Sensor panel, sensing device, and electronic device

Abstract

A sensing device, a sensor panel, and an electronic device are disclosed. The sensor panel includes a plurality of sensors arranged in a matrix form in a sensing area, and a plurality of sensing lines electrically connected one-to-one to the plurality of sensors. The sensing area includes a first area, a second area, and a third area between the first area and the second area. The plurality of sensing lines includes a 1-1 sensing line, a 1-2 sensing line, a 2-1 sensing line, and a 2-2 sensing line. A first sensor driver is electrically connected to sensors among the plurality of sensors in the first area through the 1-1 sensing line. A second sensor driver is electrically connected to sensors among the plurality of sensors in the second area through the 2-1 sensing line. The first sensor driver is electrically connected to a first subset of sensors among the plurality of sensors in the third area through the 1-2 sensing line. The second sensor driver is electrically connected to a second subset of sensors among the plurality of sensors in the third area through the 2-2 sensing line.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0178551, filed on December 4, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of this disclosure relate to sensor panels, sensing devices, and electronic devices. Background Technology

[0004] Display devices present images to users, and as the amount of information displayed increases, the demand for improved display devices is increasing in various ways. Furthermore, research and development of display devices, including those with touch sensors, are underway to improve user convenience and expand application areas. Summary of the Invention

[0005] This disclosure provides sensor panels, sensing devices, and electronic devices with improved touch performance.

[0006] According to embodiments of this disclosure, a sensing device includes: a sensor panel including a plurality of sensors arranged in a matrix in a sensing region and a plurality of sensing lines electrically connected one-to-one to the plurality of sensors, wherein the sensing region includes a first region, a second region, and a third region between the first and second regions, and wherein the plurality of sensing lines include a first-1 sensing line, a first-2 sensing line, a second-1 sensing line, and a second-2 sensing line; a first sensor driver electrically connected to a sensor in the first region of the plurality of sensors via the first-1 sensing line; and a second sensor driver electrically connected to a sensor in the second region of the plurality of sensors via the second-1 sensing line. The first sensor driver is electrically connected to a first subset of the sensors in the third region of the plurality of sensors via the first-2 sensing line. The second sensor driver is electrically connected to a second subset of the sensors in the third region of the plurality of sensors via the second-2 sensing line.

[0007] The first sensor driver can be electrically disconnected from the sensor in the second region, and the second sensor driver can be electrically disconnected from the sensor in the first region.

[0008] The first region and the second region may be spaced apart from each other in the first direction, and the third region may include at least one sensor column, wherein the sensor column of the at least one sensor column may include sensors arranged along a second direction intersecting the first direction.

[0009] The third area may include two sensor columns.

[0010] The third area may include a sensor array.

[0011] The sensing device may further include: a first multiplexer electrically connected between a sensor and a first sensor driver in a first region; and a second multiplexer electrically connected between a sensor and a second sensor driver in a second region. The first multiplexer and the second multiplexer may be electrically connected to a first subset and a second subset of the sensors in a third region, respectively.

[0012] The first multiplexer can be electrically connected to the first sensor driver via multiple pads. The first multiplexer can selectively connect a first subset of the sensors in the third region to the pads among the multiple pads, and the sensors in the first region can be not electrically connected to the pads.

[0013] The first multiplexer may include: a first transistor electrically connected between a sensing line and a first drive line among a plurality of sensing lines; a second transistor electrically connected between a sensing line and a connection line; a third transistor electrically connected between a connection line and a pad among a plurality of pads; and a fourth transistor electrically connected between the connection line and the second drive line.

[0014] The pads can be provided with a target pulse signal, the first drive line can be provided with a first drive signal having an opposite phase to the target pulse signal, and the second drive line can be provided with a second drive signal having the same phase as the target pulse signal.

[0015] The first sensor driver and the second sensor driver can obtain one sensing signal for each of the sensors in the first region and the second region, and obtain two sensing signals for each of the sensors in the third region.

[0016] The first sensor driver and the second sensor driver can sense touch input based on sensing signals received from the sensor in the first area and the sensor in the second area, and the first sensor driver and the second sensor driver can adjust touch sensitivity based on sensing signals obtained from the sensor in the third area.

[0017] The first region and the second region may be spaced apart from each other in a first direction. Each of the first sensor driver and the second sensor driver may sequentially acquire sensing signals from multiple sensors along the first direction. The time points at which the first sensor driver acquires the sensing signal for the sensor in the third region and the time points at which the second sensor driver acquires the sensing signal for the sensor in the third region may be different from each other and do not overlap.

[0018] According to embodiments of this disclosure, a sensor panel includes: a sensing area including a first area, a second area, and a third area between the first and second areas; a plurality of sensors arranged in a matrix within the sensing area; a plurality of sensing lines electrically connected one-to-one to the plurality of sensors, wherein the plurality of sensing lines include a first-1 sensing line, a first-2 sensing line, a second-1 sensing line, and a second-2 sensing line; a first multiplexer electrically connected via the first-1 sensing line to a sensor in the first area among the plurality of sensors; and a second multiplexer electrically connected via the second-1 sensing line to a sensor in the second area among the plurality of sensors.

[0019] The first multiplexer can be electrically disconnected from the sensor in the second region, and the second multiplexer can be electrically disconnected from the sensor in the first region.

[0020] The first region and the second region may be spaced apart from each other in the first direction, and the third region may include at least one sensor column, wherein the sensor column of the at least one sensor column may include sensors arranged along a second direction intersecting the first direction.

[0021] The third area may include two sensor columns.

[0022] The third area may include a sensor array.

[0023] The first multiplexer can be electrically connected to multiple pads. The first multiplexer can selectively connect the sensor in the third region to the pad among the multiple pads, and the sensor in the first region can be not electrically connected to the pad.

[0024] The first multiplexer may include: a first transistor electrically connected between a sensing line and a first drive line among a plurality of sensing lines; a second transistor electrically connected between a sensing line and a connection line; a third transistor electrically connected between a connection line and a pad among a plurality of pads; and a fourth transistor electrically connected between the connection line and the second drive line.

[0025] According to embodiments of this disclosure, an electronic device includes: one or more processors configured to provide input image data; a display device configured to display an image based on the input image data; and a power supply configured to supply power to the display device. The display device includes: a display unit including a substrate layer and light-emitting elements disposed on the substrate layer; a sensing unit including a plurality of sensors and a plurality of sensing lines, wherein the plurality of sensors are disposed on the display unit and arranged in a matrix in a sensing region, the plurality of sensing lines are electrically connected one-to-one to the plurality of sensors, the sensing region includes a first region, a second region, and a third region between the first and second regions, and the plurality of sensing lines include a first-1 sensing line, a first-2 sensing line, a second-1 sensing line, and a second-2 sensing line; a first sensor driver electrically connected via the first-1 sensing line to a sensor in the first region among the plurality of sensors; and a second sensor driver electrically connected via the second-1 sensing line to a sensor in the second region among the plurality of sensors. The first sensor driver is electrically connected via the first-2 sensing line to a first subset of the sensors in the third region among the plurality of sensors. The second sensor driver is electrically connected via the second-2 sensing line to a second subset of the sensors in the third region among a plurality of sensors.

[0026] According to embodiments of this disclosure, in a sensor panel, sensing device, and electronic device, a first sensor driver and a second sensor driver (or a first multiplexer and a second multiplexer) can share a sensor (or sensing electrode) in a third region (or boundary region) between a first region and a second region. Therefore, the touch sensitivity of the first sensor driver and the second sensor driver can be objectively adjusted based on the sensing values ​​obtained in the third region, and touch performance for the third region can be improved.

[0027] The effects of the embodiments disclosed herein are not limited to the descriptions or illustrations above, and further various effects and features of this disclosure will be described in detail below. Attached Figure Description

[0028] Figure 1 This is a schematic diagram illustrating a display device according to an embodiment.

[0029] Figure 2 It is shown that it includes Figure 1 A schematic plan view of an embodiment of a display unit in a display device.

[0030] Figure 3 It is shown that it includes Figure 1 A schematic plan view of an embodiment of a sensing unit in a display device.

[0031] Figure 4 It is shown Figure 1A schematic cross-sectional view of the display device.

[0032] Figure 5 and Figure 6 This is a schematic plan view illustrating a sensing device according to an embodiment.

[0033] Figure 7 and Figure 8 It is used to describe by Figure 5 A schematic diagram of a sensing device sensing touch input.

[0034] Figure 9 It is shown Figure 5 and Figure 6 A schematic plan view of an embodiment of the sensing device.

