Electrode plate processing device

Abstract

An electrode plate processing apparatus includes a plurality of rollers, a substrate between the plurality of rollers, a self-supporting film movable by the plurality of rollers, the self-supporting film attached to the substrate, and a laser cutter configured to cut the self-supporting film into a predetermined width using a laser beam emitted from the laser cutter. In the electrode plate processing apparatus according to the present invention, the laser cutter can pass through the rollers and cut the self-supporting film attached to the substrate into a proper size.

Description

Technical Field

[0001] This disclosure relates to an electrode plate processing apparatus. Background Technology

[0002] Generally speaking, with the rapid increase in demand for portable electronic products such as laptops, video cameras, and mobile phones, and the commercialization of robots and electric vehicles reaching full maturity, research is actively underway on high-performance rechargeable and rechargeable batteries. In particular, lithium-ion batteries are widely used as energy sources for various electronic products due to their high energy density, operating voltage, and excellent capacitance and lifespan characteristics.

[0003] To meet the demands of miniaturization and high performance in electronic products, in addition to miniaturization and weight reduction, high energy density of lithium batteries is becoming increasingly important. In other words, high-capacity lithium batteries are becoming crucial.

[0004] The information disclosed above in the technology that forms the background of this disclosure is provided to improve the understanding of the background of this disclosure, and therefore may include information that does not constitute related technology. Summary of the Invention

[0005] The embodiment includes an electrode plate processing apparatus comprising: a plurality of rollers; a substrate between the plurality of rollers; a self-supporting film movable via the plurality of rollers and attached to the substrate; and a laser cutter configured to cut the self-supporting film to a predetermined width using a laser beam emitted from the laser cutter.

[0006] The plurality of rollers may include: one or more first rollers arranged in a first transverse direction of the substrate; and one or more second rollers arranged in a second transverse direction of the substrate.

[0007] One or more first rollers may include: a first attachment roller, close to the substrate, the first attachment roller being configured to guide the self-supporting film to be attached to the substrate; and one or more first transfer rollers, configured to guide the self-supporting film to the first attachment roller.

[0008] One or more second rollers may include: a second attachment roller, close to the substrate, the second attachment roller being configured to guide the self-supporting film to the substrate; and one or more second transfer rollers, configured to guide the self-supporting film to the second attachment roller.

[0009] A laser cutter may include: a laser emitter that emits a laser beam toward a moving path of a self-supporting membrane; and a laser receiver that receives the laser beam emitted from the laser emitter.

[0010] The laser cutter may further include a position adjustment unit configured to adjust the position of the laser emitter and the position of the laser receiver.

[0011] The position adjustment unit may include: a main bracket fixed to a fixed facility; a transmitter bracket connected to the main bracket, the transmitter bracket supporting the laser transmitter and having an adjustable length; and a receiver bracket connected to the main bracket, the receiver bracket supporting the laser receiver and having an adjustable length.

[0012] The position adjustment unit can be configured to fix the position of the laser emitter and the laser receiver when the self-supporting membrane is cut.

[0013] The position adjustment unit can be configured to change the position of the laser emitter and the laser receiver when the self-supporting membrane is cut.

[0014] Laser cutters can emit laser beams that are parallel to the direction of movement of the self-supporting membrane.

[0015] The laser cutter may include a lower cutter for cutting the self-supporting film as it passes the lower portion of multiple rollers.

[0016] The laser cutter may include an upper cutter for cutting the self-supporting film as it passes over the upper portion of multiple rollers.

[0017] The laser cutter may include: a lower cutter for cutting the self-supporting film as it passes the lower portion of a plurality of rollers; and an upper cutter for cutting the self-supporting film as it passes the upper portion of a plurality of rollers.

[0018] Laser cutters can emit laser beams perpendicular to the direction of movement of the self-supporting membrane.

[0019] Laser cutters can cut self-supporting films as they pass between multiple rollers.

[0020] The width of the laser beam emitted from the laser cutter is smaller than the gap between multiple rollers.

[0021] The electrode plate processing apparatus may further include: a sensor unit configured to detect the state of at least one of a plurality of rollers, a substrate and a self-supporting film; and a control unit configured to receive the detection signal from the sensor unit and control the operation of the laser cutter.

[0022] The sensor unit can be further configured to detect whether the gap between multiple rollers is within a predetermined distance.

[0023] The sensor unit can be further configured to detect whether multiple rollers are interfered with by the laser cutter.

