Laser processing apparatus and method

Abstract

The present invention relates to a laser processing apparatus and method. Technical problems will be solved by providing a laser processing apparatus and method capable of changing a processing recipe (processing condition) according to a material and thickness of a processing object. To this end, the present disclosure provides a laser processing apparatus including a laser generator for generating a laser beam, a scanner for emitting the laser output from the laser generator so as to process a processing object, a moving unit for moving the scanner, a vision unit for photographing the processing object processed by the scanner, and a control unit for analyzing a thermal deformation tendency of a processing area based on an image of the processing object photographed by the vision unit, changing a processing recipe based on the thermal deformation tendency, and controlling at least one among the laser generator, the scanner, and the moving unit according to the changed processing recipe.

Description

Technical Field

[0001] This invention relates to laser processing equipment and methods for processing objects using lasers. Background Technology

[0002] A secondary battery charges and discharges by moving ions of an electrolyte placed between a positive electrode and a negative electrode, which are insulated by a separator, between the two electrodes. The electrodes used in a secondary battery, specifically the positive and negative electrodes, comprise an electrode body and an electrode active material coated thereon. The electrode body is typically formed by processing highly conductive metals such as aluminum (Al) and copper (Cu) into sheets, plates, or foils.

[0003] The electrode plate (electrode film) used to form the electrode assembly is manufactured in a form in which a portion of the electrode plate is coated with an active material and the remaining portion is uncoated, exposing the electrode body. The uncoated portion exposing the electrode body is processed to connect the positive and negative electrodes to external electrode terminals when constructing the electrode assembly (positive electrode, negative electrode, and diaphragm). To enable such processing, the electrode film is formed by coating a thin conductive sheet constituting the electrode body with an active material and is thus rendered undetectable through processing.

[0004] To address this, a grooving apparatus is provided. The grooving apparatus is used to form a terminal portion by cutting a portion of the uncoated portion and a portion coated with an active material from an electrode film. Specifically, the grooving apparatus forms the terminal portion by cutting a portion of the uncoated portion using a punch or laser.

[0005] Conventionally, grooving devices using punches are mainly used. However, recently, laser-based devices have been used for grooving, and because they cause less damage to the electrodes than punches and enable efficient production, the use of laser-based grooving devices is increasing.

[0006] When laser processing (cutting) electrode plates, quality variations occur due to the mechanical properties of the electrode plates, such as material and thickness. Furthermore, when processing electrode plates using the same processing formula (processing conditions), it is difficult to find processing conditions that satisfy both the foil portion and the coated portion, and quality variations due to thermal deformation occur even after processing.

[0007] The information disclosed in the background section of the invention is only intended to enhance the understanding of the background of the invention, and therefore may include information that does not constitute prior art. Summary of the Invention

[0008] [Technical Issues] The purpose of this invention is to provide laser processing equipment and methods that allow for changes in processing formulas (processing conditions) based on the material and thickness of the object being processed.

[0009] However, the purpose of this invention is not limited to the above-described purpose, and those skilled in the art will be able to clearly understand other purposes not mentioned from the following description of the invention.

[0010] [Technical Solution] According to one embodiment of the present invention, a laser processing apparatus for achieving this purpose analyzes the thermal deformation trend of the processing area based on an image of the processing object, and changes the processing formula based on the thermal deformation trend.

[0011] [Beneficial Effects] According to the present invention, by changing the processing formula (processing conditions) according to the material and thickness of the object being processed, it is possible to ensure optimal processing formula (processing conditions) and quality.

[0012] According to the present invention, by changing the processing formula (processing conditions) of the foil portion and the coated portion based on the thermal deformation trend of the foil portion and the coated portion during processing of the workpiece, it is possible to find a processing formula (processing conditions) that satisfies both the foil portion and the coated portion, thereby ensuring the optimal quality of the foil portion and the coated portion.

[0013] However, the effects that can be obtained by the present invention are not limited to those described above, and those skilled in the art will be able to clearly understand other technical effects not mentioned from the following description of the invention. Attached Figure Description

[0014] The accompanying drawings illustrate embodiments of the present disclosure and, together with the detailed description thereof, further describe aspects and features of the disclosure. Therefore, the present disclosure should not be construed as limited to the drawings.

[0015] Figure 1 This is a schematic diagram illustrating a laser processing apparatus according to an embodiment of the present invention.

[0016] Figure 2 It is shown Figure 1 A detailed view of the laser processing equipment shown.

[0017] Figure 3 This is a cross-sectional view showing an electrode plate according to an embodiment of the present invention.

[0018] Figure 4 This is a view illustrating an example of the laser processing path of an electrode plate according to an embodiment of the present invention.

[0019] Figure 5 This is a view illustrating an example of thermal deformation caused by the processing of an electrode plate according to an embodiment of the present invention.

[0020] Figure 6 This is an example view showing a cross-section resulting from thermal deformation of the foil portion and the coated portion according to an embodiment of the present invention.

[0021] Figure 7 This is a view illustrating an example of a focal point for describing a laser beam according to an embodiment of the present invention.

[0022] Figure 8 This is a view showing a section directly struck by a laser according to an embodiment of the present invention.

