Cutting process development method, electronic device, and computer-readable storage medium
By simulating the diamond wire cutting process to obtain wear data and adjusting process parameters, the problem of relying on experience in cutting process development was solved, achieving higher reliability and accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 高测(盐城)技术有限公司
- Filing Date
- 2024-12-06
- Publication Date
- 2026-06-09
AI Technical Summary
In existing technologies, the development of cutting processes relies on the experience of developers, resulting in low reliability and accuracy of new cutting processes, and making it impossible to intuitively judge the rationality of the process design.
By simulating the multi-cutting process of the target coiled diamond wire, wear data of the diamond wire segment in each cycle of each cut is obtained. Combined with the take-up and untake-up parameters and the preset process parameters of the cutting machine, the cutting process parameters are adjusted to keep the wear data within the set threshold. A graphical display is used to assist the development process.
The reliability and accuracy of the new cutting process have been improved, the reliance on the experience of developers has been reduced, wear data has been kept within the set threshold, and the reliability of the cutting process has been enhanced.
Smart Images
Figure CN122165545A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of multi-wire cutting, and more specifically, to a cutting process development method, electronic equipment, and computer-readable storage medium. Background Technology
[0002] A wire saw, also known as a wire cutter, is a device that cuts a workpiece by rubbing it against a cutting wire such as a diamond wire. Different cutting wires, different materials to be cut, and different user cutting needs require developers to design different cutting devices and different cutting processes.
[0003] Currently, the development process for different cutting processes mainly involves simulating the entire cutting process using cutting process compilation software. Developers need to rely on their own experience to judge the wear of the cutting lines during the simulation in order to design and adjust the cutting process. This requires a high level of skill from the developers and makes it impossible to intuitively judge whether the cutting process design is reasonable. There is a significant risk to the yield rate when developing new cutting processes. Summary of the Invention
[0004] The purpose of this application is to provide a cutting process development method, electronic device, and storage medium that can improve the reliability of the newly developed cutting process.
[0005] In a first aspect, embodiments of this application provide a cutting process development method, comprising: during a simulated multi-cutting process of a target coiled diamond wire, for each cutting process, obtaining wear data of each diamond wire segment in that cutting process based on the take-up and untake-up parameters of the target coiled diamond wire in each cycle of that cutting process and the preset cutting process parameters of the cutting machine; obtaining the actual overall wear data of the target coiled diamond wire based on the wear data of each diamond wire segment in all cutting processes; and adjusting the preset cutting process parameters to the target cutting process parameters based on the actual overall wear data, wherein the target overall wear data corresponding to the target cutting process parameters is within a set threshold.
[0006] Compared with related technologies, the cutting process development method provided in this application can divide the cutting process of multiple materials into multiple cuts based on the quantity of materials to be cut. Each cut corresponds to cutting one material. In each cut, based on the working principle of the diamond wire reciprocating during the cutting process, the simulated cutting process can be divided into multiple cyclic cutting cycles. Each cycle includes a wire feeding stage and a wire return stage. The wire feeding stage drives the diamond wire to move in the set cutting direction, and the wire return stage drives the diamond wire to move in the opposite direction of the set cutting direction. In this application, the entire roll of target diamond wire participating in the cutting is divided into multiple diamond wire segments. In each cycle, the wear degree between different diamond wire segments in the entire roll of target diamond wire may differ. Based on the wire feeding and take-up parameters of the target roll diamond wire in each cycle and the preset cutting process parameters of the cutting machine, the wear data of each diamond wire segment in each cycle can be determined. Then, the wear data of all diamond wire segments in all cuts and all cycles are integrated together to obtain the actual overall wear data of the target roll diamond wire. Finally, it can be determined which wear data in the actual overall wear data of the target roll of diamond wire exceeds the set threshold, and the preset cutting process parameters are adjusted according to the wear data exceeding the set threshold. Then, the cutting process is simulated again according to the adjusted cutting process parameters, and it is determined again whether the actual overall wear data of the target roll of diamond wire is within the set threshold. This process of adjusting the preset cutting process parameters is repeated until all the actual overall wear data of the target roll of diamond wire is within the set threshold, thus obtaining the target cutting process parameters with the target overall wear data within the set threshold, completing the development of the cutting process. Since the wear data of each diamond wire segment in each cut and each cycle is calculated and determined independently in this application, the cutting process parameters can be adjusted based on the wear data of each diamond wire segment. Compared with the related technology, which develops the cutting process based on the wear situation estimated by the developer's experience, the cutting process development based on the wear data of each diamond wire segment in this application is less affected by the unstable factors of the developer, thereby improving the reliability of the developed new cutting process.
