Semiconductor fluidic component flow coefficient adjustment device

Abstract

This invention relates to the field of semiconductor manufacturing technology and discloses a flow coefficient adjustment device and a semiconductor flow control component. The device includes a housing and an operating rod. The housing has a channel with an open end and a through hole communicating with the channel. One end of the housing near the open end can be sealed to the air inlet of a pneumatic actuator. Gas is introduced through the through hole to drive the pneumatic actuator to perform on / off actions. The operating rod is placed inside the channel, with both ends extending through the channel. One end of the operating rod extends from the open end to an operating end located outside the housing. The operating rod is telescopically movable relative to the housing, allowing the operating end to be inserted into the pneumatic actuator and matched with a flow regulating nut. The operating rod can rotate around its own axis to synchronously rotate the flow regulating nut, thereby achieving flow regulation. This embodiment of the semiconductor flow control component flow coefficient adjustment device allows for simultaneous adjustment and testing, improving adjustment convenience.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, and specifically relates to a flow coefficient adjustment device for semiconductor flow control components. Background Technology

[0002] In semiconductor vapor deposition processes, specialized process diaphragm valves are required to control the flow rate of process gases. Therefore, precise control of the valve's flow coefficient is essential to regulate the quality of the gas flowing through it. In actual production, due to factors such as tolerances and diaphragm deformation, the flow coefficient of each valve cannot be guaranteed to be completely consistent. Therefore, after assembly, the valve's flow coefficient needs to be adjusted using adjusting screws. By adjusting the position of the adjusting nut, the valve opening is controlled, thus setting the flow coefficient. In related technologies, process valves commonly used in vapor deposition processes often have the adjusting nut located inside the vent for sealing and compactness considerations. This means that adjusting and measuring the flow coefficient cannot be performed simultaneously, making adjustment difficult and generally requiring multiple adjustments and tests. Summary of the Invention

[0003] This invention aims to at least partially solve one of the technical problems in related technologies. To this end, embodiments of this invention propose a flow coefficient adjustment device for semiconductor flow control components. This device can utilize existing vents to achieve simultaneous adjustment and testing, eliminating the need for repeated disassembly and reassembly of the adjustment device, simplifying the adjustment steps, improving adjustment speed and accuracy, and achieving accurate single-step adjustment.

[0004] This invention discloses a semiconductor flow control component flow coefficient adjustment device for adjusting the flow rate of a semiconductor flow control component. The semiconductor flow control component includes a valve body with a medium inlet / outlet channel, a valve cover securely connected to the valve body, a diaphragm sandwiched between the valve body and the valve cover for sealing the medium flowing within the valve body and for controlling the flow of the medium, and a pneumatic actuator positioned above the valve cover and applying the force required for the on / off control towards the diaphragm. The pneumatic actuator, from top to bottom, includes an air inlet, a flow adjustment nut, and a piston assembly. One end of the piston assembly extends into the valve body and acts above the diaphragm. The actuator includes a housing and an operating rod. The housing has a channel, one end of which communicates with the outside of the housing to form a... At the open end, the side wall of the housing has a through hole communicating with the channel. The end of the housing near the open end can be sealed to the air inlet of the pneumatic actuator to allow gas to be introduced into the pneumatic actuator through the through hole and the channel, further driving the piston assembly to actuate the diaphragm to perform fluid on / off control. The operating rod is placed in the channel, with both ends extending through the channel. One end of the operating rod extends from the open end to the operating end located outside the housing. The operating rod is telescopically movable relative to the housing so that the operating end can be inserted into the pneumatic actuator and matched with the flow regulating nut. The operating rod can rotate around its own axis to drive the flow regulating nut to rotate synchronously, thereby achieving flow regulation.

[0005] The semiconductor flow control component flow coefficient adjustment device of this invention can adjust the flow coefficient without repeated disassembly, simplifying the on-site adjustment process and avoiding problems such as large workload and inaccurate adjustment caused by repeated disassembly. Adjustment and testing are performed simultaneously, improving adjustment efficiency and effectiveness.

[0006] In some embodiments, the semiconductor flow control component flow coefficient adjustment device further includes a sealing component, which is sleeved on the operating rod and disposed at a preset position at the other end of the channel away from the opening end, for sealing the gap between the operating rod and the housing, so as to form a sealed gas delivery passage between the through hole and the opening end.

[0007] In some embodiments, the housing further includes a first chamber and a first sleeve. The first chamber is connected to the other end of the channel. The other end of the operating rod extends out of the first chamber to the outside. The sealing member is disposed at the bottom of the first chamber. The first sleeve is fitted onto the operating rod and fastened within the first chamber to press the sealing member.

[0008] In some embodiments, the semiconductor flow control component flow coefficient adjustment device further includes a handle connected to the other end of the operating rod away from the operating end and located outside the housing, for driving the operating rod to rotate relative to the housing, thereby driving the flow adjustment nut to rotate synchronously to achieve flow adjustment.

