A method for disassembling a potted microcircuit module
By using X-ray imaging and heating to dissolve petroleum extract reagents, the problem of potting adhesives being difficult to remove or damaging internal components in traditional dissection methods has been solved. This enables efficient and stable dissection of potted microcircuit modules, supporting subsequent analysis.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING ZHENXING METROLOGY & TEST INST
- Filing Date
- 2024-12-06
- Publication Date
- 2026-06-09
AI Technical Summary
When performing destructive physical analysis on microcircuit modules, traditional dissection methods for potted microcircuit modules struggle to control the intensity and angle of mechanical stress application while ensuring the safety of diverse internal components. This makes it difficult to remove the potting compound or damage the internal components of the module, affecting subsequent analysis.
X-ray imaging was used to obtain information about the internal structure. After the outer shell was destroyed, petroleum extract reagents were used to selectively dissolve the potting compound under heating conditions to avoid damaging the internal components. The most effective solvent was determined by a sampling-test control group method.
It achieves efficient and stable removal of potting compound, preserves internal components and structure of the module, improves dissection quality, provides reliable support for subsequent analysis, and reduces cost and time consumption.
Smart Images
Figure CN122171284A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the fields of destructive physical analysis, structural analysis, and failure analysis of electronic components, and particularly to a method for dissecting potted microcircuit modules. Background Technology
[0002] Potting refers to the process of mechanically or manually injecting liquid epoxy resin, silicone rubber, organosilicon resin, and polyurethane composites into devices containing electronic components and circuits, which then cures at room temperature or under heating conditions to form a thermosetting polymer insulating material—the potting compound. The potting compound fills the spaces between electronic components and circuits, typically exhibiting strong adhesion to the components and circuits within the device, and possessing a certain degree of hardness.
[0003] Due to the complex internal components and material distribution of potted microcircuit modules, traditional manual de-adhesive removal methods (using tweezers or other tools to manually remove the potting compound) are difficult to control the intensity and angle of mechanical stress while ensuring the safety of the diverse internal components. This can easily cause physical damage to the internal components, solder joints, wires, printed circuit boards, and process structures. Moreover, due to the inconvenience of operation caused by many internal spaces and the uncontrollable hardness of the adhesive, dissection is time-consuming. Manual de-adhesive removal of a single potted microcircuit module can take as long as 2-4 hours, and there may still be residual adhesive that is difficult to remove.
[0004] If the traditional acidic chemical reagent method is used to remove the potting compound (using acid to etch the potting compound), the effect is minimal for potting compounds that are mainly composed of organic matter if the etching stress is small, and the etching stress is large if it easily corrodes the printed circuit board, wires, components and solder joints inside the potted microcircuit module (traditional acidic chemical reagents can react with metals, molding compounds and epoxy resins).
[0005] In summary, due to the process characteristics of potted microcircuit modules, traditional dissection methods either leave residual potting compound that is difficult to remove, hindering subsequent observation and analysis, or damage the internal components, solder joints, wires, printed circuit boards, and process structures of the module, making subsequent analysis impossible. Summary of the Invention
[0006] Based on the above analysis, the present invention aims to provide a dissection method for potted microcircuit modules, in order to solve the problems of traditional potted microcircuit module dissection methods either leaving residual potting glue that is difficult to remove, hindering subsequent observation and analysis, or damaging the internal components, solder joints, wires, printed circuit boards and process structures of the module, making subsequent analysis impossible.
[0007] The objective of this invention is mainly achieved through the following technical solutions:
[0008] This invention provides a method for dissecting a potted microcircuit module, comprising the following steps:
[0009] Step S01: Use X-rays to perform internal imaging of the front and side of the potted microcircuit module to obtain information about the internal structure of the object;
[0010] Step S02: Based on the internal structure information of the object obtained in step S01, destroy the outer shell of the potting microcircuit module to expose the potting body A;
[0011] Step S03: Based on the internal structure information of the object determined in step S01, without damaging the internal components, solder joints, wires, printed circuit boards and process structure of the potting microcircuit module, remove three pieces of colloid from the potting body A.