[0007] In some embodiments of this application, obtaining the wear data of each diamond wire segment in the cutting pass includes: for each diamond wire segment, obtaining the number of cuts the diamond wire segment participates in in the cutting pass according to the take-up and release parameters and the preset cutting process parameters; and determining the wear data of the diamond wire segment according to the number of cuts.
[0008] In some embodiments of this application, the step of obtaining the number of cuts in which the diamond wire segment participates in the cutting in the cut based on the take-up and release parameters and the preset cutting process parameters further includes: determining the number of cycles in the cut based on the take-up and release parameters and the preset cutting process parameters; and determining the number of cuts based on the number of cycles.
[0009] In some embodiments of this application, determining the wear data of the diamond wire segment based on the number of cuts includes: determining the wear degree data of the diamond wire segment in each cut based on the functional relationship between the number of cuts and the wear coefficient; and determining the wear data based on the wear degree data. For a diamond wire segment, due to the influence of factors such as frictional heat generation during the cutting process, diamond wire structure, material material, and cutting process parameters, the wear coefficient of each cut will change accordingly with the number of cuts. There is a corresponding functional relationship between the two. Under the influence of other factors such as diamond wire structure, material material, and cutting process parameters, this functional relationship between the number of cuts and the wear coefficient may be linear or non-linear. Based on this functional relationship, combined with the number of cuts for each diamond wire segment, the wear degree data of the diamond wire segment in each cut is determined. Then, based on this wear degree data, the wear data of each diamond wire segment in that cut can be determined, which can improve the accuracy of the obtained wear data of each diamond wire segment in that cut. Higher accuracy wear data can make the target cutting process parameters more reliable.
[0010] In some embodiments of this application, each cycle includes a wire feeding stage and a wire return stage, the wire take-up and unwinding parameters include the wire feeding amount in the wire feeding stage and the wire return amount in the wire return stage, and obtaining the number of cuts in which the diamond wire segment participates in cutting in that cut includes: for each cycle, determining whether the diamond wire segment participates in cutting in the wire feeding stage and the wire return stage respectively; and accumulating the number of cuts in which the diamond wire segment participates in cutting in all cycles of that cut.
[0011] In some embodiments of this application, determining whether the diamond wire segment participates in cutting during the wire feeding stage and the wire return stage includes: for each cycle, determining whether the diamond wire segment participates in cutting during the wire feeding stage based on the initial wire feeding position and the wire feeding amount, and determining whether the diamond wire segment participates in cutting during the wire return stage based on the initial wire return position and the wire return amount.
[0012] In some embodiments of this application, the cutting process development method further includes: for each cycle, determining the starting return position based on the starting feed position and the feed amount, and determining the starting feed position for the next cycle based on the starting return position and the return amount.
[0013] In some embodiments of this application, the cutting process development method further includes: graphically displaying the wear data of each diamond wire segment in each cycle; overlaying the display parameters of the graphical display for all cycles; and graphically displaying the actual overall wear data. During the cutting process development process, graphically displaying the actual overall wear data facilitates developers' real-time understanding of the cutting process development process.
[0014] Secondly, embodiments of this application provide an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the cutting process development method as described above.
[0015] Thirdly, embodiments of this application provide a computer-readable storage medium storing a computer program, which is executed by a processor to implement the cutting process development method as described above. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings.
[0017] Figure 1 This is a flowchart illustrating the cutting process development method provided in Embodiment 1 of this application;
[0018] Figure 2 This is a flowchart illustrating the process of determining wear data for each diamond wire segment in the cutting process development method provided in Embodiment 1 of this application.
