A fluid replenishment device and method

Abstract

This application relates to semiconductor technology, specifically to a replenishment device for supplying heat exchange medium to cooling equipment configured in a vapor deposition chamber. The device includes a control system and an execution system. The control system determines the appropriate type and flow rate of automatically replenished heat exchange medium based on the coolant conductivity and coolant level in the cooling equipment, and generates a control signal based on the medium type and flow rate. The execution system automatically executes the corresponding heat exchange medium replenishment strategy based on the control signal. Firstly, this application eliminates manual inspection and manual addition of heat exchange medium, reducing the workload of personnel. Secondly, the embodiments of this application determine the coolant medium type based on conductivity conditions, effectively controlling the coolant conductivity while ensuring sufficient coolant supply, avoiding excessively high coolant conductivity that could cause tip discharge, and eliminating potential production hazards in the vapor deposition process.

Description

Technical Field

[0001] This application relates to semiconductor technology, and more particularly to a liquid replenishment device and liquid replenishment method. Background Technology

[0002] The vapor deposition chamber is equipped with a cooling system to keep it within a threshold temperature range. This cooling system typically uses deionized water and a dielectric coolant. Deionized water is used for heat exchange cooling, while the dielectric coolant maintains the coolant's resistivity. When coolant needs replenishment, existing technologies generally employ manual replenishment. To prevent sudden temperature changes caused by adding room-temperature coolant (which is typically around 75 degrees Celsius inside the cooling system), a small, frequent addition method is used. Each addition ensures the coolant temperature recovers before further addition, until the level reaches a safe level. The shortcomings of existing coolant replenishment methods for vapor deposition chambers include: manual replenishment is labor-intensive and inefficient. Summary of the Invention

[0003] This application provides a liquid replenishment device for supplying a heat exchange medium to a cooling device configured in a vapor deposition chamber. The device includes a control system and an execution system. The control system is configured to determine the type of the heat exchange medium based on the coolant conductivity of the cooling device, determine the input flow rate of the heat exchange medium based on the coolant level and device status information of the cooling device, and generate a control signal based on the obtained medium type and input flow rate. The heat exchange medium type includes deionized water and dielectric coolant. The execution system is configured to collect the coolant conductivity, the coolant level, the device status information, and control a valve group to supply the heat exchange medium to the cooling device based on the control signal.

[0004] In some embodiments, the control system includes: a water resistance control module; the execution system includes a water resistance sensor; the water resistance sensor is installed on the cooling equipment and configured to acquire the coolant conductivity of the cooling equipment; the water resistance control module is communicatively connected to the water resistance sensor and configured to select the medium type as deionized water in the control signal when the coolant conductivity of the cooling equipment is lower than a first threshold, and to select dielectric coolant in the control signal when the coolant conductivity is higher than the first threshold.

[0005] In some embodiments, the control system further includes: a state collector and a liquid level control module; the execution system further includes a liquid level sensor; the liquid level sensor is installed on the cooling equipment and configured to collect the coolant level of the cooling equipment; the state collector is installed on the cooling equipment and configured to collect equipment status information of the cooling equipment; the liquid level control module is communicatively connected to the liquid level sensor and configured to select the input flow rate as a first flow rate in the control signal when the coolant level of the cooling equipment is less than a second threshold, and to select the input flow rate as a first flow rate when the coolant level is between the second threshold and a third threshold, and the cooling equipment... When the equipment status information of the equipment is idle, the input flow rate is selected as the second flow rate in the control signal; and when the coolant level of the cooling equipment is between the second threshold and the third threshold, the coolant conductivity is lower than the first threshold, and the equipment status information of the cooling equipment is in operation, the input flow rate is selected as zero flow rate in the control signal; and when the coolant level is greater than the third threshold and the coolant conductivity is lower than the first threshold, the input flow rate is selected as zero flow rate in the control signal; wherein the second threshold is less than the third threshold, and the first flow rate is greater than the second flow rate.

[0006] In some embodiments, the control system further includes: a state collector and a liquid level control module; the execution system further includes a liquid level sensor; the liquid level sensor is installed on the cooling equipment and configured to collect the coolant level of the cooling equipment; the state collector is installed on the cooling equipment and configured to collect equipment status information of the cooling equipment; the liquid level control module is communicatively connected to the liquid level sensor and configured to select the input flow rate as a first flow rate in the control signal when the coolant level of the cooling equipment is less than a second threshold, and to select the input flow rate as a first flow rate when the coolant level is between the second threshold and a third threshold. When the equipment status information of the cooling device is idle, the input flow rate is selected as variable flow rate in the control signal; when the coolant level of the cooling device is between the second threshold and the third threshold, the coolant conductivity is lower than the first threshold, and the equipment status information of the cooling device is in operation, the input flow rate is selected as zero flow rate in the control signal; and when the coolant level is greater than the third threshold and the coolant conductivity is lower than the first threshold, the input flow rate is selected as zero flow rate in the control signal; wherein the second threshold is less than the third threshold.

[0007] In some embodiments, the execution system includes: a switching valve and a flow valve; the switching valve has its inlet end connected to a first container for containing the deionized water and a second container for containing the dielectric coolant respectively, and its inlet end connected to the flow valve, and is configured to open a pipeline passage from the first container to the flow valve or open a pipeline passage from the second container to the flow valve; the flow valve has its inlet end connected to the outlet end of the switching valve, and its outlet connected to the coolant flow channel of the cooling device or a coolant storage container.

