An antenna assembly, antenna and communication device

Abstract

The application provides an antenna assembly, an antenna and a communication device, and relates to the technical field of communication, to solve the problem of poor electrostatic discharge capability in a radiator. The antenna assembly provided by the application comprises a floor, a radiator and a grounding network, the radiator is used for radiating or receiving electromagnetic waves, the grounding network comprises a grounding end and a connecting end, the grounding end is connected with the floor, and the connecting end is connected with the radiator; the grounding network further comprises a resistive line and an inductive structure, and the resistive line and the inductive structure are connected between the grounding end and the connecting end. In the antenna assembly provided by the application, the resistive line has a relatively high characteristic impedance, thus, the working frequency or bandwidth and other performances of the radiator are not obviously affected, the inductive structure can conduct direct current and block alternating current, thus, the static electricity in the radiator can be discharged to the floor through the grounding network, and the grounding network can obviously block high-frequency radio frequency signals, so that the working performance of the antenna assembly is ensured.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an antenna assembly, an antenna, and a communication device. Background Technology

[0002] In communication equipment, antennas are used to achieve wireless communication functions. An antenna includes a feed network and a radiator. The radiator effectively transmits or receives electromagnetic waves, and the feed network is connected to the radiator, thus converting radio frequency signals into electromagnetic waves that are radiated outwards. Alternatively, electromagnetic waves received by the radiator from the outside environment can also be transmitted to the feed network.

[0003] When antennas are used in environments with strong electromagnetic fields, they are prone to accumulating charge within the radiator, resulting in static electricity. When the accumulated charge becomes significant, a discharge phenomenon occurs. The electric arc generated by this discharge can interfere with the normal operation of the antenna and may even lead to communication interruptions or distortion.

[0004] Therefore, how to discharge electrostatic discharge from the radiator while ensuring antenna performance has become an urgent technical problem to be solved. Summary of the Invention

[0005] This application provides an antenna assembly, antenna, and communication device that can effectively achieve electrostatic discharge.

[0006] In a first aspect, this application provides an antenna assembly, including a ground plane, a radiator, and a grounding network. The radiator is used to radiate or receive electromagnetic waves to realize the wireless signal transmission and reception capability of the antenna assembly. The grounding network is connected between the radiator and the ground plane, allowing static electricity in the radiator to be discharged to the ground plane through the grounding network. The grounding network includes a grounding terminal and a connection terminal; the grounding terminal is connected to the ground plane, and the connection terminal is connected to the radiator. The grounding network also includes a resistance wire and an inductive structure, which are connected between the grounding terminal and the connection terminal.

[0007] Through the above scheme, static electricity in the radiator can be discharged to the ground through a circuit composed of resistive wires and an inductive structure. Since the resistive wires have high characteristic impedance, they will not significantly affect the radiator's operating frequency or bandwidth. Furthermore, the inductive structure, similar to an inductor, can conduct direct current and block alternating current; therefore, static electricity (or direct current) in the radiator can be discharged to the ground through the grounding network. Moreover, the grounding network can also significantly block high-frequency radio frequency signals (or alternating current), thereby ensuring the antenna assembly's operational performance.

[0008] In one example, the antenna assembly may include a radiator, and the grounding network includes a grounding terminal and a connection terminal. That is, static electricity in the radiator can be discharged to the ground through the grounding network.

[0009] In one example, the antenna assembly includes multiple radiators, and the grounding network includes multiple connection terminals. The multiple radiators and multiple connection terminals are connected one-to-one. That is, each radiator can be connected to the ground through the grounding network, allowing static electricity in each radiator to be discharged to the ground through the grounding network. Alternatively, in some examples, when some radiators do not require static discharge, they may not be connected to the grounding network.

[0010] In one example, the grounding network includes a grounding terminal, which is connected to each connection terminal via a resistance wire and an inductive structure. That is, static electricity in each radiator can be discharged to the ground through the same grounding terminal, effectively reducing the number of grounding terminals required, simplifying the structural complexity of the grounding network, and reducing the manufacturing cost of the antenna components. It should be understood that the connections mentioned in this application can include direct connections and indirect connections. When the connection is understood as a direct connection, the grounding terminal is connected to each connection terminal via a resistance wire and an inductive structure. When the connection is understood as an indirect connection, at least one connection terminal connected to a radiator may be first connected to other radiators, and then connected to a grounding terminal via the resistance wire and inductive structure connected to the other radiators. This application is not limited to this. The above description can be applied to the description of other examples in this application, and will not be repeated here.

[0011] Alternatively, in one example, the grounding network includes multiple grounding terminals, any one of which is connected to any one of the multiple grounding terminals via a resistance wire and an inductive structure. Alternatively, in another example, the multiple grounding terminals are each connected to multiple connection terminals via resistance wires and inductive structures, and the connection terminals connected to different grounding terminals are not the same. That is, having a large number of grounding terminals avoids interruptions in the electrostatic discharge path of all radiators due to poor connection between the grounding terminal and the floor, thus providing better reliability.

[0012] In one example, multiple grounding terminals in the grounding network are connected. Alternatively, some of the grounding terminals in the grounding network are connected. When multiple grounding terminals are connected, static electricity in the radiator can be discharged to the floor through multiple grounding terminals, providing multiple static discharge paths and better reliability.

[0013] In one example, the antenna assembly includes multiple radiators, including a first radiator and at least one second radiator adjacent to the first radiator. The first and second radiators are connected by a resistive wire and an inductive structure. That is, static electricity in the first radiator can be directly discharged to the ground through a grounding network, or static electricity in the first radiator can also be discharged to the ground through the second radiator and the grounding network, increasing the static electricity discharge path for the first or second radiator and improving reliability.

[0014] In one example, the resistance wire comprises multiple resistance wire segments connected by resistors. Dividing the resistance wire into multiple segments and connecting them with resistors effectively prevents electromagnetic resonance and ensures the radiation performance of the antenna assembly.

[0015] In one example, at least one of the multiple resistance wires has a length less than or equal to half the wavelength of the antenna's highest operating frequency. This reduces the likelihood of electromagnetic resonance in the resistance wires and improves the radiation performance of the antenna assembly. If the lengths of all the resistance wires can satisfy the condition of being less than or equal to half the wavelength of the antenna's highest operating frequency, the radiation performance of the antenna assembly can be further improved.

