Drilling jig and drilling method for green ceramic sheet

Abstract

The application discloses a green ceramic sheet drilling jig and a drilling method. The green ceramic sheet drilling jig comprises a vacuum chip suction component and a fixing component. The vacuum chip suction component comprises a chip suction component and a chip suction vacuum negative pressure source. The chip suction component comprises a plurality of chip suction holes corresponding to the holes to be drilled on the green ceramic sheet. Under the action of the chip suction vacuum negative pressure source, the machining byproducts (such as chippings) generated by drilling the holes on the green ceramic sheet enter the chip suction holes. The fixing component is arranged around the circumference of the chip suction component and is used for fixing the green ceramic sheet drilling jig and the green ceramic sheet (for example, the green ceramic sheet is fixed flat on the drilling jig through vacuum adsorption). Therefore, the problem that the edges of the through holes of the green ceramic sheet have residues and the through holes of the green ceramic sheet are blocked can be avoided, and thus the machining efficiency can be improved. Furthermore, the machining byproducts are sucked away from the through holes of the green ceramic sheet, which helps to ensure that the hole openings and the holes of the green ceramic sheet are clean and free of foreign matters, and thus the appearance quality of the through holes of the green ceramic sheet is good.

Description

Technical Field

[0001] This application belongs to the field of raw ceramic tile processing, and specifically relates to a drilling fixture and drilling method for raw ceramic tiles. Background Technology

[0002] Both LTCC and HTCC manufacturing processes require the initial machining of through-holes in the green ceramic wafers, followed by filling the holes with metal paste. The quality of the through-holes directly affects the fullness of the paste filling and thus determines the final product quality. Currently, with the increasing number of through-holes being machined, laser drilling has become the preferred solution for through-hole machining. However, the current laser drilling process for green ceramic wafers suffers from low processing efficiency. Summary of the Invention

[0003] The purpose of this application is to overcome the shortcomings of the prior art and provide a drilling fixture and drilling method for green ceramic tiles. The drilling fixture and drilling method for green ceramic tiles enable high drilling efficiency.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0005] A drilling fixture for green ceramic tiles includes a vacuum chip-collecting component and a fixing component. The vacuum chip-collecting component includes a chip-collecting part and a chip-collecting vacuum negative pressure source. The chip-collecting part includes multiple chip-collecting holes, which correspond to the holes to be drilled on the green ceramic tile. Under the action of the chip-collecting vacuum negative pressure source, processing byproducts generated during drilling on the green ceramic tile enter the chip-collecting holes. The fixing component is arranged circumferentially around the chip-collecting part for fixing the drilling fixture to the green ceramic tile.

[0006] In some embodiments, at least a portion of the dust-collecting hole extends through the dust-collecting component.

[0007] In some embodiments, the fixing component includes a fixing component support surface, the dust suction component includes a dust suction component support surface, the dust suction component support surface is penetrated by the dust suction hole, and is located in the same plane as the fixing component support surface and is parallel to the horizontal plane.

[0008] In some embodiments, at least some of the chip suction holes are honeycomb holes, and these honeycomb holes are connected as a whole.

[0009] In some embodiments, the diameter of the honeycomb pores is 0.5-5 mm.

[0010] In some embodiments, the drilling fixture for the green ceramic sheet includes a fixed vacuum negative pressure source, and the fixing component includes a plurality of adsorption holes; the fixed vacuum negative pressure source is in communication with the plurality of adsorption holes to adsorb the green ceramic sheet onto the fixing component.

[0011] In some embodiments, the fixing member surrounds the dust-collecting member, and the plurality of suction holes are evenly distributed on the fixing member.

[0012] In some embodiments, the spacing between the plurality of adsorption pores is 5-20 mm, and / or, at least some of the adsorption pores have a diameter of 0.5-2 mm.

[0013] A method for drilling holes in raw ceramic tiles includes the following steps:

[0014] The drilling fixture is fixed to the green ceramic sheet, and the drilling fixture includes a chip suction hole and a chip suction vacuum negative pressure source;

[0015] Import the processing drawings and use the set parameters to perform laser drilling on the green ceramic sheet;

[0016] Under the action of the vacuum negative pressure source for chip removal, the processing byproducts generated from drilling holes in the green ceramic sheet enter the chip removal hole.

