A high voltage arc extinguishing device for power grid

Abstract

The application discloses a kind of high voltage arc extinguishing devices of electric power grid, including device module, a pair of convection heat dissipation mechanism and uniform heat dissipation mechanism, a pair of convection heat dissipation mechanism is fixedly installed in the downside of device module, convection heat dissipation mechanism includes convection passage assembly, convection temperature difference component and convection cooling component, convection passage assembly is fixedly installed in the downside of device module, convection temperature difference component is set to one side of convection passage assembly, convection cooling component is fixedly installed in the upside of convection temperature difference component.The high voltage arc extinguishing devices of electric power grid of the application is set through corresponding mechanism, in the process of IGBT module high-frequency switch, can quickly cool for IGBT module, reduce its power consumption to heat-up speed, reduce the appearance of junction temperature phenomenon, not only heat dissipation effect can be guaranteed, also greatly reduce the appearance of thermal fatigue failure, effectively reduce the probability of IGBT module failure, reduce the expense of repair.

Description

Technical Field

[0001] This invention belongs to the technical field of high-voltage arc suppression devices for power grids, and specifically relates to a high-voltage arc suppression device for power grids. Background Technology

[0002] High-voltage arc suppression devices are one of the core equipment for ensuring the safe operation of power distribution networks. Their core function is to eliminate the electric arc generated when a single-phase ground fault occurs in a high-voltage power grid, prevent the fault from expanding, and ensure the stability of the power grid. They are mainly used in medium and high-voltage power distribution networks of 3-66kV, and are especially suitable for power grids with many cable lines. In such power grids, the line-to-ground capacitance is large. When a single-phase ground fault occurs, a continuous capacitive current will be generated, which can easily form a stable electric arc, thereby triggering arc ground overvoltage, damaging equipment, or even causing phase-to-phase short circuits.

[0003] The core principle of high-voltage arc extinguishing devices is to reduce the residual current at the fault point to a level that cannot sustain arc combustion by compensating for the grounding capacitance current. This residual current level is usually less than 10A, thereby quickly extinguishing the arc. Common types include arc extinguishing coils and active arc extinguishing devices.

[0004] IGBT stands for Insulated Gate Bipolar Transistor. It is a core power electronic device mainly used for power conversion and control in high-voltage and high-current scenarios. It is also the core brain of equipment such as active arc suppression devices, frequency converters, and new energy inverters. IGBTs are widely used in high-voltage scenarios such as active arc suppression devices and new energy power plants.

[0005] The main function of the IGBT module is: when a fault occurs, the IGBT will adjust the output current in a high-frequency switching manner according to the controller's instructions, quickly generate a compensation current that is equal in magnitude and opposite in direction to the "grounding capacitor current", reduce the residual current at the fault point to below 1A, and ensure that the arc is extinguished.

[0006] Currently, IGBT modules are an essential component in active arc suppression devices. However, during high-frequency switching, they generate a large amount of power consumption, which rapidly increases the heat of the IGBT module, causing the junction temperature of the IGBT module to rise. During long-term operation, not only is heat dissipation difficult to guarantee, but thermal fatigue failure is also very likely to occur. Moreover, the maintenance cost is high, and once damaged, it will cause considerable losses.

[0007] Therefore, in order to address the aforementioned technical problems, it is necessary to provide a high-voltage arc suppression device for power grids.

[0008] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0009] The purpose of this invention is to provide a high-voltage arc suppression device for power grids, which can solve the problem that the IGBT module in the existing high-voltage arc suppression device is prone to junction temperature during high-frequency switching, which not only makes heat dissipation difficult to guarantee, but also easily leads to thermal fatigue and high maintenance costs.

[0010] To achieve the above objectives, a specific embodiment of the present invention provides the following technical solution: A high-voltage arc suppression device for power grids includes: a device module, a pair of convection cooling mechanisms, and a uniform cooling mechanism. The pair of convection cooling mechanisms are fixedly installed on the lower side of the device module. Each convection cooling mechanism includes a convection channel assembly, a convection temperature difference assembly, and a convection cooling assembly. The convection channel assembly is fixedly installed on the lower side of the device module, the convection temperature difference assembly is disposed on one side of the convection channel assembly, and the convection cooling assembly is fixedly installed on the upper side of the convection temperature difference assembly. The uniform cooling mechanism is fixedly installed between the pair of convection cooling mechanisms and the device module.