[0009] In some embodiments, the semiconductor flow control component flow coefficient adjustment device further includes a second sleeve, which is sleeved on the operating rod and at least one end is located outside the housing. The side wall of the second sleeve is provided with a threaded hole, and the operating rod is provided with a positioning groove at a position corresponding to the threaded hole. The front end of the handle is provided with a positioning part that matches the positioning groove. The handle is fastened in the threaded hole and the positioning part is matched and connected with the positioning groove, thereby realizing a detachable fixed connection between the handle and the operating rod through the second sleeve.

[0010] In some embodiments, the semiconductor flow control component flow coefficient adjustment device further includes a limiting component and a second chamber, the second chamber being disposed within the housing and communicating above the first chamber, the limiting component being disposed within the second chamber, and the limiting component being used to limit the rotation of the operating lever.

[0011] In some embodiments, the limiting component includes a first limiting member and a second limiting member. The first limiting member is disposed on the side wall of the second chamber, and the second limiting member is disposed on the outer peripheral surface of one end of the second sleeve located inside the second chamber. The second limiting member abuts against the first limiting member to limit the rotation angle of the operating lever.

[0012] In some embodiments, at least two first limiting members are provided, and the first limiting members and the second limiting members are spaced apart from each other to limit the rotation angle of the operating lever.

[0013] In some embodiments, the diameter of the second chamber is greater than the diameter of the first chamber, and the depth of the second chamber is greater than the thickness of the second limiting member, so that an upper limiting surface and a lower limiting surface are formed between the top and bottom surfaces of the second chamber. When the operating rod moves telescopically relative to the housing, the telescopic movement stroke of the operating rod is limited by the abutment of the upper limiting surface and the lower limiting surface with the second limiting member.

[0014] In some embodiments, the housing includes a lower shell and an upper cover, the lower shell and the upper cover being detachably connected, and a second chamber being formed between the lower shell and the upper cover.

[0015] In some embodiments, a scale is provided on the outer wall surface of the housing, and pointer marks corresponding to the scale are provided on the outer peripheral surface of the operating lever.

[0016] The semiconductor flow control component flow coefficient adjustment device of this invention avoids gas pressure loss through a sealing component and a first sleeve, and facilitates the installation of the sealing component. The handle and limit assembly prevent damage from excessive component movement and simplifies manual adjustment. The split housing enables rapid assembly and maintenance, and the dial provides visualized, high-precision adjustment control. The overall structure is compatible with existing standard pneumatic actuators, balancing adjustment accuracy and ease of operation. Attached Figure Description

[0017] Figure 1 This is a first-view perspective perspective view of the present invention.

[0018] Figure 2 This is a perspective view of the invention from a second angle.

[0019] Figure 3 This is the front view of the present invention.

[0020] Figure 4 yes Figure 3 Sectional view of AA.

[0021] Figure 5 This is a perspective view of the lower shell of the present invention.

[0022] Figure 6 This is a perspective view of the first sleeve of the present invention.

[0023] Figure 7 This is a perspective view of the top cover of the present invention.

[0024] Figure 8 This is a perspective view of the second sleeve of the present invention.

[0025] Figure 9 This is a perspective view of the operating lever of the present invention.

[0026] Figure 10 This is a schematic diagram of a semiconductor flow control component according to an embodiment of the present invention.

[0027] Figure label:

[0028] 1. Shell; 11. Channel; 12. Opening end; 13. Through hole; 14. First chamber; 15. Second chamber; 16. Dial; 2. Operating lever; 21. Operating end; 22. Positioning slot; 3. Sealing components; 4. First sleeve; 5. Limiting component; 51. First limiting element; 53. Second limiting element; 6. Handle; 7. Pneumatic actuator; 71. Air vent; 72. Adjusting nut; 73. Piston assembly; 8. Diaphragm; 9. Second sleeve; 91. Threaded hole; 92. Pointer mark. Detailed Implementation

[0029] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0030] like Figures 1-10 As shown, the semiconductor flow control component flow coefficient adjustment device of this embodiment of the invention is used to adjust the flow rate of the semiconductor flow control component.

[0031] Specifically, such as Figure 10 As shown, the semiconductor flow control component includes a valve body (not shown) with a medium inlet and outlet channel, a valve cover (not shown) fastened to the valve body, a diaphragm 8 sandwiched between the valve body and the valve cover for sealing the medium flowing inside the valve body and for controlling the flow of the medium, and a pneumatic actuator 7 located above the valve cover and applying the force required for the on / off control to the diaphragm 8. The pneumatic actuator 7 has an air inlet 71, a flow regulating nut 72, and a piston assembly 73 arranged from top to bottom. One end of the piston assembly 73 extends into the valve body and acts above the diaphragm 8. Gas is introduced through the air inlet 71 to drive the piston assembly 73 to move, generating a corresponding force on the diaphragm 8, causing the diaphragm 8 to deform, thereby sealing or separating from the valve seat, realizing fluid on / off control (i.e., opening or closing the medium channel inside the semiconductor flow control component).

