Modular resistance grid assembly and resistance grid system

Abstract

Systems, apparatuses, and methods for a modular resistance grid system include a mounting base and a plurality of modular resistance grid assemblies interchangeably coupleable to the mounting base. At least two modular resistance grid assemblies belong to the plurality of modular resistance grid assemblies. Each modular resistance grid assembly has a housing and a plurality of resistance plates. Each housing has an input terminal and an output terminal. Each plurality of resistance plates is connected between the input terminal and the output terminal of the housing. Each resistance plate has a thickness, and each plurality of resistance plates provides a target resistance for the modular resistance grid assembly. A first modular resistance grid assembly has a first number of resistance plates having a first thickness. A second modular resistance grid assembly has a second number of resistance plates having a second thickness. The first number of resistance plates is more than the second number. The first thickness is greater than the second thickness.

Description

Technical Field

[0001] This invention relates generally to a modular resistive grid system comprising modular resistive grid assemblies, such as resistive grid assemblies for resistive braking in machinery. More specifically, the invention relates to a modular resistive grid system configured to interchangeably accommodate modular resistive grid assemblies. The modular resistive grid assembly can be formed from multiple modular resistive grids and can have overlapping electrical properties, different dimensions, and different thermodynamic properties, such that, among other benefits, the interchangeable connection of the modular resistive grid assemblies to the modular resistive grid system can also achieve improved resistive braking capability in variable operating environments. Background Technology

[0002] Resistive grid systems are known for dynamic braking in machinery such as electric locomotives and diesel-electric locomotives, off-highway machinery, and other heavy equipment. Typically, a resistive grid system comprises multiple resistive elements to dissipate the electricity generated during machine braking as heat. Therefore, resistive grid systems can complement friction brakes and minimize wear on the machine's friction braking components. However, the heat dissipation capability of a resistive grid system can be diminished based on the system's component design, environmental conditions surrounding the machine, and the altitude at which the machine operates. Improved resistive grid system designs are needed to increase the lifespan of resistive braking systems and achieve maximum braking capacity under various operating conditions.

[0003] Furthermore, existing resistive grid systems operate in environments prone to extreme conditions such as severe weather, rain, and exposure to dust and debris. Consequently, humid conditions can lead to DC grounding failures and other shortages, thus reducing resistive braking capability. Moreover, current resistive grid systems fail to account for variations in machine operating conditions. For example, changes in altitude and corresponding air density can weaken the resistive braking capability of current systems because they cannot adapt to changes in the target operating location or environmental operating conditions. There is a need for modular resistive grid systems and components that can interchangeably have different thermodynamic properties and system dimensions while providing consistent resistive braking capability to adapt to their operating environments. Summary of the Invention

[0004] One embodiment relates to a modular resistor grid system. The modular resistor grid system includes a mounting base and a plurality of modular resistor grid assemblies configured to be interchangeably coupled to the mounting base. The plurality of modular resistor grid assemblies includes at least a first modular resistor grid assembly and a second modular resistor grid assembly. Each of the plurality of modular resistor grid assemblies has a housing and a plurality of resistor plates disposed within the housing. Each housing has an input terminal and an output terminal. Each corresponding plurality of resistor plates is connected between the input terminal and the output terminal of the corresponding housing. Each resistor plate has a thickness, and each plurality of resistor plates provides a target resistance for the corresponding modular resistor grid assembly between the input terminal and the output terminal. Furthermore, each modular resistor grid assembly has the same target resistance. Additionally, the first modular resistor grid assembly has a first number of resistor plates with a first thickness, and the second modular resistor grid assembly has a second number of resistor plates with a second thickness. The first number of resistor plates is greater than the second number of resistor plates, and the first thickness is greater than the second thickness.

[0005] Another embodiment relates to a modular resistor grid system. The modular resistor grid system includes a mounting base, a fan, and a plurality of modular resistor grid assemblies configured to be interchangeably coupled to the mounting base and the fan. The plurality of modular resistor grid assemblies includes at least a first modular resistor grid assembly and a second modular resistor grid assembly. Each of the plurality of modular resistor grid assemblies has a housing, an input terminal, an output terminal, and a plurality of resistor arrays. The input terminal and the output terminal are coupled to the housing. The plurality of resistor arrays are disposed within the housing and connect the input terminal to the output terminal. Each of the resistor arrays includes a plurality of resistor plates, wherein the resistor plates have a thickness. Each of the plurality of resistor plates provides a target resistance for a corresponding modular resistor grid assembly between the input terminal and the output terminal, and each modular resistor grid assembly has the same target resistance. Furthermore, the housing of the first modular resistor grid assembly extends a first length in an axial direction, and the housing of the second modular resistor grid assembly extends a second length in the axial direction, the second length being less than the first length. The first modular resistor grid assembly includes a first number of resistor plates, each resistor plate having a first thickness, and the second modular resistor grid assembly includes a second number of resistor plates, each resistor plate having a second thickness. Additionally, the first number of resistor plates is greater than the second number of resistor plates, and the first thickness is greater than the second thickness.

[0006] Another embodiment relates to a method of manufacturing a modular resistor grid assembly. The method includes: providing a plurality of first resistor plates having a first thickness; connecting a first number of the first resistor plates to input terminals and output terminals of a first housing to form a first modular resistor grid; and connecting two or more of the first modular resistor grids together to form a first modular resistor grid assembly. Furthermore, the first modular resistor grid assembly has a first target resistance and a first axial length. The method further includes: providing a plurality of second resistor plates having a second thickness; connecting a second number of the second resistor plates to input terminals and output terminals of a second housing to form a second modular resistor grid; and connecting two or more of the second modular resistor grids together to form a second modular resistor grid assembly. Similarly, the second modular resistor grid assembly has a second target resistance and a second axial length. Additionally, the first target resistance is equal to the second target resistance, the first thickness is greater than the second thickness, the first number of first resistor plates is greater than the second number of second resistor plates, and the first axial length is greater than the second axial length.

[0007] This invention is merely illustrative and is not intended to be limiting in any way. Other aspects, inventive features, and advantages of the apparatus or process described herein will become apparent from the detailed description set forth herein in conjunction with the accompanying drawings, in which the same reference numerals refer to the same elements. Attached Figure Description

[0008] Figure 1 A side view of a machine according to an aspect of the invention is shown;

[0009] Figure 2 Examples are shown for use Figure 1 A schematic diagram of the electric drive unit of the machine;

[0010] Figure 3 A perspective view illustrating one configuration of a modular resistive grid system and its components is shown.

[0011] Figure 4 Examples Figure 3 An exploded view of an exemplary configuration of a modular resistive grid system;

[0012] Figure 5 A perspective view of an example modular resistor grid assembly among the various modular resistor grid assemblies disclosed herein is shown;

[0013] Figure 6 Examples Figure 5 A perspective view of the modular resistor grid of the modular resistor grid assembly;

[0014] Figure 7 A perspective view of a resistive element is shown;

[0015] Figure 8 A side view of a modular resistor grid system, which is interchangeably connected to a first modular resistor grid assembly according to aspects of the invention, is shown.

[0016] Figure 9 Examples Figure 8 A perspective view of the first modular resistor grid of the first modular resistor grid assembly;

[0017] Figure 10 Examples Figure 9 An exploded view of the first modular resistive grid;

[0018] Figure 11 A side view of a modular resistor grid system, which can be interchangeably coupled to a second modular resistor grid assembly according to aspects of the present invention, is shown.

[0019] Figure 12 Examples Figure 11 A perspective view of the second modular resistor grid of the second modular resistor grid assembly;

[0020] Figure 13 A flowchart illustrating a method for manufacturing the modular resistive grid assembly described herein is provided. Detailed Implementation

[0021] Before turning to the accompanying drawings, which illustrate certain exemplary embodiments in detail, it should be understood that the invention is not limited to the details or methods set forth in the specification or illustrated in the drawings. It should also be understood that the terminology used herein is for descriptive purposes only and should not be considered limiting.

