A laser ranging system

Abstract

The application provides a laser ranging system which can prolong the endurance time and solve the problem of measurement error caused by signal saturation distortion; the laser ranging system comprises a power supply circuit for realizing power supply, a pulse laser driving circuit connected with a laser for driving the laser to emit pulse laser, a receiving amplification circuit for receiving echo reflected after the laser irradiation to a target and generating an echo voltage pulse signal, and a main control circuit connected with the power supply circuit, the pulse laser driving circuit and the receiving amplification circuit for realizing power cut-off in a standby state and laser ranging according to the received echo voltage pulse signal; the receiving amplification circuit comprises an avalanche photodiode (APD), a transimpedance amplification circuit, a first amplification circuit and a two-stage amplification circuit which are connected in sequence; the avalanche photodiode (APD) is arranged adjacent to a temperature sensor; the transimpedance amplification circuit, the first amplification circuit, the two-stage amplification circuit and the temperature sensor are all connected to the main control circuit.

Description

Technical Field

[0001] This invention relates to the field of laser technology, specifically to a laser ranging system. Background Technology

[0002] With the increasing demand for precision laser rangefinders, pulsed laser ranging technology, as an important means of modern precision measurement, is rapidly expanding from large-scale industrial and military equipment to portable consumer electronics, drones, handheld surveying instruments, and IoT terminals. This trend presents two extremely demanding and interconnected core challenges to the design of ranging systems: First, power consumption is a critical indicator in portable laser rangefinders. This is because the system is not always in a measuring state. If all components in the circuit are still powered during standby or sleep mode, it will lead to a large amount of static power consumption and ineffective energy consumption, severely shortening the device's battery life. Second, how to ensure timing accuracy over a very wide distance range from a few meters to several kilometers, and avoid measurement errors caused by signal saturation distortion. Summary of the Invention

[0003] To address the aforementioned problems, this invention provides a laser ranging system that can extend battery life and solve the problem of measurement errors caused by signal saturation distortion.

[0004] This invention adopts the following technical solution: a laser ranging system, comprising: The power supply circuit is used to provide power. A pulsed laser driving circuit, connected to the laser, is used to drive the laser so that the laser emits pulsed laser light. The receiving amplifier circuit is used to receive the echo reflected after the laser shines on the target and generate an echo voltage pulse signal. The main control circuit is connected to the power supply circuit, the pulsed laser drive circuit, and the receiving amplifier circuit. It is used to cut off the power supply in standby mode and to realize laser ranging based on the received echo voltage pulse signal. The receiving amplification circuit includes an avalanche photodiode (APD), a transimpedance amplifier circuit, a first-stage amplifier circuit, and a second-stage amplifier circuit connected in sequence. The avalanche photodiode (APD) is arranged adjacent to the temperature sensor. The transimpedance amplifier circuit, the first-stage amplifier circuit, the second-stage amplifier circuit, and the temperature sensor are all connected to the main control circuit.

