Display apparatus, display apparatus manufacturing method, and electronic device including display apparatus

Abstract

A display apparatus, a display apparatus manufacturing method, and an electronic device including the display apparatus are provided. The display apparatus includes a display panel including a display area configured to display an image, an adjacent area surrounding at least a portion of the display area, and a pad area on a side of the adjacent area; a cover layer above the display panel configured to protect the display panel; an adhesive layer between the display panel and the cover layer; and a laser protection layer between the display panel and the cover layer in the adjacent area adjacent to the pad area, wherein the laser protection layer and the adhesive layer are on the same layer.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0179692, filed on December 5, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] One or more embodiments of this disclosure relate to apparatus and methods, and more specifically, to display devices and methods of manufacturing display devices. Background Technology

[0004] In recent years, electronic devices have become widely used. Electronic devices can be used as mobile or stationary devices. To support various functions, electronic devices include display devices capable of providing users with visual information such as images or videos.

[0005] In recent years, display devices have been used in a wide variety of ways. Furthermore, display devices have generally become thinner and lighter, and the areas for displaying images have generally increased, while the non-display areas have generally decreased. In addition, various materials such as glass and resin are commonly used to form cover layers to protect the display panel.

[0006] The information disclosed in this background section is intended only to enhance the understanding of the background of this disclosure, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0007] Images emitted from a display panel can pass through the overlay and be perceived by the user. In this respect, the surface quality of the overlay (e.g., flatness) can be important to the quality of the display device.

[0008] One or more embodiments include a display device and a method of manufacturing the display device, wherein the overlay layer has flatness (e.g., excellent flatness or flatness above a threshold).

[0009] Additional aspects and features will be set forth in the description below and may be apparent in part from the description or may be learned by practicing one or more of the embodiments presented in this disclosure.

[0010] According to one or more embodiments of the present disclosure, a display device includes: a display panel including a display area configured to display an image, an adjacent area surrounding at least a portion of the display area, and a pad area on one side of the adjacent area; a cover layer above the display panel and configured to protect the display panel; an adhesive layer between the display panel and the cover layer; and a laser protection layer between the display panel and the cover layer in an adjacent area adjacent to the pad area, wherein the laser protection layer and the adhesive layer are on the same layer.

[0011] In embodiments of this disclosure, the laser protective layer may be integrally formed with and attached to the edge of the adhesive layer, and may be held in place by the adhesive layer.

[0012] In embodiments of this disclosure, the thickness of the laser protective layer may be equal to the thickness of the adhesive layer.

[0013] In embodiments of this disclosure, in a plan view, the laser protective layer may be inside the perimeter of the covering layer.

[0014] In embodiments of this disclosure, in a plan view, the cover layer may include a light-blocking layer arranged along the outer perimeter of the cover layer, wherein the laser protection layer may overlap with the light-blocking layer.

[0015] In embodiments of this disclosure, the laser protective layer can absorb ultraviolet or infrared light.

[0016] In embodiments of this disclosure, the laser protective layer may include at least one of triazine, benzophenone, benzotriazole, anthraquinone, and stilbene biphenyl derivatives.

[0017] In embodiments of this disclosure, the laser protective layer may include at least one of 1,1,5,5-tetrakis[4-(diethylamino)phenyl]-1,4-pentadien-3-onium and p-toluenesulfonate.

[0018] In embodiments of this disclosure, the laser protective layer may include a metallic material.

[0019] In embodiments of this disclosure, the laser protective layer may include a base layer and a metal coating on the base layer.

[0020] In embodiments of this disclosure, the cover layer may include: a film layer disposed above the display panel; and a resin layer disposed on the film layer.

[0021] According to one or more embodiments of the present disclosure, a method of manufacturing a display device includes: arranging a display panel including a display area for displaying an image, an adjacent area surrounding at least a portion of the display area, and a pad area disposed on one side of the adjacent area; arranging an adhesive layer and a laser protective layer integrally formed with the adhesive layer on the display panel; arranging a cover layer above the adhesive layer and the laser protective layer; and cutting the cover layer and the display panel by performing laser irradiation along the perimeter of the cover layer, wherein the laser protective layer absorbs or reflects the laser beam without being cut, and substantially shields the portion of the display panel disposed below the laser protective layer.

[0022] In embodiments of this disclosure, the laser protective layer may be integrally formed with and attached to the edge of the adhesive layer, and may be held in place by the adhesive layer.

[0023] In embodiments of this disclosure, the thickness of the laser protective layer can be substantially equal to the thickness of the adhesive layer.

[0024] In embodiments of this disclosure, in a plan view, the laser protective layer may be inside the perimeter of the covering layer.

[0025] In embodiments of this disclosure, in a plan view, the cover layer may include a light-blocking layer arranged along the outer perimeter of the cover layer, wherein the laser protection layer may overlap with the light-blocking layer.

[0026] In embodiments of this disclosure, the laser protective layer can absorb ultraviolet or infrared light.

[0027] In embodiments of this disclosure, the laser protective layer may include at least one of triazine, benzophenone, benzotriazole, anthraquinone, and stilbene biphenyl derivatives.

[0028] In embodiments of this disclosure, the laser protective layer may include at least one of 1,1,5,5-tetrakis[4-(diethylamino)phenyl]-1,4-pentadien-3-onium and p-toluenesulfonate.

[0029] In embodiments of this disclosure, the laser protective layer may include a metallic material.

