Wafer carrier and wafer surface processing apparatus

Abstract

The application belongs to the technical field of wafer surface processing, and discloses a wafer carrier and a wafer surface processing device. The carrier, the bearing disc mechanism, the compression ring mechanism and the flexible vacuum connecting piece of the wafer carrier are arranged in the vacuum chamber. The compression ring mechanism comprises a compression plate, a guide column and a support which are fixedly connected in sequence. The flexible vacuum connecting piece is sealingly connected between the carrier and the support. The flexible vacuum connecting piece is in communication with the gas source outside the vacuum chamber through the air pipe. The gas source drives the flexible vacuum connecting piece to stretch and retract. Under the guidance of the guide column, the support and the compression plate move up and down with the flexible vacuum connecting piece, so that the compression plate cooperates with the bearing disc mechanism to compress or release the wafer. The flexible vacuum connecting piece is used to replace the traditional rigid structure by adopting the air pressure driving mode. The carrier can be fixed on the cavity wall in the vacuum chamber or on the movable part in the vacuum chamber, and the wafer carrier is driven to move by the movable part, so that the actual needs in different situations can be met.

Description

Technical Field

[0001] This invention relates to the field of wafer surface treatment technology, and more particularly to a wafer stage and wafer surface treatment equipment. Background Technology

[0002] During processing, wafers are susceptible to slight warping due to thermal stress and other factors. If this is not controlled, it will directly affect the accuracy of subsequent processing. Current technology usually uses a wafer stage to press the wafer and apply pressure to it.

[0003] In existing technologies, a pressing structure is usually arranged inside a vacuum chamber, and a driving structure is arranged outside the vacuum chamber. The driving structure needs to be fixed and partially passes through the bottom wall of the vacuum chamber to connect with the pressing structure. The driving structure uses a cylinder or motor to provide power to the pressing structure through rigid transmission. However, the rigid transmission driving structure will restrict the setting position of the pressing structure, resulting in the pressing structure being fixed in position inside the vacuum chamber and unable to move, which makes it difficult to meet the actual needs under different conditions.

[0004] Therefore, there is an urgent need to provide a wafer stage and wafer surface treatment equipment to remove positional restrictions, so that the position of the wafer stage can be set according to actual needs, and it can also move in a vacuum chamber as needed. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer stage and wafer surface treatment equipment to remove positional limitations, so that the position of the wafer stage can be set according to actual needs, and it can also move in a vacuum chamber as needed.

[0006] To achieve this objective, the present invention adopts the following technical solution: This invention provides a wafer stage, comprising: The support component is located within the vacuum chamber; A support disk mechanism, fixed to the support member, is used to support the wafer; The pressure ring mechanism and the bearing plate mechanism are both located in the vacuum chamber. The pressure ring mechanism includes a pressure plate, a guide column, and a support member that are fixedly connected in sequence. The bearing plate mechanism is located between the pressure plate and the support member. The guide column slides through the bearing plate mechanism. A flexible vacuum connector is located inside the vacuum chamber. The flexible vacuum connector is sealed between the support member and the carrier member. The flexible vacuum connector is connected to an air source located outside the vacuum chamber through an air pipe. Under the action of air pressure, the flexible vacuum connector extends and retracts, driving the pressure ring mechanism to move relative to the carrier plate mechanism, so as to drive the pressure plate to press the wafer or release the pressing.

[0007] As an optional technical solution for a wafer stage, the carrier is provided with an air port that communicates with the flexible vacuum connector, and the air port is connected to the air source through the air pipe.

[0008] As an optional technical solution for a wafer stage, it also includes an elastic pressing mechanism, which includes an elastic element, a support element located between the carrier disk mechanism and the carrier element, the support element having a receiving groove, and the elastic element being at least partially disposed within the receiving groove and located between the carrier disk mechanism and the support element; When the flexible vacuum connector extends, the support moves closer to the bearing disk mechanism and squeezes the elastic element; when the flexible vacuum connector shortens, the bearing disk mechanism moves closer to the pressure plate and presses the wafer together under the action of the elastic element.