[0008] In some embodiments, the flow valve includes: a valve body and a valve core; the valve body, installed between the switching valve and the cooling device, includes a valve body inlet and a valve body outlet, the valve body inlet pipe being connected to the switching valve and the valve body outlet pipe being connected to the cooling device; the valve core, installed in the valve body, is configured to regulate the transmission flow rate of the heat exchange medium delivered to the cooling device based on its relative position within the valve body.

[0009] In some embodiments, the execution system further includes: an angular stroke actuator; the angular stroke actuator is communicatively connected to the control system and configured to drive the valve core to rotate within the valve body based on the control signal; wherein the valve core is rotatably mounted within the valve body and includes a first flow channel and a second flow channel with equivalent diameters, and is configured to, when rotating within the valve body, achieve flow channel connection between the valve body inlet and the valve body outlet based on the first flow channel, or achieve flow channel connection between the valve body inlet and the valve body outlet based on the second flow channel, or achieve flow channel closure between the valve body inlet and the valve body outlet based on its own structure.

[0010] In some embodiments, the execution system further includes: a stepper actuator; the stepper actuator is communicatively connected to the control system and configured to drive the valve core to linearly displace within the valve body based on the control signal; wherein the valve core is slidably mounted within the valve body and is configured to adjust the equivalent diameter of the medium channel between the valve body inlet and the valve body outlet when linearly displacing within the valve body.

[0011] In some embodiments, the present invention also provides a replenishment method for supplying a heat exchange medium to a cooling device in a vapor deposition chamber, the method comprising: obtaining the coolant conductivity and coolant quantity of the cooling device; when the coolant conductivity of the cooling device is greater than a first threshold: if the coolant quantity of the cooling device is less than a second threshold, supplying dielectric coolant to the cooling device at a first flow rate, or, if the coolant quantity of the cooling device is greater than the second threshold, supplying dielectric coolant to the cooling device at a second flow rate or a first variable flow rate; when the coolant conductivity of the cooling device is less than the first threshold: if the coolant quantity of the cooling device is less than the second threshold, supplying deionized water to the cooling device at a first flow rate, or, if the coolant quantity of the cooling device is greater than a third threshold, stopping the supply of the heat exchange medium to the cooling device; wherein: the second threshold is less than the third threshold; the first flow rate is greater than the second flow rate; the maximum value of the first variable flow rate is equal to the first flow rate, and the minimum value of the first variable flow rate is equal to the first flow rate; when the coolant quantity is within the range of the second threshold to the third threshold, the magnitude of the first variable flow rate is linearly related to the coolant quantity of the cooling device.

[0012] In some embodiments, the replenishment method further includes: obtaining the device status of the vapor deposition chamber; when the conductivity of the coolant is less than a first threshold: if the coolant level is greater than a second threshold and less than a third threshold, and the device status is idle, supplying deionized water to the cooling device at a second flow rate or a second variable flow rate; or, if the coolant level is greater than the second threshold and less than the third threshold, and the device status is operating, stopping the supply of the heat exchange medium to the cooling device; the maximum value of the second variable flow rate is equal to the first flow rate, and the minimum value of the first variable flow rate is zero flow rate; when the coolant level is within the range of the second threshold to the third threshold, the magnitude of the first variable flow rate is linearly related to the coolant level of the cooling device.

[0013] The embodiments of this application have the following beneficial effects: In this embodiment, a control system and an execution system are configured to collect information on the coolant's quantity and conductivity in the cooling equipment. Based on this information, a coolant addition strategy is determined, and the addition of the heat exchange medium is automatically executed. Firstly, this application eliminates manual inspection and manual addition of the heat exchange medium, reducing the workload of personnel. Secondly, this embodiment determines the coolant medium type based on its conductivity, effectively controlling the coolant's conductivity while ensuring sufficient coolant supply. This prevents excessively high coolant conductivity from causing tip discharge, eliminating potential production hazards in the vapor deposition process. Attached Figure Description

[0014] Figure 1 This is a structural diagram of a fluid replenishment device provided in an embodiment of this application; Figure 2 This is a schematic diagram of a working mode of a fluid replenishment device provided in an embodiment of this application; Figure 3 This is a diagram illustrating another working mode of a fluid replenishment device provided in an embodiment of this application; Figure 4 This is a schematic diagram of a high-traffic mode of the execution system provided in an embodiment of this application; Figure 5 This is a schematic diagram of a low-flow mode of the execution system provided in an embodiment of this application; Figure 6 This is a schematic diagram of a flow valve core structure provided in an embodiment of this application; Figure 7 This is a schematic diagram of another high-traffic mode of the execution system provided in the embodiments of this application; Figure 8 This is a schematic diagram of another low-flow mode of the execution system provided in the embodiments of this application.