[0017] In some embodiments, the chip suction hole extends through the drilling fixture, and under the action of the chip suction vacuum negative pressure source, the processing by-products are discharged from the chip suction hole, and / or, the chip suction hole is also used to dissipate heat generated during the drilling process.

[0018] In some embodiments, the drilling fixture is fixed to the green ceramic sheet by vacuum adsorption.

[0019] This application has the following advantages compared with the prior art:

[0020] Because the vacuum negative pressure source draws the processing byproducts (such as chips) generated during drilling of green ceramic wafers into the suction hole, it helps avoid problems such as residue buildup at the edges of the green ceramic wafer through-holes and blockages within the through-holes during processing (e.g., at high laser processing energies). This allows for increased laser processing energy and fewer processing cycles, thus improving processing efficiency. Furthermore, under the suction effect of the vacuum negative pressure source, the processing byproducts enter the suction hole from the bottom of the green ceramic wafer through-hole, preventing backsplashing and glue overflow. This ensures that the opening and interior of the green ceramic wafer through-holes are clean and free of foreign matter, resulting in better appearance quality and easier quality control during the processing of green ceramic wafer through-holes. Attached Figure Description

[0021] Figure 1 This is a top view of a drilling fixture for green ceramic tiles according to this application;

[0022] Figure 2 This is a schematic diagram of the drilling fixture for the green ceramic tile of this application assembled with the green ceramic tile, used to illustrate drilling holes in the green ceramic tile. Detailed Implementation

[0023] To illustrate the technical content, structural features, achieved objectives, and effects of the invention in detail, the technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. In the following description, for illustrative purposes, numerous specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments can also be implemented independently without these specific details or in one or more equivalent arrangements. Furthermore, the various exemplary embodiments may differ, but are not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, structure, and characteristics of the exemplary embodiments may be used or implemented in another exemplary embodiment.

[0024] See Figure 1 and Figure 2 This application discloses a drilling fixture for green ceramic tiles. The drilling fixture 10 for green ceramic tiles includes a vacuum chip suction component and a fixing component 1. In some embodiments, the fixing component 1 is made of stainless steel. The vacuum chip suction component includes a chip suction component 2 and a chip suction vacuum negative pressure source (not shown in the figure). The chip suction vacuum negative pressure source and the subsequent fixing vacuum negative pressure source are actually vacuum negative pressure sources, but are distinguished by adding chip suction and fixing respectively. The chip suction component 2 is made of alloy honeycomb plate or polypropylene (PP), etc. The chip suction component 2 includes multiple chip suction holes 21. Figure 2 Only one chip suction hole 21 is shown, but this is not intended to limit the chip suction hole 21 to only one. One function of the chip suction hole 21 is to collect the processing byproducts (chips or molten material, etc.) generated during drilling. Therefore, the structure and number of chip suction holes 21 are not limited, as long as they serve the stated function. Typically, the width of the hole drilled on the green ceramic sheet is consistent with the width of the chip suction component 2. The position of the chip suction hole 21 corresponds to the position of the hole to be drilled on the green ceramic sheet 20. Under the action of the chip suction vacuum negative pressure source, the processing byproducts (such as chips) generated during drilling on the green ceramic sheet enter the chip suction hole 21. Therefore, based on the relationship between the processing byproducts, the hole to be drilled, and the chip suction hole 21, the correspondence is not limited to a one-to-one correspondence (for example, one chip suction hole 21 can collect the processing byproducts generated from multiple holes to be drilled), as long as the processing byproducts generated during drilling can be sucked into the chip suction hole 21 and discharged smoothly.

[0025] The fixing component 1 is distributed circumferentially around the chip-collecting component 2. Here, the fixing component 1 can be a single component distributed circumferentially around the chip-collecting component 2, or it can be multiple components distributed at intervals circumferentially around the chip-collecting component 2. In some embodiments, the fixing component 1 and the chip-collecting component 2 can be an integral structure, that is, two parts of a single component. The circumferential distribution can be a full circle or not. The fixing component 1 is used to fix the drilling fixture 10 of the green ceramic sheet to the green ceramic sheet 20. The fixing structure is not limited, as long as drilling is completed.

