Low-modulus high-toughness photothermal deicing material and preparation method thereof
By introducing hydrophobic polysiloxane segments and flexible polyether segments into the photothermal anti-icing and de-icing material, and combining them with chemical covalent bonds and a three-dimensional cross-linked network, the problems of poor interfacial compatibility and insufficient de-icing time were solved, achieving a highly efficient and stable photothermal anti-icing and de-icing effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CIVIL AVIATION FLIGHT UNIV OF CHINA
- Filing Date
- 2026-04-13
- Publication Date
- 2026-06-09
AI Technical Summary
Existing photothermal de-icing materials suffer from poor interfacial compatibility, photothermal efficiency degradation, and material delamination, resulting in the inability to continuously transfer heat. They are also prone to aging and cracking under external conditions and have insufficient de-icing timeliness.
By introducing hydrophobic polysiloxane segments, flexible polyether segments, and photothermal conversion groups, multi-block polyurethane molecular chains are formed. Combined with chemical covalent bonds and a three-dimensional cross-linked network, a low-modulus, high-toughness photothermal de-icing material is constructed.
The material achieves low modulus, high toughness, and hydrophobicity, ensuring the stability of photothermal conversion efficiency and the continuity of de-icing effect, and solving the problems of interface defects and de-icing timeliness.
Smart Images
Figure CN122167697A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of anti-icing and de-icing materials technology, and particularly relates to a low-modulus, high-toughness photothermal anti-icing and de-icing material and its preparation method. Background Technology
[0002] With increasing demands for safe operation in aviation, wind power, and power transmission, de-icing technology has become a key research area. Traditional de-icing methods mainly include active de-icing technologies such as mechanical removal, chemical melting, and electrothermal de-icing. However, these methods have limitations such as high energy consumption, heavy environmental burden, and poor durability. Passive de-icing, due to its ability to effectively reduce ice adhesion and delay icing time, is widely used in auxiliary de-icing coatings.
[0003] Photothermal de-icing technology, which converts solar energy into thermal energy to melt ice, has become a current research hotspot due to its clean and renewable advantages. Photothermal de-icing primarily uses the photothermal effect to promote ice melting on the contact surface, forming a water film between the material and the ice. This water film reduces ice adhesion, achieving low-energy de-icing. However, if this water film is unevenly distributed or unstable, heat cannot be continuously and efficiently transferred to the entire ice layer, resulting in localized melting while the ice remains adhered, making it difficult for the ice to detach completely. Currently reported photothermal de-icing materials rely on composite materials with physically doped photothermal fillers. These are prone to poor interfacial compatibility, leading to photothermal efficiency degradation and material delamination. During material use, especially under external conditions such as thermal cycling and mechanical stress, the filler is prone to detachment or migration from the matrix, causing defects at the interface. The loss of filler directly reduces photothermal conversion efficiency, and these interfacial defects become stress concentration points, accelerating material aging and cracking, affecting the long-term stability of the de-icing effect.
[0004] Furthermore, relying solely on photothermal melting of the water layer presents a problem of de-icing timeliness. For example, there are time requirements for photothermal melting of ice under extremely low temperatures, and the uniformity of light and shadow spreading. Therefore, how to achieve complete ice removal with minimal molten water is a practical problem that urgently needs to be solved. If the coating material is too hard, it may not effectively release the stress between the ice layer and the substrate, resulting in strong ice adhesion; while if it is too soft, it may lack sufficient mechanical strength, and its abrasion resistance may not meet practical application requirements. To solve these problems, it is necessary to design coating materials at the molecular level that combine low modulus, high toughness, and intrinsic photothermal functionality. Summary of the Invention
[0005] In order to combine low modulus, high toughness, photothermal conversion and hydrophobic anti-icing functions into one, the present invention provides a low modulus and high toughness photothermal anti-icing and de-icing material. By introducing hydrophobic polysiloxane segments, flexible polyether segments, photothermal conversion groups and dynamic bonds to form multi-block polyurethane molecular chains, low modulus, high toughness and photothermal anti-icing and de-icing are achieved.
[0006] The low-modulus, high-toughness photothermal de-icing material of the present invention has the structure of formula (1):
[0007] OCN-A-NHCOO-RA-NHCOO-RA-NHCOO-Rf-OOCHN-A-NHCOO-RA-NHCO-Rb (1)
[0008] In formula (1):
[0009] A is an aromatic hard segment, selected from any one of compounds A-1, A-2, and A-3:
[0010] , , ;
[0011] R is a soft segment repeating chain, selected from any one of compounds R-1, R-2, R-3, and R-4.