[0015] It should be noted that the terms "first" and "second" mentioned above are only used to distinguish between different options and do not represent the degree of superiority or inferiority of the options or their priority in the implementation process. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0017] This application provides a liquid replenishment device 300 for supplying a heat exchange medium to the cooling equipment configured in a vapor deposition chamber; see reference. Figure 1 , Figure 1 The structural framework of the fluid replenishment device 300 is described, such as... Figure 1As shown, the replenishment device 300 includes: a control system 100 and an execution system 200; the control system 100 is configured to determine the type of heat exchange medium based on the coolant conductivity of the cooling equipment, and to determine the input flow rate of the heat exchange medium based on the coolant level and equipment status information of the cooling equipment, and to generate a control signal based on the obtained medium type and input flow rate; wherein the type of heat exchange medium includes deionized water and dielectric coolant; the execution system 200 is configured to collect coolant conductivity, collect coolant level, collect equipment status information, and control the valve group to deliver the heat exchange medium to the cooling equipment according to the control signal.

[0018] In some implementations, cooling equipment can be either a chiller exchange or a heat exchange, commonly used auxiliary equipment in vapor deposition chambers. The distinction between a chiller exchange and a heat exchange is based on the operating temperature range of the coolant; both serve to help cool the chamber. Both chiller and heat exchanges require circulating coolant, whose main components are deionized water and dielectric coolant. Deionized water is a crucial circulating cooling medium, carrying away heat generated at specific locations within the vapor deposition chamber based on its specific heat capacity. Inevitably, some deionized water will be lost from the coolant until the liquid level is insufficient, leading to a decrease in cooling efficiency. The conductivity of deionized water is generally 1-10 µS / cm. Its free ion content is extremely low, resulting in extremely low conductivity. One reason for the loss of deionized water is evaporation. During evaporation, water molecules are lost from the deionized water, but free ions remain. The increased concentration of free ions leads to an increase in the conductivity of the coolant. Excessive conductivity can cause tip discharge during cooling, affecting the vapor deposition process. The dielectric coolant in the coolant (generally ethylene glycol or electronic fluorinated liquid) has extremely high water resistance. Increasing the concentration of the dielectric coolant can reduce the conductivity of the cooling medium.

[0019] In some embodiments, the replenishment device 300 makes a judgment and generates control information in real time based on the coolant storage information (generally liquid level), equipment status information (whether the process chamber is running) and conductivity information in the cooling equipment. The control information, based on the mutual coordination of the control valve group, ensures that the coolant storage and conductivity are within the normal range, without the need for personnel to read data, make judgments based on experience, or manually add cooling medium.

[0020] Here, the operational logic of the control system 100 is generally based on components such as circuit boards and logic chips to implement the necessary comparison and control signal generation functions of this application. The execution system 200 includes a conductivity meter, a medium inventory measuring instrument, an electrically controlled valve, and signal wires for receiving information on the working status of the vapor deposition chamber, to implement the necessary signal acquisition and medium flow channel switching functions of this application.

[0021] Here, the heat exchange medium described in this application includes deionized water monomers and dielectric coolant monomers before entering the cooling equipment, and the coolant described in this application is a mixture of deionized water and dielectric coolant after entering the cooling equipment.

[0022] For example, the control system 100 can be mounted on a PCB board. The microcontroller (MCU) or processor on the PCB generates an electrical signal that can drive a valve actuator (such as an electromagnet or motor) through digital or analog circuitry, based on a preset program and input signals. This electrical signal controls the electrically controlled valve. The execution system 200 includes a signal acquisition unit 220 and a conductivity meter, a level sensor, a solenoid valve capable of flow channel switching, a solenoid valve capable of flow regulation, and signal lines connected to the operating circuit of the vapor deposition chamber, all of which communicate with the signal acquisition unit.

[0023] For example, this application also includes a container for storing heat exchange media (unmixed deionized water and dielectric coolant to form the final cooling medium) and a connecting pipe between the container and the cooling equipment.

[0024] This application employs a control system 100 and an execution system 200 to collect information on the coolant's quantity and conductivity in the cooling equipment. Based on this information, a coolant addition strategy is determined, and the coolant is automatically added. Firstly, this application eliminates manual inspection and manual coolant addition, reducing the workload of personnel. Secondly, this application determines the coolant's medium type based on its conductivity, effectively controlling the coolant's conductivity while ensuring sufficient coolant supply. This prevents excessively high coolant conductivity from causing tip discharge, eliminating potential production hazards in the vapor deposition process.

[0025] In some embodiments, Figure 2 and Figure 3 for Figure 1 The two operating modes of the fluid replenishment device 300 shown are described in the reference. Figure 2 and Figure 3The control system 100 includes: a water resistance control module 120; an execution system 200 includes a water resistance sensor; the water resistance sensor is installed on the cooling equipment and configured to acquire the coolant conductivity of the cooling equipment; the water resistance control module 120 is communicatively connected to the water resistance sensor and is configured to select deionized water as the medium type in the control signal when the coolant conductivity of the cooling equipment is lower than a first threshold, and to select dielectric coolant as the medium type in the control signal when the coolant conductivity is higher than the first threshold.

[0026] Here, the water resistance sensor uses a conductivity meter. When the conductivity of the coolant exceeds the safety threshold (first threshold), the water resistance control module 120 generates a control signal based on the signal from the conductivity meter, and directly replenishes the cooling equipment with dielectric coolant. This function has high priority (regardless of the coolant level), which can ensure the low conductivity of the coolant in the cooling equipment and ensure the normal operation of the vapor deposition chamber.

