Battery signal acquisition structure and manufacturing method thereof, battery pack and vehicle

By using a hot-press connection between the flexible circuit body, acquisition components, and busbars and the fixed membrane, the problem of complex assembly of the battery signal acquisition structure is solved, achieving high integration and simplified assembly.

CN122158764APending Publication Date: 2026-06-05ZHEJIANG LEAPENERGY TECH CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG LEAPENERGY TECH CO LTD
Filing Date
2026-04-20
Publication Date
2026-06-05

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Abstract

The application discloses a battery signal acquisition structure and a manufacturing method thereof, a battery pack and a vehicle, and belongs to the technical field of batteries. The battery signal acquisition structure comprises a flexible circuit main body extending along a first direction, a plurality of acquisition components connected with the flexible circuit main body and extending along a second direction, a plurality of busbars arranged on one side of the flexible circuit main body along the second direction and connected with the acquisition components, and a fixing film. Along a third direction, the flexible circuit main body, the plurality of acquisition components and the plurality of busbars are arranged on the same side of the fixing film and are in thermal pressure connection with the fixing film. The flexible circuit main body comprises at least two circuit layers arranged in a stack along the third direction, and the acquisition component comprises a first connecting portion, an expansion portion and a second connecting portion. The application also discloses a corresponding manufacturing method. The above scheme is beneficial to improving the integration of related components, simplifying the assembly relationship and improving the structural arrangement.
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Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a battery signal acquisition structure and its manufacturing method, a battery pack, and a vehicle. Background Technology

[0002] Battery signal acquisition structures are commonly used in power battery modules or battery packs to collect signals such as voltage and temperature related to the battery cells and transmit these signals to the management system. A typical battery signal acquisition structure includes a main circuit body, acquisition components, a busbar, and a tray for supporting and positioning related components. The main circuit body connects to the acquisition components, which in turn connect to the busbar. The tray provides assembly support and positional stability for the main circuit body, acquisition components, and busbar. The tray is usually positioned as an independent support on one side of the main circuit body, acquisition components, and busbar. During assembly, related components need to be positioned and aligned with the tray before being connected to each other.

[0003] However, when the number of collection points is large and the structure is relatively compact, the introduction of the tray can easily increase the assembly relationship of the battery signal acquisition structure, affect the overall integration, and make the arrangement and assembly process of related components more complicated. Summary of the Invention

[0004] Objectives of this invention: This application provides a battery signal acquisition structure to solve the technical problem of complex assembly process in the prior art; another objective of this application is to provide a battery pack; another objective of this application is to provide a vehicle; yet another objective of this application is to provide a method for manufacturing the battery signal acquisition structure.

[0005] The present application provides a battery signal acquisition structure, comprising: a flexible circuit body extending along a first direction; multiple acquisition components connected to the flexible circuit body and extending along a second direction; multiple busbars disposed on one side of the flexible circuit body along the second direction and connected to the end of the acquisition component away from the flexible circuit body; and a fixed membrane disposed on the same side of the fixed membrane along a third direction and hot-pressed to the fixed membrane; wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0006] In some embodiments, the flexible circuit body includes at least two circuit layers, which are stacked along the third direction. Each circuit layer includes a cable and an insulating film. The insulating film is connected to the side of the cable away from the fixed film. A portion of the acquisition component is disposed between the insulating film and the cable and is electrically connected to the cable.

[0007] In some embodiments, the cable includes a plurality of conductors, a first protective film and a second protective film, the plurality of conductors being spaced apart along the second direction, the first protective film being connected to the side of the conductors close to the fixed film, the second protective film being connected to the side of the conductors away from the fixed film, the second protective film having a connection hole, and the acquisition component and the conductors being connected through the connection hole.

[0008] In some embodiments, the flexible circuit body further includes a connector, the cable is connected to the connector, the cable has a plurality of cut-off holes, the cut-off holes are correspondingly disposed with respect to the acquisition components, the cut-off holes are used to cut off the conductor connected to the corresponding acquisition component, and the cut-off holes are located on the side of the corresponding acquisition component away from the connector.

[0009] In some embodiments, the acquisition component includes a first connecting portion, a telescopic portion and a second connecting portion along the second direction, the telescopic portion being connected between the first connecting portion and the second connecting portion, and the first connecting portion being connected to the flexible line body.

[0010] In some embodiments, the telescopic portion has a first side and a second side, the first side and the second side being opposite to each other along the first direction; the telescopic portion has a first weak portion and a second weak portion, the first weak portion and the second weak portion being alternately spaced along the second direction; the first weak portion includes a first gap and a first notch, the first gap extending along the first direction and being spaced apart from the first side and the second side respectively, the first notch being disposed on the first side, the first notch being located on one side of the first gap along the first direction; the second weak portion includes a second gap and a second notch, the second gap extending along the first direction and being spaced apart from the first side and the second side respectively, the second notch being disposed on the second side, the second notch being located on one side of the second gap along the first direction.

[0011] In some embodiments, the fixing membrane is provided with a clearance hole through the third direction, and the orthographic projection of the telescopic part along the third direction falls within the clearance hole.

[0012] In some embodiments, a portion of the plurality of acquisition components is a temperature acquisition component and another portion is a voltage acquisition component. The second connection portion of the temperature acquisition component is connected to a temperature sensor, and the second connection portion of the voltage acquisition component is connected to the busbar.

[0013] Accordingly, this application also provides a battery pack, including a battery signal acquisition structure as described in any of the above embodiments.

[0014] Accordingly, this application also provides a vehicle including a battery signal acquisition structure as described in any of the above embodiments or a battery pack as described in the above embodiments.

[0015] Accordingly, this application also provides a method for manufacturing a battery signal acquisition structure, comprising: continuously conveying a plurality of third protective films; continuously conveying a plurality of conductive sheets; adjusting the relative conveying speed between the plurality of third protective films and the plurality of conductive sheets according to a first target spacing between two adjacent conductive sheets in the same acquisition component and a second target spacing between two adjacent conductive sheets between two adjacent acquisition components, so that the plurality of conductive sheets are attached to the plurality of third protective films at a preset spacing.

[0016] In some embodiments, the method for manufacturing the battery signal acquisition structure further includes: cutting the raw material of the third protective film to form a plurality of the third protective films; cutting the raw material of the conductive sheet to form a plurality of the conductive sheets; and baking the bonded third protective film and the plurality of conductive sheets.

[0017] In some embodiments, the method for manufacturing the battery signal acquisition structure further includes: welding the connecting cable and the acquisition component; connecting an insulating film to the side of the acquisition component away from the cable; and placing the connector and the cable into a tooling for pressing and forming.

[0018] In some embodiments, the method for manufacturing the battery signal acquisition structure further includes: welding the busbar and the acquisition component together; placing the busbar, the acquisition component, and the flexible circuit body on the same side of the fixed membrane; and bonding and hot-pressing the busbar, the acquisition component, the flexible circuit body, and the fixed membrane together.