[0019] Figure 3 This is a schematic diagram of the cutting area of the target coiled diamond wire in one cycle of the cutting process development method provided in Embodiment 1 of this application;
[0020] Figure 4 This is a schematic diagram of the structure of the cutting device simulated in the cutting process development method provided in Embodiment 1 of this application;
[0021] Figure 5 This is a schematic diagram of the cutting area of the target coiled diamond wire in multiple cycles of the cutting process development method provided in Embodiment 1 of this application;
[0022] Figure 6A heat map of single-cycle wear data of the target coiled diamond wire in one cycle of the cutting process development method provided in Embodiment 1 of this application;
[0023] Figure 7 A heat map showing the overall wear data of the target coiled diamond wire in multiple cycles of the cutting process development method provided in Embodiment 1 of this application;
[0024] Figure 8 This is a schematic diagram of the structure of the electronic device provided in Embodiment 2 of this application. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0026] Therefore, the following detailed description of embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the present application.
[0027] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0028] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0029] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.
[0030] Embodiment 1 of this application provides a method for developing a cutting process, such as... Figure 1 As shown, it includes the following steps:
[0031] Step S101: During the simulated multi-cutting process of the target coil diamond wire, for each cutting process, the wear data of each diamond wire segment in that cutting process is obtained based on the take-up and untake-up parameters of the target coil diamond wire in each cycle and the preset cutting process parameters of the cutting machine.
[0032] Specifically, when developing new cutting processes, technicians can use compilation software to simulate the entire cutting process of the cutting device. The entire cutting process simulated by the compilation software includes multiple cuts, each cut includes multiple cutting cycles, and multiple cutting cycles are executed cyclically to form a cutting cut. Multiple cuts are executed cyclically to form the entire cutting process.
[0033] Specifically, in some embodiments of this application, multiple cycles can be as follows: The workpiece stage starts controlling the material to be cut, such as a silicon rod, to press down onto the wire mesh. Simultaneously, the target coil diamond wire accelerates to a preset cutting rate and then rotates at a constant speed, moving in the initial direction (left to right or right to left, depending on process requirements) to reach the feed length. Before reaching the feed length, it begins to decelerate. When the feed length is reached, the linear velocity of the target coil diamond wire drops to 0, completing the feed stage. After a pause (the pause time is set by the machine and can be adjusted according to process and equipment requirements), the return stage begins. The target coil diamond wire accelerates to a preset cutting rate and moves in the opposite direction to the return length. Before reaching the return length, it begins to decelerate. When the return length is reached, the linear velocity drops to 0, completing the return stage. One feed stage and one return stage together constitute one cycle. After one cycle is completed, the next cycle is executed, and the feed and return stages are repeated until one cut is completed. Accordingly, multiple cut cycles can be executed to form the entire cutting process.
[0034] Based on the aforementioned cutting process, the take-up and untake-up parameters of the target coil diamond wire in each cycle can specifically include data such as the starting position of the target coil diamond wire infeed, the amount of wire fed, the wire feeding speed, the ending position of the wire fed, the starting position of the return, the amount of wire returned, the return speed, and the ending position of the return. The preset cutting process parameters of the cutting machine can specifically include the number of rollers in the cutting device, the roller size, the left-side tension (the force on the left side to keep the target coil diamond wire taut), the right-side tension (the force on the right side to keep the target coil diamond wire taut), the flow rate (the size of the circulating water flow used to cool the heat generated during the cutting process), and the temperature (the temperature of the circulating water used to cool the heat generated during the cutting process).
[0035] Please refer to Figure 2 In some embodiments of this application, obtaining the wear data of each diamond wire segment in the cutting process may specifically include the following steps:
[0036] Step S201: For each diamond wire segment, obtain the number of cuts the diamond wire segment participates in in this cut based on the wire take-up and take-down parameters and the preset cutting process parameters.
[0037] In this step, each cutting pass includes multiple cycles, and each cycle includes a wire infeed stage and a wire return stage. Specifically, it can be determined whether the diamond wire segment participates in cutting during the wire infeed stage and the wire return stage; the number of cuttings in which the diamond wire segment participates in cutting in all cycles of this cutting pass is accumulated.
[0038] Please refer to the details. Figure 3 For each cycle, the starting wire entry position and the amount of wire entered determine whether each diamond wire segment participates in cutting during the wire entry stage, and the starting wire return position and the amount of wire returned determine whether each diamond wire segment participates in cutting during the wire return stage.