[0032] like Figures 1-9 As shown, the flow coefficient adjustment device for semiconductor flow control components includes a housing 1 and an operating rod 2. The housing 1 has a channel 11 inside, one end of which communicates with the outside of the housing 1 to form an open end 12. The side wall of the housing 1 is provided with a through hole 13 communicating with the channel 11. The end of the housing 1 near the open end 12 can be sealed to the air inlet 71 of the pneumatic actuator 7 to allow gas to be introduced into the pneumatic actuator 7 through the through hole 13 and the channel 11, further driving the piston assembly 73 to actuate the diaphragm 8 to perform fluid on / off control action. The operating rod 2 is placed inside the channel 11, with both ends extending through the channel 11. One end of the operating rod 2 extends from the open end 12 to the operating end 21 located outside the housing 1. The operating rod 2 is telescopically movable relative to the housing 1 so that the operating end 21 can be inserted into the pneumatic actuator 7 and matched with the flow regulating nut 72. The operating rod 2 can rotate around its own axis to drive the flow regulating nut 72 to rotate synchronously, thereby realizing flow regulation.

[0033] The flow coefficient adjustment device for the semiconductor flow control component in this embodiment achieves a sealed connection between the housing 1 and the pneumatic actuator 7 of the semiconductor flow control component. On one hand, gas can be introduced into the semiconductor flow control component to perform fluid on / off control. On the other hand, by pressing, the operating rod 2 extends relative to the housing 1 and engages with the flow adjustment nut 72 inside the pneumatic actuator 7. Further rotation of the operating rod 2 drives the flow adjustment nut 72 to rotate synchronously, thereby adjusting the flow coefficient of the semiconductor flow control component. In other words, the flow coefficient adjustment device of this embodiment enables simultaneous air supply and flow adjustment actions of the pneumatic actuator of the semiconductor flow control component, simplifying the existing flow adjustment process. It eliminates the need for separate air supply and adjustment actions, improving the convenience and efficiency of flow adjustment.

[0034] The flow coefficient adjustment device for semiconductor flow control components mainly includes a housing 1 and an operating lever 2. The housing 1 has a channel 11 machined inside, running axially (vertically) along the operating lever 2. One end of the channel 11 communicates with the outside of the housing 1, forming an open end 12 (lower end). A through hole 13 communicating with the inside of the channel 11 is provided on the side wall of the housing 1. The end of the housing 1 near the open end 12 can be sealed to the air vent 71 of the pneumatic actuator 7. Typically, an external thread is machined on the outer circumferential surface of the open end 12, which connects to the internal thread on the inner wall of the air vent 71.

[0035] After connection, the through hole 13 can communicate with the internal air passage of the pneumatic actuator 7 through the channel 11. That is, the gas acts on the piston assembly 73 along the path of through hole 13-channel 11-open end 12-vent 71. The pressure of the gas causes the piston assembly 73 to move downward, thereby driving the diaphragm 8 to perform the on / off control action of the fluid. Taking a normally closed diaphragm pneumatic valve as an example, after gas is introduced, the piston assembly 73 moves upward under the action of gas pressure, overcoming its internal elastic force. That is, the piston assembly 73 disengages from the diaphragm 8. At this time, the central area of ​​the diaphragm 8 deforms upward and moves away from the valve seat below it. The medium inlet and outlet passage in the valve body becomes open, so the actual flow rate of the valve body can be tested and the flow coefficient can be adjusted.

[0036] The operating lever 2 is entirely inserted into the channel 11 of the housing 1, with both ends of the operating lever 2 passing through both ends of the channel 11. The end of the operating lever 2 facing the pneumatic actuator 7 is the operating end 21, which protrudes from the opening end 12 of the housing 1 and is located outside the housing 1. The operating lever 2 can extend and retract relative to the housing 1 along the axial direction of the operating lever 2.

[0037] When flow coefficient adjustment is required, first connect housing 1 and pneumatic actuator 7. Then, push operating rod 2 downwards (towards pneumatic actuator 7) to insert operating end 21 into pneumatic actuator 7 and form a mating connection with flow regulating nut 72. The flow regulating nut 72 can then be adjusted via operating rod 2 to regulate the valve body flow coefficient. The specific shape of operating end 21 can be customized as needed, for example, as a hexagonal prism structure that matches the flow regulating nut 72, achieving a screwdriver-nut-like connection.