[0027] In some embodiments, see Figure 2 , Figure 2 One operating mode of the replenishment device 300 of this application is described, in which the heat exchange medium is replenished into the cooling equipment at two flow rates. For example... Figure 2 As shown, the control system 100 further includes: a state collector and a liquid level control module 110; the execution system 200 further includes a liquid level sensor; the liquid level sensor, installed on the cooling equipment, is configured to collect the coolant level of the cooling equipment; the state collector, installed on the cooling equipment, is configured to collect equipment status information of the cooling equipment; the liquid level control module 110, communicatively connected to the liquid level sensor, is configured to select a first flow rate in the control signal when the coolant level of the cooling equipment is less than a second threshold, and to select a first flow rate when the coolant level is between the second threshold and a third threshold (e.g., when the coolant level is between the second threshold and a third threshold). Figure 2 When the intermediate liquid level is shown and the equipment status information of the cooling equipment is idle, the input flow rate is selected as the second flow rate in the control signal; when the coolant level of the cooling equipment is between the second threshold and the third threshold, the coolant conductivity is lower than the first threshold, and the equipment status information of the cooling equipment is in operation, the input flow rate is selected as zero flow rate in the control signal; and when the coolant level is greater than the third threshold and the coolant conductivity is lower than the first threshold, the input flow rate is selected as zero flow rate in the control signal; wherein, the second threshold is less than the third threshold, and the first flow rate is greater than the second flow rate.

[0028] For example, the second threshold of this application indicates that the coolant content of the cooling equipment is close to the necessary level for normal operation, the third threshold indicates that the coolant content is at or above the healthy level, the first flow rate is the maximum flow rate that can be used to avoid the coolant temperature fluctuation in the cooling equipment from exceeding the set safety range of the cooling equipment, and the second flow rate is the flow rate that is greater than the normal coolant loss of the cooling equipment.

[0029] Here, the liquid level control module 110 of this application adopts a phased strategy, generating different liquid replenishment strategies based on the signal from the liquid level sensor and whether the vapor deposition chamber is in operation. When the coolant level is lower than the second threshold of the dangerous liquid level, a large flow rate is used to replenish the coolant until the minimum liquid level requirement is met (this function has high priority). Afterwards, a gentler small flow rate is used to continue replenishing the coolant until the liquid level reaches or exceeds the healthy liquid level. This ensures that the cooling equipment has sufficient coolant while minimizing the temperature fluctuation of the coolant in the cooling equipment.

[0030] In some embodiments, see Figure 3 , Figure 3 One operating mode of the liquid replenishment device 300 of this application is described, in which heat exchange medium is replenished to the cooling equipment at a steplessly adjustable variable flow rate within a certain flow range. For example... Figure 3 As shown, the control system 100 further includes: a state collector and a liquid level control module 110; the execution system 200 further includes a liquid level sensor; the liquid level sensor, installed on the cooling equipment, is configured to collect the coolant level of the cooling equipment; the state collector, installed on the cooling equipment, is configured to collect equipment status information of the cooling equipment; the liquid level control module 110, communicatively connected to the liquid level sensor, is configured to select a first flow rate in the control signal when the coolant level of the cooling equipment is less than a second threshold, and to select a first flow rate when the coolant level is between the second threshold and a third threshold (e.g., when the coolant level is between the second threshold and a third threshold). Figure 3 When the intermediate liquid level is shown and the equipment status information of the cooling equipment is idle, the input flow rate is selected as variable flow rate in the control signal; when the coolant level of the cooling equipment is between the second threshold and the third threshold, the coolant conductivity is lower than the first threshold, and the equipment status information of the cooling equipment is in operation, the input flow rate is selected as zero flow rate in the control signal; and when the coolant level is greater than the third threshold and the coolant conductivity is lower than the first threshold, the input flow rate is selected as zero flow rate in the control signal; wherein, the second threshold is less than the third threshold.

[0031] For example, the second threshold of this application indicates that the coolant content of the cooling equipment has reached the necessary level for normal operation, the third threshold indicates that the coolant content is at or above the healthy level, and the first flow rate is the maximum flow rate that can be used to avoid the coolant temperature fluctuation in the cooling equipment from exceeding the set safe range.

[0032] Here, the liquid level control module 110 of this application adopts a phased strategy, generating different liquid replenishment strategies based on the signal from the liquid level sensor and whether the vapor deposition chamber is in operation. When the coolant level is lower than the second threshold of the dangerous liquid level, a large flow rate is used to replenish the coolant until the minimum liquid level requirement is met (this function has high priority). After that, the flow rate of coolant is used to continue replenishing the coolant until the liquid level reaches or exceeds the healthy liquid level. While ensuring that no temperature fluctuations exceeding the acceptable threshold are generated, the coolant addition rate is maximized.

[0033] For example, the status collector can be a displacement sensor, actuation sensor, or temperature sensor that can collect the operating status of the vapor deposition chamber, or it can be a signal receiving device that is directly connected to the vapor deposition chamber host and can transmit the operating status of the vapor deposition chamber. The signal receiving device can be a wired device or a wireless communication device.

