An electromagnetic interference source positioning method based on IC-level EMC data assets

Abstract

The application discloses a kind of electromagnetic interference source diagnosis positioning methods based on IC level EMC data assets, by constructing read-only interference source positioning database, extracts IC eigenfrequency spectrum characteristics;Obtain measured EMC data for spectrum matching, identify dominant interference source and record the whole diagnosis process, generate structured, traceable diagnostic process data assets;Verification data is stored to user local application knowledge base and generates local correction coefficient.The application realizes accurate diagnosis of interference source, data and assetization of diagnosis process, solves the problem of accurate quantization of multiple interference sources in complex systems, and the diagnosis process is traceable, and the diagnosis idea can be used for reference, to improve EMC diagnosis efficiency.

Description

Technical Field

[0001] This invention belongs to the field of electromagnetic compatibility (EMC) design and testing technology, specifically relating to a method for locating electromagnetic interference sources based on integrated circuit (IC) level EMC data assets. Background Technology

[0002] Electromagnetic interference (EMI) is becoming increasingly prominent in the research and development of electronic products. With the continuous increase in IC integration and operating frequency, the electromagnetic coupling effect between multiple ICs working collaboratively in the same system makes interference source identification extremely difficult. Traditional interference source localization methods mainly rely on near-field scanning, spectrum analysis, or engineer's experience, which have the following shortcomings:

[0003] First, near-field scanning methods require specialized hardware, resulting in high testing costs. Furthermore, they can only locate physical areas on the PCB, making it difficult to correlate the measured spectrum with the intrinsic characteristics of the IC, especially when multiple ICs operate at similar frequencies, making it impossible to distinguish their individual contributions. More importantly, this method only outputs the final location result; the diagnostic process itself is not digitized, failing to provide traceable decision-making basis for diagnosing similar problems in the future. Second, while spectrum analysis methods can obtain interference spectra, they struggle to correlate the measured spectrum with the intrinsic characteristics of specific ICs, particularly when multiple ICs operate at similar frequencies, making it impossible to distinguish their individual contributions. Third, traditional methods lack standardized interference characteristic databases, and diagnostic results rely on engineer experience, potentially leading to different conclusions from different personnel.

[0004] In the prior art, some methods have attempted to locate and diagnose electromagnetic interference (EMC) in integrated circuits (ICs). For example, patent application CN121347953A discloses a multi-dimensional intelligent analysis and diagnosis system for EMC signals of supercomputing optical module chips. This system collects multi-channel EMC data streams, processes them by slicing, and matches them with a fault template library to identify fault modes and locate physical channels. However, this method relies on a pre-built fault template library and does not involve locating EMC from IC-level EMC data assets (such as intrinsic data and extended layer quantization contribution values), and lacks pre-judgment capabilities during the design phase. Patent application CN115047270A discloses a monitoring auxiliary device and method for EMC testing of integrated circuits. It identifies IC types and test items through adaptive learning, but its main focus is on monitoring assistance during the testing process, without addressing interference source location. Patent application CN119227467A relates to an EMC suppression method and system for chips. It identifies interference and generates suppression strategies through simulation modeling, but it relies on complex simulations and does not utilize IC intrinsic data.

[0005] In summary, existing technologies lack a method to locate interference sources by starting from IC-level EMC data assets and utilizing the intrinsic spectral characteristics of ICs. Furthermore, it is even more difficult to predict potential interference sources during the design phase or accurately locate specific ICs during the testing phase. Summary of the Invention

[0006] The purpose of this invention is to provide an electromagnetic interference source diagnosis and localization method based on IC-level EMC data assets, which solves the problems in the prior art of difficulty in accurately locating interference sources, inability to distinguish contributions from multiple ICs, and non-data-driven diagnostic processes that prevent the reuse of experience. This method can provide interference prediction before design and generate traceable diagnostic process data assets after testing.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A method for diagnosing and locating electromagnetic interference sources based on IC-level EMC data assets includes the following:

[0009] Interference source localization database construction: For the target system, the baseline test data, baseline simulation data and extended layer test data and extended layer simulation data of each IC under each design variable are obtained from the IC-level EMC data assets. The intrinsic spectrum characteristics of each IC are extracted to construct a read-only interference source localization database.