[0030] According to one or more embodiments of the present disclosure, an electronic device includes: a display device; and a housing for housing the display device, wherein the display device includes: a display panel including a display area configured to display an image, an adjacent area surrounding at least a portion of the display area, and a pad area on one side of the adjacent area; a cover layer above the display panel and configured to protect the display panel; an adhesive layer between the display panel and the cover layer; and a laser protection layer between the display panel and the cover layer in an adjacent area adjacent to the pad area, wherein the laser protection layer and the adhesive layer are on the same layer. Attached Figure Description

[0031] The above and other aspects, features and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein: Figure 1 This is a schematic perspective view of an electronic device according to an embodiment of the present disclosure; Figure 2 This is a schematic plan view of a display device according to an embodiment of the present disclosure; Figure 3 This is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure; Figure 4 This is another schematic cross-sectional view of a display device according to an embodiment of the present disclosure; Figure 5 The display panel along the edge of the embodiment of this disclosure Figure 2 A schematic cross-sectional view taken from line II-II' in the diagram, and it can be Figure 3 An enlarged cross-sectional view of the display panel; Figure 6 This is a schematic circuit diagram illustrating a pixel circuit applicable to a display panel according to an embodiment of the present disclosure; and Figures 7 to 13 This is a schematic diagram of a method for manufacturing a display device according to an embodiment of the present disclosure. Detailed Implementation

[0032] This disclosure may be implemented in a variety of different forms, and therefore specific embodiments will be shown and described in more detail in the accompanying drawings. However, it should be understood that this is not intended to limit this disclosure to the specific forms disclosed, but rather to cover all modifications, equivalents, and substitutions that fall within the spirit and scope of this disclosure.

[0033] Reference will now be made in more detail to one or more embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals always denote the same elements, and their repeated descriptions may be omitted. Rather, these embodiments are provided as examples so that this disclosure will be comprehensive and complete, and will fully convey to those skilled in the art the aspects and features of this disclosure. Therefore, processes, elements, and techniques that are not essential for those skilled in the art to fully understand the aspects and features of this disclosure may not be described.

[0034] As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items. Unless otherwise expressly stated in this disclosure, when expressions such as “at least one of…”, “multiples,” “one of…” and other prepositional phrases precede a list of elements, if written as a parallel list, they should be understood to include a disjunctive relation, and vice versa. For example, expressions “at least one of a, b, or c,” “at least one of a, b, and / or c,” “choose one of the group consisting of a, b, and c,” “selected from at least one of a, b, and c,” “at least one of a, b, and c,” “one of a, b, and c,” “at least one of a to c” indicate only a, only b, only c, both a and b, both a and c, both b and c, all or variations thereof of a, b, and c.

[0035] Because this specification allows for one or more suitable modifications and numerous embodiments, certain embodiments will be shown in the accompanying drawings and described in the written description. Aspects and features of one or more embodiments, as well as methods of implementing one or more embodiments, will become apparent from the following detailed description of one or more embodiments, taken in conjunction with the accompanying drawings. However, these embodiments may take different forms and should not be construed as limited to the description set forth herein.

[0036] One or more embodiments will be described in more detail with reference to the accompanying drawings. Elements that may be independent and identical or corresponding to each other are given the same reference numerals regardless of the drawing numbers, and their redundant descriptions are omitted.

[0037] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the spirit and scope of this disclosure, the first element, component, region, layer, or part described below may be referred to as the second element, component, region, layer, or part.

[0038] Unless the context clearly indicates otherwise, the singular forms “a,” “one,” and “the” used herein are intended to also include the plural forms.

[0039] It will also be understood that when the terms “comprises,” “comprising,” “includes,” “including,” “have,” and “having” are used in this specification, they specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0040] It will also be understood that when a layer, region, or element is referred to as being on another layer, region, or element, it can be directly or indirectly on that other layer, region, or element. That is to say, for example, there can be intermediate layers, regions, or elements.

[0041] It will also be understood that when layers, areas, or elements are referred to as being connected to each other, they can be directly connected to each other and / or indirectly connected to each other using intermediate layers, areas, or elements therebetween. Furthermore, when layers, areas, or elements are referred to as being electrically connected to each other, they can be directly electrically connected to each other and / or indirectly electrically connected to each other using intermediate layers, areas, or elements therebetween.

[0042] For ease of illustration, the dimensions of the elements in the drawings may be exaggerated or reduced. For example, since the dimensions and thicknesses of the elements in the drawings are shown (e.g., arbitrarily shown) for ease of description, the embodiments of this disclosure are not limited thereto.

[0043] As used herein, the expression "A and / or B" means A, B, or A and B. When an expression such as "at least one of..." precedes a list of elements, it modifies the entire list of elements and does not modify any individual element in the list. For example, the expressions "at least one of A, B, and C", "at least one of A, B, or C", and "at least one selected from the group consisting of A, B, and C" mean both A and B, both A and C, both B and C, all of A, B, and C, or only A, only B, and only C.

[0044] As used in this article, the description of wiring “extending in a first or second direction” covers not only the case where wiring extends in a straight line, but also the case where wiring extends in a zigzag or curved manner in a first or second direction.

[0045] As used herein, the phrase "in a plan view" indicates the portion of the object seen from above. The phrase "in a sectional view" indicates the portion of the object cut vertically and viewed from the side. As used herein, the description of the first element "overlapping" with the second element means that the first element is on or below the second element.

[0046] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0047] When implementation methods can be different, certain process sequences can be performed differently than the described sequence. For example, two consecutively described processes can be performed substantially simultaneously, or in the reverse order of their description.

[0048] Statements indicating that two comparison targets are “substantially equal” or have “basic” characteristics may include situations where a low level of deviation is considered to be possible in the art, such as a deviation within 5%.

[0049] Figure 1 This is a schematic perspective view of an electronic device 2 according to an embodiment of the present disclosure. Figure 2 This is a schematic plan view of a display device 1 according to an embodiment of the present disclosure. Figure 3 This is a schematic cross-sectional view of a display device 1 according to an embodiment of the present disclosure. Figure 4 This is a schematic cross-sectional view of a display device 1 according to another embodiment of the present disclosure.

[0050] refer to Figure 1 and Figure 2 Display device 1 is a device for displaying moving or still images, and can display images or perform data input and output in electronic device 2. Although Figure 1 An embodiment of display device 1 in a mobile phone is shown, but one or more embodiments are not limited thereto, and display device 1 can be used not only as a display screen for portable electronic devices such as mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation systems, and ultra-mobile PCs (UMPCs), but also as a display screen for various electronic devices such as televisions, laptop computers, monitors, billboards, and / or Internet of Things (IoT) devices. In some embodiments, display device 1 can be used in electronic devices such as wearable devices, for example, smartwatches, watch phones, glasses displays, and / or head-mounted displays (HMDs). In some embodiments, display device 1 can be used as a display for various electronic devices, such as a car dashboard, a central information display (CID) placed on the center console or dashboard of a car, an interior rearview mirror display replacing the side rearview mirrors of a car, and / or a display placed on the back of the front seats to provide entertainment for the rear seats of a car.