[0026] As described above, the processing byproducts (such as debris) generated during drilling holes in the green ceramic sheet (for ease of distinction, these holes will be referred to as green ceramic sheet through holes 201) are drawn into the suction holes 21 by the suction vacuum negative pressure source. This helps to avoid the problems of residue easily accumulating at the edges of the green ceramic sheet through holes 201 and blockage within the holes 201 during processing (e.g., under high laser energy). This allows for increased laser processing energy and reduced processing times, thereby improving processing efficiency. Furthermore, under the adsorption effect of the suction vacuum negative pressure source, the processing byproducts enter the suction holes 21 from the bottom of the green ceramic sheet through holes 201 without backsplashing or excess adhesive. This helps ensure that the opening and interior of the green ceramic sheet through holes 201 are clean and free of foreign matter, thus contributing to good appearance quality of the green ceramic sheet through holes 201 and making it easier to control the quality of the processed green ceramic sheet through holes.

[0027] See Figure 2 In some embodiments, the chip suction hole 21 extends through the chip suction component 2. Thus, on the one hand, the processing byproducts generated during drilling can be smoothly discharged through the through-hole 21 under the adsorption of the chip suction vacuum negative pressure source; on the other hand, it also helps to prevent the heat generated by laser drilling from accumulating at the bottom of the green ceramic sheet. Ultimately, both of these aspects contribute to achieving a high-efficiency and high-quality laser drilling process.

[0028] See Figure 2 and Figure 1 The fixing component 1 includes a fixing component support surface 12. The dust suction component 2 includes a dust suction component support surface 22. The dust suction component support surface 22 is penetrated by a dust suction hole 21, and is located in the same plane as the fixing component support surface 12 and is parallel to the horizontal plane.

[0029] As described above, with both components located in the same plane and parallel to the horizontal plane, the green ceramic sheet 20 is supported by the chip-collecting component support surface 22 and the fixing component support surface 12. The green ceramic sheet 20 is also horizontal, which helps to avoid warping and other adverse factors, ensuring good positional and machining accuracy of the through-hole 201. If the chip-collecting component support surface 22 and the fixing component support surface are not parallel to the horizontal plane, the green ceramic sheet 20 will be tilted (including unevenness), causing the machined through-hole 201 to deviate from its designed position. Consequently, the positional accuracy and machining accuracy of the through-hole 201 will be low.

[0030] See Figure 1 , Figure 1 The illustration shows all the chip suction holes 21 as honeycomb holes (the holes at the edges are part of the honeycomb holes), but those skilled in the art will understand that at least some of the chip suction holes 21 may be honeycomb holes, and these honeycomb holes may be connected as a whole. Of course, considering only the need to accommodate the processing byproducts generated during drilling, the chip suction holes 21 may not be honeycomb holes, for example, square holes or round holes, etc.

[0031] As described above, compared to holes of other shapes, the honeycomb holes have a smaller area occupied by the spacing 23 between them. This makes it easier for drilling byproducts to enter the honeycomb holes, thus improving processing efficiency and the appearance quality of the through-holes 201 in the green ceramic sheet. Furthermore, when the chip-collecting holes 21 penetrate the chip-collecting component 2, they also facilitate heat dissipation and the removal of processing byproducts.

[0032] In some embodiments, the diameter of the honeycomb cells is 0.5-5 mm. This facilitates the entry of processing byproducts into the honeycomb cells; if the diameter is too small, processing byproducts may not easily enter the cells and may remain in the gaps 23 between adjacent cells. Furthermore, it ensures good support for the green ceramic sheet 20. If the diameter is too large, the area of ​​the chip-collecting component 2 corresponding to the chip-collecting hole 21 becomes too soft and easily deformed, thus failing to properly support the green ceramic sheet 20, causing it to tilt (including unevenness) and affecting drilling accuracy.