[0038] Specifically, since the operating lever 2 can also rotate around its own axis, during the rotation, the flow regulating nut 72 is driven to rotate synchronously through the hexagonal prism structure of the operating end 21. By changing the engagement position of the flow regulating nut 72, the movable position space of the piston assembly 73 is adjusted, thereby changing the maximum opening degree of the diaphragm 8, and finally realizing the adjustment of the flow coefficient of the semiconductor flow control component.

[0039] Furthermore, it is understandable that the portion of the operating lever 2 located inside the channel 11 has a clearance fit between its outer circumference and the inner wall of the channel 11. This facilitates the rotation and vertical movement of the operating lever 2, serving as a guide; additionally, gas can flow through the gap between them. Therefore, before, during, or after adjustment, gas can always act on the piston assembly 71, allowing adjustment and testing actions to be performed simultaneously through the vent. That is, while maintaining continuous ventilation, the actual flow rate of the medium within the valve body can be observed in real time. Based on the flow feedback, the rotation angle of the operating lever 2 can be fine-tuned until the medium flow rate reaches the target value, significantly improving the convenience, accuracy, and efficiency of adjustment.

[0040] In this embodiment, the other end of the operating lever 2, away from the operating end 21, can be driven and positioned as needed. For example, the other end of the operating lever 2 can be placed directly inside the housing 1, effectively preventing gas leakage from areas outside the opening end 12. The operation of the operating lever 2 is achieved by a corresponding driving component built into the housing 1. The driving component can be manual or electric. When an electric driving component is used, remote operation can also be achieved. Alternatively, the other end of the operating lever 2 can pass through the housing 1 and be placed outside the housing 1, allowing for direct manual operation or operation with the aid of tools. Of course, to prevent gas leakage caused by the operating lever 2 passing through the housing 1, a sealing element can be added.

[0041] In some embodiments, the flow coefficient adjustment device for semiconductor flow control components further includes a sealing component 3, which is sleeved on the operating rod 2 and located at a preset position in the channel 11 away from the opening end 12, for sealing the gap between the operating rod 2 and the housing 1, so that a sealed gas delivery passage is formed between the through hole 13 and the opening end 12.

[0042] The semiconductor flow control component flow coefficient adjustment device of this embodiment, by adding a sealing component 3, can effectively prevent gas from overflowing from the other end of the channel 11, thus ensuring gas pressure. At the same time, it does not affect the extension, retraction, and rotation of the operating lever 2.

[0043] Specifically, the sealing component 3 is entirely fitted onto the outer circumferential surface of the operating rod 2 and installed at a preset position at the other end of the channel 11 away from the opening end 12. The preset position is located above the through hole 13, thereby ensuring that all gas entering the channel 11 through the through hole 13 flows out through the opening end 12. The inner circumferential surface of the sealing component 3 is tightly fitted with the outer circumferential surface of the operating rod 2, and the outer circumferential surface of the sealing component 3 is tightly fitted with the inner wall of the channel 11. After the sealing component 3 is installed, it can adapt to the extension, retraction, and rotation of the operating rod 2, ensuring a sealing effect without hindering the normal movement and rotation of the operating rod 2.

[0044] In some embodiments, the housing 1 is further provided with a first chamber 14 and a first sleeve 4. The first chamber 14 is connected to the other end of the channel 11. The other end of the operating rod 2 extends out of the first chamber 14 to the outside. The sealing member 3 is disposed at the bottom of the first chamber 14. The first sleeve 4 is sleeved on the operating rod 2 and fastened in the first chamber 14 to press the sealing member 3.

[0045] In this embodiment, by setting the first chamber 14 and the first sleeve 4, the sealing component 3 can be stably installed, preventing the sealing component 3 from shifting when the operating rod 2 is repeatedly moved, and the sealing performance of the sealing component 3 can be further improved by pressing the sealing component 3 from above.

[0046] Specifically, the first chamber 14 is connected to the other end (upper end) of the channel 11, and the other end (upper end) of the operating lever 2 extends from the first chamber 14 to the outside of the housing 1. The sealing component 3 is disposed at the bottom of the first chamber 14, that is, at the connection between the first chamber 14 and the channel 11, and an installation groove can be provided at the bottom of the first chamber 14 as needed to install the sealing component 3.

[0047] The first sleeve 4 is fitted onto the operating rod 2 and secured within the first chamber 14. Typically, the outer circumferential surface of the first sleeve 4 and the inner wall of the first chamber 14 are threaded together. After installation, the lower end face of the first sleeve 4 tightly abuts against the upper end face of the sealing component 3, pressing and fixing the sealing component 3 between the bottom of the first chamber 14 and the first sleeve 4, preventing displacement of the sealing component 3. Furthermore, the cross-section of the middle portion of the operating rod 2 is typically circular, and the sealing component 3 uses an annular sealing ring to ensure a tight seal during extension, retraction, and rotation of the operating rod 2.