[0012] , ,
[0013] , ;
[0014] The Rf is an intermediate functional group, selected from any one of compounds Rf-1, Rf-2, and Rf-3:
[0015] , , ;
[0016] The Rb is a branched polyamine terminal group, selected from any one of compounds Rb-1, Rb-2, and Rb-3:
[0017] , , ;
[0018] The low-modulus, high-toughness photothermal de-icing material has the structure shown in formulas (2)-(7):
[0019] (2)
[0020] (3)
[0021] (4)
[0022] (5)
[0023] (6)
[0024] (7).
[0025] This invention also provides a method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0026] (1) Heat the polymer matrix to 100-120℃, vacuum dehydrate for 30-60 min, then cool to 50-65℃ and add dry solvent and diisocyanate, then add organotin catalyst dropwise, and stir in a closed reaction system at 55-65℃ for 3-6 hours to obtain -NCO-terminated prepolymer;
[0027] (2) Add a chain extender to the -NCO-terminated prepolymer and continue stirring at 45-65°C for 4-5 hours;
[0028] (3) After adding a triamine crosslinking agent to the reaction system and stirring for 3-5 minutes, cure it in an oven at 45-50℃ for 1.5-2 hours and in an oven at 50-60℃ for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, which is the low modulus high toughness photothermal anti-icing material.
[0029] Preferably, the polymer matrix in step (1) is at least one of PSI (polydimethylsiloxane), PTMG (polybutanediol), PEG (polyethylene glycol), and PPG (polypropylene glycol).
[0030] Preferably, the solvent in step (1) is at least one of tetrahydrofuran solution, N,N-dimethylformamide, and N,N-dimethylacetamide.
[0031] Preferably, the diisocyanate in step (1) is at least one of aliphatic diisocyanate and aromatic diisocyanate.
[0032] More preferably, the diisocyanate in step (1) is any one of toluene diisocyanate (TDI), isophorone diisocyanate (IPDI), diphenylmethane diisocyanate (MDI), dicyclohexylmethane diisocyanate (HMDI), and hexamethylene diisocyanate (HDI).
[0033] Preferably, the organotin catalyst in step (1) is any one of dibutyltin disilicate, stannous octoate, and dibutyltin diacetate.
[0034] Preferably, in step (1), the molar ratio of the polymer matrix to the diisocyanate is 1:4 to 4:1; the ratio of the organotin catalyst to the polymer matrix is 2-8 drops of organotin catalyst added for every 2-25g of polymer matrix; and the volume-mass ratio of the solvent to the polymer matrix is 25-30ml:2-25g.
[0035] Preferably, the chain extender in step (2) is any one of p-benzoquinone dioxime, acenaphthoquinone dioxime, diphenylglyoxime, and naphthol; the molar ratio of the polymer matrix to the chain extender is 1:1.
[0036] Preferably, the triamine crosslinking agent in step (3) is any one of diethylenetriamine, tri(2-aminoethyl)amine, polyoxypropylene triamine, diethylenetriamine, tri(2-aminoethyl)amine, and polyoxypropylene triamine; the mass ratio of the polymer matrix to the triamine crosslinking agent is 5-25:0.1-0.5.
[0037] The present invention has the following technical effects:
[0038] This invention can obtain low-modulus, high-toughness photothermal de-icing materials with different molecular structures, crosslinking densities, hydrogen bond densities, and dynamic bond densities by adjusting the molecular weight of PSI, PTMG, PEG, PPG, diisocyanate, chain extender, end-capping agent, and crosslinking agent.
[0039] The present invention provides a method for preparing low-modulus, high-toughness photothermal anti-icing and de-icing materials; by introducing the p-benzoquinone structure with light absorption and photothermal conversion functions into the polymer molecular chain through chemical covalent bonding, the problems of interface defects present in doped or adsorbed systems can be avoided.
[0040] The method for preparing low-modulus, high-toughness photothermal de-icing material provided by the present invention is as follows: a block skeleton chain structure with hydrophobic segments and flexible molecular chain structure is prepared by molecular structure design, thereby endowing the polymer material with hydrophobic and low-modulus functions.