[0009] As an optional technical solution for a wafer stage, the elastic pressing mechanism further includes an adjusting guide post and an adjusting nut. The adjusting guide post is rotatably connected to the support member, and the adjusting nut is threadedly connected to the portion of the adjusting guide post placed in the receiving groove. The elastic member is sleeved on the adjusting guide post and its two ends abut against the bearing plate mechanism and the adjusting nut, respectively. The rotation of the adjusting guide post can drive the adjusting nut to move within the receiving groove.

[0010] As an optional technical solution for a wafer stage, the support member is also provided with an elongated slot, which penetrates the support member and communicates with the receiving groove. The length direction of the elongated slot is parallel to the moving direction of the adjusting nut, and the sliding limit of the adjusting nut is located within the elongated slot.

[0011] As an optional technical solution for a wafer stage, the carrier disk mechanism includes a tray and a base fixed to the carrier, the guide post slides through the base, and the tray is sealed to the base and cooperates with the base to support the wafer; The tray and the substrate enclose a liquid cooling channel, and / or, the substrate is provided with a cooling gas channel, the air inlet of the cooling gas channel is used to communicate with the gas supply system, and the air outlet of the cooling gas channel passes through the tray and acts between the tray and the wafer.

[0012] As an optional technical solution for a wafer stage, it also includes a first electrical contact sensor, which includes a first conductive part and a first receiving part. One of the first conductive part and the first receiving part is insulated and fixed to the carrier disk mechanism, and the other is insulated and fixed to the support member. When the support member abuts against the carrier disk mechanism, the first conductive part and the first receiving part make contact and conduct.

[0013] As an optional technical solution for a wafer stage, it also includes a second electrical contact sensor, which includes an insulating element, a second conductive part, and a second receiving part. The insulating element passes through the support member and is fixed at one end to the carrier disk mechanism. One of the second conductive part and the second receiving part is fixed to the other end of the insulating member, and the other is insulated and fixed to the support member. When the pressure plate abuts against the bearing plate mechanism, the second conductive part and the second receiving part make contact and conduct.

[0014] As an optional technical solution for a wafer stage, a pressure sensor is provided between the carrier disk mechanism and the pressure plate.

[0015] The present invention provides a wafer surface treatment apparatus, including a vacuum chamber, a gas source and the wafer stage described above.

[0016] Beneficial effects: This invention provides a wafer stage, which includes a support member, a support disk mechanism, a pressure ring mechanism, and a flexible vacuum connector. The support member is disposed in a vacuum chamber. The support disk mechanism is fixed on the support member and is used to support the wafer. Both the pressure ring mechanism and the support disk mechanism are located in the vacuum chamber. The pressure ring mechanism includes a pressure plate, a guide post, and a support member that are fixedly connected in sequence. The support disk mechanism is located between the pressure plate and the support member, and the guide post slides through the support disk mechanism. The flexible vacuum connector is located in the vacuum chamber and is sealed between the support member and the support member. The flexible vacuum connector is connected to a gas source located outside the vacuum chamber through a gas pipe. Under the action of gas pressure, the flexible vacuum connector extends and retracts, driving the pressure ring mechanism to move relative to the support disk mechanism, thereby causing the pressure plate to press the wafer or release the press. The wafer stage's support, bearing disk mechanism, pressure ring mechanism, and flexible vacuum connector are all housed within the vacuum chamber. A flexible vacuum connector is sealed between the support and the pressure ring mechanism's support. This connector is connected to a gas source outside the vacuum chamber via a gas pipe. The gas source supplies compressed air to the flexible vacuum connector, driving its expansion and contraction. Guided by guide columns, the support and pressure plate move up and down with the expansion and contraction of the flexible vacuum connector, allowing the pressure plate to press or release the wafer in conjunction with the bearing disk mechanism. By employing a pneumatically driven method and using a flexible vacuum connector instead of a traditional rigid structure, the gas source and gas pipes do not restrict the position of the flexible vacuum connector or the movement of the wafer stage. This allows the wafer stage position to be designed according to actual needs. For example, the support can be fixed to the inner wall of the vacuum chamber or to a movable component within the vacuum chamber, which drives the wafer stage to move (translate, flip, swing, etc.) within the vacuum chamber, meeting the practical needs of different situations.