[0051] In embodiments of this disclosure, the display device 1 may be housed within a housing 3 of the electronic device 2. The housing 3 may be a cover that protects internal components such as the display device 1 and forms the exterior of the electronic device 2. In some embodiments, the display device 1 may be connected to and driven on an electronic module of the electronic device 2.

[0052] like Figure 2 As shown, display device 1 can have a substantially rectangular shape. For example, as... Figure 2 As shown, the display device 1 can generally have a rectangular planar shape comprising a first (e.g., short) side extending in a first direction (e.g., direction x or direction -x) and a second (e.g., long) side extending in a second direction (e.g., direction y or direction -y). In embodiments of this disclosure, the area where the short side extending in the first direction (e.g., direction x or direction -x) and the long side extending in the second direction (e.g., direction y or direction -y) intersect each other can have a right-angled shape or a rounded shape with a certain curvature. The planar shape of the display device 1 is not limited to a rectangular shape, and the display device 1 can have other polygonal shapes, circular shapes, elliptical shapes, etc.

[0053] Display device 1 may include a display area DA and a peripheral area PA. The display area DA can display an image. In this regard, pixels PX can be arranged in the display area DA. Display device 1 can provide an image by using light emitted from the pixels PX. One or more of the pixels PX (e.g., each) can emit light using a display element. In embodiments of this disclosure, one or more of the pixels PX (e.g., each) can emit red light, green light, or blue light. In embodiments of this disclosure, one or more of the pixels PX (e.g., each) can emit red light, green light, blue light, or white light.

[0054] The peripheral region PA is an area that does not provide an image and may be a non-display area. The peripheral region PA may at least partially surround the display region DA. For example, the peripheral region PA may completely surround the display region DA. A driver configured to provide electrical signals to the pixel PX or a power line for providing power may be arranged in the peripheral region PA. For example, a scan driver for applying scan signals to the pixel PX may be arranged in the peripheral region PA. In some embodiments, a data driver for applying data signals to the pixel PX may be arranged in the peripheral region PA.

[0055] According to one or more implementation methods Figure 2 The diagram schematically shows a portion of the display device 1 before it is bent, and Figure 3 The diagram schematically shows a portion of the already bent display device 1.

[0056] refer to Figure 2 and Figure 3 The display device 1 may include a display panel 10, a cover layer 20, a display driver 30, a display circuit board 40, a touch sensor driver 50, a shock-absorbing layer 60, a protective film PTF, a bending protective layer 70, an adhesive layer 80, and a laser protective layer 90.

[0057] Display panel 10 can display information processed by display device 1. For example, display panel 10 can display execution screen information about an application running on display device 1, or user interface (UI) or graphical user interface (GUI) information based on the execution screen information.

[0058] Display panel 10 may include display elements. For example, display panel 10 may be an organic light-emitting display panel using organic light-emitting diodes (OLEDs), a micro light-emitting diode (LED) display panel using micro LEDs, a quantum dot light-emitting display panel using quantum dot light-emitting diodes including quantum dot emission layers, or an inorganic light-emitting display panel using inorganic light-emitting diodes including inorganic semiconductors. In one or more embodiments of this disclosure, display panel 10 is an organic light-emitting display panel using organic light-emitting diodes as display elements.

[0059] The display panel 10 may include a substrate 100 and multiple layers disposed on the substrate 100. In embodiments of this disclosure, the display panel 10 may include a substrate 100, a pixel circuit layer (PCL), a display element layer (DEL), and a packaging layer (TFE) (see reference). Figure 5 ).

[0060] In embodiments of this disclosure, the display panel 10 may include a display area DA and a peripheral area PA surrounding at least a portion of the display area DA. The display area DA may display an image. In embodiments of this disclosure, the peripheral area PA may include an adjacent area AA surrounding the display area DA, a pad area PDA disposed on one side of the adjacent area AA, and a curved area BA disposed between the adjacent area AA and the pad area PDA.

[0061] Adjacent regions AA may surround display region DA, and for example, when display region DA has a quadrilateral shape in a plan view, adjacent regions AA may include a first adjacent region AA1, a second adjacent region AA2, a third adjacent region AA3, and a fourth adjacent region AA4 surrounding the respective edges of display region DA.

[0062] The pad area PDA can be arranged outside the display area DA, for example, outside the first adjacent area AA1. In embodiments of this disclosure, the pad area PDA can be arranged further away from the display area DA than the curved area BA. In embodiments of this disclosure, the display driver 30 can be arranged in the pad area PDA, and the pad area PDA can be connected to the display circuit board 40.

[0063] The curved region BA can be arranged between the display region DA and the pad region PDA. In some embodiments, the curved region BA can be arranged between the first adjacent region AA1 and the pad region PDA. The curved region BA is the area where the display panel 10 is curved, and the display panel 10 can be curved in the curved region BA such that the pad region PDA can be arranged below the display region DA. In some embodiments, the area of ​​the peripheral region PA visible to the user can be reduced.

[0064] The display driver 30 can be disposed in the pad area of ​​the PDA. The display driver 30 can be configured to receive control signals and power voltages, and generate and output signals and voltages for driving the display panel 10. The display driver 30 may include an integrated circuit (IC).

[0065] The display circuit board 40 can be electrically connected to the display panel 10. For example, the display circuit board 40 can be electrically connected to the pad area PDA via an anisotropic conductive film. The display circuit board 40 can be a flexible printed circuit board (FPCB) that is flexible and not easily bent or has a bending smaller than that of an FPCB (RPCB). In some embodiments, the display circuit board 40 can be a complex printed circuit board that includes both an RPCB and an FPCB.