[0010] Interference source diagnosis and analysis: Obtain the measured EMC data of the system to be analyzed, retrieve the intrinsic spectrum characteristics of the corresponding IC from the interference source location database, calculate the matching degree between the measured spectrum and the intrinsic spectrum of each IC through the spectrum matching algorithm, identify the dominant interference source and its contribution ratio; record the matching degree change curve, threshold selection basis, matching history of each candidate IC and intermediate results of each iteration during the diagnosis process;

[0011] Diagnostic process data asset generation: Based on the entire process of the interference source diagnosis and analysis, generate structured diagnostic process data assets with multi-dimensional searchable tags. These diagnostic process data assets include at least:

[0012] Diagnostic results layer: IC model, function type, contribution percentage, and confidence level of the dominant interference source;

[0013] Diagnostic process layer: matching degree change trajectory, candidate IC ranking history, similarity score for each match, threshold decision point, and coupling coefficient correction record;

[0014] Context layer: system layout parameters, measured spectrum characteristics, associated IC-level data asset identifiers, and diagnostic timestamps;

[0015] Traceable chain: the causes and consequences of each diagnostic step, the confidence assessment of intermediate results, and the traceable decision-making path;

[0016] The diagnostic process data assets serve as callable data assets for subsequent EMC design processes.

[0017] Furthermore, the construction of the interference source localization database further includes:

[0018] Baseline data acquisition: Obtain baseline test data and baseline simulation data of the target IC from IC-level EMC data assets. The baseline test data reflects the EMC characteristics of the IC under intrinsic operating conditions, and the baseline simulation data is simulation model data calibrated with the baseline test data.

[0019] Extended data acquisition: Obtain extended layer test data and extended layer simulation data of the IC in at least one extended dimension from IC-level EMC data assets. The extended layer data reflects the impact of changes in a single design variable on EMC performance.

[0020] Quantitative analysis: Obtain the quantitative contribution value of each design variable change stored in the IC-level EMC data asset. The quantitative contribution value includes at least one of the following: change relative to the benchmark, influence coefficient of continuous variables, and comprehensive effect value of measures.

[0021] Furthermore, the interference source diagnostic analysis includes two application modes:

[0022] Design prediction mode: During the PCB design stage, based on the list of ICs to be selected, the intrinsic spectrum characteristics of each IC are retrieved from the interference source location database to simulate the electromagnetic interference distribution under different IC combinations and layouts, and to predict potential interference sources.

[0023] Diagnostic mode: During the product testing phase, the measured EMC data is obtained, and after correcting the measured spectrum with the IC's intrinsic spectrum, the specific interference source and its contribution ratio are matched.

[0024] Furthermore, in diagnostic mode, the interference source diagnostic analysis further includes:

[0025] Obtain the layout parameters of the current PCB, including at least one of IC position, trace length, and reference layer integrity;

[0026] The measured EMC data is corrected based on the layout parameters to generate a corrected measured spectrum that matches the actual layout.

[0027] The corrected measured spectrum is matched with the intrinsic spectrum of each IC, and the matching degree is calculated.

[0028] Furthermore, the matching degree calculation adopts a spectrum correlation algorithm or a contribution decomposition algorithm. The contribution decomposition algorithm separates the interference contribution ratio when multiple ICs work simultaneously based on the quantized contribution value and coupling coefficient of each IC.

[0029] Furthermore, the method also includes location effectiveness verification and local knowledge accumulation:

[0030] Record EMC test data after the actual corrective measures are implemented;

[0031] The actual test data is compared with the interference source diagnosis results to calculate the positioning error;

[0032] When the positioning error exceeds a preset threshold, the actual test data, layout parameters and positioning error are associated and stored in the user's local application knowledge base for reuse of local experience in subsequent design references.