[0022] According to an exemplary embodiment, a modular resistor grid system includes a mounting base, a fan, and a plurality of modular resistor grid assemblies configured to be interchangeably coupled to the mounting base and the fan. The plurality of modular resistor grid assemblies includes at least a first modular resistor grid assembly and a second modular resistor grid assembly. Each of the plurality of modular resistor grid assemblies has a housing, input terminals, output terminals, and a plurality of resistor rows and / or resistor plates disposed within the housing and connecting the input terminals to the output terminals. The resistor rows may include resistive elements, and the resistor plates may be components of resistive elements, which include a first insulator and a second insulator. While each of the plurality of modular resistor grid assemblies is configured to be interchangeably coupled to the mounting base and the fan (e.g., interchangeably coupled for compatibility with a resistor braking system including the mounting base and the fan), the respective modular resistor grid assemblies may differ in certain physical, electrical, and thermodynamic properties to suit the specific operating environment of the machine.

[0023] For example, and as discussed herein, the first modular resistor grid assembly and the second modular resistor grid assembly may differ in the following aspects: (i) the number of resistor plates disposed within the housing; (ii) the thickness of these resistor plates disposed within the housing; and (iii) the axial length of the housing. Furthermore, the first modular resistor grid assembly and the second modular resistor grid assembly may differ in the following aspects: (iv) the respective watt density of these modular resistor grid assemblies; (v) the number of modular resistor grids joined together to form the respective modular resistor grid assembly; and (vi) the number of resistor rows disposed within the respective modular resistor grid assembly. Moreover, the first modular resistor grid assembly and the second modular resistor grid assembly may be similar and share at least: (i) the same target resistance between the input terminal and the output terminal; (ii) the same radial height (e.g., the dimensions of the inner radius and / or the outer radius of the housing); and (iii) the form and structure of the insulator within each respective housing. Advantageously, the interchangeability of these modular resistor grid assemblies, along with their similarity in form and structure, allows for the use of common insulator tools, common resistor element tools, common cooling fan (e.g., blower) assemblies, and common mounting features (e.g., frames, fan mounts, etc.) on a batch of machines. The common tooling and overlapping structural components reduce the costs associated with the manufacture, assembly, and installation of this modular resistor grid system.

[0024] Additionally, the variability and interchangeability of the modular resistive grid components within this modular resistive grid system advantageously support the interchangeability of specific modular resistive grid components within the system to adapt to changes in the machine's operating environment. For example, air density is lower at higher altitudes than at lower altitudes. Therefore, a machine operating fans to cool the modular resistive grid components will provide equal cooling air volumetric flow rates at both altitudes; however, due to the difference in air density, the air mass flow rate through the modular resistive grid components at higher altitudes can be substantially less than that through the modular resistive grid components at lower altitudes. Thus, a machine at a higher altitude will benefit from modular resistive grid components comprising power dissipation with lower watt density and a larger axial length (e.g., surface area for thermal convection). Similarly, the same machine at a lower altitude will benefit from power dissipation with higher watt density and a smaller axial length (e.g., surface area for thermal convection) to achieve the same resistive braking capability while reducing machine weight and footprint. The devices, systems, and methods disclosed herein enable the interchangeable adaptation of regenerative braking components to optimize the physical, electrical, and thermodynamic properties of a machine's regenerative braking system based on such variations in the machine's operating environment. In short, machines can, for example, benefit from modular regenerative braking systems with compatible / interchangeable components that can be interchangeably connected to optimize regenerative braking capability and performance in a variety of operating environments without requiring a large-scale replacement of all parts of the regenerative braking system.

[0025] Exemplary electric drive machine

[0026] Figure 1 The diagram schematically illustrates a machine 100 in which the disclosed embodiments may be implemented. Machine 100 can be generally described as any machine having an electric drive unit that can be connected to one or more drive wheels. Machine 100 may include vehicles such as diesel-powered locomotives, underground trams, off-highway trucks, or vehicles used for mining, construction, quarrying, and other applications. However, it will be apparent that any other vehicle having an electric drive or fully electric arrangement may be included in machine 100.

[0027] For the purposes of this invention, in Figure 1In this embodiment, machine 100 is exemplified as an off-highway truck. Machine 100 may include a chassis 102 to support various components of machine 100. Machine 100 may include a dump truck body 104 supported on chassis 102. Chassis 102 may also support a cab 106, which is defined as an enclosed space. An operator, located in cab 106, can control various functions of machine 100 by issuing various operator commands using control devices such as joysticks, levers, or touch-screen user interfaces.

[0028] The machine 100 may also include a set of drive wheels 108 for propulsion. In an embodiment, a set of idler wheels 110 may also be provided to steer the machine 100 in different directions. Furthermore, the machine 100 may include an articulated chassis for steering. The set of drive wheels 108 and the set of idler wheels 110 may together serve as grounding engagement members of the machine 100. Figure 1 As illustrated, machine 100 also includes a modular resistive grid system 111, which is positioned next to the cab 106 in machine 100. However, it will be apparent that the modular resistive grid system 111 can be positioned anywhere based on the design and available space in machine 100.

[0029] The machine 100 of the present invention may be an electric motor having an electric drive unit 112. The electric drive unit 112 can provide electricity to drive various components in the machine 100. In embodiments, the electricity may be generated on the vehicle by a generator, alternator, or other power generation device, which may be driven by an engine or any other power source. Alternatively, the electricity may not be generated on the vehicle, but may be supplied externally via an overhead conductor through a pantograph receiver, battery, series of capacitors, etc., to drive the machine 100.

[0030] In the illustrated embodiment, the electric drive unit 112 includes a power source 114, which may be an engine, such as an internal combustion engine, like a diesel engine, gasoline engine, natural gas engine, etc. The power source 114 can provide output torque at an output shaft 116 in the machine 100. The output shaft 116 can be connected to a generator 118, which may be a multiphase alternating current (AC) synchronous alternating current generator. During operation, the output shaft 116 rotates the rotor of the generator 118 to generate electricity, such as alternating current (AC) power. This generated electricity can be used to operate multiple drive motors 120, which are directly coupled or connected via intermediate components to the set of drive wheels 108. For the purposes of this invention, the drive motors 120 may be variable speed, reversible AC motors.

[0031] Exemplary electric drive devices and dynamic braking systems

[0032] Figure 2A schematic diagram of the electric drive device 112 is shown. The electric drive device 112 of the present invention can be a direct series drive device. Figure 2 An exemplary arrangement of various components of the electric drive unit 112 in machine 100 is illustrated. In this schematic diagram, the direction of electrical flow in the system is indicated by arrows. Solid arrows indicate the flow of electricity when machine 100 is being propelled. Conversely, in... Figure 2 In the diagram, the flow of electricity in the machine 100 during braking mode is represented by dashed arrows. Dotted arrows indicate the control circuit connections between the various components of the electric drive unit 112.

[0033] Those skilled in the art will understand that generator 118 can generate electricity in the form of alternating current (AC). This electricity can be supplied to rectifier 122 and converted to direct current (DC). The rectified DC power can then be converted back to AC power by inverter circuit 124. Inverter circuit 124 can selectively adjust the frequency and / or pulse width of its output, allowing drive motor 120 connected to the output of inverter circuit 124 to operate at variable speeds. In embodiments, multiple inverter circuits 124 can be configured to connect to drive motor 120 in machine 100.

[0034] Figure 2 A dynamic braking system 200 for machine 100 is also illustrated. The dynamic braking system 200 can be connected to the drive motor 120 of machine 100. Specifically, the dynamic braking system 200 can be operably configured to be connected to the inverter circuit 124 in machine 100. The dynamic braking system 200 can be configured to delay the propulsion of machine 100 during braking mode according to operator commands in machine 100.