[0048] In some specific embodiments, the first chamber 14 is divided into upper and lower parts. The inner diameter of the upper first part is larger than that of the lower second part, and the inner wall of the upper first part is provided with internal threads. Correspondingly, the first sleeve 4 is also configured as upper and lower parts that cooperate with the first chamber 14, and the outer circumferential surface of the upper part of the first sleeve 4 is provided with external threads. This structural design, with a smaller lower end and a larger upper end, allows for quick installation of the first sleeve 4, reducing the number of turns required for threaded connections. It also provides auxiliary limiting of the tightening angle.

[0049] In some specific embodiments, the diameter of the upper end of the operating rod 2 is larger than the diameter of the lower end to prevent the operating rod 2 from passing completely through the first sleeve 4 from top to bottom. In addition, the diameter of the inner central hole of the second sleeve 9 is such that its inner wall surface near the through hole 13 is in clearance fit with the operating rod 2, while its diameter in the remaining part can be much larger than the maximum diameter of the operating rod 2 to reduce the weight of the second sleeve 9.

[0050] In some embodiments, the flow coefficient adjustment device for semiconductor flow control components further includes a handle 6, which is connected to the other end of the operating lever 2 away from the operating end 21 and located outside the housing 1. The handle 6 is used to drive the operating lever 2 to rotate relative to the housing 1, thereby driving the flow adjustment nut 72 to rotate synchronously to achieve flow adjustment.

[0051] In this embodiment, the handle 6 is connected to the other end of the operating lever 2 away from the operating end 21 and is located outside the housing 1. The handle 6 is typically positioned perpendicular to the operating lever 2 and is either fixedly or detachably connected to it. The operator can press down on the operating lever 2 using the handle 6, or directly press the operating lever 2 to achieve the engagement connection between the operating end 21 and the flow regulating nut 72. Subsequently, by holding the handle 6 and applying a rotational force, the operating lever 2 is driven to rotate relative to the housing 1. The handle 6 avoids slippage that occurs when directly holding the operating lever 2 for rotation, while also extending the lever arm and reducing the force required for adjustment.

[0052] In some embodiments, the flow coefficient adjustment device for semiconductor flow control components further includes a second sleeve 9, which is sleeved on the operating rod 2 and at least one end is located outside the housing 1. The side wall of the second sleeve 9 is provided with a threaded hole 91. The operating rod 2 is provided with a positioning groove 22 at a position corresponding to the threaded hole 91. The front end of the handle 6 is provided with a positioning part that matches the positioning groove 22. The handle 6 is fastened in the threaded hole 91 and the positioning part is matched and connected with the positioning groove 22, so as to realize the detachable fixed connection between the handle 6 and the operating rod 2 through the second sleeve 9.

[0053] In this embodiment, the second sleeve 9 and the positioning fit structure enable the handle 6 and the operating rod 2 to be detachably and fixedly connected, which facilitates the replacement of the handle 6 and effectively prevents circumferential relative sliding between the handle 6 and the operating rod 2, thus ensuring the stable transmission of rotational torque.

[0054] Specifically, the second sleeve 9 is fitted onto the operating rod 2, with at least one end located outside the housing 1. Typically, the upper end of the second sleeve 9 is located outside the housing 1, and the lower end is located inside the housing 1. The outer circumferential surface of the second sleeve 9 and the housing 1 are in clearance fit.

[0055] The second sleeve 9 has a threaded hole 91 on its side wall. The threaded hole 91 is located outside the housing 1 and extends radially along the second sleeve 9. The inner end of the threaded hole 91 communicates with the internal center hole of the second sleeve 9. A positioning groove 22 is provided near the upper part of the operating lever 2, specifically at the position corresponding to the threaded hole. One end (e.g., the front end) of the handle 6 can be inserted into the threaded hole 91 and placed in the positioning groove 22, thus achieving a detachable connection between the handle 6, the second sleeve 9, and the operating lever 2. Specifically, the front end of the handle 6 has a positioning part that matches the positioning groove 22. The outer circumferential surface of the handle 6 is threaded into the threaded hole 91. By screwing, the positioning part at the front end of the handle 6 passes through the threaded hole 91 and abuts against the positioning groove 22. The shape and contour of the positioning part match the positioning groove 22, for example, it is conical or hemispherical, to prevent the handle 6 and the operating lever 2 from wobbling in the vertical direction after installation.

[0056] In addition, although the operating lever 2 can drive the second sleeve 9 to rotate synchronously through the handle 6, in order to further enhance the connection and fit between the two, the upper end of the operating lever 2 can be set as a hexagonal prism structure, and the inner wall surface of the vertical center hole of the second sleeve 9 is a hexahedral structure, so that the operating lever 2 can achieve synchronous rotation in the direction of rotation by means of the hexagonal prism structure and the hexahedral structure.