[0024] The sensor unit can be further configured to detect the width of the adhesive layer on the substrate. Attached Figure Description

[0025] Features will become apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0026] Figure 1 This is a schematic side view illustrating an electrode plate processing apparatus according to an embodiment of the present disclosure;

[0027] Figure 2 This is a schematic plan view illustrating an electrode plate processing apparatus according to an embodiment of the present disclosure;

[0028] Figure 3 This is a schematic diagram illustrating a laser cutter according to an embodiment of the present disclosure;

[0029] Figure 4 This is a schematic diagram illustrating a state in which a laser cutter according to an embodiment of the present disclosure is fixed and cuts a self-supporting membrane.

[0030] Figure 5 This is a schematic diagram illustrating the state in which a laser cutter moves and cuts a self-supporting membrane according to an embodiment of the present disclosure.

[0031] Figure 6 This is a schematic side view illustrating a laser cutter according to an embodiment of the present disclosure emitting a laser beam parallel to the direction of movement of the self-supporting film passing through the lower portion of the roller.

[0032] Figure 7 This is a schematic bottom view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam parallel to the direction of movement of the self-supporting film through the lower portion of the roller.

[0033] Figure 8 This is a schematic side view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam parallel to the direction of movement of the self-supporting film over the upper portion of the roller.

[0034] Figure 9 This is a schematic bottom view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam parallel to the direction of movement of the self-supporting film over the upper part of the roller.

[0035] Figure 10 This is a schematic side view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam parallel to the direction of movement of the self-supporting film through the upper and lower portions of the roller.

[0036] Figure 11This is a schematic side view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam perpendicular to the movement direction of the roller and the self-supporting film passing through the roller.

[0037] Figure 12 This is a schematic plan view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam perpendicular to the movement direction of the roller and the self-supporting film passing through the roller.

[0038] Figure 13 This is a schematic side view illustrating the state in which a laser cutter according to another embodiment of the present disclosure emits a laser beam perpendicular to the movement direction of the roller and the self-supporting film passing through the roller.

[0039] Figure 14 This is a schematic plan view illustrating the state in which a laser cutter according to another embodiment of the present disclosure emits a laser beam perpendicular to the movement direction of the roller and the self-supporting film passing through the roller.

[0040] Figure 15 This is a schematic diagram illustrating the state in which a sensor unit and a control unit are added to an electrode plate processing apparatus according to an embodiment of the present disclosure.

[0041] Figure 16 This is a schematic diagram illustrating the state of the gap between the sensor units according to an embodiment of the present disclosure;

[0042] Figure 17 This is a schematic diagram illustrating whether a sensor unit, according to an embodiment of the present disclosure, is detecting whether a roller is being interfered with by a laser cutter; and

[0043] Figure 18 This is a schematic diagram illustrating the state of the adhesive layer of the substrate detected by the sensor unit according to an embodiment of the present disclosure. Detailed Implementation

[0044] Example embodiments will now be described more fully below with reference to the accompanying drawings; however, example embodiments may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey exemplary embodiments to those skilled in the art.

[0045] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It should also be understood that when a layer or element is referred to as "on" another layer or substrate, it may be directly on that layer or substrate, or there may be intervening layers. Furthermore, it should be understood that when a layer is referred to as "below" another layer, it may be directly below, or there may be one or more intervening layers. Additionally, it will be understood that when a layer is referred to as "between two layers," it may be the only layer between those two layers, or there may be one or more intervening layers. The same reference numerals refer to the same elements throughout.

[0046] The terms or words used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, and should be interpreted as having meanings and concepts consistent with the technical ideas of this disclosure, based on the principle that the inventor is capable of being his own lexicographer to properly define the concepts of the terms.

[0047] The embodiments described in this specification and the constructions shown in the accompanying drawings are provided as some exemplary embodiments of this disclosure and do not necessarily represent all the technical ideas, aspects, and features of this disclosure. Accordingly, it should be understood that various equivalents and modifications are possible at the time of filing this application, which can replace or modify the embodiments described herein.

[0048] It should be understood that when an element or layer is referred to as being "on," "connected to," or "linked to" another element or layer, the element or layer may be directly on, connected to, or linked to the other element or layer, or one or more intermediary elements or layers may be present. When an element or layer is referred to as being "directly on," "directly connected to," or "directly linked to" another element or layer, no intermediary element or layer is present. For example, when a first element is described as being "linked" or "connected to" a second element, the first element may be directly linked to or connected to the second element, or the first element may be indirectly linked to or connected to the second element via one or more intermediary elements.