[0023] Figure 9 This is a diagram illustrating a laser processing method according to an embodiment of the present invention. Detailed Implementation

[0024] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. Prior to this, the terms or words used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted as meanings and concepts consistent with the technical spirit of the invention, based on the principle that the inventor can appropriately define the concepts of terms in order to describe his / her own invention in the best possible way. Therefore, it should be understood that the embodiments described in this specification and the constructions shown in the drawings are only some of the most preferred embodiments of the invention and do not represent the entire technical spirit of the invention, and various equivalents and modifications may exist at the time of filing this application. Furthermore, as used herein, “comprising,” “including,” and / or variations indicate the presence of the stated shapes, quantities, steps, operations, components, elements, and / or groups thereof, but do not exclude the presence or addition of one or more other shapes, quantities, operations, components, elements, and / or groups thereof. Additionally, when describing embodiments of the invention, “may” and “can be” may include “one or more embodiments of the invention.”

[0025] Additionally, to aid in understanding the invention, the drawings may not be drawn to scale, and the dimensions of some components may be exaggerated. Furthermore, the same reference numerals may be assigned to the same components in different embodiments.

[0026] The term "identical" to describe two objects being compared means "substantially identical." Therefore, substantially identical can include cases where the deviation is considered low in the art (e.g., within 5%). Furthermore, the statement that a parameter is uniform in a given region may mean that it is uniform from an average perspective.

[0027] Although terms such as "first," "second," etc., are used to describe various components, it is self-evident that these components are not limited by these terms. These terms are only used to distinguish one component from another, and unless specifically stated to the contrary, the first component can certainly also be the second component.

[0028] Throughout the specification, unless specifically stated to the contrary, each component may be singular or plural.

[0029] Setting any construction "above (or below)" or "on (or under)" a component means not only that the arbitrary construction is set to contact the upper (or lower) surface of the component, but also that another construction can be placed between the component and the arbitrary construction set on (or under) the component.

[0030] Furthermore, when a component is described as being “connected,” “joined,” or “linked” to another component, it should be understood that these components may be directly connected or linked to each other, but the other component may be “placed” between the components, or the components may be “connected,” “joined,” or “linked” through another component. Additionally, when one part is described as being electrically joined to another part, this includes not only the case of direct connection but also the case of connection with another element placed between them.

[0031] Throughout this specification, unless specifically stated to the contrary, “A and / or B” means A, B, or A and B. That is, “and / or” includes all or any combination of the listed items. Unless specifically stated to the contrary, when “C to D” is stated, it means C or greater and D or less.

[0032] Figure 1 This is a schematic diagram illustrating a laser processing apparatus according to an embodiment of the present invention. Figure 2 It is shown Figure 1 Detailed view of the laser processing equipment shown. Figure 3 This is a cross-sectional view showing an electrode plate according to an embodiment of the present invention. Figure 4 This is a view illustrating an example of the laser processing path of an electrode plate according to an embodiment of the present invention. Figure 5 This is a view illustrating an example of thermal deformation caused by the processing of an electrode plate according to an embodiment of the present invention. Figure 6 This is a view illustrating an example of a cross-section resulting from the thermal deformation of the foil portion and the coated portion according to an embodiment of the present invention. Figure 7 This is a view illustrating an example of describing the focus of a laser beam according to an embodiment of the present invention. Figure 8 This is a view showing a section directly struck by a laser according to an embodiment of the present invention.

[0033] Reference Figure 1 and Figure 2 According to an embodiment of the present invention, a laser processing apparatus 100 includes a conveying unit 110, a laser generator 120, a scanner 130, a moving unit 140, a vision unit 150, and a control unit 160.

[0034] The conveying unit 110 can convey the workpiece 10 from the supply unit 112 to the collection unit 114. Here, the workpiece 10 can be an electrode plate.

[0035] The conveying unit 110 can convey the electrode plate 10, which is wound around the outer peripheral surface of the supply roller provided in the supply unit 112, to the collecting unit 114, and a portion of the electrode plate 10 can be cut by a laser beam during the conveying process and then wound around the outer peripheral surface of the collecting roll provided in the collecting unit 114.

[0036] The laser generator 120 can generate a laser beam by adjusting at least one of the laser power, pulse repetition rate (PRR (Hz)), and beam duration according to the control signal of the control unit 160. In other words, the laser generator 120 can output a laser beam by adjusting at least one of the laser beam power, pulse repetition rate, and beam duration according to the power control value, pulse repetition rate control value, and beam duration control value included in the control signal.

[0037] The laser beam output from the laser generator 120 can be transmitted to the scanner 130 through one or more optical components (not shown) disposed between the laser generator 120 and the scanner 130 and including one or more optical mirrors, beam collectors and beam expanders forming the beam transmission path.

[0038] The scanner 130 can cut the workpiece 10 by irradiating a designated position of the workpiece 10 with a laser beam output from the laser generator 120. At this time, the scanner 130 can cut a portion of the workpiece 10 by adjusting the processing speed according to the control signal from the control unit 160 and irradiating the workpiece 10 with the laser beam. In other words, the scanner 130 can adjust the processing speed according to the processing speed control value included in the control signal and irradiate the workpiece 10 with the laser beam.

[0039] The scanner 130 can control the processing speed of the laser beam by driving a lens (not shown) and a reflector (not shown) disposed therein. In other words, the scanner 130 can change the position of the laser beam illumination while tilting the two reflectors included in the lens, and in this case, the rotational speed of the reflectors can be the processing speed. Therefore, the scanner 130 can adjust the processing speed by adjusting the rotational speed of the reflectors according to a processing speed control value.