[0011] In one or more embodiments of the present invention, the convection channel assembly includes: a convection heat dissipation mounting chamber, a convection heat dissipation storage chamber, a pair of convection heat dissipation baffles, a plurality of convection heat dissipation through pipes, and a plurality of convection heat dissipation channel partitions. The convection heat dissipation mounting chamber is fixedly installed on the lower side of the device module. The convection heat dissipation storage chamber is disposed on one side of the convection heat dissipation mounting chamber. The pair of convection heat dissipation baffles is fixedly installed inside the convection heat dissipation mounting chamber. The plurality of convection heat dissipation through pipes are fixedly installed on the side of the pair of convection heat dissipation baffles adjacent to each other. The plurality of convection heat dissipation channel partitions are fixedly installed between the pair of convection heat dissipation baffles.

[0012] In one or more embodiments of the present invention, a convection heat dissipation channel liquid inlet pipe is fixedly installed between the convection heat dissipation storage chamber and the convection heat dissipation installation chamber. The convection heat dissipation channel liquid inlet pipe is configured to pass through the convection heat dissipation installation chamber and the convection heat dissipation storage chamber. The convection heat dissipation is configured to pass through the convection heat dissipation baffle plate.

[0013] In one or more embodiments of the present invention, a plurality of the convection heat dissipation pipes are evenly distributed, and the convection heat dissipation channel partition is disposed between a pair of convection heat dissipation pipes.

[0014] In one or more embodiments of the present invention, the convection temperature difference assembly includes: a convection temperature difference receiving chamber, a convection temperature difference sinking chamber, a convection temperature difference connecting pipe, a convection temperature difference sealing plate, a pair of convection temperature difference sealing springs, and a convection temperature difference water pump. The convection temperature difference receiving chamber is disposed on the side of the convection heat dissipation mounting chamber away from the convection heat dissipation storage chamber. The convection temperature difference sinking chamber is fixedly installed on the lower side of the convection temperature difference receiving chamber. The convection temperature difference connecting pipe is fixedly installed on the lower side of the convection temperature difference receiving chamber. The convection temperature difference sealing plate is slidably installed on the lower side of the convection temperature difference receiving chamber. A pair of convection temperature difference sealing springs are sleeved on the convection temperature difference sealing plate. The convection temperature difference water pump is fixedly installed on one side of the convection temperature difference sinking chamber.

[0015] In one or more embodiments of the present invention, the convection temperature difference connecting pipe passes through the convection temperature difference receiving chamber, the convection temperature difference sealing plate is matched with the convection temperature difference connecting pipe, the convection temperature difference sealing spring is disposed between the convection temperature difference sealing plate and the convection temperature difference receiving chamber, and the convection temperature difference water pump passes through the convection heat dissipation storage chamber and the convection temperature difference receiving chamber.

[0016] In one or more embodiments of the present invention, the convection cooling assembly includes: a convection cooling air chamber, a convection cooling flow pipe, a plurality of convection cooling mounting plates, a convection cooling installation pipe, a convection cooling motor, and a convection cooling fan. The convection cooling air chamber is fixedly installed on the upper side of the convection temperature difference receiving chamber. The convection cooling flow pipe is fixedly installed on the lower side of the convection cooling air chamber. The plurality of convection cooling mounting plates are fixedly installed on the convection cooling flow pipe. The convection cooling installation pipe is fixedly installed on the upper side of the convection cooling air chamber. The convection cooling motor is fixedly installed on the upper side of the convection cooling installation pipe. The convection cooling fan is fixedly installed on the lower side of the convection cooling motor.

[0017] In one or more embodiments of the present invention, the convection cooling flow pipe is arranged through the convection cooling air chamber and the convection temperature difference containment chamber, the convection cooling installation pipe is arranged through the convection cooling air chamber, the convection cooling fan is arranged through the convection cooling installation pipe, and the convection cooling fan is arranged inside the convection cooling installation pipe.