[0057] In some specific embodiments, the second sleeve 9 is divided into an upper part and a lower part. The upper part penetrates the housing 1 and is located outside the housing 1. The upper part has a hexagonal prism structure, which facilitates the use of tools such as wrenches to further assist the rotation of the second sleeve 9, and also facilitates the machining of a threaded hole 91 on one of the six faces. The lower part is located inside the housing 1, and the diameter of the lower part is larger than that of the upper part, which can prevent the second sleeve 9 from coming out from the top of the housing 1. The lower part is usually a cylinder and corresponds to the position that penetrates the housing 1, so that the second sleeve 9 can rotate relative to the housing 1 when it rotates synchronously with the operating rod 2.

[0058] In some embodiments, the semiconductor flow control component flow coefficient adjustment device further includes a limiting component 5 and a second chamber 15. The second chamber 15 is disposed within the housing 1 and communicates with the upper part of the first chamber 14. The limiting component 5 is disposed within the second chamber 15 and is used to limit the rotation of the operating lever 2.

[0059] Preferably, the limiting component 5 includes a first limiting member 51 and a second limiting member 53. The first limiting member 51 is disposed on the side wall of the second chamber 15, and the second limiting member 53 is disposed on the outer peripheral surface of one end of the second sleeve 9 located inside the second chamber 15. The second limiting member 53 abuts against the first limiting member 51 to limit the rotation angle of the operating lever 2.

[0060] Preferably, there are at least two first limiting members 51, and the first limiting members 51 and the second limiting members 53 are spaced apart from each other to limit the rotation angle of the operating lever 2.

[0061] Preferably, the diameter of the second chamber 15 is greater than the diameter of the first chamber 14, and the depth of the second chamber 15 is greater than the thickness of the second limiting member 53, so that an upper limiting surface and a lower limiting surface are formed between the top and bottom surfaces of the second chamber 15. When the operating rod 2 moves telescopically relative to the housing 1, the telescopic movement stroke of the operating rod 2 is limited by the upper limiting surface and the lower limiting surface abutting against the second limiting member 53.

[0062] The semiconductor flow control component flow coefficient adjustment device of this embodiment, by setting the second chamber 15 and the limiting component 5, can simultaneously realize the rotation angle limit and the extension and retraction stroke limit of the operating lever 2, prevent the operating lever 2 from rotating excessively or extending excessively, and at the same time ensure that the flow adjustment range is controllable, thereby improving the safety and adjustment stability of the device.

[0063] Specifically, the second chamber 15 is located within the housing 1 and communicates with the upper part of the first chamber 14. The limiting assembly 5 is entirely located within the second chamber 15. The first limiting member 51 is located on the inner wall of the second chamber 15 and typically extends towards the center of the second chamber 15. Simultaneously, the lower end of the second sleeve 9 is placed within the second chamber 15, and the second limiting member 53 is fixed to the outer circumferential surface of the second sleeve 9 located within the second chamber 15, extending towards the inner wall of the second chamber 15. Therefore, when the operating lever 2 rotates the second sleeve 9, it simultaneously rotates the second limiting member 53. When the second limiting member 53 abuts against the first limiting member 51, the operating lever 2 cannot continue to rotate in that direction, thereby limiting the rotation angle of the operating lever 2.

[0064] Furthermore, the number of the first limiting member 51 and the second limiting member 53 is set according to the angle required for limiting. For example, there may be two first limiting members 51 and one second limiting member 53 positioned between the two first limiting members 51. Alternatively, there may be two first limiting members 51 and two second limiting members 53, spaced apart from each other and arranged symmetrically, further enhancing the stability of the limiting.

[0065] The specific limiting of the vertical movement of the operating lever 2 is as follows: the diameter of the second chamber 15 is larger than the diameter of the first chamber 14, and the depth of the second chamber 15 is greater than the thickness of the second limiting member 53, so that an upper limiting surface and a lower limiting surface are formed between the top and bottom surfaces of the second chamber 15, respectively. When the operating lever 2 moves telescopically relative to the housing 1, the second limiting member 53 moves up and down within the second chamber 15 along with the second sleeve 9. When the second limiting member 53 abuts against the upper limiting surface, the operating lever 2 cannot continue to retract away from the pneumatic actuator 7; when the second limiting member 53 abuts against the lower limiting surface, the operating lever 2 cannot continue to extend towards the pneumatic actuator 7, thereby limiting the telescopic movement stroke of the operating lever 2. The position of the operating lever 2 can be flexibly adjusted according to the actual flow adjustment needs. When the flow needs to be adjusted, the operating lever 2 is pressed to drive its operating end 21 to match and connect with the flow adjustment nut 72. When the flow does not need to be adjusted, the operating lever 2 is retracted to separate it from the flow adjustment nut 72 to avoid misoperation.