[0035] Figure 10 It is shown that it includes Figure 9 A schematic circuit diagram of an embodiment of a sub-multiplexer in a sensing device.

[0036] Figure 11 This is a plan view showing the operation of the sensing device.

[0037] Figure 12 It shows that it is applied to Figure 11 A waveform diagram of the signal from the sensing electrode in an embodiment.

[0038] Figure 13 This is a schematic plan view showing a sensing device according to a comparative example.

[0039] Figure 14 It is shown by Figure 13 The sensing signal acquired by the sensing device and from Figure 5 A diagram illustrating an embodiment of a sensing device acquiring a sensing signal.

[0040] Figure 15 It is shown by Figure 5 A waveform diagram of an embodiment of the sensing signal acquired by the sensing device.

[0041] Figure 16 This is a schematic plan view illustrating a sensing device according to an embodiment.

[0042] Figure 17 This is a schematic block diagram illustrating an electronic device according to an embodiment.

[0043] Figure 18 It is shown that Figure 17 A schematic diagram illustrating an example of an electronic device implemented as a smartphone.

[0044] Figure 19 It is shown that Figure 17 A schematic diagram illustrating an example of an electronic device implemented as a tablet PC.

[0045] Figure 20 It is shown that Figure 17 A schematic diagram illustrating an example of an electronic device implemented as a smartwatch.

[0046] Figure 21 It is shown that Figure 17 A schematic diagram illustrating an example of an electronic device implemented as an automotive display system. Detailed Implementation

[0047] This disclosure can be modified in various ways and has many forms, and embodiments will be shown and described in detail below. However, this is not intended to limit this disclosure to any particular disclosed form, and it should be understood to include all modifications, equivalents, and substitutions falling within the spirit and scope of this disclosure.

[0048] Terms such as "first" and "second" are used only to describe various elements and should not be construed as limiting these elements. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form.

[0049] As used in this article, unless the context otherwise indicates, the word “or” means logical “or”, such that the expression “A, B or C” means “A and B and C”, “A and B but not C”, “A and C but not B”, “B and C but not A”, “A but not B and not C”, “B but not A and not C”, and “C but not A and not B”.

[0050] The accompanying drawings depict some embodiments related to functional blocks, units, or modules. Those skilled in the art will understand that these blocks, units, or modules are physically implemented by logic circuitry, discrete components, microprocessors, hardwired circuitry, memory elements, wiring connections, or other electronic circuitry. These can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Where blocks, units, or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software to perform the various functions discussed herein, and may optionally be driven by firmware or software. It is also contemplated that each block, unit, or module can be implemented by dedicated hardware, or as a combination of dedicated hardware performing some functions and processors performing other functions (e.g., one or more programmed microprocessors and associated circuitry). Furthermore, without departing from the inventive concept, each block, unit, or module of some embodiments can be physically separated into two or more interacting and discrete blocks, units, or modules. Moreover, without departing from the inventive concept, blocks, units, or modules of some embodiments can be physically combined into more complex blocks, units, or modules.

[0051] In this disclosure, it should be understood that the terms "comprising," "including," "having," and "configured" indicate the presence of the features, quantities, steps, operations, elements, components, or combinations thereof described in this specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, elements, components, or combinations thereof. Furthermore, when a portion of a layer, film, region, or plate, etc., is "on" another portion, this includes not only the case where the portion is "directly on" the other portion, but also the case where another portion exists between the portion and the other portion. Additionally, in this specification, when a portion such as a layer, film, region, or plate is formed on another portion, the direction of formation is not limited to the upward direction, but includes the side surface or the downward direction. Conversely, when a portion of a layer, film, region, or plate, etc., is "below" another portion, this includes not only the case where the portion is "directly below" the other portion, but also the case where another portion exists between them.

[0052] In the accompanying drawings, reference numerals presented and discussed in relation to a particular drawing have similar meanings when presented in other drawings.

[0053] In the following description, a display device according to an embodiment of the present disclosure will be described with reference to the accompanying drawings in connection with the embodiments of the present disclosure.

[0054] Reference Figures 1 to 4 A display device DD according to an embodiment is described.

[0055] Figure 1 This is a schematic diagram illustrating a display device according to an embodiment. Figure 2 It is shown that it includes Figure 1 A schematic plan view of an embodiment of a display unit in a display device. Figure 3 It is shown that it includes Figure 1 A schematic plan view of an embodiment of a sensing unit in a display device. Figure 4 It is shown Figure 1 A schematic cross-sectional view of the display device.

[0056] Reference Figures 1 to 4 The display device DD is configured to provide (or emit) light. In embodiments, the display device DD can be applied to various devices, and the applicable devices are not limited to specific examples.

[0057] The display device DD includes a panel PNL and a driving circuit DV configured to drive the panel PNL.

[0058] The panel PNL may include a display unit DP (or display component) configured to display an image and a sensing unit TSP (or sensing component) configured to sense user input (e.g., touch input).

[0059] The display unit DP may include pixels PXL. The sensing unit TSP may include sensing electrodes SP (or a sensor).

[0060] The driving circuit DV may include a display driver (or D-IC) DDV configured to drive the display unit DP and a sensor driver (or T-IC) SDV configured to drive the sensing unit TSP. The sensing unit TSP and the sensor driver SDV may constitute a sensing device.

[0061] In this embodiment, the display unit DP may be referred to as a display layer or display panel. The sensing unit TSP may be referred to as a sensing layer, sensor panel, or touch sensor.

[0062] Pixel PXL can display an image in units of display frame cycles. Sensing electrodes SP can sense user input (e.g., touch input) in units of sensing frame cycles. In embodiments, the sensing frame cycle and the display frame cycle can be independent of each other or can be different from each other. The sensing frame cycle and the display frame cycle can be synchronized or asynchronous with each other.

[0063] The sensing unit TSP, including the sensing electrodes SP, can acquire (or obtain) information about the user's touch input UTI (see...). Figure 7 Information about touch input (or touch events) can refer to information such as the location of the touch the user wants to make.

[0064] The first substrate layer BS1 may be a substrate base or substrate member for supporting the display device DD. The first substrate layer BS1 may be a rigid substrate including glass. Alternatively, the first substrate layer BS1 may be a flexible substrate. In this case, the first substrate layer BS1 may include an insulating material such as a polymer resin, for example, polyimide. However, this disclosure is not particularly limited thereto.

[0065] The display device DD (or display unit DP) may include a display area DA and a non-display area NDA. The non-display area NDA may surround at least a portion of the display area DA. The non-display area NDA may be located on the periphery of the display area DA.

[0066] The pixel PXL, as well as the scan lines and data lines electrically connected to the pixel PXL, can be set in the display area DA.

[0067] Pixel PXL can be configured to receive data signals from data lines based on a scan signal with a conduction level supplied from the scan lines, and emit light with a brightness corresponding to the data signals. Therefore, an image corresponding to the data signals is displayed in the display area DA.

[0068] Pixels PXL can be arranged in the display area DA according to various layout structures. For example, pixels PXL can be arranged according to stripes, (or conventional) Or diamonds Array structures, etc., can be used for arrangement. However, this disclosure is not limited to the examples described above.

[0069] Each pixel PXL can include two or more subpixels. Two or more subpixels can form a pixel unit PXU capable of emitting light of various colors.

[0070] For example, a pixel PXL may include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. Each of the first sub-pixels SPX1 through the third sub-pixel SPX3 may emit light of a single color. For example, the first sub-pixel SPX1 may be a red pixel that emits red light (e.g., a first color), the second sub-pixel SPX2 may be a green pixel that emits green light (e.g., a second color), and the third sub-pixel SPX3 may be a blue pixel that emits blue light (e.g., a third color).

[0071] As another example, a pixel PXL may include four subpixels. For instance, a pixel PXL may be implemented as an RGBG type pixel unit PXU comprising one red pixel, one blue pixel, and two green pixels, or it may be implemented as an RGBW type pixel unit TXU comprising one red pixel, one blue pixel, one green pixel, and one white pixel. The number of subpixels included in a pixel PXL and the color of light emitted by each of the subpixels are not particularly limited.

[0072] Various wiring or built-in circuitry connecting the pixel PXL to the display area DA can be located in the non-display area NDA. For example, multiple wirings used to supply various power and control signals to the display area DA can be located in the non-display area NDA.

[0073] The sensing unit TSP can acquire information about input provided by the user. The sensing unit TSP can be configured to recognize touch input.

[0074] The display device (DD) (or sensing unit TSP) may include a sensing area (SA) and a non-sensing area (NSA).