[0018] In one or more embodiments of the present invention, the uniform heat dissipation mechanism includes: a uniform heat dissipation receiving chamber and a plurality of uniform heat dissipation support columns. The uniform heat dissipation receiving chamber is fixedly installed between the device module and a pair of convection heat dissipation mounting chambers. The plurality of uniform heat dissipation support columns are fixedly installed within the uniform heat dissipation receiving chamber.

[0019] In one or more embodiments of the present invention, a plurality of uniform heat dissipation support columns are evenly distributed, deionized water is provided in the uniform heat dissipation receiving chamber, and a plurality of uniformly distributed capillary grooves are cut in the uniform heat dissipation receiving chamber. Compared with the prior art, the high-voltage arc suppression device for power grids of the present invention, through the setting of corresponding mechanisms, can quickly cool down the IGBT module during the high-frequency switching process of the IGBT module, reduce the rate at which its power consumption causes heat to rise, and reduce the occurrence of junction temperature phenomena. Not only is the heat dissipation effect guaranteed, but the occurrence of thermal fatigue failure is also greatly reduced, effectively reducing the probability of IGBT module failure and reducing maintenance costs. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a partial three-dimensional view of a high-voltage arc suppression device for a power grid according to an embodiment of the present invention; Figure 2 This is a partial front sectional view of a high-voltage arc suppression device for a power grid according to an embodiment of the present invention; Figure 3 for Figure 2 Schematic diagram of the structure at point A in the middle; Figure 4 for Figure 2 Schematic diagram of the structure at point B; Figure 5 This is a bottom view of a portion of the structure of a high-voltage arc suppression device for a power grid in one embodiment of the present invention; Figure 6 This is a top sectional view of a portion of the structure of a high-voltage arc suppression device for a power grid in one embodiment of the present invention; Figure 7 This is a top sectional view of a uniform heat dissipation mechanism in one embodiment of the present invention; Figure 8 This is a perspective view of a high-voltage arc suppression device for a power grid according to an embodiment of the present invention.

[0022] Explanation of key figure labels: 1-Device module, 2-Convection cooling mechanism, 21-Convection channel assembly, 211-Convection cooling installation chamber, 212-Convection cooling storage chamber, 213-Convection cooling baffle plate, 214-Convection cooling through pipe, 215-Convection cooling channel partition, 216-Convection cooling channel liquid inlet pipe, 22-Convection temperature difference assembly, 221-Convection temperature difference receiving chamber, 222-Convection temperature difference sinking chamber, 223-Convection temperature difference connecting pipe, 224-Convection temperature... 225-Convection temperature difference sealing plate, 226-Convection temperature difference water pump, 227-Convection temperature difference discharge pipe, 23-Convection cooling component, 231-Convection cooling air chamber, 232-Convection cooling flow pipe, 233-Convection cooling mounting plate, 234-Convection cooling mounting pipe, 235-Convection cooling motor, 236-Convection cooling fan, 3-Uniform heat dissipation mechanism, 31-Uniform heat dissipation receiving chamber, 32-Uniform heat dissipation support column. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0024] like Figures 1 to 8 As shown, a high-voltage arc suppression device for power grids in one embodiment of the present invention includes: a device module 1, a pair of convection heat dissipation mechanisms 2, and a uniform heat dissipation mechanism 3. The pair of convection heat dissipation mechanisms 2 are fixedly installed on the lower side of the device module 1. Each convection heat dissipation mechanism 2 includes a convection channel assembly 21, a convection temperature difference assembly 22, and a convection cooling assembly 23. The convection channel assembly 21 is fixedly installed on the lower side of the device module 1, the convection temperature difference assembly 22 is disposed on one side of the convection channel assembly 21, and the convection cooling assembly 23 is fixedly installed on the upper side of the convection temperature difference assembly 22. The uniform heat dissipation mechanism 3 is fixedly installed between the pair of convection heat dissipation mechanisms 2 and the device module 1.