[0033] The user's local application knowledge base is independent of the interference source location database and does not modify the original data in the interference source location database.

[0034] Furthermore, it also includes the generation and application of local correction coefficients:

[0035] Based on historical verification data in the user's local application knowledge base, local correction coefficients are statistically generated for specific application scenarios.

[0036] In subsequent interference source diagnosis and analysis, the local correction coefficients can be optionally applied to perform secondary optimization of the matching algorithm or spectrum correction.

[0037] The local correction coefficients are stored only in the user's local application knowledge base and do not affect the original data in the interference source location database.

[0038] Furthermore, the interference source localization database has a hierarchical structure and includes at least:

[0039] The IC basic information layer stores the identification information, functional classification, and packaging type of the target IC;

[0040] The reference data layer stores the reference layer test data and reference layer simulation data of the target IC;

[0041] An extended data layer stores extended layer test data and extended layer simulation data in at least one extended dimension.

[0042] The quantification contribution layer stores the quantified contribution values ​​of the design variable changes to EMC performance;

[0043] The intrinsic spectrum layer stores the intrinsic spectrum characteristics of the IC extracted based on baseline and extended data.

[0044] This invention also provides an electromagnetic interference source localization system based on IC-level EMC data assets, comprising:

[0045] The IC-level EMC data asset interface is used to obtain IC baseline test data, baseline simulation data, extended layer test data, and extended layer simulation data from locally stored IC-level EMC data assets.

[0046] The interference source localization database is constructed based on the data obtained from the IC-level EMC data asset interface, and stores the read-only intrinsic spectrum characteristics and quantized contribution values ​​of multiple ICs.

[0047] The data acquisition module is used to acquire the measured EMC data of the system to be analyzed and the current PCB layout parameters;

[0048] The diagnostic analysis module is used to retrieve the intrinsic spectrum characteristics of the corresponding IC from the interference source location database, correct the measured spectrum in combination with the layout parameters, calculate the matching degree through the spectrum matching algorithm, identify the dominant interference source and its contribution ratio, and record the matching degree change curve, threshold selection basis, matching history of each candidate IC and intermediate results of each iteration during the diagnostic process.

[0049] The diagnostic data asset generation module is used to generate structured diagnostic process data assets with multi-dimensional searchable tags based on the entire process of the diagnostic analysis of the interference source.

[0050] The output module is used to output the diagnostic process data assets.

[0051] Furthermore, in diagnostic mode, the system also includes:

[0052] The verification feedback module is used to record EMC test data after actual rectification measures are implemented, compare it with the diagnostic results, and store the verification data in the user's local application knowledge base.

[0053] The local correction module is used to generate local correction coefficients based on historical verification data in the user's local application knowledge base, and can be optionally applied in subsequent diagnostic analysis.

[0054] The beneficial effects of this invention are:

[0055] First, based on the intrinsic spectrum characteristics in IC-level EMC data assets, this invention achieves accurate diagnosis and location of electromagnetic interference sources, transforming interference identification from "experience-based guessing" to "data matching," and generating traceable and reusable diagnostic process data assets. This allows for the prediction of potential interference before design and provides a complete record of the diagnostic process after testing.

[0056] Secondly, by introducing a layout parameter correction mechanism, this invention solves the problem of matching deviation between the measured spectrum and the intrinsic spectrum of the IC caused by layout differences, effectively improving the accuracy of positioning in diagnostic mode.

[0057] Third, the contribution decomposition algorithm of this invention combines quantized contribution value and coupling coefficient to separate the interference contribution ratio when multiple ICs work simultaneously, solving the industry problem of indistinguishable co-frequency interference.

[0058] Fourth, by constructing a user-local application knowledge base and local correction coefficients, this invention enables users to accumulate local location verification data, achieve self-growth of interference diagnosis knowledge, and not affect the original data assets, thus protecting the commercial value of the data assets.