[0016] In one example, the resistance value is greater than or equal to twice the characteristic impedance of the antenna assembly to ensure that the resistance wire connected to the resistor does not generate electromagnetic resonance.

[0017] In one example, the characteristic impedance of the resistance wire is greater than or equal to twice the characteristic impedance of the antenna assembly, so that the grounding network has a better electrostatic discharge capability and can also effectively prevent the grounding network from having a significant impact on the radiation performance of the antenna assembly.

[0018] In one example, the grounding network is located in the same plane, or the grounding network is located in multiple planes, providing good design flexibility.

[0019] In one example, the antenna assembly further includes a dielectric substrate comprising a first surface and a second surface facing away from each other. The radiator is located on the first surface, and the ground plane is located on the second surface. That is, the antenna assembly can be a circuit board structure, offering good manufacturing convenience and lower manufacturing costs.

[0020] In one example, the ground terminal is located on the first plate surface. The dielectric substrate has a first conductive structure extending through the first and second plate surfaces, with one end of the first conductive structure connected to the ground terminal and the other end connected to the ground plane. That is, an effective connection between the ground terminal and the ground plane located on different plate surfaces can be achieved through the first conductive structure.

[0021] In one example, the connection terminal is located on the second plate surface. The dielectric substrate has a second conductive structure extending through both the first and second plate surfaces. One end of the second conductive structure is connected to the connection terminal, and the other end is connected to the radiator. That is, the second conductive structure enables an effective connection between the connection terminal and the radiator located on different plate surfaces.

[0022] In one example, the inductive structure is S-shaped or spiral-shaped, or it can be any other structural shape with inductive properties, offering good structural flexibility and diversity.

[0023] Secondly, this application provides an antenna, which includes a feed network and any of the aforementioned antenna components, with the feed network connected to a radiator. The feed network may include at least one of devices such as a phase shifter and a filter. By configuring the feed network, beam scanning and other functions of the antenna can be achieved, thereby improving the antenna's signal coverage. In the antenna provided in this application, by configuring the aforementioned antenna components, the antenna has good electrostatic discharge capability, ensuring that some components in the antenna are not damaged by electrostatic discharge, thus guaranteeing the antenna's safety. Furthermore, the grounding network in the antenna components does not significantly affect the antenna's signal transmission and reception performance, thus giving the antenna good operating performance.

[0024] Thirdly, this application also provides a communication device including the antenna described in the second aspect. By configuring this antenna in the communication device, the operational safety of the communication device and better wireless communication performance can be guaranteed. In one example, the communication device may include a radio frequency (RF) circuit connected to a feed network in the antenna to transmit RF signals to the antenna. Attached Figure Description

[0025] Figure 1 This is a schematic diagram illustrating an application scenario of an antenna provided in an embodiment of this application;

[0026] Figure 2 A structural block diagram of an antenna provided in an embodiment of this application;

[0027] Figure 3 A simplified schematic diagram of an antenna structure provided in an embodiment of this application;

[0028] Figure 4 This is a schematic diagram of a planar structure of an antenna assembly provided in an embodiment of this application;

[0029] Figure 5 A cross-sectional structural diagram of an antenna provided in an embodiment of this application;

[0030] Figure 6 A schematic diagram of a sensory structure provided in an embodiment of this application;

[0031] Figure 7 A schematic diagram of another inductive structure provided in the embodiments of this application;

[0032] Figure 8 A cross-sectional structural schematic diagram of another antenna assembly provided in an embodiment of this application;

[0033] Figure 9 This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0034] Figure 10A This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0035] Figure 10B This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0036] Figure 11 This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0037] Figure 12 for Figure 11 A schematic diagram of the cross-sectional structure of the antenna assembly along the AA direction is shown.

[0038] Figure 13 This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0039] Figure 14 This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0040] Figure 15 This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0041] Figure 16 This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0042] Figure 17 This is a schematic diagram of another planar structure of an antenna assembly provided in an embodiment of this application;

[0043] Figure 18 This is a structural block diagram of a communication device provided in an embodiment of this application. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0045] To facilitate understanding of the antenna components provided in the embodiments of this application, their application scenarios will be introduced first below.

[0046] The antenna assembly provided in this application embodiment can be used in communication equipment such as base stations and radar to realize wireless communication functions.

[0047] For example, such as Figure 1 As shown, this antenna assembly is applicable to scenarios that may include access network equipment and terminals. For example... Figure 1As shown, taking an access network device as a base station as an example, wireless communication can be achieved between the base station and the terminal. This base station can be applied to cellular systems related to the 3rd Generation Partnership Project (3GPP), such as fourth-generation mobile communication systems, fifth-generation mobile communication systems, or future communication systems. This base station can also be applied to open RAN (O-RAN or ORAN), cloud radio access network (C-RAN), or wireless fidelity (WiFi) systems. This base station can also be a communication system that integrates two or more of the above systems.

[0048] Access network equipment, sometimes referred to as radio access network (RAN) nodes, RAN entities, or access nodes, forms part of a communication system and helps terminals achieve wireless access. Multiple RAN nodes in a communication system can be of the same type or different types. In one possible scenario, a RAN node can be a base station, an evolved NodeB (eNodeB), an access point (AP), a transmission reception point (TRP), a next-generation NodeB (gNB), a base station in a future mobile communication system, or an access node in a WiFi system. RAN nodes can be macro base stations, micro base stations, indoor stations, relay nodes, donor nodes, or radio controllers in CRAN scenarios. Optionally, RAN nodes can also be servers, wearable devices, vehicles, or in-vehicle equipment. For example, in vehicle-to-everything (V2X) technology, the access network equipment can be a roadside unit (RSU).

[0049] In another possible scenario, multiple RAN nodes collaborate to assist the terminal in achieving wireless access, with each RAN node performing a portion of the base station's functions. For example, RAN nodes can be central units (CUs), distributed units (DUs), CU-control plane (CPs), CU-user plane (UPs), or radio units (RUs), etc. CUs and DUs can be set up separately or included in the same network element, such as a baseband unit (BBU). RUs can be included in radio frequency equipment or radio frequency units, such as remote radio units (RRUs), active antenna units (AAUs), or remote radio heads (RRHs).