[0025] The operation method of this high-voltage arc suppression device for the power grid is as follows: When the device module 1 is running, the convection temperature difference water pump 226 is started, causing the coolant in the convection temperature difference receiving chamber 221 to be injected into the convection heat dissipation installation chamber 211 through the convection temperature difference discharge pipe 227 and the convection heat dissipation storage chamber 212. The coolant injected into the convection heat dissipation installation chamber 211 absorbs the heat from the uniform heat dissipation mechanism 3, quickly removing the heat from the device module 1. The coolant after absorbing heat will vaporize and be propelled by subsequent coolant into the convection temperature difference receiving chamber 221, where it will be cooled by the convection cooling component 23. At this time, the cooled coolant will settle, and the uncooled coolant will continue to settle. The coolant continues to be cooled by the convection cooling component 23. When the coolant in the convection temperature difference receiving chamber 221 reaches a certain amount, it will squeeze the convection temperature difference sealing plate 224 to open the convection temperature difference connecting pipe 223 and inject it into the convection temperature difference sinking chamber 222. It is then drawn out by the convection temperature difference water pump 226 to form a circulation. The uniform heat dissipation mechanism 3 can absorb the heat in the device module 1. At the same time, after the heat enters the uniform heat dissipation mechanism 3, it will quickly heat the deionized water, causing the vaporized deionized water to flow towards the lower temperature. After cooling, due to the capillary effect, it flows back through the capillary groove to form a circulation, so that the uniform heat dissipation mechanism 3 can conduct the temperature evenly and improve the heat dissipation efficiency of the convection heat dissipation mechanism 2.

[0026] like Figures 1 to 7As shown, the convection channel assembly 21 includes: a convection heat dissipation mounting chamber 211, a convection heat dissipation storage chamber 212, a pair of convection heat dissipation baffles 213, multiple convection heat dissipation through pipes 214, and multiple convection heat dissipation channel partitions 215. The convection heat dissipation mounting chamber 211 is fixedly installed on the lower side of the device module 1. The convection heat dissipation mounting chamber 211 can quickly cool the uniform heat dissipation mechanism 3, causing the temperature of the uniform heat dissipation mechanism 3 to drop rapidly, thereby reducing the temperature of the device module 1. The uniform heat dissipation mechanism 3 can effectively reduce the junction temperature phenomenon of the device module 1. At the same time, the convection heat dissipation mounting chamber 211 facilitates the installation of the convection heat dissipation baffles 213 and the convection heat dissipation channel partitions 215. The convection heat dissipation storage chamber 212 is located on one side of the convection heat dissipation mounting chamber 211. The convection heat dissipation storage chamber 212 can temporarily store coolant, and coolant can be continuously injected into the convection heat dissipation mounting chamber 211 by continuously increasing water pressure. A pair of convection heat dissipation baffles 213 are fixedly installed inside the convection heat dissipation mounting chamber 211, which can evenly distribute the coolant and allow the coolant to flow quickly between the pair of convection heat dissipation channel baffles 215, thereby increasing the speed at which the coolant transfers heat from the surface of the convection heat dissipation channel baffles 215. Multiple convection heat dissipation pipes 214 are fixedly installed on the side of the pair of convection heat dissipation baffles 213 that are close to each other. The convection heat dissipation pipes 214 connect the two sides of the convection heat dissipation baffles 213, allowing coolant to flow between the pair of convection heat dissipation channel baffles 215. Multiple convection heat dissipation channel baffles 215 are fixedly installed between the pair of convection heat dissipation baffles 213. The convection heat dissipation channel baffles 215 can be fixedly installed with the uniform heat dissipation receiving chamber 31, which can quickly absorb heat from the uniform heat dissipation receiving chamber 31. By increasing the contact area with the coolant, the heat dissipation efficiency of the device module 1 is improved.

[0027] like Figures 1 to 3 As shown, a convection cooling channel inlet pipe 216 is fixedly installed between the convection cooling storage chamber 212 and the convection cooling installation chamber 211. The convection cooling channel inlet pipe 216 can connect the convection cooling storage chamber 212 and the convection cooling installation chamber 211, allowing the coolant in the convection cooling storage chamber 212 to enter the convection cooling installation chamber 211, replenishing the coolant in the convection cooling installation chamber 211 and keeping the coolant in the convection cooling installation chamber 211 flowing. The convection cooling channel inlet pipe 216 is set through the convection cooling installation chamber 211 and the convection cooling storage chamber 212, and the convection cooling through pipe 214 is set through the convection cooling baffle plate 213.

