A multi-field coupling in-situ loading device and method based on piezoelectric micro-nano driving

By integrating a piezoelectric micro-nano driven multi-field coupling in-situ loading device with a piezoelectric driving module and a multi-field loading component, the problem of limited functionality and insufficient precision of existing devices is solved. This device achieves multi-field coupling integration and high-precision displacement control of the loading target, and is suitable for micro-nano material research in complex environments.

CN122149984APending Publication Date: 2026-06-05ZHEJIANG UNIV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG UNIV
Filing Date
2026-02-14
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing in-situ loading experimental devices have limited functionality and cannot achieve multi-field synergistic coupling loading such as force, electricity, heat, and magnetism. Furthermore, their positioning accuracy and response are insufficient, making it difficult to meet the high-end scientific research needs of micro and nano materials.

Method used

A multi-field coupled in-situ loading device driven by piezoelectric micro-nano integrates a piezoelectric driving module and a multi-field loading component. It provides high-precision displacement control through a piezoelectric stack and combines bending, thermal field and magnetic field loading modules to achieve multi-field coupled loading.

Benefits of technology

It achieves multi-field coupling integration of the loaded target, with displacement resolution reaching the micrometer or even nanometer level, suitable for dynamic mechanical testing, supports in-situ real-time observation, and is compatible with microscopic characterization equipment such as AFM and SEM.

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Abstract

The application discloses a multi-field coupling in-situ loading device and method based on piezoelectric micro-nano driving, which comprises a base platform, a piezoelectric driving module and a modular multi-field loading assembly fixed on the base platform; the piezoelectric driving module utilizes the inverse piezoelectric effect of a piezoelectric stack to generate precise displacement, and the displacement is transmitted to a loading target through a guide mechanism in the piezoelectric driving module to apply a mechanical load. The modular multi-field loading assembly comprises a bending module, a warming module and a magnetic field module, each module is installed in a multi-field loading area in the center of the base platform in a detachable structure; through piezoelectric stack driving and modular design, the integration and adaptation of the multi-field loading device and the object table are solved, and the multi-physical field coupling load such as force, heat, electricity and magnetism can be applied to the loading target under in-situ conditions.
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