[0005] Further, the power supply circuit includes a DC-DC circuit module, a power electronic switch module, an LDO power chip module, and a DC-DC boost module. The LDO power chip module includes a first voltage regulator unit LDO1, a second voltage regulator unit LDO2, and a third voltage regulator unit LDO3. The DC-DC circuit module is connected to the power electronic switch module, and the power electronic switch module is connected to the DC-DC boost module. The DC-DC circuit module, the power electronic switch module, and the DC-DC boost module are connected to the first voltage regulator unit LDO1, the second voltage regulator unit LDO2, and the third voltage regulator unit LDO3. The second voltage regulator unit LDO2 and the third voltage regulator unit LDO3 are respectively connected, and the first voltage regulator unit LDO1 and the second voltage regulator unit LDO2 are both connected to the main control circuit. The third voltage regulator unit LDO3 is connected to the transimpedance amplifier circuit, the first-stage amplifier circuit, the diode amplifier circuit, and the temperature sensor. The DC-DC boost module is connected to the avalanche photodiode APD. The pulsed laser drive circuit is connected to the power electronic switch module, the second voltage regulator unit LDO2, the third voltage regulator unit LDO3, and the DC-DC boost module. Furthermore, the main control circuit includes an MCU chip module, an FPGA chip module, an ADC chip module, and an analog switch chip module. The MCU chip module is connected to the first voltage regulator unit LDO1, the power electronic switch module, the DC-DC boost module, the FPGA chip module, and the temperature sensor. The MCU chip module communicates with the host computer via a serial port. The FPGA chip module is connected to the second voltage regulator unit LDO2, the ADC chip module, the analog switch chip module, and the pulsed laser drive circuit. The ADC chip module is connected to the analog switch chip module, and the analog switch chip module is connected to the first-stage amplifier circuit and the second-stage amplifier circuit. Furthermore, the DC-DC circuit module includes a boost chip U1, an inductor L1, capacitors C1~C6, and resistors R1~R5. The boost chip U1 is an SGM66051-ADJYTN6G / TR chip. One end of resistor R1 is connected to pin 1 of external terminal CN, and one end of resistor R4 is connected to pin 2 of external terminal CN. The other ends of resistors R1 and R4 are connected to one end of resistor R3, one end of capacitor C1, and pin 3 of boost chip U1. One end of inductor L1 is connected to the boost chip U1. Pin 1 of the circuit breaker is connected to pin 6 of the boost chip U1 and one end of capacitors C2-C4, and then connected to pin 1 of the external terminal CN. The other ends of capacitors C2-C4 are connected to ground. Pin 5 of the boost chip U1 is connected to one end of resistor R4, capacitors C5 and C6, and then connected to a voltage of 5V. The other ends of capacitors C5 and C6 are connected to ground. Pin 4 of the boost chip U1 is connected to the other end of resistor R4 and one end of resistor R5. The other ends of resistors R3, R5, and capacitor C1 are all grounded. Furthermore, the power electronic switch module includes a switch chip U2 and a resistor R6; the first voltage regulator unit LDO1 includes an LDO power chip U3 and capacitors C7~C11; the second voltage regulator unit LDO2 includes an LDO power chip U4 and capacitors C12~C14; the third voltage regulator unit LDO3 includes an LDO power chip U5 and capacitors C15~C17; the switch chip U2 is a SY6288DAAC chip; the LDO power chips U3 and U4 are both SGM2036-3.3YC5G / TR power chips, and the LDO power chip U5 is a ME6216A33M3G power chip. Furthermore, the DC-DC boost module includes a boost chip U6, capacitors C18~C24, resistors R7~R14, a ferrite bead B1, a boost transformer T1, and a switching diode D1; the boost chip U6 is an SGM6607AYTN6G / TR boost chip; one end of resistor R11 is connected to one end of capacitor C23 and then connected to the receiving amplifier circuit, and one end of resistor R14 is connected to the MCU chip module; Furthermore, the MCU chip module includes an MCU chip U7, capacitors C25~C30, and resistors R15~R16; the FPGA chip module includes an FPGA chip U8 and a resistor R17; the MCU chip U7 is an HC32F072FAUA-QN32TR chip, and the FPGA chip U8 is a GW1N-UV9QN48C6 / I5 chip; Further, the ADC chip module includes an ADC chip U9, capacitors C31~C42, resistors R18~R24, and inductor L2; the analog switch chip module includes an analog switch chip U10 and resistor R25; the ADC chip U9 is a 3PA1030 chip, and the analog switch chip U10 is an RS2057XC6 chip; one end of resistor R23 is connected to pin 38 of the FPGA chip U8, and one end of resistor R24 ​​is connected to pin 41 of the FPGA chip U8; pin 6 of the analog switch chip U10 is connected to pin 21 of the FPGA chip U8; one end of resistors R20~R22 is connected to pin 4 of the analog switch chip U10; pin 1 of the analog switch chip U10 is connected to the receiving amplifier circuit via resistor R25; and pin 3 of the analog switch chip U10 is connected to the receiving amplifier circuit. Furthermore, the pulsed laser driving circuit includes a driver U11, capacitors C43~C45, resistors R26~R30, inductor L3, diodes D2 and D3, interface LD, and MOSFET Q1; the interface LD is used to connect to the laser; the driver U11 uses a chip of model SL27511, pin 6 of the driver U11 is connected to one end of the resistor R26 and then connected to pin 20 of the FPGA chip U8, one end of the inductor L3 is connected to the positive terminal of the diode D2, and the other end of the inductor L3 is connected to the boost DC power supply; Furthermore, the transimpedance amplifier circuit includes a transimpedance amplifier U12, resistors R31~R33, and capacitors C46~C51; the first-stage amplifier circuit includes an operational amplifier U13, resistors R34~R37, and capacitors C52~C55; the second-stage amplifier circuit includes resistors R38~R41 and capacitors C56~C58; the transimpedance amplifier U12 uses an MS8257N chip, and the operational amplifier U13 uses an SGM8062XMS / TR chip. The avalanche photodiode (APD) is an LCC-905APD-230-1 / 2 diode; one end of resistor R31 is connected to one end of resistor R11 and one end of capacitor C23; one end of capacitor C58 is connected to one end of capacitor C52, one end of resistor R35, and one end of resistor R25; pin 1 of operational amplifier U13 is connected to one end of resistor R40, one end of capacitor C56, and pin 3 of analog switch chip U10.