[0040] Additionally, the scanner 130 can adjust the shape and size of the laser beam by driving the lens (not shown) and mirror (not shown) disposed therein.

[0041] The scanner 130 can cut the workpiece 10 by irradiating a laser beam in a direction perpendicular to the laser beam transmission path or in a direction parallel to the ground. Therefore, the scanner 130 can be configured to move or rotate along three axes (horizontal axis, vertical axis, and axis perpendicular to both axes).

[0042] The moving unit 140 can move the scanner 130 in the X, Y and Z axis directions.

[0043] Sometimes, the same processing objects 10 conveyed by the conveying unit 110 may have a height difference. Therefore, the moving unit 140 moves the scanner 130 in the Z-axis direction so that products with height differences can be cut without quality changes.

[0044] Additionally, the moving unit 140 can adjust the position of the scanner 130 by moving the scanner 130 along the X and Y axes.

[0045] The moving unit 140 can be implemented as an actuator consisting of a motor (e.g., a servo motor), gears, etc., to move the scanner 130 along three axes, and the movement of the moving unit 140 can be controlled by the control unit 160.

[0046] The laser beam can irradiate the workpiece 10 while moving through the moving unit 140 and the scanner 130 in the X-axis, Y-axis and Z-axis directions, and a generally quadrilateral processing area can be formed on one side of the workpiece 10 by the laser beam. Here, the workpiece 10 can be an electrode plate 10 (electrode film).

[0047] like Figure 3 As shown, the electrode plate 10 may include a foil portion 12 where the electrode body is exposed and a coating portion 11 coated with an active material. Here, the electrode body may be a metal such as aluminum or copper, and the active material may be a material such as carbon powder, but other known materials may also be used as the electrode body or the active material.

[0048] The foil portion 12 that exposes the electrode body can be processed to serve as electrode terminals for connecting the positive and negative electrodes to an external unit during the formation of the electrode assembly (positive electrode, negative electrode, and diaphragm). Therefore, the foil portion 12 is configured to transmit current to or receive current from the coating portion 11, and can be made of copper, aluminum, or the like.

[0049] The electrode plate 10 can be formed with terminals containing positive and negative electrodes using a laser beam cutting process, and can be divided by cutting to a length suitable for the size of the electrode assembly. At this time, the scanner 130 can cut the electrode plate 10 by irradiating a laser beam along the laser processing path.

[0050] Meanwhile, when the electrode plate 10 is processed (cut) using a laser beam, quality changes occur due to mechanical properties of the electrode plate 10, such as its material and thickness. In addition, when the electrode plate 10 is processed using the same processing formula (processing conditions), it is difficult to find processing conditions that satisfy the quality of both the foil portion 12 and the coated portion 11, and thermal deformation occurs even after processing, affecting product quality.

[0051] For example, describing by along Figure 4 The laser processing path A shown depicts a laser beam irradiating the electrode plate 10 to cut it. Figure 4 In the process, the laser processing path A can be a continuous line that starts at a predetermined point Start of the foil portion 12, forms in front of the coating portion 11, then forms in the coating portion 11 along the left-right direction of the electrode plate 10, and forms from the coating portion 11 toward the edge END of the foil portion 12.

[0052] When electrode plate 10 is processed (cut) by irradiating a laser beam along laser processing path A, the processed area B of electrode plate 10 may be thermally deformed by the laser beam, such as... Figure 5 As shown in the image, thermal deformation degrades product quality.

[0053] Therefore, a technique is needed to reduce thermal deformation after machining the electrode plate 10 so that the electrode plate 10 can maintain a constant mass. Since the electrode plate 10 is the workpiece 10, it will be described as the workpiece 10 in the following text.

[0054] Therefore, the laser processing apparatus 100 according to the present invention may include: a vision unit 150 for capturing an image of the processing object 10 processed by the scanner 130; and a control unit 160 for changing the processing formula required for laser processing based on the image of the processing object captured by the vision unit 150.

[0055] The vision unit 150 can capture images of the workpiece 10 processed by the scanner 130 and transmit the captured images of the workpiece 10 to the control unit 160.

[0056] The vision unit 150 is configured such that a camera (not shown) mounted on the upper part of the conveyor unit 110 through which the workpiece 10 is moved can capture images of the workpiece 10. Therefore, the vision unit 150 may include a camera mounted on the upper part of the conveyor unit 110 and a lamp (not shown) for illuminating the workpiece 10. When the workpiece 10 is conveyed through the conveyor unit 110, the vision unit 150 can illuminate the workpiece 10 from above to enable clear reading.

[0057] Control unit 160 is a device for controlling transmission unit 110, laser generator 120, scanner 130, motion unit 140, and vision unit 150. It can be implemented as a central processing unit (CPU), system-on-a-chip (SoC), or processor, controlling multiple hardware or software components connected to control unit 160 by driving an operating system or application, and processing and calculating various types of data. Control unit 160 can be configured to execute at least one command stored in memory (not shown) and store the execution result data in memory.

[0058] The control unit 160 can analyze the thermal deformation trend of the processing area based on the image of the processing object captured by the vision unit 150, change the processing formula based on the thermal deformation trend, and control at least one of the laser generator 120, scanner 130 and moving unit 140 according to the changed processing formula.

[0059] The operation of the control unit 160 will be described in detail below.

[0060] The control unit 160 can control at least one of the laser generator 120, the scanner 130 and the moving unit 140 to perform initial processing on the workpiece 10 according to the processing formula set for the workpiece 10.