[0019] Beneficial Effects: Compared with the prior art, the battery signal acquisition structure, vehicle, and manufacturing method of the battery signal acquisition structure provided in this application include: a flexible circuit body, multiple acquisition components, multiple busbars, and a fixing film. This application, by placing the flexible circuit body, multiple acquisition components, and multiple busbars on the same side of the fixing film and hot-pressing them together, can replace the tray for supporting and positioning related components, thereby reducing assembly relationships and improving overall integration. Simultaneously, this application, by establishing a connection between the circuit body and the acquisition components and connecting the acquisition components to the busbars, can form a structural foundation for signal acquisition and transmission. Furthermore, by employing a continuous bonding method between a third protective film and a conductive sheet in the manufacturing method, this application can achieve continuous molding of the acquisition components, which is beneficial for improving the continuity and consistency of the manufacturing process. Correspondingly, vehicles using the above-described battery signal acquisition structure also have corresponding application effects. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0022] Figure 1 This is a schematic diagram of the battery signal acquisition structure provided in an exemplary embodiment of this disclosure; Figure 2 This is a top view of the battery signal acquisition structure provided in an exemplary embodiment of this disclosure; Figure 3 yes Figure 2 Sectional view at point AA; Figure 4 yes Figure 3 Detailed view of section B in the middle frame; Figure 5 This is a schematic diagram of the battery signal acquisition structure provided in an exemplary embodiment of this disclosure after removing an insulating film. Figure 6 yes Figure 5 Detailed view of point C in the middle circle; Figure 7 This is a schematic diagram of the battery signal acquisition structure provided in the exemplary embodiment of this disclosure after removing one insulating film and one second protective film; Figure 8 yes Figure 7 Detailed view of point D in the middle circle; Figure 9 This is a flowchart illustrating the fabrication method of the battery signal acquisition structure provided in an exemplary embodiment of this disclosure; Figure 10 This is a flowchart illustrating the fabrication method of the battery signal acquisition structure provided in an exemplary embodiment of this disclosure; Figure 11 This is a flowchart illustrating the fabrication method of the battery signal acquisition structure provided in an exemplary embodiment of this disclosure; Figure 12 This is a flowchart illustrating the fabrication method of the battery signal acquisition structure provided in an exemplary embodiment of this disclosure.

[0023] Explanation of reference numerals in the attached figures: 100 - Flexible circuit body; 110 - Circuit layer; 111 - Cable; 112 - Insulating film; 113 - Conductor; 114 - First protective film; 115 - Second protective film; 116 - Connection hole; 117 - Cut-off hole; 120 - Connector; 200 - Acquisition component; 210 - First connection part; 220 - Telescopic part; 221 - First side; 222 - Second side; 223 - First weak part; 224 - First gap; 225 - ... 1. Through hole; 226-First notch; 227-Second weak point; 228-Second gap; 229-Second through hole; 230-Second notch; 240-Second connection; 250-Temperature acquisition component; 251-Temperature sensor; 260-Voltage acquisition component; 300-Bus; 400-Fixing film; 410-Allowing hole; 510-Conductive sheet; 520-Third protective film; X-First direction; Y-Second direction; Z-Third direction. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for mutual communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically limited. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0026] It should also be noted that in the accompanying drawings of the embodiments of this application, the arrows labeled X, Y, and Z respectively represent the first direction X, the second direction Y, and the third direction Z. The description of this application introduces the first direction X, the second direction Y, and the third direction Z to more clearly express the relative positional relationship involved in this application. The first direction X, the second direction Y, and the third direction Z are three intersecting relative directions, not absolute directions. In practical applications, the first direction X, the second direction Y, and the third direction Z can point to any direction in space, as long as the intersection relationship between them is maintained.

[0027] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure of this application, the components and arrangements of specific examples are described below. Of course, these are merely examples and are not intended to limit this application.

[0028] Battery signal acquisition structures are typically used in power battery modules or battery packs to collect signals such as voltage and temperature related to the battery cells and transmit the collected signals to the management system. A typical battery signal acquisition structure includes a main circuit body, an acquisition component 200, a busbar 300, and a tray for supporting and positioning related components. The main circuit body is connected to the acquisition component 200, which in turn is connected to the busbar 300. The tray provides assembly support and positional stability for the main circuit body, acquisition component 200, and busbar 300. The tray is usually positioned as an independent support on one side of the main circuit body, acquisition component 200, and busbar 300. During assembly, related components need to be positioned and aligned with the tray before being connected to each other.

[0029] However, when the number of collection points is large and the structure is relatively compact, the introduction of the tray can easily increase the assembly relationship of the battery signal acquisition structure, affect the overall integration, and make the arrangement and assembly process of related components more complicated.

[0030] To address the technical challenges of a complex assembly process, the first embodiment of this application provides a battery signal acquisition structure. (See attached...) Figure 1 The system includes: a flexible circuit body 100 extending along a first direction X; multiple acquisition components 200 connected to the flexible circuit body 100 and extending along a second direction Y; multiple busbars 300 along the second direction Y, disposed on one side of the flexible circuit body 100 and connected to the end of the acquisition components 200 away from the flexible circuit body 100; and a fixed membrane 400 along a third direction Z, on the same side of the fixed membrane 400, and thermally pressed together with the fixed membrane 400; the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0031] In this embodiment, the flexible circuit body 100 can be used to transmit acquired signals. The acquisition component 200 can be used to establish an electrical connection between the flexible circuit body 100 and the busbar 300 to realize the acquisition and transmission of battery-related signals. The busbar 300 can be used to connect to a corresponding battery cell. The fixing film 400 can be used to fix the flexible circuit body 100, multiple acquisition components 200 and multiple busbars 300 to form an integrated structure.

[0032] In the above embodiments, by placing the flexible circuit body 100, multiple acquisition components 200 and multiple busbars 300 on the same side of the fixed membrane 400 and heat-pressing them together, the flexible circuit body 100, multiple acquisition components 200 and multiple busbars 300 can be supported and positioned instead of a tray, thereby reducing the need for independent support components and simplifying the assembly relationship between related components.

[0033] In some embodiments, each acquisition component 200 is a voltage acquisition component 260, and multiple acquisition components 200 can be configured one-to-one with multiple busbars 300. That is, each acquisition component 200 can be connected to one busbar 300. Through the above configuration, each acquisition component 200 can correspond to a different busbar 300 to achieve separate acquisition of signals at different locations. In other embodiments, in addition to the voltage acquisition component 260, the multiple acquisition components 200 also include a temperature acquisition component 250. In this case, the busbar 300 is only connected to the voltage acquisition component 260, and the temperature acquisition component 250 is used to connect to the temperature sensor 251.

[0034] In some embodiments, the fixing membrane 400 may be a single-layer membrane. The fixing membrane 400 can be connected to the flexible circuit body 100, multiple acquisition components 200, and multiple busbars 300 by hot pressing. With the above arrangement, the membrane structure can be simplified while fixing the relevant components.

[0035] In some embodiments, the fixing membrane 400 may be integrally disposed along a continuous direction to simultaneously cover at least a portion of the flexible circuit body 100, the plurality of acquisition components 200, and the plurality of busbars 300. This arrangement improves the overall integrity between the relevant components.

[0036] In some embodiments, the busbars 300 may be spaced apart along a first direction X, and the multiple acquisition components 200 may be respectively connected to different busbars 300. Alternatively, the busbars 300 may also be spaced apart along other directions according to the arrangement of the battery cells.

[0037] In some embodiments, the fixing film 400 can be a polyester film, such as a polyethylene terephthalate film. The fixing film 400 can be insulating and can be connected to the flexible circuit body 100, the plurality of acquisition components 200, and the plurality of busbars 300 by heat pressing. With the above configuration, the fixing film 400 can fix the flexible circuit body 100, the plurality of acquisition components 200, and the plurality of busbars 300 while reducing the risk of electrical contact interference between related components.