[0039] For example, in the feed phase of a cycle, Q1 is the initial position of the workpiece to be cut relative to the target coil of diamond wire, Q1' is the position of the workpiece to be cut after moving a certain amount of feed relative to the target coil of diamond wire, W is the target coil of diamond wire, and E1 is the diamond wire that has been cut on the workpiece during the feed phase. The area of the target coil of diamond wire excluding arrow E1 is the diamond wire that has not been cut on the workpiece during the feed phase. E1 can include multiple diamond wire segments, and after this feed phase, the number of cuts for the diamond wire segments included in E1 can be incremented by 1.
[0040] For the return phase, please continue to refer to... Figure 3 Q2' represents the starting position of the workpiece to be cut relative to the target coiled diamond wire during the return stroke stage. Q2 represents the position of the workpiece to be cut relative to the target coiled diamond wire after the return stroke stage. W represents the target coiled diamond wire. E2 represents the diamond wire that has been cut in the workpiece during the return stroke stage. The area of the target coiled diamond wire excluding E2 represents the diamond wire that has not been cut in the workpiece during the return stroke stage. E2 can also include multiple diamond wire segments. After this return stroke stage, the cutting count of the diamond wire segments included in E2 can be incremented by 1.
[0041] By repeating the cutting process in the order of wire infeed, wire return, wire infeed, and so on in each cut, the number of cuts each diamond wire segment participates in during that cut can be obtained.
[0042] It is understood that, in this embodiment, as Figure 3 As shown, for each cycle, the end position of the incoming line stage is the starting position of the next outgoing line stage, and the end position of the outgoing line stage is the starting position of the next incoming line stage. Specifically, the starting outgoing line position can be determined based on the starting incoming line position and the incoming line quantity, and the starting incoming line position of the next cycle can be determined based on the starting outgoing line position and the outgoing line quantity. This process is repeated until the entire cutting process is completed.
[0043] In this step, the specific areas of the diamond wire that have been cut, such as E1 and E2, can be determined based on the wire feeding and take-up parameters and the preset cutting process parameters.
[0044] Specifically, in the embodiments of this application, the preset cutting process parameters may include the length of a single coil of target diamond wire, the number of blades, etc., wherein the single coil cutting length can be calculated based on the number, size, and spacing of the cutting machine rollers, as shown in the example. Figure 4 Taking the cutting device shown as an example, which includes three rollers 100, 200, and 300 and a target coil of diamond wire 400, the number of rollers is 3, the horizontal axis spacing A is 360mm, the vertical axis spacing B is 235mm, and the roller diameter D is 160mm. Therefore, the calculated single-turn cutting length is 160*π + 360 + 2*√[235² + (360 / 2)²]) ≈ 1455mm = 1.455m. Similarly, the specific number of blades per blade can be calculated based on the length of the workpiece and the groove spacing. Again, using... Figure 2 Taking the cutting device with three rollers as an example, if the length L of the workpiece to be cut is 830mm and the groove distance is 0.178mm, then the number of blades per blade is calculated to be 830 / 0.178≈4662.
[0045] In this step, taking a wire feeding stage with a feed rate of 1050m as an example, the total length of the target coil diamond wire on the main roller is calculated to be 4662 * 1.455m ≈ 6783m based on the length of the single coil of target diamond wire and the number of blades. Further calculation yields the length of the target coil diamond wire participating in cutting during this feeding stage to be 1050 + 6783 = 7833m. That is, the target coil diamond wire participating in cutting during the feeding stage is a diamond wire region with a length of 7833m, starting from the beginning position of the feeding stage. Taking a 1m length unit as an example, the cutting count for the 7833 diamond wire segments within this 7833m length region is increased by 1.
[0046] Similarly, taking a return length of 950m corresponding to the entry stage as an example, the total length of the target roll diamond wire on the main roller is calculated to be 4662 * 1.455m ≈ 6783m based on the length of the target roll diamond wire per coil and the number of blades. Further calculation yields the length of the target roll diamond wire involved in cutting during the return stage as 950 + 6783 = 7733m. This means the target roll diamond wire involved in cutting during the return stage is a 7733m long diamond wire region starting from the beginning of the return stage. Taking a 1m length unit as an example, the number of cuts for the 7733 diamond wire segments within this 7733m long diamond wire region is increased by 1 again.