[0075] In this embodiment, the sensing area SA can be positioned to overlap with at least one area of ​​the display area DA. For example, the sensing area SA can be set to an area corresponding to the display area DA (e.g., an area overlapping with the display area DA), and the non-sensing area NSA can be set to an area corresponding to the non-display area NDA (e.g., an area overlapping with the non-display area NDA). In this case, when touch input or the like is provided in the display area DA, the touch input can be detected by the sensing unit TSP.

[0076] The second substrate layer BS2 may include one or more insulating layers. For example, the insulating layer (e.g., an inorganic insulating layer) used to form the second substrate layer BS2 may be disposed (e.g., directly disposed) on the display unit DP (e.g., the encapsulation layer TFE) to form a substrate for forming the sensing electrode SP. However, the examples used to form the second substrate layer BS2 are not particularly limited.

[0077] The sensing area SA is defined as an area that can respond to touch input (e.g., the effective area of ​​the sensor). Sensing electrodes SP for sensing touch input, etc., can be positioned within the sensing area SA.

[0078] The sensing electrode SP can use the self-capacitance method to obtain information about user touch input.

[0079] The sensing electrodes SP can be arranged in various structures within the sensing region SA. For example, the sensing electrodes SP can be arranged along a first direction DR1. The sensing electrodes SP can be arranged along a second direction DR2. The sensing electrodes SP can be arranged in a matrix shape defined relative to the first direction DR1 and the second direction DR2. However, this disclosure is not limited thereto. For example, the sensing electrodes SP can be arranged in a circular shape, an elliptical shape, or at an angle.

[0080] In this embodiment, the first direction DR1 and the second direction DR2 can be different directions. The first direction DR1 and the second direction DR2 can be orthogonal to each other. However, this disclosure is not limited to this. For example, the first direction DR1 and the second direction DR2 can be inclined to each other.

[0081] In embodiments, the sensing electrode SP can have various shapes. For example, the sensing electrode SP can have various shapes such as square, triangle, circle, ellipse or grid shape.

[0082] In embodiments, the sensing electrode SP may include a conductive material. For example, the sensing electrode SP may have conductivity by comprising at least one of metallic materials, transparent conductive materials, and various other conductive materials. For example, the sensing electrode SP may include at least one of various metallic materials or alloys thereof, including gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and platinum (Pt). The sensing electrode SP may include at least one of various transparent conductive materials, including silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc aluminum oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes, and graphene. The sensing electrode SP may be formed of a single layer or multiple layers, and the cross-sectional structure of the sensing electrode SP is not particularly limited.

[0083] The panel PNL may include a pad area PDA. The panel PNL may include display pads DPD and touch sensing pads TPD disposed in the pad area PDA.

[0084] Display pads (DPD) can be electrically connected to pixels (PXL) in the display area (DA) via wiring. Display pads (DPD) can also be electrically connected to the display driver (DDV) in the drive circuit (DV). For example, electrical signals provided by the display driver (DDV) can be applied to pixels (PXL) via display pads (DPD).

[0085] The touch sensing pad (TPD) can be electrically connected to the sensing electrode SP via wiring and a multiplexer (MUX). The touch sensing pad (TPD) can be electrically connected to the sensor driver (SDV) in the drive circuit (DV). For example, an electrical signal provided by the sensor driver (SDV) can be applied to the sensing electrode SP via the touch sensing pad (TPD).

[0086] The drive circuit (DV) can include a flexible circuit board. The drive circuit (DV) can be implemented as an integrated circuit (IC).

[0087] The driving circuit DV may include a display driver DDV and a sensor driver SDV. The driving circuit DV may be positioned on the rear surface of the first substrate layer BS1.

[0088] The display driver DDV can be electrically connected to the display unit DP and can be configured to drive the display unit DP. The display driver DDV can be positioned on the rear surface of the first substrate layer BS1 and can be electrically connected to the pixel PXL via the display pad DPD. The display driver DDV may include a data driver, a timing controller, and a scan driver, etc.

[0089] The sensor driver SDV can be electrically connected to the sensing unit TSP and can be configured to drive the sensing unit TSP. The sensor driver SDV can be positioned on the rear surface of the first substrate layer BS1 and can be electrically connected to the sensing electrode SP via the touch sensing pad TPD.

[0090] A panel PNL (e.g., a sensing unit TSP) may include a multiplexer region MUA. A panel PNL (e.g., a sensing unit TSP) may include a multiplexer MUX located within the multiplexer region MUA.

[0091] The multiplexer region MUA can be located on one side of the sensing region SA. The multiplexer region MUA can also be located between the sensing region SA and the pad region PDA. Electrical signals supplied by the touch sensing pad TPD can be applied to the sensing electrode SP via the multiplexer MUX.

[0092] Reference Figure 4 The display unit DP may include a circuit layer CIL, a light-emitting element layer LEL, and a packaging layer TFE disposed on the first substrate layer BS1. The third direction DR3 may be a direction perpendicular to the first direction DR1 and the second direction DR2.

[0093] The circuit layer CIL can extend across the display area DA and the non-display area NDA, and can be located on the first substrate layer BS1. The circuit layer CIL is configured to drive pixels PXL and can include pixel circuitry electrically connected to light-emitting elements. The circuit layer CIL may include multiplexer transistors of the multiplexer MUX (see [link to multiplexer]). Figure 10 ).

[0094] The light-emitting element layer (LEL) can be disposed on the circuit layer (CIL) in the display area (DA). The LEL can include light-emitting elements that emit light. The light-emitting elements can include organic light-emitting diodes (OLEDs) containing organic materials, or inorganic light-emitting diodes (e.g., micro light-emitting diodes (LEDs) containing inorganic materials). However, this disclosure is not limited thereto.

[0095] The encapsulation layer TFE can cover the light-emitting element layer LEL. At least a portion of the encapsulation layer TFE can be positioned within the display area DA. The encapsulation layer TFE can encapsulate the light-emitting element layer LEL.

[0096] The sensing unit TSP can be positioned across the sensing region SA and the non-sensing region NSA. At least a portion of the sensing unit TSP can be disposed (e.g., directly disposed) on the encapsulation layer TFE.

[0097] In one embodiment, the sensing unit TSP can be disposed on a separately provided substrate and then formed and manufactured on the encapsulation layer TFE, without being coupled to the display unit DP. Therefore, the manufacturing process of the display device DD can be simplified.

[0098] Reference Figures 5 to 8 A sensing device according to an embodiment is described. For ease of explanation, content that is repeated above will be described briefly or not repeated.

[0099] Figure 5 and Figure 6 This is a schematic plan view illustrating a sensing device according to an embodiment. Figure 7 and Figure 8 It is used to describe by Figure 5 A schematic diagram of a sensing device sensing touch input.

[0100] Reference Figures 5 to 8 The sensing device may include a sensing unit (TSP) and a sensor driver (SDV).

[0101] The sensing unit TSP may also include sensing lines SL (or sensor lines) and signal lines SGL. Sensing lines SL can be electrically connected one-to-one to sensing electrodes SP. Sensing lines SL can electrically connect the sensing electrodes SP in the sensing area SA to the multiplexer MUX. Signal lines SGL electrically connect the multiplexer MUX and the touch sensing pad TPD, and can be electrically connected to the sensor driver SDV through the touch sensing pad TPD. Therefore, the drive signal provided by the sensor driver SDV can be applied to the sensing electrodes SP through signal lines SGL, the multiplexer MUX, and sensing lines SL.

[0102] In an embodiment, the sensing area SA may include a first area A1, a second area A2, and a boundary area BA (or a shared area, a third area A3). The first area A1 and the second area A2 may be spaced apart from each other in a first direction DR1, and the boundary area BA may be located between the first area A1 and the second area A2.

[0103] In an embodiment, the sensing line SL may include a first sensing line SL1-1, a first sensing line SL1-2, a second sensing line SL2-1, and a second sensing line SL2-2. In an embodiment, the signal line SGL may include a first signal line SGL1 and a second signal line SGL2.

[0104] In an embodiment, the sensor driver SDV may include a first sensor driver SDV1 (T-IC1) and a second sensor driver SDV2 (T-IC2). Each of the first sensor driver SDV1 and the second sensor driver SDV2 may be implemented as an integrated circuit.

[0105] The first sensor driver SDV1 can be electrically connected to the sensing electrode SP in the first region A1 via the first sensing line SL1-1. Additionally, the first sensor driver SDV1 can be electrically connected to a first subset of the sensing electrodes SP in the boundary region BA via the first sensing line SL1-2. The first sensor driver SDV1 may not be connected to the sensing electrode SP in the second region A2 or may be electrically disconnected from the sensing electrode SP in the second region A2.