[0017] This invention provides a wafer surface treatment apparatus, including a vacuum chamber, a gas source, and the aforementioned wafer stage. By arranging the various parts of the wafer stage within the vacuum chamber and utilizing gas pressure to drive the axial extension and retraction of the flexible vacuum connectors of the wafer stage, the constraints on the wafer stage's position are effectively reduced, resulting in greater positional freedom. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the wafer stage provided in an embodiment of the present invention from a first-view perspective; Figure 2 This is a schematic diagram of the wafer stage provided in an embodiment of the present invention from a second perspective. Figure 3 This is a schematic diagram of the wafer stage provided in an embodiment of the present invention from a third-view perspective; Figure 4 This is a schematic diagram of the wafer stage from a fourth perspective provided in an embodiment of the present invention; Figure 5 This is a cross-sectional view of the wafer stage provided in an embodiment of the present invention; Figure 6 This is a partial structural schematic diagram of the wafer stage provided in an embodiment of the present invention; Figure 7 This is a partial cross-sectional view of the wafer stage provided in an embodiment of the present invention.

[0019] In the picture: 1. Load-bearing components; 11. Columns; 2. Support plate mechanism; 21. Base; 211. Liquid cooling tank; 212. Cooling gas channel; 213. Sealing groove; 22. Tray; 221. Cooling airflow channel; 23. Ejector pin; 3. Pressure ring mechanism; 31. Pressure plate; 32. Guide post; 33. Support component; 331. Receiving groove; 332. Long slot hole; 4. Flexible vacuum connectors; 5. Elastic pressing mechanism; 51. Elastic element; 52. Adjusting guide post; 53. Adjusting nut; 6. First electrical contact sensor; 61. First conductive part; 62. First receiving part; 7. Second electrical contact sensor; 71. Insulating component; 72. Second conductive part. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0021] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0024] like Figures 1 to 5 As shown, this embodiment provides a wafer stage and a wafer surface treatment device, which includes a vacuum chamber, a gas source, and a wafer stage.

[0025] The wafer stage includes a support component 1, a support disk mechanism 2, a pressure ring mechanism 3, and a flexible vacuum connector 4. The support component 1 is disposed in a vacuum chamber. The support disk mechanism 2 is fixed on the support component 1 and is used to support the wafer. The pressure ring mechanism 3 and the support disk mechanism 2 are both located in the vacuum chamber. The pressure ring mechanism 3 includes a pressure plate 31, a guide post 32, and a support component 33 that are fixedly connected in sequence. The support disk mechanism 2 is located between the pressure plate 31 and the support component 33. The guide post 32 slides through the support disk mechanism 2. The flexible vacuum connector 4 is located in the vacuum chamber and is sealed between the support component 33 and the support component 1. The flexible vacuum connector 4 is connected to a gas source located outside the vacuum chamber through a gas pipe. Under the action of gas pressure, the flexible vacuum connector 4 extends and retracts, driving the pressure ring mechanism 3 to move relative to the support disk mechanism 2, so as to drive the pressure plate 31 to press the wafer or release the press.

[0026] The wafer stage's carrier 1, carrier disk mechanism 2, pressure ring mechanism 3, and flexible vacuum connector 4 are all housed within a vacuum chamber. A flexible vacuum connector 4 is sealed between the carrier 1 and the support 33 of the pressure ring mechanism 3. The flexible vacuum connector 4 is connected to an air source outside the vacuum chamber via an air pipe. The air source can input compressed air to drive the flexible vacuum connector 4 to extend and retract. Guided by the guide column 32, the support 33 and pressure plate 31 can move up and down with the extension and retraction of the flexible vacuum connector 4, allowing the pressure plate 31 to cooperate with the carrier disk mechanism 2 to press or release the wafer. By using a pneumatic drive and replacing the traditional rigid structure with the flexible vacuum connector 4, the air source and air pipe do not restrict the position of the flexible vacuum connector 4 or the movement of the wafer stage. This allows the wafer stage position to be designed according to actual needs. For example, the carrier 1 can be fixed to the inner wall of the vacuum chamber or to a movable component within the vacuum chamber, which drives the wafer stage to move (translate, flip, swing, etc.) within the vacuum chamber, meeting the actual needs under different circumstances.