[0061] Here, the processing formula is based on preset processing conditions for the processing object 10, and may include processing speed, laser power, PRR (Hz), beam duration, etc. Processing speed may include the rotational speed of the mirror in the scanner 130. Laser power may be the output (%) of the laser beam. PRR (Hz) may be the number of laser beam repetitions per second. Beam duration may be the duration of a single laser beam.

[0062] Pulsed lasers do not scan the laser beam continuously, but rather at regular intervals. As the processing speed of the laser beam increases, the intervals between beams increase at the same scanning rate, resulting in different processing characteristics. Laser power is adjusted in percentage (%) of the maximum output, and the power becomes stronger or weaker proportionally. Since PRR (Hz) is the number of times the laser beam repetitions per second, PRR (Hz) affects processing characteristics. Since beam duration is the duration of a laser beam, beam duration affects processing quality. Therefore, a processing formula can include processing speed, laser power, PRR (Hz), and beam duration.

[0063] When the workpiece 10 is initially processed, the control unit 160 can retrieve the processing recipe set for the workpiece 10 from the memory (not shown) and generate a control signal according to the retrieved processing recipe to adjust at least one of the processing speed of the laser beam, laser power, PRR (Hz) and beam duration.

[0064] In other words, since the absorptivity of the laser beam varies depending on the workpiece 10, the control unit 160 can retrieve from its memory a processing formula that takes into account the absorptivity of the laser beam based on the material of the workpiece 10. The control unit 160 can then transmit control signals for adjusting the processing speed, laser power, PRR, and beam duration of the laser beam included in the retrieved processing formula to at least one of the laser generator 120, scanner 130, and movement unit 140.

[0065] Since the processing speed is adjusted using the scanner 130, the control unit 160 can transmit a control signal, including a processing speed control value, to the scanner 130. The scanner 130, receiving the control signal, can adjust the processing speed according to the processing speed control value included in the control signal.

[0066] Since the laser power, PRR, and beam duration are adjusted by the laser generator 120, the control unit 160 can transmit a control signal for adjusting at least one of the power, PRR, and beam duration to the laser generator 120. The laser generator 120, receiving the control signal, can adjust at least one of the laser beam power, PRR, and beam duration according to at least one of the power control value, PRR control value, and beam duration control value included in the control signal.

[0067] The laser processing equipment 100 processes the processing object 10 by irradiating it with a laser according to a preset processing formula, and the processing object 10 moves in the conveying direction via the conveying unit 110.

[0068] As described above, since a processing formula is set for the material of the object to be processed 10, the control unit 160 can process the object to be processed 10 according to the processing formula set for the material of the object to be processed 10.

[0069] However, even when the workpiece 10 is the same, the quality of the workpiece 10 may vary due to various variables such as height deviation, swaying during movement, and foreign objects.

[0070] Therefore, it is necessary to adjust the processing formula to prevent the quality of the processed object 10 from changing due to various variables.

[0071] For this purpose, the vision unit 150 can capture an image of the processed object 10 and transmit the captured image of the processed object to the control unit 160.

[0072] The control unit 160 can analyze the thermal deformation trend in the processing area based on an image of the processed object captured by the vision unit 150. In other words, the control unit 160 can analyze the thermal deformation trend in the processing area of ​​the image of the processed object, including at least one of thermal deformation width, cutting shape, color, and shading. Here, the thermal deformation width can be the width of the area deformed by the heat generated by laser processing.

[0073] When analyzing thermal deformation trends, the control unit 160 can classify the processed area into at least one of the following: a direct irradiation zone, a heat-affected zone, and a smoke-affected zone, based on the thermal deformation trends.

[0074] When laser cutting is used to process object 10, the processing area can be classified into a laser-directly struck section and a section affected by heat energy. Based on at least one of color and shadow, the heat-affected section can be classified into a heat-affected section and a smoke-affected section. The laser-directly struck section can be a surface irradiated by a laser beam and can be considered the starting point of the cutting surface (processed surface). For example, the laser-directly struck section can be a surface irradiated by a circular laser beam of 30 μm to 50 μm.

[0075] like Figure 6 As shown, the processing area processed by the laser beam can be classified into the laser-directly hit section, the heat-affected section, and the smoke-affected section. (See reference...) Figure 6 It can be seen that the foil portion 12 and the coated portion 11 have different shapes, colors, and shadows in the laser-directly-hit section, the heat-affected section, and the smoke-affected section. It can also be seen that the heat-affected section of the foil portion 12 mainly exhibits a gradient pattern, such as... Figure 6 As shown in (a) above. It can be seen that the heat-affected zone of the coated portion 11 is mainly in the form of soot, such as Figure 6As shown in (b) above. Regarding the smoke-affected zone, it can be seen that the smoke-affected zone is rarely found in the foil portion 12, but is mainly found in the coating portion 11, and has a gradient region similar to the gradient region of the heat-affected zone generated during the processing of the foil portion 12.

[0076] Therefore, the control unit 160 can classify heat-affected sections and smoke-affected sections based on at least one of the color and shadow of the heat-affected section. For example, the control unit 160 can classify sections in the heat-affected section whose color value is greater than or equal to a critical value or whose shadow level is greater than or equal to a critical level as heat-affected sections. Conversely, the control unit 160 can classify sections in the heat-affected section whose color value is less than a critical value or whose shadow level is less than a critical level as smoke-affected sections.