[0049] In the accompanying drawings, the dimensions of various elements, layers, etc., may be exaggerated for clarity of illustration. The same reference numerals denote the same or similar elements. As used herein, the term "and / or" includes any and all combinations of one or more of the items listed herein. Furthermore, when describing embodiments of this disclosure, the use of "may" means "one or more embodiments of this disclosure." Expressions such as "at least one of" and "any one of" modify the entire list of elements without modifying individual elements in the list when placed after the list of elements. When phrases such as "at least one of A, B, and C," "at least one of A, B, or C," "at least one selected from the group consisting of A, B, and C," or "at least one selected from A, B, and C" are used to specify a list of elements A, B, and C, the phrase may refer to any and all suitable combinations or subsets of A, B, C, A and B, A and C, B and C, or A and B and C, A, B, and C. As used herein, the term "use" and its variations may be considered synonymous with the term "utilize" and its variations, respectively. As used herein, the terms “substantially,” “approximately,” and similar terms are used as approximate terms rather than terms of degree and are intended to describe the inherent biases of measurements or calculations that would be recognized by one of ordinary skill in the art.

[0050] It should be understood that although terms such as "first," "second," "third," etc., may be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion.

[0051] In this document, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” may be used to describe the relationship between one element or feature as shown in the figures and another (or several) other elements or features. It should be understood that, in addition to the orientations depicted in the figures, spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would be oriented “above” or “directly above” other elements or features. Thus, the term “below” can include both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0052] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “an” are intended to also include the plural forms. It should be further understood that, when used in this specification, the term “comprising” specifies the presence of the stated features, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0053] Furthermore, any numerical range disclosed and / or enumerated herein is intended to include all subranges with the same numerical precision within the enumerated range. For example, the range “1.0 to 10.0” is intended to include, for example, 2.4 to 7.6, all subranges between the stated minimum value of 1.0 and the stated maximum value of 10.0 (inclusive), i.e., all subranges with a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0. Any maximum numerical limit described herein is intended to include all smaller numerical limits, and any minimum numerical limit described in this specification is intended to include all larger numerical limits. Therefore, the applicant reserves the right to amend this specification (including the claims) to explicitly detail any subranges included within the scope expressly described herein.

[0054] Referring to two compared elements, features, etc., as “identical” can mean that they are identical or substantially identical. Therefore, the phrase “identical” or “substantially identical” can include cases with a deviation considered low in the art (e.g., less than 5%). Additionally, when a parameter is stated to be consistent in a given region, this can mean that it is consistent in terms of average value.

[0055] Throughout this specification, unless otherwise stated, each element may be singular or plural.

[0056] When any element is referred to as being arranged (or located or placed) "above (or below)" or "on (or below)" a component, this can mean that the element is placed in contact with the upper (or lower) surface of the component, or it can mean that another component may be located between the component and any element arranged (or located or placed) on (or below) the component.

[0057] Furthermore, it should be understood that when an element is referred to as "connected," "linked," or "attached" to another element, these elements may be directly "connected," "linked," or "attached" to each other, or one or more intermediary elements may exist therein, through which the element may be "connected," "linked," or "attached" to the other element. Additionally, when a part is referred to as "electrically connected" to another part, the part may be directly electrically connected to the other part, or one or more intermediary parts may exist therein, such that the part and the other part are indirectly electrically connected to each other.

[0058] Throughout this specification, unless otherwise stated, when “A and / or B” is mentioned, it means A, B, or A and B. That is, “and / or” includes any or all combinations of the enumerated items. Unless otherwise stated, when “C to D” is mentioned, it means C and below D.

[0059] The terminology used in this specification is for describing embodiments of this disclosure and is not intended to limit this disclosure.

[0060] Figure 1 This is a schematic side view illustrating an electrode plate processing apparatus according to an embodiment of the present disclosure, and Figure 2 This is a schematic plan view illustrating an electrode plate processing apparatus according to an embodiment of the present disclosure. See also Figure 1 and Figure 2 The electrode plate processing apparatus 1 according to the embodiments of the present disclosure includes a plurality of rollers 10, a substrate 20, a self-supporting film 30 and a laser cutter 40.

[0061] Roller 10 can be mounted on a fixed device so that it can rotate. Roller 10 can be arranged in the X-axis direction. Roller 10 can have a cylindrical shape, which has a length in the Y-axis direction.