[0006] The beneficial effects of this invention are that, in standby mode, the main control module can control the power circuit to cut off the power supply to all non-essential functional modules, thereby reducing the overall standby current of the system and perfectly meeting the demanding requirements of portable devices for long battery life. Furthermore, through the set transimpedance amplifier circuit, first-stage amplifier circuit, and second-stage amplifier circuit, the main control circuit can adaptively switch between multiple gain channels to select the echo voltage pulse of the first-stage amplifier circuit or the second-stage amplifier circuit, thereby solving the problem of measurement errors caused by signal saturation distortion, meeting the laser ranging requirements for different distances, and having good practical value. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the structural connection of the present invention; Figure 2 This is the circuit schematic diagram of the DC-DC circuit module in this invention; Figure 3 This is a circuit connection diagram of the power electronic switch module and the LDO power chip module in this invention; Figure 4 This is the circuit schematic of the DC-DC boost module in this invention; Figure 5 This is a circuit connection diagram of the MCU chip module and the FPGA chip module in this invention; Figure 6 This is a circuit connection diagram of the ADC chip module and the analog switch chip module in this invention; Figure 7 This is a circuit diagram of the pulsed laser driving circuit in this invention; Figure 8 This is a circuit diagram of the receiving amplifier circuit in this invention. Detailed Implementation

[0008] like Figures 1-8 As shown, a laser ranging system of the present invention includes: The power supply circuit is used to provide power. A pulsed laser driving circuit is connected to the laser and is used to drive the laser so that the laser emits pulsed laser light. The receiving amplifier circuit is used to receive the echo reflected after the laser shines on the target and generate an echo voltage pulse signal. The main control circuit is connected to the power supply circuit, the pulsed laser drive circuit, and the receiving amplifier circuit. It is used to cut off the power supply in standby mode and to realize laser ranging based on the received echo voltage pulse signal. The receiving amplification circuit includes an avalanche photodiode (APD), a transimpedance amplifier circuit, a first-stage amplifier circuit, and a second-stage amplifier circuit connected in sequence. The avalanche photodiode (APD) is arranged adjacent to the temperature sensor. The transimpedance amplifier circuit, the first-stage amplifier circuit, the second-stage amplifier circuit, and the temperature sensor are all connected to the main control circuit.