[0050] All base stations or access network nodes, regardless of type, include antennas. Antennas can be devices independent of the radio frequency remote unit or integrated with it. For example... Figure 2 As shown, in one example, antenna 01 may include radiator 011, reflector 012, and feed network 013. The feed network 013 is optional.

[0051] The radiator 011, also known as an oscillator or radiating element, is a unit that constitutes the basic structure of an antenna and can effectively transmit or receive electromagnetic waves.

[0052] The reflector 012 can also be called a floor or base plate. The reflector 012 can improve the receiving sensitivity of the signal from the radiator 011 and reflect the electromagnetic waves radiated by the radiator 011 into the air. The reflector 012 can not only enhance the receiving and transmitting capabilities of the antenna 01, but also block and shield other electromagnetic clutter from the back, preventing electromagnetic clutter from interfering with the radiator 011.

[0053] The main function of the feed network 013 is to feed signals to the radiator 011 with a certain amplitude and phase, or to transmit the wireless signals received by the radiator 011 to the baseband processing unit with a certain amplitude and phase. It is understood that, in specific implementations, the feed network 013 may include at least one of the following devices: a phase shifter, a combiner, a transmission or calibration network, or a filter. This application does not limit the components, type, or functions that the feed network 013 can achieve.

[0054] Of course, the antenna 01 described above can also be applied to various types of communication devices, and this application does not limit the application scenarios of the antenna 01.

[0055] like Figure 3 As shown, antenna 01 can be a microstrip antenna. Simply put, antenna 01 has a printed circuit board (PCB) or flexible printed circuit (FPC) structure. Antenna 01 includes a dielectric substrate 014, a radiator 011, a ground plane 012, and a feed network 013. The radiator 011 is located on one surface of the dielectric substrate 014 (e.g., ...). Figure 3 The upper surface of the substrate 014), and the ground plane 012 is located on another surface of the dielectric substrate 014 (e.g., the upper surface of the substrate 014). Figure 3 (The lower plate surface). The radiator 011 and the feed network 013 are connected by a feed wire 015. The radiator 011 and the ground plane 012 are typically made of materials with good conductivity, such as copper, aluminum, or metal alloys. The dielectric substrate 014 is typically made of insulating materials such as polytetrafluoroethylene or fiberglass. It is understood that microstrip antennas are a commonly used type of antenna, and their working principle will not be elaborated upon here.

[0056] The feed line 015 is electrically connected to the radiator 011, enabling the feed signal to be transmitted between the radiator 011 and the feed network 013. However, in this configuration, if static electricity is present in the radiator 011, it will be conducted to the feed network 013 via the feed line 015. When the accumulated charge of this static electricity is large, a discharge will occur. The electric arc generated by this discharge can interfere with the normal operation of the antenna 01, and may even lead to communication interruptions or distortion.

[0057] Therefore, this application provides an antenna assembly that can effectively achieve electrostatic discharge, and an antenna and communication device equipped with the antenna assembly.

[0058] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0059] Figure 4 This is a schematic diagram of the planar structure of antenna assembly 11. Figure 5 This is a schematic cross-sectional view of antenna 10. Among them, Figure 5 The antenna 10 includes Figure 4 The antenna assembly 11 is shown. Specifically, in one example provided in this application, such as... Figure 5As shown, antenna 10 includes antenna assembly 11 and feed network 12. Antenna assembly 11 includes radiator 111, and feed network 12 is connected to radiator 111 via feed line 120, allowing radio frequency signals transmitted in feed network 12 to be transmitted to radiator 111, causing radiator 111 to radiate electromagnetic waves. Electromagnetic waves received by radiator 111 can also be transmitted to feed network 12. In one example, feed line 120 may specifically be a microstrip line or other type of radio frequency transmission line. Additionally, in some antennas 10, feed line 120 may also be connected to ground plane 112. This application does not limit the specific connection method between feed network 12 and antenna assembly 11.

[0060] Please refer to the following: Figure 4 Antenna assembly 11 includes a radiator 111, a ground plane 112, and a grounding network 113. The radiator 111 radiates or receives electromagnetic waves. The grounding network 113 includes a grounding terminal and a connection terminal. The grounding terminal is connected to the ground plane 112, and the connection terminal is connected to the radiator 111. In other words, the grounding network 113 connects the radiator 111 and the ground plane 112. When there is charge in the radiator 111, it can be discharged to the ground plane 112 through the grounding network 113, thereby preventing the accumulation of charge in the radiator 111 and causing adverse phenomena such as discharge. Through a reasonable structural design, the impact of the grounding network 113 on the radiation performance of the antenna assembly 11 can be reduced. For example, the grounding network 113 can include an inductive structure with inductive characteristics and a resistance wire with high characteristic impedance. Static electricity in the radiator 111 can be discharged to the ground through the static discharge path formed by the inductive structure and the resistance wire, effectively blocking radio frequency signals.

[0061] Specifically, the grounding network 113 includes a grounding terminal 1132 and a connection terminal 1131. The grounding terminal 1132 is connected to the floor 112, and the connection terminal 1131 is connected to the radiator 111. Additionally, the grounding network 113 includes a resistance wire 1133 and an inductive structure 1134, which are connected between the grounding terminal 1132 and the connection terminal 1131, allowing static electricity in the radiator 111 to be discharged to the floor 112 through the circuit formed by the resistance wire 1133 and the inductive structure 1134. It is understood that the connection of the connection terminal 1131 to the radiator 111 includes both a direct and indirect connection. Similarly, the connection of the grounding terminal 1132 to the floor 112 includes both a direct and indirect connection. Figure 4 and Figure 5 In the example provided, connection terminal 1131 is directly connected to radiator 111, and grounding terminal 1132 is indirectly connected to floor 112. This will be explained in detail in the following examples and will not be repeated here.

