Mechanical and electrical assembly circuit board intelligent integrated control operation optimization system

Abstract

The application belongs to the technical field of intelligent manufacturing of electromechanical assembly circuit board, and discloses an intelligent integrated control operation optimization system for electromechanical assembly circuit board; the system comprises a multi-parameter sensing module, an energy efficiency correction processing module, a stress correlation modeling module, a delay setting control module and a collaborative execution module, the energy efficiency correction processing module is provided with an environment load collaborative energy efficiency correction structure, the stress correlation modeling module is provided with a solder joint stress electrical performance correlation modeling structure, the delay setting control module is provided with a process parameter adaptive delay setting structure, and the modules are connected in sequence; the application solves the problem of poor operation stability of the circuit board control without collaborative optimization structure in the prior art, realizes intelligent integrated control optimization of the circuit board, and guarantees operation reliability.

Description

Technical Field

[0001] This invention belongs to the field of intelligent manufacturing technology for electromechanical component circuit boards, and specifically relates to an intelligent integrated control and operation optimization system for electromechanical component circuit boards. Background Technology

[0002] In the current intelligent manufacturing process of electromechanical component circuit boards, the control and operation optimization system mostly adopts a single module independent working mode. It lacks a collaborative structure that includes environmental load coordinated energy efficiency correction, solder joint stress electrical performance correlation modeling, and process parameter adaptive delay tuning. As a result, when the circuit board is running, it is impossible to achieve dynamic linkage optimization of input power, environmental parameters, and solder joint stress. This can easily lead to problems such as unstable signal transmission and easy solder joint failure, which seriously affects the operational reliability and service life of the circuit board.

[0003] Based on the above problems, there is an urgent need for an intelligent integrated control and operation optimization system for electromechanical component circuit boards that can achieve multi-module collaborative optimization and solve the above core problems. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies and propose an intelligent integrated control and operation optimization system for electromechanical component circuit boards. This system includes a multi-parameter sensing module, an energy efficiency correction processing module, a stress correlation modeling module, a delay tuning control module, and a collaborative execution module. The energy efficiency correction processing module is equipped with an environmental load-coordinated energy efficiency correction structure. The stress correlation modeling module is equipped with a solder joint stress electrical performance correlation modeling structure. The delay tuning control module is equipped with a process parameter adaptive delay tuning structure. The multi-parameter sensing module is connected to the energy efficiency correction processing module, the energy efficiency correction processing module is connected to the stress correlation modeling module, the stress correlation modeling module is connected to the delay tuning control module, and the delay tuning control module is connected to the collaborative execution module.

[0005] Preferably, the multi-parameter sensing module includes a power acquisition unit, a temperature acquisition unit, a humidity acquisition unit, a load detection unit, a strain detection unit, and a modulus detection unit. The power acquisition unit is connected to the energy efficiency correction processing module, the temperature acquisition unit is connected to the energy efficiency correction processing module, the humidity acquisition unit is connected to the energy efficiency correction processing module, the load detection unit is connected to the energy efficiency correction processing module, the strain detection unit is connected to the stress correlation modeling module, and the modulus detection unit is connected to the stress correlation modeling module.

[0006] More preferably, the energy efficiency correction processing module includes a data parsing unit, a correction calculation unit, and a parameter output unit. The data parsing unit is connected to the power acquisition unit, the temperature acquisition unit, the humidity acquisition unit, and the load detection unit. The correction calculation unit is connected to the data parsing unit. The correction calculation unit has a built-in environmental load-coordinated energy efficiency correction structure. The parameter output unit is connected to the correction calculation unit and the stress correlation modeling module.

[0007] More preferably, the stress correlation modeling module includes a modeling calculation unit, a stress calibration unit, and a stress output unit. The modeling calculation unit is connected to the parameter output unit, the modeling calculation unit is connected to the strain detection unit, and the modeling calculation unit is connected to the modulus detection unit. The modeling calculation unit has the weld stress electrical performance correlation modeling structure built in it. The stress calibration unit is connected to the modeling calculation unit, the stress output unit is connected to the modeling calculation unit, and the stress output unit is connected to the delay tuning control module.

[0008] More preferably, the correction calculation unit stores a dynamic signal transmission energy efficiency optimization formula, which is: ; in, For the circuit board to effectively transmit power, The total power input for the circuit board to operate. Based on the basic energy efficiency coefficient, For temperature sensitivity coefficient, For the process environment temperature, For standard reference temperature, Humidity sensitivity coefficient The relative humidity of the process environment, This is the load fluctuation factor.

[0009] More preferably, the modeling and calculation unit stores a calculation formula, which is used to combine the calculation results of the dynamic signal transmission energy efficiency optimization formula to complete the dynamic stress coupling calculation of the solder joint. The parameters of the calculation formula include the dynamic equivalent stress of the solder joint, the rated allowable stress of the solder joint, the strain parameter of the solder joint, the Young's modulus of the substrate, the standard Young's modulus of the substrate, and the load stress coupling coefficient.

[0010] More preferably, the delay tuning control module stores a calculation formula, which is used to combine the calculation results of the modeling calculation unit to complete the optimal adaptation delay calculation of process parameters. The parameters of the calculation formula include the optimal adaptation delay time, the basic adaptation delay time, the stress delay coupling coefficient, the energy efficiency delay coupling coefficient, the dynamic equivalent stress of the solder joint, and the effective transmission power of the circuit board.

[0011] More preferably, the delay tuning control module includes a delay calculation unit, a tuning generation unit, and a tuning output unit. The delay calculation unit is connected to the stress output unit. The delay calculation unit has the process parameter adaptive delay tuning structure built in it. The delay calculation unit stores the calculation formula. The tuning generation unit is connected to the delay calculation unit. The tuning output unit is connected to the tuning generation unit. The tuning output unit is connected to the collaborative execution module.