[0012] Step S04: Pour the three reagents, which are mainly composed of petroleum extracts, into three sealable containers and label them as Container 1, Container 2, and Container 3.
[0013] Step S05: Place the three colloids obtained in step S03 into containers 1, 2 and 3 prepared in step S04 and seal them. Place the three containers on a heating table, set the heating temperature to 48-52℃ and the heating time to 20-24min, and observe after heating.
[0014] Step S06: Select the container with the most obvious colloid dissolution phenomenon, open the sealed opening, put in the potting body A from step S03, and continue to add the original solvent corresponding to the container number until the potting body A is completely submerged. After sealing the container, remove the other two containers and continue to heat at 50°C for 30 minutes. If the colloid does not swell, loosen, or break down, increase the temperature by 50°C and raise the heating element temperature to 100°C. Continue to heat at 100°C for 30 minutes and observe. If the colloid still does not swell, loosen, or break down, increase the temperature by 50°C again, that is, raise the heating element temperature to 150°C. Continue to heat steadily at 150°C until the colloid swells, loosens, or breaks down.
[0015] Step S07: Stop heating, cool to room temperature, open the seal, and remove the potting body A.
[0016] Furthermore, in step S01, the internal structural information of the object includes the distribution of internal components, solder joints, wires, printed circuit boards, and process structures within the module. The internal process structure of the module includes the bonding system and the welding / bonding system.
[0017] Further, in step S02, based on the internal structure information of the object obtained in step S01, the screws on the surface of the potting microcircuit module housing are removed with a screwdriver, and the surface terminals are pried up with a flathead screwdriver and inserted into the gap to apply static pressure.
[0018] Furthermore, in step S02, for finned cold plate potted microcircuit modules, when the module shell is damaged, a laser decapsulation machine is used to remove the five sides of the encapsulation surface except for the base plate, exposing its potting body A.
[0019] Furthermore, in step S03, the three colloids have the same volume and their heights are all less than or equal to 1 cm.
[0020] Furthermore, in step S04, the three reagents mainly composed of petroleum extracts are HYRJ-166 solvent, YGFR-331 solvent, and YGRJ-338A solvent, which are poured into containers 1, 2, and 3 respectively.
[0021] Furthermore, in step S04, the components of the HYRJ-166 solvent include petroleum ether, formic acid, dewaxing agent, and corrosion inhibitor; the components of the YGRJ-338A solvent include high molecular weight cycloalkane compound, hydroxy acid, penetrant, and corrosion inhibitor; and the components of the YGRJ-338A solvent include high molecular weight cycloalkane compound, oleic acid ester, benzenesulfonic acid, and corrosion inhibitor.
[0022] Furthermore, in step S04, the solvent content in containers 1, 2, and 3 is such that the liquid level in the containers is higher than 1 cm.
[0023] Furthermore, in step S06, if the size of the potting body A exceeds the size of the container, the hygroscopic material soaked in the solvent selected in step S06 is applied to the potting body A and soaked until the colloid swells, loosens, or breaks down.
[0024] Further, in step S07, the swollen, loose, or broken colloid is removed with tweezers or a brush, and the potting body A is rinsed clean with alcohol or acetone, thus completing the dissection.
[0025] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:
[0026] (1) This invention can cleanly remove the encapsulation, including potting compound, while perfectly preserving the internal components, solder joints, wires, printed circuit boards and process structures (including bonding system and welding / adhesion system) of the module. It greatly improves the dissection quality of potted microcircuit modules and provides reliable, efficient and stable support for obtaining the internal process features and morphology of potted microcircuit modules and determining defects. It significantly controls the interfering factors that affect the analysis, which is crucial for scientific research and production work such as destructive physical analysis, structural analysis, failure location, mechanism analysis and process evaluation.