[0038] In some embodiments, please refer to Figure 2 , Figure 3 and Figure 4 The flexible line body 100 includes at least two line layers 110, which are stacked along the third direction Z. The line layer 110 includes a cable 111 and an insulating film 112. The insulating film 112 is connected to the side of the cable 111 away from the fixed film 400. A portion of the acquisition component 200 is disposed between the insulating film 112 and the cable 111 and is electrically connected to the cable 111.

[0039] in, Figure 4 The embodiment in question includes four line layers 110.

[0040] Specifically, the flexible circuit body 100 may include two, three, or more circuit layers 110. Multiple circuit layers 110 may be stacked sequentially along the third direction (Z) to form a multi-layer circuit structure in the thickness direction of the flexible circuit body 100. For any circuit layer 110, a cable 111 may serve as a signal transmission component, and an insulating film 112 may be disposed on the side of the cable 111 facing away from the fixing film 400, forming a corresponding circuit layer 110 structure together with the cable 111. In the area where the acquisition component 200 connects to the flexible circuit body 100, a portion of the acquisition component 200 may be inserted between the insulating film 112 and the cable 111, and electrically connected to the cable 111 to achieve signal transmission between the acquisition component 200 and the flexible circuit body 100.

[0041] In the above embodiments, by including at least two circuit layers 110 stacked along the third direction Z in the flexible circuit body 100, the multiple conductors 113 in the flexible circuit body 100 can be arranged not only along the second direction Y, but also in layers along the third direction Z, thereby improving the conductor 113 capacity of the flexible circuit body 100. Compared to simply laying multiple conductors 113 flat along the second direction Y, the above multi-layer arrangement can reduce the size of the flexible circuit body 100 along the second direction Y with the same number of conductors 113, thereby avoiding the flexible circuit body 100 being too wide and facilitating the arrangement of the flexible circuit body 100 in space-constrained battery systems.

[0042] Meanwhile, when increasing the number of conductors 113 solely along the second direction Y, the width of the flexible circuit body 100 along the second direction Y typically increases with the increase in the number of conductors 113, which can easily affect the arrangement of other components or the selection of the connector 120. By placing some conductors 113 in different circuit layers 110, the trend of width growth of the flexible circuit body 100 can be controlled, thereby improving the adaptability of the flexible circuit body 100 to compact installation spaces while ensuring the number of conductors 113.

[0043] Furthermore, by stacking at least two circuit layers 110 along the third direction Z, the conductors 113 in different circuit layers 110 can correspond to different acquisition components 200, thereby facilitating the design of the distribution of conductors 113 in different circuit layers 110 according to the positional requirements of the acquisition components 200. That is, the arrangement of multiple conductors 113 is no longer limited to a single layer laid flat in the second direction Y, but can be combined and arranged in the second direction Y and the third direction Z, thereby improving the structural design flexibility of the flexible circuit body 100.

[0044] In some embodiments, the dimensions of different circuit layers 110 in the first direction X can be different. For example, a portion of at least two circuit layers 110 may be used only to connect a portion of the acquisition components 200 closer to the connector 120, and this portion of the circuit layer 110 may have a relatively short length in the first direction X; another portion of the circuit layers 110 may be used to connect more acquisition components 200 farther from the connector 120, and this portion of the circuit layer 110 may have a relatively long length in the first direction X. This arrangement allows the dimensions of different circuit layers 110 to be adapted to the distribution of their corresponding acquisition components 200, thereby avoiding material redundancy caused by using the same length for all circuit layers 110.

[0045] Furthermore, in some embodiments, the circuit layers 110 closer to the fixed membrane 400 along the third direction Z can connect to a larger number of acquisition components 200, while the circuit layers 110 farther away from the fixed membrane 400 along the third direction Z can connect to a smaller number of acquisition components 200; alternatively, the circuit layers 110 at different positions along the third direction Z can be configured with different lengths in the first direction X according to the distribution positions of the acquisition components 200. This application does not limit this. Through the above configuration, the overall size and material utilization of the flexible circuit body 100 can be further optimized while meeting signal transmission requirements.

[0046] In some embodiments, one end of two adjacent line layers 110 can be aligned in the first direction X to facilitate connection to the connector 120, while the other end is staggered. The shorter line layer 110 may extend only to the area where the corresponding acquisition component 200 is located, while the longer line layer 110 may extend further to the area where the acquisition component 200 is located. This arrangement facilitates the connection of different line layers 110 to their respective acquisition components 200 and helps reduce redundant structures in areas not involved in the connection process.

[0047] In some embodiments, please refer to Figure 4 , Figure 5 and Figure 6 The cable 111 includes multiple conductors 113, a first protective film 114, and a second protective film 115. The multiple conductors 113 are spaced apart along the second direction Y. The first protective film 114 is connected to the side of the conductor 113 near the fixed film 400, and the second protective film 115 is connected to the side of the conductor 113 away from the fixed film 400. The second protective film 115 has a connection hole 116, and the acquisition component 200 and the conductor 113 are connected through the connection hole 116.

[0048] In some embodiments, conductor 113 is rolled flat copper wire.

[0049] Specifically, multiple conductors 113 can serve as the signal transmission portion of the cable 111. The multiple conductors 113 are spaced apart along a second direction Y to form multiple conductive channels arranged along the second direction Y. A first protective film 114 and a second protective film 115 are respectively disposed on both sides of the multiple conductors 113 along a third direction Z to clamp and protect the multiple conductors 113. The first protective film 114 is disposed on the side of the multiple conductors 113 closest to the fixing film 400, and the second protective film 115 is disposed on the side of the multiple conductors 113 away from the fixing film 400. A connection hole 116 is formed on the second protective film 115, which can expose a local area of ​​the conductor 113, allowing the acquisition component 200 to connect to the corresponding conductor 113 through the connection hole 116.

[0050] In the above embodiments, by including multiple conductors 113 spaced apart along the second direction Y in the cable 111, multiple spaced conductive channels can be formed in the cable 111, thereby facilitating the separate transmission of different acquired signals. Simultaneously, the multiple conductors 113 spaced apart along the second direction Y also allow for reserved spacing between adjacent conductors 113, thus helping to reduce the risk of mutual interference between adjacent conductors 113.

[0051] Meanwhile, by connecting the first protective film 114 and the second protective film 115 to both sides of the plurality of conductors 113 along the third direction Z, double-sided protection can be provided for the plurality of conductors 113, thereby improving the stability of the cable 111 structure. The first protective film 114 and the second protective film 115 can also limit the plurality of conductors 113, thereby helping to maintain the relative positional relationship between the plurality of conductors 113.

[0052] Furthermore, by providing a connection hole 116 on the second protective film 115 and connecting the acquisition component 200 and the conductor 113 through the connection hole 116, a connection area can be reserved for the connection between the acquisition component 200 and the conductor 113 while protecting the conductor 113, thus taking into account both the protection requirements of the conductor 113 and the electrical connection requirements.

[0053] In some embodiments, multiple connection holes 116 may be correspondingly provided with multiple conductors 113. That is, a conductor 113 can be connected to a corresponding acquisition component 200 through a connection hole 116. With the above arrangement, each acquisition component 200 can establish a connection relationship with its corresponding conductor 113, thereby facilitating different acquisition components 200 to correspond to different signal channels.

[0054] In some embodiments, the connection hole 116 can be a round hole, an elongated hole, a rectangular hole, or other hole shape that can expose a local area of ​​the conductor 113. With the above settings, the shape of the connection hole 116 can be adapted to the connection method and connection area size of the acquisition component 200.