[0009] The power supply circuit primarily provides the required power voltage to various components in the system. It includes a DC-DC circuit module, a power electronic switch module, an LDO power chip module, and a DC-DC boost module. The LDO power chip module comprises a first voltage regulator unit (LDO1), a second voltage regulator unit (LDO2), and a third voltage regulator unit (LDO3). The DC-DC circuit module is connected to the power electronic switch module, which in turn is connected to the DC-DC boost module. The DC-DC circuit module, power electronic switch module, and DC-DC boost module are respectively connected to the first voltage regulator unit (LDO1), the second voltage regulator unit (LDO2), and the third voltage regulator unit (LDO3). The first voltage regulator unit (LDO1) and the second voltage regulator unit (LDO2) are both connected to the main control circuit, while the third voltage regulator unit (LDO3) is connected to the transimpedance amplifier circuit, the first-stage amplifier circuit, the diode amplifier circuit, and the temperature sensor. The DC-DC boost module is connected to the avalanche photodiode (APD). The pulsed laser drive circuit is connected to the power electronic switch module, the second voltage regulator unit (LDO2), the third voltage regulator unit (LDO3), and the DC-DC boost module.

[0010] The main control circuit includes an MCU chip module, an FPGA chip module, an ADC chip module, and an analog switch chip module. The MCU chip module is connected to the first voltage regulator unit LDO1, the power electronic switch module, the DC-DC boost module, the FPGA chip module, and the temperature sensor. The MCU chip module communicates with the host computer via a serial port. The FPGA chip module is connected to the second voltage regulator unit LDO2, the ADC chip module, the analog switch chip module, and the pulsed laser drive circuit. The ADC chip module is connected to the analog switch chip module, and the analog switch chip module is connected to the first-stage amplifier circuit and the second-stage amplifier circuit.

[0011] The DC-DC circuit module includes a boost converter chip U1, an inductor L1, capacitors C1~C6, and resistors R1~R5. The boost converter chip U1 is model SGM66051-ADJYTN6G / TR. One end of resistor R1 is connected to pin 1 of external terminal CN, and one end of resistor R4 is connected to pin 2 of external terminal CN. The other ends of resistors R1 and R4 are connected to one end of resistor R3, one end of capacitor C1, and pin 3 of boost converter chip U1. One end of inductor L1 is connected to boost converter chip U1. Pin 1 of the boost chip is connected to pin 6 of the boost chip U1 and one end of capacitors C2 to C4, and then connected to pin 1 of the external terminal CN. The other ends of capacitors C2 to C4 are connected to ground. Pin 5 of the boost chip U1 is connected to one end of resistor R4, capacitors C5 and C6, and then connected to a voltage of 5V. The other ends of capacitors C5 and C6 are connected to ground. Pin 4 of the boost chip U1 is connected to the other end of resistor R4 and one end of resistor R5. The other ends of resistors R3, R5 and capacitor C1 are all grounded.

[0012] The power electronic switch module includes a switch chip U2 and a resistor R6; the first voltage regulator unit LDO1 includes an LDO power chip U3 and capacitors C7~C11; the second voltage regulator unit LDO2 includes an LDO power chip U4 and capacitors C12~C14; the third voltage regulator unit LDO3 includes an LDO power chip U5 and capacitors C15~C17; the switch chip U2 uses the SY6288DAAC chip; the LDO power chips U3 and U4 both use the SGM2036-3.3YC5G / TR power chip, and the LDO power chip U5 uses the ME6216A33M3G power chip.

[0013] The DC-DC boost module includes a boost chip U6, capacitors C18~C24, resistors R7~R14, a ferrite bead B1, a boost transformer T1, and a switching diode D1. The boost chip U6 is an SGM6607AYTN6G / TR boost chip. One end of resistor R11 is connected to one end of capacitor C23 and then connected to the receiving amplifier circuit. One end of resistor R14 is connected to the MCU chip module.

[0014] The MCU chip module includes MCU chip U7, capacitors C25~C30, and resistors R15~R16; the FPGA chip module includes FPGA chip U8 and resistor R17; MCU chip U7 uses the HC32F072FAUA-QN32TR chip, and FPGA chip U8 uses the GW1N-UV9QN48C6 / I5 chip.