[0106] The second sensor driver SDV2 can be electrically connected to the sensing electrode SP in the second region A2 via the 2-1 sensing line SL2-1. Additionally, the second sensor driver SDV2 can be electrically connected to a second subset of the sensing electrodes SP in the boundary region BA via the 2-2 sensing line SL2-2. The second sensor driver SDV2 may not be connected to the sensing electrodes SP in the first region A1 or may be electrically disconnected from the sensing electrodes SP in the first region A1. In this embodiment, the first sensor driver SDV1 and the second sensor driver SDV2 can obtain one sensing signal for each of the sensing electrodes SP in the first region A1 and the second region A2, and two sensing signals for each of the sensing electrodes SP in the third region A3.

[0107] In other words, the first sensor driver SDV1 and the second sensor driver SDV2 can share the sensing electrode SP in the boundary region BA. (See later...) Figure 14 As described, the first sensor driver SDV1 and the second sensor driver SDV2 can adjust the touch sensitivity based on the sensing signal acquired from the boundary region BA. In this case, the difference in touch sensitivity between the first region A1 and the second region A2 can be reduced, and the touch performance in the boundary region BA can be improved.

[0108] In an embodiment, the boundary region BA may include at least one sensor array. The sensor array may include sensing electrodes SP arranged along the second direction DR2. For example, as... Figure 5 As shown, the boundary region BA may include two sensor columns, for example, a first sensor column COL1 and a second sensor column COL2. As another example, ... Figure 6 As shown, the boundary region BA may include one sensor column, for example, a first sensor column COL1. However, the boundary region BA is not limited to this, and for example, the boundary region BA may include three or more sensor columns. For reference, as the number of sensor columns included in the boundary region BA increases, sufficient data can be ensured to adjust for the sensitivity difference between the first region A1 and the second region A2, but the number of channels (or the number of integrated circuits) of the sensor driver SDV may increase. Given the above, preferably, the boundary region BA may include two columns.

[0109] In an embodiment, the multiplexer MUX may include a first multiplexer MUX1 and a second multiplexer MUX2.

[0110] The first multiplexer MUX1 can be electrically connected between the sensing electrode SP in the first region A1 and the first sensor driver SDV1. Additionally, the first multiplexer MUX1 can be electrically connected to a first subset of the sensing electrodes SP in the boundary region BA. The first multiplexer MUX1 can selectively connect the sensing electrodes SP in the first region A1 and the boundary region BA (or the first sensing lines SL1-1 and SL1-2 connected to the sensing electrodes SP) to the first signal line SGL1 (or the first sensor driver SDV1 connected to the first signal line SGL1).

[0111] The second multiplexer MUX2 can be electrically connected between the sensing electrode SP in the second region A2 and the second sensor driver SDV2. Additionally, the second multiplexer MUX2 can be electrically connected to a second subset of the sensing electrodes SP in the boundary region BA. The second multiplexer MUX2 can selectively connect the sensing electrodes SP in the second region A2 and the boundary region BA (or the second sensing lines SL2-1 and SL2-2 connected to the sensing electrodes SP) to the second signal line SGL2 (or the second sensor driver SDV2 connected to the second signal line SGL2).

[0112] In other words, the first multiplexer MUX1 and the second multiplexer MUX2 can share the sensing electrode SP in the boundary region BA.

[0113] Already referred to Figure 5 and Figure 6 The description describes two sensor drivers, SDV1 and SDV2, sharing a boundary region BA, but this disclosure is not limited thereto. For example, depending on the size of the sensing region SA, the sensing device may include three or more sensor drivers, each of which drives a corresponding region within the sensing region SA, and each of the three or more sensor drivers may share a boundary region adjacent to the corresponding region with another sensor driver. Reference will be made later. Figure 16 Describe it.

[0114] Reference Figure 7 The sensor driver SDV can obtain information about the user's touch input UTI by using a self-capacitance method. In an embodiment, Figure 1 The sensing unit TSP or panel PNL may include a capacitive electrode CE. In an embodiment, the capacitive electrode CE may be... Figure 1 At least one of the electrodes of the display unit DP. For example, the capacitor electrode CE can be the cathode electrode of the light-emitting element. However, the capacitor electrode CE is not limited to this.

[0115] In this embodiment, the sensor driver SDV can charge and release charge to the sensing electrode SP via the signal line SGL, the multiplexer MUX, and the sensing line SL, and detect changes in the capacitance of the sensing electrode SP to obtain information about the user touch input UTI. The information about the user touch input UTI may include the location of the user touch input UTI or its presence or absence.

[0116] For example, a reference voltage (or drive signal) provided by the sensor driver SDV can be applied to the sensing electrode SP. When a user touch input UTI is applied, a self-capacitance Csf can be formed between the sensing electrode SP and the capacitive electrode CE, and the reference voltage can be changed to voltage information (or sensing signal) with a waveform changed by the self-capacitance Csf. The sensor driver SDV can receive the changed voltage information and analyze the changed voltage information to determine the location of the user touch input UTI and whether the user touch input UTI exists, etc.

[0117] Reference Figure 8 The multiplexer MUX may include a first switch SW1. The first switch SW1 can electrically connect the sensing line SL and the sensor driver SDV.

[0118] The sensor driver SDV may include a sensor channel 222. Sensor channel 222 may be configured to receive a sensing signal Vsense from the sensing line SL during a first cycle when the first switch SW1 is turned on. Sensor channel 222 may output a voltage signal corresponding to the voltage level of the charge charged into the sensing electrode SP to the output terminal OUT1. For example, sensor channel 222 may be an integrator.

[0119] For example, sensor channel 222 may include an amplifier AMP, a sensing capacitor Ca, and a reset switch SWr. The amplifier AMP may include a first input terminal IN1 connected to the sensing line SL via a first switch SW1, a second input terminal IN2 receiving a reference signal Vref (or a drive signal), and an output terminal OUT1. For example, the amplifier AMP may be an operational amplifier. For example, the first input terminal IN1 may be an inverting terminal, and the second input terminal IN2 may be a non-inverting terminal.

[0120] The sensing capacitor Ca can be electrically connected between the first input terminal IN1 and the output terminal OUT1. The reset switch SWr can be electrically connected between the first input terminal IN1 and the output terminal OUT1. The sensing capacitor Ca and the reset switch SWr can be connected in parallel between the first input terminal IN1 and the output terminal OUT1. In an embodiment, a resistor connected in parallel with the sensing capacitor Ca can be further provided in the sensor channel 222.

[0121] The reference signal Vref (or drive signal) can have a square wave. When the reference signal Vref is applied to the second input terminal IN2 of the amplifier AMP, a sensing signal Vsense corresponding to the reference signal Vref can be generated in the sensing line SL (and / or sensing electrode SP). The sensing signal Vsense can have a waveform that is RC-delayed by the reference signal Vref due to its self-capacitance Csf, etc. The self-capacitance Csf can vary depending on the presence or absence of the user touch input UTI (e.g., touch or no touch), and therefore the waveform of the sensing signal Vsense can vary.

[0122] The sensor driver SDV may also include an analog-to-digital converter 224 (or ADC). The ADC 224 can receive the output signal from the sensor channel 222. The ADC 224 can convert the analog voltage level output from the sensor channel 222 into a digital value and output the digital value. The sensor driver SDV (or processor) can determine the presence or absence of a user touch input UTI and its location, etc., based on the digital value.

[0123] As described above, the sensing area SA includes a boundary region BA between the first region A1 and the second region A2, and the first sensor driver SDV1 and the second sensor driver SDV2 can share the sensing electrode SP in the boundary region BA. Based on the sensing signal obtained from the boundary region BA, the first sensor driver SDV1 and the second sensor driver SDV2 can adjust the touch sensitivity, and the touch performance in the boundary region BA can be improved.

[0124] Despite Figure 5 and Figure 6 The diagram shows a first multiplexer MUX1 and a second multiplexer MUX2 sharing a boundary region BA, but this disclosure is not limited thereto. For example, when the multiplexer MUX is not provided, the first sensor driver SDV1 and the second sensor driver SDV2 can be directly connected and share the sensing electrode SP in the boundary region BA.

[0125] Reference Figures 9 to 12 Describe the operation of the multiplexer (MUX) and the display device (or sensing device). For ease of explanation, the content already described above will be briefly described or will not be repeated.