[0055] In some embodiments, the first protective film 114 and the second protective film 115 can be film layers made of the same material or film layers made of different materials. With the above arrangement, suitable protective film forms can be selected according to the structural requirements on both sides of the cable 111.

[0056] In some embodiments, the first protective film 114 and the second protective film 115 can be polyimide films. The polyimide films can be attached to both sides of the plurality of conductors 113 along a third direction Z to protect the plurality of conductors 113. With the above arrangement, the protective stability of the first protective film 114 and the second protective film 115 on the plurality of conductors 113 can be improved, and it is beneficial to maintain the structure of the cable 111 during subsequent processing and use.

[0057] In some embodiments, a acquisition component 200 may be connected to a conductor 113. Alternatively, a acquisition component 200 may be connected to at least two of a plurality of conductors 113.

[0058] In some embodiments, please refer to Figure 5 , Figure 6 , Figure 7 and Figure 8 The flexible circuit body 100 also includes a connector 120, and a cable 111 is connected to the connector 120. The cable 111 has multiple cut-off holes 117, which are correspondingly arranged with the acquisition component 200. The cut-off holes 117 are used to cut off the conductor 113 connected to the corresponding acquisition component 200. The cut-off holes 117 are located on the side of the corresponding acquisition component 200 away from the connector 120.

[0059] Specifically, connector 120 may be disposed at one end of flexible line body 100 along the first direction X. Multiple conductors 113 in cable 111 may be connected to connector 120 to transmit signals in the multiple conductors 113 to external circuitry or management system. Multiple cut-off holes 117 may be formed on cable 111, and the multiple cut-off holes 117 may be respectively disposed corresponding to multiple acquisition components 200. For any acquisition component 200, the conductor 113 connected to that acquisition component 200 is cut off by the corresponding cut-off hole 117 on the side of the acquisition component 200 away from connector 120.

[0060] In the above embodiments, by setting multiple cut-off holes 117 corresponding to multiple acquisition components 200, and placing the corresponding cut-off holes 117 on the side of the corresponding acquisition component 200 away from the connector 120, it is possible to cut off the conductor 113 downstream of the acquisition component 200 while preserving the signal transmission path between the acquisition component 200 and the connector 120. This avoids the continued extension of the invalid conductor 113, which helps to reduce the redundant conductor 113 portion in the cable 111 and makes the structure of the cable 111 more compatible with the distribution relationship of the acquisition components 200.

[0061] In some embodiments, multiple cut-off holes 117 may be correspondingly configured with multiple acquisition components 200. That is, one acquisition component 200 may correspond to one cut-off hole 117. In other embodiments, one acquisition component 200 needs to be connected to multiple conductors 113, then one acquisition component 200 corresponds to multiple cut-off holes 117. With the above configuration, the conductors 113 corresponding to each acquisition component 200 can be cut off at their respective positions.

[0062] In some embodiments, the cut-off hole 117 may penetrate at least a portion of the structure of the cable 111 to break the corresponding conductor 113 at the location of the cut-off hole 117. The shape of the cut-off hole 117 may be a circular hole, an elongated hole, a rectangular hole, or other hole shape suitable for cutting off the conductor 113, and this application does not limit it in this regard.

[0063] In some embodiments, please refer to Figure 6The acquisition component 200 includes a first connecting part 210, a telescopic part 220 and a second connecting part 240 along the second direction Y. The telescopic part 220 is connected between the first connecting part 210 and the second connecting part 240. The first connecting part 210 is connected to the flexible line body 100.

[0064] Specifically, the first connecting portion 210 is used to connect the flexible line body 100. The second connecting portion 240 can serve as a functional connection area for the acquisition component 200 on the side away from the flexible line body 100. The telescopic portion 220 is disposed between the first connecting portion 210 and the second connecting portion 240 to form a transition structure between the first connecting portion 210 and the second connecting portion 240 that can generate deformation allowance.

[0065] In the above embodiment, by connecting the telescopic part 220 between the first connecting part 210 and the second connecting part 240, a deformation transition area can be set between the first connecting part 210 and the second connecting part 240, thereby providing a certain deformation margin for the acquisition component 200 and helping to alleviate the influence of assembly deviation, position change or force change between the first connecting part 210 and the second connecting part 240.

[0066] In some embodiments, the second connection portion 240 is connected to the bus 300, and the acquisition component 200 can be used to acquire voltage signals. Accordingly, the acquisition component 200 can be used as a voltage acquisition component 260.

[0067] In some embodiments, the second connection portion 240 can be connected to the temperature sensor 251, and the acquisition component 200 can be used to acquire temperature signals. Accordingly, the acquisition component 200 can be used as the temperature acquisition component 250.

[0068] In some embodiments, both the voltage acquisition component 260 and the temperature acquisition component 250 may include a first connecting portion 210, a telescopic portion 220, and a second connecting portion 240. That is, different types of acquisition components 200 can adopt the same segmented basic structure, with only the connection objects of the second connecting portion 240 being different. Through the above arrangement, it is possible to maintain the uniformity of the structural form of the acquisition components 200 while taking into account the acquisition requirements of different signal types.

[0069] In some embodiments, the first connecting portion 210, the telescopic portion 220, and the second connecting portion 240 may be sequentially connected along the second direction Y. The first connecting portion 210 and the second connecting portion 240 may be located on both sides of the telescopic portion 220 along the second direction Y. With the above arrangement, the acquisition component 200 can form a continuous structure extending along the second direction Y.

[0070] In some embodiments, the first connecting portion 210 and the flexible circuit body 100 can be connected by welding. Alternatively, the first connecting portion 210 and the flexible circuit body 100 can also be connected by other methods that enable electrical connection, which is not limited in this application.

[0071] In some embodiments, please refer to Figure 6 The telescopic portion 220 has a first side surface 221 and a second side surface 222, which are opposite to each other along a first direction X. The telescopic portion 220 has a first weak portion 223 and a second weak portion 227, which are alternately spaced along a second direction Y. The first weak portion 223 includes a first gap 224 and a first notch 226. The first gap 224 extends along the first direction X and is spaced apart from the first side surface 221 and the second side surface 222, respectively. The first notch 226 is located on the first side surface 221 and is located on one side of the first gap 224 along the first direction X. The second weak portion 227 includes a second gap 228 and a second notch 230. The second gap 228 extends along the first direction X and is spaced apart from the first side surface 221 and the second side surface 222, respectively. The second notch 230 is located on the second side surface 222 and is located on one side of the second gap 228 along the first direction X.

[0072] Specifically, the telescopic portion 220 may be located in the middle region of the acquisition component 200 along the second direction Y. The first side 221 and the second side 222 may respectively serve as the two side boundaries of the telescopic portion 220 along the first direction X. The first weak portion 223 and the second weak portion 227 may be arranged sequentially along the second direction Y. For the first weak portion 223, a first gap 224 may be formed inside the telescopic portion 220, and a first notch 226 may be recessed from the first side 221 into the telescopic portion 220, forming a first connecting region between the first gap 224 and the first notch 226. For the second weak portion 227, a second gap 228 may be formed inside the telescopic portion 220, and a second notch 230 may be recessed from the second side 222 into the telescopic portion 220, forming a second connecting region between the second gap 228 and the second notch 230.