[0028] like Figures 1 to 4As shown, multiple convection heat dissipation pipes 214 are evenly distributed. The uniform arrangement of the convection heat dissipation pipes 214 can keep the amount of coolant flowing between a pair of convection heat dissipation channel partitions 215 uniform, and can keep the heat dissipation efficiency of multiple convection heat dissipation channel partitions 215 consistent, reducing the probability of overheating at a certain point. The convection heat dissipation channel partitions 215 are arranged between a pair of convection heat dissipation pipes 214.

[0029] like Figures 1 to 4 As shown, the convection temperature difference assembly 22 includes: a convection temperature difference receiving chamber 221, a convection temperature difference sinking chamber 222, a convection temperature difference connecting pipe 223, a convection temperature difference sealing plate 224, a pair of convection temperature difference sealing springs 225, and a convection temperature difference water pump 226. The convection temperature difference receiving chamber 221 is located on the side of the convection heat dissipation mounting chamber 211 away from the convection heat dissipation storage chamber 212. The convection temperature difference receiving chamber 221 can temporarily contain coolant. Unlike the convection heat dissipation storage chamber 212, the coolant can be cooled within the convection temperature difference receiving chamber 221. Overheated coolant can rise within the large volume of coolant, maintaining a lower temperature for the coolant entering the convection temperature difference sinking chamber 222. The convection temperature difference sinking chamber 222 is fixedly installed below the convection temperature difference receiving chamber 221. The convection temperature difference sinking chamber 222 can contain coolant at lower temperatures, facilitating extraction by the convection temperature difference water pump 226. A convection temperature difference connecting pipe 223 is fixedly installed on the lower side of the convection temperature difference receiving chamber 221. The convection temperature difference connecting pipe 223 connects the convection temperature difference receiving chamber 221 and the convection temperature difference sinking chamber 222, allowing the coolant in the convection temperature difference receiving chamber 221 to flow into the convection temperature difference sinking chamber 222 through the convection temperature difference connecting pipe 223. A convection temperature difference sealing plate 224 is slidably installed on the lower side of the convection temperature difference receiving chamber 221. The convection temperature difference sealing plate 224 can seal the convection temperature difference connecting pipe 223, reducing the probability of coolant in the convection temperature difference receiving chamber 221 entering the convection temperature difference sinking chamber 222. A pair of convection temperature difference sealing springs 225 are sleeved on the convection temperature difference sealing plate 224. The convection temperature difference sealing springs 225 can pull the convection temperature difference sealing plate 224 to keep it closed to the convection temperature difference connecting pipe 223, thereby improving the barrier effect of the convection temperature difference sealing plate 224 on the coolant between the convection temperature difference receiving chamber 221 and the convection temperature difference sinking chamber 222. The convection temperature difference water pump 226 is fixedly installed on one side of the convection temperature difference sinking chamber 222. The convection temperature difference water pump 226 can draw coolant from the convection temperature difference sinking chamber 222 and inject it into the convection heat dissipation storage chamber 212. By continuously injecting coolant into the convection heat dissipation storage chamber 212, the convection heat dissipation storage chamber 212 can continuously deliver coolant to the convection heat dissipation installation chamber 211.

[0030] like Figures 1 to 6As shown, the convection temperature difference connecting pipe 223 penetrates the convection temperature difference receiving chamber 221, connecting the convection temperature difference sinking chamber 222 and the convection temperature difference receiving chamber 221. This allows the coolant with a lower temperature in the convection temperature difference receiving chamber 221 to flow into the convection temperature difference sinking chamber 222. The convection temperature difference sealing plate 224 matches the convection temperature difference connecting pipe 223, improving the sealing effect of the convection temperature difference sealing plate 224 on the convection temperature difference connecting pipe 223 and further reducing the probability of coolant leakage between the convection temperature difference sealing plate 224 and the convection temperature difference connecting pipe 223. The convection temperature difference sealing spring 225 is installed. Between the convection temperature difference sealing plate 224 and the convection temperature difference receiving chamber 221, the convection temperature difference water pump 226 is installed through the convection heat dissipation storage chamber 212 and the convection temperature difference receiving chamber 221. A convection temperature difference discharge pipe 227 is fixedly installed between the convection temperature difference receiving chamber 221 and the convection heat dissipation installation chamber 211. The convection temperature difference discharge pipe 227 is installed through the convection heat dissipation installation chamber 211 and the convection temperature difference receiving chamber 221, connecting the convection temperature difference receiving chamber 221 and the convection heat dissipation installation chamber 211, so that the coolant heated in the convection heat dissipation installation chamber 211 can enter the convection temperature difference receiving chamber 221.