[0062] The substrate 20 can pass between the rollers 10. The substrate 20 can have a thin film shape. The substrate 20 can have a width in the Y-axis direction and a length in the Z-axis direction, and can move in the Z-axis direction. The substrate 20 can be used as an electrode plate in a secondary battery. The substrate 20 can be coated with an adhesive layer 25.

[0063] The self-supporting film 30 (e.g., "self-supporting" means no substrate is required) can be moved by the roller 10 and can be attached to the substrate 20. The self-supporting film 30 can be in close contact with the adhesive layer 25 and can be held in a bonded state to the substrate 20. The self-supporting film 30 can be supplied to the substrate 20 from both sides and is attached to the first surface 21 and the second surface 22 corresponding to the two surfaces of the substrate 20.

[0064] The laser cutter 40 can use a laser beam to cut the self-supporting film 30, which moves through the roller 10, to a suitable width (e.g., a predetermined width). The laser cutter 40 can cut the self-supporting film 30 to a length in the Y-axis direction corresponding to the width of the adhesive layer 25. The laser cutter 40 can be configured as a pair of laser cutters 40 in the Y-axis direction to cut the edges on both sides of the self-supporting film 30.

[0065] Roller 10 according to embodiments of the present disclosure may include one or more first rollers 11 and one or more second rollers 12.

[0066] One or more of the first rollers 11 may be arranged in a first transverse direction of the substrate 20. The first rollers 11 may be arranged to face the first surface 21. The first rollers 11 may include a first attachment roller 111 and a first transfer roller 112.

[0067] The first attachment roller 111 may be disposed close to the substrate 20 (e.g., the distance between the first attachment roller 111 and the substrate 20 may be equal to the thickness of the self-supporting film 30) and guides the self-supporting film 30 to attach it to the substrate 20. The self-supporting film 30, having passed the first attachment roller 111, may be attached to the substrate 20 while moving along the Z-axis. A first transfer roller 112 may guide the self-supporting film 30 to the first attachment roller 111. The first transfer rollers 112 may be provided as a plurality of first transfer rollers 112 spaced apart from each other in the X-axis direction. The self-supporting film 30 may alternately pass through the upper and lower portions of the plurality of first transfer rollers 112 arranged spaced apart from each other. The self-supporting film 30 may move along the Z-axis while passing through the upper portion of the first attachment roller 111 and then be attached to the substrate 20.

[0068] One or more of the second rollers 12 may be arranged in the second transverse direction of the substrate 20. The second rollers 12 may be arranged to face the second surface 22. The second rollers 12 may include a second attachment roller 121 and a second transfer roller 122.

[0069] The second attachment roller 121 may be disposed close to the substrate 20 and guide the self-supporting film 30 to attach it to the substrate 20. The self-supporting film 30, having passed through the second attachment roller 121, may be attached to the substrate 20 while moving along the Z-axis. A second transfer roller 122 may guide the self-supporting film 30 to the second attachment roller 121. The second transfer roller 122 may be provided as a plurality of second transfer rollers 122 spaced apart from each other in the X-axis direction. The self-supporting film 30 may alternately pass through the upper and lower portions of the plurality of spaced-apart second transfer rollers 122. The self-supporting film 30 may move along the Z-axis while passing through the upper portion of the second attachment roller 121 to attach to the substrate 20.

[0070] Figure 3 This is a schematic diagram of a laser cutter according to an embodiment of the present disclosure. Figure 4 This is a schematic diagram illustrating a state in which a laser cutter according to an embodiment of the present disclosure is fixed and cuts a self-supporting membrane. Figure 5 This is a schematic diagram illustrating the state in which a laser cutter moves and cuts a self-supporting membrane according to an embodiment of the present disclosure. See also Figures 3 to 5 The laser cutter 40 according to embodiments of the present disclosure may include a laser emitter 41 and a laser receiver 42.

[0071] The laser emitter 41 can emit a laser beam toward the moving path of the self-supporting membrane 30. The laser receiver 42 can receive the laser beam emitted from the laser emitter 41. The laser beam emitted from the laser emitter 41 can cut the self-supporting membrane 30.

[0072] The laser cutter 40 according to embodiments of the present disclosure may further include a position adjustment unit 43 (e.g., a position adjuster). The position adjustment unit 43 can adjust the position of the laser emitter 41 and the position of the laser receiver 42. The position adjustment unit 43 may include a main support 431, an emitter support 432, and a receiver support 433.