[0027] In this embodiment, the chamber of the wafer surface treatment equipment includes two parts. One part is a sealed area that maintains a pressure lower than atmospheric pressure as a vacuum chamber, and the other part is located outside the vacuum chamber as an atmospheric chamber. The atmospheric chamber is connected to the external environment or maintains normal pressure.

[0028] See Figure 1 The pressure ring mechanism 3 has a first position where the pressure plate 31 abuts against the bearing plate mechanism 2; see also Figure 3 The pressure ring mechanism 3 also has a second position where the support member 33 abuts against the carrier plate mechanism 2. In the initial state, when the gas source is not supplying gas to the flexible vacuum connector 4, the pressure ring mechanism 3 of the wafer stage is in the first position, with the pressure plate 31 abutting against the carrier plate mechanism 2. When the gas source supplies gas to the flexible vacuum connector 4, the flexible vacuum connector 4 extends, the pressure ring mechanism 3 rises relative to the carrier plate mechanism 2, the pressure plate 31 gradually moves away from the carrier plate mechanism 2, and the support member 33 gradually moves closer to the carrier plate mechanism 2 until the support member 33 abuts against the carrier plate mechanism 2, i.e., the pressure ring mechanism 3 of the wafer stage is in the second position. At this time, the wafer can be placed on the carrier plate mechanism 2. On the disk mechanism 2, the wafer is placed below the pressure plate 31. When the gas in the flexible vacuum connector 4 is discharged, the flexible vacuum connector 4 shortens, the pressure ring mechanism 3 rises relative to the carrier disk mechanism 2, the support 33 gradually moves away from the carrier disk mechanism 2, and the pressure plate 31 gradually moves closer to the carrier disk mechanism 2 until the pressure plate 31 abuts against the carrier disk mechanism 2. The pressure plate 31 cooperates with the carrier disk mechanism 2 to press the wafer together. At this time, the pressure ring mechanism 3 of the wafer stage returns to the first position. If the pressing needs to be released later, the gas source can be used to supply gas to the flexible vacuum connector 4 again.

[0029] Traditional rigid drive structures require the drive structure and pressing structure to partially pass through the bottom wall of the vacuum chamber to connect with the pressing structure. This can easily lead to poor sealing at the bottom wall, affecting the vacuum stability of the vacuum chamber. In this embodiment, pneumatic drive is used instead of rigid drive. The flexible vacuum connector 4 and the air source are connected by an air pipe. Even if the air pipe has to pass through the cavity wall of the vacuum chamber, it is easier to fit the hole wall to achieve a seal, which helps to improve the sealing performance and ensure the sealing performance and vacuum stability of the vacuum chamber.

[0030] Optionally, the flexible vacuum connector 4 is made of a low thermal conductivity material with a thermal conductivity of less than 15 W / (m·K). Compared to the traditional rigid transmission drive structure, which can transfer heat to the pressing structure, the flexible vacuum connector 4, made of a low thermal conductivity material, can block the heat from the gas source from the atmospheric chamber to the vacuum chamber, thus helping to maintain the temperature of the vacuum chamber.

[0031] Furthermore, the carrier 1 is provided with an air port that communicates with the flexible vacuum connector 4, and the air port is connected to the air source located in the atmospheric chamber through an air pipe. Compared with the flexible vacuum connector 4 being directly connected to the air pipe, the carrier 1 is provided with an air port that communicates with both the flexible vacuum connector 4 and the air pipe. The flexible vacuum connector 4 is indirectly connected to the air pipe through the air port, which can not only prevent the flexible vacuum connector 4 from being directly impacted by the airflow, but also use the air port as a standardized interface to adapt to different air sources.

[0032] In this embodiment, the flexible vacuum connector 4 is a vacuum bellows, and the flexible vacuum connector 4 is parallel to the axis of the guide post 32. The support 33 is located between the bearing plate mechanism 2 and the bearing member 1. The central axes of the pressure plate 31, the bearing plate mechanism 2, and the support 33 are all coincident with the axis of the flexible vacuum connector 4. Designing the pressure plate 31, the bearing plate mechanism 2, and the support 33 with coincident central axes, and placing the flexible vacuum connector 4 at the corresponding central position, helps to uniformly transmit the axial deformation of the flexible vacuum connector 4 and avoid local stress concentration caused by off-center loading.