[0035] According to the present invention, the dynamic braking system 200 may include a control unit 202, which may be a combination of, but is not limited to, instruction sets, random access memory (RAM), read-only memory (ROM), flash memory, data structures, etc. The control unit 202 may be configured to receive operator commands from the machine 100. Furthermore, the control unit 202 may determine whether to place the machine 100 into braking mode based at least in part on the operator commands. To initiate braking of the machine 100, the control unit 202 may generate a braking signal (illustrated by dotted lines) for the inverter circuit 124.

[0036] The braking signal can be received by the inverter circuit 124 in machine 100. This braking signal can carry a command to reverse the torque polarity of the drive motor 120. This causes the drive motor 120 to act as a generator, thereby using mechanical power in the form of rotational energy from the set of drive wheels 108 to generate electricity. This electricity can be supplied back to the electric drive unit 112 in machine 100.

[0037] The dynamic braking system 200 can also be configured to provide regenerative braking in the machine 100. For this purpose, the dynamic braking system 200 may include an energy storage unit 204. The energy storage unit 204 may include a battery, multiple capacitors, etc., which are configured to be connected to a drive motor 120 in the electric drive unit 112. As during braking mode, the drive motor 120 can generate electricity, which the energy storage unit 204 can store for later use by the machine 100.

[0038] This invention is applicable to many machines, such as large off-highway trucks, like dump trucks, which are commonly used in mines, construction sites, and quarries. Machine 100 can have a high payload capacity and travel speeds of several miles per hour when fully loaded. Machine 100 may also need to operate in a variety of environments, at various altitudes, and successfully traverse steep slopes in dry or wet conditions.

[0039] Typically, friction brakes are used to stop or slow down such machines, connecting the set of drive wheels and the set of idler wheels. These friction brakes are effective, but can wear out with prolonged use. To overcome this problem, the dynamic braking system 200 of the machine 100 of the present invention can operate in combination with or without these friction brakes. The dynamic braking system 200 can supplement the friction brakes in the machine 100, thereby helping to reduce wear on such brakes.

[0040] The dynamic braking system 200 can activate according to operator commands, placing the machine 100 into braking mode. Specifically, the operator commands can be received by the control unit 202 in the dynamic braking system 200. The control unit 202 generates a braking signal, which is at least partially determined by the operator command. This determination or calculation can be based on various operating parameters of the machine 100, such as current speed, current payload, acceleration, desired speed, etc.

[0041] Subsequently, the inverter circuit 124 in the electric drive unit 112 of machine 100 can receive a braking signal. In braking mode, the electric drive unit 112 can reverse the torque polarity of the drive motor 120, thereby causing the drive motor 120 to act as a generator. In this mode, the drive motor 120 can use the power of the set of drive wheels 108, thereby ultimately releasing the mechanical energy of the set of drive wheels 108 and slowing down machine 100. In addition, the drive motor 120 can generate electricity in the electric drive unit 112 by consuming the mechanical power of the set of drive wheels 108.

[0042] The generated electricity can be supplied to the dynamic braking system 200 in the electric drive unit 112. The generated electricity (which can be in AC form) can be supplied via an inverter 124 that converts AC power to DC power. In an embodiment where the machine 100 has regenerative braking, a portion of the generated electricity can be supplied to the modular resistive grid system 111 for dissipation as heat, while the remainder can be supplied to the energy storage unit 204 for later use by the machine 100.

[0043] Exemplary components and configurations of a modular resistive grid system

[0044] The dynamic braking system 200 may include the modular resistive grid system 111 disclosed herein. The modular resistive grid system 111 may dissipate some or all of the generated electricity as heat. Figure 3 A perspective view illustrating an exemplary configuration of a modular resistive grid system 111 according to aspects of the present invention is shown. Figure 4 Examples Figure 3 An exploded view of an exemplary configuration of the modular resistive grid system 111.

[0045] refer to Figure 3 and Figure 4The modular resistor grid system 111 includes a mounting base 302, a fan 310, and modular resistor grid assemblies 400 among a plurality of modular resistor grid assemblies 400. The mounting base 302 may be permanently or removably coupled to the machine 100. The mounting base 302 provides a support structure to which other components of the modular resistor grid system 111 may be secured, connected, and / or coupled to the dynamic braking system 200 of the machine 100. The mounting base 302 may include a frame 304 and one or more supports 306. The frame 304 may include rigid support members (such as rods, rails, columns, tracks, or other suitable elements) to secure components of the modular resistor grid system 111 to the machine 100. The frame 304 may have a first end 330 and a second end 331 defining an installation length ML therebetween. The installation length ML may be sufficiently sized to allow resistor grid assemblies with different axial lengths to be interchangeably connected to the mounting base 302. In this manner, mounting base 302 allows the operator to remove components of the modular resistor grid system 111 and, depending on the operating environment, replace these components with those occupying less or more space. Bracket 306 can be selectively movable, allowing one or more brackets 306 to be fastened to a first position along the frame 304, loosened to slide along the length of the frame 304 to a second position, and then tightened to secure the bracket 306 in the second position. In this way, bracket 306 can accommodate and connect to modular resistor grid assemblies 400 with different axial lengths L or dimensions. Bracket 306 may also include mounting features 308 configured to align or abut against components of the modular resistor grid system 111, such that these components can be fastened together by bolts, welds, or other suitable fasteners. For example, in Figure 3 and Figure 4 In this system, movable brackets 306 are coupled to mounting features 308, the shapes of which match the cylindrical profile of the exemplary modular resistor grid system 111. Multiple modular resistor grid assemblies 400 with different axial lengths L can be interchangeably coupled to the mounting base 302 by moving the brackets 306 and the mounting features 308, and by sliding and securing the movable brackets 306 along the frame 304 as needed. Additionally, the movable brackets 306 can allow the fan 310 to be coupled at one or more locations along the mounting length ML.

[0046] The modular resistive grid system 111 also includes a fan 310. The fan 310 is configured, for example, during the resistive braking mode of the machine 100, to blow cooling air through the modular resistive grid assembly 400 to dissipate heat. In some embodiments, the fan 310 may include a blower, a pressurized air source, a coolant delivery source, etc. The fan 310 may include a blade assembly 312 configured to direct air toward or through the modular resistive grid assembly 400 as the blade assembly 312 rotates. A power source 314 (e.g., a motor, battery, etc.) can power the fan 310, and a hub assembly 316 can direct air toward the modular resistive grid assembly 400 and / or enclose and protect components of the fan 310.

[0047] The modular resistive grid system 111 includes a modular resistive grid assembly 400. The modular resistive grid assembly 400 facilitates resistive braking by receiving power from the machine 100 and dissipating that power as heat. In some embodiments, the modular resistive grid assembly 400 may be formed as a single unit, or it may be formed from a single modular resistive grid 402. In other embodiments, the modular resistive grid assembly 400 may be formed by joining two or more modular resistive grids 402 together (see, for example, discussed below). Figure 5 and Figure 6 The modular resistor grid assembly 400 includes a housing 404 that provides support for the various components of the modular resistor grid system 111. Figures 3 to 5 In the illustrated example, the housing 404 is cylindrical, having an inner wall 406 and an outer wall 408. The housing 404 can be of any shape and can be divided into one or more modular sections. For example, the housing 404 of a modular resistor grid assembly 400 can be formed by joining two or more modular resistor grids 402 together, each modular resistor grid having a housing 404 that encloses one or more resistor elements 410. The modular resistor grid 402 can be cylindrical, semi-cylindrical, quadrant-shaped, wedge-shaped, triangular, or other suitable shapes. The number of sub-sections of the housing 404 and the number of individual modular resistor grids 402 that can be joined together to form the modular resistor grid assembly 400 can vary depending on the space constraints of the machine 100 and the electrical and thermodynamic properties required in a specific operating environment (e.g., lower watt density for higher altitudes, smaller axial length for lower altitudes, etc.).