[0073] The main support 431 can be fixedly mounted on a fixed facility. The main support 431 can be connected to a fixed facility such as the ground or equipment. The main support 431 can have a length in the X-axis or Z-axis direction.

[0074] The transmitter bracket 432 can be connected to the main bracket 431, and its length can be adjusted automatically. The transmitter bracket 432 supports the laser emitter 41. One end of the transmitter bracket 432 can be connected to the main bracket 431, and the other end of the transmitter bracket 432 can be connected to the laser emitter 41. The length of the transmitter bracket 432 can be adjusted by the operator or automatically by a motor.

[0075] The receiver bracket 433 can be connected to the main bracket 431, and its length can be adjusted automatically. The receiver bracket 433 supports the laser receiver 42. One end of the receiver bracket 433 can be connected to the main bracket 431, and the other end can be connected to the laser receiver 42. The length of the receiver bracket 433 can be adjusted by the operator or automatically by a motor.

[0076] The position adjustment unit 43 can fix the position of the laser emitter 41 and the laser receiver 42 when the self-supporting membrane 30 is cut. When the positions of the laser emitter 41 and the laser receiver 42 are fixed by the position adjustment unit 43, the self-supporting membrane 30 can be cut into a uniform shape.

[0077] The position adjustment unit 43 can change the positions of the laser emitter 41 and the laser receiver 42 when the self-supporting film 30 is cut. When the positions of the laser emitter 41 and the laser receiver 42 are changed by the position adjustment unit 43, the self-supporting film 30 can be cut into a predetermined pattern or shape. The position adjustment unit 43 can move the laser emitter 41 and the laser receiver 42 according to a predetermined program (e.g., code readable by a processor).

[0078] The laser cutter 40 can emit a laser beam parallel to the movement direction of the self-supporting membrane 30. The self-supporting membrane 30 can move in the X-axis direction, and the laser emitter 41 and the laser receiver 42 can be arranged to face each other in the X-axis direction, so that the laser beam can move in the X-axis direction.

[0079] Figure 6 This is a schematic side view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam parallel to the direction of movement of the self-supporting film as it passes the lower portion of the roller. Figure 7 This is a schematic bottom view illustrating a laser cutter according to an embodiment of the present disclosure emitting a laser beam parallel to the direction of movement of the self-supporting film as it passes the lower portion of the roller. See also Figure 6 and Figure 7 The laser cutter 40 may include a lower cutter 45.

[0080] The lower cutter 45 can cut the self-supporting film 30 passing through the lower portion of the roller 10. The laser beam emitted from the lower cutter 45 can approach the lower portion of the roller 10. One lower cutter 45 can cut the self-supporting film 30 passing through the lower portion of the first transfer roller 112 of the first roller 11. Another lower cutter 45 can cut the self-supporting film 30 passing through the lower portion of the second transfer roller 122 of the second roller 12.

[0081] Figure 8 This is a schematic side view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam parallel to the direction of movement of the self-supporting film over the upper portion of the roller. Figure 9 This is a schematic bottom view illustrating the state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam parallel to the direction of movement of the self-supporting film over the upper portion of the roller. See also Figure 8 and Figure 9 The laser cutter 40 may include an upper cutter 46.

[0082] The upper cutter 46 can cut the self-supporting film 30 passing over the upper portion of the roller 10. The laser beam emitted from the upper cutter 46 can approach the upper portion of the roller 10. One upper cutter 46 can cut the self-supporting film 30 passing over the upper portion of the first attachment roller 111 of the first roller 11. Another upper cutter 46 can cut the self-supporting film 30 passing over the upper portion of the second attachment roller 121 of the second roller 12.

[0083] Figure 10 This is a schematic side view illustrating a state in which a laser cutter according to an embodiment of the present disclosure emits a laser beam parallel to the direction of movement of the self-supporting film through the upper and lower portions of the roller. See also Figure 10 The laser cutter 40 may include a lower cutter 45 and an upper cutter 46.

[0084] The lower cutter 45 can cut the self-supporting film 30 passing through the lower portion of the roller 10. The laser beam emitted from the lower cutter 45 can approach the lower portion of the roller 10. One lower cutter 45 can cut the self-supporting film 30 passing through the lower portion of the first transfer roller 112 of the first roller 11. Another lower cutter 45 can cut the self-supporting film 30 passing through the lower portion of the second transfer roller 122 of the second roller 12.

