High-throughput high-temperature creep test apparatus and method
By utilizing heating components and heat-concentrating elements to create a temperature gradient in a high-temperature creep testing device, combined with loading and deformation measurements, the problem of low efficiency in traditional creep testing is solved, enabling efficient synchronous testing at multiple temperature points. This method is suitable for evaluating the creep performance of novel and scarce materials.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI NUCLEAR ENGINEERING RESEARCH & DESIGN INSTITUTE CO LTD
- Filing Date
- 2026-03-26
- Publication Date
- 2026-06-09
AI Technical Summary
Traditional creep tests can only obtain temperature data at a single point, resulting in low testing efficiency. This bottleneck is particularly prominent in the research and development of new materials and the testing of scarce materials. Furthermore, existing high-temperature creep equipment cannot achieve simultaneous testing at multiple temperature points.
A high-throughput high-temperature creep testing device is used. A temperature gradient is formed on one side of the specimen through a heating component and a heat-concentrating element. Combined with a loading component and a deformation measurement device, simultaneous testing at multiple temperature points is achieved. The heating component heats the specimen, the heat-concentrating element directionally feeds back heat energy, the loading component applies creep load, and the deformation measurement device acquires deformation data at multiple locations.
It enables the acquisition of creep data at multiple temperature points within a wide temperature range in a single test, significantly improving test efficiency and reducing material consumption. It is particularly suitable for scarce samples, and the equipment structure is simplified, reducing costs.
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Figure CN122171349A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of high-temperature performance testing technology for materials, and more specifically, to a high-throughput high-temperature creep testing device and method. Background Technology
[0002] Creep properties are an important basis for evaluating the long-term service reliability of high-temperature structural materials. Accurately establishing a creep constitutive model of materials over a wide temperature range requires obtaining a large amount of creep test data at different temperature points.
[0003] Traditional creep tests are typically conducted at constant temperatures, with the core technical logic being the pursuit of uniformity in the temperature field of the sample. A single test can only obtain creep data at one temperature point. When it is necessary to establish a creep model covering a wide temperature range of hundreds of degrees Celsius, it is necessary to prepare samples and conduct independent tests for each target temperature point, resulting in long testing cycles and huge material consumption. The efficiency bottleneck is particularly prominent in the research and development of new materials and the testing of scarce materials.
[0004] Existing high-temperature creep equipment mostly adopts the furnace body as a whole for heating. Its original design intention is to achieve uniform heating, but it cannot build a controllable temperature gradient on a single sample to achieve simultaneous testing at multiple temperature points. Summary of the Invention
[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.
[0006] The present invention aims to provide, for example, a high-throughput high-temperature creep testing apparatus and method that can improve the problem of low testing efficiency caused by traditional creep tests only being able to acquire single-point temperature data per test.
[0007] The embodiments of the present invention can be implemented as follows: An embodiment of the present invention provides a high-throughput high-temperature creep testing device for performing creep tests on specimens. The device includes a heating assembly, a heat concentrating element, a loading assembly, and a deformation measuring device. The heating assembly heats the specimen. The heat concentrating element is disposed on one side of the specimen and is used to directionally return the radiated heat energy from the specimen to a predetermined area on the specimen, thereby forming a temperature gradient along the length of the specimen. The loading assembly is connected to the specimen and is used to apply a predetermined creep load to the specimen. The deformation measuring device acquires deformation data at multiple different locations on the specimen within the temperature gradient range.
[0008] In addition, the high-throughput high-temperature creep testing device provided in the embodiments of the present invention may also have the following additional technical features: Optionally, the heating component is electrically connected to the sample, and the heating component is used to directly energize the sample so that the sample itself generates Joule heat.
[0009] Optionally, the heat-gathering element includes a plurality of sub-elements, which are arranged at intervals along the length of the sample, and each sub-element corresponds to a preset region.
[0010] Optionally, the sub-element includes at least one thermal reflective mirror for reflecting the infrared thermal energy radiated by the sample to the preset area.