[0066] In some embodiments, a scale 16 is provided on the outer wall surface of the housing 1, and a pointer mark 92 corresponding to the scale 16 is provided on the outer peripheral surface of the operating lever 2. The scale 16 is provided on the outer wall surface of the housing 1, and the scale 16 has rotation angle markings distributed circumferentially. According to the current flow rate of the semiconductor flow control component, the displacement of the flow regulating nut 72 is obtained through the rotation angle markings, thereby achieving precise adjustment and improving adjustment efficiency.

[0067] Correspondingly, the outer circumference of the operating lever 2 is provided with a pointer mark 92 corresponding to the scale 16, and the pointer mark 92 rotates synchronously with the operating lever 2. When adjusting the flow coefficient, the operator can intuitively obtain the rotation angle of the operating lever 2 by observing the corresponding position of the pointer mark 92 on the scale 16, thereby obtaining the corresponding adjustment amount of the flow coefficient of the semiconductor flow control component, and can compare it with the final measured flow coefficient, reducing the number of times the medium flow rate needs to be measured repeatedly and improving the adjustment efficiency.

[0068] It is also understandable that this is done to facilitate observation of the scale and to maximize the adjustment of the forward and reverse rotation angles. In a preferred embodiment, the rotation angle markings on the dial 16 range from -60° to 60°, and when the pointer mark 92 points to 0°, either of the second limiting members 53 is in the middle position between two adjacent first limiting members 51. When the operating lever 2 is installed, the pointer mark 92 is kept pointing to 0°.

[0069] In some embodiments, the housing 1 includes a lower housing and an upper cover, which are detachably connected, and a second chamber 15 is formed between the lower housing and the upper cover.

[0070] In some specific embodiments, the lower part of the lower shell is a prism structure extending vertically. A channel 11 is formed along the vertical direction, corresponding to the interior of the prism structure. A through hole 13 is formed along one side of the prism structure, facilitating the machining of the through hole 13 and extending the length of the channel 11 to guide the operating rod 2. Alternatively, the lower end of the prism structure can be made into a cylindrical structure with external threads, forming a bolt-like structure for easy threaded connection with the vent 71. Finally, if the connection between the lower shell and the vent 71 becomes jammed, a wrench or other tools can be used to hold it on the outer circumference of the prism structure for auxiliary installation.

[0071] This embodiment enables rapid installation and removal of various components. Specifically, the housing 1 includes a lower shell and an upper cover, which are detachably connected (usually by bolts), forming a second chamber 15 between them. A portion of the second chamber 15 may be located in the lower shell, and another portion in the upper cover. The first limiting member 51 may be located in the lower shell. Preferably, the first limiting member 51 is disposed on the inner wall of the upper cover, which allows the first limiting member 51 to extend further toward the operating rod 2 without hindering the installation of the first sleeve 4.

[0072] One specific assembly sequence is given below: Step 1: Fit the sealing component 3 onto the operating rod 2, and insert the operating rod 2 into the channel 11. At the same time, the operating rod 2 will drive the sealing component 3 to be placed at the bottom of the first chamber 14.

[0073] Step 2: Install the first sleeve 4, which is usually installed in the first chamber 14 via a threaded connection.

[0074] The third step is to fit the second sleeve 9 onto the upper end of the operating lever 2.

[0075] The fourth step is to fasten the top cover to the bottom shell and connect them with bolts.

[0076] Fifth step, slightly pull the second sleeve 9 upward or move the operating lever 2 downward so that the positioning groove 22 on the operating lever 2 is aligned with the threaded hole 91 on the second sleeve 9, and finally tighten the handle 6 to achieve a fixed connection between the second sleeve 9, the operating lever 2 and the handle 6.

[0077] Furthermore, the specific flow regulation process of the flow coefficient regulating device for the semiconductor flow control component in this embodiment is as follows: 1. Connect the semiconductor flow control component to the flow coefficient testing platform; 2. By rotating the housing 1 clockwise through the external thread at its end, it is installed inside the vent 71 of the semiconductor flow control component; 3. Working gas is introduced through the through hole 13 on the side of the housing 1; 4. Turn on the flow coefficient testing platform and take readings; 5. Rotate and press down the handle 6 until you feel the operating lever 2 insert into the flow regulating nut 72 inside the semiconductor flow control component; 6. Adjust the operating lever 2 to a certain angle or adjust it to the specified flow rate as needed; 7. After adjustment, lift handle 6 to separate operating lever 2 from flow regulating nut 72; 8. Disconnect the working gas and rotate housing 1 counterclockwise to separate the flow coefficient regulating device from the semiconductor flow control component; 9. Remove the semiconductor flow control component from the flow test platform and complete the flow adjustment operation.

[0078] In addition, the flow coefficient adjustment device of the semiconductor flow control component in this embodiment can be directly adapted and connected to the air port 71 of the existing standard pneumatic actuator 7 as an independent module, without the need to modify the original valve body, valve cover and main structure of the pneumatic actuator 7, and the valve body to which it is adapted is wide-ranging.