[0033] See Figure 1 , Figure 3 and Figure 6 The carrier plate mechanism 2 includes a tray 22 and a base 21 fixed on the carrier 1. The guide post 32 slides through the base 21. The tray 22 is sealed to the base 21 and cooperates with the base 21 to support the wafer.

[0034] The carrier disk mechanism 2 includes an electrode plate, through which an electric field is applied to excite and maintain plasma, uniformly distribute the electric field to achieve uniform surface treatment, define the plasma region and regulate the treatment intensity.

[0035] In this embodiment, the substrate 21 is provided with two sealing grooves 213 forming a double-ring sealing groove, and a sealing ring is provided in the sealing groove 213. The substrate 21 and the tray 22 are connected by a double-ring sealing connection. The substrate 21 is fixed to the support member 1 by the column 11. The tray 22 is located at the center of the substrate 21. The pressure plate 31 is an annular plate structure. The pressure plate 31 abuts against the substrate 21 and presses the edge of the wafer. The substrate 21 is also provided with a liftable ejector pin 23. The top of the ejector pin 23 can pass through the tray 22 to support the wafer.

[0036] When the robotic arm places the wafer, the tip of the ejector pin 23 extends to a position higher than the tray 22 to support the wafer. After the robotic arm retracts, the ejector pin 23 descends so that the wafer falls smoothly onto the tray 22. The design of the ejector pin 23 can reserve a certain amount of working space for the robotic arm that supports the wafer.

[0037] Optionally, a pressure sensor is provided between the base 21 and the pressure plate 31 of the bearing plate mechanism 2. For example, the pressure sensor can be embedded in the pressure plate 31; one pressure sensor can be provided, or multiple pressure sensors can be evenly spaced around the circumference of the pressure plate 31. The pressure sensor design can detect the pressing force on the wafer in real time, and multiple pressure sensors can also be used to detect the uniformity of pressure distribution.

[0038] Optionally, the tray 22 and the base 21 enclose each other to form a liquid cooling channel. Designing a liquid cooling channel between the tray 22 and the base 21 can cool the tray 22 by water cooling, thereby improving the heat dissipation performance of the tray 22.

[0039] Optionally, the substrate 21 is provided with a cooling gas channel 212. The air inlet of the cooling gas channel 212 is used to connect with the gas supply system, and the air outlet of the cooling gas channel 212 passes through the tray 22 and acts between the tray 22 and the wafer. Gas is introduced into the cooling gas channel 212 by the gas supply system, and the gas can act between the tray 22 and the wafer to achieve heat dissipation.

[0040] In this embodiment, a liquid cooling tank 211 is provided inside the substrate 21, and the liquid cooling tank 211 and the surface of the tray 22 together form a liquid cooling channel; the bearing surface of the tray 22 for contacting the wafer is also provided with a cooling airflow channel 221, which is connected to the cooling gas channel 212. The cooling airflow channel 221 is designed to increase the gas action range, further improve the heat dissipation effect, accurately control the temperature, and prevent wafer defects caused by temperature; the gas used includes, but is not limited to, helium.

[0041] See Figure 4 and Figure 5The wafer stage also includes an elastic pressing mechanism 5, which includes an elastic element 51. A support element 33 is located between the carrier disk mechanism 2 and the carrier element 1. The support element 33 is provided with a receiving groove 331. The elastic element 51 is at least partially disposed in the receiving groove 331 and located between the carrier disk mechanism 2 and the support element 33. When the flexible vacuum connector 4 extends, the support element 33 approaches the carrier disk mechanism 2 and squeezes the elastic element 51. When the flexible vacuum connector 4 shortens, the carrier disk mechanism 2 approaches the pressure plate 31 under the action of the elastic element 51 and presses the wafer.

