cooling device

Abstract

The application discloses a cooling device, comprising a bearing plate, a first cover body and a first heat conductor, the bearing plate is provided with grooves corresponding to the first cover body on both sides of the bearing plate, and the first heat conductor is arranged in the grooves; the first cover body is provided with a liquid inlet and a liquid outlet, and the first cover body and the bearing plate jointly form a first cooling cavity. The liquid cooling heat dissipation structure is formed by cooperation of the bearing plate, the first cover body and the first heat conductor, the heat of the chip is efficiently transmitted to the bearing plate through the liquid first heat conductor, and then the flowing cooling liquid quickly takes out the heat, compared with the traditional air cooling heat dissipation, the efficiency is significantly improved, the local high temperature of the chip can be effectively avoided, and stable operation of the chip under high frequency and high load is ensured; meanwhile, the overall structure of the cooling device is compact, there is no fan operation noise, the cooling device has the advantages of good heat dissipation effect, simple structure, silence and reliability, and is favorable for prolonging the service life of the chip and electronic equipment.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more specifically, to a cooling device. Background Technology

[0002] As the core functional component of various electronic devices, chips continuously generate a large amount of heat during high-frequency operation and high-load work. If the heat cannot be dissipated in a timely and effective manner, the chip temperature will rise sharply, leading to problems such as decreased computing speed and reduced operational stability. In severe cases, it may even cause chip performance degradation or burnout, directly affecting the normal use and lifespan of the device.

[0003] Currently, traditional air cooling is the most common method for chip heat dissipation, using fans to circulate air and exchange heat. However, air has poor thermal conductivity and limited heat exchange efficiency, resulting in poor heat dissipation for highly integrated, high-power chips and the formation of localized high-temperature areas. In addition, air cooling structures also have disadvantages such as large size and significant operating noise. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a cooling device.

[0005] The present invention discloses a cooling device comprising: a support plate, a first cover, and a first heat conductor. The support plate has a groove, which is disposed on both sides of the support plate corresponding to the first cover. The first heat conductor is disposed in the groove. The first cover has a liquid inlet and a liquid outlet. The first cover and the support plate together constitute a first cooling chamber. The coolant flows sequentially through the inlet, the first cooling chamber, and the outlet. The groove is connected to the chip and forms a heat-conducting chamber. The heat from the chip is transferred to the first heat conductor, which changes from a solid to a liquid state. The first heat conductor transfers the heat to the carrier plate, and the heat from the carrier plate is carried out with the flow of the coolant.

[0006] According to one embodiment of the present invention, the first heat conductor is made of gallium material.

[0007] According to one embodiment of the present invention, it further includes a plurality of second heat conductors, which are spaced apart in the groove; the first heat conductor transfers heat to the plurality of second heat conductors, and the plurality of second heat conductors then transfer heat to the support plate.

[0008] According to one embodiment of the present invention, both the support plate and the second heat conductor are made of thermally conductive material.

[0009] According to one embodiment of the present invention, it further includes a first sealing body, which is disposed between the support plate and the first cover.

[0010] According to one embodiment of the present invention, a second sealing body is further included, which is disposed at the edge of the groove.

[0011] According to one embodiment of the present invention, it further includes a first inlet pipe and a first outlet pipe, wherein the first inlet pipe is connected to an inlet port and the first outlet pipe is connected to an outlet port.

[0012] According to one embodiment of the present invention, it further includes an injection pipe and a distributor. The distributor is disposed on a support plate. The injection pipe and the first inlet pipe are both connected to the distributor. Coolant is injected through the injection pipe and flows through the distributor and the first inlet pipe into the first cooling chamber.

[0013] According to one embodiment of the present invention, the system further includes a second cover, a second inlet pipe, and a second outlet pipe. The second cover is disposed on the support plate and forms a second cooling chamber. The second inlet pipe is connected to the distributor and the second cover, and the second outlet pipe is connected to the second cover. The coolant in the distributor flows into the second cooling chamber through the second inlet pipe and then flows out through the second outlet pipe.

[0014] According to one embodiment of the present invention, the system further includes a third cover and a drain pipe. The third cover is disposed on the support plate and forms a third cooling chamber. The first and second drain pipes are both connected to the third cover, and the drain pipe is connected to the third cover. Coolant flows into the third cooling chamber from the first and second drain pipes and then flows out from the drain pipe.

