Method for dissecting non-transparent potted components with alkaline reagents

Abstract

The application discloses a method for dissecting non-transparent glass-sealed components and devices by using an alkaline reagent, which comprises the following steps: injecting distilled water, which is not less than the volume of a non-transparent glass-sealed component sample, into a beaker at room temperature, adding potassium hydroxide solid into the water and stirring to prepare a saturated solution; immersing the non-transparent glass-sealed component sample to be dissected in the prepared solution, placing the beaker on a heating table to heat until the internal three-dimensional structure is completely exposed, and stopping heating; and cleaning the non-transparent glass-sealed component sample to complete dissection. The method can convert the complicated and dangerous hydrofluoric acid dissection into a simple and safe dissection effect by using an alkaline reagent and heating conditions.

Description

Technical Field

[0001] This invention relates to the fields of destructive physical analysis, structural analysis, and failure analysis of electronic components, and particularly to a method for dissecting non-transparent glass-sealed components with alkaline reagents for inspection. Background Technology

[0002] Glass-encapsulated components, including glass-encapsulated thermistors and glass-encapsulated diodes, offer several advantages over plastic or ceramic encapsulation: 1) High-temperature stability: Glass has a high melting point and thermal stability, enabling it to operate in high-temperature environments and making it suitable for high-temperature component encapsulation; 2) Low coefficient of thermal expansion: Glass has a low coefficient of thermal expansion, similar to that of semiconductor silicon, reducing stress-induced encapsulation failures caused by temperature changes; 3) Good electrical insulation: Glass provides excellent electrical isolation, preventing interference and short circuits between electronic components; 4) Excellent hermeticity: Glass effectively prevents corrosion from oxygen and moisture in the environment, protecting electronic components from humidity and chemical substances; 5) Good mechanical strength. These characteristics enable glass-encapsulated components to offer high reliability, long-term stability, and adaptability to compact circuit layouts (low coefficient of thermal expansion, reducing space requirements; good electrical isolation, allowing for close proximity) and high-temperature operating environments. However, correspondingly, conducting destructive physical analysis, structural analysis, and failure analysis on glass-sealed components faces challenges such as difficulty in removing the encapsulation and the inconvenience of dissecting samples to extract their intact internal three-dimensional structure. This is especially true for non-transparent glass-sealed components, where it is difficult to obtain internal structural information through optical microscopy and X-ray imaging for targeted sectioning. Moreover, due to the fragility of glass, sectioning can easily introduce damage. When metallurgically bonded glass diodes are sectioned, the stress release within the glass encapsulation may damage the internal structure. Traditional chemical unlocking methods for destructive physical analysis, structural analysis, and failure analysis, such as acid etching, are largely ineffective against glass encapsulations (silicate, the main component of glass, is an acidic oxide). Using hydrofluoric acid for dissection presents significant risks: the acid corrodes the internal metal structure, and the process incurs high costs for laboratory renovation, environmental upgrades, and safety risks. Hydrofluoric acid is highly volatile and permeable; inhalation of the gas can damage bones and is difficult to detect. It also irritates and corrodes various mucous membranes, including the skin, eyes, respiratory tract, and digestive tract. It can dehydrate and dissolve tissue proteins, and upon entering the bloodstream, it combines with calcium and magnesium ions to form insoluble calcium and magnesium fluorides, which can clog blood vessels. This poses an extremely high risk, making it a reagent that can seriously endanger personal safety even without direct contact. Therefore, a relatively safe and effective method for dissecting non-transparent, glass-sealed components is needed for inspection. Summary of the Invention

[0003] The purpose of this invention is to provide a relatively safe and effective method for dissecting non-transparent glass-sealed components.

[0004] To achieve the objective of this invention, a method for dissecting non-transparent glass-sealed components using an alkaline reagent is provided, comprising the following steps:

[0005] Step 1: At room temperature, pour distilled water to a volume that covers the non-transparent glass-sealed component sample into a beaker, add potassium hydroxide solid to the water and stir to prepare a saturated solution;

[0006] Step 2: Immerse the non-transparent glass-sealed component sample to be dissected in the solution prepared in step S01, place the beaker on a heating table and heat until the internal three-dimensional structure is completely exposed, then stop heating;

[0007] Step 3: Clean the non-transparent glass-sealed component sample and complete the dissection.

[0008] Furthermore, in step 2, the plastic beaker is placed on a heating table and heated, with the temperature controlled below 110°C.

[0009] Furthermore, the specific method of step 3 includes: removing the non-transparent glass-sealed component sample and placing it in a container to cool to room temperature; injecting distilled water into the container to clean the sample, testing the cleaning solution with pH test paper, changing the water, until the pH test paper turns neutral.

[0010] Furthermore, the beaker is placed on a heating platform for heating in the working environment of the ventilation system.