[0011] Optionally, the heat-reflecting mirror is a curved mirror, which is disposed around at least a portion of the outer periphery of the sample.
[0012] Optionally, the arrangement density of the heat-gathering elements is adjustable, the corresponding area of the heat-gathering elements and the sample is adjustable, and the distance between the heat-gathering elements and the sample is adjustable, so as to adjust the temperature of the preset area.
[0013] Optionally, the sample has an inner cavity; the loading assembly includes a pressurization line, the heating assembly includes a heating electrode, the pressurization line communicates with the inner cavity of the sample for filling the sample with high-pressure gas to apply internal pressure; the heating electrode is electrically connected to the sample for inputting a heating current to the sample.
[0014] Optionally, the deformation measuring device includes a laser diameter gauge, which is used to scan along the length direction of the sample to continuously acquire data on the outer diameter change within the temperature gradient range.
[0015] Optionally, the high-throughput high-temperature creep testing device further includes a temperature measuring device and a controller. The temperature measuring device is used to monitor the temperature distribution along the length of the sample in real time. The controller is communicatively connected to the temperature measuring device, the heating component, and / or the heat converging element, respectively. The controller is used to dynamically adjust the heating power of the heating component and / or the heat converging parameters of the heat converging element according to the monitored temperature distribution.
[0016] Optionally, the temperature measuring device includes a multi-point distributed thermocouple or an infrared thermometer.
[0017] Optionally, the high-throughput high-temperature creep testing device further includes a data acquisition and analysis module, which is communicatively connected to the deformation measurement device. The data acquisition and analysis module is used to receive the deformation data and convert the deformation data into creep data at different temperatures according to the pre-calibrated correspondence between the axial position of the specimen and the temperature.
[0018] An embodiment of the present invention also provides a high-throughput high-temperature creep testing method, implemented using a high-throughput high-temperature creep testing device, comprising the following steps: The sample is heated by the heating assembly. The heat-concentrating element directs the heat energy radiated by the sample back to a predetermined area on the sample, thereby creating a temperature gradient along the length of the sample. A predetermined creep load is applied to the specimen by the loading component; The deformation measurement device acquires deformation data at multiple different locations on the sample within the temperature gradient range.
[0019] Optionally, the high-throughput high-temperature creep test method further includes the following steps: Based on the pre-calibrated correspondence between the axial position and temperature of the sample, the obtained deformation data is converted into creep data at different temperatures, and a wide-temperature-range creep constitutive model of the material is constructed based on the creep data at different temperatures.
[0020] The beneficial effects of the high-throughput high-temperature creep testing device and method of the present invention include, for example: This high-throughput high-temperature creep testing apparatus provides a basic heat source through a heating component, raising the overall temperature of the specimen. A heat-converging element, positioned on one side of the specimen, directionally feeds back the spontaneously emitted radiant heat energy to a predetermined area. This heat redistribution method achieves precise enhancement of localized heating intensity without increasing additional energy consumption, thereby actively constructing a controllable temperature gradient from low to high temperatures along the specimen's length. This temperature gradient corresponds to different test temperatures at different axial positions on a single specimen. A loading component connects to the specimen and applies a predetermined creep load, simulating the material's service conditions. A deformation measurement device simultaneously acquires deformation data at multiple different locations within the temperature gradient range, covering the creep response across the entire temperature range. Through the synergistic operation of these structures, wide-temperature-range creep data, which traditionally requires multiple independent tests, can be obtained in a single test, significantly improving the testing efficiency of material creep performance.
[0021] The high-throughput high-temperature creep test method, using the aforementioned high-throughput high-temperature creep test device, can improve the problem of low test efficiency caused by the traditional creep test only being able to obtain single-point temperature data per test. Attached Figure Description
[0022] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.