[0015] The beneficial effects of this invention are as follows: by combining the carrier plate, the first cover and the first heat conductor to form a liquid cooling heat dissipation structure, the heat of the chip is efficiently transferred to the carrier plate through the first heat conductor, and then the heat is quickly carried away by the flowing coolant. Compared with traditional air cooling, its efficiency is significantly improved, which can effectively avoid local high temperature of the chip and ensure stable operation of the chip under high frequency and high load. At the same time, the cooling device has a compact overall structure, no fan noise, and has the advantages of good heat dissipation, simple structure, quiet and reliable operation, which is conducive to extending the service life of the chip and electronic equipment. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a three-dimensional structural diagram of the cooling device; Figure 2 This is a cross-sectional schematic diagram of the cooling device; Figure 3 for Figure 2 Enlarged view at point B in the middle; Figure 4 This is another cross-sectional view of the cooling device; Figure 5 This is a schematic diagram of the assembly structure of the support plate, the second heat conductor and the second sealing body; Figure 6 for Figure 5 Enlarged view of section A in the middle; Figure 7 This is a front view of the cooling device.

[0017] Explanation of reference numerals in the attached figures 1. Support plate; 11. Groove; 2. First cover; 21. Liquid inlet; 22. Liquid outlet; 3. First heat conductor; 4. First cooling chamber; 5. Second heat conductor; 6. First sealing body; 7. Second sealing body; 8. First inlet pipe; 9. First outlet pipe; 10. Injection tubing; 20. Flow separator; 30. Second cover; 301. Second cooling chamber; 40. Second inlet pipe; 50. Second outlet pipe; 60. Third cover; 601. Third cooling chamber; 70. Drain pipe; 100. Chips; 200. Heat conduction cavity. Detailed Implementation

[0018] The following drawings disclose several embodiments of the present invention. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0019] Furthermore, in this invention, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the invention. They are merely used to distinguish components or operations described using the same technical terms, and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, such a combination should be considered nonexistent and not within the scope of protection claimed by this invention.

[0020] like Figures 1-7 As shown, Figure 1 This is a three-dimensional structural diagram of the cooling device; Figure 2 This is a cross-sectional schematic diagram of the cooling device; Figure 3 for Figure 2 Enlarged view at point B in the middle; Figure 4 This is another cross-sectional view of the cooling device; Figure 5 This is a schematic diagram of the assembly structure of the support plate 1, the second heat conductor 5 and the second sealing body 7; Figure 6 for Figure 5 Enlarged view of section A in the middle; Figure 7 This is a front view of the cooling device. The cooling device includes a support plate 1, a first cover 2, and a first heat conductor 3. The first cover 2 is disposed on one side of the support plate 1, and the first heat conductor 3 is disposed on the other side of the support plate 1. The area where the first cover 2 is disposed corresponds to the area where the first heat conductor 3 is disposed.

[0021] A groove 11 is provided on one side of the support plate 1, and the first heat conductor 3 is disposed in the groove 11. The groove 11 is positioned corresponding to the first cover 2. The first cover 2 has a liquid inlet 21 and a liquid outlet 22. After the first cover 2 is connected to the support plate 1, the two together form the first cooling cavity 4. Both the liquid inlet 21 and the liquid outlet 22 are connected to the first cooling cavity 4. In use, the support plate 1 is connected to the chip 100, and the groove 11 and the chip 100 together form a heat-conducting cavity 200. When the chip 100 is working, it will generate heat, which is transferred to the first heat conductor 3. The first heat conductor 3 transfers the heat to the support plate 1. Then, the external coolant flows into the first cooling cavity 4 through the liquid inlet 21 of the first cover 2, and then flows out through the liquid outlet 22 of the first cover 2. During the process of flowing through the first cooling cavity 4, the coolant will carry away the heat on the support plate 1, thereby achieving heat dissipation and cooling of the chip 100.

[0022] In this embodiment, the first heat conductor 3 is made of gallium material. When in use, the gallium material can be pre-pressed into the groove 11. The heat generated by the chip 100 during operation is transferred to the first heat conductor 3. After absorbing the heat, the first heat conductor 3 will change from solid to liquid to improve the heat transfer effect.

[0023] Furthermore, the cooling device also includes multiple second heat conductors 5, which are spaced apart on one side of the support plate 1 and are all located within the groove 11. The first heat conductor 3 is in contact with the second heat conductors 5. In use, the first heat conductor 3 transfers heat to the second heat conductors 5, and then the second heat conductors 5 transfer heat to the support plate 1. After the first heat conductor 3 turns into a liquid state, the contact area between the first heat conductor 3 and the second heat conductor 5 is greatly increased, which is beneficial to improving heat dissipation. In addition, one side of the first heat conductor 3 is in contact with the chip 100, where it absorbs more heat and has a higher temperature, while the other side of the first heat conductor 3 is in contact with the second heat conductor 5, where its heat is carried away and its temperature is lower. Due to the temperature difference between the two sides of the first heat conductor 3, the side with a higher temperature will move towards the second heat conductor 5, while the side with a lower temperature will move towards the chip 100. This further improves the heat absorption and transfer efficiency of the first heat conductor 3.