[0085] The upper cutter 46 can cut the self-supporting film 30 passing over the upper portion of the roller 10. The laser beam emitted from the upper cutter 46 can approach the upper portion of the roller 10. One upper cutter 46 can cut the self-supporting film 30 passing over the upper portion of the first attachment roller 111 of the first roller 11. Another upper cutter 46 can cut the self-supporting film 30 passing over the upper portion of the second attachment roller 121 of the second roller 12.

[0086] The self-supporting film 30 can be cut by alternately passing it through the lower cutter 45 and the upper cutter 46. The lower cutter 45 can cut the portion of the self-supporting film 30 from its midpoint to its lower portion, and the upper cutter 46 can cut the portion of the self-supporting film 30 from its midpoint to its upper portion. Accordingly, direct contact between the laser beam emitted from the lower cutter 45 and the upper cutter 46 and the roller 10 can be prevented.

[0087] Figure 11 This is a schematic side view illustrating a laser cutter according to an embodiment of the present disclosure emitting a laser beam perpendicular to the movement direction of the roller and the self-supporting film passing through the roller. Figure 12 This is a schematic plan view illustrating a laser cutter according to an embodiment of the present disclosure emitting a laser beam perpendicular to the movement direction of the roller and the self-supporting film passing over the roller. See also Figure 11 and Figure 12The laser cutter 40 can emit a laser beam perpendicular to the moving direction of the self-supporting membrane 30. The self-supporting membrane 30 can move in the X-axis direction, and the laser emitter 41 and the laser receiver 42 can be arranged to face each other in the Z-axis direction, so that the laser beam can move in the Z-axis direction.

[0088] The laser cutter 40 can cut the self-supporting film 30 as it passes between the rollers 10. A laser beam emitted from the laser cutter 40 can cut the self-supporting film 30 as it passes between the first attachment roller 111 and the first transfer roller 112. A laser beam emitted from the laser cutter 40 can also cut the self-supporting film 30 as it passes between the second attachment roller 121 and the second transfer roller 122.

[0089] To prevent the laser beam emitted from the laser cutter 40 from interfering with the rollers 10, the width of the laser beam is smaller than the gap between the rollers 10. The gap between the rollers 10 can be adjusted according to the width of the laser beam emitted from the laser cutter 40.

[0090] Figure 13 This is a schematic side view illustrating a laser cutter according to another embodiment of the present disclosure, in which a laser beam is emitted perpendicular to the movement direction of the roller and the self-supporting film passing through the roller. Figure 14 This is a schematic plan view illustrating a laser cutter according to another embodiment of the present disclosure, in which a laser beam is emitted perpendicular to the movement direction of the roller and the self-supporting film passing over the roller. See also Figure 13 and Figure 14 The first transfer roller 112 can be provided as a pair of first transfer rollers 112 facing each other in the Z-axis direction, and the self-supporting film 30 can pass between the pair of first transfer rollers 112 and then move between the first attachment roller 111 and the substrate 20, such that the self-supporting film 30 can be attached to the substrate 20. The second transfer roller 122 can be provided as a pair of second transfer rollers 122 facing each other in the Z-axis direction, and the self-supporting film 30 can pass between the pair of second transfer rollers 122 and then move between the second attachment roller 121 and the substrate 20, such that the self-supporting film 30 can be attached to the substrate 20.

[0091] Figure 15 This is a schematic diagram illustrating the state of an electrode plate processing apparatus according to an embodiment of this disclosure, where sensor units (e.g., sensors) and control units (e.g., controllers) are added. See also Figure 15 The electrode plate processing apparatus 1 according to the embodiments of the present disclosure may further include a sensor unit 50 and a control unit 60.

[0092] The sensor unit 50 can detect the state of at least one of the roller 10, the substrate 20, and the self-supporting film 30. The sensor unit 50 can detect whether there is an abnormality in the equipment or materials used to process the electrode plate.

[0093] The control unit 60 can receive detection signals from the sensor unit 50 and control the operation of the laser cutter 40. When the sensor unit 50 detects an abnormality in the equipment, the operation of the laser cutter 40 can be stopped by the control signal from the control unit 60. In this case, an additional warning signal can be provided to the operator.

