mechanically attached to the device substrate 204 to form the electronic device 200 shown in step (D).

[0055] Figure 25 and Figure 26 An example embodiment of the lead frame 250 of an electronic device 200 according to various embodiments is shown. Figure 25 A schematic perspective view of the busbar located above the even-numbered row electrical module 202 is shown. Figure 26 A schematic perspective view of the busbar located above the odd-numbered rows of electronic modules 202 is shown. The lead frame 250 can be located in the even-numbered columns of electronic modules 202 (e.g., ...). Figure 25 (as shown) or odd-numbered sequences (such as) Figure 26 (As shown) on. In Figure 26 In the illustrated embodiment, with Figure 25 Compared to busbar 220, busbar 220 can be formed from a simpler structure. However, Figure 26 Busbar 220 can be primarily used in devices with an odd number of rows of electronic modules 202, while Figure 25 The busbar 220 can be used in devices with an even or odd number of rows of electronic modules 202.

[0056] Figure 27 Another embodiment of the electronic device 200, which can operate as a heat sink, is shown. The electronic device 200 may include fins 226 of a heat sink busbar 220, which may be arranged parallel to and / or perpendicular to the trace 206. Additionally or alternatively, the fins 226 may be in a cross configuration, wherein the fins 226 include fins 226a parallel to the trace 206 and fins 226b perpendicular to the trace 206. Any gaps between the electronic module 202 and the heat sink busbar 220 can then be filled using an adhesive (e.g., epoxy resin).

[0057] Unless the context explicitly requires otherwise, throughout the specification and claims, the words “comprising,” “including,” “containing,” “having,” etc., shall be interpreted in an inclusive sense, rather than an exclusive or exhaustive sense; that is, in the sense of “including but not limited to,” the word “coupled” as commonly used herein refers to two or more elements that may be directly connected or connected through one or more intermediate elements. Similarly, as commonly used herein, the word “connected” refers to two or more elements that may be directly connected or connected through one or more intermediate elements. Furthermore, when used herein, the words “here,” “on top,” “below,” and similar terms shall refer to the application as a whole, and not to any particular part thereof. Moreover, as used herein, when a first element is described as being “on” or “above” a second element, the first element may be directly on or above the second element such that the first and second elements are in direct contact, or the first element may be indirectly on or above the second element such that one or more elements are located between the first and second elements. Where the context permits, the singular or plural terms used in the above detailed description may also include the plural or singular, respectively. The word "or" refers to a list of two or more items, and the word encompasses all of the following interpretations: any item in the list, all items in the list, and any combination of items in the list.

[0058] Furthermore, the conditional language used herein, in particular words such as “can,” “able,” “may,” “possibly,” “e.g.,” “as,” “for example,” “like,” etc., unless otherwise specifically stated or otherwise understood in the context of their use, is generally intended to convey that certain embodiments include certain features, elements, and / or states, while other embodiments do not. Therefore, such conditional language is generally not intended to imply that features, elements, and / or states are required in any way for one or more embodiments.

[0059] While certain embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of this disclosure. In fact, the novel apparatuses, methods, and systems described herein can be embodied in a variety of other forms; furthermore, various omissions, substitutions, and changes can be made to the form of the methods and systems described herein without departing from the spirit of this disclosure. For example, although blocks are presented in a given arrangement, alternative embodiments may perform similar functions with different components and / or circuit topologies, and some blocks may be deleted, moved, added, subdivided, combined, and / or modified. Each of these blocks can be implemented in a variety of different ways. Any suitable combination of elements and actions of the various embodiments described above can be combined to provide further embodiments. The appended claims and their equivalents are intended to cover such forms or modifications falling within the scope and spirit of this disclosure.

[0060] Several illustrative examples of radiator busbars and related systems and methods have been disclosed. Although this disclosure has been described with reference to certain illustrative examples and uses, other examples and uses, including those that do not provide all the features and advantages set forth herein, are also within the scope of this disclosure. Components, elements, features, actions, or steps may be arranged or performed differently from those described, and components, elements, features, actions, or steps may be combined, incorporated, added, or omitted in various examples. All possible combinations and sub-combinations of the elements and components described herein are intended to be included in this disclosure. No single feature or group of features is necessary or indispensable.

[0061] Some features described in the context of individual embodiments in this disclosure may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments. Furthermore, although features may be described above as functioning in certain combinations, one or more features from a claimed combination may be removed from the combination in some cases, and the combination may be claimed as a sub-combination or a variation of a sub-combination.

[0062] Furthermore, while illustrative examples have been described, any examples with equivalent elements, modifications, omissions, and / or combinations are also within the scope of this disclosure. Moreover, although certain aspects, advantages, and novel features are described herein, not all such advantages may necessarily be achieved according to any particular example. For example, some examples within the scope of this disclosure achieve one or a set of advantages as taught herein, but not necessarily other advantages taught or suggested herein. Furthermore, some examples may achieve advantages different from those taught or suggested herein.