[0079] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0080] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0081] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0082] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0083] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0084] Although the above embodiments have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.

Claims

1. A flow coefficient regulating device for a semiconductor flow control component, used to regulate the flow rate of the semiconductor flow control component, the semiconductor flow control component comprising a valve body having a medium inlet / outlet channel, a valve cover fastened to the valve body, a diaphragm sandwiched between the valve body and the valve cover for sealing the medium flowing within the valve body and for controlling the flow of the medium, and a pneumatic actuator disposed above the valve cover and applying the force required for the on / off control towards the diaphragm, the pneumatic actuator comprising, from top to bottom, an air inlet, a flow regulating nut, and a piston assembly, one end of the piston assembly extending into the valve body and acting above the diaphragm, characterized in that, include: The housing has a channel inside, one end of which communicates with the outside of the housing to form an open end. The side wall of the housing is provided with a through hole communicating with the channel. The end of the housing near the open end can be sealed to the air port of the pneumatic actuator so that gas can be introduced into the pneumatic actuator through the through hole and the channel, further driving the piston assembly to actuate the diaphragm to perform fluid on / off control action. An operating lever is placed inside the channel, with both ends extending through the channel. One end of the operating lever extends from the open end to an operating end located outside the housing. The operating lever is telescopically movable relative to the housing so that the operating end can be inserted into the pneumatic actuator and matched with the flow regulating nut. The operating lever can rotate around its own axis to drive the flow regulating nut to rotate synchronously, thereby achieving flow regulation.

2. The semiconductor flow control component flow coefficient adjustment device according to claim 1, characterized in that, It also includes a sealing component, which is sleeved on the operating rod and located at a preset position at the other end of the channel away from the opening end, for sealing the gap between the operating rod and the housing, so that a sealed gas delivery passage is formed between the through hole and the opening end.

3. The semiconductor flow control component flow coefficient adjustment device according to claim 2, characterized in that, The housing also includes a first chamber and a first sleeve. The first chamber is connected to the other end of the channel. The other end of the operating rod extends out of the first chamber to the outside. The sealing component is located at the bottom of the first chamber. The first sleeve is fitted onto the operating rod and fastened within the first chamber to press the sealing component.

4. The semiconductor flow control component flow coefficient adjustment device according to claim 3, characterized in that, It also includes a handle, which is connected to the other end of the operating lever away from the operating end and located outside the housing, for driving the operating lever to rotate relative to the housing, thereby driving the flow regulating nut to rotate synchronously to achieve flow regulation.

5. The semiconductor flow control component flow coefficient adjustment device according to claim 4, characterized in that, It also includes a second sleeve, which is sleeved on the operating rod and at least one end is located outside the housing. The side wall of the second sleeve is provided with a threaded hole. The operating rod is provided with a positioning groove at a position corresponding to the threaded hole. The front end of the handle is provided with a positioning part that matches the positioning groove. The handle is fastened in the threaded hole and the positioning part is matched and connected with the positioning groove, so as to realize the detachable fixed connection between the handle and the operating rod through the second sleeve.

6. The semiconductor flow control component flow coefficient adjustment device according to claim 5, characterized in that, It also includes a limiting component and a second chamber, the second chamber being disposed within the housing and communicating above the first chamber, the limiting component being disposed within the second chamber, the limiting component being used to limit the rotation of the operating lever.

7. The semiconductor flow control component flow coefficient adjustment device according to claim 6, characterized in that, The limiting component includes: The first limiting member is disposed on the side wall of the second chamber; The second limiting member is disposed on the outer peripheral surface of one end of the second sleeve located inside the second cavity. The second limiting member abuts against the first limiting member to limit the rotation angle of the operating lever.

8. The semiconductor flow control component flow coefficient adjustment device according to claim 7, characterized in that, At least two first limiting members are provided, and the first and second limiting members are spaced apart from each other to limit the rotation angle of the operating lever.

9. The semiconductor flow control component flow coefficient adjustment device according to claim 7, characterized in that, The diameter of the second chamber is greater than the diameter of the first chamber, and the depth of the second chamber is greater than the thickness of the second limiting member, so that an upper limiting surface and a lower limiting surface are formed between the top and bottom surfaces of the second chamber. When the operating rod moves telescopically relative to the housing, the telescopic movement of the operating rod is limited by the upper limiting surface and the lower limiting surface abutting against the second limiting member.

10. The semiconductor flow control component flow coefficient adjustment device according to any one of claims 6-9, characterized in that, The housing includes a lower shell and an upper cover, the lower shell and the upper cover being detachably connected, forming a second chamber between the lower shell and the upper cover, and / or, The outer wall of the housing is provided with a scale, and the outer peripheral surface of the operating lever is provided with pointer marks corresponding to the scale.

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