[0094] Figure 16 This is a schematic plan view illustrating the state of the gap between the sensor unit detecting the rollers according to an embodiment of the present disclosure. See also... Figure 16 The sensor unit 50 may include a first sensor 51 that detects whether the gap between the rollers 10 is within a set distance (e.g., a predetermined distance). The first sensor 51 may be spaced apart from the rollers 10 in the Y-axis direction to detect the rollers 10. One first sensor 51 may detect the gap between the first attachment roller 111 and the first transfer roller 112. Another first sensor 51 may detect the gap between the second attachment roller 121 and the second transfer roller 122. When the measurement value of the first sensor 51 is less than the set distance (e.g., a predetermined distance), the gap between the rollers 10 may be less than the design value, which may cause interference with the laser beam, and therefore, the control unit 60 may stop the operation of the laser cutter 40.

[0095] Figure 17 This is a schematic diagram illustrating whether a sensor unit according to an embodiment of the present disclosure is detecting whether a roller is being interfered with by a laser cutter. See also Figure 17 The sensor unit 50 may include a second sensor 52 for detecting whether the roller 10 is interfered with by the laser cutter 40. The second sensor 52 may be formed on the surface of the roller 10 or may be embedded in the roller 10. The second sensor 52 can detect the laser beam emitted from the laser cutter 40. When the second sensor 52 detects the laser beam, the control unit 60 can stop the operation of the laser cutter 40 to prevent damage to the roller 10 caused by the laser beam.

[0096] Figure 18 This is a schematic diagram illustrating the state of the adhesive layer on a substrate detected by a sensor unit according to an embodiment of the present disclosure. See also... Figure 18 The sensor unit 50 may include a third sensor 53 for detecting the width of the adhesive layer 25 of the substrate 20. The third sensor 53 may be disposed above the roller 10 (e.g., above the first transfer roller 112 and the second transfer roller 122) and is configured to face the first surface 21 and the second surface 22. When the third sensor 53 detects the width of the adhesive layer 25, the control unit 60 may control the laser cutter 40 such that the width of the self-supporting film 30 corresponds to the width of the adhesive layer 25, and the self-supporting film 30 is processed.

[0097] In the electrode plate processing apparatus 1 according to an embodiment of the present disclosure, the laser cutter 40 can cut the self-supporting film 30, which has passed through the roller 10 and is attached to the substrate 20, into a size that is appropriate.

[0098] In the electrode plate processing apparatus 1 according to an embodiment of the present disclosure, the laser cutter 40 can emit a laser beam parallel to the moving direction of the self-supporting membrane 30.

[0099] In the electrode plate processing apparatus 1 according to an embodiment of the present disclosure, the laser cutter 40 can emit a laser beam perpendicular to the moving direction of the self-supporting membrane 30.

[0100] In the electrode plate processing apparatus 1 according to an embodiment of the present disclosure, the laser cutter 40 can be fixed so that the shape of the self-supporting membrane 30 can be consistently maintained.

[0101] In the electrode plate processing apparatus 1 according to an embodiment of the present disclosure, the position of the laser cutter 40 can be changed, thereby forming a self-supporting membrane 30 with various shapes.

[0102] The methods, processes, and / or operations described herein can be executed by code or instructions that will be performed by a computer, processor, controller, or other signal processing device. For example, the controller controlling the sensor unit 50 and the laser cutter 40 can be a computing device such as a workstation computer, desktop computer, laptop computer, or tablet computer, and can be implemented as a simple controller, a complex processor such as a microprocessor, central processing unit (CPU), graphics processing unit (GPU), or a processor composed of software or dedicated hardware or firmware. The computer, processor, controller, or other signal processing device can be those elements described herein or elements other than those described herein.

[0103] Electrodes manufactured using slurries containing solvents use excessive amounts of solvent during the manufacturing process, and therefore, a dry process without organic solvents is being considered.

[0104] The dry process involves attaching a self-supporting film to a substrate on which an adhesive layer is formed, and the self-supporting film moves simultaneously through multiple rollers to ensure close contact with the substrate.

[0105] In the electrode plate processing apparatus according to embodiments of the present disclosure, the position of the laser cutter can be varied to obtain the degree of freedom in the shape of the self-supporting membrane.

[0106] However, the effects that can be obtained through this disclosure are not limited to those described above, and other technical effects not mentioned will be clearly understood by those skilled in the art from this disclosure.

[0107] Although this disclosure has been described with reference to some exemplary embodiments shown in the accompanying drawings, these embodiments are merely illustrative and it should be understood that those skilled in the art can derive various modifications and equivalent other embodiments based on these embodiments.