[0031] like Figures 1 to 7 As shown, the convection cooling assembly 23 includes: a convection cooling air chamber 231, a convection cooling circulation duct 232, multiple convection cooling mounting plates 233, a convection cooling mounting duct 234, a convection cooling motor 235, and a convection cooling fan 236. The convection cooling air chamber 231 is fixedly installed on the upper side of the convection temperature difference receiving chamber 221, and can store and continuously draw in air. The convection cooling circulation duct 232 is fixedly installed on the lower side of the convection cooling air chamber 231. Multiple convection cooling circulation ducts 232 can rapidly cool the coolant through contact with the coolant and the rapidly flowing air inside. Multiple convection cooling mounting plates 233 are fixedly installed on the convection cooling circulation duct 232. The convection cooling mounting plates 233 can increase the cooling speed of the coolant, increase the contact area with the coolant, and increase the cooling area. The convection cooling installation duct 234 is fixedly installed on the upper side of the convection cooling air chamber 231, providing a channel for air circulation. The convection cooling motor 235 is fixedly installed on the upper side of the convection cooling installation duct 234, driving the rotation of the convection cooling fan 236 and providing power for its rotation. The convection cooling fan 236 is fixedly installed on the lower side of the convection cooling motor 235, enabling air circulation and drawing air from the convection cooling installation plate 233 within the convection cooling air chamber 231, allowing the air within the convection cooling installation plate 233 to flow rapidly through it.

[0032] like Figures 1 to 8As shown, the convection cooling circulation duct 232 is installed through the convection cooling air chamber 231 and the convection temperature difference containment chamber 221, the convection cooling installation duct 234 is installed through the convection cooling air chamber 231, the convection cooling fan 236 is installed through the convection cooling installation duct 234, and the convection cooling fan 236 is installed inside the convection cooling installation duct 234.

[0033] like Figures 1 to 8 As shown, the uniform heat dissipation mechanism 3 includes a uniform heat dissipation receiving chamber 31 and multiple uniform heat dissipation support columns 32. The uniform heat dissipation receiving chamber 31 is fixedly installed between the device module 1 and a pair of convection heat dissipation installation chambers 211. The uniform heat dissipation receiving chamber 31 can contain deionized water and can also quickly absorb heat from the device module 1 through contact. The multiple uniform heat dissipation support columns 32 are fixedly installed inside the uniform heat dissipation receiving chamber 31. The uniform heat dissipation support columns 32 can support the uniform heat dissipation receiving chamber 31, reducing the probability of deformation of the uniform heat dissipation receiving chamber 31 and improving the stability of the uniform heat dissipation receiving chamber 31.

[0034] like Figures 1 to 5 As shown, multiple uniform heat dissipation support columns 32 are evenly distributed. Deionized water is placed inside the uniform heat dissipation container 31. The deionized water can absorb the heat of the device module 1 and evenly transfer the heat to all parts of the uniform heat dissipation container 31. Water vapor diffuses to the low-temperature area at the edge of the uniform heat dissipation container 31 under the drive of temperature difference. Several evenly distributed capillary grooves are drilled inside the uniform heat dissipation container 31. After the deionized water is cooled, the capillary effect allows the deionized water to flow back and form a cycle.

[0035] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0036] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high-voltage arc suppression device for power grids, characterized in that, include: Device module; A pair of convection heat dissipation mechanisms are fixedly installed on the lower side of the device module. The convection heat dissipation mechanism includes a convection channel assembly, a convection temperature difference assembly, and a convection cooling assembly. The convection channel assembly is fixedly installed on the lower side of the device module, the convection temperature difference assembly is disposed on one side of the convection channel assembly, and the convection cooling assembly is fixedly installed on the upper side of the convection temperature difference assembly. A uniform heat dissipation mechanism is fixedly installed between a pair of convection heat dissipation mechanisms and the device module.