[0048] For example, Figure 5 and Figure 6An embodiment of a modular resistor grid assembly 400 is illustrated, which is divided into four quadrant-shaped modular resistor grids 402, which are assembled together in machine 100. Modular resistor grid assemblies 400 and 402 include at least one resistive element 410 disposed between the inner wall 406 and outer wall 408 of housing 404. Modular resistor grid assemblies 400 and / or modular resistor grids 402 may include two or more resistive elements 410 (e.g., multiple resistive elements 410) tightly packaged in a stacked configuration with an end-to-end orientation. The two or more resistive elements 410 form a conductive path between input terminals 419 and output terminals 420 of the modular resistor grid assembly 400. The resistive elements 410 may be uniformly arranged in housing 404 to maintain air space between them. This uniform spacing provides cooling airflow between the resistive elements 410 in the modular resistor grid system 111. In addition, one or more cooling air vents may be provided in the housing 404 for circulating cooling air in the modular resistive grid system 111.

[0049] Figure 7 An exemplary resistive element 410 is illustrated. The resistive element 410 includes a first insulator 412, a second insulator 414, and one or more resistive plates 416 mounted to the first insulator 412 and the second insulator 414. In the illustrated example, a resistive plate 416 is mounted between and extends between the first insulator 412 and the second insulator 414. The first insulator 412 and the second insulator 414 may be secured to the inner wall 406 and outer wall 408 of the housing 404 of the modular resistive grid assembly 400 and / or the modular resistive grid 402, respectively. One or more resistive plates 416 may be accommodated in slots, containers, ridges, or other mounting features (e.g., holes 418) formed in the first insulator 412 and the second insulator 414. In this manner, the resistive plates 416 may be connected at or near the holes 418 to form a continuous conductive path for the resistive plates 416, which are configured to dissipate electrical energy as heat during resistive braking mode. Furthermore, one or more resistive elements 410 may be arranged in one or more rows, substantially parallel to each other, in a close face-to-face relationship, thereby forming an axial airflow path therebetween. For example, multiple resistive plates 416 of the multiple resistive elements 410 may be connected in series within each modular resistive grid 402 and / or each modular resistive grid assembly 400 to provide a continuous current path between the input terminals 419 and the output terminals 420 of the modular resistive grid 402 and / or the modular resistive grid assembly 400 (see [link to documentation]). Figure 5 and Figure 6For this purpose, conductive members can be provided in the housing 404 to electrically connect two or more resistor plates 416 in the modular resistor grid system 111. The conductive member can be a conductive wire, a weld, etc. For example, in some embodiments, the conductive member includes a weld between adjacent portions of adjacent resistor plates 416. Additionally, conductive connectors can also be provided between the resistor element 410 and the input terminal 419, between the resistor element 410 and the output terminal 420, and / or between the ends of two rows of resistor elements 410 to electrically connect multiple resistor plates 416 within the housing 404. These conductive connectors can include conductive (e.g., metal) plates, switches, wires, terminals, busbars, or other suitable electrical connectors. The resistor elements 410 can be connected in such a way that the modular resistor grid system 111 can have two current circuits (i.e., a contactor power circuit and a chopper power circuit).

[0050] As illustrated, the first insulator 412 and the second insulator 414 can be in the form of a block made of an insulating material, such as a silicon-bonded laminated mica, ceramic, glass-reinforced material, etc. However, other suitable materials with insulating properties can be used to form the first insulator 412 and the second insulator 414. Similarly, the first insulator 412 and the second insulator 414 can be formed in various shapes, such as blocky, blocky separated by wing-shaped or horn-shaped connectors, arc-shaped, circular, triangular, hexagonal, etc. Preferably, the shape and profile of the first insulator 412 and the second insulator 414 are configured to allow air to flow freely relative to the housing 404 in the axial direction and across a large exposed surface area of ​​the resistive element 410 when assembled within the housing 404. Additionally, the first insulator 412 and the second insulator 414 can be shaped to achieve predetermined electrical properties (e.g., creepage distance, clearance, etc.) between the conductors of the modular resistive grid assembly 400. The first insulator 412 can be secured to the outer wall 408 of the housing 404 by some fastening member (such as nuts and bolts, screws, etc.). The second insulator 414 can be secured to the inner wall 406 of the housing 404 in a similar manner. The first insulator 412 and the second insulator 414 may each include one or more mounting features (e.g., holes 418) formed in the first insulator and the second insulator and configured to receive one or more resistance plates 416. Furthermore, the holes 418 may not extend completely through the first insulator 412 or the second insulator 414 and may be configured to receive the tip portion 424 of the resistance plate 416 and mount the resistance plate 416 between the first insulator 412 and the second insulator 414.

[0051] The resistor plate 416 may be formed of a resistive material, such as stainless steel, carbon, nickel-chromium alloy, tungsten, ceramic, polymer material, graphite, semiconductor, metal oxide, photovoltaic cell, resistive ink, or any other resistive material. The resistor plate may take various shapes and be contoured to increase the surface area exposed to air flowing through the housing 404 for heat convection. For example, the resistor plate 416 may be a continuous strip of a resistive material, such as stainless steel. The resistor plate 416 may include a body portion 421 extending along the longitudinal direction XX' of the resistor plate 416. In embodiments, the resistor plate 416 may also include a series of folded portions 422 disposed on opposite longitudinal sides of the body portion 421 of the resistor plate 416. In an exemplary configuration, the resistor plate 416 may extend along the longitudinal direction XX' for a length LR of approximately 150 mm to approximately 200 mm. In a particular example, the resistive element 410 may have a length LR of approximately 175 mm. The resistor plate 416 may have a tip portion 424 disposed at an end 426 of the body portion 421. Alternatively, the resistor plate 416 may include two or more pointed portions 424 disposed away from the two ends 426. The pointed portions 424 may include curved profiles configured to abut adjacent pointed portions 424 of the resistor plate 416 for fastening together via welds, clamps, ties, pins, caps, etc. The pointed portions 424 of the resistor plate 416 may be adapted to be received in holes 418 in the first insulator 412 and the second insulator 414. The holes 418 may provide some clearance for movement of the pointed portions 424 therein. This allows the resistor plate 416 to move in the longitudinal direction XX' within the resistive element 410 during thermal expansion and contraction.

[0052] The resistor plate 416 may also include a thickness T, such as Figure 7As shown. The thickness T can be determined based on the thickness of the sheet material (e.g., stainless steel) forming the resistor plate 416. The resistor plate 416 can be formed by stamping, forming, laser cutting, waterjet cutting, etc. Various dies, molds, etc., can be used to form resistor plates 416 having substantially similar or identical lengths LR, profiles, and geometries, but differing in thickness T. For example, a resistor element 410 may have a length LR, a resistor plate 416 with adjacent folded portions 422, and a tip portion 424. Another resistor element 410 may have the same length LR, may also have folded portions 422 and tip portions 424, but may have a different thickness T than the first insulator (e.g., if the second resistor element 410 is formed from a thicker sheet). It should be understood that, given that two resistor elements have similar or identical lengths, geometries, and profiles, but different thicknesses, a resistor element with a larger thickness will generally have a smaller resistance between its tip portions than a resistor element with a smaller thickness. In other words, the resistive element 410 and / or the resistive plate 416 can be approximated as a wire, where the resistance of the wire is calculated as R = ρ (L / A).

[0053] During the resistor braking mode, the generated power can enter the modular resistor grid system 111 via input terminal 419. This generated power can flow through the resistance plate 416 in the resistive element 410 of the modular resistor grid system 111 to dissipate as heat. Specifically, heat is generated by the body portion 421 of the resistance plate 416. This generated heat can be dissipated to the first insulator 412 and the second insulator 414, raising the temperature of the first insulator 412 and the second insulator 414 in the resistive element 410. According to industry standards, the normal continuous operating temperature of the first insulator 412 and the second insulator 414 can be in the range of 300 degrees Celsius to 400 degrees Celsius. In short time intervals, the temperature of the first insulator 412 and the second insulator 414 may reach higher values ​​due to surges, but if the temperature rises to above the critical temperature or the maximum operating temperature over a long period, the lifespan of the first insulator 412 and the second insulator 414 may be significantly shortened.