[0012] More preferably, the collaborative execution module includes a temperature control execution unit, a pressure execution unit, and a power supply regulation unit. The temperature control execution unit is connected to the setting output unit, the pressure execution unit is connected to the setting output unit, and the power supply regulation unit is connected to the setting output unit.

[0013] More preferably, the multi-parameter sensing module, the energy efficiency correction processing module, the stress correlation modeling module, the delay tuning control module, and the collaborative execution module are all built using embedded hardware units. The multi-parameter sensing module is connected to the detection port of the external circuit board process station, the collaborative execution module is connected to the execution port of the external circuit board process station, and the delay tuning control module and the collaborative execution module transmit data via wired data transmission.

[0014] The technical effects include: The inventive technical points of this invention are an environmental load collaborative energy efficiency correction structure, a solder joint stress electrical performance correlation modeling structure, and a process parameter adaptive delay tuning structure. These three structures work together to solve the core problems of circuit board control lacking a collaborative optimization structure, unstable operation, and easy solder joint failure in the background technology, thereby realizing intelligent integrated control optimization of the circuit board and ensuring operational reliability. Attached Figure Description

[0015] Figure 1 A block diagram showing the overall module connection of an optimized system for intelligent integrated control and operation of electromechanical component circuit boards; Figure 2 A block diagram showing the internal units and external modules of the multi-parameter sensing module; Figure 3 This is a block diagram showing the internal and external connections of the energy efficiency correction module; Figure 4A block diagram showing the connection between internal and external elements of the stress correlation modeling module; Figure 5 This is a block diagram showing the internal and external connections of the delay tuning control module; Figure 6 This is a diagram showing the connection between the internal units of the collaborative execution module and the external process stations. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0017] The existing technology has the following technical problems: In the intelligent manufacturing process of existing electromechanical component circuit boards, the control and operation optimization system mostly adopts a single module independent working mode, lacking a collaborative structure for environmental load coordinated energy efficiency correction, solder joint stress electrical performance correlation modeling, and process parameter adaptive delay tuning. As a result, when the circuit board is running, it is impossible to achieve dynamic linkage optimization of input power, environmental parameters and solder joint stress, which easily leads to problems such as unstable signal transmission and easy solder joint failure, seriously affecting the operational reliability and service life of the circuit board.

[0018] Based on this, please refer to Figures 1-6 This embodiment provides an intelligent integrated control and operation optimization system for electromechanical component circuit boards, including a multi-parameter sensing module, an energy efficiency correction processing module, a stress correlation modeling module, a delay tuning control module, and a collaborative execution module. The energy efficiency correction processing module is equipped with an environmental load-coordinated energy efficiency correction structure. The stress correlation modeling module is equipped with a solder joint stress electrical performance correlation modeling structure. The delay tuning control module is equipped with a process parameter adaptive delay tuning structure. The multi-parameter sensing module is connected to the energy efficiency correction processing module, the energy efficiency correction processing module is connected to the stress correlation modeling module, the stress correlation modeling module is connected to the delay tuning control module, and the delay tuning control module is connected to the collaborative execution module.

[0019] This solution constructs a complete intelligent integrated control and optimization system. The multi-parameter sensing module is the foundation for data acquisition in the entire system, responsible for collecting various core parameters involved in the circuit board's operation, such as electrical performance parameters, environmental parameters, and mechanical performance parameters. All collected parameters are directly transmitted to the corresponding processing modules, providing raw data support for all subsequent calculations and control actions, without any parameter redundancy or loss. The energy efficiency correction processing module completes dynamic optimization of signal transmission energy efficiency through a built-in environmental load-coordinated energy efficiency correction structure. This structure does not rely on single parameter adjustments but combines environmental and load data transmitted by the multi-parameter sensing module to achieve coordinated correction, completing the first step of optimization processing at the electrical performance transmission level. The stress correlation modeling module completes accurate modeling of solder joint stress through a built-in solder joint stress-electrical performance correlation modeling structure. This structure combines the electrical performance optimization results with the solder joint mechanical performance parameters, breaking through the limitations of traditional mechanical stress modeling and electrical performance parameter separation, and realizing the linkage modeling of electrical and mechanical performance. The delay tuning control module dynamically adjusts the process parameter adaptation delay through a built-in process parameter adaptive delay tuning structure. This structure combines stress modeling results and energy efficiency optimization results to achieve precise tuning of delay parameters, eliminating the need for traditional control methods with fixed delay parameters and improving the overall system's response adaptability from the control logic level. The collaborative execution module receives the tuning parameters output by the delay tuning control module and directly executes the corresponding circuit board operation control actions without additional conversion or processing, ensuring direct execution of control commands. The five modules are connected sequentially in the order of multi-parameter sensing module, energy efficiency correction processing module, stress correlation modeling module, delay tuning control module, and finally collaborative execution module. Data is transmitted in an orderly manner in a unidirectional direction, without data backflow or cross-transmission, forming a complete and coherent closed-loop control system. All modules and innovative structures are essential technical features for solving the aforementioned technical problems. The absence of any module or innovative structure will prevent the overall control optimization system from operating completely, making it impossible to achieve dynamic linkage optimization of input power, environmental parameters, and solder joint stress, and also failing to solve the problems of unstable signal transmission and easy solder joint failure. The technical effects achieved by this implementation include: enabling multi-module collaborative optimization, solving the defects of a single module working independently, ensuring stable operation of the circuit board, and reducing the risk of solder joint failure.