[0015] The ADC chip module includes ADC chip U9, capacitors C31~C42, resistors R18~R24, and inductor L2; the analog switch chip module includes analog switch chip U10 and resistor R25; ADC chip U9 is a 3PA1030 chip, and analog switch chip U10 is an RS2057XC6 chip; one end of resistor R23 is connected to pin 38 of FPGA chip U8, and one end of resistor R24 ​​is connected to pin 41 of FPGA chip U8; pin 6 of analog switch chip U10 is connected to pin 21 of FPGA chip U8; one end of resistors R20~R22 is connected to pin 4 of analog switch chip U10; pin 1 of analog switch chip U10 is connected to the receiving amplifier circuit via resistor R25; and pin 3 of analog switch chip U10 is connected to the receiving amplifier circuit.

[0016] The pulsed laser drive circuit includes driver U11, capacitors C43~C45, resistors R26~R30, inductor L3, diodes D2 and D3, interface LD, and MOSFET Q1. Interface LD is used to connect to the laser. Driver U11 uses the SL27511 chip. Pin 6 of driver U11 is connected to one end of resistor R26 and then to pin 20 of FPGA chip U8. One end of inductor L3 is connected to the positive terminal of diode D2, and the other end of inductor L3 is connected to the boost DC power supply. The port LD_PWR in the figure is used to connect to the boost DC power supply, and the boost DC power supply can be the XL6007 boost DC power supply chip.

[0017] The transimpedance amplifier circuit includes transimpedance amplifier U12, resistors R31~R33, and capacitors C46~C51; the first-stage amplifier circuit includes operational amplifier U13, resistors R34~R37, and capacitors C52~C55; the second-stage amplifier circuit includes resistors R38~R41 and capacitors C56~C58; the transimpedance amplifier U12 uses an MS8257N chip, the operational amplifier U13 uses an SGM8062XMS / TR chip, and the avalanche photodiode APD uses an LCC-905APD-230-1 / 2 diode; one end of resistor R31 is connected to one end of resistor R11 and one end of capacitor C23; one end of capacitor C58 is connected to one end of capacitor C52, one end of resistor R35, and one end of resistor R25; pin 1 of operational amplifier U13 is connected to one end of resistor R40, one end of capacitor C56, and pin 3 of analog switch chip U10.

[0018] In this invention, the power electronic switch module can be controlled via pin 26 of the MCU chip U7 in standby mode. This allows the power supply to other components in the system to be cut off in standby mode, reducing standby power consumption and perfectly meeting the demanding requirements of portable devices for long battery life. The MCU chip U7 reads the temperature detected by a temperature sensor placed next to the avalanche photodiode (APD), and then adjusts the output voltage of the DC-DC boost module via pin 10 of the MCU chip U7 to provide a suitable power supply voltage for the avalanche photodiode (APD). The MCU chip module communicates with the host computer via a serial port connection to the external terminal CN. After receiving the ranging command from the host computer, the MCU chip module communicates with the FPGA chip module via a serial interface. The MCU chip module notifies the FPGA chip module to start ranging and reads the ranging data calculated by the FPGA chip module, then sends the ranging data to the host computer. In this process, after the FPGA chip module receives the ranging command from the MCU chip module, the pulsed laser drive circuit, controlled by pin 20 of the FPGA chip U8, provides a pulse voltage to the laser, causing the laser to emit pulsed laser light. When the laser shines on the target, it is reflected and received by the avalanche photodiode (APD). The APD generates a weak echo pulse current, which, after passing through a transimpedance amplifier circuit, a first-stage amplifier circuit, and a second-stage amplifier circuit, generates an echo voltage pulse. This echo voltage pulse is then controlled by pin 21 of the FPGA chip U8 to select either the echo voltage pulse from the first-stage or second-stage amplifier circuit and transmitted to the ADC chip module. The ADC chip module converts the voltage pulse signal into a continuous digital signal and sends it to the FPGA chip module via a parallel interface. The FPGA chip module calculates the distance between the target and the laser based on the time difference between the laser emission time and the pulse voltage start time. Subsequently, the FPGA chip module feeds back the calculated distance data to the MCU chip module. This process uses different amplification circuits for echo voltage pulses for near-range and long-range ranging to solve the measurement error caused by signal saturation distortion.