[0077] like Figure 6 As shown in the figure, it can be seen that the foil portion 12 and the coating portion 11 have different thermal deformation trends.

[0078] Therefore, the control unit 160 needs to make the processing formula (processing conditions) of the foil portion 12 different from the processing formula (processing conditions) of the coating portion 11. In other words, the control unit 160 can change the processing formula according to the material and thickness of the foil portion 12, and also change the processing formula according to the material and thickness of the coating portion 11. In other words, the control unit 160 can change the processing formula based on the thermal deformation trend of the foil portion 12, and also change the processing formula based on the thermal deformation trend of the coating portion 11.

[0079] The control unit 160 can change the processing formula based on the cutting shape of the section directly hit by the laser. Additionally, the control unit 160 can change the processing formula of the heat-affected zone or the smoke-affected zone based on at least one of the color and shading of the heat-affected zone or the smoke-affected zone.

[0080] First, the control unit 160 can adjust the size of the laser beam based on the section where the laser directly hits.

[0081] When there are uncut portions in the area directly hit by the laser, the control unit 160 can adjust the beam size by controlling the movement unit 140 to move the scanner 130 in the direction of gravity (Z-axis). In other words, when there are uncut portions in the processing area of ​​the image of the object being processed, the control unit 160 can adjust the beam size by moving the movement unit 140 along the Z-axis.

[0082] When an F-θ lens is used in scanner 130, the laser beam is focused to a single point, and then... Figure 7 The diffusion shown in the figure.

[0083] When the laser beam is focused to a point, it can cut (process) the object 10.

[0084] When the laser beam is not focused on a single point or is out of focus, the power (energy) is not concentrated on the laser beam and only heat is transferred, and therefore the laser beam may not cut (process) the workpiece 10. In this case, the control unit 160 should find the focal point of the laser beam.

[0085] To locate the focal point of the laser beam, the control unit 160 adjusts the distance between the scanner 130 and the workpiece 10. To this end, the control unit 160 can transmit control signals for adjusting the position of the scanner 130 to the motion unit 140. The motion unit 140 can then locate the focal point of the laser beam by moving the scanner 130 in the Z-axis direction according to the control signals. In other words, the motion unit 140 can locate the focal point of the laser beam by moving the scanner 130 up or down.

[0086] As described above, the control unit 160 can adjust the size of the laser beam by adjusting the Z-axis height of the scanner 130 according to whether it is a full cut or a half cut. Here, a full cut can refer to the case where the cut is completely successful, and a half cut can refer to the case where bridges or other defects are preserved.

[0087] When a partial cut occurs, the control unit 160 can control the moving unit 140 to move the scanner 130 in the Z-axis direction. When a full cut is performed while the scanner 130 is moving, the control unit 160 can control the moving unit 140 to stop the movement of the scanner 130.

[0088] Even if a full cut is not performed while the scanner 130 is being moved, the control unit 160 can change the laser power and PRR (Hz) to find the processing formula (processing conditions) for a full cut. If a full cut is still not performed even after changing the processing formula values, the administrator can inspect the laser processing equipment 100, replace the protective glass, and re-process.

[0089] Furthermore, the control unit 160 can classify the shape of the laser-directly-hit section into at least one of gear shape, melting shape, and teardrop shape based on the cutting shape of the laser-directly-hit section. In other words, the control unit 160 can classify the laser-directly-hit section into such... Figure 8 The three types shown are: gear shape, melt shape, and teardrop shape.

[0090] Gear shapes can be generated when the machining speed is higher than the reference speed or when the power (energy) is lower than the reference power. Melting shapes can be generated when the machining speed and power (energy) are kept constant. Teardrop shapes can be generated when the machining speed is lower than the reference speed or when the power (energy) exceeds the reference power.

[0091] Therefore, when the laser directly strikes a section with a gear or teardrop shape, the control unit 160 can adjust the processing speed and laser power in the current processing formula. The control unit 160 then transmits control signals, including processing speed control values ​​and power control values, to the scanner 130 and the laser generator 120. The scanner 130, receiving the control signals, adjusts the processing speed according to the processing speed control values. The laser generator 120, also receiving the control signals, adjusts the power according to the power control values.

[0092] For example, in the case of a gear shape, the control unit 160 can transmit a processing speed control value that lowers the processing speed from the current processing speed and a power control value that raises the laser power from the current laser power to the scanner 130 and the laser generator 120, thereby setting the processing speed lower than the current processing speed and the power higher than the current power. In the case of a teardrop shape, the control unit 160 can transmit a processing speed control value that raises the processing speed from the current processing speed and a power control value that raises the laser power from the current laser power to the scanner 130 and the laser generator 120, thereby setting the processing speed higher than the current processing speed and the power lower than the current power.

[0093] When the laser directly strikes a section and melts it, the control unit 160 can adjust at least one of the PRR, beam duration, and processing speed in the current processing formula. The control unit 160 then transmits control signals, including PRR control values, beam duration control values, and processing speed control values, to the laser generator 120 and the scanner 130. The laser generator 120, receiving the control signals, adjusts the PRR and beam duration according to the PRR control values ​​and beam duration control values. The scanner 130, receiving the control signals, adjusts the processing speed according to the processing speed control values.

[0094] The control unit 160 can classify heat-affected sections and smoke-affected sections based on at least one of the color and shadow of the heat-affected sections in the processing area.