[0066] The touch sensor driver 50 can be disposed on the display circuit board 40. The touch sensor driver 50 may include an IC. The touch sensor driver 50 can be attached to the display circuit board 40. The touch sensor driver 50 can be electrically connected to the sensor electrodes of the touch sensor layer of the display panel 10 through the display circuit board 40.

[0067] In some embodiments, the power supply may be located on the display circuit board 40. The power supply may be configured to supply driving voltages for driving the pixels of the display panel 10 and the display driver 30.

[0068] The protective film PTF can be patterned and attached to the lower surface of the display panel 10. In embodiments of this disclosure, the protective film PTF can be attached to a portion of the display panel 10 excluding the curved region BA. In this regard, a first portion of the protective film PTF can be attached to the lower surface of the display panel 10 to correspond to the display region DA. A second portion of the protective film PTF can be attached to the lower surface of the display panel 10 to correspond to the pad region PDA.

[0069] In embodiments of this disclosure, the damping layer 60 may be disposed between the protective films PTF. In some embodiments, the damping layer 60 is disposed below the display panel 10, and the display panel 10 is bent in the bending region BA, the damping layer 60 may be disposed between the portion of the display panel 10 corresponding to the display region DA and the portion of the display panel 10 corresponding to the pad region PDA.

[0070] The damping layer 60 can absorb external impacts to reduce or prevent damage to the display panel 10. The damping layer 60 may include polymer resins such as polyurethane, polycarbonate, polypropylene, polyethylene, etc., or may include elastic materials such as sponge obtained by foaming rubber, urethane-based materials, or acrylic-based materials.

[0071] Although not shown, the digitizer layer may be arranged above or below the damping layer 60. The digitizer layer may include a main body layer and / or a pattern layer, and the pattern layer may be used to detect signals input from an external electronic pen or the like. In some embodiments, the digitizer layer may detect the intensity, direction, etc., of signals input from an electronic pen or the like.

[0072] A bend protection layer 70 may be placed over the bend region BA of the display panel 10 (e.g., covering the bend region BA of the display panel 10). The bend protection layer 70 may be disposed on the display panel 10 within the bend region BA and may be bent along the bend region BA. In embodiments of this disclosure, one end of the bend protection layer 70 may extend from the bend region BA to an adjacent region AA adjacent to the bend region BA and cover the display panel 10, and the other end of the bend protection layer 70 may extend from the bend region BA to the pad region PDA and cover the display panel 10. In embodiments of this disclosure, the bend protection layer 70 may comprise a photocurable resin.

[0073] The bend protection layer 70 can protect the bend area BA from external impacts and can reduce stress on the bend area BA. In some embodiments, by arranging the bend protection layer 70, the position of the neutral plane can be adjusted to reduce the stress applied to the display panel 10.

[0074] A cover layer 20 may be disposed above the display panel 10. The cover layer 20 protects the display panel 10 from external impacts, etc. In embodiments of this disclosure, the cover layer 20 may include a film layer 21 and a resin layer 22. The film layer 21 may be disposed above the display panel 10. The film layer 21 may be disposed on an adhesive layer 80 that allows the cover layer 20 to adhere to the display panel 10. In some embodiments, the adhesive layer 80 may be disposed or disposed between the display panel 10 and the film layer 21. In embodiments of this disclosure, the film layer 21 may include polyethylene terephthalate (PET). The film layer 21 may have high light transmittance and can protect the display panel 10 from external impacts, etc.

[0075] A resin layer 22 can be disposed on a film layer 21. The resin layer 22 can be applied to the film layer 21 and cured, and thus can be formed. For example, the resin layer 22 can be cured by irradiation with ultraviolet or infrared light. The resin layer 22 can also have high light transmittance and can have the property of being easily cut by a laser beam used in laser processes.

[0076] In embodiments of this disclosure, the cover layer 20 may include a light-blocking layer 23. The light-blocking layer 23 may be disposed between the film layer 21 and the resin layer 22. In embodiments of this disclosure, the light-blocking layer 23 may be disposed along the outer perimeter of the cover layer 20 in a plan view. For example, the light-blocking layer 23 may overlap with an adjacent region AA in a plan view. The light-blocking layer 23 may include a light-blocking material configured to reduce or prevent the visible layer beneath the light-blocking layer 23.

[0077] An adhesive layer 80 may be disposed or arranged between the display panel 10 and the cover layer 20 to allow the cover layer 20 to adhere to the display panel 10. In embodiments of this disclosure, the adhesive layer 80 may be a pressure-sensitive adhesive (PSA).

[0078] A laser protective layer 90 may be disposed on one side of the adhesive layer 80. In embodiments of this disclosure, the laser protective layer 90 may be disposed on the layer on which the adhesive layer 80 is disposed. In this respect, the laser protective layer 90 and the adhesive layer 80 are on the same layer. In some embodiments, the laser protective layer 90 may be disposed between the display panel 10 and the cover layer 20. In some embodiments, the laser protective layer 90 may be connected to and integrally formed with the adhesive layer 80. For example, the laser protective layer 90 may be connected to and integrally formed with the edge of the adhesive layer 80 located in the first adjacent region AA1. In some embodiments, the laser protective layer 90 does not include adhesive material and can therefore be held by the adhesive layer 80. In embodiments of this disclosure, the thickness of the laser protective layer 90 may be equal to (e.g., substantially equal to) the thickness of the adhesive layer 80. In some embodiments, the laser protective layer 90 may fill the gap between the display panel 10 and the cover layer 20 and may hold the cover layer 20.

[0079] In embodiments of this disclosure, the laser protective layer 90 may overlap with an adjacent region AA in a plan view. For example, the laser protective layer 90 may be disposed between the display panel 10 and the cover layer 20 in an adjacent region AA (e.g., in a first adjacent region AA1) adjacent to the pad region PDA.

[0080] In some embodiments of this disclosure, the laser protection layer 90 may be located inside the perimeter of the cover layer 20 in a plan view. In some embodiments, the laser protection layer 90 may overlap with the cover layer 20 in a first adjacent region AA1. In some embodiments of this disclosure, the laser protection layer 90 may overlap with the light-blocking layer 23 of the cover layer 20 in a plan view. In some embodiments, it will be understood that the laser protection layer 90 is disposed in the first adjacent region AA1 and therefore may be separate from the bending protection layer 70 disposed in the bending region BA.