[0034] In some embodiments, see Figure 4-5 7-8, The execution system 200 includes: a switching valve 230 and a flow valve 210; the switching valve 230 has its inlet end connected to a first container for containing deionized water and a second container for containing dielectric coolant respectively, and its inlet end connected to the flow valve 210, and is configured to open the pipeline passage from the first container to the flow valve 210 or open the pipeline passage from the second container to the flow valve 210; the flow valve 210 has its inlet end connected to the outlet end of the switching valve 230, and its outlet connected to the coolant flow channel of the cooling equipment or the coolant storage container.

[0035] For example, the switching valve 230 of this application has two inlet channels and one outlet channel, one inlet channel is a first container channel and the other inlet channel is a second container channel, and the reversing valve 230 is capable of connecting one of the first container channel and the second container channel to the outlet channel.

[0036] For example, the switching valve 230 of this application is an electromagnetic two-position three-way directional valve. To illustrate the medium flow direction, the two medium inlets of the two-position three-way valve are respectively connected to the first container and the second container through pipelines, and the outlet is connected to the flow valve 210 through a pipeline. The flow valve 210 is an electromagnetically driven two-way valve with adjustable opening. In other words, the flow valve 210 is an electromagnetically driven valve that adjusts the flow channel diameter between the two openings of the flow valve 210211 based on the displacement, rotation and other actions of its internal valve core.

[0037] Here, this application adopts a technical solution of a three-way reversing valve based on electromagnetic drive plus flow valve 210 for regulation. The medium type of heat exchange medium can be switched and the supplementary flow rate of heat exchange medium can be regulated by the control signal of the control system 100. The structure is simple, reliable and easy to implement signal control.

[0038] In some embodiments, the flow valve 210 includes: a valve body and a valve core; the valve body, installed between the switching valve 230 and the cooling device, includes a valve body inlet and a valve body outlet, the valve body inlet pipe being connected to the switching valve 230 and the valve body outlet pipe being connected to the cooling device; the valve core, installed in the valve body, is configured to regulate the flow rate of the heat exchange medium delivered to the cooling device based on its relative position within the valve body.

[0039] For example, the main structures of the flow valve 210 in this application that regulate the flow rate of the heat exchange medium are the valve body and the valve core. In addition, the flow valve 210 also includes a valve cover, valve stem, seals, and an electromagnetic actuator to fully realize its flow regulation function. The valve core is installed in the cavity of the valve body of the flow valve 210. The valve core is fixedly connected to the valve stem, which is driven by the electromagnetic actuator, which is controlled by the control signal generated by the control system 100. The function of the valve core in this application is based on its own structural features. Driven by the valve stem, it rotates and slides within the valve body to change the spatial characteristics within the valve body, thereby changing the flow channel characteristics between the openings at both ends of the valve body, and ultimately regulating the flow rate of the heat exchange medium based on the equivalent diameter of the flow channel.

[0040] Here, the flow valve 210 of this application adopts a more classic valve core and valve body matching method, which is simple, reliable and easy to implement signal control.

[0041] In some embodiments, the execution system 200 further includes: a rotary actuator; the rotary actuator is communicatively connected to the control system 100 and configured to drive a valve core to rotate within the valve body based on a control signal; see reference Figure 4 , Figure 5 The flow valve 210 in this application is a ball valve. Figure 4 This indicates the high flow rate status of the ball valve. Figure 5 The slide gate valve is shown to be at a small opening. The valve core is rotatably mounted within the valve body and includes a first and second flow channel with different equivalent diameters. These are configured to, when rotated within the valve body, establish flow communication between the valve body inlet and outlet based on the first flow channel (e.g., ...). Figure 3 (as shown), or, based on the second flow channel, to achieve flow channel connection between the valve body inlet and the valve body outlet (as shown). Figure 4 (as shown), or, based on its own structure, it can achieve the closure of the flow channel between the valve body inlet and the valve body outlet.

[0042] For example, see Figure 6 , Figure 6 This illustration shows a valve body structure according to an embodiment of this application. The internal cavity of the valve body is spherical. The valve body is provided with a valve stem through-hole and two medium through-holes. The valve stem coaxially passes through the valve stem through-hole and is fixedly connected to the valve core, allowing the valve core to rotate coaxially. The two medium through-holes are coaxially arranged, with their central axes perpendicular to the central axis of the valve stem. The central axis of the medium through-holes passes through the center point of the spherical internal cavity. The main structure of the valve core is spherical with the same diameter as the internal cavity. The valve core has a first flow channel 211 and a second flow channel 212 with different equivalent diameters that penetrate the valve core. Both the first flow channel 211 and the second flow channel 212 are straight-flow channels with a circular axial cross-section. The central axes of both the first flow channel 211 and the second flow channel 212 pass through the center point of the internal cavity. Simultaneously, the central axes of both the first flow channel 211 and the second flow channel 212 are perpendicular to the central axis of the valve stem. There is a certain angle between the central axes of the first flow channel 211 and the second flow channel 212. When the valve stem is limited by the valve stem through hole and drives the valve core to rotate, the first flow channel 211 and the second flow channel 212 will be coaxial with the two medium through holes respectively, thereby forming a fluid channel between the two medium through holes. When neither the first flow channel 211 nor the second flow channel 212 is coaxial with the two medium through holes, the body of the valve core will block the channel between the two medium through holes.