[0095] In the case of the heat-affected zone, the light energy generated by the laser generator 120 is converted into heat energy to affect the surrounding area, so the heat-affected zone is mainly characterized by color changes.

[0096] Therefore, the control unit 160 can adjust at least one of the processing speed, laser power, PRR, and beam duration based on at least one of the width, color, and shading level of the heat-affected zone. At this time, the control unit 160 can transmit a control signal including at least one of the processing speed control value, power control value, pulse repetition rate control value, and beam duration control value to the scanner 130 and the laser generator 120. The scanner 130, receiving the control signal, can adjust the processing speed according to the processing speed control value. The laser generator 120, receiving the control signal, can adjust the laser power, PRR, and beam duration according to the power control value, PRR control value, and beam duration control value.

[0097] It can be seen that the heat-affected zone of foil section 12 mainly presents as follows: Figure 6 The gradient form shown in (a) is as follows. It can be seen that the heat-affected zone of the coated portion 11 mainly exhibits the following characteristics: Figure 6 The form of soot shown in (b) of the image.

[0098] Therefore, in the case of the heat-affected zone of the foil portion 12, the control unit 160 can change the processing formula according to the width and color of the gradient. In the case of the heat-affected zone of the coating portion 11, the control unit 160 can change the processing formula according to the shading level and width of the soot.

[0099] In the heat-affected zone, the control unit 160 can change the processing formula in the order of laser power, processing speed, PRR, and beam duration.

[0100] For example, when the color value of the heat-affected zone of the foil portion 12 is greater than or equal to the reference color value, the control unit 160 can reduce the laser power to a lower level than the current laser power. For example, when processing the workpiece 10 at 80% power and the color value of the heat-affected zone is greater than or equal to the reference color value, the control unit 160 can reduce the power to 70% to 75%. When the color value is greater than or equal to the reference color value despite the reduced power, the control unit 160 can reduce the processing speed to a lower level than the current processing speed. When the color value is greater than or equal to the reference color value despite the reduced processing speed, the control unit 160 can reduce the PRR to a lower level or increase the beam duration to a longer level than the current beam duration.

[0101] The control unit 160 can adjust at least one of the processing speed, laser power, PRR, and beam duration based on at least one of the width of the smoke-affected zone and the shadow level. In this case, the control unit 160 can transmit a control signal, including at least one of the processing speed control value, power control value, pulse repetition rate control value, and beam duration control value, to the scanner 130 and the laser generator 120. The scanner 130, receiving the control signal, can adjust the processing speed according to the processing speed control value. The laser generator 120, receiving the control signal, can adjust the laser power, PRR, and beam duration according to the power control value, PRR control value, and beam duration control value.

[0102] Regarding the areas affected by the smoke, refer to... Figure 6 As can be seen, the smoke-affected zone is rarely found in the foil portion 12, but is mainly found in the coating portion 11, and has a gradient region similar to the gradient region of the heat-affected zone generated during the processing of the foil portion 12. Therefore, in the case of the smoke-affected zone in the coating portion 11, the control unit 160 can change the processing formula according to the width and color of the gradient. In other words, the control unit 160 can adjust at least one of the processing speed, laser power, PRR, and beam duration based on the gradient and color of the smoke-affected zone in the coating portion 11.

[0103] As described above, the control unit 160 can control the processing formula of each of the foil portion 12 and the coating portion 11. In other words, the control unit 160 can change the processing formula based on the thermal deformation trend of the foil portion 12 and the thermal deformation trend of the coating portion 11.

[0104] Furthermore, the control unit 160 can change the processing formula for each laser processing path. In other words, when a foil portion 12 exists in the laser processing path during processing of the workpiece 10 along the laser processing path, the control unit 160 can change the processing formula based on the thermal deformation trend of the foil portion 12. Additionally, when a coating portion 11 exists in the laser processing path, the control unit 160 can change the processing formula based on the thermal deformation trend of the coating portion 11.

[0105] When along Figure 4When the laser processing path shown cuts (processes) the object 10, the control unit 160 can change the processing formula (processing conditions) from the foil portion 12 to the coating portion 11, or from the coating portion 11 to the foil portion 12. For example, the foil portion 12 can be processed at a processing speed of 3 m / s, 50% power, 800 kHz PRR, and a beam duration of 30 ns, and the coating portion 11 can be processed at a processing speed of 1 m / s, 80% power, 2000 kHz PRR, and a beam duration of 240 ns.

[0106] As described above, the control unit 160 can process the foil portion 12 and the coating portion 11 using different processing formulas during the processing of the workpiece 10. Therefore, according to the present invention, it is possible to find a processing formula (processing conditions) that satisfies both the foil portion 12 and the coating portion 11 and maintains the quality of the foil portion 12 and the coating portion 11.

[0107] In addition, the control unit 160 can compare the thermal deformation width of the processing area with a preset reference range, and determine that the processing object 10 is defective when the thermal deformation width exceeds the reference range.

[0108] When the thermal deformation width of the processing area is close to the upper or lower limit of the reference range, the control unit 160 can change the processing formula to make the thermal deformation width less than the upper limit, or it can change the processing formula to make the thermal deformation width greater than the lower limit.

[0109] Figure 9 This is a diagram illustrating a laser processing method according to an embodiment of the present invention.