[0081] The laser protective layer 90 can absorb the laser beam used in the laser process. For example, the laser protective layer 90 can absorb ultraviolet or infrared light. The laser protective layer 90 can substantially shield, block, isolate, or protect the display panel 10 from the laser beam. More specifically, the laser beam can be applied from above the cover layer 20 to perform cell-size cutting as described below. The laser protective layer 90 can absorb light during laser irradiation for cutting, and thus can protect the display panel 10 below the laser protective layer 90, and more specifically, protect the wiring extending above the first adjacent area AA1 from the laser beam.

[0082] In embodiments of this disclosure, the laser protective layer 90 may include at least one of triazine, benzophenone, benzotriazole, anthraquinone, and stilbene biphenyl derivatives to absorb ultraviolet light. In some embodiments, the laser protective layer 90 may include at least one of 1,1,5,5-tetratetra[4-(diethylamino)phenyl]-1,4-pentadien-3-onium and p-toluenesulfonate to absorb infrared light. In some embodiments, the laser protective layer 90 may be a resin-cured layer comprising a variety of light absorbers, such as carbon black, graphite, chromium-based materials, and dye particles.

[0083] refer to Figure 4 In embodiments of this disclosure, the laser protective layer 90 may include a base layer 91 and a metal coating 92 disposed on the base layer 91. In some embodiments, the base layer 91 and the metal coating 92 may be bonded to and integrally formed with an adhesive layer 80. In some embodiments, the thickness of the laser protective layer 90, including the base layer 91 and the metal coating 92, may be equal to the thickness of the adhesive layer 80. The base layer 91 may include a resin. The metal coating 92 may protect the layers beneath the laser protective layer 90 from the influence of the laser beam by reflecting light. In embodiments of this disclosure, the metal coating 92 may include at least one of aluminum, silver, copper, and gold having a high reflectivity (e.g., a reflectivity above a set threshold).

[0084] Figure 5 The display panel 10 according to an embodiment of the present disclosure is along Figure 2 A schematic cross-sectional view taken from line II-II' in the diagram, and it can be Figure 3 An enlarged cross-sectional view of the display panel.

[0085] refer to Figure 5 The display device 1 may include a display panel 10. In some embodiments, the display panel 10 may include a substrate 100, a buffer layer 111, a pixel circuit layer PCL, a display element layer DEL, and a packaging layer TFE.

[0086] Substrate 100 may include glass, or may include polymeric resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. In embodiments of this disclosure, substrate 100 may have a multilayer structure including a base layer and a barrier layer (not shown), the base layer comprising the aforementioned polymeric resins. Substrate 100 comprising polymeric resins may be flexible, rollable, and / or bendable.

[0087] The buffer layer 111 may be disposed on the substrate 100. The buffer layer 111 may include inorganic insulating materials such as silicon nitride, silicon oxide nitride, and silicon oxide, and may have a single-layer or multi-layer structure including the inorganic insulating materials described above.

[0088] The pixel circuit layer PCL can be disposed on the buffer layer 111. The pixel circuit layer PCL may include thin-film transistors (TFTs) included in the pixel circuit, and inorganic insulating layer IIL, a first planarization layer 115, and a second planarization layer 116 disposed below and / or above the elements of the thin-film transistors (TFTs). The inorganic insulating layer IIL may include a first gate insulating layer 112, a second gate insulating layer 113, and an interlayer insulating layer 114.

[0089] A thin-film transistor (TFT) may include a semiconductor layer A, and semiconductor layer A may include polycrystalline silicon. In some embodiments, semiconductor layer A may include amorphous silicon, oxide semiconductor, or organic semiconductor. Semiconductor layer A may include a channel region, and drain and source regions respectively disposed on opposite sides of the channel region. The gate electrode G may overlap with the channel region.

[0090] The gate electrode G may include a low-resistance metallic material. The gate electrode G may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a multilayer or single-layer structure comprising the materials described above.

[0091] The first gate insulating layer 112 between the semiconductor layer A and the gate electrode G may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). x ), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Inorganic insulating materials, such as zinc oxide (ZnO). x () can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0092] The second gate insulating layer 113 may cover the gate electrode G. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Inorganic insulating materials, such as zinc oxide (ZnO). x () can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0093] The upper electrode CE2 of the storage capacitor Cst can be disposed on the second gate insulating layer 113. The upper electrode CE2 can overlap with the gate electrode G disposed below the upper electrode CE2. In this respect, the gate electrode G and the upper electrode CE2 overlapping each other with the second gate insulating layer 113 between them can constitute the storage capacitor Cst of the pixel circuit. In some embodiments, the gate electrode G can serve as the lower electrode CE1 of the storage capacitor Cst. In some embodiments, the storage capacitor Cst and the thin-film transistor TFT can overlap each other. In some embodiments, the storage capacitor Cst may not overlap with the thin-film transistor TFT.

[0094] The upper electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may have a single-layer or multi-layer structure including the materials described above.

[0095] The interlayer insulating layer 114 may cover the upper electrode CE2. The interlayer insulating layer 114 may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Zinc oxide (ZnO) x The interlayer insulation layer 114 can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2). The interlayer insulation layer 114 can have a single-layer or multi-layer structure including the inorganic insulating materials described above.

[0096] The drain electrode D and the source electrode S may each be located on the interlayer insulating layer 114. The drain electrode D and the source electrode S may each comprise a highly conductive material (e.g., a conductive material above a set threshold). The drain electrode D and the source electrode S may each comprise a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a multilayer or single-layer structure comprising the materials described above. In embodiments of this disclosure, the drain electrode D and the source electrode S may each have a titanium (Ti) / aluminum (Al) / titanium (Ti) multilayer structure.

[0097] The first planarization layer 115 may cover the drain electrode D and the source electrode S. The first planarization layer 115 may include an organic insulating layer. The first planarization layer 115 may include an organic insulating material such as a commercially available polymer, such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives having phenol-based groups, acrylic acid-based polymers, imide-based polymers, aryl ether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol-based polymers, and blends thereof.