[0020] It is worth mentioning that the parameters collected by the multi-parameter sensing module are all basic data necessary for the operation of the subsequent three creative structures, with no invalid parameter collection process. The environmental load-coordinated energy efficiency correction structure of the energy efficiency correction processing module is the core structure for realizing electrical performance energy efficiency optimization. It can synchronously combine environmental parameters and load fluctuations to complete the dynamic correction of signal transmission energy efficiency. The solder joint stress-electrical performance correlation modeling structure of the stress correlation modeling module is the core structure for realizing the linkage between solder joint stress and electrical performance. It can accurately capture the stress fluctuation state of the solder joint under changes in electrical performance. The process parameter adaptive delay tuning structure of the delay tuning control module is the core structure for realizing the dynamic adaptation of control logic. It can adjust the adaptation delay time of process parameters according to stress and energy efficiency status. The sequential connection of the five modules ensures that the data transmission path is unique and smooth. The control logic proceeds in an orderly manner according to a fixed process. The overall system has no redundant structure or invalid connection. All technical features are set around the core technical issues and have complete feasibility and sufficient disclosure.

[0021] The existing technology has the following technical problems: the existing multi-parameter sensing module does not clearly divide the acquisition units, which leads to chaotic parameter acquisition. When different types of parameters are transmitted to the corresponding processing modules, data confusion is likely to occur, affecting the accuracy of subsequent calculations.

[0022] Based on this, the multi-parameter sensing module includes a power acquisition unit, a temperature acquisition unit, a humidity acquisition unit, a load detection unit, a strain detection unit, and a modulus detection unit. The power acquisition unit is connected to the energy efficiency correction processing module, the temperature acquisition unit is connected to the energy efficiency correction processing module, the humidity acquisition unit is connected to the energy efficiency correction processing module, the load detection unit is connected to the energy efficiency correction processing module, the strain detection unit is connected to the stress correlation modeling module, and the modulus detection unit is connected to the stress correlation modeling module. This scheme divides the circuit into six independent and clearly defined acquisition units, each responsible for acquiring only a single type of parameter, eliminating the need for mixed acquisition of multiple parameters. The power acquisition unit specifically acquires the total input power of the circuit board, a core electrical performance parameter for subsequent energy efficiency correction calculations. The temperature acquisition unit specifically acquires the process ambient temperature and standard reference temperature, core environmental parameters for the environmental load-coordinated energy efficiency correction structure. The humidity acquisition unit specifically acquires the relative humidity of the process environment, which, combined with load parameters, participates in energy efficiency correction calculations. The load detection unit specifically acquires the load fluctuation factor, reflecting the load change state during circuit board operation and influencing signal transmission efficiency in conjunction with ambient humidity. The strain detection unit specifically acquires solder joint strain parameters, core mechanical performance parameters for solder joint stress modeling. The modulus detection unit specifically acquires the Young's modulus of the substrate and the standard Young's modulus of the substrate. Modulus, a parameter used to correct the influence of the substrate's own properties on the stress of the weld joint, is directly connected to the corresponding processing modules according to its parameter type. The power acquisition unit, temperature acquisition unit, humidity acquisition unit, and load detection unit are all connected to the energy efficiency correction processing module, directly transmitting the acquired electrical performance parameters and environmental parameters to it, providing complete input parameters for the environmental load-coordinated energy efficiency correction structure. The strain detection unit and modulus detection unit are both connected to the stress correlation modeling module, directly transmitting the acquired mechanical performance parameters to it, providing complete input parameters for the weld joint stress-electrical performance correlation modeling structure. The connection paths between each acquisition unit and the processing module are independent, with no parameter transmission overlap or confusion. Each acquisition unit's acquisition action is executed independently without interference, ensuring the acquisition accuracy and transmission accuracy of each type of parameter. The technical effects achieved by this implementation include: realizing parameter classification acquisition, improving data acquisition accuracy, providing accurate data support for subsequent calculations, and ensuring the system control optimization effect.

[0023] It is worth mentioning that the division of the six acquisition units perfectly matches the parameter requirements of the subsequent three innovative structures, with no redundant acquisition units or missing parameters. The acquisition parameters of the power acquisition unit, temperature acquisition unit, humidity acquisition unit, and load detection unit together constitute the complete input parameter set of the environmental load collaborative energy efficiency correction structure. The acquisition parameters of the strain detection unit and the modulus detection unit together constitute the basic input parameter set of the weld stress electrical performance correlation modeling structure. The corresponding connection method between the acquisition units and the processing modules ensures the targeted nature of parameter transmission, avoids invalid data transmission occupying system operating resources, and improves the processing efficiency of subsequent calculation modules. This allows the parameter acquisition, transmission, and calculation processes of the overall system to form an orderly connection, further ensuring the stable operation of the overall control optimization system.

[0024] The existing technology has the following technical problems: the existing energy efficiency correction processing module does not clearly divide the functional units, and the data parsing, calculation and output are integrated, resulting in low energy efficiency correction calculation efficiency, inaccurate parameter output, and affecting the accuracy of subsequent stress modeling.