[0041] The preparation method of the low-modulus, high-toughness photothermal anti-icing material provided by this invention: the separation of soft and hard segments by micro-phase change and the three-dimensional cross-linked network stabilization structure can effectively solve the problem of poor material toughness.
[0042] The functional segments and network structure in the polymer molecules are formed by the synergistic construction of the various reacting components. Specifically, the chain extender added in step (2) reacts with the -NCO-terminated prepolymer obtained in step (1), introducing the p-benzoquinone structure, which has light absorption and photothermal conversion functions, into the polymer backbone through chemical covalent bonds. The polymer matrix, including PSI, PTMG, PEG, and PPG, remains as long-chain flexible segments in the polymer backbone after the reaction, constituting the soft segments of the material and imparting low modulus properties. The PSI and PPG segments also provide hydrophobic segments, giving the material hydrophobic properties. Simultaneously, the diisocyanate structural units, the rigid conjugated / aromatic structures introduced by the chain extender, and the urea or carbamate bonds generated in the reaction together constitute the hard segments of the material. Due to the differences in polarity, rigidity / flexibility, and segment mobility between the soft and hard segments, a microphase separation structure of soft and hard segments is formed within the polymer. Furthermore, the ternary amine crosslinking agent in step (3) reacts with the isocyanate groups in the prepolymer to form multiple chemical crosslinking points between the molecular chains, constructing a stable three-dimensional crosslinking network structure. The synergistic effect of the soft segments, hard segments, microphase separation structure and the three-dimensional crosslinking network gives the material hydrophobicity, low modulus and high toughness. Attached Figure Description
[0043] Figure 1 A sample image of Y1 prepared in Example 1;
[0044] Figure 2 The results of thermogravimetric analysis of Y1 prepared in Example 1;
[0045] Figure 3 The XRD curve of Y1 prepared in Example 1;
[0046] Figure 4 The photothermal heating curve of Y1 prepared in Example 1;
[0047] Figure 5 The infrared spectrum of Y1 prepared in Example 1;
[0048] Figure 6 The stress-strain curve of Y1 prepared in Example 1.
[0049] Figure 7 Water contact angle diagram prepared in Example 1 Detailed Implementation
[0050] Example 1
[0051] A method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0052] (1) Heat 2.5g (0.0025mol) of PSI with a molecular weight of 1000 and 2.5g (0.0025mol) of PTMG with a molecular weight of 1000 to 120℃, vacuum dehydrate for 60min, then cool to 65℃ and add 30ml of tetrahydrofuran (ultra-dry) and 3.02g (2.8mol) of dicyclohexylmethane diisocyanate, then add 6 drops of dibutyltin disilicate, and stir at 65℃ for 3 hours in a closed reaction system to obtain -NCO-terminated prepolymer;
[0053] (2) Add 0.8035 g (0.005 mol) of 1,5-naphthol to the -NCO-terminated prepolymer and continue stirring at 65°C for 5 hours to obtain a uniform dark brown liquid;
[0054] (3) Add 0.44 g (0.00125 mol) of polyoxypropylene triamine to the reaction system and stir for 3-5 minutes. Pour the resulting liquid into a polytetrafluoroethylene mold, wrap it with tin foil, poke some holes with a needle, tie it with rubber bands, and cure it in an oven at 45°C for 1.5 hours. Then cure it in an oven at 55°C for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, namely the low modulus high toughness photothermal anti-icing material (denoted as Y1).
[0055] The reaction for preparing Y1 in Example 1 is as shown in equation (8):
[0056] (8)
[0057] Sample image of Y1 is shown below. Figure 1 .
[0058] Thermogravimetric analysis was performed on Y1, and the results are as follows: Figure 2 XRD analysis was performed on Y1, and the XRD curve is shown below. Figure 3 Photothermal analysis was performed on Y1, and the photothermal heating curve is shown below. Figure 4 Infrared analysis was performed on Y1, and the infrared spectrum is as follows: Figure 5 The stress-strain curve of Y1 is as follows: Figure 6 Water contact angle such as Figure 7 .
[0059] The stress-strain curves show that the material's fracture strain is close to 1500%, and the maximum stress is 10 MPa, indicating that it possesses both high ductility and high load-bearing capacity. Since the material's toughness can be characterized by the area under the stress-strain curve, the large integral area of this curve proves the material's excellent toughness. Furthermore, under illumination, the sample temperature rapidly rises from room temperature to approximately 170°C, and then cools rapidly after the light source is turned off, indicating that the material can efficiently convert light energy into heat energy, demonstrating significant photothermal conversion capabilities. The average contact angle of all samples is greater than 107°, indicating that they are all hydrophobic.