2. The high-voltage arc suppression device for power grids according to claim 1, characterized in that, The convection channel assembly includes: A convection cooling mounting compartment is fixedly installed on the lower side of the device module; A convection heat dissipation storage chamber is disposed on one side of the convection heat dissipation installation chamber; A pair of convection heat dissipation barrier plates are fixedly installed inside the convection heat dissipation installation chamber; Multiple convection heat dissipation pipes are fixedly installed on one side of a pair of convection heat dissipation barrier plates that are close to each other; Multiple convection heat dissipation channel baffles are fixedly installed between a pair of convection heat dissipation barrier plates.

3. The high-voltage arc suppression device for power grids according to claim 2, characterized in that, A convection heat dissipation channel liquid inlet pipe is fixedly installed between the convection heat dissipation storage chamber and the convection heat dissipation installation chamber. The convection heat dissipation channel liquid inlet pipe is set through the convection heat dissipation installation chamber and the convection heat dissipation storage chamber. The convection heat dissipation is set through the convection heat dissipation baffle plate.

4. The high-voltage arc suppression device for power grids according to claim 2, characterized in that, The multiple convection heat dissipation pipes are evenly distributed, and the convection heat dissipation channel partition is disposed between a pair of convection heat dissipation pipes.

5. The high-voltage arc suppression device for power grids according to claim 2, characterized in that, The convection temperature difference component includes: A convection temperature difference containment chamber is located on the side of the convection heat dissipation installation chamber away from the convection heat dissipation storage chamber; A convection temperature difference sinking chamber is fixedly installed on the lower side of the convection temperature difference receiving chamber; A convection temperature difference connecting pipe is fixedly installed on the lower side of the convection temperature difference containing chamber; A convection temperature difference sealing plate is slidably installed on the lower side of the convection temperature difference receiving chamber; A pair of convection temperature difference sealing springs are fitted onto the convection temperature difference sealing plate; A convection temperature difference water pump is fixedly installed on one side of the convection temperature difference settling chamber.

6. The high-voltage arc suppression device for power grids according to claim 5, characterized in that, The convection temperature difference connecting pipe passes through the convection temperature difference receiving chamber. The convection temperature difference sealing plate matches the convection temperature difference connecting pipe. The convection temperature difference sealing spring is disposed between the convection temperature difference sealing plate and the convection temperature difference receiving chamber. The convection temperature difference water pump passes through the convection heat dissipation storage chamber and the convection temperature difference receiving chamber. A convection temperature difference discharge pipe is fixedly installed between the convection temperature difference receiving chamber and the convection heat dissipation installation chamber. The convection temperature difference discharge pipe passes through the convection heat dissipation installation chamber and the convection temperature difference receiving chamber.

7. The high-voltage arc suppression device for power grids according to claim 5, characterized in that, The convection cooling component includes: A convective cooling air chamber is fixedly installed on the upper side of the convective temperature difference receiving chamber; A convection cooling circulation duct is fixedly installed on the lower side of the convection cooling air chamber; Multiple convection cooling mounting plates are fixedly installed on the convection cooling flow pipe; The convection cooling installation pipe is fixedly installed on the upper side of the convection cooling air chamber; A convection cooling motor is fixedly installed on the upper side of the convection cooling installation pipe; A convection cooling fan is fixedly installed on the lower side of the convection cooling motor.

8. The high-voltage arc suppression device for power grids according to claim 7, characterized in that, The convection cooling circulation duct runs through the convection cooling air chamber and the convection temperature difference containment chamber. The convection cooling installation duct runs through the convection cooling air chamber. The convection cooling fan runs through the convection cooling installation duct and is installed inside the convection cooling installation duct.

9. The high-voltage arc suppression device for power grids according to claim 7, characterized in that, The uniform heat dissipation mechanism includes: A uniform heat dissipation containment chamber is fixedly installed between the device module and a pair of convection heat dissipation installation chambers; Multiple uniform heat dissipation support columns are fixedly installed inside the uniform heat dissipation accommodating chamber.

10. The high-voltage arc suppression device for power grids according to claim 9, characterized in that, The multiple uniform heat dissipation support columns are evenly distributed, the uniform heat dissipation receiving chamber is filled with deionized water, and the uniform heat dissipation receiving chamber is chiseled with several evenly distributed capillary grooves.

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