[0110] Reference Figure 9 The control unit 160 controls at least one of the laser generator 120, scanner 130, and moving unit 140 according to a processing recipe set for the workpiece 10 (S902). During initial processing, the control unit 160 retrieves the processing recipe set for the workpiece 10 from a memory (not shown) and generates a control signal based on the retrieved processing recipe for adjusting at least one of the following: processing speed, laser power, PRR (Hz), and beam duration. The scanner 130, receiving the control signal, adjusts the processing speed according to the processing speed value of the processing recipe. The laser generator 120, also receiving the control signal, adjusts at least one of the laser beam power, PRR, and beam duration according to at least one of the power control value, PRR control value, and beam duration value included in the processing recipe in the control signal.

[0111] In operation S902, the laser generator 120, scanner 130, and moving unit 140 are adjusted according to the processing recipe, and the control unit 160 controls the processing of the workpiece 10 (S904). At this time, the scanner 130 processes the workpiece 10 by irradiating a laser beam according to the processing recipe, and the workpiece 10 moves in the conveying direction via the conveying unit 110. Then, the vision unit 150 can capture an image of the workpiece 10 processed by the vision unit 150 and transmit the captured image of the workpiece 10 to the control unit 160.

[0112] After operation S904, when an image of the object to be processed is received from the vision unit 150 (S906), the control unit 160 analyzes the thermal deformation trend of the processing area based on the image of the object to be processed (S908). In other words, the control unit 160 can analyze the thermal deformation trend of at least one of thermal deformation width, cutting shape, color, and shadow in the processing area of ​​the image of the object to be processed.

[0113] After operation S908, the control unit 160 classifies the processed area into at least one of a laser-directly struck section, a heat-affected section, and a smoke-affected section based on the thermal deformation trend (S910). When processing the object 10 using laser cutting, the processed area can be classified into a laser-directly struck section and a section affected by heat energy. Based on at least one of color and shading, the heat-affected section can be classified into a heat-affected section and a smoke-affected section.

[0114] After performing operation S910, the control unit 160 changes the processing formula based on the characteristics of at least one of the laser-directly-hit section, the heat-affected section, and the smoke-affected section (S912), and controls at least one of the laser generator 120, the scanner 130, and the moving unit 140 according to the changed processing formula (S914).

[0115] For example, when performing a half-cut in the laser-directly-hit section, the control unit 160 can change at least one of the processing formulas for the laser power and the PRR (Hz). Additionally, the control unit 160 can classify the shape of the laser-directly-hit section into at least one of a gear shape, a molten shape, and a teardrop shape based on the cutting shape of the laser-directly-hit section. The control unit 160 can change at least one of the processing formulas for the gear shape or teardrop shape, and change at least one of the processing formulas for the PRR, beam duration, and processing speed in the case of a molten shape.

[0116] In addition, the control unit 160 can change the processing formula for at least one of the processing speed, laser power, PRR and beam duration based on at least one of the width, color and shadow of the heat-affected zone.

[0117] In addition, the control unit 160 can change at least one of the processing formulas, such as processing speed, laser power, PRR, and beam duration, based on at least one of the width of the smoke-affected section and the shadow level.

[0118] As described above, according to the present invention, by changing the processing formula (processing conditions) according to the material and thickness of the object being processed 10, it is possible to ensure optimal processing formula (processing conditions) and quality.

[0119] According to the present invention, by changing the processing formula (processing conditions) of the foil portion and the coated portion based on the thermal deformation trend of the foil portion and the coated portion during the processing of the object, it is possible to find a processing formula (processing conditions) that satisfies both the foil portion and the coated portion, thereby ensuring the optimal quality of the foil portion and the coated portion.

[0120] As used in this specification, the term "unit" can include a unit implemented in hardware, software, or firmware, and can be used interchangeably with terms such as logic, logic block, component, or circuit. The term "unit" can be an integrated component or the smallest unit of a component, or a portion thereof, that performs one or more functions. For example, according to one embodiment, the term "unit" can be implemented as an application-specific integrated circuit (ASIC).

[0121] The embodiments described in this specification can be implemented as, for example, methods or processes, apparatus, software programs, data streams, or signals. Although described only in the context of a single form of embodiment (e.g., only a method is described), embodiments of the described features can also be implemented in other forms (e.g., devices or programs). Apparatus can be implemented with suitable hardware, software, firmware, etc. Methods can be implemented by means of devices (such as processors) that are generally processing means including computers, microprocessors, integrated circuits, or programmable logic devices. Processors include communication devices such as computers, cellular phones, portable / personal digital assistants (PDAs), and other means that facilitate information communication between end users.

[0122] Although the invention has been described with reference to embodiments shown in the accompanying drawings, this is merely illustrative, and those skilled in the art will understand that various modifications and other equivalent embodiments are possible. Therefore, the scope of the invention should be determined by the appended claims.

Claims

1. A laser processing apparatus, the laser processing apparatus comprising: A laser generator is constructed to produce a laser beam; The scanner is configured to process an object by irradiating it with a laser emitted from the laser generator; A mobile unit is configured to move the scanner; A vision unit is configured to capture an image of the object being processed by the scanner; as well as The control unit is configured to analyze the thermal deformation trend of the processing area based on the image of the processing object captured by the vision unit, change the processing formula based on the thermal deformation trend, and control at least one of the laser generator, the scanner, and the moving unit according to the changed processing formula.