[0073] In the above embodiments, by providing a first weak portion 223 and a second weak portion 227 on the telescopic portion 220, a plurality of preset weak regions distributed along the second direction Y can be formed on the telescopic portion 220. The first and second connecting regions are more prone to fracture under stress than the remaining regions of the telescopic portion 220, thereby providing a structural basis for the subsequent deformation of the telescopic portion 220.

[0074] When the telescopic portion 220 is subjected to a force along the second direction Y, the first connecting area can break, allowing the first gap 224 to connect with the first notch 226; the second connecting area can break, allowing the second gap 228 to connect with the second notch 230. Since the first weak portion 223 and the second weak portion 227 are alternately spaced along the second direction Y, and the first notch 226 and the second notch 230 are respectively located on opposite sides of the telescopic portion 220 along the first direction X, the telescopic portion 220 can deform sequentially in different directions at adjacent weak portions, thus forming an S-shaped structure. Through this arrangement, the telescopic portion 220 can transform from its initial state to an S-shaped state after being subjected to a force along the second direction Y, thereby providing the acquisition component 200 with a telescopic allowance along the second direction Y, and helping to alleviate stress concentration in the acquisition component 200 during assembly, use, or stress application, improving the adaptability of the acquisition component 200 to positional changes and assembly deviations.

[0075] In some embodiments, the number of first weak portions 223 and second weak portions 227 may be multiple. The multiple first weak portions 223 and the multiple second weak portions 227 may be alternately and periodically arranged along the second direction Y.

[0076] In some embodiments, the dimensions of the first gap 224 and the second gap 228 in the first direction X may be the same or different; the dimensions of the first notch 226 and the second notch 230 in the first direction X or the second direction Y may be the same or different. Through the above settings, the fracture location and deformation capacity of different weak points can be adjusted according to the stress and deformation requirements of the acquisition component 200.

[0077] In some embodiments, a second weak portion 227 may be provided between two adjacent first weak portions 223, and a first weak portion 223 may be provided between two adjacent second weak portions 227. Alternatively, other arrangements may be provided on the telescopic portion 220 as needed, as long as the first weak portions 223 and the second weak portions 227 can be alternately spaced along the second direction Y. This application does not limit this arrangement.

[0078] In some embodiments, the two ends of the first gap 224 are respectively connected to a first through hole 225, and the two ends of the second gap 228 are respectively connected to a second through hole 229. That is, the first gap 224 can be connected between the two first through holes 225 along the first direction X, and the second gap 228 can be connected between the two second through holes 229 along the first direction X. With the above arrangement, the first through holes 225 and the second through holes 229 can make way for the end regions of the corresponding gaps, thereby helping to reduce stress concentration at the gap ends and reducing the possibility of disordered crack propagation at the gap ends. Correspondingly, when the telescopic part 220 is subjected to a force along the second direction Y, the first connecting region and the second connecting region are more likely to break at a preset position, thereby helping to improve the stability and consistency of the S-shaped structure formed by the telescopic part 220.

[0079] In some embodiments, please refer to Figure 6 The fixed membrane 400 is provided with a clearance hole 410 through it in the third direction Z, and the orthographic projection of the telescopic part 220 in the third direction Z falls in the clearance hole 410.

[0080] Specifically, the clearance hole 410 can be formed on the fixed membrane 400 in the area corresponding to the telescopic part 220. When viewed along the third direction Z, the orthographic projection of the telescopic part 220 on the fixed membrane 400 can be entirely within the range defined by the clearance hole 410. That is, the fixed membrane 400 does not need to cover the telescopic part 220 in the area corresponding to the telescopic part 220, thereby reserving clearance space for the telescopic part 220 along the third direction Z.

[0081] In the above embodiment, by providing a clearance hole 410 through the fixed membrane 400 along the third direction Z, and by ensuring that the orthogonal projection of the telescopic part 220 along the third direction Z falls within the clearance hole 410, it is possible to avoid the fixed membrane 400 directly restricting the telescopic part 220 in the corresponding area, thereby reserving space for the deformation of the telescopic part 220.

[0082] When the telescopic portion 220 is subjected to a force along the second direction Y and transforms from its initial state to an S-shaped state, the clearance hole 410 can provide clearance space for the displacement and deformation of a local area of ​​the telescopic portion 220, thereby reducing the obstruction effect of the fixed membrane 400 on the deformation of the telescopic portion 220. Accordingly, the telescopic portion 220 is more likely to form an S-shaped structure according to a preset mechanism.

[0083] By setting the clearance hole 410 to correspond to the orthographic projection of the telescopic part 220 along the third direction Z, the setting range of the clearance hole 410 can be adapted to the deformation area of ​​the telescopic part 220. This ensures that the telescopic part 220 has sufficient deformation space while avoiding excessive clearance of the fixing membrane 400 in unnecessary areas, which is beneficial to balancing the deformation requirements of the telescopic part 220 and the fixing requirements of the fixing membrane 400 for other components.

[0084] In some embodiments, the clearance hole 410 may be disposed through the thickness direction of the fixing film 400. With the above arrangement, a through clearance space can be formed in the corresponding area of ​​the telescopic part 220 at the fixing film 400, thereby further reducing the influence of the fixing film 400 on the deformation of the telescopic part 220.

[0085] In some embodiments, the shape of the clearance hole 410 can be an elongated hole, a rectangular hole, an oblong hole, or other hole shape that can cover the telescopic part 220 along the third direction Z-orthographic projection; this application does not limit this. With the above configuration, the shape of the clearance hole 410 can be adapted to the shape and deformation path of the telescopic part 220.

[0086] In some embodiments, the size of the clearance hole 410 along the first direction X and the second direction Y can be greater than, equal to, or approximately equal to the size of the telescopic part 220 projected orthogonally along the third direction Z in the corresponding direction; this application does not limit this. Through the above arrangement, clearance spaces of different sizes can be reserved according to the deformation range requirements of the telescopic part 220.

[0087] In some embodiments, one telescopic portion 220 may correspond to one clearance hole 410. Alternatively, one clearance hole 410 may correspond to multiple adjacent telescopic portions 220, and this application does not limit this. With the above arrangement, the number and distribution of clearance holes 410 can be designed according to the arrangement of the acquisition components 200 and the overall structure of the fixing membrane 400.

[0088] In some embodiments, please refer to Figure 5 Among the multiple acquisition components 200, one part is a temperature acquisition component 250 and the other part is a voltage acquisition component 260. The second connection part 240 of the temperature acquisition component 250 is connected to a temperature sensor 251, and the second connection part 240 of the voltage acquisition component 260 is connected to a bus 300.

[0089] Specifically, both the temperature acquisition component 250 and the voltage acquisition component 260 can be connected to the flexible circuit body 100. That is, the first connecting portion 210 of the temperature acquisition component 250 is connected to the flexible circuit body 100, and the first connecting portion 210 of the voltage acquisition component 260 is also connected to the flexible circuit body 100. Both the temperature acquisition component 250 and the voltage acquisition component 260 can include a first connecting portion 210, a telescopic portion 220, and a second connecting portion 240. For the temperature acquisition component 250, its second connecting portion 240 can be used to connect to the temperature sensor 251 to acquire a temperature signal. For the voltage acquisition component 260, its second connecting portion 240 can be used to connect to the busbar 300 to acquire a voltage signal. Through the above configuration, different types of acquisition components 200 can respectively achieve temperature acquisition and voltage acquisition while maintaining a consistent basic structural form.