[0098] The connection electrode CML can be disposed on the first planarization layer 115. In this respect, the connection electrode CML can be connected to the drain electrode D or the source electrode S through contact holes in the first planarization layer 115. The connection electrode CML may include a highly conductive material (e.g., a conductive material above a threshold). The connection electrode CML may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a multilayer or single-layer structure comprising the materials described above. In embodiments of this disclosure, the connection electrode CML may have a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti).

[0099] The second planarization layer 116 may cover the connection electrode CML. The second planarization layer 116 may include an organic insulating material. The second planarization layer 116 may include organic insulating materials such as commercially available polymers, such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives having phenol-based groups, acrylic acid-based polymers, imide-based polymers, aryl ether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol-based polymers, and blends thereof.

[0100] The display element layer DEL can be disposed on the pixel circuit layer PCL. The display element layer DEL can include display elements DE. The display element DE can be an organic light-emitting diode (OLED). The pixel electrode 211 of the display element DE can be electrically connected to the connection electrode CML through contact holes in the second planarization layer 116.

[0101] Pixel electrode 211 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In some embodiments, pixel electrode 211 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. In some embodiments, pixel electrode 211 may also include a layer comprising ITO, IZO, ZnO, or In2O3 on or below the reflective layer described above.

[0102] A pixel defining layer 118, including an opening 118OP exposing the central portion of the pixel electrode 211, may be disposed on the pixel electrode 211. The pixel defining layer 118 may include an organic insulating material and / or an inorganic insulating material. The opening 118OP may define an emission region (hereinafter referred to as the emission region EA) of light emitted from the display element DE. For example, the width of the opening 118OP may correspond to the width of the emission region EA of the display element DE.

[0103] In embodiments of this disclosure, the pixel defining layer 118 may include a black light-blocking material. The light-blocking material may include carbon black, carbon nanotubes, a resin or slurry including a black dye, metal particles (e.g., nickel, aluminum, molybdenum, and alloys thereof), metal oxide particles (e.g., chromium oxide), or metal nitride particles (e.g., chromium nitride). When the pixel defining layer 118 includes a light-blocking material, reflection of external light caused by the metal structure disposed beneath the pixel defining layer 118 can be reduced.

[0104] Spacers 119 may be disposed on the pixel defining layer 118. In a method of manufacturing a display device, spacers 119 may be used to reduce or prevent damage to the substrate 100. A mask may be used to manufacture a display panel. In this respect, defects may be reduced or prevented where the mask enters the opening 118OP of the pixel defining layer 118 or is in close contact with the pixel defining layer 118, and thus portions of the substrate 100 are damaged or destroyed by the mask when a deposition material is deposited on the substrate 100.

[0105] Spacer 119 may include an organic insulating material such as polyimide. In some embodiments, spacer 119 may include an inorganic insulating material such as silicon nitride or silicon oxide, or may include both organic and inorganic insulating materials.

[0106] In embodiments of this disclosure, spacer 119 may comprise a different material than pixel defining layer 118. In some embodiments, spacer 119 may comprise the same material as pixel defining layer 118, and in this case, pixel defining layer 118 and spacer 119 may be formed together in a masking process using a halftone mask or the like.

[0107] Intermediate layer 212 may be disposed on pixel defining layer 118. Intermediate layer 212 may include emitting layer 212b disposed in opening 118OP of pixel defining layer 118. Emitting layer 212b may include high molecular weight or low molecular weight organic material that emits light of a certain color.

[0108] The first functional layer 212a and the second functional layer 212c can be disposed below and above the emitter layer 212b, respectively. The first functional layer 212a may include, for example, a hole transport layer (HTL), or an HTL and a hole injection layer (HIL). The second functional layer 212c is an element disposed on the emitter layer 212b and may be optional. The second functional layer 212c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer 212a and / or the second functional layer 212c may be a common layer covering (e.g., completely covering) the substrate 100, as may be implemented by the opposing electrode 213.

[0109] The counter electrode 213 may comprise a conductive material having a low work function. For example, the counter electrode 213 may comprise a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. In some embodiments, the counter electrode 213 may also comprise a layer such as ITO, IZO, ZnO, or In2O3 on a (semi-)transparent layer comprising the materials described above.

[0110] In some embodiments, a capping layer (not shown) may be disposed on the opposing electrode 213. The capping layer may include lithium fluoride (LiF), inorganic materials, and / or organic materials.

[0111] The encapsulation layer TFE can be disposed on the opposing electrode 213. In embodiments of this disclosure, the encapsulation layer TFE includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 5 The TFE encapsulation layer is shown, comprising a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 stacked sequentially on top of each other.

[0112] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise one or more inorganic materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon nitride. The organic encapsulation layer 320 may comprise a polymer-based material. Examples of polymer-based materials may include acrylic resins, epoxy resins, polyimides, and polyethylene. In embodiments of this disclosure, the organic encapsulation layer 320 may comprise acrylates.

[0113] In embodiments of this disclosure, a touch sensor layer (not shown) may be formed on the encapsulation layer TFE. In some embodiments, the touch sensor layer may be formed separately on the touch substrate and then bonded to the encapsulation layer TFE by an adhesive layer such as an optically transparent adhesive. In embodiments of this disclosure, the touch sensor layer may be formed (e.g., directly formed) on the encapsulation layer TFE, and in this case, the adhesive layer may not be disposed or may be arranged between the touch sensor layer and the encapsulation layer TFE.

[0114] In embodiments of this disclosure, an optical functional layer (not shown) may be disposed on the touch sensor layer. The optical functional layer may reduce the reflectivity of light (e.g., external light) incident on the display device 1 from the outside, and / or may improve the color purity of light emitted from the display device 1. In embodiments of this disclosure, the optical functional layer may include a phase retarder and a polarizer. The phase retarder may be a film-type or a liquid crystal coating-type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film-type or a liquid crystal coating-type. The film-type may include a stretched synthetic resin film, and the liquid crystal coating-type may include liquid crystals arranged in a specific configuration. The phase retarder and polarizer may also include a protective film.