[0062] The resistor wire 1133 has a high characteristic impedance, thus reducing its impact on the operating frequency or bandwidth of the radiator 111. Furthermore, the inductive structure 1134 has inductive properties, enabling it to conduct direct current and block alternating current. Therefore, static electricity (or direct current) in the radiator 111 can be discharged to the ground 112 through the grounding network 113. In addition, the grounding network 113 can also block high-frequency radio frequency signals (or alternating current), thereby ensuring the operating performance of the antenna assembly 11.

[0063] It should be noted that, in one example, the high characteristic impedance of the resistance line 1133 in the grounding network 113 means that the characteristic impedance of the resistance line 1133 is greater than that of the antenna 10, so as to avoid the grounding network 113 from significantly affecting the radiation performance of the antenna 10. For example, the characteristic impedance of the resistance line 1133 can be greater than or equal to twice the characteristic impedance of the antenna 10. Or, the characteristic impedance of the resistance line 1133 can be greater than or equal to five or ten times the characteristic impedance of the antenna 10, etc. It should be understood that, in any example described in this application, the characteristic impedance of the resistance line 1133 can also meet the above requirements, thereby further enabling the grounding network to have a good electrostatic discharge effect and reducing the impact on the radiation performance of the antenna 10.

[0064] In practice, the characteristic resistance value of the resistor wire 1133 can be reasonably adjusted by adjusting parameters such as material, length, width, cross-sectional shape or cross-sectional area, so that the grounding network 113 has a good electrostatic discharge effect and reduces the adverse effects on the radiation performance of the antenna 10.

[0065] In one example provided in this application, the inductive structure 1134 can be formed by bending the resistance wire 1133, that is, the inductive structure 1134 and the resistance wire 1133 are an integral structure. This is beneficial to improving the ease of manufacturing the grounding network 113 and reducing the number of solder joints in the grounding network, and is beneficial to improving the reliability and stability of the connection between the inductive structure 1134 and the resistance wire 1133.

[0066] In other examples, the inductive structure 1134 can also be a separate inductor. Alternatively, the inductive structure 1134 can be fabricated separately from the resistance wire 1133. The fabricated inductive structure 1134 and the resistance wire 1133 can be connected by processes such as welding.

[0067] To facilitate understanding of the technical solution of this application, the following example will be illustrated by taking the structure in which the inductive structure 1134 and the resistance line 1133 are integrated.

[0068] The specific shape of the inductive structure 1134 can be varied. For example, the inductive structure 1134 can be S-shaped, spiral-shaped, or other shapes. The spiral shape can be planar or three-dimensional. Planar spirals can also have various shapes, such as square, rectangle, circle, triangle, etc. Regardless of the shape, as long as the structure possesses inductive characteristics, this application is not limited. Figures 4-7 For example, in Figure 4 In the example provided, the sensory structure 1134 is specifically S-shaped. Or, as... Figure 6 As shown, the sensory structure 1134 is specifically a planar spiral, and the outline of each turn in the sensory structure 1134 is approximately circular. Or, as Figure 7 As shown, the sensory structure 1134 is a planar spiral, and the outline of each turn in the sensory structure 1134 is approximately rectangular. Alternatively, in other examples, the sensory structure 1134 may also be a three-dimensional spiral or S-shape.

[0069] Additionally, it should be noted that the aforementioned radiator 111 can be referenced. Figure 2 The description of the radiator 011 in the antenna 10 is as follows. Alternatively, the radiator 111 can also be a director piece. In general, any element or structure in the antenna 10 used for radiating or receiving electromagnetic waves can be considered as the radiator 111 described above.

[0070] To facilitate understanding of the technical solution of this application, the following example will use a microstrip antenna 10 as an example for illustrative purposes. Of course, the same applies when the antenna 10 has other structural types, which will not be elaborated here.

[0071] like Figure 4 and Figure 5 As shown, the antenna 10 also includes a dielectric substrate 115, which typically has a high dielectric constant. The material of the dielectric substrate 115 can be referenced from [reference needed]. Figure 3 Description of dielectric substrate 014. Dielectric substrate 115 has a first plate surface 1151 facing away from each other (e.g., Figure 5 The upper plate surface) and the second plate surface 1152 (e.g.) Figure 5 (Lower plate surface). The radiator 111 and the grounding network 113 are both located on the first plate surface 1151 of the dielectric substrate 115, and the ground plane 112 is located on the second plate surface 1152 of the dielectric substrate 115.

[0072] In one example, the ground plane 112 can be a copper plate, or it can be made of a material with good conductivity such as aluminum. The radiator 111 can be a copper plate, or it can be made of a material with good conductivity such as aluminum. In practical applications, the shape of the radiator 111 can be reasonably prepared by etching or other processes to reasonably set the performance such as the operating frequency band of the radiator 111. Alternatively, the resistance line 1133 in the grounding network 113 can be an independent structure, which can be set on the first plate surface 1151 of the dielectric substrate 115 by bonding, welding or other processes. Alternatively, the radiator 111 and the resistance line 1133 can be made from a single copper plate located on the first plate surface 1151 by etching or other processes. Alternatively, the radiator 111 can be made from a copper layer in a printed circuit board or a copper layer in a flexible printed circuit board, and the radiator 111 can be shaped by etching or other processes. Alternatively, the resistance line 1133 or the inductive structure 1134 can also be a copper layer in a printed circuit board or a flexible circuit board, and can be fabricated using processes such as etching. Or, in some examples, the radiator 111, the resistance line 1133, and the inductive structure 1134 can be fabricated within a single copper layer, or they can be fabricated within different copper layers.

[0073] This application does not impose any restrictions on the specific manufacturing process of the floor 112, the radiator 111, and the grounding network 113.

[0074] In addition, Figure 4 and Figure 5 In the example provided, the grounding terminal 1132 of the grounding network 113 is connected to the ground plane 112 through a first conductive structure 114, which is specifically a metallized via (or through-hole). Simply put, the metallized via includes a through-hole 1141 and a conductive layer 1142 located on the inner wall of the through-hole 1141. One end of the metallized via (e.g., ...) Figure 5 The upper end of the metallized hole extends to the first plate surface 1151 and connects to the grounding terminal 1132 located on the first plate surface 1151. The other end of the metallized hole (such as...) Figure 5 The lower end of the radiator 111 extends to the second plate surface 1152 and connects to the floor 112. Static electricity in the radiator 111 can be discharged to the floor 112 through the first conductive structure 114 formed by the grounding network 113 and the metallized holes.