[0047] The above is an example illustrating the method for obtaining the number of cuts of each diamond wire segment in one cycle according to an embodiment of this application. In each cutting pass, the number of cuts of each diamond wire segment is also related to the number of cycles in the cutting pass. In this embodiment, the number of cycles in the cutting pass can be determined based on the take-up and untake-down parameters and preset cutting process parameters. Then, the total number of cuts in the entire cutting pass is determined based on the number of cycles and the aforementioned number of cuts of each diamond wire segment in one cycle. Specifically, for example, the number of cycles in one cutting pass can be determined based on the take-up and untake-down parameters and the target coil of diamond wire.
[0048] By performing calculations on each cut, the feed stage, and the return stage of each cycle, the number of cuts each diamond wire segment participates in during each cut can be obtained.
[0049] Step S202: Determine the wear data of the diamond wire segment based on the number of cuts.
[0050] In this embodiment, the number of cuts for each diamond wire segment can be directly used as wear data. That is, the wear process can be simplified to the fact that the wear degree of each diamond wire segment is the same in each cutting process, and the number of cuts can be directly used as the wear data of each diamond wire segment.
[0051] Alternatively, in some other embodiments of this application, the wear degree data of the diamond wire segment in each cut can be determined based on the functional relationship between the number of cuts and the wear coefficient; and the wear data can be determined based on the wear degree data. Specifically, for a diamond wire segment, due to the influence of factors such as frictional heat generation during the cutting process, diamond wire structure, material material, and cutting process parameters, its wear coefficient in each cut will change accordingly with the number of cuts. There is a corresponding functional relationship between the two. Under the influence of other factors such as diamond wire structure, material material, and cutting process parameters, this functional relationship between the number of cuts and the wear coefficient may be linear or non-linear. Based on this functional relationship, combined with the number of cuts for each diamond wire segment, the wear degree data of the diamond wire segment in each cut can be determined. Then, based on this wear degree data, the wear data of each diamond wire segment in that cut can be determined, which can improve the accuracy of the obtained wear data of each diamond wire segment in that cut. Higher accuracy wear data can make the target cutting process parameters more reliable.
[0052] It is understood that the aforementioned determination of the wear level data of the diamond wire segment in each cut based on the functional relationship between the number of cuts and the wear coefficient is only an example in some embodiments of this application. In some other embodiments of this application, the wear level data of the diamond wire segment in each cut can also be determined by other means. For example, based on the functional relationship between other cutting process parameters such as diamond wire speed and table speed (the speed at which the material descends towards the diamond wire) and the wear coefficient, the diamond wire speed and table speed of each diamond wire segment when participating in the cut can be substituted into the corresponding function to obtain the wear level data when participating in the cut, thereby determining the wear level data of each diamond wire segment in each cut.
[0053] Step S102: Based on the wear data of each diamond wire segment in all cuts, obtain the actual overall wear data of the target roll of diamond wire.
[0054] In this embodiment, the wear data of each diamond wire segment in each cut has been obtained in the aforementioned step S101. In this step, the wear data of each diamond wire segment in all cuts are accumulated to obtain the actual overall wear data of the target coil diamond wire during the entire multi-cut process.
[0055] Step S103: Based on the actual overall wear data, adjust the preset cutting process parameters to the target cutting process parameters, wherein the target overall wear data corresponding to the target cutting process parameters is within the set threshold.
[0056] Specifically, in this step, a threshold value can be pre-set for the overall wear data corresponding to the cutting process parameters based on the relevant safety and cost requirements of the cutting process. If the actual overall wear data corresponding to the cutting process parameters does not exceed the set threshold, the corresponding cutting process is considered qualified. Conversely, if the actual overall wear data corresponding to the preset cutting process parameters exceeds the set threshold, the corresponding cutting process parameters can be adjusted accordingly based on the portion exceeding the set threshold. Then, the overall wear data corresponding to the adjusted cutting process parameters is obtained again, and it is judged again whether the overall wear data corresponding to the adjusted cutting process parameters exceeds the set threshold. If it does, it is adjusted again until the overall wear data corresponding to a certain adjusted cutting process parameter does not exceed the set threshold. The cutting process parameter at this time is the target cutting process parameter. If the target overall wear data corresponding to the target cutting process parameter is within the set threshold, the cutting process corresponding to the target cutting process parameter is qualified, and the development of the cutting process is completed.