[0115] In some embodiments, the optical functional layer may include a black matrix and color filters. The color filters can be arranged to take into account the color of light emitted from each pixel of the display device 1. One or more color filters (e.g., each) may include red, green, or blue pigments or dyes. In some embodiments, one or more color filters (e.g., each) may also include quantum dots (e.g., in addition to the pigments or dyes described above). In some embodiments, some color filters may not include the pigments or dyes described above and may include scattering particles such as titanium oxide.

[0116] In another embodiment of this disclosure, the optical functional layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, can destructively interfere with each other, thereby reducing the reflectivity of external light.

[0117] Figure 6 This is a schematic diagram illustrating a pixel circuit PC that can be applied to a display panel.

[0118] refer to Figure 6 The pixel circuit PC can be connected to a display element, such as an organic light-emitting diode (OLED). The pixel circuit PC may include a driving thin-film transistor T1, a switching thin-film transistor T2, and a storage capacitor Cst. In some embodiments, the OLED may emit red, green, or blue light, or may emit red, green, blue, or white light.

[0119] The switching thin-film transistor T2 can be connected to the scan line SL and the data line DL, and can be configured to transmit the data voltage or data signal input from the data line DL to the driving thin-film transistor T1 based on the switching voltage or scan signal input from the scan line SL. The storage capacitor Cst can be connected to the switching thin-film transistor T2 and the driving voltage line PL, and can store a voltage corresponding to the difference between the voltage received from the switching thin-film transistor T2 and the first power voltage ELVDD supplied to the driving voltage line PL.

[0120] The driving thin-film transistor T1 can be connected to the driving voltage line PL and the storage capacitor Cst, and can be configured to control the driving current flowing from the driving voltage line PL through the organic light-emitting diode (OLED) in response to the voltage value stored in the storage capacitor Cst. The OLED can emit light with a certain brightness according to the driving current. The opposite electrode of the OLED can receive a second power voltage ELVSS.

[0121] although Figure 6 The pixel circuit PC shown includes two thin-film transistors and a storage capacitor, but the pixel circuit PC may include three, four, five or more thin-film transistors.

[0122] Figures 7 to 13 This is a schematic diagram of a method for manufacturing a display device according to an embodiment of the present disclosure.

[0123] The method for manufacturing a display device according to the embodiments of this disclosure can be used to manufacture the display device 1 described above, but one or more embodiments are not limited thereto.

[0124] refer to Figure 7 The display panel 10 may include a display area DA and a peripheral area PA. In some embodiments, the peripheral area PA may include an adjacent area AA that at least partially surrounds the display area DA, a pad area PDA disposed on one side of the adjacent area AA, and a curved area BA disposed between the adjacent area AA and the pad area PDA.

[0125] The protective PTF film can be disposed below the display panel 10. In some embodiments, the damping layer 60 can be disposed below the protective PTF film.

[0126] The display circuit board 40 can be connected to the display panel 10, for example, the pad area of ​​the PDA.

[0127] refer to Figure 8 The adhesive layer 80 and the laser protective layer 90 can be disposed on the display panel 10. In embodiments of this disclosure, the adhesive layer 80 and the laser protective layer 90 can be integrally formed with each other and disposed on the display panel 10. The adhesive layer 80 can be attached to the display panel 10, and the laser protective layer 90 can be held by the adhesive layer 80 and can contact the display panel 10 without being attached thereto.

[0128] In some embodiments, the laser protection layer 90 may be attached to one edge of the adhesive layer 80, for example, the edge adjacent to the curved region BA and / or the pad region PDA. In embodiments of this disclosure, the laser protection layer 90 may extend in a first direction (direction x).

[0129] refer to Figure 9 Film layer 21 can be disposed on adhesive layer 80 and laser protective layer 90. Film layer 21 can cover (e.g., completely cover) adhesive layer 80 and laser protective layer 90. Film layer 21 may include, for example, polyethylene terephthalate (PET).

[0130] In some embodiments, the light-blocking layer 23 may be disposed on the film layer 21. In embodiments of this disclosure, the light-blocking layer 23 may be printed and disposed along the edge of the film layer 21. In some embodiments, the light-blocking layer 23 may overlap with the peripheral region PA (e.g., adjacent region AA). In embodiments of this disclosure, the light-blocking layer 23 may be configured as a closed loop.

[0131] refer to Figure 10 Resin can be applied to cover the film layer 21 and the light-blocking layer 23. After application, the resin can be cured to form a resin layer 22. In this respect, because the resin layer 22 is applied and cured, protrusions can appear around its edges. In some embodiments, the cover layer 20 can be formed to have a size larger than the final size, and the edge portions where the protrusions subsequently appear can be cut. In some embodiments, the adjacent regions AA of the corresponding display panel 10 (e.g., the second adjacent regions AA2 to the fourth adjacent regions AA4) can also be formed to have a size larger than the final size, and can be cut together when cutting the cover layer 20.

[0132] refer to Figure 11The cover layer 20 can be cut offset inward along its perimeter. In this regard, a laser cutting method, in which the cutting is performed by laser irradiation, can be used to cut the cover layer 20. The laser beam can be applied from above the cover layer 20, and in some embodiments, both the cover layer 20 and the display panel 10 below the cover layer 20 can be cut. In some embodiments, portions of the display panel 10 and the cover layer 20 in adjacent regions AA can be cut. This can remove protrusions around the edges of the cover layer 20, thereby improving the flatness of the cover layer 20.

[0133] refer to Figure 12 As described above, the laser protection layer 90 may not be cut even when irradiated with a laser beam. In some embodiments, the display panel 10 disposed below the laser protection layer 90 may also not be cut. In some embodiments, the display panel 10 may not be cut in the first adjacent region AA1. In some embodiments, the cut surface of the cover layer 20 may overlap with the laser protection layer 90 in the first adjacent region AA1. In some embodiments, in the first adjacent region AA1, the cut surface of the cover layer 20 may be located at the center of the width (e.g., the length in the direction y) of the laser protection layer 90 in a plan view. In this way, the laser protection layer 90 can protect the wiring of the display panel 10 in the curved region BA and the first adjacent region AA1 adjacent to the pad region PDA.