[0043] For example, the two medium through-holes in this application have the same diameter, which is not less than the minimum flow channel requirement when conveying the heat exchange medium at a first flow rate. The diameter of the first flow channel 211 is used to convey the heat exchange medium at a first flow rate in accordance with a predetermined conveying pressure; the diameter of the second flow channel 212 is used to convey the heat exchange medium at a second flow rate in accordance with a predetermined conveying pressure. The flow control of the heat exchange medium is achieved through the structural apertures of the first flow channel 211 and the second flow channel 212. In the flow direction of the heat exchange medium, the heat exchange medium is slightly pressurized upstream of the flow valve 210 to achieve the flowability of the heat exchange medium. This pressurization can be achieved through liquid level difference or pumping, in order to facilitate flow control. For example, the equivalent diameter of the flow channel of the two-position three-way directional valve is larger than the aperture of the first flow channel 212, so as to avoid the failure of the liquid level difference (or booster pump), the three-way valve, and the flow valve 210 to control the flow of the heat exchange medium.

[0044] For example, the axial angle between the first flow channel 211 and the second flow channel 212 in this application is 90°. The angular stroke actuator in this application includes an angular stroke electric actuator with the output end connected to the valve stem, which can drive the valve stem to rotate by not less than 90°.

[0045] Here, the replenishment flow rate of the heat exchange medium in this application is two fixed quantities, namely the first flow rate and the second flow rate, which can reliably achieve controllable replenishment of the coolant and reduce the temperature fluctuation range of the coolant.

[0046] In some embodiments, the execution system 200 further includes: a stepper actuator; the stepper actuator is communicatively connected to the control system 100 and configured to drive the valve core to linearly displace within the valve body based on a control signal; wherein the valve core is slidably mounted within the valve body and is configured to adjust the equivalent diameter of the medium passage between the valve body inlet and the valve body outlet when linearly displaced within the valve body.

[0047] For example, see Figure 7 , Figure 8 The flow valve 210 in this application is a slide gate valve. Figure 7 The slide gate valve is shown to be at its maximum opening. Figure 8 The slide gate valve is shown in its small opening position. The slide gate valve includes a valve body, a valve stem, and a valve core. The valve body has a cylindrical cavity with openings at both axial ends, and the valve body has a valve core through-hole. The valve core slides within the through-hole perpendicular to the cavity's axial direction. This sliding motion creates a blocking surface within the cavity, adjusting the equivalent diameter of the flow channel between the openings at both ends of the valve body. The valve body has a valve stem through-hole, which is a threaded hole with its axial direction perpendicular to the cavity's axial direction. The valve stem is threaded into the valve stem through-hole and rotatably connects to the valve core after passing through it. When the valve stem rotates within the valve stem through-hole, axial displacement occurs between it and the through-hole, thereby causing the valve core to slide as described above.

[0048] For example, the stepper actuator of this application includes a stepper motor and a reducer. The shaft of the stepper motor is driven to the input end of the reducer, and the output end of the reducer is fixedly connected to the valve stem. Under the control of the control signal, the stepper motor generates a controllable angular displacement, which, after being reduced by the reducer, drives the valve core to generate a controllable linear displacement, thereby realizing the adjustment of the equivalent diameter of the medium channel of the slide gate valve. The flow control of the heat exchange medium is achieved through this equivalent diameter. In the flow direction of the heat exchange medium, the heat exchange medium is slightly pressurized upstream of the slide gate valve 210 to achieve the flowability of the heat exchange medium. This pressurization can be achieved through liquid level difference or pumping for easy flow control. For example, the equivalent diameter of the flow channel of the two-position three-way directional valve is larger than the orifice of the cylindrical cavity to avoid the failure of the liquid level difference (or booster pump), the three-way valve, and the slide gate valves 210 and 211 to control the flow of the heat exchange medium.

[0049] In some embodiments, see Figure 2 or Figure 3 The control system 100 also includes a flow control module 130; the flow control module 130 generates control signals for the switching valve 230 and the flow valve 210 based on the control signals from the liquid level control module 110 and the water resistance control module 120, so as to realize the control of the actuating device in the execution system 200.

[0050] In some embodiments, when the flow valve 210 is a slide gate valve, the replenishment flow rate needs to be adjusted in real time according to the amount of coolant in the cooling equipment. The control module stores a calculation formula in non-volatile memory. This calculation formula is obtained based on the inlet pressure and flow rate of deionized water, the inlet pressure and flow rate of dielectric coolant, the flow channel size of the switching valve 230, the flow channel range of the slide gate valve, and the control rules of the slide gate valve, so as to achieve the required flow rate by generating the control signal.

[0051] In one embodiment of this application, a fluid resuscitation method is provided, see reference. Figure 2 or Figure 3 The replenishment method is used to deliver a heat exchange medium to the cooling equipment of a vapor deposition chamber, including: obtaining the coolant conductivity and coolant quantity of the cooling equipment; when the coolant conductivity of the cooling equipment is greater than a first threshold: if the coolant quantity of the cooling equipment is less than a second threshold, delivering dielectric coolant to the cooling equipment at a first flow rate, or, if the coolant quantity of the cooling equipment is greater than the second threshold, delivering dielectric coolant to the cooling equipment at a second flow rate or a first variable flow rate; when the coolant conductivity of the cooling equipment is less than the first threshold: if the coolant quantity of the cooling equipment is less than the second threshold, delivering deionized water to the cooling equipment at a first flow rate, or, if the coolant quantity of the cooling equipment is greater than a third threshold, stopping the delivery of the heat exchange medium to the cooling equipment; wherein: the second threshold is less than the third threshold; the first flow rate is greater than the second flow rate; the maximum value of the first variable flow rate is equal to the first flow rate, and the minimum value of the first variable flow rate is equal to the first flow rate; when the coolant quantity is within the range of the second threshold to the third threshold, the magnitude of the first variable flow rate is linearly related to the coolant quantity of the cooling equipment.