[0024] In practical applications, the support plate 1 and the second heat conductor 5 can be made of the same material or different materials. For example, the support plate 1 can be made of aluminum, and the second heat conductor 5 can be made of copper. The process of placing the second heat conductor 5 on the support plate 1 is as follows: First, the support plate 1 is placed in a designated position. Then, high-pressure gas is used to transport the pre-prepared powder particles corresponding to the material of the second heat conductor 5. Then, the powder particles are mixed with another heated high-pressure gas to form a mixed gas. The mixed gas passes through the Laval tube and is output to the designated position on the surface of the support plate 1. During the process, the flow velocity increases from subsonic to supersonic, and finally impacts the surface of the support plate 1. The powder particles, with their own high-speed kinetic energy, undergo violent deformation at the moment of impact with the surface of the support plate 1. Through mechanical interlocking and metal bonding, they deposit on the surface of the support plate 1 to form a dense and completely covered second heat conductor 5. The mechanical interlocking and metal bonding between the powder particles and the support plate 1 can eliminate the gap between the second heat conductor 5 and the support plate 1, which is beneficial to solving the electrochemical corrosion problem at the interface between the two. At the same time, it can also improve the bonding strength between the second heat conductor 5 and the support plate 1.

[0025] Preferably, the cooling device further includes a first sealing body 6, which is disposed between the first cover 2 and the support plate 1. The first sealing body 6 helps to improve the sealing performance of the first cooling cavity 4 and prevents the coolant from flowing out from the edge of the first cover 2. Further, the cooling device also includes a second sealing body 7, which is disposed at the edge of the groove 11 and located between the support plate 1 and the chip 100. The second sealing body 7 effectively improves the sealing performance of the heat conduction cavity 200 and prevents the liquid first heat conductor 3 in the heat conduction cavity 200 from flowing out along the edge of the groove 11. Specifically, both the first sealing body 6 and the second sealing body 7 can adopt existing colloidal structures.

[0026] The cooling device also includes a first liquid inlet pipe 8 and a first liquid outlet pipe 9. The first liquid inlet pipe 8 is connected to the liquid inlet 21 of the first cover 2, and the first liquid outlet pipe 9 is connected to the liquid outlet 22 of the first cover 2. Both the first liquid inlet pipe 8 and the first liquid outlet pipe 9 are connected to the first cooling chamber 4. The arrangement of the first liquid inlet pipe 8 and the first liquid outlet pipe 9 facilitates the flow of coolant in the first cooling chamber 4 of the first cover 2.

[0027] Furthermore, the cooling device also includes an injection pipe 10 and a distributor 20. The distributor 20 is disposed on the support plate 1, the injection pipe 10 is connected to the distributor 20, and the first inlet pipe 8 is connected to the distributor 20. In use, external coolant is injected through the injection pipe 10, and the coolant flows sequentially through the distributor 20 and the first inlet pipe 8 before entering the first cooling chamber 4, and then flows out through the first outlet pipe 9.

[0028] In practical applications, there may be multiple chips 100. Each chip 100 is equipped with a groove 11, a first heat conductor 3, and a second heat conductor 5. The arrangement and structure of these three components are the same as described above and will not be repeated here. Please review. Figure 7The arrows in the diagram indicate the flow direction of the coolant. Taking three chips 100 as an example, the cooling device also includes a second cover 30, a second inlet pipe 40, and a second outlet pipe 50. The second cover 30 is disposed on the support plate 1, and the second cover 30 and the support plate 1 together form the second cooling chamber 301. The second inlet pipe 40 is connected to the distributor 20 and the second cover 30, respectively, and the second outlet pipe 50 is connected to the second cover 30. In use, the coolant flows through the distributor 20 and the second inlet pipe 40 into the second cooling chamber 301, and then flows out through the second outlet pipe 50. The cooling device also includes a third cover 60 and a drain pipe 70. The third cover 60 is disposed on the support plate 1, and the third cover 60 and the support plate 1 together form the third cooling chamber 601. The first outlet pipe 9, the second outlet pipe 50, and the drain pipe 70 are all connected to the third cover 60. In use, the coolant flowing from the first outlet pipe 9 and the second outlet pipe 50 flows into the third cooling chamber 601, and is then discharged by the drain pipe 70. Specifically, the first cover 2, the second cover 30, and the third cover 60 correspond to three chips 100 respectively. After the coolant flows through the first cooling chamber 4, the second cooling chamber 301, and the third cooling chamber 601, it cools and reduces the temperature of the corresponding area of ​​the support plate 1.