[0025] Based on this, the energy efficiency correction processing module includes a data parsing unit, a correction calculation unit, and a parameter output unit. The data parsing unit is connected to the power acquisition unit, the temperature acquisition unit, the humidity acquisition unit, and the load detection unit. The correction calculation unit is connected to the data parsing unit and has a built-in environmental load collaborative energy efficiency correction structure. The parameter output unit is connected to the correction calculation unit and the stress correlation modeling module. This solution divides the system into three independent yet interconnected functional units, each responsible for a single step of the processing. The data parsing unit specifically receives raw parameters from the power acquisition unit, temperature acquisition unit, humidity acquisition unit, and load detection unit. It performs format standardization, data filtering, and outlier removal on the raw parameters, converting the chaotic raw parameters into well-formed parameters that conform to the calculation standards of the correction calculation unit. This ensures that the parameters input to the correction calculation unit are free of outliers or invalid values. The correction calculation unit, which incorporates the environmental load collaborative energy efficiency correction structure, receives the well-formed parameters from the data parsing unit and completes the signal transmission energy efficiency correction according to preset calculation logic. The calculation process is independent of manual intervention and can automatically perform dynamic corrections based on real-time parameters. The parameter output unit specifically receives the energy efficiency calculation results output by the correction calculation unit, converts the calculation results into a parameter format compatible with the stress correlation modeling module, and directly transmits them to the stress correlation modeling module. This provides accurate energy efficiency parameters for subsequent weld stress modeling. The three functional units are sequentially connected in the order of data parsing unit to correction calculation unit and then to parameter output unit. Data is transmitted in only one direction, with no data backflow or duplicate processing, realizing the division of labor and cooperation between data parsing, calculation, and output. The workflow of each functional unit is independent and clear, with no functional overlap or processing gaps. The technical effects achieved by this implementation include improving the efficiency of energy efficiency correction calculation and the accuracy of parameter output, providing accurate energy efficiency parameter support for subsequent stress modeling.

[0026] It is worth mentioning that the direct connection between the data parsing unit and the four acquisition units allows for the simultaneous reception of multiple types of raw parameters and the completion of parallel parsing processing, significantly improving parameter preprocessing efficiency. The environmental load collaborative energy efficiency correction structure built into the correction calculation unit is the core of the entire energy efficiency correction processing module. It can simultaneously combine temperature deviation, humidity parameters, and load fluctuation factors to complete multi-dimensional collaborative correction, breaking through the limitations of traditional single parameter correction. The direct connection between the parameter output unit and the stress correlation modeling module ensures lossless transmission of energy efficiency calculation results, allowing energy efficiency optimization results to directly participate in subsequent weld stress modeling, achieving seamless integration of electrical performance optimization and mechanical performance modeling, and further enhancing the overall system's linkage optimization capability.

[0027] The existing technology has the following technical problems: the existing stress correlation modeling module does not clearly divide functional units, and the modeling calculation and stress calibration are integrated, resulting in low accuracy of weld stress modeling, inability to accurately output stress parameters, and affecting the accuracy of subsequent delay tuning.

[0028] Based on this, the stress correlation modeling module includes a modeling calculation unit, a stress calibration unit, and a stress output unit. The modeling calculation unit is connected to the parameter output unit, the strain detection unit, and the modulus detection unit. The modeling calculation unit has a built-in weld stress electrical performance correlation modeling structure. The stress calibration unit is connected to the modeling calculation unit, the stress output unit is connected to the modeling calculation unit, and the stress output unit is connected to the delay tuning control module. This scheme divides the system into three clearly defined and mutually cooperating functional units, each undertaking a dedicated processing task. The modeling calculation unit has a built-in weld stress electrical performance correlation modeling structure and simultaneously receives energy efficiency parameters transmitted from the parameter output unit, weld strain parameters transmitted from the strain detection unit, and substrate Young's modulus parameters transmitted from the modulus detection unit. After combining these three types of parameters, it completes the linkage modeling calculation of the weld dynamic stress. This calculation process deeply integrates electrical performance energy efficiency parameters and mechanical performance parameters, eliminating the need for separate calculation of mechanical stress. The stress calibration unit specifically provides the modeling calculation unit with the rated allowable stress parameter of the weld, which is the weld stress. The baseline reference value for modeling ensures that the calculation results of the modeling calculation unit have practical reference significance, avoiding deviations of stress calculation results from actual working conditions. The stress output unit specifically receives the weld joint dynamic equivalent stress parameters output by the modeling calculation unit, converts the parameters into a format suitable for the delay tuning control module, and directly transmits them to the delay tuning control module. This provides accurate stress data for subsequent process parameter delay tuning. The three functional units work in a coordinated manner, from the modeling calculation unit to the stress calibration unit, and then to the stress output unit. Data transmission is orderly and accurate, achieving a division of labor and cooperation between modeling calculation, stress calibration, and parameter output, without any missing functions or calculation deviations. The technical effects achieved by this implementation include improving the accuracy of weld joint stress modeling, accurately outputting stress parameters, and providing reliable support for subsequent delay tuning.

[0029] It is worth mentioning that the modeling and calculation unit is connected to the parameter output unit, the strain detection unit, and the modulus detection unit, which can simultaneously acquire multi-dimensional parameters, providing complete data support for the stress-electrical performance correlation modeling structure of the weld joint. This allows the modeling process to simultaneously consider the influence of changes in electrical performance and changes in the mechanical properties of the substrate. The rated allowable stress parameters of the weld joint provided by the stress calibration unit are key to ensuring that the stress modeling results conform to the actual application scenario, avoiding discrepancies between the modeling results and the actual weld joint load-bearing capacity. The direct connection between the stress output unit and the delay tuning control module allows the weld joint stress parameters to directly participate in the subsequent control logic tuning, achieving seamless integration of mechanical performance modeling and control logic adjustment, and further improving the overall system's control adaptation accuracy.