[0059] Fifth, this invention can be integrated into intelligent EMC design aids, providing engineers with real-time interference source location and diagnostic data assets, significantly improving EMC diagnostic efficiency and reducing R&D costs. Attached Figure Description

[0060] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0061] Figure 1 This is a flowchart of the method of the present invention.

[0062] Figure 2 This is a schematic diagram of the interference source localization database structure of the present invention.

[0063] Figure 3 This is a flowchart (diagnostic mode) of the interference source diagnosis and analysis of the present invention.

[0064] Figure 4 This is a schematic diagram of the contribution decomposition of the present invention.

[0065] Figure 5 This is a flowchart of the positioning effect verification and feedback process of the present invention. Detailed Implementation

[0066] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0067] The overall process of this invention includes: S1 Constructing a read-only interference source location database based on IC-level EMC data assets; S2 Obtaining the measured EMC data of the system to be analyzed and the current PCB layout parameters, and selecting a design mode or a diagnostic mode according to the application scenario; S3 Retrieving the intrinsic spectrum characteristics of the corresponding IC from the interference source location database; In design mode, directly proceeding to S5 to simulate interference distribution; In diagnostic mode, S4 Obtaining the current PCB layout parameters and correcting the measured spectrum; S5 Performing spectrum matching and interference source diagnosis; S6 Recording the matching degree change curve, threshold selection basis, matching history of each candidate IC, and intermediate results of each iteration during the diagnostic process; S7 Generating structured diagnostic process data assets with multi-dimensional searchable tags based on the entire diagnostic process; S8 Outputting the diagnostic process data assets; S9 Actual rectification verification, storing the verification data in the user's local application knowledge base.

[0068]

Example 1

[0069] This embodiment uses a flight control system for a certain type of UAV as an example to illustrate the application of the present invention in the design mode. The system includes three different types of integrated circuits: a power management IC, a clock IC, and a digital control IC. The PCB layout has not yet been completed, and potential interference sources need to be anticipated to guide the early design phase.

[0070] First, an interference source localization database was constructed. Intrinsic spectral characteristics of three ICs were obtained from IC-level EMC data assets:

[0071] IC1-1 (Power Management IC, model PWR-001, operating frequency 1.8MHz): Radiated peak at fundamental frequency 1.8MHz is 42dBμV / m, second harmonic at 3.6MHz is 38dBμV / m, and third harmonic at 5.4MHz is 35dBμV / m.

[0072] IC1-2 (clock IC, model CLK-002, operating frequency 50MHz): radiated peak at fundamental frequency 50MHz is 55dBμV / m, second harmonic at 100MHz is 48dBμV / m, and third harmonic at 150MHz is 45dBμV / m.

[0073] IC1-3 (Digital Control IC, Model DSP-003, Operating Frequency 200MHz): The radiation peak at the fundamental frequency of 200MHz is 52dBμV / m, with no significant harmonics.

[0074] Organize this data into a read-only interference source location database.

[0075] Engineers want to assess the interference risk of the selected IC combination in advance to optimize the layout. The system receives a list of ICs (IC1-1, IC1-2, IC1-3), selects a design mode, retrieves the intrinsic spectrum characteristics of the three ICs, simulates interference coupling under different layouts, and generates the following prediction report:

[0076] "The 1.8MHz baseband of IC1-1 does not directly overlap with the operating frequency of IC1-3, but its 5.4MHz third harmonic may not affect the 50MHz baseband of IC1-2. Attention should be paid to the interference of power supply ripple on analog circuits. The 50MHz baseband radiation intensity of IC1-2 is relatively high (55dBμV / m). If it is placed close to the RF receiving circuit, it may cause a decrease in receiving sensitivity. It is recommended to keep IC1-2 away from the RF area or add local shielding. The 200MHz baseband radiation of IC1-3 is relatively strong. It is recommended to place it on the edge of the PCB and add grounding vias to reduce the impact on sensitive circuits on the board."

[0077] Based on the prediction, the engineer adjusted the IC layout: moved IC1-2 away from the RF area, placed IC1-3 on the side of the board and added a grounding via, and reserved a position for a filter capacitor at the output of IC1-1.