[0075] It should be noted that, in Figure 5 The example provided is exemplified by the first conductive structure 114 being a metallized via. In other examples, the first conductive structure 114 may also be a conductive wire, conductive post, or other structure with conductive function.

[0076] Alternatively, in some examples, the grounding terminal 1132 of the grounding network 113 may also extend to the second plate surface 1152.

[0077] For example, such as Figure 8 As shown, the dielectric substrate 115 has a through hole 1153 extending through its thickness. The grounding terminal 1132 of the grounding network 113 can extend through the through hole 1153 to the second plate surface 1152 and connect to the ground plane 112. That is, the connection terminal 1131 of the grounding network 113 is located on the first plate surface 1151, and the grounding terminal 1132 is located on the second plate surface 1152.

[0078] Alternatively, in some examples, the grounding terminal 1132 of the grounding network 113 may extend from the edge of the dielectric substrate 115 to the second plate surface 1152 and connect to the ground plane 112. That is, the dielectric substrate 115 may also not include through holes 1153 for the resistance wires 1133 to pass through, in order to simplify the manufacturing process.

[0079] Alternatively, in some examples, the connection terminal 1131 of the grounding network 113 may also be located on the second plate surface 1152. The dielectric substrate 115 may include a second conductive structure extending through the first plate surface 1151 and the second plate surface 1152, wherein the second conductive structure may be the same as or similar to the first conductive structure 114. One end of the second conductive structure may be connected to the radiator 111, and the other end may be connected to the connection terminal 1131. Alternatively, the dielectric substrate 115 may also include a through-hole extending through the first plate surface 1151 and the second plate surface 1152. The connection terminal 1131 may extend through the through-hole to the first plate surface 1151 and connect to the radiator 111.

[0080] In summary, in some examples, all lines or devices in the grounding network 113 may be located in the same plane or in multiple different planes. For example, in Figure 5 In the example provided, the grounding network 113 is located in the same plane. Alternatively, in... Figure 8 In the examples provided, the grounding network 113 is located in different planes. Additionally, the dielectric substrate 115 can be a single-layer board or a multi-layer board. The lines or devices in the grounding network 113 can be located on the outermost surface of the dielectric substrate 115 or inside the dielectric substrate 115. Alternatively, in some examples, the radiator 111 or the ground plane 112 can be located on the outermost surface of the dielectric substrate 115 or inside the dielectric substrate 115, which will not be elaborated further here.

[0081] Furthermore, when the length of the resistance wire 1133 is close to half the wavelength of the operating frequency of the antenna 10, the resistance wire 1133 may generate electromagnetic resonance, which will reduce the radiation performance of the antenna 10. Here, the wavelength described in this application refers to the same wavelength (λ), that is, when the antenna 10 has a single operating frequency, the wavelength (λ) corresponds to the wavelength of the electromagnetic wave at that operating frequency propagating in space. When the antenna 10 has multiple operating frequency bands, the wavelength corresponds to the wavelength of the electromagnetic wave at the highest operating frequency within that band propagating in space. The wavelength (λ) refers to the wavelength (λ) of the electromagnetic wave radiated by the antenna 10 propagating in space, and half the wavelength is half of the wavelength.

[0082] For example, the resistance wire 1133 can be divided into at least two segments, and the different resistance wires can be connected by a resistor to avoid the generation of electromagnetic resonance.

[0083] Specifically, such as Figure 9 As shown, in an example of an antenna assembly provided in this application, the resistance line 1133 includes two resistance lines, namely resistance line 11331 and resistance line 11332. The inductive structure 1134 is located within the resistance line 11331, and one end of the resistance line 11331 (e.g., Figure 9 The left end is connected to the radiator 111, and the other end (such as...) Figure 9 The right end of the resistor (as shown in the image) is connected to resistor R. One end of resistor 11332 (e.g., the right end of the resistor) is connected to resistor R. Figure 9 The left end of the connector is connected to resistor R, and the other end (e.g., the left end of the connector) .... Figure 9 The right end of the structure is connected to the first conductive structure 114. The first conductive structure 114 is used to connect to the ground terminal.

[0084] That is, the resistor line 1133 is divided into resistor line 11332 and resistor line 11332 by the resistor R in order to avoid electromagnetic resonance of the entire resistor line 1133 and to ensure the radiation performance of the antenna 10.

[0085] To prevent electromagnetic resonance in resistors 11331 and 11332, the lengths L1 and L2 of resistors 11331 and 11332 are both less than or equal to λ / 2. However, in some examples, the resistors in resistor 1133 are typically connected to the radiator 111, the first conductive structure 114, or the resistor R using welding or other processes. Welding inevitably alters the length of the resistors in resistor 1133. Therefore, in some examples, the length L1 of resistor 11331 or the length L2 of resistor 11332 can also be equal to λ / 2. In summary, in one example, it is sufficient to ensure that electromagnetic resonance in resistor 1133 or its resistors is kept within a controllable range, thus preventing a deterioration in the radiation performance of the antenna 10.

[0086] It should be noted that, in Figure 9 In the example of the antenna assembly provided, the resistor line 11331 includes the inductive structure 1134. That is, the length L1 of the resistor line 11331 includes the total length of the line, including the length of the inductive structure 1134. When the inductive structure 1134 is an independent inductor device independent of the resistor line 11331, the length L1 of the resistor line 11331 may only include the length of the resistor line 1133.

[0087] In addition, in some examples, antenna 10 typically operates in one or more operating frequency bands, meaning antenna 10 has a highest operating frequency and a lowest operating frequency. Therefore, the length of each resistance wire is less than or equal to half the wavelength of the antenna's highest operating frequency. In other words, the lengths L1 of resistance wire 11331 and L2 of resistance wire 11332 can both be less than half the wavelength of the highest operating frequency band of antenna 10 to prevent electromagnetic resonance in resistance wires 11331 and 11332.

[0088] Furthermore, the resistance wire 1133 can also be divided into three or more resistance wire segments. These segments can be connected in series with resistors. The specific number of resistance wires into which the resistance wire 1133 is divided can be reasonably set according to actual needs, and will not be elaborated here.