[0029] In this embodiment, the support plate 1, the second heat conductor 5, the first cover 2, the second cover 30 and the third cover 60 are all made of heat-conducting materials.

[0030] In summary, by combining the carrier plate 1, the first cover 2, and the first heat conductor 3 to form a liquid cooling structure, the heat from the chip 100 is efficiently transferred to the carrier plate 1 via the first heat conductor 3, and then quickly carried away by the flowing coolant. Compared with traditional air cooling, its efficiency is significantly improved, which can effectively avoid local high temperatures of the chip 100 and ensure stable operation of the chip 100 under high frequency and high load. At the same time, the cooling device has a compact overall structure, no fan noise, and has the advantages of good heat dissipation, simple structure, and quiet reliability, which is conducive to extending the service life of the chip 100 and electronic equipment.

[0031] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A cooling device, characterized in that, include: The support plate (1), the first cover (2) and the first heat conductor (3) are provided. The support plate (1) has a groove (11). The groove (11) is disposed on both sides of the support plate (1) corresponding to the first cover (2). The first heat conductor (3) is disposed in the groove (11). The first cover (2) has a liquid inlet (21) and a liquid outlet (22). The first cover (2) and the support plate (1) together constitute the first cooling chamber (4). The coolant flows sequentially through the inlet (21), the first cooling chamber (4) and the outlet (22). The groove (11) is connected to the chip (100) and forms a heat-conducting chamber (200). The heat of the chip (100) is transferred to the first heat conductor (3). The first heat conductor (3) changes from solid to liquid. The first heat conductor (3) transfers the heat to the support plate (1). With the flow of the coolant, the heat of the support plate (1) is carried out.

2. The cooling device according to claim 1, characterized in that, The first heat conductor (3) is made of gallium material.

3. The cooling device according to claim 2, characterized in that, It also includes multiple second heat conductors (5), which are spaced apart in the groove (11); the first heat conductor (3) transfers heat to the multiple second heat conductors (5), and the multiple second heat conductors (5) then transfer heat to the support plate (1).

4. The cooling device according to claim 3, characterized in that, Both the support plate (1) and the second heat conductor (5) are made of thermally conductive material.

5. The cooling device according to any one of claims 1-4, characterized in that, It also includes a first sealing body (6), which is disposed between the support plate (1) and the first cover (2).

6. The cooling device according to any one of claims 1-4, characterized in that, It also includes a second sealing body (7), which is disposed at the edge of the groove (11).

7. The cooling device according to any one of claims 1-4, characterized in that, It also includes a first inlet pipe (8) and a first outlet pipe (9), the first inlet pipe (8) being connected to the inlet (21) and the first outlet pipe (9) being connected to the outlet (22).

8. The cooling device according to claim 7, characterized in that, It also includes a liquid injection pipe (10) and a distributor (20). The distributor (20) is set on the support plate (1). The liquid injection pipe (10) and the first liquid inlet pipe (8) are both connected to the distributor (20). The coolant is injected through the liquid injection pipe (10). After the coolant flows through the distributor (20) and the first liquid inlet pipe (8), it enters the first cooling chamber (4).

9. The cooling device according to claim 8, characterized in that, It also includes a second cover (30), a second liquid inlet pipe (40) and a second liquid outlet pipe (50). The second cover (30) is disposed on the support plate (1) and forms a second cooling chamber (301). The second liquid inlet pipe (40) is connected to the distributor (20) and the second cover (30) respectively. The second liquid outlet pipe (50) is connected to the second cover (30). The coolant in the distributor (20) flows into the second cooling chamber (301) through the second liquid inlet pipe (40) and then flows out through the second liquid outlet pipe (50).

10. The cooling device according to claim 9, characterized in that, It also includes a third cover (60) and a drain pipe (70). The third cover (60) is disposed on the support plate (1) and forms a third cooling chamber (601). The first drain pipe (9) and the second drain pipe (50) are both connected to the third cover (60), and the drain pipe (70) is connected to the third cover (60). Coolant flows into the third cooling chamber (601) from the first drain pipe (9) and the second drain pipe (50), and then flows out from the drain pipe (70).

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