[0078] This embodiment demonstrates the value of design patterns in predicting potential interference sources in multi-IC systems before design, providing quantitative basis for layout optimization, and reducing the risk of later rectification from the source.

[0079]

Example 2

[0080] This embodiment uses a certain model of industrial Ethernet switch as an example to illustrate the application of the present invention in accurate identification of a single interference source in diagnostic mode. The device was found to have excessive radiated emissions at a frequency of 100MHz during electromagnetic compatibility testing.

[0081] The ICs that may generate 100MHz radiation in the system include: IC2-1 (Ethernet PHY chip, model PHY-100M, operating frequency 100MHz), IC2-2 (system clock, model CLK-50M, operating frequency 50MHz, its second harmonic is 100MHz), and IC2-3 (power management IC, model PWR-1M8, operating frequency 1.8MHz, but its high-frequency harmonic energy is low).

[0082] The system acquires measured EMC data (58 dBμV / m at 100 MHz) and retrieves the intrinsic spectrum characteristics of the relevant IC from the interference source localization database.

[0083] IC2-1: The intrinsic radiative value at 100MHz is 55dBμV / m;

[0084] IC2-2: The intrinsic radiative value at 50MHz is 48dBμV / m, and the value at 100MHz harmonics is 42dBμV / m;

[0085] IC2-3: The intrinsic radiation value at 1.8MHz is 40dBμV / m, and there is no significant harmonic energy at 100MHz.

[0086] The matching degree between the measured spectrum and the intrinsic spectrum of each IC was calculated by the spectrum matching algorithm. The results showed that the matching degree of IC2-1 was 92%, the matching degree of IC2-2 was 35%, and the matching degree of IC2-3 was less than 5%.

[0087] The system further obtains the current PCB layout parameters: IC2-1 is 5mm from the PCB edge, and the reference layer is intact; IC2-2 is 8mm from IC2-1, and there is spatial coupling between the two. Based on the layout parameters, the matching results are corrected, and the corrected matching degree after considering the coupling coefficient is: 88% for IC2-1 and 45% for IC2-2.

[0088] The analysis concluded that "the dominant interference source is IC2-1, contributing approximately 85%; IC2-2 contributes approximately 15% through spatial coupling. It is recommended to add a ferrite bead to the power supply pin of IC2-1, or adjust the layout of IC2-2 to reduce coupling."

[0089] The engineers adopted the suggestion to add a ferrite bead to the power pin of IC2-1, and the measured 100MHz radiation dropped to 51dBμV / m, close to the limit requirement. The system stores the actual test data, layout parameters, and positioning results in the user's local application knowledge base for future experience reuse. Simultaneously, the system generates diagnostic process data assets based on the entire diagnostic process, including matching degree change curves, threshold decision points, matching history of each candidate IC, and contribution decomposition process, for reference in the diagnosis of similar systems in the future.

[0090] This embodiment demonstrates the value of accurately identifying a single interference source in diagnostic mode, avoiding blindly modifying all ICs in the system and improving diagnostic efficiency.

[0091]

Example 3

[0092] This embodiment uses a certain type of multiprocessor system as an example to illustrate the application of the present invention in decomposing the contribution of multiple interference sources in diagnostic mode. The system includes three ICs: a main processor, a coprocessor, and a clock IC. An abnormal radiation was found at a frequency of 400MHz during testing, but all three ICs could generate this frequency component.

[0093] The operating frequencies of the three ICs in the system are as follows:

[0094] IC3-1 (Main Processor): Operating frequency 400MHz;

[0095] IC3-2 (coprocessor): Operating frequency 200MHz (second harmonic is 400MHz);

[0096] IC3-3 (Clock IC): Operating frequency 100MHz (fourth harmonic is 400MHz).

[0097] Traditional spectrum analysis can only show a peak at 400MHz and cannot distinguish the contribution percentage of each of the three ICs.