[0108] Thus far, exemplary embodiments have been disclosed. Although specific terminology has been used, it is used in a general and descriptive sense only, and is not intended to be limiting. In some cases, as would be apparent to those skilled in the art at the time of filing this application, unless otherwise specifically stated, features, characteristics, and / or elements described in connection with particular embodiments may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the invention.

Claims

1. An electrode plate processing apparatus, comprising: Multiple rollers; The substrate is located between the plurality of rollers; A self-supporting membrane, movable via the plurality of rollers, is attached to the substrate. as well as A laser cutter is configured to cut the self-supporting membrane to a predetermined width using a laser beam emitted from the laser cutter.

2. The electrode plate processing apparatus according to claim 1, wherein, The plurality of rollers includes: One or more first rollers are arranged in a first transverse direction on the substrate; and One or more second rollers are arranged in a second transverse direction on the substrate.

3. The electrode plate processing apparatus according to claim 2, wherein, The one or more first rollers include: A first attachment roller, located near the substrate, is configured to guide the self-supporting film to attach to the substrate; and One or more first transfer rollers are configured to guide the self-supporting film to the first attachment roller.

4. The electrode plate processing apparatus according to claim 2, wherein, The one or more second rollers include: A second attachment roller, located near the substrate, is configured to guide the self-supporting film to attach to the substrate; and One or more second transfer rollers are configured to guide the self-supporting film to the second attachment roller.

5. The electrode plate processing apparatus according to any one of claims 1 to 4, wherein, The laser cutter includes: A laser emitter emits a laser beam toward the movement path of the self-supporting membrane; and A laser receiver receives the laser beam emitted from the laser emitter.

6. The electrode plate processing apparatus according to claim 5, wherein, The laser cutter further includes a position adjustment unit configured to adjust the position of the laser emitter and the position of the laser receiver.

7. The electrode plate processing apparatus according to claim 6, wherein, The position adjustment unit includes: The main support frame is fixed to the fixed facility; A transmitter bracket, connected to the main bracket, supports the laser transmitter and is length-adjustable; and A receiver bracket is connected to the main bracket, and the receiver bracket supports the laser receiver and its length is adjustable.

8. The electrode plate processing apparatus according to claim 6, wherein, The position adjustment unit is configured to fix the position of the laser emitter and the position of the laser receiver when the self-supporting membrane is cut.

9. The electrode plate processing apparatus according to claim 6, wherein, The position adjustment unit is configured to change the position of the laser emitter and the position of the laser receiver when the self-supporting membrane is cut.

10. The electrode plate processing apparatus according to any one of claims 1 to 4, wherein, The laser cutter emits a laser beam parallel to the direction of movement of the self-supporting membrane.

11. The electrode plate processing apparatus according to claim 10, wherein, The laser cutter includes a lower cutter for cutting the self-supporting film as it passes the lower portion of the plurality of rollers.

12. The electrode plate processing apparatus according to claim 10, wherein, The laser cutter includes an upper cutter for cutting the self-supporting film as it passes over the upper portion of the plurality of rollers.

13. The electrode plate processing apparatus according to claim 10, wherein, The laser cutter includes: A lower cutter for cutting the self-supporting film as it passes the lower portion of the plurality of rollers; and An upper cutter is used to cut the self-supporting membrane as it passes the upper portion of the plurality of rollers.

14. The electrode plate processing apparatus according to any one of claims 1 to 4, wherein, The laser cutter emits a laser beam perpendicular to the direction of movement of the self-supporting membrane.

15. The electrode plate processing apparatus according to claim 14, wherein, The laser cutter cuts the self-supporting membrane as it passes between the plurality of rollers.

16. The electrode plate processing apparatus according to claim 15, wherein, The width of the laser beam emitted from the laser cutter is smaller than the gap between the plurality of rollers.

17. The electrode plate processing apparatus according to any one of claims 1 to 4, further comprising: The sensor unit is configured to detect the state of at least one of the plurality of rollers, the substrate, and the self-supporting membrane; as well as The control unit is configured to receive detection signals from the sensor unit and control the operation of the laser cutter.

18. The electrode plate processing apparatus according to claim 17, wherein, The sensor unit is further configured to detect whether the gap between the plurality of rollers is within a predetermined distance.

19. The electrode plate processing apparatus according to claim 17, wherein, The sensor unit is further configured to detect whether the plurality of rollers are interfered with by the laser cutter.

20. The electrode plate processing apparatus according to claim 17, wherein, The sensor unit is further configured to detect the width of the adhesive layer on the substrate.

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