[0042] Based on the flexible vacuum connector 4, an elastic element 51 is added, and a receiving groove 331 is provided on the support 33 to accommodate the elastic element 51. When the flexible vacuum connector 4 extends, the support 33 squeezes the elastic element 51 and abuts against the base 21 of the carrier plate mechanism 2. When the flexible vacuum connector 4 shortens, under the elastic force of the elastic element 51, the support 33 moves away from the carrier plate mechanism 2 and drives the pressure plate 31 to approach the carrier plate mechanism 2 until the pressure plate 31 abuts against the base 21. The elastic element 51 works with the flexible vacuum connector 4 to achieve wafer pressing, playing the role of contact buffering and pressure regulation, preventing the wafer from deforming or even being damaged and broken due to minor unevenness or deviation.

[0043] In this embodiment, the support member 33 includes a support plate and a mounting cylinder. The support plate is connected to the guide post 32 and the flexible vacuum connector 4. The mounting cylinder protrudes from the side of the support plate away from the base 21. The axial direction of the mounting cylinder is parallel to the axial direction of the flexible vacuum connector 4. The inner hole of the mounting cylinder serves as a receiving groove 331.

[0044] Furthermore, the elastic pressing mechanism 5 also includes an adjusting guide post 52 and an adjusting nut 53. The adjusting guide post 52 is rotatably connected to the support member 33. The adjusting nut 53 is threadedly connected to the portion of the adjusting guide post 52 placed in the receiving groove 331. The elastic member 51 is sleeved on the adjusting guide post 52 and its two ends abut against the bearing plate mechanism 2 and the adjusting nut 53 respectively. The rotation of the adjusting guide post 52 can drive the adjusting nut 53 to move within the receiving groove 331.

[0045] In this embodiment, the axial direction of the adjusting guide post 52 coincides with the axial direction of the mounting cylinder of the support member 33; the top end of the adjusting guide post 52 is placed in the receiving groove 331 and threadedly connected to the adjusting nut 53, and the bottom end of the adjusting guide post 52 passes through the support member 33 and is placed outside the receiving groove 331; the elastic member 51 is sleeved on the top end of the adjusting guide post 52, the top end of the elastic member 51 abuts against the base 21 and the bottom end abuts against the adjusting nut 53; the elastic member 51 is a compression spring.

[0046] When the bottom end of the adjusting guide post 52 is rotated, the adjusting nut 53 is moved along the axis of the adjusting guide post 52, thereby changing the compression of the elastic element 51 and making the preload of the elastic element 51 adjustable, which helps to ensure the wafer yield.

[0047] The support member 33 is also provided with an elongated slot 332, which passes through the support member 33 and is connected to the receiving groove 331. The length direction of the elongated slot 332 is parallel to the moving direction of the adjusting nut 53, and part of the sliding limit of the adjusting nut 53 is located in the elongated slot 332.

[0048] An elongated slot 332 is designed on the support member 33. When the adjusting nut 53 moves, the position of the adjusting nut 53 can be observed intuitively from the elongated slot 332, realizing the visualization of adjustment. A positioning mark can also be set at the edge of the elongated slot 332 to facilitate the quick and accurate switching of the adjusting nut 53 to a specific position.

[0049] See Figure 1 and Figure 7 The wafer stage also includes a first electrical contact sensor 6, which includes a first conductive part 61 and a first receiving part 62. One of the first conductive part 61 and the first receiving part 62 is insulated and fixed to the carrier disk mechanism 2, and the other is insulated and fixed to the support member 33. When the support member 33 abuts against the carrier disk mechanism 2, the first conductive part 61 and the first receiving part 62 make contact and conduct.

[0050] The first conductive part 61 and the first receiving part 62 of the first electrical contact sensor 6 are made to make contact and conduction to detect that the pressure ring mechanism 3 is in the second position where the support member 33 abuts against the base 21 of the bearing plate mechanism 2. This determines whether the pressure ring mechanism 3 is in place so that the subsequent action can be driven by the flexible vacuum connector 4 to prevent misoperation.

[0051] In this embodiment, the first conductive part 61 is insulated and fixed on the base 21, and the first receiving part 62 is insulated and fixed on the support member 33. The first receiving part 62 partially passes through the support member 33 and is exposed on the side of the support member 33 near the base 21. The movement of the support member 33 synchronously drives the first receiving part 62 to move.