[0126] Figure 9 It is shown Figure 5 and Figure 6 A schematic plan view of an embodiment of the sensing device. Figure 10 It is shown that it includes Figure 9 A schematic circuit diagram of an embodiment of a sub-multiplexer in a sensing device. Figure 11This is a plan view showing the operation of the sensing device. Figure 12 It shows that it is applied to Figure 11 A waveform diagram of the signal from the sensing electrode in an embodiment.

[0127] Reference Figure 9 The multiplexer MUX may include sub-multiplexers MUX_S (or signal selection circuitry). The sub-multiplexers MUX_S are provided per sensor column, and the sensing electrodes SP included in the sensor column can be selectively connected to the corresponding touch sensing pads TPD. For example, a sub-multiplexer MUX_S may be provided for each sensor column or for every two sensor columns.

[0128] The first multiplexer MUX1 may include a first sub-multiplexer MUX_S1 and a second sub-multiplexer MUX_S2.

[0129] The first sub-multiplexer MUX_S1 can be electrically connected to the sensor array in the first region A1 (or to the sensing electrodes SP and the first-1 sensing line SL1-1 included in the sensor array). For example, the first sub-multiplexer MUX_S1 can selectively connect the sensing electrodes SP (or the first-1 sensing line SL1-1) in the third sensor array COL3 to the first touch sensing pad TPD1. In an embodiment, among the sensor arrays in the first region A1, the third sensor array COL3 can be closest to the boundary region BA. The first touch sensing pad TPD1 and the second touch sensing pad TPD2 can be electrically connected to the first sensor driver SDV1.

[0130] The second sub-multiplexer MUX_S2 can be electrically connected to the sensor array in the boundary region BA (or to the sensing electrodes SP and the first-second sensing lines SL1-2 included in the sensor array). For example, the second sub-multiplexer MUX_S2 can selectively connect a first subset (or the first-second sensing lines SL1-2) of the sensing electrodes SP in the first sensor array COL1 to the second touch sensing pad TPD2. The second sub-multiplexer MUX_S2 is not electrically connected to the first touch sensing pad TPD1. That is, the first subset of the sensing electrodes SP in the boundary region BA is not electrically connected to the first touch sensing pad TPD1. Furthermore, the sensing electrodes SP in the third sensor array COL3 are not electrically connected to the second touch sensing pad TPD2.

[0131] The second multiplexer MUX2 may include a third sub-multiplexer MUX_S3 and a fourth sub-multiplexer MUX_S4.

[0132] The third sub-multiplexer MUX_S3 can be electrically connected to the sensor array in the boundary region BA (or the second subset of sensing electrodes SP and the 2-2 sensing line SL2-2 included in the sensor array). For example, the third sub-multiplexer MUX_S3 can selectively connect the second subset of sensing electrodes SP (or the 2-2 sensing line SL2-2) in the first sensor array COL1 to the third touch sensing pad TPD3. The third sub-multiplexer MUX_S3 is not connected to the fourth touch sensing pad TPD4. That is, the second subset of sensing electrodes SP in the boundary region BA is not connected to the fourth touch sensing pad TPD4. The third touch sensing pad TPD3 and the fourth touch sensing pad TPD4 can be electrically connected to the second sensor driver SDV2.

[0133] The fourth sub-multiplexer MUX_S4 can be electrically connected to the sensor array in the second region A2 (or to the sensing electrodes SP and the second-first sensing line SL2-1 included in the sensor array). For example, the fourth sub-multiplexer MUX_S4 can selectively connect the sensing electrodes SP (or the second-first sensing line SL2-1) in the fourth sensor array COL4 to the fourth touch sensing pad TPD4. In an embodiment, among the sensor arrays in the second region A2, the fourth sensor array COL4 can be closest to the boundary region BA.

[0134] Reference Figure 10 The sub-multiplexer MUX_S can selectively connect the sensing line SL (or sensing electrode SP) to the signal line SGL (or touch sensing pad TPD), the first drive line DRL1, or the second drive line DRL2. The target pulse signal can be received from... Figure 7 The sensor driver SDV shown is applied to the signal line SGL, the first drive signal DR_NP can be applied to the first drive line DRL1, and the second drive signal DR_BP can be applied to the second drive line DRL2.

[0135] The sub-multiplexer MUX_S may include multiple multiplexer transistors MT1 to MT4 (or transistors). For example, multiplexer transistors MT1 to MT4 may include a first multiplexer transistor MT1 (or a first transistor), a second multiplexer transistor MT2 (or a second transistor), a third multiplexer transistor MT3 (or a third transistor), and a fourth multiplexer transistor MT4 (or a fourth transistor).

[0136] The first electrode of the first multiplexer transistor MT1 can be electrically connected to the sensing line SL, the second electrode of the first multiplexer transistor MT1 can be electrically connected to the first drive line DRL1, and the gate electrode of the first multiplexer transistor MT1 can be electrically connected to the first multiplexer gate line MGL1 (or the first gate line). When the first gate signal MC_NP is applied from the first multiplexer gate line MGL1, the first multiplexer transistor MT1 can be turned on to electrically connect the sensing line SL and the first drive line DRL1.

[0137] The first electrode of the second multiplexer transistor MT2 can be electrically connected to the sensing line SL, the second electrode of the second multiplexer transistor MT2 can be electrically connected to the connection line CL, and the gate electrode of the second multiplexer transistor MT2 can be electrically connected to the second multiplexer gate line MGL2 (or the second gate line). When the second gate signal MC_SP is applied from the second multiplexer gate line MGL2, the second multiplexer transistor MT2 can be turned on to electrically connect the sensing line SL and the connection line CL.

[0138] The first electrode of the third multiplexer transistor MT3 can be electrically connected to the connection line CL, the second electrode of the third multiplexer transistor MT3 can be electrically connected to the signal line SGL, and the gate electrode of the third multiplexer transistor MT3 can be electrically connected to the third multiplexer gate line MGL3 (or the third gate line). When the third gate signal MC_S is applied from the third multiplexer gate line MGL3, the third multiplexer transistor MT3 can be turned on to electrically connect the connection line CL and the signal line SGL.

[0139] The first electrode of the fourth multiplexer transistor MT4 can be electrically connected to the connection line CL, the second electrode of the fourth multiplexer transistor MT4 can be electrically connected to the second drive line DRL2, and the gate electrode of the fourth multiplexer transistor MT4 can be electrically connected to the fourth multiplexer gate line MGL4 (or the fourth gate line). When the fourth gate signal MC_B is applied from the fourth multiplexer gate line MGL4, the fourth multiplexer transistor MT4 can be turned on to electrically connect the connection line CL and the second drive line DRL2.

[0140] When the second multiplexer transistor MT2 and the third multiplexer transistor MT3 are turned on, the sensing line SL (or sensing electrode SP) can be electrically connected to the signal line SGL (or touch sensing pad TPD).

[0141] When the second multiplexer transistor MT2 and the fourth multiplexer transistor MT4 are turned on, the sensing line SL (or sensing electrode SP) can be electrically connected to the second drive line DRL2, and the second drive signal DR_BP can be applied to the sensing electrode SP.

[0142] When the first multiplexer transistor MT1 is turned on, the sensing line SL (or sensing electrode SP) can be electrically connected to the first drive line DRL1, and the first drive signal DR_NP can be applied to the sensing electrode SP.

[0143] The target pulse signal can be used to sense the sensing electrode SP (or the target sensing electrode TP) that is electrically connected to the sensing line SL. Figure 11 User touch input UTI at the location (see) Figure 7 The first drive signal DR_NP can be applied to the corresponding sensing electrode SP (or non-sensing electrode NP) when no user touch input UTI is sensed at or around the location where the sensing electrode SP is electrically connected to the sensing line SL. Figure 11 The second drive signal DR_BP can be used to determine when another sensing electrode SP (or an adjacent sensing electrode BP) is used in a region adjacent to the location of the sensing electrode SP that is electrically connected to the sensing line SL. Figure 11 )) Sensing auxiliary signals that provide information about the user's touch input UTI when the user touches the input UTI.

[0144] Reference Figure 11 Relative to the first sensor column COL1 included in the display device DD (or sensing unit TSP), the sensor electrode located in the fourth row ROW4 can be selected to be connected to the sensor driver SDV (see...). Figure 9 The target sensing electrode TP is defined as follows. In this case, the sensor electrode located in the row adjacent to the fourth row (ROW4) can be an adjacent sensing electrode BP. For example, the sensor electrodes located in the second row (ROW2), third row (ROW3), fifth row (ROW5), and sixth row (ROW6) can be selected as adjacent sensing electrodes BP. At least one of the remaining sensor electrodes other than those located in the second row (ROW2) to the sixth row (ROW6) can be a non-sensing electrode NP. For example, the sensor electrode located in the first row (ROW1), seventh row (ROW7), or eighth row (ROW8) can be selected as a non-sensing electrode NP.