[0057] Compared with related technologies, the cutting process development method provided in Embodiment 1 of this application divides the cutting process of multiple materials into multiple cuts based on the quantity of materials to be cut. Each cut corresponds to cutting one material. In each cut, based on the working principle of the diamond wire reciprocating during the cutting process, the simulated cutting process can be divided into multiple cyclic cutting cycles. Each cycle includes a wire feeding stage and a wire return stage. The wire feeding stage drives the diamond wire to move in the set cutting direction, and the wire return stage drives the diamond wire to move in the opposite direction of the set cutting direction. In this application, the entire roll of target diamond wire participating in the cutting is divided into multiple diamond wire segments. In each cycle, the wear degree between different diamond wire segments in the entire roll of target diamond wire may differ. Based on the wire feeding and take-up parameters of the target roll diamond wire in each cycle and the preset cutting process parameters of the cutting machine, the wear data of each diamond wire segment in each cycle can be determined. Then, the wear data of all diamond wire segments in all cuts and all cycles are integrated together to obtain the actual overall wear data of the target roll diamond wire. Finally, it can be determined which wear data in the actual overall wear data of the target roll of diamond wire exceeds the set threshold, and the preset cutting process parameters are adjusted according to the wear data exceeding the set threshold. Then, the cutting process is simulated again according to the adjusted cutting process parameters, and it is determined again whether the actual overall wear data of the target roll of diamond wire is within the set threshold. This process of adjusting the preset cutting process parameters is repeated until all the actual overall wear data of the target roll of diamond wire is within the set threshold, thus obtaining the target cutting process parameters with the target overall wear data within the set threshold, completing the development of the cutting process. Since the wear data of each diamond wire segment in each cut and each cycle is calculated and determined independently in this application, the cutting process parameters can be adjusted based on the wear data of each diamond wire segment. Compared with the related technology, which develops the cutting process based on the wear situation estimated by the developer's experience, the cutting process development based on the wear data of each diamond wire segment in this application is less affected by the unstable factors of the developer, thereby improving the reliability of the developed new cutting process.
[0058] Furthermore, in some other embodiments of the present invention, after determining the actual overall wear data of the target coil diamond wire during the cutting process, the method may further include graphically displaying the overall wear data. Specifically, for example, the wear data of each diamond wire segment in each cycle may be graphically displayed; display parameters of the graphical display of all cycles may be superimposed to graphically display the actual overall wear data.
[0059] Below, we will illustrate the overall wear data graphically with an example. For instance... Figure 5As shown in the table below, taking a single cut consisting of 103 cycles as an example, each cycle includes an infeed stage and a return stage. Each row of cells represents one infeed stage or return stage within a cycle. The 103 cycles comprise 206 rows of cells, each representing a one-meter length of the target coiled diamond wire. In the infeed stage of the first cycle, the corresponding cutting area length is 7833m, which can be filled by selecting 7833 cells in row 206. In the return stage of the first cycle, the corresponding cutting area length is 7733m. You can select 7733 cells backward from cell 7833 in row 205 to fill. Because the first cycle generated a 100m cycle difference, the incoming phase of the second cycle needs to start from 101m. Therefore, select 7517 cells backward from cell 101 in row 204 and fill them with green. Then, select 7417 cells backward from cell 7617(7517+100) in row 203 and fill them with red, and so on. Repeat this process for the incoming phase cutting area length and the return phase cutting area length as shown in the table below. Figure 6 As shown, by summing up the number of cuts in each cell throughout the entire cut sequence and displaying the value of each cell by color level, the result can be obtained as shown below. Figure 6 As shown, this is a wear heat map of the overall wear data of the target roll diamond wire.
[0060]
[0061]
[0062] It is understandable that the above is merely an example illustrating the process of determining the wear data for a single cut during the entire cutting process. For each cut in the entire cutting process, the above process is repeated, and the overall wear data for each cut is superimposed to obtain the overall wear data of the target coil diamond wire during the entire cutting process. Graphical display of each cut separately yields the results shown below. Figure 7 The image shows a wear heat map of the overall wear data of the target coiled diamond wire.
[0063] Embodiment 2 of this application relates to an electronic device, such as... Figure 8 As shown, it includes: at least one processor 801; and a memory 802 communicatively connected to at least one processor 801; wherein the memory 802 stores instructions executable by at least one processor 801, the instructions being executed by at least one processor 801 to enable at least one processor 801 to perform the methods in the above embodiments.