[0033] In some embodiments, the drilling fixture for the green ceramic sheet includes a fixed vacuum negative pressure source (not shown in the figure), and the fixing component 1 includes a plurality of adsorption holes 12. The fixed vacuum negative pressure source communicates with the plurality of adsorption holes 12 to adsorb the green ceramic sheet 20 onto the fixing component 1. The fixed vacuum negative pressure source and the chip suction vacuum negative pressure source can be independent components, or they can be the same component.

[0034] As described above, by adsorbing the fixing component 1 and the green ceramic sheet 20 together through vacuum adsorption, the drilling fixture 10 of the green ceramic sheet is fixed together with the green ceramic sheet 20, providing uniform adsorption of the green ceramic sheet, preventing warping of the green ceramic sheet 20, and ensuring good positional accuracy of the through hole 201 in the green ceramic sheet. With the fixed vacuum negative pressure source and the chip suction vacuum negative pressure source as independent components, the vacuum path of the entire drilling fixture is divided into two independent paths, which can be controlled separately, facilitating control and allowing for precise control of each path.

[0035] See Figure 1 The fixing component 1 surrounds the dust-collecting component 2, and the plurality of suction holes 12 are evenly distributed on the fixing component 1. Figure 1 In this configuration, the plurality of adsorption pores 12 are arranged in two concentric rings, with the adsorption pores 12 arranged in a row both laterally and longitudinally. In some other embodiments, the plurality of adsorption pores 12 may also be staggered to achieve a uniform distribution.

[0036] As described above, after the fixing component 1 surrounds the chip suction component 2, the multiple suction holes 12 are also evenly distributed on the fixing component 1 and around the chip suction component 2. In this way, the entire circumference of the green ceramic sheet 20 can be evenly adsorbed, which can provide better adsorption uniformity of the green ceramic sheet, better prevent the green ceramic sheet 20 from warping, and also make the positional accuracy of the through hole 201 of the processed green ceramic sheet good.

[0037] See Figure 1 The spacing between the plurality of adsorption pores 12 is 5-20 mm. This spacing can be horizontal, vertical, or both. In this case, the arrangement of the plurality of adsorption pores 12 is not limited to the two concentric circles shown in the figure; the pores 12 can also be staggered. In other embodiments, at least some of the adsorption pores 12 have a diameter of 0.5-2 mm. In still other embodiments, both the spacing and diameter of the adsorption pores 12 are within the aforementioned ranges.

[0038] As described above, the spacing and aperture of the adsorption holes 12 meet the above range, which can better provide the adsorption uniformity of the green ceramic sheet, better prevent the warping of the green ceramic sheet 20, and also make the positional accuracy of the through hole 201 of the processed green ceramic sheet good.

[0039] Secondly, this application discloses a drilling method for a green ceramic sheet. The green ceramic sheet includes a PET layer 202 and a green ceramic layer 203. The drilling method for the green ceramic sheet includes the following steps:

[0040] Install the drilling fixture 10 onto the worktable of the laser drilling machine and connect it to the equipment's vacuum system. If the vacuum system only includes a chip suction vacuum negative pressure source, connect only the chip suction vacuum negative pressure source. If the vacuum system includes both a chip suction vacuum negative pressure source and a stationary vacuum negative pressure source, connect both.

[0041] The drilling fixture 10 is fixed to the green ceramic sheet 20, thus the drilling fixture 10 serves as the working surface for drilling holes in the green ceramic sheet. More specifically, in some embodiments, the green ceramic sheet 20 with through holes to be processed is placed on the drilling fixture 10, and the green ceramic sheet 20 completely covers the adsorption hole 11 on the outside of the drilling fixture 10. Vacuum adsorption is then activated to adsorb and fix the green ceramic sheet 20. The drilling fixture 10 includes a chip suction hole 11 and a chip suction vacuum negative pressure source; in this case, the adsorption hole 21 can be provided on the adsorption component 2 as described above, or it can be provided on other structures.

[0042] Import the machining drawings and perform laser drilling on the green ceramic sheet 20 using the set parameters. The laser type can be a picosecond ultraviolet, picosecond green, nano, or femtosecond laser.