[0145] Reference Figure 7 as well as Figures 10 to 12The target pulse signal TPS can be applied to the target sensing electrode TP from the sensor driver SDV. A first pulse signal PS1 can be applied to the adjacent sensing electrode BP. The first pulse signal PS1 can be the second drive signal DR_BP of the second drive line DRL2. A second pulse signal PS2 can be applied to the non-sensing electrode NP. The second pulse signal PS2 can be the first drive signal DR_NP of the first drive line DRL1. The first pulse signal PS1 can have the same phase as the target pulse signal TPS, and the second pulse signal PS2 can have the opposite phase to the target pulse signal TPS.

[0146] At the first time point T1, the target pulse signal TPS applied to the target sensing electrode TP can change from the first target voltage level TV1 to the second target voltage level TV2.

[0147] At the second time point T2, the target pulse signal TPS can gradually decrease from the second target voltage level TV2 to the first target voltage level TV1. The slope of the voltage level of the target pulse signal TPS can change according to the user's touch. For example, when the user's touch is not adjacent to the target sensing electrode TP, the voltage level of the target pulse signal TPS can have a first slope S1. For example, when the user's touch is adjacent to the target sensing electrode TP, the voltage level of the target pulse signal TPS can have a second slope S2. The sensor driver SDV (or processor) can sense the user's touch based on whether the target pulse signal TPS has the first slope S1 or the second slope S2.

[0148] At the first time point T1, the first pulse signal PS1 applied to the adjacent sensing electrode BP can transition from a first voltage level V1 to a second voltage level V2. Simultaneously, the second pulse signal PS2 applied to the non-sensing electrode NP can transition from the second voltage level V2 to the first voltage level V1.

[0149] At the second time point T2, the first pulse signal PS1 can transition from the second voltage level V2 to the first voltage level V1. Simultaneously, the second pulse signal PS2 can transition from the first voltage level V1 to the second voltage level V2.

[0150] At the third time point T3, the first pulse signal PS1 can switch from the first voltage level V1 to the second voltage level V2 again. At the same time, the second pulse signal PS2 can switch from the second voltage level V2 back to the first voltage level V1.

[0151] Here, the time between the first time point T1 and the third time point T3 can be defined as the first cycle CYCL1. The operations at the third time point T3, the fourth time point T4, and the fifth time point T5 can be described as being the same as the operations at the first time point T1, the second time point T2, and the third time point T3, respectively. At the fifth time point T5, the sensing cycle SS for the target sensing electrode TP ends, and the time between the third time point T3 and the fifth time point T5 can be defined as the second cycle CYCL2 following the first cycle CYCL1. Thus, the sensing cycle SS can include one or more cycles CYCL1 and CYCL2 to sense the user's touch through the target sensing electrode TP.

[0152] The first pulse signal PS1 applied to the adjacent sensing electrode BP can have the form of multiple repetitive square waves during the sensing period SS, and the second pulse signal PS2 applied to the non-sensing electrode NP can have the form of multiple repetitive square waves with a phase opposite to that of the first pulse signal PS1. The first pulse signal PS1 and the second pulse signal PS2 can have the same frequency as the target pulse signal TPS. When the second pulse signal PS2 is applied to the non-sensing electrode NP, the EMI (electromagnetic interference) caused by the first pulse signal PS1 is reduced, and the touch performance can be improved.

[0153] Figure 13 This is a schematic plan view showing a sensing device according to a comparative example. Figure 14 It is shown by Figure 13 The sensing signal acquired by the sensing device and from Figure 5 A diagram illustrating an embodiment of a sensing device acquiring a sensing signal. Figure 15 It is shown by Figure 5 A waveform diagram of the sensing signal acquired by the sensing device in an embodiment. For ease of explanation, content that is repeated above will be described briefly or not repeated.

[0154] Reference Figure 13 The sensing area SA_C may include a first area A1_C and a second area A2_C. The first area A1_C and the second area A2_C may be adjacent to each other in the first direction DR1. The sensing area SA_C does not include... Figure 6 The boundary region BA.

[0155] The first sensor driver (T-IC1_C) SDV1_C can be electrically connected to the sensing electrode SP in the first region A1_C via the first multiplexer MUX1_C. The second sensor driver (T-IC2_C) SDV2_C can be electrically connected to the sensing electrode SP in the second region A2_C via the second multiplexer MUX2_C.

[0156] There is no region (or sensing electrode SP) shared by the first sensor driver SDV1_C and the second sensor driver SDV2_C, and the first sensor driver SDV1_C and the second sensor driver SDV2_C can independently drive the first region A1_C and the second region A2_C.

[0157] Reference Figure 14 The fourth curve, CURVE4, represents the curve formed by... Figure 13 The first sensor driver SDV1_C and the second sensor driver SDV2_C obtain sensing values ​​or sensing data from sensing electrodes included in a row. For example, each of the sensing values ​​may be obtained from... Figure 8 The value output by the analog-to-digital converter 224. Depending on variations in the structure or manufacturing process of the display device, the lengths of the sensing line SL for the first region A1_C and the sensing line SL for the second region A2_C may differ, or the capacitance formed in the sensing electrode SP or the sensing line SL may differ between the first region A1_C and the second region A2_C. For this reason, the sensing value (and / or touch sensitivity) obtained in the first region A1_C may differ from the sensing value (and / or touch sensitivity) obtained in the second region A2_C. For example, the sensing value obtained in the second region A2_C may be higher than the sensing value obtained from the first region A1_C, and the difference between the sensing values ​​obtained from the first sensor column COL1 and the second sensor column COL2, which are adjacent to each other, may be large.

[0158] The first sensor driver SDV1_C and the second sensor driver SDV2_C can be adjusted. Figure 8 The analog-to-digital converter 224 senses the values ​​or touch sensitivity, such as gain / offset, sampling time, or reference signal Vref. However, because the first sensor driver SDV1_C and the second sensor driver SDV2_C are driven independently of each other, it is difficult to objectively compare the touch sensitivity of the first sensor driver SDV1_C and the second sensor driver SDV2_C, and a degraded touch performance may occur between the first region A1_C and the second region A2_C. For example, when a user touches between the first region A1_C and the second region A2_C, the touch input may not be properly sensed due to the difference in touch sensitivity between the first region A1_C and the second region A2_C. For example, in regions with high touch sensitivity, subtle changes in capacitance are also sensed, so glove touches (i.e., touches with small changes in self-capacitance when the user is wearing gloves) are sensed, but noise may be identified as touches (i.e., ghosting touches occur). In regions with low touch sensitivity, glove touches may not be sensed.

[0159] Therefore, according to Figure 5 and Figure 6 The first sensor driver SDV1 and the second sensor driver SDV2 in the embodiment can share the boundary region BA between the first region A1 and the second region A2, and can objectively adjust the touch sensitivity based on the sensing values ​​obtained from the boundary region BA.

[0160] Reference Figure 14 and Figure 15 The first curve, CURVE1, represents the curve formed by... Figure 5 The first sensor driver, SDV1, obtains the sensed values ​​or sensed data from the sensing electrodes included in a row. The second curve, CURVE2, represents the sensed values ​​or sensed data obtained from the sensing electrodes included in a row. Figure 5 The second sensor driver SDV2 obtains sensing values ​​or sensing data from the sensing electrodes included in the row.

[0161] The first sensor driver SDV1 can acquire a sensing value (or sensing signal) for each sensing electrode SP in the first region A1 and the boundary region BA. The first sensor driver SDV1 can acquire a first sensing value SV1 for the first sensor column COL1 and the second sensor column COL2 in the boundary region BA. The second sensor driver SDV2 can acquire a sensing value for each sensing electrode SP in the boundary region BA and the second region A2. The second sensor driver SDV2 can acquire a second sensing value SV2 for the first sensor column COL1 and the second sensor column COL2 in the boundary region BA. That is, for the boundary region BA, two sensing values ​​SV1 and SV2 can be acquired. By comparing the first sensing value SV1 and the second sensing value SV2, the first sensor driver SDV1 and the second sensor driver SDV2 can adjust the touch sensitivity. For example, like the third curve CURVE3, the first sensor driver SDV1 and the second sensor driver SDV2 can adjust the sensing value or touch sensitivity for the boundary region BA to be the same or similar to each other. Therefore, touch performance relative to the boundary region BA can be improved.