[0060] Therefore, the sample of this application has good elastic modulus, high toughness, photothermal conversion capability and hydrophobic anti-icing function.
[0061] Example 2
[0062] A method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0063] (1) Heat 5g (0.005mol) of PSI with a molecular weight of 1000 to 120℃, vacuum dehydrate for 60min, then cool to 65℃ and add 30ml of tetrahydrofuran (ultra-dry) and 3.02g (2.8mol) of dicyclohexylmethane diisocyanate, then add 2 drops of di(dodecyl sulfide)dibutyltin, stir at 65℃ for 3 hours in a closed reaction system to obtain -NCO-terminated prepolymer;
[0064] (2) Add 0.8035 g (0.005 mol) of 1,5-naphthol to the -NCO-terminated prepolymer and continue stirring at 65°C for 5 hours to obtain a uniform dark brown liquid;
[0065] (3) Add 0.44 g (0.00125 mol) of polyoxypropylene triamine to the reaction system and stir for 3-5 minutes. Pour the resulting liquid into a polytetrafluoroethylene mold, wrap it with tin foil, poke some holes with a needle, tie it with rubber bands, cure it in an oven at 45°C for 1.5 hours, and then cure it in an oven at 55°C for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, namely the low modulus high toughness photothermal anti-icing material (denoted as Y2), with the specific structure as shown in formula (2).
[0066] (2)
[0067] Example 3
[0068] A method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0069] (1) Heat 10g (0.005mol) of PSI with a molecular weight of 2000 to 120℃, remove water by vacuum treatment for 60min, then cool to 65℃ and add 30ml of tetrahydrofuran (ultra-dry) and 3.02g (2.8mol) of dicyclohexylmethane diisocyanate, then add 4 drops of dibutyltin disilicate, stir at 65℃ for 3 hours in a closed reaction system to obtain -NCO-terminated prepolymer;
[0070] (2) Add 0.693 g (0.005 mol) of p-benzoquinone dioxime to the -NCO-terminated prepolymer and continue stirring at 65°C for 5 hours to obtain a uniform dark brown liquid;
[0071] (3) Add 0.44 g (0.00125 mol) of polyoxypropylene triamine to the reaction system and stir for 3-5 minutes. Pour the resulting liquid into a polytetrafluoroethylene mold, wrap it with tin foil, poke some holes with a needle, tie it with rubber bands, cure it in an oven at 45°C for 1.5 hours, and then cure it in an oven at 55°C for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, namely the low modulus high toughness photothermal anti-icing material (denoted as Y3), with the specific structure as shown in formula (3).
[0072] (3)
[0073] Example 4
[0074] A method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0075] (1) Heat 25g (0.005mol) of PSI with a molecular weight of 5000 to 120℃, remove water under vacuum for 60min, then cool to 65℃ and add 30ml of tetrahydrofuran (ultra-dry) and 3.02g (2.8mol) of dicyclohexylmethane diisocyanate, then add 6 drops of dibutyltin diacetate, and stir at 65℃ for 3 hours in a closed reaction system to obtain -NCO-terminated prepolymer;
[0076] (2) Add 0.693 g (0.005 mol) of p-benzoquinone dioxime to the -NCO-terminated prepolymer and continue stirring at 65°C for 5 hours to obtain a uniform dark brown liquid;
[0077] (3) Add 0.104 g (0.00125 mol) of diethylenetriamine to the reaction system and stir for 3-5 minutes. Pour the resulting liquid into a polytetrafluoroethylene mold, wrap it with tin foil, poke some holes with a needle, tie it with rubber bands, cure it in an oven at 45°C for 1.5 hours, and then cure it in an oven at 55°C for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, namely the low modulus high toughness photothermal anti-icing material (denoted as Y4), with the specific structure as shown in formula (4).
[0078] (4)
[0079] Example 5
[0080] A method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0081] (1) Mix 2.5g (0.0025mol) of PSI with a molecular weight of 1000 and 2.5g (0.0025mol) of PTMG with a molecular weight of 1000 and heat to 120°C. Vacuum dehydrate for 60min, then cool to 65°C and add 30ml of tetrahydrofuran (ultra-dry) and 2.56g (2.8mol) of isophorone diisocyanate. Then add 3 drops of dioctyltin dilaurate. Stir at 65°C for 3 hours in a closed reaction system to obtain -NCO-terminated prepolymer.