[0090] In the above embodiment, by setting a portion of the multiple acquisition components 200 as a temperature acquisition component 250 and another portion as a voltage acquisition component 260, the battery signal acquisition structure can simultaneously possess temperature signal acquisition function and voltage signal acquisition function, thereby improving the signal acquisition integrity of the battery signal acquisition structure.

[0091] In some embodiments, the temperature sensor 251 may be a thermistor.

[0092] In some embodiments, the fixed membrane 400 has a temperature detection hole, and the temperature sensor 251 is located within the temperature detection hole along the third direction Z by its orthogonal projection.

[0093] In some embodiments, the second connection portion 240 of the voltage acquisition component 260 can be directly welded to the bus 300. Alternatively, the second connection portion 240 of the voltage acquisition component 260 can also be connected to the bus 300 through an intermediate connection structure; this application does not limit this. With the above configuration, the connection method between the voltage acquisition component 260 and the bus 300 can be designed according to the structural form and connection requirements of the bus 300.

[0094] Accordingly, this application also provides a battery pack, including a battery signal acquisition structure as described in any of the above embodiments.

[0095] Accordingly, this application also provides a vehicle including a battery signal acquisition structure as described in any of the above embodiments or a battery pack as described in the above embodiments.

[0096] In some embodiments, the battery signal acquisition structure is installed in the vehicle's power battery system to acquire the battery's temperature and voltage signals.

[0097] Accordingly, this application also provides a method for fabricating a battery signal acquisition structure; please refer to [link / reference]. Figure 9 The method for manufacturing the battery signal acquisition structure includes: continuously conveying multiple third protective films 520; continuously conveying multiple conductive sheets 510; adjusting the relative conveying speed between the multiple third protective films 520 and the multiple conductive sheets 510 according to the first target spacing between two adjacent conductive sheets 510 in the same acquisition component 200 and the second target spacing between two adjacent conductive sheets 510 between two adjacent acquisition components 200, so that the multiple conductive sheets 510 are attached to the multiple third protective films 520 at a preset spacing.

[0098] Specifically, the third protective film 520 can serve as a protective film layer in the acquisition component 200, and the conductive sheet 510 can serve as a conductive part in the acquisition component 200. The first target spacing corresponds to the functional spacing between two adjacent conductive sheets 510 within the same acquisition component 200, and this first target spacing will be retained in the final product after subsequent cutting to form a single acquisition component 200. The second target spacing corresponds to the pitch of multiple third protective films 520 on the fixture waiting to be bonded to the conductive sheet 510. That is, multiple third protective films 520 can be set on the fixture according to the second target spacing so that the conductive sheet 510 can be bonded to the corresponding third protective film 520.

[0099] For example, please see Figure 5 , Figure 5 The distance between the two conductive sheets 510 is the first target distance.

[0100] In the above embodiments, by adjusting the relative conveying speed between the third protective film 520 and the conductive sheet 510 according to the first target spacing, the relative positional relationship of multiple conductive sheets 510 inside the same acquisition component 200 on the third protective film 520 can be guaranteed, thereby improving the accuracy of the arrangement of conductive sheets 510 inside the final acquisition component 200.

[0101] By adjusting the relative conveying speed between the third protective film 520 and the conductive sheet 510 according to the second target spacing, the spacing between multiple third protective films 520 can be adapted to the pitch of the bonding fixture, thereby facilitating the arrangement, positioning and continuous conveying of multiple third protective films 520 before bonding, and also facilitating the alignment between the conductive sheet 510 and the corresponding third protective film 520.

[0102] By setting the first target spacing and the second target spacing respectively, the functional arrangement requirements of the conductive sheet 510 inside the acquisition component 200 can be distinguished from the pitch requirements of the multiple third protective films 520 on the tooling, thereby improving the adaptability of the acquisition component 200 manufacturing process to the continuous bonding process.

[0103] In some embodiments, the third protective film 520 may be a polyimide film. The polyimide film may be bonded to the conductive sheet 510 to form a protective layer structure in the acquisition assembly 200.

[0104] In some embodiments, the conductive sheet 510 can be a copper foil. The copper foil can serve as a conductive portion in the acquisition component 200 for signal transmission.

[0105] In some embodiments, please refer to Figure 10 The method for manufacturing the battery signal acquisition structure also includes: cutting the raw material of the third protective film to form multiple third protective films 520; cutting the raw material of the conductive sheet to form multiple conductive sheets 510; and baking the bonded third protective film 520 and multiple conductive sheets 510.

[0106] Specifically, the raw material for the third protective film can be a roll of film. The raw material for the conductive sheet can be a roll of conductive material. The raw material for the third protective film can be cut according to a preset size to form multiple third protective films 520. The raw material for the conductive sheet can then be cut according to a preset size to form multiple conductive sheets 510. After the multiple third protective films 520 and multiple conductive sheets 510 are bonded together, a semi-finished product, the acquisition component 200, can be formed. Subsequently, the bonded third protective films 520 and multiple conductive sheets 510 can be baked to cure the bonded semi-finished product. After baking, the bonded third protective films 520 and multiple conductive sheets 510 can further proceed to subsequent assembly or connection processes.

[0107] In the above embodiments, by cutting the raw material of the third protective film, multiple third protective films 520 that meet the preset size requirements can be formed. By cutting the raw material of the conductive sheet, multiple conductive sheets 510 that meet the preset size requirements can be formed, thereby providing a component base with size matching for subsequent bonding.

[0108] Meanwhile, by baking after bonding the third protective film 520 and multiple conductive sheets 510, the structure of the bonded semi-finished product can be made more stable, which is conducive to improving the bonding stability between the third protective film 520 and the conductive sheets 510, and facilitates the subsequent processing of the acquisition component 200.

[0109] Furthermore, by sequentially combining the cutting of the third protective film raw material, the cutting of the conductive sheet raw material, and the baking after bonding, the manufacturing process of the acquisition component 200 can form a relatively complete pre-processing and post-processing flow, which is conducive to improving the consistency of the manufacturing of the acquisition component 200.

[0110] In some embodiments, the cutting dimensions of the third protective film material and the conductive sheet material can be determined according to the structural dimensions of the corresponding acquisition component 200. Through the above settings, the formed third protective film 520 and conductive sheet 510 can be adapted to the size requirements of the subsequent acquisition component 200.

[0111] In some embodiments, the baking step can be performed in an oven. The baking temperature and baking time can be determined based on the third protective film 520, the conductive sheet 510, and the bonding requirements between them, which are not limited in this application. With the above settings, the baking conditions can be adjusted according to different materials and different process requirements.

[0112] In some embodiments, please refer to Figure 11 The method for manufacturing the battery signal acquisition structure also includes: welding the connecting cable 111 and the acquisition component 200; connecting the insulating film 112 to the side of the acquisition component 200 away from the cable 111; and placing the connector 120 and the cable 111 into a tooling for pressing and forming.

[0113] Specifically, after the acquisition component 200 is manufactured, it can be soldered to the cable 111 to establish an electrical connection. Then, an insulating film 112 can be attached to the side of the acquisition component 200 facing away from the cable 111, so that the acquisition component 200 and the cable 111 together form the corresponding circuit layer 110 structure. Afterwards, the connector 120 and the cable 111 can be placed in a pre-set fixture and crimped together to form the connection end structure in the flexible circuit body 100.

[0114] Firstly, in the above embodiments, by first welding the cable 111 to the acquisition component 200, a stable electrical connection can be formed between the acquisition component 200 and the cable 111, thereby providing a connection basis for the subsequent formation of the circuit layer 110 structure.