[0162] Reference Figure 5 and Figure 15During the sensing frame period, each of the first sensor driver SDV1 and the second sensor driver SDV2 can sequentially drive or scan the sensor array (or sensing electrode SP) along the first direction DR1, and sequentially acquire sensed values ​​(or sensed signals) along the first direction DR1. A sixth time point T6 can be the start time point of the sensing frame period, and a seventh time point T7 can be the end time point of the sensing frame period. For example, the first sensor driver SDV1 can acquire a first sensed value SV1 for the first sensor array COL1 and the second sensor array COL2 in the boundary region BA at the seventh time point T7, and the second sensor driver SDV2 can acquire a second sensed value SV2 for the first sensor array COL1 and the second sensor array COL2 in the boundary region BA at the sixth time point T6. That is, the first sensor driver SDV1 and the second sensor driver SDV2 can acquire sensed values ​​for the boundary region BA at different and non-overlapping time points. For reference, when the first sensor driver SDV1 and the second sensor driver SDV2 scan the sensing electrode SP simultaneously, a drive signal is applied to the sensing electrode SP from each of the first sensor driver SDV1 and the second sensor driver SDV2, and errors may occur.

[0163] As described above, the first sensor driver SDV1 and the second sensor driver SDV2 share the boundary region BA between the first region A1 and the second region A2, and the touch sensitivity can be objectively adjusted based on the sensing values ​​obtained from the boundary region BA. Therefore, touch performance for the boundary region BA can be improved.

[0164] Figure 16 This is a schematic plan view illustrating a sensing device according to an embodiment.

[0165] Reference Figure 5 , Figure 6 and Figure 16 In addition to the fourth region A4, the second boundary region BA2, the third multiplexer MUX3, and the third sensor driver SDV3, Figure 16 The sensing device can be with Figure 5 or Figure 6 The sensing devices are basically the same or similar. Therefore, redundant descriptions have been omitted.

[0166] The sensing area SA may also include a fourth area A4 and a second boundary area BA2 (or a second shared area, a fifth area A5). The first boundary area BA1 may be connected with... Figure 6 (or Figure 5The boundary regions BA1 and BA2 are substantially the same or similar. The fourth region A4 may be spaced apart from the second region A2 in the first direction DR1, and the second boundary region BA2 may be located between the second region A2 and the fourth region A4. Except for their positions, the fourth region A4 and the second boundary region BA2 (or the configurations included in the fourth region A4 and the second boundary region BA2) may be substantially the same or similar to the second region A2 and the first boundary region BA1, respectively.

[0167] The sensor driver SDV may also include a third sensor driver SDV3. The third sensor driver SDV3 may be implemented as an integrated circuit. The third sensor driver SDV3 may be electrically connected to the sensing electrode SP in the fourth region A4 via the sensing line SL.

[0168] Each of the second sensor driver SDV2 and the third sensor driver SDV3 can be electrically connected to the sensing electrode SP in the second boundary region BA2 via the sensing line SL. That is, the second sensor driver SDV2 and the third sensor driver SDV3 can share the sensing electrode SP in the second boundary region BA2. The second sensor driver SDV2 and the third sensor driver SDV3 can adjust the touch sensitivity based on the sensing signal obtained from the second boundary region BA2. In this case, the difference in touch sensitivity between the second region A2 and the fourth region A4 can be reduced, and the touch performance for the second boundary region BA2 can be improved.

[0169] The multiplexer MUX may also include a third multiplexer MUX3. The third multiplexer MUX3 may be electrically connected between the sensing electrode SP in the fourth region A4 and the third sensor driver SDV3. Additionally, the third multiplexer MUX3 may be electrically connected to the sensing electrode SP in the second boundary region BA2. The third multiplexer MUX3 may selectively connect the sensing electrode SP (or the sensing line SL connected to the sensing electrode SP) in the fourth region A4 and the second boundary region BA2 to the signal line SGL (or the third sensor driver SDV3 connected to the signal line SGL).

[0170] Additionally, the second multiplexer MUX2 can be electrically connected to the sensing electrode SP in the second boundary region BA2. That is, the second multiplexer MUX2 and the third multiplexer MUX3 can share the sensing electrode SP in the second boundary region BA2.

[0171] As described above, the sensing area SA may include a first area A1, a second area A2, and a fourth area A4, as well as a first boundary area BA1 and a second boundary area BA2 between the first area A1, the second area A2, and the fourth area A4. A first sensor driver (T-IC1) SDV1 and a second sensor driver (T-IC2) SDV2 may share the sensing electrode SP in the first boundary area BA1, and a second sensor driver SDV2 and a third sensor driver (T-IC3) SDV3 may share the sensing electrode SP in the second boundary area BA2. The first sensor driver SDV1 and the second sensor driver SDV2 may adjust the touch sensitivity based on the sensing signal obtained from the first boundary area BA1, and the second sensor driver SDV2 and the third sensor driver SDV3 may adjust the touch sensitivity based on the sensing signal obtained from the second boundary area BA2. Therefore, touch performance in the boundary areas BA1 and BA2 can be improved.

[0172] Although it has been referenced Figure 16 The description describes a sensing area SA divided into three regions A1, A2, and A4 along the first direction DR1. Three sensor drivers SDV1 to SDV3 (and three multiplexers MUX1 to MUX3) responsible for regions A1, A2, and A4 respectively (or having jurisdiction over regions A1, A2, and A4) share adjacent boundary regions. However, the arrangement / number or configuration relationship between the regions (and boundary regions), and between the multiplexers and sensor drivers, is not limited to this. (See panel PNL for more details.) Figure 1 (or sensing unit TSP (see)) Figure 3 The relationship between the structure or size of the area (and boundary area) and the arrangement / number or configuration of the area can be configured differently.

[0173] Figure 17 This is a schematic block diagram illustrating an electronic device according to an embodiment. Figure 18 It is shown that Figure 17 A schematic diagram illustrating an example of an electronic device implemented as a smartphone. Figure 19 It is shown that Figure 17 A schematic diagram illustrating an example of an electronic device implemented as a tablet PC. Figure 20 It is shown that Figure 17 A schematic diagram illustrating an example of an electronic device implemented as a smartwatch. Figure 21 It is shown that Figure 17 A schematic diagram illustrating an example of an electronic device implemented as an automotive display system.

[0174] Reference Figures 17 to 21The electronic device 1000 may include a processor 1010, a memory device 1020, a storage device 1030, an input / output (I / O) device 1040, a power supply 1050, and a display device 1060. The display device 1060 may be the display device DD described above. Additionally, the electronic device 1000 may also include various ports capable of communicating with video cards, sound cards, memory cards, or USB devices, or with other systems.

[0175] Processor 1010 can perform calculations or tasks. In embodiments, processor 1010 can be a microprocessor, central processing unit, or application processor, etc. The functions or multiple functions of processor 1010 can be performed by one or more processors. Processor 1010 can be coupled to other components via address buses, control buses, and data buses, etc. In embodiments, processor 1010 can also be connected to an expansion bus such as a peripheral component interconnect (PCI) bus. In embodiments, processor 1010 can provide input image data to display device 1060, and therefore, display device 1060 can display an image based on the input image data provided from processor 1010.

[0176] In this embodiment, the processor 1010 can... Figure 5 and Figure 6 The first sensor driver SDV1 and the second sensor driver SDV2 receive sensing signals (or sensing data) and sense user touch input based on the sensing signals. In an embodiment, the processor 1010 can control the first sensor driver SDV1 and the second sensor driver SDV2 to adjust touch sensitivity based on sensing signals from the boundary region BA.

[0177] The memory device 1020 can store data required for the operation of the electronic device 1000. For example, the memory device 1020 may include non-volatile memory devices such as erasable programmable read-only memory (EPROM) devices, electrically erasable programmable read-only memory (EEPROM) devices, flash memory devices, phase-change random access memory (PRAM) devices, resistive random access memory (RRAM) devices, nano-floating gate memory (NFGM) devices, polymer random access memory (PoRAM) devices, magnetic random access memory (MRAM) or ferroelectric random access memory (FRAM) devices, or volatile memory devices such as dynamic random access memory (DRAM) devices, static random access memory (SRAM) devices and mobile DRAM devices.

[0178] Storage device 1030 may include solid-state drives (SSDs), hard disk drives (HDDs), and read-only optical disc storage (CD-ROMs), etc.

[0179] Input / output device 1040 may include input devices such as a keyboard, keypad, touchpad, touchscreen, and mouse, and output devices such as a speaker and printer. In an embodiment, display device 1060 may be included in input / output device 1040.