[0089] Any of the examples provided in this application can be applied to the above-described resistor setting scheme. That is, regardless of how many radiators or grounding terminals are included in the antenna assembly, or what kind of grounding network is set up, a resistor can be used to divide the resistance line in the grounding network into multiple segments.

[0090] In one example, the resistance value of resistor R can be varied.

[0091] For example, the resistance value of resistor R can be greater than or equal to twice the characteristic impedance of antenna 10 to ensure that the electrostatic discharge path formed by resistor R and the resistor wire connected to R has a good electrostatic discharge effect and avoids electromagnetic resonance. For example, the resistance value of resistor R can be 1 kiloohm (KΩ). In one example, the specific resistance value of resistor R can be reasonably set according to the actual situation, which will not be elaborated here.

[0092] In addition, Figure 9 The example of the antenna assembly provided is illustrated by using an inductive structure 1134 connected between the connection terminal 1131 and the ground terminal 1132 as an example. In other examples, more inductive structures 1134 may be connected between the connection terminal 1131 and the ground terminal 1132.

[0093] For example, such as Figure 10AAs shown, in another example of an antenna assembly provided in this application, two inductive structures, namely inductive structure 1134a and inductive structure 1134b, are connected between the ground terminal 1132 and the connection terminal 1131. Specifically, both inductive structure 1134a and inductive structure 1134b belong to the resistance line 11331.

[0094] Or, such as Figure 10B As shown, in another example of an antenna assembly provided in this application, inductive structure 1134a belongs to resistor line 11331, and inductive structure 1134b belongs to resistor line 11332.

[0095] Alternatively, in other examples, three or more inductive structures 1134 may be connected between the ground terminal 1132 and the connection terminal 1131, which will not be elaborated here.

[0096] In summary, among the multiple inductive structures 1134 connected between the grounding terminal 1132 and the connection terminal 1131, the multiple inductive structures 1134 can be directly connected. Alternatively, the multiple inductive structures 1134 can be connected through a resistance wire 1133. Alternatively, the multiple inductive structures 1134 can be connected through a resistor. The multiple inductive structures 1134 can belong to the same resistance wire or to different resistance wires.

[0097] In the above example, the antenna 10 includes one radiator 111 as an exemplary illustration. In other examples, the antenna 10 may include two or more radiators 111. Each radiator 111 can be connected to the ground 112 via a grounding network 113.

[0098] To facilitate understanding of the technical solution of this application, the following example will be used to illustrate the concept of an antenna 10 comprising four radiators 111, all of which are connected to the ground 112 via a grounding network 113.

[0099] Please refer to the following: Figure 11 and Figure 12 . Figure 11 This is a schematic diagram of the planar structure of the antenna assembly. Figure 12 for Figure 11 A cross-sectional view along direction AA. In one example provided in this application, the four radiators are radiator 111a, radiator 111b, radiator 111c, and radiator 111d. All four radiators are connected to the floor 112 via a grounding network 113, allowing static electricity in each radiator to be discharged to the floor 112 through the grounding network 113. Furthermore, the grounding network 113 includes four grounding terminals and four first conductive structures, with the four grounding terminals respectively connected to the floor 112 via corresponding first conductive structures.

[0100] Specifically, radiators 111a, 111b, 111c, and 111d are all located on the first surface 1151 of the dielectric substrate 115. The grounding network 113 includes four connection terminals and four grounding terminals. The four connection terminals are connection terminals 1131a, 1131b, 1131c, and 1131d. The four grounding terminals are grounding terminals 1132a, 1132b, 1132c, and 1132d. Connection terminal 1131a is connected to radiator 111a, and grounding terminal 1132a is connected to ground plane 112. Connection terminal 1131b is connected to radiator 111b, and grounding terminal 1132b is connected to ground plane 112. Connection terminal 1131c is connected to radiator 111c, and grounding terminal 1132c is connected to ground plane 112. The connection terminal 1131d is connected to the radiator 111d, and the grounding terminal 1132d is connected to the floor 112.

[0101] The grounding network 113 includes four resistance wires: resistance wire 1133a, resistance wire 1133b, resistance wire 1133c, and resistance wire 1133d. Resistance wire 1133a has an inductive structure 1134a, resistance wire 1133b has an inductive structure 1134b, resistance wire 1133c has an inductive structure 1134c, and resistance wire 1133d has an inductive structure 1134d.

[0102] Resistance wire 1133a is connected between connection terminal 1131a and ground terminal 1132a, resistance wire 1133b is connected between connection terminal 1131b and ground terminal 1132b, resistance wire 1133c is connected between connection terminal 1131c and ground terminal 1132c, and resistance wire 1133d is connected between connection terminal 1131d and ground terminal 1132d.

[0103] Static electricity in radiator 111a can be discharged to floor 112 through resistance wire 1133a and first conductive structure 114a; static electricity in radiator 111b can be discharged to floor 112 through resistance wire 1133b and first conductive structure 114b; static electricity in radiator 111c can be discharged to floor 112 through resistance wire 1133c and first conductive structure 114c; and static electricity in radiator 111d can be discharged to floor 112 through resistance wire 1133d and first conductive structure 114d.

[0104] In summary, in one example, the grounding network 113 may include multiple connection terminals 1131 and multiple grounding terminals 1132, the number of which corresponds to the number of radiators 111, and each connection terminal 1131 is connected to one of the radiators 111. The connection terminals 1131 and grounding terminals 1132 are arranged in pairs, and each pair is connected via a resistance wire 1133 and an inductive structure 1134. Alternatively, it can be considered that each grounding terminal 1132 is connected to a different connection terminal 1131 via a resistance wire 1133. Furthermore, the connection terminals 1131 connected to different grounding terminals 1132 are not the same.

[0105] exist Figure 11 In the example provided, grounding terminal 1132a is connected to ground 112 via conductive structure 114a, grounding terminal 1132b is connected to ground 112 via conductive structure 114b, grounding terminal 1132c is connected to ground 112 via conductive structure 114c, and grounding terminal 1132d is connected to ground 112 via conductive structure 114d. That is, the four grounding terminals are connected to ground 112 via four different conductive structures.