[0043] During the drilling process, the processing byproducts (molten material, debris, etc.) of the green ceramic layer 203 and the PET layer 202 can enter the chip suction hole 11 under the action of vacuum adsorption, without back splashing or overflowing adhesive.

[0044] In some embodiments, the chip suction hole 11 of the drilling method for the green ceramic sheet penetrates the drilling fixture, and under the action of the chip suction vacuum negative pressure source, the processing by-products are discharged from the chip suction hole 11. In some embodiments, the chip suction hole 11 is also used to dissipate heat generated during the drilling process, thereby preventing the accumulation of laser processing heat at the bottom of the through hole in the green ceramic sheet. Of course, in another embodiment, the chip suction hole 11 can be used both to discharge processing by-products and to dissipate heat.

[0045] In some embodiments, the drilling fixture 10 and the green ceramic sheet 20 are fixed by vacuum adsorption. The equipment used to achieve vacuum adsorption is not limited.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope. The scope of protection of the present invention is defined by the appended claims, specification, and their equivalents.

Claims

1. A drilling fixture for raw ceramic tiles, characterized in that, The drilling fixture for the green ceramic slab includes: A vacuum chip removal component includes a chip removal component and a chip removal vacuum negative pressure source. The chip removal component includes multiple chip removal holes, which correspond to the holes to be drilled on the green ceramic sheet. Under the action of the chip removal vacuum negative pressure source, the processing by-products generated during drilling on the green ceramic sheet enter the chip removal holes. A fixing component is arranged circumferentially around the chip-collecting component for fixing the drilling fixture of the green ceramic tile to the green ceramic tile.

2. The drilling fixture for green ceramic slabs according to claim 1, characterized in that, At least a portion of the said chip-collecting holes penetrates the chip-collecting component; And / or, the fixing component includes a fixing component support surface, the dust suction component includes a dust suction component support surface, the dust suction component support surface is penetrated by the dust suction hole, and is located in the same plane as the fixing component support surface and is parallel to the horizontal plane.

3. The drilling fixture for green ceramic slabs according to claim 1, characterized in that, At least some of the said chip suction holes are honeycomb holes, and these honeycomb holes are connected as one piece.

4. The drilling fixture for green ceramic slabs according to claim 3, characterized in that, The diameter of the honeycomb pores is 0.5-5mm.

5. The drilling fixture for green ceramic slabs according to claim 1, characterized in that, The drilling fixture for the green ceramic tile shown includes a fixed vacuum negative pressure source, and the fixing component includes a plurality of adsorption holes; the fixed vacuum negative pressure source is connected to the plurality of adsorption holes to adsorb the green ceramic tile onto the fixing component.

6. The drilling fixture for green ceramic slabs according to claim 5, characterized in that, The fixing component surrounds the dust-collecting component, and the plurality of suction holes are evenly distributed on the fixing component.

7. The drilling fixture for green ceramic slabs according to claim 5 or 6, characterized in that, The spacing between the plurality of adsorption pores is 5-20 mm, and / or, at least some of the adsorption pores have a diameter of 0.5-2 mm.

8. A method for drilling holes in raw ceramic tiles, characterized in that, The drilling method for the green ceramic slab includes the following steps: The drilling fixture is fixed to the green ceramic sheet, and the drilling fixture includes a chip suction hole and a chip suction vacuum negative pressure source; Import the processing drawings and use the set parameters to perform laser drilling on the green ceramic sheet; Under the action of the vacuum negative pressure source for chip removal, the processing byproducts generated from drilling holes in the green ceramic sheet enter the chip removal hole.

9. The drilling method for raw ceramic slabs according to claim 8, characterized in that, The chip suction hole extends through the drilling fixture. Under the action of the chip suction vacuum negative pressure source, the processing by-products are discharged from the chip suction hole, and / or the chip suction hole is also used to dissipate heat generated during the drilling process.

10. The drilling method for green ceramic slabs according to claim 8, characterized in that, The drilling fixture is fixed to the green ceramic sheet by vacuum adsorption.

Images