[0082] (2) Add 0.693 g (0.005 mol) of p-benzoquinone dioxime to the -NCO-terminated prepolymer and continue stirring at 65°C for 5 hours to obtain a uniform dark brown liquid;
[0083] (3) Add 0.104 g (0.00125 mol) of diethylenetriamine to the reaction system and stir for 3-5 minutes. Pour the resulting liquid into a polytetrafluoroethylene mold, wrap it with tin foil, poke some holes with a needle, tie it with rubber bands, cure it in an oven at 45°C for 1.5 hours, and then cure it in an oven at 55°C for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, namely the low modulus high toughness photothermal anti-icing material (denoted as Y5), with the specific structure as shown in formula (5).
[0084] (5)
[0085] Example 6
[0086] A method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0087] (1) Mix 2.5g (0.0025mol) of PSI with a molecular weight of 1000 and 2.5g (0.0025mol) of PTMG with a molecular weight of 1000 and heat to 120℃. Vacuum dehydrate for 60min, then cool to 65℃ and add 30ml of tetrahydrofuran (ultra-dry) and 3.02g (2.8mol) of dicyclohexylmethane diisocyanate. Then add 5 drops of dibutyltin disilicate. Stir at 65℃ for 3 hours in a closed reaction system to obtain -NCO-terminated prepolymer.
[0088] (2) Add 0.693 g (0.005 mol) of p-benzoquinone dioxime to the -NCO-terminated prepolymer and continue stirring at 65°C for 5 hours to obtain a uniform dark brown liquid;
[0089] (3) Add 0.147 g (0.00125 mol) of tris(2-aminoethyl)amine to the reaction system and stir for 3-5 minutes. Pour the resulting liquid into a polytetrafluoroethylene mold, wrap it with tin foil, poke some holes with a needle, tie it with rubber bands, and cure it in an oven at 45°C for 1.5 hours. Then cure it in an oven at 55°C for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, namely the low modulus high toughness photothermal anti-icing material (denoted as Y6), with the specific structure as shown in formula (6).
[0090] (6)
[0091] Example 7
[0092] A method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0093] (1) Heat 5g (0.005mol) of PSI with a molecular weight of 1000 to 120°C, remove water under vacuum for 60min, then cool to 65°C and add 30ml of tetrahydrofuran (ultra-dry) and 2.56g (2.8mol) of isophorone diisocyanate, then add 8 drops of stannous octoate, and stir at 65°C for 3 hours in a closed reaction system to obtain -NCO-terminated prepolymer;
[0094] (2) Add 1.065 g (0.005 mol) of acenaphthene dioxime to the -NCO-terminated prepolymer and continue stirring at 65°C for 5 hours to obtain a uniform dark brown liquid;
[0095] (3) Add 0.147 g (0.00125 mol) of tris(2-aminoethyl)amine to the reaction system and stir for 3-5 minutes. Pour the resulting liquid into a polytetrafluoroethylene mold, wrap it with tin foil, poke some holes with a needle, tie it with rubber bands, and cure it in an oven at 45°C for 1.5 hours. Then cure it in an oven at 55°C for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, namely the low modulus high toughness photothermal anti-icing material (denoted as Y7), with the specific structure as shown in formula (7).
[0096] (7)
[0097] Example 8
[0098] A method for preparing a low-modulus, high-toughness photothermal anti-icing and de-icing material, comprising the following steps:
[0099] (1) Heat 5g (0.005mol) of PPG with a molecular weight of 1000 to 120°C, remove water under vacuum for 60min, then cool to 65°C and add 30ml of tetrahydrofuran (ultra-dry) and 3.02g (2.8mol) of dicyclohexylmethane diisocyanate, then add 6 drops of dibutyltin diacetate, and stir at 65°C for 3 hours in a closed reaction system to obtain -NCO-terminated prepolymer;
[0100] (2) Add 1.065 g (0.005 mol) of acenaphthene dioxime to the -NCO-terminated prepolymer and continue stirring at 65°C for 5 hours to obtain a uniform dark brown liquid;
[0101] (3) Add 0.147 g (0.00125 mol) of tris(2-aminoethyl)amine to the reaction system and stir for 3-5 minutes. Pour the resulting liquid into a polytetrafluoroethylene mold, wrap it with tin foil, poke some holes with a needle, tie it with rubber bands, and cure it in an oven at 45°C for 1.5 hours. Then cure it in an oven at 55°C for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, namely the low modulus high toughness photothermal anti-icing material (denoted as Y8), with the specific structure as shown in formula (8).