2. The laser processing equipment according to claim 1, wherein, The processing formula includes at least one of processing speed, laser power, pulse repetition rate (PRR), and beam duration.

3. The laser processing equipment according to claim 1, wherein, The control unit is configured as follows: Control at least one of the laser generator, the scanner, and the moving unit to perform initial processing on the object to be processed according to the processing formula set for the object to be processed; as well as When the image of the object to be processed is received from the vision unit, the processing recipe is changed based on the image of the object to be processed.

4. The laser processing equipment according to claim 1, wherein, The control unit analyzes the thermal deformation trend, which includes at least one of the thermal deformation width, cutting shape, color, and shadow of the processing area in the image of the processed object.

5. The laser processing equipment according to claim 4, wherein, The control unit classifies the processed area into at least one of laser-directly-hit sections, heat-affected sections, and smoke-affected sections based on the thermal deformation trend, and changes the processing formula based on the characteristics of each classified section.

6. The laser processing equipment according to claim 5, wherein, When there is an uncut portion in the section directly hit by the laser, the control unit adjusts the beam size of the laser beam by controlling the moving unit to move the scanner in the direction of gravity.

7. The laser processing equipment according to claim 6, wherein, When a full cut is not performed by moving the scanner, the control unit changes at least one of the processing formulas: laser power and pulse repetition rate (PRR (Hz)).

8. The laser processing equipment according to claim 5, wherein, The control unit is configured as follows: Based on the cutting shape of the section directly hit by the laser, the shape of the section directly hit by the laser is classified into at least one of gear shape, melting shape, and teardrop shape, and In the case of the gear shape or the teardrop shape, at least one of the processing formulas of processing speed and laser power is changed, and in the case of the melting shape, at least one of the processing formulas of pulse repetition rate (PRR), beam duration and processing speed is changed.

9. The laser processing equipment according to claim 5, wherein, The control unit modifies the processing formula for at least one of processing speed, laser power, pulse repetition rate (PRR), and beam duration based on at least one of the width, color, and shadow of the heat-affected zone.

10. The laser processing equipment according to claim 5, wherein, The control unit adjusts the processing formula based on at least one of the width of the smoke-affected zone and the shadow level, targeting at least one of the processing speed, laser power, pulse repetition rate (PRR), and beam duration.

11. The laser processing equipment according to claim 1, wherein, The processed object includes a foil portion and a coated portion, and The control unit changes the processing formula based on the thermal deformation trend of the foil portion and also changes the processing formula based on the thermal deformation trend of the coated portion.

12. The laser processing equipment according to claim 11, wherein, During the processing of the object along the laser processing path, the control unit changes the processing formula based on the thermal deformation trend of the foil portion in the case of the foil portion in the laser processing path, and changes the processing formula based on the thermal deformation trend of the coating portion in the case of the coating portion in the laser processing path.

13. A laser processing method, the laser processing method comprising the following steps: The control unit controls at least one of the laser generator, scanner, and moving unit to perform initial processing on the object to be processed according to the processing formula set for the object to be processed; The control unit receives an image of the object being processed from the vision unit. The control unit analyzes the thermal deformation trend of the processing area based on the image of the processing object; The control unit changes the processing formula based on the thermal deformation trend; as well as The control unit controls at least one of the laser generator, the scanner, and the moving unit according to the modified processing formula.

14. The laser processing method according to claim 13, wherein, The processing formula includes at least one of processing speed, laser power, pulse repetition rate (PRR), and beam duration.

15. The laser processing method according to claim 13, wherein, In the step of analyzing the thermal deformation trend of the processed area The control unit analyzes the thermal deformation trend of the processing area in the image of the processing object, including at least one of thermal deformation width, cutting shape, color, and shadow.

16. The laser processing method according to claim 15, wherein, In the step of changing the processing formula The control unit classifies the processed area into at least one of laser-directly-hit sections, heat-affected sections, and smoke-affected sections based on the thermal deformation trend, and changes the processing formula based on the characteristics of each classified section.

17. The laser processing method according to claim 13, wherein, The processed object includes a foil portion and a coated portion, and In the step of changing the processing formula The control unit changes the processing formula based on the thermal deformation trend of the foil portion and also changes the processing formula based on the thermal deformation trend of the coated portion.

18. The laser processing method according to claim 17, wherein, In the step of changing the processing formula During the processing of the object along the laser processing path, the control unit changes the processing formula based on the thermal deformation trend of the foil portion in the case of the foil portion in the laser processing path, and changes the processing formula based on the thermal deformation trend of the coating portion in the case of the coating portion in the laser processing path.

19. A laser processing method, the laser processing method comprising the following steps: A laser beam is generated by a laser generator; The object is processed by a scanner that irradiates the object with the laser beam output from the laser generator. The image of the object being processed by the scanner is captured by the vision unit; as well as The control unit analyzes the thermal deformation trend of the processing area based on the image of the processing object captured by the vision unit, changes the processing formula based on the thermal deformation trend, and controls at least one of the laser generator, the scanner, and the moving unit according to the changed processing formula.

20. The laser processing method according to claim 19, wherein, In the control step, the control unit is configured as follows: The analysis of the thermal deformation trend of the processed area in the image of the processed object includes at least one of thermal deformation width, cutting shape, color, and shadow. Based on the thermal deformation trend, the processed area is classified into at least one of the following: laser-directly hit section, heat-affected section, and smoke-affected section; as well as The processing formula is modified based on the characteristics of each category segment.

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