[0063] Several examples have been described in conjunction with the accompanying drawings. The drawings may be drawn and / or shown to scale or not to scale, but such scale should not be limiting, as dimensions and proportions other than those shown are contemplated and within the scope of the disclosed invention. Distances, angles, etc., are merely illustrative and do not necessarily have an exact relationship to the actual dimensions and layout of the illustrated apparatus. Components may be added, removed, and / or rearranged. Furthermore, the disclosure of any particular feature, aspect, method, property, characteristic, quality, attribute, element, etc., in conjunction with the various examples herein is applicable to all other examples set forth herein. Additionally, any method described herein can be practiced using any apparatus suitable for performing the enumerated steps.

[0064] For the purpose of summarizing this disclosure, certain aspects, advantages, and features of the invention have been described herein. Not all or any of these advantages are necessarily achieved according to any particular example of the invention disclosed herein. No aspect of this disclosure is essential or indispensable. In many examples, devices, systems, and methods may be configured differently from those shown in the drawings or described herein. For example, the various functions provided by the illustrated modules may be combined, rearranged, added, or removed. In some embodiments, additional or different processors or modules may perform some or all of the functions described in the examples described and shown with reference to the drawings. Many variations of implementation are possible. Any of the features, structures, steps, or processes disclosed in this specification may be included in any example.

Claims

1. An electronic component, comprising: A component substrate, including one or more electrical connectors; as well as An electronic device mounted to a first surface of the component substrate, the electronic device comprising: A plurality of electronic modules are mounted on and electrically connected to a first surface of a device substrate, the device substrate having one or more traces; and Busbars, including: A first portion, the first portion extending along at least a portion of the lateral dimension of the device substrate; and The second part has one or more protrusions that extend non-parallel to and away from the first part and between the plurality of electronic modules, to be electrically and mechanically connected to the one or more traces disposed on the first surface of the device substrate, the one or more protrusions comprising a thermally conductive material.

2. The electronic component according to claim 1, further comprising a second electronic device, the second electronic device being mounted on and electrically connected to a second surface of the component substrate opposite to the first surface.

3. The electronic component according to claim 1, wherein, The first portion extends to at least partially cover the plurality of electronic modules.

4. The electronic component according to claim 2, wherein, The electronic device and the second electronic device are electrically connected to each other via the one or more electrical connectors.

5. The electronic component according to claim 1, wherein, The one or more protrusions are welded to the one or more traces.

6. The electronic component according to claim 1, wherein, The first part includes a flat surface.

7. The electronic component according to claim 1, wherein, The busbar includes a top surface that is substantially flat.

8. The electronic component according to claim 7, wherein, The top surface includes an insulating layer that electrically isolates the top surface.

9. The electronic component according to claim 1, wherein, The second part includes a lead frame.

10. The electronic component according to claim 1, wherein, The one or more protrusions include a protrusion insulating layer near the substrate.

11. The electronic component according to claim 1, wherein, The one or more protrusions may include at least one of thin blades or thick columns.

12. The electronic component of claim 1, further comprising a metal clip soldered to the busbar, wherein the metal clip is connected to a power source to provide power to the electronic component.

13. The electronic component according to claim 1, wherein, The first portion of the busbar includes a heat sink portion configured to absorb heat from the top side of (i) the device substrate and (ii) the plurality of electronic modules.

14. The electronic component of claim 1, wherein the plurality of electronic modules include passive elements packaged and connected to the package, wherein the package includes a molding compound.

15. An electronic package, comprising: A substrate, including one or more traces disposed on the surface of the substrate and voltage inputs and voltage outputs connected to the one or more traces; Multiple electronic modules are configured to be mounted on and electrically connected to the substrate, wherein one or more traces are disposed between the modules of the multiple electronic modules; as well as A busbar extending along at least a portion of the length of the substrate, the busbar including one or more protrusions electrically and mechanically connected to the one or more traces.

16. The electronic package according to claim 15, wherein, The busbar includes a top surface that is substantially flat.

17. The electronic package according to claim 15, wherein, The busbar includes a lead frame.

18. The electronic package according to claim 15, wherein, The busbar includes a heat sink portion configured to absorb heat from the top side of the substrate and the plurality of electronic modules.

19. A method for manufacturing an electronic component, the method comprising: A substrate is provided, the substrate including one or more traces and a voltage input and a voltage output connected to the one or more traces; An electronic device package comprising multiple electronic modules is mounted to mechanically fix the electronic device package to a first surface of the substrate and electrically connect the electronic device package to the first surface of the substrate, wherein one or more traces are disposed between the modules of the multiple electronic modules. A second electronic device package is mounted to mechanically fix the second electronic device package to a second surface of the substrate opposite to the first surface, and to electrically connect the second electronic device package to the second surface of the substrate opposite to the first surface. as well as A busbar extending along the length of the substrate is mounted to the substrate, the busbar including one or more protrusions for electrical and mechanical connection to the one or more traces.

20. The method of claim 19, further comprising stamping the manifold to form the one or more protrusions and one or more tie rods on either side of the one or more gaps, thereby forming the one or more protrusions.

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