[0027] (2) The present invention adopts a sampling-test control group method to first test a solvent that is most effective for the potting colloid of the sample, and then uses it on the entire sample; the purpose is achieved with minimal cost (including reagent cost and time cost). After the control group test, the entire sample is used. This can cleanly remove the encapsulation, including the potting colloid, while preserving the internal components, solder joints, wires, printed circuit boards and process structures (including bonding system and welding / adhesion system) of the module. It avoids the situation where a certain solvent is arbitrarily used to the end, resulting in unsatisfactory results after a long time of dissolution. Therefore, the present invention can improve the dissection efficiency.
[0028] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained through the embodiments described and the accompanying drawings, which are particularly pointed out. Attached Figure Description
[0029] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.
[0030] Figure 1 This is a flowchart illustrating the dissection method of the potting microcircuit module of the present invention;
[0031] Figure 2 Figure 1 shows the effect of dissecting a potted microcircuit module using the dissection method of the present invention;
[0032] Figure 3 Figure 2 shows the effect of dissecting a potted microcircuit module using the dissection method of the present invention;
[0033] Figure 4 The diagram shown is a cross-sectional view of the failure location of a potted microcircuit module.
[0034] Figure 5 For Comparative Example 1, the adhesive removal effect of the existing manual adhesive removal and dissection of the potted microcircuit module is shown in the figure.
[0035] Figure 6 For Comparative Example 2, the effect of removing adhesive from potted microcircuit modules using existing acid etching methods is shown in the diagram.
[0036] Figure 7 The image shows the effect of removing adhesive from a potted microcircuit module using existing mechanical adhesive removal methods, as shown in Comparative Example 3. Detailed Implementation
[0037] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.
[0038] This invention provides a method for dissecting potted microcircuit modules, such as... Figure 1 As shown, this anatomical method includes the following steps:
[0039] Step S01: Use X-rays to perform internal imaging of the front and side of the potted microcircuit module to obtain information about the internal structure of the object;
[0040] In step S01 above, the internal structure information of the object includes the distribution of internal components, solder joints, wires, printed circuit boards and process structures of the module. The internal process structure of the module includes the bonding system and the welding / bonding system.
[0041] In step S01 above, the internal structural information of the object also includes the top cover mounting outline of the module, the bending and forming of the terminals, and the location of the bolts connecting the internal bottom plate.
[0042] Step S02: Based on the internal structure information of the object obtained in step S01, destroy the outer shell of the potting microcircuit module to expose the potting body A;
[0043] In step S02 above, based on the internal structure information of the object obtained in step S01, the screws on the surface of the potting microcircuit module housing are removed with a screwdriver, and the surface terminals are pried up with a flathead screwdriver and inserted into the gap to apply static pressure.
[0044] In step S02 above, for finned cold plate potted microcircuit modules, when the module shell is damaged, a laser unpacking machine is used to remove the five sides of the encapsulation surface except for the base plate, exposing its potting body A.
[0045] Step S03: Based on the internal structure information of the object determined in step S01, without damaging the internal components, solder joints, wires, printed circuit boards and process structure of the potting microcircuit module, remove three pieces of colloid from the potting body A.
[0046] In step S03 above, the three colloids have the same volume and their heights are all less than or equal to 1 cm.
[0047] Step S04: Pour the three reagents, which are mainly composed of petroleum extracts, into three sealable containers and label them as Container 1, Container 2, and Container 3.
[0048] In step S04 above, HYRJ-166 solvent, YGFR-331 solvent, and YGRJ-338A solvent are poured into containers 1, 2, and 3 respectively.
[0049] In step S04 above, the components of the HYRJ-166 solvent include petroleum ether, formic acid, dewaxing agent, and corrosion inhibitor; the components of the YGRJ-338A solvent include high molecular weight cycloalkane compound, hydroxy acid, penetrant, and corrosion inhibitor; and the components of the YGRJ-338A solvent include high molecular weight cycloalkane compound, oleic acid ester, benzenesulfonic acid, and corrosion inhibitor. It should be noted that all three solvents are currently commercially available products.