[0052] Here, this application first considers the collected conductivity data of the coolant. When the conductivity is greater than a safety threshold (first threshold), dielectric coolant is immediately added to the cooling equipment. This process does not consider the existing coolant quantity in the cooling equipment. The flow rate of the added dielectric coolant is determined based on the following method: when the coolant quantity is less than a second threshold, the flow rate of the added dielectric coolant is a first flow rate; when the coolant quantity is greater than a second threshold but less than a third threshold, the flow rate of the added dielectric coolant is a second flow rate or the aforementioned first variable flow rate; when the coolant quantity is greater than a third threshold, the flow rate of the added dielectric coolant remains at the second flow rate.

[0053] This application, by eliminating the risk of coolant conductivity issues, replenishes the cooling equipment with deionized water at a high flow rate when the coolant level is too low, and stops replenishing deionized water when the coolant level is too high. This method of replenishing the heat transfer medium simultaneously controls both coolant conductivity and coolant quantity, and by employing different flow rate ranges for different coolant levels, it effectively replenishes coolant while minimizing temperature fluctuations.

[0054] In one embodiment of this application, the replenishment method further includes: obtaining the equipment status of the vapor deposition chamber; when the conductivity of the coolant is less than a first threshold: if the coolant level is greater than a second threshold and less than a third threshold, and the equipment status is idle, deionized water is supplied to the cooling equipment at a second flow rate or a second variable flow rate; or, if the coolant level is greater than the second threshold and less than the third threshold, and the equipment status is working, the supply of heat exchange medium to the cooling equipment is stopped; the maximum value of the second variable flow rate is equal to the first flow rate, and the minimum value of the first variable flow rate is zero flow rate; when the coolant level is within the range of the second threshold to the third threshold, the magnitude of the first variable flow rate is linearly related to the coolant level of the cooling equipment.

[0055] Here, this application uses a second flow rate, less than the first flow rate, to replenish deionized water when the liquid level is intermediate, or uses a second variable flow rate, with a maximum of the first flow rate and a minimum of zero flow rate, to replenish the heat transfer medium when the liquid level is intermediate. The magnitude of the second variable flow rate is linearly related to the coolant level, having a maximum value (first flow rate) when the coolant level is at a second threshold and a minimum value (zero flow rate) when the coolant level is at a third threshold. When the vapor deposition chamber is in operation, it is highly sensitive to temperature fluctuations. Therefore, this application considers the operating status information of the vapor deposition chamber equipment. If the coolant level is not below the second threshold that affects normal operation, replenishing deionized water when the vapor deposition chamber is idle or in standby mode can further avoid the impact of temperature fluctuations on the vapor deposition chamber.

[0056] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and scope of this application are included within the scope of protection of this application.

Claims

1. A fluid replenishment device, characterized in that, The replenishment device is used to supply heat exchange medium to the cooling equipment configured in the vapor deposition chamber; the replenishment device includes: a control system and an execution system; The control system is configured to determine the medium type of the heat exchange medium based on the coolant conductivity of the cooling equipment, and to determine the input flow rate of the heat exchange medium based on the coolant level and equipment status information of the cooling equipment, and to generate a control signal based on the obtained medium type and the input flow rate; wherein the medium type of the heat exchange medium includes deionized water and dielectric coolant; The execution system is configured to collect the conductivity of the coolant, collect the coolant quantity, collect the equipment status information, and control the valve group to deliver the heat exchange medium to the cooling equipment according to the control signal.

2. The fluid replenishment device according to claim 1, characterized in that, The control system includes a water resistance control module; the execution system includes a water resistance sensor. The water resistance sensor is installed on the cooling equipment and is configured to collect the conductivity of the coolant in the cooling equipment. The water resistance control module, which is communicatively connected to the water resistance sensor, is configured to select the medium type as deionized water in the control signal when the coolant conductivity of the cooling device is lower than a first threshold, and to select dielectric coolant in the control signal when the coolant conductivity is higher than the first threshold.

3. The fluid replenishment device according to claim 2, characterized in that, The control system further includes: a state collector and a liquid level control module; the execution system further includes a liquid level sensor; The liquid level sensor is installed on the cooling equipment and is configured to collect the coolant level of the cooling equipment. The status collector is installed on the cooling equipment and is configured to collect the equipment status information of the cooling equipment; The liquid level control module, communicatively connected to the liquid level sensor, is configured to: select a first flow rate in the control signal when the coolant level of the cooling device is less than a second threshold; select a second flow rate in the control signal when the coolant level is between the second and third thresholds and the device status information of the cooling device is idle; select zero flow rate in the control signal when the coolant level is between the second and third thresholds, the coolant conductivity is lower than the first threshold, and the device status information of the cooling device is running; and select zero flow rate in the control signal when the coolant level is greater than the third threshold and the coolant conductivity is lower than the first threshold; wherein the second threshold is less than the third threshold, and the first flow rate is greater than the second flow rate.