[0054] Exemplary modular resistor grid systems and modular resistor grid assemblies

[0055] Turn Figure 8 The side view illustrates the modular resistive grid system 111. Figure 8The modular resistor grid system 111 includes a mounting base 302 and a first modular resistor grid assembly 802, shown as being coupled to the mounting base 302 and its components (e.g., a frame 304, one or more movable supports 306, and mounting features 308). The first modular resistor grid assembly 802 may consist of one or more first modular resistor grids 902 (such as...). Figure 9 The first modular resistor grid 902 shown is formed. As discussed above, the first modular resistor grid assembly 802 can be of various shapes and sizes (e.g., cylindrical, semi-cylindrical, quadrant-shaped, wedge-shaped, triangular, or other suitable shapes). Figure 8 and Figure 9 In the example shown, the first modular resistor grid assembly 802 is formed by connecting four quadrant-shaped first modular resistor grids 902 together to form a cylindrical first modular resistor grid assembly 802, which can be removably connected to the modular resistor grid system 111.

[0056] The first modular resistor grid assembly 802 includes a first housing 804. The first housing 804 provides a protective enclosure within which components (e.g., resistor elements 410) can be safely housed, partially protecting these components from debris, dust, moisture, etc. The first housing 804 can be coupled to a fan 310 and / or mounting features 308. In this way, the first housing 804 allows the first modular resistor grid assembly 802 to be positioned such that cooling air from the fan flows axially between the inlet 806 and outlet 808 of the first modular resistor grid assembly 802 and across the surface area of ​​a plurality of resistor elements 410 within the first housing 804. The first housing 804 may also define one or more vents or flow paths to further facilitate convective cooling of the resistor elements 410 disposed within the first housing. Figure 4 and Figure 5 The cases shown are similar; the first housing 804 includes a first input terminal and a first output terminal (in... Figure 8 It is positioned on the opposite side of the first housing 804, and corresponds to Figure 4 The first input terminal 419 and the first output terminal 420 shown are configured to electrically connect the modular resistive grid system 111 to the machine 100 (e.g., to the dynamic braking system 200 or the resistive braking system of the machine 100). Figure 8 and Figure 9The terminal 817 shown can be configured to electrically connect a plurality of first modular resistor grids 902 in the first modular resistor grid assembly 802, such that one (in a series configuration) or more (in a parallel configuration) conductive paths extend between the first input terminal and the first output terminal. In other words, terminal 817 electrically connects the first modular resistor grids 902 in the first modular resistor grid assembly 802 together. In some embodiments, terminal 817 can be connected via a jumper cable, busbar, or other suitable conductive connector.

[0057] The first housing 804 of the first modular resistor grid assembly 802 may also have a first axial length L1 and a first height H1. The first axial length L1 and the first height H1 define the dimensions of the first housing 804 and determine the amount of space within the first housing, thus determining the final number of resistor elements 410 that can be disposed within the first housing 804. In some embodiments, the first axial length L1 may be 600 mm, 700 mm, 900 mm, 1100 mm, 1250 mm, 1300 mm, 1500 mm, or another suitable size. The first height H1 may fall within a similar dimensional range. Therefore, in some embodiments, the modular resistor grid system 111 may occupy a space volume of approximately 1300 mm × 1300 mm × 1250 mm. Figure 9 As shown, when the first modular resistor grid assembly 802 is a cylindrical assembly formed by two or more first modular resistor grids 902, the first height H1 can be composed of a first inner radius R1i and a first outer radius R1o, which are defined by the inner wall 406 and the outer wall 408 of the first housing 804, respectively. In an additional embodiment, the first height H1 can be twice the length of the first outer radius R1o.

[0058] The first modular resistor grid assembly 802 also includes a first plurality of resistor elements 810 and / or a first plurality of resistor plates 816 connected between the first input terminal and the first output terminal. The first plurality of resistor plates 816 may be components of the first plurality of resistor elements 810, which may be assembled / configured as a first number of resistor rows 812 within the first housing 804 of the first modular resistor grid assembly 802, such as... Figure 10 As shown in the image.

[0059] For example, Figure 10 Examples Figure 9An exploded view of the first modular resistor grid 902. The first housing 804 is disassembled to show a first number of resistor rows 812 disposed within the first housing 804. Here, a first axial length L1 allows a total of six first resistor rows 812 to be fitted within the first housing 804. Specifically, in some embodiments, the first axial length L1 may be approximately 1100 mm to 1110 mm to allow six first resistor rows 812 to be mounted in the first housing 804. Furthermore, in this embodiment, each of the first plurality of resistor plates 816 is connected in series between the first input terminal and the first output terminal. As shown, in some embodiments, each of the first plurality of resistor elements 810 and / or resistor plates 816 extends between the inner wall 406 and the outer wall 408 of the first housing 804. Additionally, each of the first resistor plates 816 has a first thickness T1, which may be the same for each of the first resistor plates 816 disposed within the first housing 804.

[0060] Turn Figure 11 The side view illustrates another configuration of the modular resistive grid system 111. Figure 11 The modular resistor grid system 111 includes a mounting base 302 and a second modular resistor grid assembly 1102, shown as interchangeably connectable to the mounting base 302 and its components (e.g., frame 304, one or more movable supports 306, and mounting features 308). Similar to the first modular resistor grid assembly 802, the second modular resistor grid assembly 1102 may consist of one or more second modular resistor grids (such as...) in the second modular resistor grid 1202. Figure 12 The second modular resistor grid 1202 shown is formed. The second modular resistor grid assembly 1102 may present a shape and form similar to those discussed above with respect to the first modular resistor grid assembly 802. Figure 11 and Figure 12 As shown, the second modular resistor grid assembly 1102 can be formed by connecting four quadrant-shaped second modular resistor grids 1202 together to form a cylindrical second modular resistor grid assembly 1102, which can be removably connected to the modular resistor grid system 111.

[0061] The second modular resistor grid assembly 1102 includes a second housing 1104, which may differ in size from the first housing 804 (e.g., in axial length, volume, or surface area). In other aspects, the dimensions of the second housing 1104 may be the same as or similar to those of the first housing 804. For example, the second housing 1104 may be based on a consistent, generic, predefined, or otherwise shared height or axial profile, and may be interchangeably coupled to the fan 310 and / or mounting feature 308. The first housing 804 may be removed first from the fan 310 and mounting feature 308. A movable bracket 306 may be adjusted to accommodate a second axial length L2 of the second modular resistor grid assembly 1102. The second modular resistor grid assembly 1102 may then be coupled to the modular resistor grid system 111. Therefore, the second modular resistor grid assembly 1102 may have a second height H2 and an axial profile (e.g., a second outer radius R2o, a second inner radius R2i, etc.) that are identical to the first height H1 and the first axial profile (e.g., a first outer radius R1o, a first inner radius R1i) of the first modular resistor grid assembly 802. In this way, both the first modular resistor grid assembly 802 and the second modular resistor grid assembly 1102 can be interchangeably coupled to the same fan 310, configured to receive cooling air from the same fan, and mounted to the same frame 304.

[0062] Furthermore, similar to the first modular resistor grid assembly 802, cooling air can flow axially from the fan 310 between the inlet 1106 and outlet 1108 of the second modular resistor grid assembly 1102 and across the surface area of ​​a plurality of resistor elements 410 within the second housing 1104. The second housing 1104 may also define one or more vents or flow paths to further facilitate convective cooling of the resistor elements 410 disposed within the second housing. Figure 4 and Figure 5 The cases shown are similar; the second housing 1104 includes a second input terminal and a second output terminal (in... Figure 11 The second input terminal and the second output terminal are configured to electrically connect the modular resistive grid system 111 to the machine 100 (e.g., to the dynamic braking system 200 or the resistive braking system of the machine 100). Figure 11 and Figure 12The terminal 1117 shown can be configured to electrically connect a plurality of second modular resistor grids 1202 in the second modular resistor grid assembly 1102, such that one (in a series configuration) or a plurality (in a parallel configuration) conductive path extends between the second input terminal and the second output terminal.