[0023] Figure 1 This is a front view of the high-throughput high-temperature creep testing device provided in an embodiment of the present invention; Figure 2 This is a top view of the high-throughput high-temperature creep testing device provided in an embodiment of the present invention.
[0024] Icons: High-throughput high-temperature creep testing device-10; Sample-20; Inner cavity-21; Outer shell-30; Viewing window-31; Heating assembly-100; Heating electrode-110; Heat focusing element-200; Sub-element-210; Heat reflector-220; Loading assembly-300; Pressurization pipeline-310; Deformation measuring device-400; Laser diameter gauge-410; Temperature measuring device-500; Infrared thermometer-510; Controller-600; Data acquisition and analysis module-700. Detailed Implementation
[0025] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. It should be noted that the aspects described below with reference to the accompanying drawings and specific embodiments are merely exemplary and should not be construed as limiting the scope of protection of the present invention in any way.
[0026] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," "outer," or "vertical" appear, the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed when in use, and does not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.
[0027] At the same time, it should be noted that the terms "first" and "second" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.
[0028] In the description of this invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components, etc. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0029] Creep performance is a core indicator for evaluating the long-term reliability of high-temperature structural materials. Establishing a wide-temperature-range creep model requires acquiring a large amount of experimental data at different temperature points. However, long-standing technical specifications in the field of high-temperature creep testing have pursued absolute uniformity of the temperature field of the sample, neglecting the value of utilizing temperature gradients. All efforts in existing technologies have focused on reducing temperature fluctuations, resulting in only single-point data acquisition per test. When covering a temperature range of hundreds of degrees Celsius, it is necessary to conduct independent tests for each temperature point for thousands of hours, leading to long cycles, huge material consumption, and even infeasibility for scarce samples such as irradiated materials. Furthermore, the differences in conditions between multiple batches of tests affect the accuracy of the model. The high-throughput high-temperature creep testing device provided in this embodiment breaks through the traditional approach of temperature uniformity, actively constructing and utilizing temperature gradients on a single sample to achieve a high-throughput testing strategy, acquiring creep data at multiple temperature points within a wide temperature range in a single test.
[0030] The following is combined Figures 1 to 2 The high-throughput high-temperature creep testing device 10 provided in this embodiment will be described in detail.
[0031] Please refer to Figure 1 and Figure 2The present invention provides a high-throughput high-temperature creep testing device 10 for performing creep tests on a specimen 20. The device includes a heating assembly 100, a heat concentrating element 200, a loading assembly 300, and a deformation measuring device 400. The heating assembly 100 heats the specimen 20. The heat concentrating element 200 is disposed on one side of the specimen 20 and is used to directionally feed back the radiated heat energy from the specimen 20 to a predetermined area on the specimen 20, thereby forming a temperature gradient along the length of the specimen 20. The loading assembly 300 is connected to the specimen 20 and is used to apply a predetermined creep load to the specimen 20. The deformation measuring device 400 acquires deformation data at multiple different locations on the specimen 20 within the temperature gradient range.
[0032] The heat-concentrating element 200 enables directional feedback of radiant heat, locally enhancing the heating intensity of a predetermined area by utilizing the heat energy dissipated by the sample 20 itself without increasing additional energy consumption, thereby constructing a controllable temperature gradient on a single sample 20. The existence of the temperature gradient means that different axial positions on the sample 20 correspond to different test temperatures, providing a physical basis for subsequent multi-point deformation measurements. No complex multi-stage heating furnace is required; the temperature gradient can be constructed solely through the heat-concentrating element 200, simplifying the equipment structure and reducing costs.