[0180] Power supply 1050 can supply the power required for the operation of electronic device 1000. For example, power supply 1050 can be a power management integrated circuit (PMIC). In an embodiment, power supply 1050 can supply power to display device 1060.

[0181] The display device 1060 can display images corresponding to the visual information of the electronic device 1000. The display device 1060 can be connected to other components via a bus or other communication link.

[0182] Electronic device 1000 may include computing systems that provide image display capabilities, such as smartwatches, mobile phones, smartphones, portable computers, tablet PCs, watch phones, car displays, smart glasses, portable multimedia players (PMPs), navigation systems, and ultra-mobile personal computers (UMPCs). Additionally, electronic device 1000 may include at least one of head-mounted displays (HMDs), virtual reality (VR) devices, mixed reality (MR) devices, and augmented reality (AR) devices.

[0183] In an embodiment, such as Figure 18 As shown, the electronic device 1000 can be implemented as a smartphone. In an embodiment, as... Figure 19 As shown, the electronic device 1000 can be implemented as a tablet PC.

[0184] In an embodiment, such as Figure 20 As shown, electronic device 1000 can be applied to smartwatch 2000. Smartwatch 2000 can be a wearable electronic device. For example, smartwatch 2000 can have a structure in which the strap portion 2200 is mounted on the user's wrist. Here, display device 1060 can be applied to display unit 2100, and image data including time information can be provided to the user.

[0185] In an embodiment, such as Figure 21 As shown, the electronic device 1000 can be applied to the automotive display system 3000. Here, the automotive display system 3000 may include a computing system provided inside or outside the vehicle to provide image data.

[0186] For example, the electronic device 1000 can be applied to at least one of the following provided in a vehicle: an infotainment panel 3100, an instrument cluster 3200, a passenger-side display 3300, a head-up display 3400, a side mirror display 3500, and a rear seat display 3600.

[0187] Although this disclosure has been described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments thereof without departing from the scope and spirit of the disclosure as set forth in the appended claims.

Claims

1. A sensing device, wherein, The sensing device includes: A sensor panel includes a plurality of sensors arranged in a matrix in a sensing area and a plurality of sensing lines electrically connected one-to-one to the plurality of sensors, wherein the sensing area includes a first area, a second area, and a third area between the first area and the second area, and wherein the plurality of sensing lines include a first-1 sensing line, a first-2 sensing line, a second-1 sensing line, and a second-2 sensing line. A first sensor driver is electrically connected via the first-1 sensing line to the sensor among the plurality of sensors located in the first region; and The second sensor driver is electrically connected via the second-1 sensing line to the sensor among the plurality of sensors located in the second region. Wherein, the first sensor driver is electrically connected via the first-2 sensing lines to a first subset of the sensors in the third region among the plurality of sensors, and The second sensor driver is electrically connected via the second-2 sensing line to a second subset of the sensors in the third region among the plurality of sensors.

2. The sensing device according to claim 1, wherein, The first sensor driver is electrically disconnected from the sensor in the second region, and The second sensor driver is electrically disconnected from the sensor in the first region.

3. The sensing device according to claim 1, wherein, The first region and the second region are spaced apart from each other in a first direction. The third region includes at least one sensor array, and The sensor array in the at least one sensor array includes sensors arranged along a second direction intersecting the first direction.

4. The sensing device according to claim 3, wherein, The third region includes two of the sensor columns.

5. The sensing device according to claim 3, wherein, The third region includes one of the sensor arrays.

6. The sensing device according to claim 1, wherein, The sensing device further includes: A first multiplexer is electrically connected between the sensor in the first region and the first sensor driver; and A second multiplexer is electrically connected between the sensor in the second region and the second sensor driver. The first multiplexer and the second multiplexer are electrically connected to the first subset and the second subset of the sensors in the third region, respectively.

7. The sensing device according to claim 6, wherein, The first multiplexer is electrically connected to the first sensor driver via multiple pads. The first multiplexer selectively connects a first subset of the sensors in the third region to pads among the plurality of pads, and In this embodiment, the sensor in the first region is not electrically connected to the pad.

8. The sensing device according to claim 7, wherein, The first multiplexer includes: The first transistor is electrically connected between the sensing line and the first driving line among the plurality of sensing lines; The second transistor is electrically connected between the sensing line and the connecting line; A third transistor is electrically connected between the connection line and the pads among the plurality of pads; and The fourth transistor is electrically connected between the connection line and the second drive line.

9. The sensing device according to claim 8, wherein, The pads are provided with a target pulse signal. Wherein, the first drive line is provided with a first drive signal having a phase opposite to the target pulse signal, and The second drive line is provided with a second drive signal having the same phase as the target pulse signal.

10. The sensing device according to claim 1, wherein, The first sensor driver and the second sensor driver obtain one sensing signal for each of the sensors in the first region and the second region, and obtain two sensing signals for each of the sensors in the third region.

11. The sensing device according to claim 10, wherein, The first sensor driver and the second sensor driver sense touch input based on sensing signals received from the sensors in the first region and the second region, and The first sensor driver and the second sensor driver adjust the touch sensitivity based on the sensing signal obtained from the sensor in the third region.

12. The sensing device according to claim 10, wherein, The first region and the second region are spaced apart from each other in a first direction. Wherein, each of the first sensor driver and the second sensor driver sequentially acquires the sensing signal from the plurality of sensors along the first direction, and Wherein, the time points at which the first sensor driver obtains the sensing signal for the sensor in the third region and the time points at which the second sensor driver obtains the sensing signal for the sensor in the third region are different from each other and do not overlap.

13. A sensor panel, wherein, The sensor panel includes: The sensing area includes a first area, a second area, and a third area between the first area and the second area; Multiple sensors are arranged in a matrix in the sensing area; Multiple sensing lines are electrically connected to the multiple sensors one-to-one, wherein the multiple sensing lines include sensing line 1-1, sensing line 1-2, sensing line 2-1, and sensing line 2-2; A first multiplexer is electrically connected via the first-1 sensing line to a sensor among the plurality of sensors located in the first region; and The second multiplexer is electrically connected to the sensor in the second region among the plurality of sensors via the second-1 sensing line.

14. The sensor panel according to claim 13, wherein, The first multiplexer is electrically disconnected from the sensor in the second region, and The second multiplexer is electrically disconnected from the sensor in the first region.

15. The sensor panel according to claim 13, wherein, The first region and the second region are spaced apart from each other in a first direction. The third region includes at least one sensor array, and The sensor array in the at least one sensor array includes sensors arranged along a second direction intersecting the first direction.

16. The sensor panel according to claim 15, wherein, The third region includes two of the sensor columns.

17. The sensor panel according to claim 15, wherein, The third region includes one of the sensor arrays.

18. The sensor panel according to claim 13, wherein, The first multiplexer is electrically connected to multiple pads. The first multiplexer selectively connects a first subset of the sensors in the third region to pads among the plurality of pads, and In this embodiment, the sensor in the first region is not electrically connected to the pad.

19. The sensor panel according to claim 18, wherein, The first multiplexer includes: The first transistor is electrically connected between the sensing line and the first driving line among the plurality of sensing lines; The second transistor is electrically connected between the sensing line and the connecting line; A third transistor is electrically connected between the connection line and the pads among the plurality of pads; and The fourth transistor is electrically connected between the connection line and the second drive line.

20. An electronic device, wherein, The electronic device includes: One or more processors configured to provide input image data; A display device configured to display an image based on the input image; and The power supply is configured to supply power to the display device. The display device includes: The display unit includes a substrate layer and a light-emitting element disposed on the substrate layer; A sensing unit includes multiple sensors and multiple sensing lines. The multiple sensors are disposed on the display unit and arranged in a matrix in a sensing area. The multiple sensing lines are electrically connected one-to-one to the multiple sensors. The sensing area includes a first area, a second area, and a third area between the first area and the second area. The multiple sensing lines include a first-1 sensing line, a first-2 sensing line, a second-1 sensing line, and a second-2 sensing line. A first sensor driver is electrically connected via the first-1 sensing line to the sensor among the plurality of sensors located in the first region; and The second sensor driver is electrically connected via the second-1 sensing line to the sensor among the plurality of sensors located in the second region. Wherein, the first sensor driver is electrically connected via the first-2 sensing lines to a first subset of the sensors in the third region among the plurality of sensors, and The second sensor driver is electrically connected via the second-2 sensing line to a second subset of the sensors in the third region among the plurality of sensors.

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