[0050] To identify the most effective solvent for the sample potting colloid, based on the principle of "like dissolves like," this invention selected three solvents. All three groups of solvents are suitable for dissolving silicone rubber and epoxy resin. However, since the composition of the sample potting colloid is unknown and the composition of the colloid varies greatly in different potting modules, this invention sets up three groups of solvents to dissolve three colloids respectively. The sampling-test control group method is used to first determine the most effective solvent for the sample potting colloid, and then it is used on the entire sample.
[0051] In step S04 above, the solvent content in the three containers is such that the liquid level in the container is higher than 1 cm; this is because the three colloids are of the same volume and each has a height of less than or equal to 1 cm, and the solvent content is such that the liquid level in the container is higher than 1 cm to ensure that the solvent submerges each colloid.
[0052] In step S04 above, the container includes a polyethylene plastic container or a stainless steel container.
[0053] Step S05: Place the three colloids obtained in step S03 into containers No. 1, No. 2 and No. 3 prepared in step S04 respectively and seal them. Place the containers on a heating table, set the heating temperature to 48-52℃ (e.g., 49℃, 50℃), and the heating time to 20-24min (e.g., 20min, 24min). Observe after heating.
[0054] In step S05, to compare the dissolving effects of the three solvents, this invention sets the heating stage to 50°C, allowing observation of the dissolving effects of the three colloids in different containers. The purpose is not to dissolve the colloids, but to select the solvent with the best dissolving effect in a short time. Heating too high a temperature or for too long would waste energy. Additionally, this step also aims to test whether heating the potting compound A at 50°C for 20 minutes can dissolve it. If it cannot dissolve completely, heating will continue to a higher temperature.
[0055] Step S06: Select the container with the most obvious colloid dissolution phenomenon, open the sealed opening, put in the potting body A from step S03, and continue to add the original solvent corresponding to the container number until the potting body A is completely submerged. After sealing the container, remove the other two containers and continue to heat at 50°C for 30 minutes. If the colloid does not swell, loosen, or break down, increase the temperature by 50°C, that is, raise the temperature of the heating element to 100°C, and continue to heat at 100°C for 30 minutes. If the colloid still does not swell, loosen, or break down, increase the temperature by 50°C again, that is, raise the temperature of the heating element to 150°C, and continue to heat steadily at 150°C until the colloid swells, loosens, or breaks down.
[0056] It should be noted that in step S06 above, the maximum heating temperature is less than or equal to 150°C. After reaching 150°C, the temperature is kept stable until the colloid swells, loosens, or breaks down. In other words, the potting colloid is dissolved by extending the heating time.
[0057] In step S06 above, since the lowest melting point of tin-lead solder is 183°C and the melting point of lead-free solder is even higher, the heating temperature of no more than 150°C will not damage the solder joints inside the potted microcircuit module.
[0058] In step S06 above, if the size of the potting body A exceeds the size of the container, on the one hand, a larger container can be directly replaced to match the potting body A; on the other hand, the absorbent material (e.g., cotton wool) soaked in the solvent selected in step S06 can be laid on the potting body A, so that the potting body A is soaked in the solvent until the colloid swells, loosens or disintegrates; the swollen, loose or disintegrated colloid is peeled off with tweezers or a brush, and the potting body A is rinsed clean with alcohol or acetone, and the dissection is completed.
[0059] In step S06 above, the absorbent material (e.g., cotton wool) soaked in the solvent selected in step S06 is laid on the potting body A for soaking. The purpose is to use the absorbent material soaked in the "most suitable solvent" selected in the previous test control group to lay on the potting body A for soaking, and to dissolve the potting colloid by extending the soaking time.