[0115] Secondly, in the above embodiments, by connecting an insulating film 112 to the side of the acquisition component 200 away from the cable 111, an insulating protection structure can be formed on the outside of the cable 111 and the acquisition component 200, which is beneficial for the acquisition component 200 and the cable 111 to jointly form the corresponding line layer 110 and improve the structural integrity of the line layer 110.

[0116] By placing the connector 120 and cable 111 into a tooling for crimping, a connection end structure can be formed between the connector 120 and the cable 111, thereby facilitating the establishment of a connection between the flexible circuit body 100 and the external circuit. Compared with connection methods without tooling assistance, the above method also helps to improve the accuracy of the assembly position of the connector 120 and cable 111.

[0117] In some embodiments, the cable 111 and the acquisition component 200 can be connected by ultrasonic welding. Alternatively, the cable 111 and the acquisition component 200 can also be connected by laser welding or other welding methods that can achieve electrical connection. With the above settings, a suitable welding method can be flexibly selected according to the material of the cable 111 and the acquisition component 200 and the connection requirements.

[0118] In some embodiments, the insulating film 112 may be a polycarbonate film. The insulating film 112 may cover the side of the acquisition component 200 opposite to the cable 111 and be connected to the acquisition component 200. With the above arrangement, the insulation of the corresponding area can be improved while forming the line layer 110.

[0119] In some embodiments, connector 120 can be connected to cable 111 via crimp terminals. A fixture can be used to position connector 120 and cable 111 and maintain their relative positions during crimping. This configuration improves the consistency of the crimping process between connector 120 and cable 111.

[0120] In some embodiments, please refer to Figure 12 The method for manufacturing the battery signal acquisition structure also includes: welding the busbar 300 and the acquisition component 200 together; placing the busbar 300, the acquisition component 200 and the flexible circuit body 100 on the same side of the fixed membrane 400; and bonding and hot-pressing the busbar 300, the acquisition component 200, the flexible circuit body 100 and the fixed membrane 400 together.

[0121] Specifically, after completing the fabrication of the acquisition component 200 and the flexible circuit body 100, the acquisition component 200 can be connected to the corresponding busbar 300 to establish an electrical connection between them. Then, the flexible circuit body 100, multiple acquisition components 200, and multiple busbars 300 can be positioned on the same side of the fixing film 400 according to a preset positional relationship, and the relevant components can be bonded together. Subsequently, the fixing film 400 can be connected to the flexible circuit body 100, multiple acquisition components 200, and multiple busbars 300 through hot pressing, thereby forming a battery signal acquisition structure.

[0122] In the above embodiment, by first connecting the busbar 300 to the acquisition component 200, a stable electrical connection can be established between the acquisition component 200 and the busbar 300, thereby providing a connection basis for the subsequent formation of a battery signal acquisition structure.

[0123] By bonding the busbar 300, the acquisition component 200, and the flexible line body 100 together and hot-pressing them with the fixing film 400, the flexible line body 100, the acquisition component 200, and the busbar 300 can be integrated into a single structure, thereby reducing the need for independent load-bearing components and simplifying the assembly relationship between related parts.

[0124] By placing the relevant components on the same side of the fixing membrane 400 and connecting them by hot pressing, the fixing membrane 400 can simultaneously fix the flexible circuit body 100, the acquisition component 200 and the busbar 300, thereby improving the overall integrity and assembly stability of the battery signal acquisition structure.

[0125] In some embodiments, before hot-pressing, the flexible circuit body 100, the acquisition component 200, and the busbar 300 can be pre-positioned. Pre-positioning can be achieved through tooling positioning, fixture positioning, or other methods. This setup improves the accuracy of the relative positions of the components before hot pressing.

[0126] In some embodiments, when the acquisition component 200 includes a telescopic portion 220, the clearance hole 410 on the fixing membrane 400 can be correspondingly provided with the telescopic portion 220, so that the orthogonal projection of the telescopic portion 220 along the third direction Z falls within the corresponding clearance hole 410. With the above arrangement, deformation space can be reserved for the telescopic portion 220 while completing the thermo-pressed connection of the fixing membrane 400.

[0127] In some embodiments, after hot-pressing, the formed battery signal acquisition structure can be further tested, such as for connection status detection, position detection, or electrical performance testing; this application does not limit this. The above-described configuration facilitates the confirmation of the assembled structural state.

[0128] In some embodiments, the method for manufacturing the battery signal acquisition structure is as follows. First, the acquisition component 200 is manufactured. Specifically, the polyimide film raw material and the conductive sheet raw material can be inspected upon arrival; wherein, the polyimide film raw material can be cut to form multiple third protective films 520, and the conductive sheet raw material can be cut to form multiple conductive sheets 510. For the conductive sheets 510, they can be cut according to the drawing dimensions, and the cut conductive sheets 510 can be scanned for association. After cutting, waste removal treatment can be performed to remove excess material and clean the semi-finished product. Subsequently, multiple third protective films 520 and multiple conductive sheets 510 can be continuously laminated to form a semi-finished product, and the laminated semi-finished product is sent to an oven for baking and curing. After curing, the semi-finished product can be cut to form an upper film and lower film structure that meets the drawing dimensions, thereby obtaining the semi-finished product of the acquisition component 200. For different types of acquisition components 200, the voltage acquisition component 260 can be set with corresponding welding areas and melting areas, and the temperature acquisition component 250 can be further connected to a temperature sensor 251. The connection between the acquisition component 200 and the flexible circuit body 100 can be made by ultrasonic welding, or by a combination of ultrasonic welding and laser welding as needed. The connection area can be automatically optically inspected.

[0129] In some embodiments, the fabrication of the flexible circuit body 100 may include the following steps: Incoming material inspection may be performed on the semi-finished cable 111, the semi-finished connector 120 terminal, the semi-finished polyimide protective film, and the semi-finished adhesive. Subsequently, the acquisition component 200 may be welded to the cable 111 to form a connection structure between the flexible circuit body 100 and the acquisition component 200. After welding, the welding area may be inspected for welding quality to detect defects such as incomplete welds or missing welds. This inspection may employ two-dimensional detection, X-ray detection, or automated optical detection. Afterward, an insulating film 112 may be covered on the outside of the welded semi-finished product; and the connector 120 terminal may be placed in a pre-set fixture to press-fit the connector 120 terminal to the cable 111. After pressing, adhesive may be applied to the pressing area and cured, for example, by ultraviolet curing. Furthermore, the semi-finished flexible circuit body 100 may be bent according to a pre-set shape using a fixture, and foam may be attached to a pre-set area to provide cushioning. Subsequently, electrical performance tests, such as insulation testing, withstand voltage testing, and internal resistance testing, can be performed on the formed semi-finished products. The surface of the semi-finished products can also be cleaned to remove oil, welding slag, and other foreign matter from the process. After completing the above steps, 100 semi-finished flexible circuit main body components are obtained and can be packaged into boxes.