[0011] Compared with the prior art, the beneficial effects of the present invention

[0012] This invention provides a method for dissecting non-transparent glass-sealed components using alkaline reagents for inspection. This method not only solves the dissection problem of glass-sealed components in DPA, structural analysis, and failure analysis with a novel approach, clearing obstacles for analytical tasks, but also cleverly avoids the industry-standard hazardous reagent for dissecting glass seals—hydrofluoric acid. It has significant effects on safe production, labor protection, energy conservation and emission reduction, and green environmental protection, and effectively reduces reagent costs, saving huge costs associated with laboratory renovation, environmental impact assessment upgrades, and personal injury risks. Attached Figure Description

[0013] The accompanying drawings, which form part of this specification, are provided to further illustrate embodiments of the invention and, together with the textual description, explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0014] Figure 1Typical morphology diagram of non-transparent glass-sealed components;

[0015] Figure 2 A flowchart illustrating a method for dissecting non-transparent glass-sealed components with an alkaline reagent for inspection, as provided in an embodiment of the present invention.

[0016] Figure 3 This is a topographic image of a non-transparent glass-sealed component after being dissected using the method of this invention, revealing its complete internal three-dimensional structure. Detailed Implementation

[0017] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] The following describes an embodiment of the present invention with reference to the accompanying drawings—using a BZ3C type non-transparent glass-sealed rectifier diode (such as...). Figure 1 Taking the dissection shown in the figure as an example, the flowchart of the method for dissecting non-transparent glass-sealed components with alkaline reagents for inspection is as follows: Figure 2 As shown, it includes the following steps:

[0019] Step S01: At room temperature, pour 10-20 ml (the volume to cover the sample is set according to the sample size) of distilled water into a clean plastic beaker. Use a clean plastic spoon to scoop out potassium hydroxide solid and add it to the water, stirring to prepare a saturated solution until solid precipitates out.

[0020] In step S02, the non-transparent glass-sealed component sample to be dissected is immersed in the solution prepared in step S01 using tweezers. Under the cover of the working ventilation system, the beaker is placed on a heating platform and heated to 110°C. The heating temperature is controlled at 110°C because the plastic beaker can withstand a temperature of 110°C. Exceeding this temperature will cause the container (plastic beaker) to melt and be damaged, and harmful gases will be produced from the melted plastic.

[0021] Step S03: Every 10 minutes, use tweezers to pick up the sample and check the morphology of the encapsulation peeling off. If it is not completely peeled off, immerse it again until the internal three-dimensional structure is completely exposed.

[0022] Step S04: Stop heating, use tweezers to remove the sample, and place it in an iron box to cool to room temperature;

[0023] Step S05: Without impacting the sample, pour distilled water into the iron box to clean the sample. Use pH test paper to test the cleaning solution and change the water. Each time you test, use a glass rod dipped in the cleaning solution to drop a drop onto the middle of the dry pH test paper. After the test paper changes color, compare it with the standard color chart until the pH test paper turns neutral (usually yellow-green). Use tweezers to remove the sample, and the dissection is complete.

[0024] For non-transparent glass-sealed samples (where it is difficult to obtain internal structural information for targeted dissection using optical microscopy and X-ray fluoroscopy), the method of this invention simplifies the complex process, eliminates risks, and enables safe and effective dissection, extracting intact internal three-dimensional structures (such as...). Figure 3 As shown in the diagram, this ensures the successful completion of the analysis task. The industry-standard process of using hydrofluoric acid to remove glass is cumbersome in terms of safety requirements, poses significant health risks, and has a high operational danger factor. This invention cleverly transforms the cumbersome and dangerous hydrofluoric acid dissection process into a simple and safe method using alkaline reagents and heating conditions, commonly used in high school chemistry experiments, to achieve the desired dissection effect.

[0025] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for dissecting non-transparent glass-sealed components using an alkaline reagent, characterized in that, The method includes the following steps: Step 1: At room temperature, pour distilled water to a volume that covers the non-transparent glass-sealed component sample into a beaker, add potassium hydroxide solid to the water and stir to prepare a saturated solution; Step 2: Immerse the non-transparent glass-sealed component sample to be dissected in the solution prepared in step S01, place the beaker on a heating table and heat until the internal three-dimensional structure is completely exposed, then stop heating; Step 3: Clean the non-transparent glass-sealed component sample and complete the dissection.

2. The method for dissecting non-transparent glass-sealed components using an alkaline reagent according to claim 1, characterized in that, In step 2, the plastic beaker is placed on a heating table and heated, with the temperature controlled below 110°C.

3. The method for dissecting non-transparent glass-sealed components using an alkaline reagent according to claim 1, characterized in that, The specific method of step 3 includes: removing the non-transparent glass-sealed component sample and placing it in a container to cool to room temperature; injecting distilled water into the container to clean the sample, testing the cleaning solution with pH test paper, changing the water, until the pH test paper turns neutral.

4. The method for dissecting non-transparent glass-sealed components using an alkaline reagent according to claim 1, characterized in that, Heat the beaker on the heating table in an environment with a ventilation system.

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