[0019] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0020] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A laser ranging system, characterized in that: include: The power supply circuit is used to provide power. A pulsed laser driving circuit, connected to the laser, is used to drive the laser so that the laser emits pulsed laser light. The receiving amplifier circuit is used to receive the echo reflected after the laser shines on the target and generate an echo voltage pulse signal. The main control circuit is connected to the power supply circuit, the pulsed laser drive circuit, and the receiving amplifier circuit. It is used to cut off the power supply in standby mode and to realize laser ranging based on the received echo voltage pulse signal. The receiving amplification circuit includes an avalanche photodiode (APD), a transimpedance amplifier circuit, a first-stage amplifier circuit, and a second-stage amplifier circuit connected in sequence. The avalanche photodiode (APD) is arranged adjacent to the temperature sensor. The transimpedance amplifier circuit, the first-stage amplifier circuit, the second-stage amplifier circuit, and the temperature sensor are all connected to the main control circuit.

2. The laser ranging system according to claim 1, characterized in that: The power supply circuit includes a DC-DC circuit module, a power electronic switch module, an LDO power chip module, and a DC-DC boost module. The LDO power chip module includes a first voltage regulator unit LDO1, a second voltage regulator unit LDO2, and a third voltage regulator unit LDO3. The DC-DC circuit module is connected to the power electronic switch module, and the power electronic switch module is connected to the DC-DC boost module. The DC-DC circuit module, the power electronic switch module, and the DC-DC boost module are respectively connected to the first voltage regulator unit LDO1, the second voltage regulator unit LDO2, and the third voltage regulator unit LDO3. The first voltage regulator unit LDO1 and the second voltage regulator unit LDO2 are both connected to the main control circuit, and the third voltage regulator unit LDO3 is connected to the transimpedance amplifier circuit, the first-stage amplifier circuit, the diode amplifier circuit, and the temperature sensor. The DC-DC boost module is connected to the avalanche photodiode (APD). The pulsed laser drive circuit is connected to the power electronic switch module, the second voltage regulator unit LDO2, the third voltage regulator unit LDO3, and the DC-DC boost module.

3. The laser ranging system according to claim 2, characterized in that: The main control circuit includes an MCU chip module, an FPGA chip module, an ADC chip module, and an analog switch chip module. The MCU chip module is connected to the first voltage regulator unit LDO1, the power electronic switch module, the DC-DC boost module, the FPGA chip module, and the temperature sensor. The MCU chip module communicates with the host computer via a serial port. The FPGA chip module is connected to the second voltage regulator unit LDO2, the ADC chip module, the analog switch chip module, and the pulsed laser drive circuit. The ADC chip module is connected to the analog switch chip module, and the analog switch chip module is connected to the first-stage amplifier circuit and the second-stage amplifier circuit.

4. The laser ranging system according to claim 2, characterized in that: The DC-DC circuit module includes a boost converter chip U1, an inductor L1, capacitors C1-C6, and resistors R1-R5. The boost converter chip U1 is an SGM66051-ADJYTN6G / TR chip. One end of resistor R1 is connected to pin 1 of external terminal CN, and one end of resistor R4 is connected to pin 2 of external terminal CN. The other ends of resistors R1 and R4 are connected to one end of resistor R3, one end of capacitor C1, and pin 3 of boost converter chip U1. One end of inductor L1 is connected to pin 1 of boost converter chip U1. The other end of the inductor L1 is connected to pin 6 of the boost chip U1 and one end of capacitors C2-C4, and then connected to pin 1 of the external terminal CN. The other ends of capacitors C2-C4 are connected to ground. Pin 5 of the boost chip U1 is connected to one end of resistor R4, capacitors C5 and C6, and then connected to a voltage of 5V. The other ends of capacitors C5 and C6 are connected to ground. Pin 4 of the boost chip U1 is connected to the other end of resistor R4 and one end of resistor R5. The other ends of resistors R3, R5, and capacitor C1 are all grounded.