[0064] The memory and processor are connected via a bus, which can include any number of interconnecting buses and bridges, connecting various circuits of one or more processors and memories. The bus can also connect various other circuits, such as peripheral devices, voltage regulators, and power management circuits, which are well known in the art and will not be described further herein. The bus interface provides an interface between the bus and the transceiver. The transceiver can be a single element or multiple elements, such as multiple receivers and transmitters, providing a unit for communicating with various other devices over a transmission medium. Data processed by the processor is transmitted over the wireless medium via an antenna, which further receives data and transmits it to the processor.
[0065] The processor manages the bus and general processing, and also provides various functions, including timing, peripheral interfaces, voltage regulation, power management, and other control functions. Memory is used to store data used by the processor during operation.
[0066] Embodiment 3 of this application relates to a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the method embodiments described above.
[0067] That is, those skilled in the art will understand that all or part of the steps in the methods of the above embodiments can be implemented by a program instructing related hardware. This program is stored in a storage medium and includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.
[0068] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A method for developing a cutting process, characterized in that, include: During the simulated multi-cutting process of the target coiled diamond wire, for each cutting process, the wear data of each diamond wire segment in that cutting process is obtained based on the take-up and untake-up parameters of the target coiled diamond wire in each cycle and the preset cutting process parameters of the cutting machine. Based on the wear data of each diamond wire segment in all cuts, obtain the actual overall wear data of the target coil diamond wire; Based on the actual overall wear data, the preset cutting process parameters are adjusted to the target cutting process parameters, wherein the target overall wear data corresponding to the target cutting process parameters is within a set threshold.
2. The cutting process development method according to claim 1, characterized in that, The acquisition of wear data for each diamond wire segment in this cutting pass includes: For each diamond wire segment, the number of cuts in that cut is obtained according to the wire take-up and take-out parameters and the preset cutting process parameters. The wear data of the diamond wire segment is determined based on the number of cuts.
3. The cutting process development method according to claim 2, characterized in that, The step of obtaining the number of cuts in which the diamond wire segment participates in the cutting operation based on the wire take-up and take-down parameters and the preset cutting process parameters further includes: The number of cycles for this cut is determined based on the wire take-up and take-down parameters and the preset cutting process parameters; The number of cuts is determined based on the number of cycles.
4. The cutting process development method according to claim 2, characterized in that, The determination of wear data for the diamond wire segment based on the number of cuts includes: Based on the functional relationship between the number of cuts and the wear coefficient, the wear degree data of the diamond wire segment in each cut is determined; The wear data is determined based on the wear degree data.
5. The cutting process development method according to claim 2, characterized in that, Each cycle includes an input phase and a return phase. The take-up and untake-down parameters include the input amount in the input phase and the return amount in the return phase. Obtaining the number of cuts the diamond wire segment participates in during that cut includes: For each cycle, determine whether the diamond wire segment participates in cutting during the wire feeding stage and the wire return stage; The total number of cuts the diamond wire segment participated in during all cycles of this cut is calculated.
6. The cutting process development method according to claim 5, characterized in that, The step of determining whether the diamond wire segment participates in cutting during the wire feeding stage and the wire return stage includes: For each cycle, it is determined whether the diamond wire segment participates in cutting during the wire feeding stage based on the initial wire feeding position and the wire feeding amount, and it is determined whether the diamond wire segment participates in cutting during the wire return stage based on the initial wire return position and the wire return amount.
7. The cutting process development method according to claim 6, characterized in that, The cutting process development method also includes: For each cycle, the starting return line position is determined based on the starting incoming line position and the incoming line amount, and the starting incoming line position for the next cycle is determined based on the starting return line position and the return line amount.
8. The cutting process development method according to any one of claims 1 to 7, characterized in that, The cutting process development method further includes: The wear data of each diamond wire segment in each cycle is displayed graphically; The display parameters of the entire cycle are superimposed and graphically displayed to graphically display the actual overall wear data.
9. An electronic device, characterized in that, include: At least one processor; And, a memory communicatively connected to the at least one processor; The memory stores instructions that can be executed by the at least one processor, which, when executed by the at least one processor, enables the at least one processor to perform the cutting process development method as described in any one of claims 1 to 8.
10. A computer-readable storage medium storing a computer program, characterized in that, The computer program is executed by a processor to implement the cutting process development method according to any one of claims 1 to 8.