[0098] The system acquires measured EMC data (65dBμV / m at 400MHz) and retrieves the intrinsic spectrum characteristics of the three ICs from the interference source localization database:

[0099] IC3-1: The intrinsic radiative value at 400MHz is 62dBμV / m;

[0100] IC3-2: The intrinsic radiative value at 200MHz is 54dBμV / m, and the value at 400MHz harmonics is 50dBμV / m;

[0101] IC3-3: The intrinsic radiative value at 100MHz is 48dBμV / m, and at the fourth harmonic of 400MHz it is 45dBμV / m.

[0102] The system further obtains the current PCB layout parameters: the three ICs are arranged in a triangle, with a spacing of 10mm between each other, indicating significant spatial coupling. Simultaneously, the system retrieves the coupling coefficient matrix between the ICs from a pre-built system-level EMC data asset.

[0103] By applying a contribution decomposition algorithm, combining intrinsic spectral characteristics and coupling coefficient matrix, the actual contribution percentage of each IC in the system is calculated:

[0104] When IC3-1 operates alone, its radiation at 400MHz is 62dBμV / m. Considering a coupling coefficient of 0.95, its actual contribution to the system is 59dBμV / m, accounting for approximately 72%.

[0105] When IC3-2 operates alone, its radiation at 400MHz is 50dBμV / m. Considering the coupling coefficient of 0.3 with IC3-1, the actual contribution is approximately 48dBμV / m, accounting for about 18%.

[0106] When IC3-3 operates alone, its radiation at 400MHz is 45dBμV / m. After considering coupling, the actual contribution is about 44dBμV / m, accounting for about 10%.

[0107] The analysis concluded that "the interference at the 400MHz frequency point mainly comes from IC3-1, contributing 72%; IC3-2 contributes 18%, and IC3-3 contributes 10%. It is recommended to add a local shielding cover to IC3-1, or adjust the layout spacing of the three ICs to reduce mutual coupling."

[0108] The engineers adopted the suggestions, adding a partial shielding cover to IC3-1 and adjusting the layout of IC3-2 to increase the spacing. After the rectification, the measured 400MHz radiation decreased to 52dBμV / m, close to the predicted value. The system stores the actual test data, contribution decomposition results, and layout parameters in the user's local application knowledge base and updates the local correction coefficients to optimize the accuracy of subsequent multi-interference source decomposition. Simultaneously, the system generates diagnostic process data assets based on the entire process of this multi-interference source decomposition, recording in detail the input parameters of the contribution decomposition algorithm, coupling coefficient matrix, intermediate calculation results, and final contribution ratio, providing traceable data support for the diagnosis of co-frequency interference in subsequent complex systems.

[0109] This embodiment demonstrates the value of decomposing the contribution of multiple interference sources in diagnostic mode, solving the industry problem of indistinguishable co-frequency interference, and providing a quantitative basis for EMC optimization of complex systems.

[0110] Application Examples

[0111] 1. Interference risk prediction during the design phase

[0112] During the product design phase, engineers can utilize the method of this invention to predict potential interference sources and their intensity based on a list of ICs to be selected, under different IC combinations and layouts. Specifically, engineers input the IC models planned for use in the system, and the system retrieves the intrinsic spectrum characteristics of each IC from the interference source location database to analyze whether there is frequency overlap, harmonic interference, or strong radiation sources. By simulating interference coupling under different layout schemes, the system can output a quantitative interference risk prediction report, guiding engineers to optimize IC selection and layout during the schematic design and PCB layout phases, reducing the probability of interference from the source. For example, when it is found that the baseband of a clock IC overlaps with the operating frequency band of the RF receiving circuit, the IC can be moved away from the RF area or shielding measures can be added during the design phase to avoid wasting time and costs on later rectification.

