Embedded RFID tag packaging equipment and packaging process thereof

By combining dual-mode pressure control, thermal coupling compensation, and environmental sensing sensors, the problem of unstable packaging in multi-material mixed-flow production of existing equipment has been solved, realizing efficient and stable packaging of RFID tags and improving the versatility of the equipment and production quality.

CN122373727APending Publication Date: 2026-07-10JIANGSU SML&CF CO LTD
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Patent Information

Application Number
CN202610473275.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-04-10
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing embedded RFID tag packaging equipment is difficult to adapt to mixed-material production, lacks a dynamic compensation mechanism for the thermal expansion differences of heterogeneous materials, and lacks environmental closed-loop control capabilities, resulting in brittle matrix damage, weak adhesion, electrostatic damage, and unstable curing quality.

Method used

The system employs a dual-mode pressure control unit, a thermal coupling compensation mechanism, and an environmental sensing sensor group to achieve real-time sensing and dynamic adjustment of the substrate material. Combined with a modular tool head group and a main control terminal, it performs packaging mode switching, temperature control, and environmental monitoring to ensure the consistency and stability of packaging quality.

Benefits of technology

It improves the equipment's compatibility with multiple materials, prevents damage to brittle substrates, ensures packaging accuracy and stability, reduces the risk of electrostatic damage, and achieves stable production quality in different environments.

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Abstract

The invention relates to embedded RFID tag packaging equipment and a packaging process thereof, and relates to the technical field of radio frequency identification tag production and manufacturing, and the embedded RFID tag packaging equipment comprises base fixing support legs which are used for supporting an equipment main body; the rotating disc type sorting module is arranged on the equipment main body and is used for conveying and positioning a base body to be packaged; the dual-mode pressure control unit is used for acquiring the material characteristics of the base body and controlling equipment to be switched between a contact type press fitting mode and a non-contact type suspension mode so as to apply packaging pressure; and the thermal-mechanical coupling compensation mechanism is arranged at the packaging station and is used for performing temperature regulation and control on the packaging interface and performing precise displacement compensation in combination with piezoelectric driving. According to the application, the dual-mode pressure control unit is matched with the data acquisition sensor, the hardness of the base body is obtained in real time by utilizing a piezoelectric detection technology, the execution mode is switched according to the hardness, for hard base bodies such as metal, the equipment adopts a contact type press-fitting mode to output enough mechanical pressure, and uniform spreading and bonding strength of an adhesive layer are ensured.
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