4. The fluid replenishment device according to claim 2, characterized in that, The control system further includes: a state collector and a liquid level control module; the execution system further includes a liquid level sensor; The liquid level sensor is installed on the cooling equipment and is configured to collect the coolant level of the cooling equipment. The status collector is installed on the cooling equipment and is configured to collect the equipment status information of the cooling equipment; The liquid level control module, communicatively connected to the liquid level sensor, is configured to: when the coolant level in the cooling device is less than a second threshold, select a first flow rate in the control signal; when the coolant level is between the second and third thresholds and the device status information of the cooling device is idle, select a variable flow rate in the control signal; when the coolant level is between the second and third thresholds, the coolant conductivity is lower than the first threshold, and the device status information of the cooling device is running, select zero flow rate in the control signal; and when the coolant level is greater than the third threshold and the coolant conductivity is lower than the first threshold, select zero flow rate in the control signal; wherein the second threshold is less than the third threshold.

5. The fluid replenishment device according to claim 1, characterized in that, The execution system includes: a switching valve and a flow valve; The switching valve has its inlet end connected to a first container for containing the deionized water and a second container for containing the dielectric coolant, respectively, and its inlet end connected to the flow valve. It is configured to either open the pipeline from the first container to the flow valve or open the pipeline from the second container to the flow valve. The inlet end of the flow valve is connected to the outlet end of the switching valve via a pipeline, and the outlet end is connected to the coolant flow channel of the cooling equipment or the coolant storage container via a pipeline.

6. The fluid replenishment device according to claim 5, characterized in that, The flow valve includes: a valve body and a valve core; The valve body is installed between the switching valve and the cooling device, and includes a valve body inlet and a valve body outlet. The valve body inlet pipe is connected to the switching valve, and the valve body outlet pipe is connected to the cooling device. The valve core, mounted in the valve body, is configured to regulate the flow rate of the heat exchange medium delivered to the cooling device based on its relative position within the valve body.

7. The fluid replenishment device according to claim 6, characterized in that, The execution system further includes: an angular stroke actuator; The angular stroke actuator is communicatively connected to the control system and is configured to drive the valve core to rotate within the valve body based on the control signal. The valve core is rotatably mounted in the valve body and includes a first flow channel and a second flow channel with equivalent diameters. It is configured to, when rotating in the valve body, achieve flow channel connection between the valve body inlet and the valve body outlet based on the first flow channel, or achieve flow channel connection between the valve body inlet and the valve body outlet based on the second flow channel, or achieve flow channel closure between the valve body inlet and the valve body outlet based on its own structure.

8. The fluid replenishment device according to claim 6, characterized in that, The execution system further includes: a stepper actuator; The stepper actuator is communicatively connected to the control system and is configured to drive the valve core to linearly displace within the valve body based on the control signal. The valve core is slidably mounted in the valve body and is configured to adjust the equivalent diameter of the medium channel between the valve body inlet and the valve body outlet when it is linearly displaced within the valve body.

9. A method for fluid replacement, characterized in that, The liquid replenishment method is used to deliver a heat exchange medium to the cooling equipment of the vapor deposition chamber, including: Obtain the coolant conductivity and coolant quantity of the cooling equipment; When the coolant conductivity of the cooling equipment is greater than a first threshold: If the coolant level in the cooling device is less than the second threshold, dielectric coolant is supplied to the cooling device at a first flow rate; or, if the coolant level in the cooling device is greater than the second threshold, dielectric coolant is supplied to the cooling device at a second flow rate or a first variable flow rate. When the coolant conductivity of the cooling device is less than a first threshold: If the coolant level in the cooling device is less than the second threshold, deionized water is supplied to the cooling device at a first flow rate; or, if the coolant level in the cooling device is greater than the third threshold, the supply of the heat exchange medium to the cooling device is stopped. Wherein: the second threshold is less than the third threshold; the first flow rate is greater than the second flow rate; the maximum value of the first variable flow rate is equal to the first flow rate, and the minimum value of the first variable flow rate is equal to the first flow rate; when the coolant inventory is within the range of the second threshold to the third threshold, the magnitude of the first variable flow rate is linearly related to the coolant inventory of the cooling equipment.

10. The fluid replacement method according to claim 9, characterized in that, The liquid replenishment method further includes: obtaining the equipment status of the vapor deposition chamber; When the conductivity of the coolant is less than a first threshold: If the coolant level is greater than the second threshold and less than the third threshold, and the equipment is in an idle state, deionized water is supplied to the cooling equipment at a second flow rate or a second variable flow rate; or, if the coolant level is greater than the second threshold and less than the third threshold, and the equipment is in an operating state, the supply of the heat exchange medium to the cooling equipment is stopped; the maximum value of the second variable flow rate is equal to the first flow rate, and the minimum value of the first variable flow rate is zero flow rate; when the coolant level is within the range of the second threshold to the third threshold, the magnitude of the first variable flow rate is linearly related to the coolant level of the cooling equipment.

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