[0113] 2. Integration of Intelligent EMC Design-Aided Instruments

[0114] This invention can be integrated into intelligent EMC design aids. After the instrument acquires measured EMC data of the device under test (DUT) through its self-test function, it automatically invokes this method to retrieve the intrinsic spectral characteristics of the corresponding IC from its built-in interference source location database. Combined with the current PCB layout parameters, it performs spectrum matching and contribution decomposition. The instrument outputs an interference source location report in a visual format, including the dominant interference source IC model, a pie chart of each IC's contribution percentage, a spectrum matching curve, and optimization / rectification suggestions. Engineers can quickly pinpoint the interference source based on the location report and implement precise rectification, avoiding blindly processing all ICs in the system and significantly improving EMC diagnostic efficiency.

[0115] 3. Diagnosis of multiple interference sources in complex systems

[0116] In complex electronic systems containing dozens of ICs (such as server motherboards, base station equipment, and drone flight control systems), this invention can quickly locate the dominant interference source and its contribution percentage, providing a quantitative basis for system-level EMC optimization. For example, in the electromagnetic compatibility test of a 5G base station device, radiation exceeding the standard in a specific communication frequency band was found. The system used this method to identify the three ICs that contributed the most to the interference and quantified their respective contribution percentages. Engineers then took targeted protective measures for the dominant IC (such as partial shielding and power supply filtering), while not taking additional measures for ICs with smaller contributions, achieving a balance between precise protection and cost control. This method solves the problem of difficulty in locating interference sources and lack of quantitative basis for remedial measures in complex systems, significantly improving the EMC design efficiency of complex systems.

[0117] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for diagnosing and locating electromagnetic interference sources based on IC-level EMC data assets, characterized in that, Including the following: Interference source localization database construction: For the target system, the baseline test data, baseline simulation data and extended layer test data and extended layer simulation data of each IC under each design variable are obtained from the IC-level EMC data assets. The intrinsic spectrum characteristics of each IC are extracted to construct a read-only interference source localization database. Interference source diagnosis and analysis: Obtain the measured EMC data of the system to be analyzed, retrieve the intrinsic spectrum characteristics of the corresponding IC from the interference source location database, calculate the matching degree between the measured spectrum and the intrinsic spectrum of each IC through the spectrum matching algorithm, identify the dominant interference source and its contribution ratio; record the matching degree change curve, threshold selection basis, matching history of each candidate IC and intermediate results of each iteration during the diagnosis process; Diagnostic process data asset generation: Based on the entire process of the interference source diagnosis and analysis, generate structured diagnostic process data assets with multi-dimensional searchable tags. These diagnostic process data assets include at least: Diagnostic results layer: IC model, function type, contribution percentage, and confidence level of the dominant interference source; Diagnostic process layer: matching degree change trajectory, candidate IC ranking history, similarity score for each match, threshold decision point, and coupling coefficient correction record; Context layer: system layout parameters, measured spectrum characteristics, associated IC-level data asset identifiers, and diagnostic timestamps; Traceable chain: the causes and consequences of each diagnostic step, the confidence assessment of intermediate results, and the traceable decision-making path; The diagnostic process data assets serve as callable data assets for subsequent EMC design processes.

2. The method according to claim 1, characterized in that, The construction of the interference source localization database further includes: Baseline data acquisition: Obtain baseline test data and baseline simulation data of the target IC from IC-level EMC data assets. The baseline test data reflects the EMC characteristics of the IC under intrinsic operating conditions, and the baseline simulation data is simulation model data calibrated with the baseline test data. Extended data acquisition: Obtain extended layer test data and extended layer simulation data of the IC in at least one extended dimension from IC-level EMC data assets. The extended layer data reflects the impact of changes in a single design variable on EMC performance. Quantitative analysis: Obtain the quantitative contribution value of each design variable change stored in the IC-level EMC data asset. The quantitative contribution value includes at least one of the following: change relative to the benchmark, influence coefficient of continuous variables, and comprehensive effect value of measures.

3. The method according to claim 1, characterized in that, The interference source diagnostic analysis further includes: Diagnostic mode: During the product testing phase, the measured EMC data is obtained, and after correcting the measured spectrum with the IC's intrinsic spectrum, the specific interference source and its contribution ratio are matched.