[0130] In some embodiments, structural assembly may include the following steps: Incoming material inspection may be performed on the busbar 300, the fixing film 400, and the flexible circuit body 100 assembly semi-finished products. The fixing film 400 may be formed by cutting raw film material. Subsequently, multiple busbars 300 may be placed into a preset fixture for positioning; and the busbars 300, fixing film 400, and flexible circuit body 100 assembly semi-finished products may be cleaned, or plasma cleaning may be performed on the relevant semi-finished products. Afterwards, the flexible circuit body 100 assembly may be set in a preset position, so that the acquisition component 200 corresponds to the connection area of ​​the busbar 300; and the acquisition component 200 and the busbar 300 may be welded together, for example, using ultrasonic welding. After welding, the welding area may be automatically visually inspected to determine if there are any welding defects. Subsequently, the cut fixing film 400 may be attached to the busbar 300, the flexible circuit body 100 assembly, and the welding area, and all semi-finished products may be sent into an equipment for hot pressing. After hot pressing and demolding, the finished product can undergo visual inspection, labeling, and product code recording. Further, electrical performance tests can be performed, such as insulation testing, withstand voltage testing, continuity testing, circuit resistance testing, and probe continuity testing; and automatic visual inspection can be performed again to reject defective products. After passing inspection, the finished product can be placed in packaging boxes, packaged, coded, and boxed.

[0131] In some embodiments, the steps in the above manufacturing method can be performed sequentially as described above, or the order of some steps can be adjusted according to the actual equipment layout, production line cycle time, and product form. The above-mentioned steps, such as incoming material inspection, welding inspection, surface cleaning, electrical performance testing, visual inspection, coding and recording, and packaging, can be implemented in conjunction with the fabrication of the data acquisition component 200, the fabrication of the flexible circuit body 100, and structural assembly to form a relatively complete manufacturing process.

[0132] The foregoing has provided a detailed description of a battery signal acquisition structure and its manufacturing method, battery pack, and vehicle provided in the embodiments of this application. Specific examples have been used in this application to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A battery signal acquisition structure, characterized in that, include: A flexible circuit body (100) extends along a first direction (X); Multiple acquisition components (200) are connected to the flexible line body (100) and extend along a second direction (Y); Multiple busbars (300) are disposed on one side of the flexible line body (100) along the second direction (Y). Each busbar (300) is connected to at least a portion of one of the multiple acquisition components (200) and is connected to the end of the acquisition component (200) away from the flexible line body (100). A fixed membrane (400) is provided along a third direction (Z), wherein the flexible circuit body (100), a plurality of the acquisition components (200) and a plurality of the busbars (300) are disposed on the same side of the fixed membrane (400) and are thermally pressed to the fixed membrane (400); The first direction (X), the second direction (Y), and the third direction (Z) are perpendicular to each other.

2. The battery signal acquisition structure according to claim 1, characterized in that, The flexible circuit body (100) includes at least two circuit layers (110), which are stacked along the third direction (Z). Each circuit layer (110) includes: Cable (111); An insulating film (112) is attached to the side of the cable (111) away from the fixing film (400) along the third direction (Z). A portion of the acquisition component (200) is disposed between the insulating film (112) and the cable (111) and is electrically connected to the cable (111).

3. The battery signal acquisition structure according to claim 2, characterized in that, The cable (111) includes: A plurality of conductors (113) are arranged at intervals along the second direction (Y); A first protective film (114) is connected to the conductor (113) on the side near the fixed film (400) along the third direction (Z). The second protective film (115) is connected to the conductor (113) on the side away from the fixed film (400) along the third direction (Z). The second protective film (115) has a connection hole (116) through which the acquisition component (200) and the conductor (113) are electrically connected.

4. The battery signal acquisition structure according to claim 3, characterized in that, The flexible circuit body (100) also includes a connector (120), the cable (111) is connected to the connector (120), the cable (111) has a plurality of cut-off holes (117), the cut-off holes (117) are correspondingly provided with the acquisition component (200), the cut-off holes (117) are configured to cut off the conductor (113) connected to the corresponding acquisition component (200), and the cut-off holes (117) are located on the side of the corresponding acquisition component (200) away from the connector (120).

5. The battery signal acquisition structure according to claim 1, characterized in that, The acquisition component (200) includes a first connecting part (210), a telescopic part (220) and a second connecting part (240) along the second direction (Y). The telescopic part (220) is connected between the first connecting part (210) and the second connecting part (240). The first connecting part (210) is connected to the flexible line body (100).

6. The battery signal acquisition structure according to claim 5, characterized in that, The telescopic portion (220) has a first side (221) and a second side (222), the first side (221) and the second side (222) being opposite to each other along the first direction (X); The telescopic portion (220) has a first weak portion (223) and a second weak portion (227), which are alternately spaced along the second direction (Y); The first weak part (223) includes a first gap (224) and a first notch (226). The first gap (224) extends along the first direction (X) and is spaced apart from the first side surface (221) and the second side surface (222), respectively. The first notch (226) is located on the first side surface (221) and is located on one side of the first gap (224) along the first direction (X). The second weak portion (227) includes a second gap (228) and a second notch (230). The second gap (228) extends along the first direction (X) and is spaced apart from the first side surface (221) and the second side surface (222), respectively. The second notch (230) is located on the second side surface (222) along the first direction (X).

7. The battery signal acquisition structure according to claim 5, characterized in that, The fixed membrane (400) is provided with a clearance hole (410) along the third direction (Z), and the orthographic projection of the telescopic part (220) along the third direction (Z) falls within the clearance hole (410).

8. The battery signal acquisition structure according to claim 5, characterized in that, One of the plurality of acquisition components (200) is a temperature acquisition component (250) and the other is a voltage acquisition component (260). The second connection part (240) of the temperature acquisition component (250) is connected to a temperature sensor (251), and the second connection part (240) of the voltage acquisition component (260) is connected to the bus (300).

9. A battery pack, characterized in that, Includes the battery signal acquisition structure as described in any one of claims 1 to 8.

10. A vehicle, characterized in that, It includes the battery signal acquisition structure as described in any one of claims 1 to 8 or the battery pack as described in claim 9.

11. A method for manufacturing a battery signal acquisition structure, characterized in that, A method for manufacturing a battery signal acquisition structure as described in any one of claims 1 to 8, comprising: Multiple third protective films (520) are continuously conveyed. Multiple conductive sheets (510) are continuously conveyed. Based on the first target spacing between two adjacent conductive sheets (510) in the same acquisition component (200) and the second target spacing between two adjacent conductive sheets (510) between two adjacent acquisition components (200), the relative conveying speed between the multiple third protective films (520) and the multiple conductive sheets (510) is adjusted so that the multiple conductive sheets (510) are attached to the multiple third protective films (520) at a preset spacing.

12. The method for manufacturing the battery signal acquisition structure according to claim 11, characterized in that, The method for manufacturing the battery signal acquisition structure also includes: Cut the raw material of the third protective film to form a plurality of the third protective films (520). Cut the conductive sheet material to form a plurality of the conductive sheets (510). The third protective film (520) and the plurality of conductive sheets (510) after being bonded together are baked.

13. The method for manufacturing the battery signal acquisition structure according to claim 11, characterized in that, The method for manufacturing the battery signal acquisition structure also includes: Weld the connecting cable (111) and the acquisition component (200); An insulating film (112) is connected to the side of the acquisition component (200) away from the cable (111). The connector (120) and the cable (111) are placed into a tooling for compression molding.

14. The method for manufacturing the battery signal acquisition structure according to claim 11, characterized in that, The method for manufacturing the battery signal acquisition structure also includes: Weld the busbar (300) and the acquisition component (200) together. The busbar (300), the acquisition component (200), and the flexible line body (100) are disposed on the same side of the fixed membrane (400); The busbar (300), the acquisition component (200), the flexible line body (100), and the fixing film (400) are bonded together and hot-pressed.