[0063] The second housing 1104 of the second modular resistor grid assembly 1102 may have a second axial length L2. It is worth noting that, as... Figure 11 As shown, the second axial length L2 may be shorter than the first axial length L1. In other embodiments, the second axial length L2 may be greater than the first axial length L2. The second axial length L2 and the second height H2 define the dimensions of the second housing 1104 and determine the amount of space, thus determining the final number of resistive elements 410 that can be disposed within the second housing 1104. In some embodiments, the second axial length L2 may be 350 mm, 450 mm, 550 mm, 625 mm, 650 mm, 750 mm, 850 mm, 900 mm, or another suitable size. The second height H2 may be 700 mm, 900 mm, 1100 mm, 1250 mm, 1300 mm, 1500 mm, or another suitable size (e.g., the same or similar to the first height H1). Figure 12 As shown, when the second modular resistor grid assembly 1102 is a cylindrical assembly formed by two or more second modular resistor grids 1202, the second height H2 can be composed of a second inner radius R2i and a second outer radius R2o, which are defined by the inner wall 406 and the outer wall 408 of the second housing 1104, respectively.

[0064] The second modular resistor grid assembly 1102 also includes a second plurality of resistor elements 1110 and / or a second plurality of resistor plates 1116, which are connected between the second input terminal and the second output terminal. The second plurality of resistor plates 1116 may be components of the second plurality of resistor elements 1110, which are formed as a second number of resistor arrays 1112 within the second housing 1104 of the second modular resistor grid assembly 1102. Figure 12(Best visible in the middle). For example, in an embodiment where the second axial length L2 is less than the first axial length L1, an exploded view of the second modular resistor grid 1202 can show a number of second resistor rows 1112 with two resistor rows (e.g., 1 row, 3 rows, 4 rows, fewer than the number of first resistor rows). Specifically, in one embodiment, the second axial length L2 can be about 760 mm to 770 mm to allow three second resistor rows 1112 to be installed within the second housing 1104. In other embodiments where the second axial length L2 is greater than the first axial length L1, the second number of resistor rows 1112 can be more than the first number of resistor rows 812 (e.g., 7 rows, 8 rows, etc.).

[0065] Furthermore, each of the second plurality of resistor arrays 1112 disposed within the second housing 1104 may be formed by a second plurality of resistor plates 1116 connected in series between the second input terminal and the second output terminal. As shown, in some embodiments, each of the second plurality of resistive elements 1110 and / or resistor plates 1116 extends between the inner wall 406 and the outer wall 408 of the second housing 1104. Additionally, each of the second resistor plates 1116 has a second thickness T2, which may be the same for each of the second resistor plates 1116 disposed within the second housing 1104.

[0066] The modular resistor grid system 111 may have a target resistance defined between the input terminal and the output terminal. In this way, when the modular resistor grid system 111 is coupled to the machine 100, current can flow from the input terminal to the output terminal, and the modular resistor grid system 111 can dissipate power as heat. It is worth noting that the plurality of modular resistor grid assemblies 400 (e.g., the first modular resistor grid assembly 802, the second modular resistor grid assembly 1102, and other modular resistor grid assemblies with different shapes / sizes and configured to be interchangeably coupled to the modular resistor grid system 111) may all have the same target resistance between their respective input terminals and output terminals.

[0067] In some embodiments, the thickness of the corresponding resistive element 410 within each modular resistive grid assembly 400 may differ to achieve a consistent target resistance for each of the plurality of modular resistive grid assemblies 400. For example, a first modular resistive grid assembly 802 having an axial length L1 has a first number of resistive plates 416 connected in series between the first input terminal and the first output terminal. A second modular resistive grid assembly having a shorter axial length L2 has a second number of resistive plates 416 connected in series between the second input terminal and the second output terminal. Because the first axial length L1 is greater than the second axial length L2, the first modular resistive grid assembly 802 has more space / volume than the second modular resistive grid assembly 1102. Therefore, the first number of resistive plates 816 in the first plurality of resistive plates can be more than the second number of resistive plates 1116 in the second plurality of resistive plates. Similarly, the first number of resistor arrays 812 can be more than the second number of resistor arrays 1112. In other words, the total length of the conductive path between the first input terminal and the first output terminal can be greater than the total length of the conductive path between the second input terminal and the second output terminal.

[0068] To maintain the same target resistance between the input and output terminals of each modular resistor grid assembly 400, 802, 1102, the thickness of the resistive element can be varied. Specifically, the first thickness T1 of the first plurality of resistor plates 816 can be greater than the second thickness T2 of the second plurality of resistor plates 1116. In this way, the target resistance between each input and output terminal of the corresponding modular resistor grid assembly 400 can be 3.0 ohms. In other embodiments, the target resistance can be 1.0 ohms, 2.0 ohms, between 3.5 ohms and 3.8 ohms, 4.0 ohms, or other suitable resistance values.

[0069] By varying the dimensions of each modular resistor grid assembly 400 and the thickness of the resistor plate 416 within each respective modular resistor grid assembly 400, the power dissipation associated with the modular resistor grid system can be kept consistent, while the watt density of the modular resistor grid system 111 can be altered as one modular resistor grid assembly (e.g., the first modular resistor grid assembly 802) is removed and replaced by another modular resistor grid assembly (e.g., the second modular resistor grid assembly 1102). In some embodiments, the watt density of the modular resistor grid system 111 can vary between 10 watts per square inch and 60 watts per square inch.

[0070] More specifically, and as an example, Figure 8The first modular resistive grid assembly 802 can be configured to dissipate 1 MW of power and has a watt density of 21 watts per square inch. Similarly, Figure 11 The second modular resistive grid assembly 1102 can be configured to dissipate 1 MW of power and has a watt density of 42 watts per square inch. Because the first modular resistive grid assembly 802 and the second modular resistive grid assembly 1102 can be interchangeably coupled to the modular resistive grid system 111, the operator can selectively install or interchange the active modular resistive grid assemblies depending on the operating environment of the machine 100. This interchangeability advantageously supports the selection of optimized thermodynamic, electrical, and spatial properties tailored to current operating conditions. For example, the first modular resistive grid assembly 802, with its relatively low watt density and relatively large surface area for thermal convection, can be referred to as a “high-altitude” assembly. At high altitudes, where air density is lower and the mass flow rate of cooling air for the fan assemblies is reduced compared to low-altitude conditions, installing the first modular resistive grid assembly 802 increases the likelihood that the modular resistive grid system 111 can receive cooling air on sufficient surface area to operate at maximum resistive braking capacity. Conversely, the second modular resistive grid assembly, with its relatively high watt density and small surface area for thermal convection, can be referred to as a “low-altitude” assembly. At low altitudes, where air density is higher and the mass flow rate of cooling air for fan assemblies is greater compared to high altitude conditions, a smaller cooling surface area may be required to operate at maximum resistance braking capacity, and mass / space can be saved by installing modular resistance grid assemblies with smaller dimensions (e.g., smaller axial length).

[0071] Although the modular resistor grid assemblies 400, 802, and 1102 can be interchangeably connected to the modular resistor grid system 111, regardless of which modular resistor grid assembly 400, 802, or 1102 is installed, the modular resistor grid system 111 can be configured to dissipate a predetermined amount of power as heat during resistor braking mode. For example, the modular resistor grid system 111 can be configured to have a continuous power capacity of approximately 100 kW, 250 kW, 500 kW, 750 kW, 1 MW, 2 MW, 5 MW, 6 MW, 7 MW, 8 MW, 9 MW, 9.5 MW, or 10 MW. In other embodiments, the modular resistor grid system 111 has a continuous capacity of approximately 10 MW or greater. In some embodiments, the modular resistor grid system 111 has a continuous power capacity of approximately 500 kW to approximately 2 MW.