4. The method according to claim 1, characterized in that, It also includes an optional design prediction mode: Design prediction mode: During the PCB design stage, based on the list of ICs to be selected, the intrinsic spectrum characteristics of each IC are retrieved from the interference source location database to simulate the electromagnetic interference distribution under different IC combinations and layouts, and to predict potential interference sources.

5. The method according to claim 3, characterized in that, In diagnostic mode, the interference source diagnostic analysis further includes: Obtain the layout parameters of the current PCB, including at least one of IC position, trace length, and reference layer integrity; The measured EMC data is corrected based on the layout parameters to generate a corrected measured spectrum that matches the actual layout. The corrected measured spectrum is matched with the intrinsic spectrum of each IC, and the matching degree is calculated.

6. The method according to claim 5, characterized in that, The matching degree calculation adopts a spectrum correlation algorithm or a contribution decomposition algorithm. The contribution decomposition algorithm separates the interference contribution ratio when multiple ICs work simultaneously based on the quantized contribution value and coupling coefficient of each IC.

7. The method according to claim 1, characterized in that, It also includes location effectiveness verification and local knowledge accumulation: Record EMC test data after the actual corrective measures are implemented; The actual test data is compared with the interference source diagnosis results to calculate the positioning error; When the positioning error exceeds a preset threshold, the actual test data, layout parameters and positioning error are associated and stored in the user's local application knowledge base for reuse of local experience in subsequent design references.

8. The method according to claim 7, characterized in that, It also includes the generation and application of local correction factors: Based on historical verification data in the user's local application knowledge base, local correction coefficients are statistically generated for specific application scenarios. In subsequent interference source diagnosis and analysis, the local correction coefficients can be optionally applied to perform secondary optimization of the matching algorithm or spectrum correction. The local correction coefficients are stored only in the user's local application knowledge base and do not affect the original data in the interference source location database.

9. The method according to claim 1, characterized in that, The interference source localization database has a hierarchical structure and includes at least: The IC basic information layer stores the identification information, functional classification, and packaging type of the target IC; The reference data layer stores the reference layer test data and reference layer simulation data of the target IC; An extended data layer stores extended layer test data and extended layer simulation data in at least one extended dimension. The quantification contribution layer stores the quantified contribution values ​​of the design variable changes to EMC performance; The intrinsic spectrum layer stores the intrinsic spectrum characteristics of the IC extracted based on baseline and extended data.

10. An electromagnetic interference source localization system based on IC-level EMC data assets, characterized in that, include: The IC-level EMC data asset interface is used to obtain IC baseline test data, baseline simulation data, extended layer test data, and extended layer simulation data from locally stored IC-level EMC data assets. The interference source localization database is constructed based on the data obtained from the IC-level EMC data asset interface, and stores the read-only intrinsic spectrum characteristics and quantized contribution values ​​of multiple ICs. The data acquisition module is used to acquire the measured EMC data of the system to be analyzed and the current PCB layout parameters; The diagnostic analysis module is used to retrieve the intrinsic spectrum characteristics of the corresponding IC from the interference source location database, correct the measured spectrum in combination with the layout parameters, calculate the matching degree through the spectrum matching algorithm, identify the dominant interference source and its contribution ratio, and record the matching degree change curve, threshold selection basis, matching history of each candidate IC and intermediate results of each iteration during the diagnostic process. The output module is used to output the diagnostic process data assets.

11. The system according to claim 10, characterized in that, Also includes: The verification feedback module is used to record EMC test data after actual rectification measures are implemented, compare it with the diagnostic results, and store the verification data in the user's local application knowledge base. The local correction module is used to generate local correction coefficients based on historical verification data in the user's local application knowledge base, and can be optionally applied in subsequent diagnostic analysis.

12. The method according to claim 1, characterized in that, The spectrum matching algorithm includes spectrum similarity calculation, feature peak matching, or pattern recognition based on neural networks.

13. The method according to claim 6, characterized in that, The contribution decomposition algorithm is based on the inter-IC coupling coefficient matrix and separates the contribution ratio of each IC through decoupling calculation.

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