[0030] The existing technology suffers from the following technical problems: the current energy efficiency correction calculation lacks a clear core formula, the energy efficiency correction logic is unclear, and it cannot accurately calculate the effective transmission power of the circuit board, thus affecting the energy efficiency optimization effect. Therefore, the correction calculation unit stores a dynamic signal transmission energy efficiency optimization formula, which is: ; The For the circuit board to effectively transmit power, the The total power input for the circuit board operation, the Based on the energy efficiency coefficient, the The temperature sensitivity coefficient, the The process environment temperature, the For the standard reference temperature, the The humidity sensitivity coefficient, the The relative humidity of the process environment, the This refers to the load fluctuation factor. This formula is the core calculation basis for the operation of the environmental load-coordinated energy efficiency correction structure. All parameters are provided by the corresponding acquisition units of the multi-parameter sensing module. The parameter sources are clear and can be acquired in real time. The formula as a whole follows the power electronics energy efficiency transmission theory design, combining the influence of three factors—ambient temperature, ambient humidity, and load fluctuation—on the circuit board signal transmission energy efficiency to construct a multi-dimensional coordinated correction calculation logic. This differs from the traditional calculation method of single temperature or single humidity correction, demonstrating outstanding creativity. The formula states... and stated The units of all are watts. It is a dimensionless parameter representing the inherent signal transmission efficiency ratio of the circuit board under standard conditions. The dimension of is per Kelvin, and it is a fixed coefficient reflecting the degree of influence of temperature changes on energy efficiency. and stated Both are in the dimension of Kelvin, and the difference between them represents the deviation of the process environment temperature from the standard reference temperature. It is a dimensionless parameter, a fixed coefficient reflecting the degree of influence of humidity changes on energy efficiency. It is a dimensionless parameter representing the actual percentage of humidity in the process environment. It is a dimensionless parameter that reflects the real-time fluctuation of the load during circuit board operation. The logical derivation of the formula is based on energy efficiency transmission under standard conditions, firstly through the aforementioned... With the The product of these factors yields the basic effective transmission power of the circuit board under standard conditions. This value is an ideal energy efficiency value that does not consider the effects of environment and load. Subsequently, a temperature deviation correction term is introduced, and the power is calculated using the aforementioned... With the and stated The product of the differences is used to calculate the energy efficiency degradation caused by temperature deviation from the standard value. This degradation value is subtracted from the basic effective transmission power to complete the energy efficiency correction in the temperature dimension. Then, a humidity and load co-correction term is introduced. The above and stated The product of these three factors calculates the energy efficiency degradation caused by the combined effects of humidity and load fluctuations. This degradation value is then subtracted from the basic effective transmission power to obtain the actual effective transmission power of the circuit board, reflecting real-world operating conditions. The dimensions on both sides of the equation are completely consistent, all addition and subtraction terms are matched, and the dimensional combinations of multiplication and division operations conform to the physical laws of power electronic energy efficiency transmission. There are no dimensional conflicts or unreasonable combinations of operations. The calculation logic of the formula can be directly implemented through the hardware circuitry of the correction unit without additional auxiliary calculation equipment. After parameter substitution, accurate effective transmission power values ​​can be directly output, providing stable and accurate electrical performance parameters for subsequent stress modeling. Simultaneously, the operational logic of the environmental load-coordinated energy efficiency correction structure is fully implementable, ensuring that the overall system's energy efficiency optimization process is fully disclosed and feasible. The technical effects achieved by this implementation include: clarifying the energy efficiency correction calculation logic, accurately calculating the effective transmission power, improving energy efficiency optimization effects, and providing accurate parameters for subsequent stress modeling.

[0031] The existing technology has the following technical problems: the existing weld stress coupling calculation does not have clear formula parameters, the calculation logic is unclear, and it is impossible to accurately calculate the dynamic equivalent stress of the weld by combining energy efficiency parameters, which affects the accuracy of stress modeling.

[0032] Based on this, the modeling and calculation unit stores calculation formulas, which are used to combine the calculation results of the dynamic signal transmission energy efficiency optimization formula to complete the dynamic stress coupling calculation of the weld joint. The calculation formulas are as follows: ; The For the dynamic equivalent stress of the solder joint, the The rated allowable stress of the solder joint, the The strain parameters of the weld joint, the The Young's modulus of the substrate, the The standard Young's modulus of the substrate, the The load stress coupling coefficient, the For load fluctuation factor, the For the circuit board to effectively transmit power, the This formula provides the total power input for the circuit board's operation. It is the core calculation basis for the solder joint stress-electrical performance correlation modeling structure, following the mechanical stress-strain coupling theory and integrating the characteristics of power electronic energy transmission. It combines solder joint mechanical stress with the circuit board's electrical performance efficiency parameters, breaking through the limitations of traditional solder joint stress calculations that only consider mechanical parameters, demonstrating unique creativity. The formula states... and stated The dimensions of all are Pascals. It is a dimensionless parameter that reflects the ratio of the deformation of the weld joint after being subjected to force to its original size. and stated Both are in Pascals, and their ratio represents the extent to which the Young's modulus of the circuit board substrate deviates from the standard value. This ratio is a core parameter for correcting the influence of substrate properties on solder joint stress. It is a dimensionless parameter that reflects the degree of influence of load fluctuations on the stress of the weld joint. It is a dimensionless parameter, the stated and stated Both are in the dimension of watts, and the difference between them is related to the stated... The ratio represents the energy efficiency loss rate during circuit board operation. The logical derivation of the formula starts with the basic mechanical stress of the solder joints, first through the aforementioned... The above and stated With the The product of the ratios is used to calculate the basic stress of the weld joint considering only mechanical parameters. This value is a traditional stress calculation result that does not incorporate electrical performance parameters. With the The ratio can correct stress deviations caused by changes in substrate performance in real time, making the basic stress calculation more consistent with the actual substrate condition. Subsequently, a synergistic correction term for load fluctuation and energy efficiency loss rate is introduced. The above The product of the energy efficiency loss rate, the electrical performance energy efficiency loss, and the load fluctuation is used to calculate the increase in solder joint stress caused by the combined effect of load fluctuation. The core logic of this correction term is that the higher the circuit board energy efficiency loss, the more significant the thermal effect generated by the current operation, and the greater the thermal stress generated by the solder joint. At the same time, the greater the load fluctuation, the greater the mechanical stress borne by the solder joint. Combining this stress increase with the base stress, the dynamic equivalent stress of the solder joint after dynamic coupling is finally obtained. The dimensions on both sides of the equation are completely consistent, and the combination of the dimensions of all calculation terms conforms to the physical laws of the intersection of mechanics and power electronics. There are no dimensional contradictions or unreasonable calculations. The calculation logic of the formula can be directly implemented through the hardware circuit of the modeling calculation unit. All parameters come from the previous acquisition or calculation results, without the need for additional parameter acquisition links. It can accurately output solder joint stress values ​​that fit the actual working conditions, providing reliable mechanical performance parameters for subsequent process parameter delay tuning. At the same time, it makes the operation logic of the solder joint stress electrical performance correlation modeling structure complete and implementable, ensuring that the stress modeling link of the overall system is fully disclosed and has practical application value.