[0060] Step S07: Stop heating, cool to room temperature, open the seal, and remove the potting body A.
[0061] It should be noted that, from Figure 4The failure localization cross-section diagram of the potted microcircuit module shown reveals that the internal components and materials of the module are complex in composition and distribution. Using traditional dissection methods, either residual potting compound is difficult to remove, hindering subsequent observation and analysis, or it damages the internal components, solder joints, wires, printed circuit boards, and process structures, making subsequent analysis impossible. It is difficult to remove, easily damaged, and seriously interferes with subsequent tests, failure localization, mechanism analysis, and process evaluation (or fails to fully present the internal process structure, or damages the site and introduces interfering factors). It is also costly in terms of manpower, time, and rework, hindering the progress of the task.
[0062] Compared with existing technologies, this invention can cleanly remove the encapsulation, including potting compound, while perfectly preserving the internal components, solder joints, wires, printed circuit boards, and process structures (including bonding and soldering / adhesive systems) of the module. This significantly improves the dissection quality of potted microcircuit modules and provides reliable, efficient, and stable support for obtaining the internal process characteristics and morphology of potted microcircuit modules and determining defects. It also significantly controls interfering factors that affect the analysis, which is crucial for scientific research and production work such as destructive physical analysis, structural analysis, failure location, mechanism analysis, and process evaluation.
[0063] Furthermore, this invention employs a sampling-test control group method to first determine the most effective solvent for the sample potting compound, and then applies it to the entire sample. This achieves the goal with minimal cost (including reagent and time costs). The control group test is followed by application to the entire sample, which can cleanly remove the encapsulation, including the potting compound, while perfectly preserving the internal components, solder joints, wires, printed circuit boards, and process structures (including bonding and soldering / adhesive systems). This avoids the situation where arbitrarily specifying a single solvent for the entire process leads to unsatisfactory results after prolonged dissolution. Therefore, this invention can improve dissection efficiency.
[0064] Example 1
[0065] As an embodiment of the present invention, taking the Recom ROM-0505S potted microcircuit module as an example, the dissection method of the potted microcircuit module includes the following steps:
[0066] Step S01: Use X-rays to perform internal imaging of the front and side of the potted microcircuit module to obtain information about the internal structure of the object;
[0067] In step S01 above, the internal structure information of the object includes the distribution of internal components, solder joints, wires, printed circuit boards and process structures of the module. The internal process structure of the module includes the bonding system and the welding / bonding system.
[0068] Step S02: Based on the internal structure information of the object obtained in step S01, use a screwdriver to remove the screws on the surface of the potting microcircuit module shell, use a flathead screwdriver to pry up the surface terminals and insert them into the gap to apply static pressure, thereby damaging the potting microcircuit module shell and exposing the potting body A.
[0069] Step S03: Based on the internal structure information of the object determined in step S01, without damaging the internal components, solder joints, wires, printed circuit boards and process structure of the potting microcircuit module, remove three pieces of colloid from the potting body A.
[0070] In step S03 above, the three colloids have the same volume and their heights are all equal to 1 cm.
[0071] Step S04: Pour the three reagents, which are mainly composed of petroleum extracts, into three sealable containers and label them as Container 1, Container 2, and Container 3.
[0072] In step S04 above, HYRJ-166 solvent, YGFR-331 solvent, and YGRJ-338A solvent are poured into containers 1, 2, and 3 respectively. HYRJ-166 solvent is a petroleum extract of petroleum ether, formic acid, dewaxing agent, and corrosion inhibitor. YGRJ-338A solvent is a high molecular weight cycloalkane compound, hydroxy acid, penetrant, and corrosion inhibitor. YGRJ-338A solvent is a high molecular weight cycloalkane compound, oleic acid ester, benzenesulfonic acid, and corrosion inhibitor.
[0073] Step S05: Place the three colloids obtained in step S03 into containers No. 1, No. 2 and No. 3 prepared in step S04 and seal them. Place the containers on a heating table, set the heating temperature to 50℃ and the heating time to 20min, and observe after heating.