[0052] See Figure 1 and Figure 5 The wafer stage also includes a second electrical contact sensor 7, which includes an insulating member 71, a second conductive part 72, and a second receiving part. The insulating member 71 passes through the support member 33 and is fixed at one end to the carrier plate mechanism 2. One of the second conductive part 72 and the second receiving part is fixed to the other end of the insulating member 71, and the other is insulated and fixed to the support member 33. When the pressure plate 31 abuts against the carrier plate mechanism 2, the second conductive part 72 and the second receiving part make contact and conduct.

[0053] The second conductive part 72 and the second receiving part of the second electrical contact sensor 7 are made to make contact and conduction, so as to detect that the pressing ring mechanism 3 is in the first position where the pressing plate 31 and the base 21 of the carrier plate mechanism 2 are in contact. This determines whether the pressing ring mechanism 3 is in place and ensures stable pressing of the wafer.

[0054] In this embodiment, the insulating member 71 is a column, the top end of the insulating member 71 passes through the support member 33 and is fixed to the base 21, the second conductive part 72 is a sheet structure and is sleeved and fixed to the bottom end of the insulating member 71, and the second receiving part is insulated and fixed to the support member 33. The movement of the support member 33 synchronously drives the movement of the second receiving part.

[0055] It is understandable that the specific structure and cooperation principle of the conductive part and the receiving part in the first electrical contact sensor 6 and the second electrical contact sensor 7 can be designed with reference to existing technology, and will not be repeated here.

[0056] The following is a detailed description of the usage process of the wafer stage: See Figure 1 and Figure 2 In the initial state, when the gas source does not supply gas to the flexible vacuum connector 4, the pressure ring mechanism 3 of the wafer stage is in the first position where the pressure plate 31 abuts against the base 21 of the carrier plate mechanism 2; at this time, the second conductive part 72 and the second receiving part of the second electrical contact sensor 7 are in contact and connected, and the first conductive part 61 and the first receiving part 62 of the first electrical contact sensor 6 are separated.

[0057] See Figures 3 to 5 When the gas source supplies gas to the flexible vacuum connector 4, the flexible vacuum connector 4 extends, the pressure ring mechanism 3 rises relative to the carrier plate mechanism 2, the pressure plate 31 gradually moves away from the carrier plate mechanism 2, and the support member 33 gradually moves closer to the carrier plate mechanism 2 until the support member 33 abuts against the base 21 of the carrier plate mechanism 2, that is, the pressure ring mechanism 3 is in the second position. At this time, the wafer can be placed on the base 21, so that the wafer is placed below the pressure plate 31. At this time, the second conductive part 72 and the second receiving part of the second electrical contact sensor 7 separate, and the first conductive part 61 and the first receiving part 62 of the first electrical contact sensor 6 make contact and conduct.

[0058] When the gas in the flexible vacuum connector 4 is discharged, the flexible vacuum connector 4 shortens, the pressure ring mechanism 3 rises relative to the carrier plate mechanism 2, the support 33 gradually moves away from the carrier plate mechanism 2, and the pressure plate 31 gradually moves closer to the carrier plate mechanism 2 until the pressure plate 31 abuts against the base 21 of the carrier plate mechanism 2. The pressure plate 31 cooperates with the base 21 to press the wafer. At this time, the pressure ring mechanism 3 of the wafer stage returns to the first position where the pressure plate 31 abuts against the base 21. If the pressing needs to be released later, the gas source can be used to supply gas to the flexible vacuum connector 4 again.

[0059] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A wafer stage, characterized in that, include: The carrier (1) is disposed in the vacuum chamber; The carrier disk mechanism (2) is fixed on the carrier (1) and is used to support the wafer; The pressure ring mechanism (3) and the bearing plate mechanism (2) are both located in the vacuum chamber. The pressure ring mechanism (3) includes a pressure plate (31), a guide post (32) and a support member (33) that are fixedly connected in sequence. The bearing plate mechanism (2) is located between the pressure plate (31) and the support member (33). The guide post (32) slides through the bearing plate mechanism (2). A flexible vacuum connector (4) is located in the vacuum chamber. The flexible vacuum connector (4) is sealed between the support member (33) and the carrier member (1). The flexible vacuum connector (4) is connected to the gas source located outside the vacuum chamber through a gas pipe. Under the action of air pressure, the flexible vacuum connector (4) drives the pressure ring mechanism (3) to move relative to the carrier plate mechanism (2) to drive the pressure plate (31) to press the wafer or release the pressing.