[0134] Next, the display panel 10 can be bent in the bending area BA, so that the pad area PDA can be arranged below the display area DA.

[0135] refer to Figure 13 The laser protective layer 90 can be cut. In embodiments of this disclosure, the laser protective layer 90 can be cut in a first adjacent region AA1, aligned with the cutting surface of the cover layer 20. In this regard, the laser protective layer 90 can be mechanically cut. For example, the laser protective layer 90 can first have scribe lines formed thereon, and then be cut by a fracture process. Because the laser protective layer 90 is mechanically cut, the display panel 10 beneath the laser protective layer 90 can be protected, and damage to the display panel can be reduced or prevented.

[0136] According to one or more embodiments, in order to remove the protrusions in the resin layer 22, the cover layer 20 may be formed to have a size larger than the final size, and then offset inward along its perimeter by cutting. In this regard, the cover layer 20 may be laser-cut, and in particular, the laser protection layer 90 may be arranged to prevent the adjacent area AA, which has many wirings arranged adjacent to the pad area PDA, from being damaged by laser cutting.

[0137] According to one or more of the above embodiments, a display device in which the cover layer has excellent surface quality (e.g., surface quality above a threshold), such as excellent flatness (e.g., flatness above a threshold), and a method for manufacturing the display device can be realized. In some embodiments, a display device and a method for manufacturing the display device can be provided in which the cover layer has excellent quality and causes no damage or reduced damage to the display panel.

[0138] The effects of one or more embodiments are not limited thereto, and other unmentioned effects will become apparent to those skilled in the art from the appended claims.

[0139] It should be understood that the embodiments described herein are for descriptive purposes only and are not intended to be limiting. The description of features or aspects within each embodiment should generally be understood as applicable to other similar features or aspects in other embodiments. Although embodiments of this disclosure have been described, it should be understood that this disclosure is not limited to these embodiments, but one or more suitable changes and modifications can be made by those skilled in the art within the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. A display device, including: The display panel includes a display area configured to display an image, an adjacent area surrounding at least a portion of the display area, and a pad area on one side of the adjacent area; A cover layer is placed above the display panel and configured to protect the display panel. An adhesive layer is located between the display panel and the cover layer; as well as A laser protective layer is located between the display panel and the cover layer in the adjacent region adjacent to the pad region. The laser protective layer and the adhesive layer are on the same layer.

2. The display device according to claim 1, wherein, The laser protective layer is integrally formed with the edge of the adhesive layer and is held in place by the adhesive layer.

3. The display device according to claim 1, wherein, The thickness of the laser protective layer is equal to the thickness of the adhesive layer.

4. The display device according to claim 1, wherein, In the plan view, the laser protective layer is located inside the perimeter of the cover layer.

5. The display device according to claim 4, wherein, In the plan view, the covering layer includes a light-blocking layer arranged along the outer perimeter of the covering layer, wherein the laser protection layer overlaps with the light-blocking layer.

6. The display device according to claim 1, wherein, The laser protective layer absorbs ultraviolet or infrared light.

7. The display device according to claim 6, wherein, The laser protective layer includes at least one of triazine, benzophenone, benzotriazole, anthraquinone, and stilbene biphenyl derivatives.

8. The display device according to claim 6, wherein, The laser protective layer comprises at least one of 1,1,5,5-tetrakis[4-(diethylamino)phenyl]-1,4-pentadien-3-onium and p-toluenesulfonate.

9. The display device according to claim 1, wherein, The laser protective layer comprises a metallic material.

10. The display device according to claim 1, wherein, The laser protective layer includes a base layer and a metal coating on the base layer.

11. The display device according to claim 1, wherein, The covering layer includes: A film layer is disposed above the display panel; and A resin layer is disposed on the film layer.

12. A method for manufacturing a display device, the method comprising: A display panel is arranged, the display panel including a display area for displaying an image, an adjacent area surrounding at least a portion of the display area, and a pad area arranged on one side of the adjacent area; An adhesive layer and a laser protective layer integrally formed therewith are disposed on the display panel; A cover layer is disposed above the adhesive layer and the laser protective layer; as well as The cover layer and the display panel are cut by performing laser irradiation along the perimeter of the cover layer. The laser protective layer absorbs or reflects the laser beam without being cut, and shields the portion of the display panel located beneath the laser protective layer.

13. The method according to claim 12, wherein, The laser protective layer is integrally formed with the edge of the adhesive layer and is held in place by the adhesive layer.

14. The method according to claim 12, wherein, The thickness of the laser protective layer is equal to the thickness of the adhesive layer.

15. The method according to claim 12, wherein, In the plan view, the laser protective layer is located inside the perimeter of the cover layer.

16. The method according to claim 15, wherein, In the plan view, the covering layer includes a light-blocking layer arranged along the outer perimeter of the covering layer, wherein the laser protection layer overlaps with the light-blocking layer.

17. The method according to claim 12, wherein, The laser protective layer absorbs ultraviolet or infrared light.

18. The method according to claim 17, wherein, The laser protective layer comprises at least one of the following: triazine type, benzophenone type, benzotriazole type, anthraquinone type, stilbene biphenyl derivative, 1,1,5,5-tetratetra[4-(diethylamino)phenyl]-1,4-pentadien-3-onium, and p-toluenesulfonate.

19. The method according to claim 12, wherein, The laser protective layer comprises a metallic material.

20. Electronic devices, including: Display devices; as well as Housing that houses the display device. The display device includes: The display panel includes a display area configured to display an image, an adjacent area surrounding at least a portion of the display area, and a pad area on one side of the adjacent area; A cover layer is placed above the display panel and configured to protect the display panel. An adhesive layer is placed between the display panel and the cover layer; and A laser protective layer is located between the display panel and the cover layer in the adjacent region adjacent to the pad region. The laser protective layer and the adhesive layer are on the same layer.

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