[0074] Step S06: Select the container with the most obvious colloid dissolution phenomenon, open the sealed opening, put in the potting body A from step S03, and continue to add the original solvent corresponding to the container number until the potting body A is completely submerged. After sealing the container, remove the other two containers and continue to heat at 50°C for 30 minutes. If the colloid does not swell, loosen, or break down, increase the temperature by 50°C, that is, raise the temperature of the heating element to 100°C, and continue to heat at 100°C for 30 minutes. If the colloid still does not swell, loosen, or break down, increase the temperature by 50°C again, that is, raise the temperature of the heating element to 150°C, and continue to heat steadily at 150°C until the colloid swells, loosens, or breaks down.
[0075] Step S07: Stop heating, cool to room temperature, open the seal, remove the potted body A, and the dissection is complete. The result is as follows. Figure 2 and Figure 3 As shown.
[0076] Comparative Example 1
[0077] Comparative Example 1 uses existing manual adhesive removal methods to remove the potting compound from a potted microcircuit module, i.e., manually removing the potting compound using tools such as tweezers. The adhesive removal effect is as follows: Figure 5 As shown.
[0078] Comparative Example 2
[0079] This comparative example uses existing acidic chemical reagents to etch the potting compound inside the encapsulated microcircuit module, and the adhesive removal effect is as follows: Figure 6 As shown.
[0080] Comparative Example 3
[0081] This comparative example employs existing mechanical de-bonding methods to remove the potting compound from the interior of potted microcircuit modules. However, the internal adhesive in this comparative example exhibits high hardness and strong adhesion, making it difficult to control the intensity and angle of mechanical stress application while considering the diverse internal components. This can easily lead to damage, such as... Figure 7 As shown.
[0082] The comparison shows that, in Comparative Example 1, the manual adhesive removal method is difficult to control the intensity and angle of mechanical stress while ensuring the safety of diverse internal components. This easily causes physical damage to internal components, solder joints, wires, printed circuit boards, and process structures. Furthermore, due to the obstruction of many internal spaces, the uncontrollable hardness of the adhesive, and the long dissection time (2-4 hours for a single potted microcircuit module), manual adhesive removal can still leave difficult-to-remove residual adhesive (such as...). Figure 5 As shown, Figure 5 The middle arrow points to areas that are not clean after opening. Comparative Example 2 uses acid etching, which easily over-etches the printed circuit board, wires, components, and solder joints inside the potted microcircuit module (traditional acidic chemical reagents can react with metals, molding compounds, and epoxy resins). Figure 6 As shown, Figure 6 The middle arrows indicate areas of excessive corrosion and scratches caused by manual removal. Comparative Example 3 uses mechanical adhesive removal. The adhesive inside the module is hard and has strong adhesion, making it difficult to control the intensity and angle of mechanical stress application while considering the diverse internal components. This easily leads to damage (as shown in Figure 7). Figure 7 The middle arrow points to the internal coil wires damaged by the adhesive removal scratch.
[0083] Compared with existing technologies, such as Figure 2 and Figure 3As shown, this invention can cleanly remove the encapsulation, including potting compound, while perfectly preserving the internal components, solder joints, wires, printed circuit boards, and process structures of the module. It provides reliable, efficient, and stable support for obtaining the internal process characteristics and morphology of potted microcircuit modules and determining defects, thereby improving the quality of analysis. This is crucial for scientific research and production work such as destructive physical analysis, structural analysis, failure location, mechanism analysis, and process evaluation.
[0084] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.