2. The wafer stage according to claim 1, characterized in that, The carrier (1) is provided with an air port that communicates with the flexible vacuum connector (4), and the air port is connected to the air source through the air pipe.

3. The wafer stage according to claim 1, characterized in that, It also includes an elastic pressing mechanism (5), which includes an elastic element (51), a support element (33) located between the bearing plate mechanism (2) and the bearing element (1), the support element (33) having a receiving groove (331), and the elastic element (51) being at least partially disposed in the receiving groove (331) and located between the bearing plate mechanism (2) and the support element (33); When the flexible vacuum connector (4) elongates, the support (33) approaches the bearing disk mechanism (2) and squeezes the elastic element (51). When the flexible vacuum connector (4) shortens, the bearing disk mechanism (2) approaches the pressure plate (31) and presses the wafer under the action of the elastic element (51).

4. The wafer stage according to claim 3, characterized in that, The elastic pressing mechanism (5) further includes an adjusting guide post (52) and an adjusting nut (53). The adjusting guide post (52) is rotatably connected to the support member (33). The adjusting nut (53) is threadedly connected to the portion of the adjusting guide post (52) placed in the receiving groove (331). The elastic member (51) is sleeved on the adjusting guide post (52) and its two ends abut against the bearing plate mechanism (2) and the adjusting nut (53) respectively. The rotation of the adjusting guide post (52) can drive the adjusting nut (53) to move within the receiving groove (331).

5. The wafer stage according to claim 4, characterized in that, The support member (33) is also provided with an elongated slot (332), which penetrates the support member (33) and communicates with the receiving groove (331). The length direction of the elongated slot (332) is parallel to the moving direction of the adjusting nut (53), and part of the sliding limit of the adjusting nut (53) is located in the elongated slot (332).

6. The wafer stage according to any one of claims 1-5, characterized in that, The carrier disk mechanism (2) includes a tray (22) and a base (21) fixed on the carrier (1). The guide post (32) slides through the base (21). The tray (22) is sealed to the base (21) and cooperates with the base (21) to support the wafer. The tray (22) and the substrate (21) enclose a liquid cooling channel, and / or, the substrate (21) is provided with a cooling gas channel (212), the air inlet of the cooling gas channel (212) is used to communicate with the gas supply system, and the air outlet of the cooling gas channel (212) passes through the tray (22) and acts between the tray (22) and the wafer.

7. The wafer stage according to any one of claims 1-5, characterized in that, It also includes a first electrical contact sensor (6), which includes a first conductive part (61) and a first receiving part (62). One of the first conductive part (61) and the first receiving part (62) is insulated and fixed to the carrier plate mechanism (2), and the other is insulated and fixed to the support member (33). When the support member (33) abuts against the carrier plate mechanism (2), the first conductive part (61) and the first receiving part (62) make contact and conduct.

8. The wafer stage according to any one of claims 1-5, characterized in that, It also includes a second electrical contact sensor (7), which includes an insulating member (71), a second conductive part (72), and a second receiving part. The insulating member (71) passes through the support member (33) and is fixed at one end to the carrier plate mechanism (2). One of the second conductive part (72) and the second receiving part is fixed to the other end of the insulating member (71), and the other is fixed to the support member (33). When the pressure plate (31) abuts against the bearing plate mechanism (2), the second conductive part (72) and the second receiving part make contact and conduct.

9. The wafer stage according to any one of claims 1-5, characterized in that, A pressure sensor is provided between the bearing plate mechanism (2) and the pressure plate (31).

10. A wafer surface treatment equipment, characterized in that, It includes a vacuum chamber, a gas source, and a wafer stage as described in any one of claims 1-9.

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