[0072] Exemplary method for manufacturing modular resistor grid assemblies

[0073] Figure 13Exemplary steps for manufacturing the modular resistive grid system 111 described above are illustrated. These steps can be combined with... Figure 13 The exemplary order shown is executed in a different sequence. Additionally, steps may be repeated, separated by optional or intermediate steps, or extended to include additional actions. All such iterations of manufacturing processes that are obvious to those skilled in the art are contemplated within this invention.

[0074] At step 1302, the method includes providing a plurality of first resistance plates having a first thickness. At this step, a plurality of resistance plates (e.g., a plurality of first resistance plates 816) are formed and provided for assembly into a modular resistance grid 402 and / or a modular resistance grid assembly 400. These resistance plates may be formed by stamping, laser cutting, waterjet cutting, forming, or other suitable methods. These resistance plates may also be formed from stainless steel, iron, metal coils, metal alloys, or other suitable conductive materials. Additionally, at this step, the number of first resistance plates 816 among the plurality of first resistance plates 816 can be determined. This number can be used to calculate the total length of the conductive path of the modular resistance grid assembly 400. By utilizing this total length, the density of the resistance plate 816 material, and the cross-sectional area of ​​each plate, a first thickness can be determined to achieve a target resistance between the input and output terminals of the modular resistance grid assembly 400 formed from the plurality of first resistance plates 816. For example, in a specific embodiment, a plurality of first resistance plates 816 may be provided to fill six rows in a first housing 804. In order to achieve a target resistance of approximately between 3.1 ohms and 3.8 ohms, the first thickness of each of the first resistor plates in the first resistor plate 816 can be approximately 1.12 mm.

[0075] At step 1304, the method includes connecting a first number of first resistance plates to the input and output terminals of a first housing to form a first resistance grid. At this step, the first resistance plates 816 are mounted / secured within the first housing 804 to establish a conductive path between the first input terminal and the first output terminal. This step may include connecting a plurality of first resistance plates 816 together to form one or more first resistance arrays 812 of the first resistance plates 816. For example, a first plurality of resistance plates 816 (as in...) Figure 9 and Figure 10(Best shown in the diagram) The first resistor plate 816 can be stitched together at its tip to form a continuous conductive path. The first resistor plate 816 can then be disposed within a first plurality of insulating blocks (e.g., between a first insulator 412 and a second insulator 414) to form a row of first resistive elements 810. The first resistive elements 810 can then be placed beside the first housing, where the insulating blocks are connected to one or more walls of the first housing 804. Therefore, when a plurality of first resistive elements 810 are fixed within the first housing 804, a [structure / structure] can be formed. Figure 9 The first modular resistor grid 902 is shown in the diagram. (As shown...) Figure 9 and Figure 10 As shown, a plurality of first resistive elements 810 may be assembled in a first housing 804 having a first outer radius R1o, a first inner radius R1i and / or a first diameter (e.g., H1).

[0076] At step 1306, the method includes connecting two or more first resistor grids 902 together to form a first modular resistor grid assembly 802. For example, as shown in the figure... Figure 9 The four first modular resistor grids in the first modular resistor grid 902 shown are connected together to produce Figure 8 The first modular resistor grid assembly 802 shown is included. The first modular resistor grid assembly 802 includes a first target resistor (e.g., about 3.0 ohms to 4.0 ohms) and a first axial length L1 (e.g., about 600 mm, 700 mm, 900 mm, 1100 mm, 1250 mm, 1300 mm, 1500 mm, etc.).

[0077] At step 1308, the method includes providing a plurality of second resistance plates having a second thickness. At this step, the plurality of second resistance plates (e.g., resistance plate 1116) may have a second thickness that is less than or greater than the first thickness. For example, providing a smaller number of resistance plates with a larger thickness compared to the first plurality of resistance plates 416 can produce a “low-altitude” modular resistance grid assembly 400 during assembly.

[0078] At step 1310, the method includes connecting a second number of second resistor plates to the input and output terminals of the second housing to form a second resistor grid. Similar to step 1304 above, the second resistor plates 1116 are mounted / secured within the second housing 1104 to establish a conductive path between the second input terminal and the second output terminal. This step may also include connecting a plurality of second resistor plates 1116 together to form one or more second resistor arrays 1112. Additionally, in some embodiments, the first number of first resistor plates 816 is greater than the second number of second resistor plates 1116. In other embodiments, this may be reversed. In some embodiments, the first number of first resistor arrays 812 is greater than the second number of second resistor arrays 1112 (e.g., as described above). Figure 9 and Figure 12 (Compared to). Furthermore, similar to step 1304, this step may include disposing a second plurality of second resistor plates 1116 between the insulating blocks and securing a second plurality of resistor elements 1110 to one or more walls of the second housing 1104 to form a second modular resistor grid 1202. (As...) Figure 11 and Figure 12 As shown, a plurality of second resistor elements 1110 can be assembled in a second housing 1104 having a second outer radius R2o, a second inner radius R2i, and / or a second diameter (e.g., H2). In some embodiments, the inner radius, outer radius, diameter, and / or height of the first housing and the second housing are the same, such that the first modular resistor grid assembly and the second modular resistor grid assembly can be interchangeably coaxially connected to the fan 310.

[0079] At step 1312, the method includes connecting two or more second resistor grids 1202 together to form a second modular resistor grid assembly 1102 (e.g., connecting two or more second resistor grids 1202 together to form a second modular resistor grid assembly 1102). Figure 12 The four second modular resistor grids 1202 shown are connected together to form Figure 11The second modular resistor grid assembly 1102 shown in the diagram may have a second target resistance and a second axial length L2. In some embodiments, the first target resistance is equal to the second target resistance. Additionally, in some embodiments, the first axial length L1 is greater than the second axial length L2. Based on (i) the first axial length L1 is greater than the second axial length L2, (ii) a first number of first resistor rows 812 is greater than a second number of second resistor rows 1112, and (iii) the first thickness is greater than the second thickness, the second modular resistor grid assembly 1102 may have a greater watt density than the first modular resistor grid assembly 802. In other embodiments, each of the plurality of modular resistor grid assemblies 400 may have a watt density between 10 watts / square inch and 60 watts / square inch.

[0080] Unless otherwise specified, as used herein with respect to numerical ranges, the terms “approximately,” “about,” “substantially,” and similar terms generally mean + / - 10% of the disclosed value. As used herein with respect to structural features (e.g., to describe shape, size, orientation, direction, relative position, etc.), the terms “approximately,” “about,” “substantially,” and similar terms are intended to cover, for example, minor structural variations that may occur during manufacturing or assembly, and are intended to have a broad meaning consistent with common and accepted usage by one of ordinary skill in the art to which the subject matter of this invention pertains. Therefore, these terms should be interpreted as indicating that non-substantial or insignificant modifications or alterations to the described and claimed subject matter are considered to fall within the scope of the invention as set forth in the appended claims.

[0081] It should be noted that the term “exemplary” and its variations, as used herein to describe various embodiments, are intended to indicate possible examples, representations or illustrations of possible embodiments (and such terms are not intended to imply that such embodiments are necessarily special or best examples).

[0082] As used herein, the term “connection” and its variations mean that two components are directly or indirectly linked to each other. Such a connection can be static (e.g., permanent or fixed) or movable (e.g., removable or releaseable). This connection can be achieved by: two components being directly connected to each other; two components being connected to each other using a separate intermediate component and any additional intermediate components connected to each other; or two components being connected to each other using an intermediate component that is integral with one of the two components, forming a single whole. If “connection” or its variations are modified by an additional term (e.g., direct connection), the general definition of “connection” provided above is modified by the common linguistic meaning of the additional term (e.g., “direct connection” means connecting two components without any separate intermediate component), resulting in a narrower definition than the general definition of “connection” provided above. Such connections can be mechanical, electrical, or fluid.

[0083] The references to element positions (e.g., "top," "bottom," "above," "below") are merely for describing the orientation of the various elements in the accompanying drawings. It should be noted that the orientations of the various elements may differ according to other exemplary embodiments, and such variations are intended to be covered by this invention.