[0033] The technical effects achieved by this implementation include clarifying the stress coupling calculation logic of the solder joint, accurately calculating the dynamic equivalent stress of the solder joint, improving the accuracy of stress modeling, and providing reliable support for subsequent delay tuning.

[0034] The existing technology has the following technical problems: the existing process parameter adaptation delay calculation does not have clear formula parameters, the calculation logic is unclear, and it is impossible to accurately calculate the optimal adaptation delay time by combining stress parameters and energy efficiency parameters, which affects the real-time control.

[0035] Based on this, the delay tuning control module stores a calculation formula, which is used to combine the calculation results of the modeling calculation unit to complete the optimal adaptation delay calculation of process parameters. The calculation formula is as follows: ; The To achieve the optimal adaptation delay time, the Based on the adaptation delay time, the The stress delay coupling coefficient, the For the dynamic equivalent stress of the solder joint, the The energy efficiency delay coupling coefficient is the coefficient described above. For the circuit board to effectively transmit power, the The rated allowable stress of the solder joint is given. This formula is the core calculation basis for the operation of the adaptive delay tuning structure of process parameters. It follows the design of industrial control adaptive prediction algorithm, and combines the influence of two types of parameters—solder joint mechanical stress and circuit board electrical performance efficiency—on the control delay to construct a dual-parameter collaborative tuning calculation logic. This is different from the traditional control method with fixed delay parameters and has significant innovation. The formula states... and stated The units are all seconds, representing the delay time for adjusting process parameters. The dimension is per Pascal, reflecting the degree of influence of solder joint stress variation on fit delay. and stated Both are in the dimension of Pascal, and the ratio of the two represents the ratio of the actual stress of the weld joint to the rated allowable stress. The unit is per watt, reflecting the degree of impact of changes in circuit board energy efficiency on adaptation delay. The unit of measurement is watts, representing the real-time effective power transmitted by the circuit board. The logical derivation of the formula is based on a fixed base delay, firstly through the aforementioned... The basic adaptation delay time, which does not consider the effects of stress and energy efficiency, is determined. This value is a fixed delay parameter used in traditional control methods. Subsequently, a weld joint stress correction term is introduced. With the The product of these factors is used to calculate the adjustment range of the solder joint stress on the adaptation delay. The core logic of this correction term is that the greater the actual stress of the solder joint, the higher the risk of solder joint failure. Therefore, it is necessary to shorten the delay time for process parameter adjustment, quickly execute control actions to reduce solder joint stress, subtract this adjustment value from the basic delay time, complete the delay tuning in the stress dimension, and then introduce a coordinated correction term for energy efficiency and stress. The above and stated With the The product of the ratios of the three factors is used to calculate the delay adjustment caused by the combined effect of electrical performance efficiency and solder joint stress. The core logic of this correction term is that the lower the effective transmission power of the circuit board and the higher the proportion of solder joint stress, the higher the real-time requirement of the system control. Therefore, it is necessary to further shorten the adaptation delay time. This adjustment value is then subtracted from the basic delay time to obtain the optimal adaptation delay time that fits the actual operating conditions. The dimensions on both sides of the equation are completely consistent, and the combination of dimensions of all operational terms conforms to the physical laws of industrial control. There are no dimensional conflicts or unreasonable operational logic. The operational logic of the formula can be directly implemented through the hardware circuit of the delay tuning control module. All parameters come from the results of previous stress modeling and energy efficiency calculations, eliminating the need for additional data acquisition or processing. It can accurately output the optimal delay time that fits the real-time operating conditions, providing precise instruction basis for the control actions of the collaborative execution module. Simultaneously, it ensures that the operating logic of the process parameter adaptive delay tuning structure is complete and implementable, guaranteeing that the overall system's control tuning process is fully disclosed and can operate stably. The technical effects achieved by this implementation include clarifying the delay tuning operation logic, accurately calculating the optimal adaptation delay time, improving the real-time performance of process parameter adjustments, and ensuring stable operation of the circuit board.

[0036] The existing technology has the following technical problems: the existing delay tuning control module does not clearly divide the functional units, and the delay calculation, tuning generation and output are integrated, resulting in low delay tuning efficiency, inaccurate tuning parameter output, and affecting the control effect of the collaborative execution module.