[0106] In other examples, multiple grounding terminals can also be connected to ground 112 through a smaller number of first conductive structures.

[0107] For example, such as Figure 13 As shown, in another example provided in this application, the antenna assembly 11 includes two first conductive structures, namely, first conductive structure 114a and first conductive structure 114b. One end of the first conductive structure 114a is connected to the ground plane 112, and the other end of the first conductive structure 114a is connected to ground terminals 1132a and 1132b. One end of the first conductive structure 114b is connected to the ground plane 112, and the other end of the first conductive structure 114b is connected to ground terminals 1132c and 1132d. By adopting the above structural arrangement, the number of first conductive structures used can be reduced, which is beneficial to reducing the manufacturing cost of the antenna 10 and improving manufacturing efficiency.

[0108] Or, in Figure 13 In the example provided, grounding terminals 1132a and 1132b can be considered as combined into a single grounding terminal, which is located at a position connected to the first conductive structure 114a. Correspondingly, grounding terminals 1132c and 1132d can be considered as combined into a single grounding terminal, which is located at a position connected to the first conductive structure 114b.

[0109] Or, such as Figure 14As shown, in another example provided in this application, the antenna assembly 11 includes a first conductive structure 114. One end of the first conductive structure 114 is connected to the ground plane 112, and the other end of the first conductive structure 114 is connected to ground terminals 1132a, 1132b, 1132c, and 1132d. The four ground terminals can be connected to the ground plane 112 through the same first conductive structure 114, which reduces the number of first conductive structures 114 used, thus reducing the manufacturing cost of the antenna assembly 11 and improving manufacturing efficiency.

[0110] Or, in Figure 14 In the example provided, ground terminals 1132a, 1132b, 1132c and 1132d can be considered as being combined into a single ground terminal, which is located at a position connected to the first conductive structure 114.

[0111] In summary, Figure 13 In the example provided, two grounding terminals could be connected to ground 112 via the same first conductive structure. Alternatively, in... Figure 14 In the example provided, four grounding terminals may be connected to the ground plane 112 through the same first conductive structure. In other examples, three or more grounding terminals may be connected to the ground plane through the same first conductive structure, i.e., at least two grounding terminals may be connected to the ground plane 112 through the same first conductive structure.

[0112] Or, such as Figure 14 As shown, the grounding network 113 may include a grounding terminal, which can be connected to four connection terminals respectively via resistance wires and inductive structures. Alternatively, when the grounding network 113 includes multiple grounding terminals, any one of the multiple connection terminals can be connected to any one of the multiple grounding terminals via resistance wires and inductive structures. That is, multiple grounding terminals are respectively connected to multiple connection terminals via resistance wires and inductive structures, and the connection terminals connected to different grounding terminals are not the same.

[0113] In a grounding network, some of the connection terminals are connected to the ground. For example, in... Figure 13 In the example provided, grounding terminals 1132a and 1132b are connected. Grounding terminals 1132c and 1132d are connected. Furthermore, grounding terminals 1132a and 1132c, 1132a and 1132d, 1132b and 1132c, and 1132b and 1132d are not connected.

[0114] Alternatively, multiple grounding terminals in a grounding network can be connected. For example, in Figure 14In the example provided, ground terminals 1132a, 1132b, 1132c, and 1132d are all connected.

[0115] In addition, Figure 14 In the example provided, the grounding network 113 includes four inductive structures, namely inductive structure 1134a, inductive structure 1134b, inductive structure 1134c and inductive structure 1134d, such that the static electricity in radiator 111a is discharged to the floor 112 through inductive structure 1134a, the static electricity in radiator 111b is discharged to the floor 112 through inductive structure 1134b, the static electricity in radiator 111c is discharged to the floor 112 through inductive structure 1134c, and the static electricity in radiator 111d is discharged to the floor 112 through inductive structure 1134d.

[0116] Alternatively, multiple radiators may share a single inductive structure 1134.

[0117] For example, such as Figure 15 As shown, in another example provided in this application, radiators 111a and 111b can be vented to floor 112 through the same inductive structure 1134a. Radiators 111c and 111d can be vented to floor 112 through the same inductive structure 1134b.

[0118] Or, such as Figure 16 As shown, in another example provided in this application, radiators 111a, 111b, 111c and 111d are all radiated to floor 112 through the same inductive structure 1134.

[0119] In summary, when a grounding terminal is connected to multiple connection terminals through a resistance wire and an inductive structure, the grounding terminal can be connected to multiple connection terminals separately through the same inductive structure.

[0120] Furthermore, in the example above, multiple radiators are independently connected to the floor 112 via the grounding network 113. In other examples, the conductive path between any one radiator and the floor 112 may also include other radiators.

[0121] For example, such as Figure 17 As shown, in one example provided in this application, any radiator has at least two paths to the floor, that is, any radiator is connected to at least two connection terminals of the grounding network, wherein each of the two connection terminals of the radiator can be connected to at least one inductive structure through a resistance wire, thereby reducing the probability of failure to discharge static electricity due to one of the paths being inoperable.

[0122] refer to Figure 17In the illustrated implementation, radiators 111a and 111b are connected via a resistance line 1133a and an inductive structure 1134a, and radiators 111b and 111c are connected via a resistance line 1133b and an inductive structure 1134b. Radiators 111c and 111d are connected via a resistance line 1133c and an inductive structure 1134c, and radiators 111d and 111a are connected via a resistance line 1133d and an inductive structure 1134d. For example, when radiator 111a is described as a first radiator, radiators 111b and 111d can be described as second radiators adjacent to the first radiator. That is, a plurality of radiators may include a first radiator and a second radiator adjacent to the first radiator. The first radiator and the second radiator can be connected via a resistance line and an inductive structure.

[0123] The static electricity in radiator 111a can be discharged to the floor through two paths. One path includes inductive structure 1134a, resistor wire 1133a, radiator 111b, inductive structure 1134b, resistor wire 1133b, radiator 111c, resistor wire 1133c, inductive structure 1134c, and radiator 111d. The other path includes inductive structure 1134d, resistor wire 1133d, and radiator 111d. In other words, radiator 111a can be connected to the floor through two paths, ensuring that even if one path fails, the static electricity in radiator 111a can still be discharged to the floor through the other path, providing good reliability. Other radiators (such as radiator 111b) also have two static electricity discharge paths, which will not be described in detail here.