[0084] Hardware and data processing components for implementing the various processes, operations, exemplary logic, logic blocks, modules, and circuits described in conjunction with the embodiments disclosed herein may be implemented or executed using general-purpose single-chip or multi-chip processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or any combination thereof, which are intended to perform the functions described herein. A general-purpose processor may be a microprocessor, or any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, a combination of one or more microprocessors with a DSP core, or any other such configuration. In some embodiments, specific processes and methods may be executed by circuitry dedicated to a given function. Memory (e.g., memory, memory cell, storage device) may include one or more means (e.g., RAM, ROM, flash memory, hard disk storage devices) for storing data and / or computer code to perform or facilitate the various processes, layers, and modules described herein. The memory may be or include volatile or non-volatile memory, and may include database components, object code components, script components, or any other type of information structure for supporting the various activities and information structures described herein. According to an exemplary embodiment, the memory is communicatively connected to a processor via processing circuitry and includes computer code for performing (e.g., via processing circuitry or the processor) one or more processes described herein.

[0085] This invention contemplates methods, systems, and program products for implementing various operations on any machine-readable medium. Embodiments of the invention can be implemented using existing computer processors; or by a dedicated computer processor for a suitable system, incorporated for this or another purpose; or by a hardwired system. Embodiments within the scope of the invention include program products comprising a machine-readable medium for carrying or having machine-executable instructions or data structures stored thereon. Such a machine-readable medium can be any available medium that can be accessed by a general-purpose or special-purpose computer or other machine with a processor. As an example, such a machine-readable medium may include RAM, ROM, EPROM, EEPROM, or other optical disk storage devices, magnetic disk storage devices, or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of machine-executable instructions or data structures and that can be accessed by a general-purpose or special-purpose computer or other machine with a processor. Combinations of the foregoing are also included within the scope of machine-readable media. Machine-executable instructions include, for example, instructions and data that cause a general-purpose computer, a special-purpose computer, or a special-purpose processing machine to perform a particular function or a set of functions.

[0086] Although the accompanying drawings and description may illustrate a particular order of method steps, the order of such steps may differ from the order depicted and described unless otherwise specified above. Furthermore, unless otherwise specified above, two or more steps may be performed simultaneously or partially simultaneously. This variation may depend, for example, on the chosen software and hardware system and the designer's choices. All such variations are within the scope of this invention. Similarly, the software implementation of the described method can be accomplished using standard programming techniques, utilizing rule-based logic and other logic, to perform various connection steps, processing steps, comparison steps, and decision steps.

[0087] It is worth noting that the construction and arrangement of the various exemplary embodiments are merely illustrative. Additionally, any element disclosed in one embodiment may be incorporated into or used in any other embodiment disclosed herein.

Claims

1. A modular resistor grid (402) system (111), the modular resistor grid system comprising: Mounting bracket (302); A plurality of modular resistor grid (402) assemblies (400) are configured to be interchangeably connected to the mounting base (302). Each modular resistor grid (402) assembly (400) includes a first modular resistor grid (402) assembly (802) and a second modular resistor grid (1202) assembly (1102). Each of the plurality of modular resistor grid (402) assemblies (400) includes: Housing (404) having an input terminal (419) and an output terminal (420); Multiple resistor plates (416) are connected between the input terminal (419) and the output terminal (420), each resistor plate (416) having a thickness, the multiple resistor plates (416) providing a target resistance for a corresponding modular resistor grid (402) assembly (400) between the input terminal (419) and the output terminal (420); Each modular resistor grid (402) assembly (400) has the same target resistance, wherein the first modular resistor grid (402) assembly (802) includes a first number of resistor plates (416) having a first thickness, and the second modular resistor grid (1202) assembly (1102) includes a second number of resistor plates (416) having a second thickness, wherein the first number is greater than the second number, and the first thickness is greater than the second thickness.

2. The modular resistor grid (402) system (111) according to claim 1, wherein the mounting base (302) further includes a movable bracket (306) configured to be interchangeably coupled to one or more of the fan (310) or a corresponding modular resistor grid (402) assembly (400) among the plurality of modular resistor grid (402) assemblies (400).

3. The modular resistor grid (402) system (111) according to claim 1, wherein the fan (310) is configured to be interchangeably coaxially coupled to each of the plurality of modular resistor grid (402) assemblies (400).

4. The modular resistive grid (402) system (111) according to any one of claims 1 to 3, wherein: The first modular resistor grid (402) assembly (802) includes a first number of resistor rows (812); The second modular resistor grid (1202) assembly (1102) includes a second number of resistor rows (1112); and The first number of resistor arrays (812) is greater than the second number of resistor arrays (1112).

5. The modular resistor grid (402) system (111) according to any one of claims 1 to 4, wherein each of the plurality of modular resistor grid (402) assemblies (400) further comprises a plurality of modular resistor grids (402) connected together.

6. The modular resistive grid (402) system (111) according to any one of claims 1 to 5, wherein: Each of the plurality of modular resistive grids (402) is a quadrant having an inner radius and an outer radius; and Each of the resistor plates (416) extends between the inner radius and the outer radius.

7. The modular resistive grid (402) system (111) according to any one of claims 1 to 6, wherein the plurality of resistive plates (416) are connected in series between the input terminal (419) and the output terminal (420).

8. The modular resistive grid (402) system (111) according to any one of claims 1 to 7, wherein each of the plurality of modular resistive grid (402) assemblies (400) has a watt density between 10 watts per square inch and 60 watts per square inch.

9. The modular resistive grid (402) system (111) according to any one of claims 1 to 8, wherein: The first modular resistive grid (402) assembly (802) includes a plurality of first resistive grid quadrants, each first resistive grid quadrant having an inner radius and an outer radius; and The second modular resistor grid (1202) assembly (1102) includes a plurality of second resistor grid quadrants, each second resistor grid quadrant having the inner radius and the outer radius.

10. A method of manufacturing a modular resistive grid (402) assembly (400), the method comprising: Provide multiple first resistance plates (416) having a first thickness; A first number of first resistor plates (416) are connected to the input terminal (419) and output terminal (420) of the first housing (804) to form a first modular resistor grid (902). Two or more first modular resistor grids (902) are joined together to form a first modular resistor grid (902) assembly (802), the first modular resistor grid (902) assembly (802) having a first target resistance and a first axial length; Multiple second resistance plates (1116) with a second thickness are provided; A second number of second resistor plates (1116) are connected to the input terminal (419) and output terminal (420) of the second housing (1104) to form a second modular resistor grid (1202). Two or more second modular resistor grids (1202) are joined together to form a second modular resistor grid (1202) assembly (1102), the second modular resistor grid (1202) assembly (1102) having a second target resistance and a second axial length; in: The first target resistance is equal to the second target resistance. The first thickness is greater than the second thickness. The first number of first resistor plates (416) is greater than the second number of second resistor plates (1116), and The first axial length is greater than the second axial length.

11. The method according to claim 10, further comprising: Two or more of the first resistor plates (416) are connected together to form a row of first resistor plates (416); and Two or more second resistor plates (1116) are connected together to form a row of second resistor plates (1116).

12. The method according to any one of claims 10 to 11, further comprising: The first plurality of insulating blocks are disposed between the first number of first resistor plates (416) and the wall of the first housing (804); and A second plurality of insulating blocks are disposed between the second number of second resistor plates (1116) and the wall of the second housing (1104).

13. The method according to any one of claims 10 to 12, wherein: Each of the first modular resistor grid (902) assembly (802) and the second modular resistor grid (1202) assembly (1102) has a watt density between 10 watts per square inch and 60 watts per square inch; and The second modular resistor grid (1202) assembly (1102) has a greater watt density than the first modular resistor grid (902) assembly (802).

14. The method according to any one of claims 10 to 13, wherein: The first modular resistive grid (902) assembly (802) has an inner diameter and an outer diameter; and The second modular resistive grid (1202) assembly (1102) has the inner diameter and the outer diameter.

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