[0037] Based on this, the delay tuning control module includes a delay calculation unit, a tuning generation unit, and a tuning output unit. The delay calculation unit is connected to the stress output unit. The delay calculation unit has a built-in adaptive delay tuning structure for process parameters and stores the calculation formula. The tuning generation unit is connected to the delay calculation unit, and the tuning output unit is connected to the tuning generation unit. The tuning output unit is connected to the collaborative execution module. This solution divides the process into three functionally independent but closely connected units, each responsible for a specific step in the delay tuning process. The delay calculation unit has a built-in adaptive delay tuning structure for process parameters and stores the calculation formula for the optimal adaptation delay of process parameters. It receives the dynamic equivalent stress parameters of the solder joints transmitted by the stress output unit and the effective power transmission parameters of the circuit board obtained from previous calculations. It performs accurate calculation of the optimal adaptation delay time according to the formula logic. This calculation process can be automatically adjusted according to real-time parameters without manual setting or intervention. The tuning generation unit receives the optimal adaptation delay time output by the delay calculation unit and generates the optimal adaptation delay time based on the actual operating conditions of the circuit board. The process parameter tuning command, corresponding to the adaptive delay duration, contains all the parameters required for the collaborative execution module to perform control actions, requiring no additional supplementation or conversion. The tuning output unit specifically receives the tuning command output by the tuning generation unit, converts it into a signal format compatible with the collaborative execution module, and directly transmits it to the collaborative execution module, ensuring lossless and delay-free transmission of control commands. The three functional units operate sequentially from the delay calculation unit to the tuning generation unit, and then to the tuning output unit. Data transmission is unidirectional and orderly, achieving division of labor and cooperation between delay calculation, tuning generation, and output, without functional overlap or missing processing, significantly improving the overall efficiency of delay tuning. The technical effects achieved by this implementation include improving delay tuning efficiency and tuning parameter output accuracy, providing precise control parameters for the collaborative execution module, and ensuring control optimization effects. It is worth mentioning that the process parameter adaptive delay tuning structure built into the delay calculation unit is the core of the entire delay tuning control module. It can combine stress parameters and energy efficiency parameters to complete dynamic delay calculations, so that the tuning results fit the real-time operating conditions. The tuning generation unit can generate differentiated tuning instructions based on different delay calculation results, adapting to various operating condition changes during the circuit board operation. The direct connection between the tuning output unit and the collaborative execution module ensures that the tuning instructions are transmitted quickly and accurately, allowing the delay tuning results to be directly converted into actual control actions, realizing seamless connection between control logic tuning and execution, and further improving the overall system's control response speed and optimization effect.

[0038] The existing technology has the following technical problems: the existing collaborative execution module does not clearly divide the execution units, and various control actions are executed in an integrated manner, resulting in low control accuracy, making it impossible to adjust the circuit board process parameters in a targeted manner, and affecting the control optimization effect.

[0039] Based on this, the collaborative execution module includes a temperature control execution unit, a pressure execution unit, and a power supply regulation unit. The temperature control execution unit is connected to the setting output unit, the pressure execution unit is connected to the setting output unit, and the power supply regulation unit is connected to the setting output unit. This solution divides the circuit board manufacturing process into three independent and clearly defined execution units. Each execution unit is responsible for controlling a single core dimension of the process. The temperature control execution unit specifically regulates the ambient temperature during the circuit board manufacturing process. Based on the tuning instructions transmitted by the tuning output unit, it adjusts the ambient temperature to meet the requirements of signal transmission energy efficiency optimization. The pressure execution unit specifically regulates the assembly pressure of the circuit board components. Based on the tuning instructions, it adjusts the assembly pressure to reduce stress fluctuations at solder joints caused by abnormal pressure. The power supply regulation unit specifically regulates the input power of the circuit board operation. Based on the tuning instructions, it adjusts the input power to match the optimized power transmission requirements of the circuit board. All three execution units are directly connected to the tuning output unit, allowing them to receive tuning instructions synchronously and execute corresponding control actions independently. There is no confusion or conflict in control actions. The control actions of each execution unit are specifically designed for the core parameters required by the previous calculations and tuning, eliminating invalid control or unnecessary adjustments. The technical effects achieved by this implementation include improved control accuracy, targeted adjustment of process parameters, stable operation of the circuit board, and optimized control performance. It is worth mentioning that the division of the three execution units perfectly matches the core control dimensions in the intelligent manufacturing process of circuit boards, corresponding to the three key parameters of environment, mechanical and electrical performance. The adjustment action of the temperature control execution unit adapts to the optimization requirements of the environmental load collaborative energy efficiency correction structure, the adjustment action of the pressure execution unit adapts to the optimization requirements of the solder joint stress electrical performance correlation modeling structure, and the adjustment action of the power supply adjustment unit adapts to the dual requirements of energy efficiency optimization and stress control. The three execution units work synchronously and do not interfere with each other, which can realize comprehensive collaborative control of the circuit board operation, so that all the calculation and tuning results in the early stage are finally transformed into actual effective control actions, further ensuring the control optimization effect of the overall system and fitting the actual application scenario of intelligent manufacturing of electromechanical component circuit boards.

[0040] The existing technology has the following technical problems: the hardware implementation of each module of the existing system is unclear, and the connection method between the module and the external workstation is unclear, which makes the system deployment difficult, the data transmission unstable, and affects the overall reliability of the system operation.

[0041] Based on this, the multi-parameter sensing module, the energy efficiency correction processing module, the stress correlation modeling module, the delay tuning control module, and the collaborative execution module are all built using embedded hardware units. The multi-parameter sensing module is connected to the detection port of the external circuit board process station, the collaborative execution module is connected to the execution port of the external circuit board process station, and the delay tuning control module and the collaborative execution module transmit data via wired data transmission. This solution clearly defines the hardware implementation of all core modules of the overall system, all of which are built using embedded hardware units. Embedded hardware units are characterized by their small size, low power consumption, stable operation, and strong anti-interference capabilities. They can adapt to the deployment requirements of limited space and complex working conditions in circuit board manufacturing processes, eliminating the need for additional large hardware equipment and reducing the difficulty and cost of system deployment. The multi-parameter sensing module is directly connected to the detection port of the external circuit board manufacturing process station, and can obtain the raw parameters of the process station in real time through the detection port, eliminating the need for additional data acquisition and relay equipment, ensuring the accuracy and real-time nature of parameter acquisition. The collaborative execution module is directly connected to the execution port of the external circuit board manufacturing process station, and can directly apply control actions to the process station through the execution port, eliminating the need for additional execution relay equipment, ensuring the direct execution of control actions. The delay tuning control module and the collaborative execution module use wired data transmission to transmit data. Wired data transmission avoids the problem of electromagnetic interference that wireless transmission is susceptible to, ensuring stable transmission of tuning parameters and control commands without packet loss, further guaranteeing the stability of the overall system's closed-loop control. The technical effects achieved by this implementation include reducing system deployment difficulty, ensuring stable data transmission, improving overall system reliability, and adapting to actual intelligent manufacturing scenarios. Notably, all modules are built using unified embedded hardware units, enabling hardware compatibility and collaborative operation between modules without hardware compatibility conflicts. The connections between the multi-parameter sensing module and the external detection port, and between the collaborative execution module and the external execution port, all adopt standardized interface forms, adaptable to various types of circuit board manufacturing stations, improving system versatility. The application of wired data transmission allows the overall system to operate stably even under complex electromagnetic interference conditions in intelligent manufacturing, further ensuring the smooth progress of the entire process of parameter acquisition, calculation, tuning, and execution, giving the overall system complete deployability and practical application value.