[0124] Understandable, Figure 17 In the illustrated scheme, the grounding network 113 includes a grounding terminal 1132 and eight connection terminals. These eight connection terminals are 1131a, 1131b, 1131c, 1131d, 1131e, 1131f, 1131g, and 1131h. Connection terminals 1131a and 1131h are connected to radiator 111a. Connection terminals 1131b and 1131c are connected to radiator 111b. Connection terminals 1131d and 1131e are connected to radiator 111c. Connection terminals 1131f and 1131g are connected to radiator 111d.

[0125] In summary, any radiator can be connected to at least two terminals, giving it at least two electrostatic discharge paths and thus good reliability.

[0126] exist Figure 17In the example provided, the grounding network 113 includes a grounding terminal 1132. In other examples, the grounding network 113 may also include two or more grounding terminals 1132. Alternatively, in some examples, one of the radiators 111 may be connected to at least one adjacent radiator via a resistive wire and an inductive structure to increase the electrostatic discharge path of the radiator.

[0127] In addition to including any of the antenna components 11 mentioned above, antenna 10 may also include a feed network.

[0128] For example, such as Figure 18 As shown, in a communication device provided in this application, the communication device includes a radio frequency (RF) circuit, and the antenna may include multiple radiating structures. A feed network can be connected to the multiple radiating structures. Furthermore, the feed network is also connected to the RF circuit. That is, the feed network is connected between the RF circuit and the radiating structures.

[0129] The main function of the feed network is to feed the signals from the radio frequency circuit to the radiating structure according to a certain amplitude and phase. The feed network may include at least one of the following devices: phase shifter, combiner, drive or calibration network, or filter. This application does not limit the components, type, or functions that the feed network can achieve.

[0130] That is, by configuring the feed network, parameters such as phase can be effectively adjusted, so that the antenna has the ability to scan beams and can effectively improve the signal coverage of antenna 10.

[0131] In addition, Figure 18 The examples provided illustrate a communication device that includes radio frequency (RF) circuitry. In other examples, the RF circuitry may be located at a remote location, and the RF circuitry may be connected to the antenna via a long coaxial cable or similar cable. In other words, the communication device may or may not include RF circuitry; this will not be elaborated upon here.

[0132] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions between different embodiments are consistent and can be referenced by each other. Technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.

[0133] In this application, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, or B exists alone, where A and B can be singular or plural.

[0134] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

Claims

1. An antenna assembly, characterized in that, This includes the floor, radiators, and grounding network; The radiator is used to radiate or receive electromagnetic waves; The grounding network includes a grounding terminal and a connection terminal, wherein the grounding terminal is connected to the floor and the connection terminal is connected to the radiator; The grounding network also includes a resistance line and an inductive structure, which are connected between the grounding terminal and the connection terminal.

2. The antenna assembly according to claim 1, characterized in that, The antenna assembly includes a plurality of the radiators, and the grounding network includes a plurality of the connection terminals; The plurality of radiators and the plurality of connection terminals are connected in a one-to-one correspondence.

3. The antenna assembly according to claim 2, characterized in that, The grounding network includes a grounding terminal, which is connected to each of the connection terminals via the resistance wire and the inductive structure.

4. The antenna assembly according to claim 2, characterized in that, The grounding network includes a plurality of grounding terminals, and any one of the plurality of connection terminals is connected to any one of the plurality of grounding terminals through the resistance wire and the inductive structure.

5. The antenna assembly according to claim 4, characterized in that, All of the grounding terminals in the grounding network are connected; or, some of the grounding terminals in the grounding network are connected.

6. The antenna assembly according to any one of claims 1 to 5, characterized in that, The antenna assembly includes a plurality of radiators, the plurality of radiators including a first radiator and at least one second radiator adjacent to the first radiator; The first radiator and the second radiator are connected by the resistance wire and the inductive structure.

7. The antenna assembly according to claim 1, characterized in that, The antenna assembly includes a radiator, and the grounding network includes a grounding terminal and a connection terminal.

8. The antenna assembly according to any one of claims 1 to 7, characterized in that, The resistance wire includes multiple resistance wire segments, which are connected by resistors.

9. The antenna assembly according to claim 8, characterized in that, At least one of the segments has a resistance wire length that is less than or equal to half the wavelength of the highest operating frequency of the antenna.

10. The antenna assembly according to claim 8 or 9, characterized in that, The resistance value is greater than or equal to twice the characteristic impedance of the antenna assembly.

11. The antenna assembly according to any one of claims 1 to 10, characterized in that, The characteristic impedance of the resistance wire is greater than or equal to twice the characteristic impedance of the antenna assembly.

12. The antenna assembly according to any one of claims 1 to 11, characterized in that, The grounding network is located in the same plane, or the grounding network is located in multiple planes.

13. The antenna assembly according to any one of claims 1 to 12, characterized in that, The antenna assembly further includes a dielectric substrate, which includes a first plate surface and a second plate surface that are opposite to each other. The radiator is located on the first panel, and the floor is located on the second panel.

14. The antenna assembly according to claim 13, characterized in that, The grounding terminal is located on the first plate surface; The dielectric substrate has a first conductive structure that extends through the first plate surface and the second plate surface; One end of the first conductive structure is connected to the grounding terminal, and the other end of the first conductive structure is connected to the ground.

15. The antenna assembly according to claim 13 or 14, characterized in that, The connecting end is located on the second plate surface; The dielectric substrate has a second conductive structure that extends through the first plate surface and the second plate surface; One end of the second conductive structure is connected to the connection end, and the other end of the second conductive structure is connected to the radiator.

16. The antenna assembly according to any one of claims 1 to 15, characterized in that, The sensory structure is S-shaped or spiral-shaped.

17. An antenna, characterized in that, It includes a feed network and an antenna assembly as described in any one of claims 1 to 16, wherein the feed network is connected to the radiator.

18. A communication device, characterized in that, It includes a radio frequency circuit and an antenna as described in claim 17, wherein the radio frequency circuit is connected to the feed network.

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