Claims
1. A method for dissecting a potted microcircuit module, characterized in that, Includes the following steps: Step S01: Use X-rays to perform internal imaging of the front and side of the potted microcircuit module to obtain information about the internal structure of the object; Step S02: Based on the internal structure information of the object obtained in step S01, destroy the outer shell of the potting microcircuit module to expose the potting body A; Step S03: Based on the internal structure information of the object determined in step S01, without damaging the internal components, solder joints, wires, printed circuit boards and process structure of the potting microcircuit module, remove three pieces of colloid from the potting body A. Step S04: Pour the three reagents, which are mainly composed of petroleum extracts, into three sealable containers and label them as Container 1, Container 2, and Container 3. Step S05: Place the three colloids obtained in step S03 into containers 1, 2 and 3 prepared in step S04 and seal them. Place the three containers on a heating table, set the heating temperature to 48-52℃ and the heating time to 20-24min, and observe after heating. Step S06: Select the container with the most obvious colloid dissolution phenomenon, open the sealed opening, put in the potting body A from step S03, and continue to add the original solvent corresponding to the container number until the potting body A is completely submerged. After sealing the container, remove the other two containers and continue to heat at 50°C for 30 minutes. If the colloid does not swell, loosen, or break down, increase the temperature by 50°C and raise the heating element temperature to 100°C. Continue to heat at 100°C for 30 minutes and observe. If the colloid still does not swell, loosen, or break down, increase the temperature by 50°C again, that is, raise the heating element temperature to 150°C. Continue to heat steadily at 150°C until the colloid swells, loosens, or breaks down. Step S07: Stop heating, cool to room temperature, open the seal, and remove the potting body A.
2. The dissection method for potted microcircuit modules according to claim 1, characterized in that, In step S01, the internal structure information of the object includes the distribution of internal components, solder joints, wires, printed circuit boards, and process structures within the module. The internal process structure of the module includes a bonding system and a welding / adhesive system.
3. The dissection method for potted microcircuit modules according to claim 2, characterized in that, In step S02, based on the internal structure information of the object obtained in step S01, the screws on the surface of the potting microcircuit module housing are removed with a screwdriver, and the surface terminals are pried up with a flathead screwdriver and inserted into the gap to apply static pressure.
4. The dissection method for potted microcircuit modules according to claim 2, characterized in that, In step S02, for finned cold plate potted microcircuit modules, when the module shell is damaged, a laser decapsulation machine is used to remove the five surfaces of the encapsulation surface except for the base plate, exposing its potting body A.
5. The dissection method for potted microcircuit modules according to claim 1, characterized in that, In step S03, the three colloids have the same volume and their heights are all less than or equal to 1 cm.
6. The dissection method for potted microcircuit modules according to claim 1, characterized in that, In step S04, the three reagents mainly composed of petroleum extracts are HYRJ-166 solvent, YGFR-331 solvent, and YGRJ-338A solvent, which are poured into containers 1, 2, and 3 respectively.
7. The dissection method for a potted microcircuit module according to claim 6, characterized in that, In step S04, the components of the HYRJ-166 solvent include petroleum ether, formic acid, dewaxing agent, and corrosion inhibitor; the components of the YGRJ-338A solvent include high molecular weight cycloalkane compound, hydroxy acid, penetrant, and corrosion inhibitor; and the components of the YGRJ-338A solvent include high molecular weight cycloalkane compound, oleic acid ester, benzenesulfonic acid, and corrosion inhibitor.
8. The method for dissecting a potted microcircuit module according to claim 7, characterized in that, In step S04, the solvent content in containers 1, 2 and 3 is such that the liquid level in the containers is higher than 1 cm.
9. The method for dissecting a potted microcircuit module according to any one of claims 1 to 8, characterized in that, In step S06, if the size of the potting body A exceeds the size of the container, the absorbent material soaked in the solvent selected in step S06 is applied to the potting body A and soaked until the colloid swells, loosens, or breaks down.
10. The method for dissecting a potted microcircuit module according to claim 9, characterized in that, In step S07, the swollen, loose, or broken colloid is removed with tweezers or a brush, and the potting body A is rinsed clean with alcohol or acetone, thus completing the dissection.