[0042] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments that can be applied to other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A smart integrated control and operation optimization system for electromechanical component circuit boards, characterized in that, The system includes a multi-parameter sensing module, an energy efficiency correction processing module, a stress correlation modeling module, a delay tuning control module, and a collaborative execution module. The energy efficiency correction processing module is equipped with an environmental load-coordinated energy efficiency correction structure. The stress correlation modeling module is equipped with a weld joint stress electrical performance correlation modeling structure. The delay tuning control module is equipped with a process parameter adaptive delay tuning structure. The multi-parameter sensing module is connected to the energy efficiency correction processing module, the energy efficiency correction processing module is connected to the stress correlation modeling module, the stress correlation modeling module is connected to the delay tuning control module, and the delay tuning control module is connected to the collaborative execution module.

2. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 1, characterized in that, The multi-parameter sensing module includes a power acquisition unit, a temperature acquisition unit, a humidity acquisition unit, a load detection unit, a strain detection unit, and a modulus detection unit. The power acquisition unit is connected to the energy efficiency correction processing module, the temperature acquisition unit is connected to the energy efficiency correction processing module, the humidity acquisition unit is connected to the energy efficiency correction processing module, the load detection unit is connected to the energy efficiency correction processing module, the strain detection unit is connected to the stress correlation modeling module, and the modulus detection unit is connected to the stress correlation modeling module.

3. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 2, characterized in that, The energy efficiency correction processing module includes a data parsing unit, a correction calculation unit, and a parameter output unit. The data parsing unit is connected to the power acquisition unit, the temperature acquisition unit, the humidity acquisition unit, and the load detection unit. The correction calculation unit is connected to the data parsing unit and has a built-in environmental load-coordinated energy efficiency correction structure. The parameter output unit is connected to the correction calculation unit and the stress correlation modeling module.

4. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 3, characterized in that, The stress correlation modeling module includes a modeling calculation unit, a stress calibration unit, and a stress output unit. The modeling calculation unit is connected to the parameter output unit, the strain detection unit, and the modulus detection unit. The modeling calculation unit has a built-in weld joint stress electrical performance correlation modeling structure. The stress calibration unit is connected to the modeling calculation unit, the stress output unit is connected to the modeling calculation unit, and the stress output unit is connected to the delay tuning control module.

5. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 4, characterized in that, The correction calculation unit stores a dynamic signal transmission energy efficiency optimization formula, which is: ； in, For the circuit board to effectively transmit power, Input total power to the circuit board. Based on the basic energy efficiency coefficient, For temperature sensitivity coefficient, For the process environment temperature, For standard reference temperature, Humidity sensitivity coefficient The relative humidity of the process environment, This is the load fluctuation factor.

6. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 5, characterized in that, The modeling and calculation unit stores calculation formulas, which are used to combine the calculation results of the dynamic signal transmission energy efficiency optimization formula to complete the dynamic stress coupling calculation of the solder joint. The parameters of the calculation formula include the dynamic equivalent stress of the solder joint, the rated allowable stress of the solder joint, the strain parameter of the solder joint, the Young's modulus of the substrate, the standard Young's modulus of the substrate, and the load stress coupling coefficient.

7. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 6, characterized in that, The delay tuning control module stores a calculation formula, which is used to combine the calculation results of the modeling calculation unit to complete the optimal adaptation delay calculation of process parameters. The parameters of the calculation formula include the optimal adaptation delay time, the basic adaptation delay time, the stress delay coupling coefficient, the energy efficiency delay coupling coefficient, the dynamic equivalent stress of the solder joint, and the effective transmission power of the circuit board.

8. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 7, characterized in that, The delay tuning control module includes a delay calculation unit, a tuning generation unit, and a tuning output unit. The delay calculation unit is connected to the stress output unit. The delay calculation unit has the process parameter adaptive delay tuning structure built in it. The delay calculation unit stores the calculation formula. The tuning generation unit is connected to the delay calculation unit. The tuning output unit is connected to the tuning generation unit. The tuning output unit is connected to the collaborative execution module.

9. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 8, characterized in that, The collaborative execution module includes a temperature control execution unit, a pressure execution unit, and a power supply regulation unit. The temperature control execution unit is connected to the setting output unit, the pressure execution unit is connected to the setting output unit, and the power supply regulation unit is connected to the setting output unit.

10. The intelligent integrated control and operation optimization system for electromechanical component circuit boards according to claim 9, characterized in that, The multi-parameter sensing module, the energy efficiency correction processing module, the stress correlation modeling module, the delay tuning control module, and the collaborative execution module are all built using embedded hardware units. The multi-parameter sensing module is connected to the detection port of the external circuit board process station, the collaborative execution module is connected to the execution port of the external circuit board process station, and the delay tuning control module and the collaborative execution module transmit data via wired data transmission.

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