5. A laser ranging system according to claim 2, characterized in that: The power electronic switch module includes a switch chip U2 and a resistor R6; the first voltage regulator unit LDO1 includes an LDO power chip U3 and capacitors C7~C11; the second voltage regulator unit LDO2 includes an LDO power chip U4 and capacitors C12~C14; the third voltage regulator unit LDO3 includes an LDO power chip U5 and capacitors C15~C17; the switch chip U2 is a SY6288DAAC chip; the LDO power chips U3 and U4 are both SGM2036-3.3YC5G / TR power chips, and the LDO power chip U5 is a ME6216A33M3G power chip.

6. A laser ranging system according to claim 3, characterized in that: The DC-DC boost module includes a boost chip U6, capacitors C18~C24, resistors R7~R14, a ferrite bead B1, a boost transformer T1, and a switching diode D1; the boost chip U6 is an SGM6607AYTN6G / TR boost chip; one end of resistor R11 is connected to one end of capacitor C23 and then connected to the receiving amplifier circuit, and one end of resistor R14 is connected to the MCU chip module.

7. A laser ranging system according to claim 3, characterized in that: The MCU chip module includes MCU chip U7, capacitors C25~C30, and resistors R15~R16; the FPGA chip module includes FPGA chip U8 and resistor R17; the MCU chip U7 is a chip of model HC32F072FAUA-QN32TR, and the FPGA chip U8 is a chip of model GW1N-UV9QN48C6 / I5.

8. A laser ranging system according to claim 7, characterized in that: The ADC chip module includes an ADC chip U9, capacitors C31~C42, resistors R18~R24, and inductor L2; the analog switch chip module includes an analog switch chip U10 and resistor R25; the ADC chip U9 is a 3PA1030 chip, and the analog switch chip U10 is an RS2057XC6 chip; one end of resistor R23 is connected to pin 38 of the FPGA chip U8, and one end of resistor R24 ​​is connected to pin 41 of the FPGA chip U8; pin 6 of the analog switch chip U10 is connected to pin 21 of the FPGA chip U8; one end of resistors R20~R22 is connected to pin 4 of the analog switch chip U10; pin 1 of the analog switch chip U10 is connected to the receiving amplifier circuit via resistor R25; and pin 3 of the analog switch chip U10 is connected to the receiving amplifier circuit.

9. A laser ranging system according to claim 7, characterized in that: The pulsed laser driving circuit includes a driver U11, capacitors C43~C45, resistors R26~R30, inductor L3, diodes D2 and D3, interface LD, and MOSFET Q1. The interface LD is used to connect to the laser. The driver U11 uses a chip of model SL27511. Pin 6 of the driver U11 is connected to one end of the resistor R26 and then connected to pin 20 of the FPGA chip U8. One end of the inductor L3 is connected to the positive terminal of the diode D2, and the other end of the inductor L3 is connected to the boost DC power supply.

10. A laser ranging system according to claim 8, characterized in that: The transimpedance amplifier circuit includes a transimpedance amplifier U12, resistors R31-R33, and capacitors C46-C51; the first-stage amplifier circuit includes an operational amplifier U13, resistors R34-R37, and capacitors C52-C55; the second-stage amplifier circuit includes resistors R38-R41 and capacitors C56-C58; the transimpedance amplifier U12 uses an MS8257N chip, the operational amplifier U13 uses an SGM8062XMS / TR chip, and the avalanche photodiode (APD) uses an LCC-905APD-230-1 / 2 diode; one end of resistor R31 is connected to one end of resistor R11 and one end of capacitor C23; one end of capacitor C58 is connected to one end of capacitor C52, one end of resistor R35, and one end of resistor R25; pin 1 of the operational amplifier U13 is connected to one end of resistor R40, one end of capacitor C56, and pin 3 of analog switch chip U10.

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