[0102] (8)
[0103] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A low-modulus, high-toughness photothermal de-icing material, characterized in that, The structure is as shown in equation (1): OCN-A-NHCOO-RA-NHCOO-RA-NHCOO-Rf-OOCHN-A-NHCOO-RA-NHCO-Rb (1) In formula (1): A is an aromatic hard segment, selected from any one of compounds A-1, A-2, and A-3: 、 、 ； R is a soft segment repeating chain, selected from any one of compounds R-1, R-2, R-3, and R-4. 、 、 、 ； The Rf is an intermediate functional group, selected from any one of compounds Rf-1, Rf-2, and Rf-3: 、 、 ； The Rb is a branched polyamine terminal group, selected from any one of compounds Rb-1, Rb-2, and Rb-3: 、 、 。 2. The low-modulus, high-toughness photothermal de-icing material according to claim 1, characterized in that, The structure is as shown in equations (2)-(7): (2) （3） （4） （5） （6） （7）。 3. The preparation method of the low-modulus, high-toughness photothermal anti-icing and de-icing material according to claim 1, characterized in that, Includes the following steps: (1) Heat the polymer matrix to 100-120℃, vacuum dehydrate for 30-60 min, then cool to 50-65℃ and add dry solvent and diisocyanate, then add organotin catalyst dropwise, and stir in a closed reaction system at 55-65℃ for 3-6 hours to obtain -NCO-terminated prepolymer; (2) Add a chain extender to the -NCO-terminated prepolymer and continue stirring at 45-65°C for 4-5 hours; (3) After adding a triamine crosslinking agent to the reaction system and stirring for 3-5 minutes, cure it in an oven at 45-50℃ for 1.5-2 hours and in an oven at 50-60℃ for 24 hours to obtain a polymer with a photothermal polyurea molecular structure, which is the low modulus high toughness photothermal anti-icing material.
4. The preparation method of the low-modulus, high-toughness photothermal anti-icing and de-icing material according to claim 3, characterized in that, The polymer matrix in step (1) is at least one of polydimethylsiloxane, polybutanediol, polyethylene glycol, and polypropylene glycol.
5. The preparation method of the low-modulus, high-toughness photothermal anti-icing and de-icing material according to claim 3, characterized in that, The solvent in step (1) is at least one of tetrahydrofuran solution, N,N-dimethylformamide, and N,N-dimethylacetamide.
6. The preparation method of the low-modulus, high-toughness photothermal de-icing material according to claim 3, characterized in that, The diisocyanate in step (1) is at least one of aliphatic diisocyanate and aromatic diisocyanate.
7. The preparation method of the low-modulus, high-toughness photothermal de-icing material according to claim 6, characterized in that, The diisocyanate mentioned in step (1) is any one of toluene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, dicyclohexylmethane diisocyanate, and hexamethylene diisocyanate.
8. The preparation method of the low-modulus, high-toughness photothermal de-icing material according to claim 3, characterized in that, The organotin catalyst in step (1) is any one of dibutyltin disilicate, stannous octoate, and dibutyltin diacetate.
9. The preparation method of the low-modulus, high-toughness photothermal de-icing material according to claim 3, characterized in that, In step (1), the molar ratio of the polymer matrix to the diisocyanate is 1:4 to 4:1; the ratio of the organotin catalyst to the polymer matrix is 2-8 drops of organotin catalyst added for every 2-25g of polymer matrix; the volume-mass ratio of the solvent to the polymer matrix is 25-30ml:2-25g.
10. The method for preparing the low-modulus, high-toughness photothermal de-icing material according to claim 3, characterized in that, The chain extender in step (2) is any one of p-benzoquinone dioxime, acenaphthene dioxime, diphenylglyoxime, and naphthol; the molar ratio of the polymer matrix to the chain extender is 1:1; The triamine crosslinking agent in step (3) is any one of diethylenetriamine, tri(2-aminoethyl)amine, polyoxypropylene triamine, diethylenetriamine, tri(2-aminoethyl)amine, and polyoxypropylene triamine; the mass ratio of the polymer matrix to the triamine crosslinking agent is 5-25:0.1-0.5.