[0033] It should be noted that "high throughput" in "high-throughput high-temperature creep testing device 10" refers to the function of simultaneously acquiring material property data at multiple temperature points within a wide temperature range in a single creep test, and "length direction of specimen 20" refers to... Figure 1 In the vertical direction of the specimen, "applying a predetermined creep load" aims to apply mechanical stress to the specimen 20 to induce creep. In a preferred embodiment, this load is the internal pressure created by filling the metal tube specimen 20 with high-pressure gas to simulate the service conditions of a pipeline. However, those skilled in the art will understand that the core concept of this embodiment is also applicable to other loading methods, such as applying an axial tensile load to a rod-shaped specimen 20 or a bending load to a plate-shaped specimen 20. As long as multi-point creep data can be obtained under this load, combined with the temperature gradient on the specimen 20, it should fall within the protection scope of this embodiment.
[0034] Reference Figure 1 and Figure 2 In this embodiment, the high-throughput high-temperature creep testing device 10 also includes a housing with a viewing window. The sample 20 is vertically arranged inside the housing. The heating component 100 is connected to the sample 20. The heat concentrating element 200 is arranged inside the housing and located on one side of the sample 20.
[0035] Reference Figure 1 and Figure 2In this embodiment, the heating component 100 is electrically connected to the sample 20. The heating component 100 is used to directly energize the sample 20 so that the sample 20 generates Joule heat.
[0036] Direct electric heating generates heat directly within the sample 20, avoiding heat conduction losses and thermal inertia associated with traditional furnace heating. This results in a rapid heating rate and high energy utilization. Since the heat source originates from the sample 20 itself, changes in current immediately reflect changes in the sample 20's temperature when temperature adjustment is needed, providing a foundation for precise subsequent temperature control. The combination of direct electric heating and the heat dissipation effect of the electrodes at both ends naturally creates a basic temperature distribution that is higher in the middle and lower at both ends.
[0037] Reference Figure 1 and Figure 2 In this embodiment, the heating assembly 100 includes a pair of heating electrodes 110, which are respectively clamped at both ends of the sample 20 and used to feed heating current into the sample 20.
[0038] Reference Figure 1 and Figure 2 In this embodiment, the heat gathering element 200 includes multiple sub-elements, which are arranged at intervals along the length of the sample 20, and each sub-element corresponds to a preset area.
[0039] Multiple sub-components are spaced apart along the length, allowing each preset region to be independently controlled, achieving fine-grained, segmented control of the temperature gradient distribution. By adjusting the heat convergence effect of sub-components at different positions, arbitrary preset temperature distribution curves such as linear gradients, step gradients, and peak gradients can be formed. The structure of multiple sub-components ensures that even if one sub-component fails, the others can still maintain basic heat convergence functions, improving system reliability.
[0040] Reference Figure 1 and Figure 2 In this embodiment, the sub-element includes at least one thermal reflective mirror 220, which is used to reflect the infrared thermal energy radiated by the sample 20 to a preset area.
[0041] By using a reflective mirror to redirect the infrared heat energy radiated from sample 20 back to its surface, energy recycling is achieved, improving heating efficiency. The reflective mirror does not have physical contact with sample 20, avoiding stress or contamination that may be introduced by traditional contact heating elements, ensuring the surface condition of sample 20 remains unaffected. Reflection control is a physical optical process with no thermal inertia, resulting in a fast adjustment response and facilitating dynamic temperature control.
[0042] Reference Figure 1 and Figure 2In this embodiment, the heat-reflecting mirror 220 is a curved mirror, which is arranged around at least a portion of the outer periphery of the sample 20.
[0043] The curved mirror design enables more efficient focusing of radiant heat back to the preset area, exhibiting higher heat convergence efficiency compared to a plane mirror. Positioned around the outer perimeter of the sample 20, it ensures uniform circumferential heating of the sample 20, avoiding the circumferential temperature unevenness caused by unilateral heating. The curved mirror's surrounding structure is compact, occupies little space, and facilitates integration with other components.
[0044] Reference Figure 1 and Figure 2 In this embodiment, the arrangement density of the heat converging element 200 is adjustable, the corresponding area of the heat converging element 200 and the sample 20 is adjustable, and the distance between the heat converging element 200 and the sample 20 is adjustable, so as to adjust the temperature of the preset area.
[0045] By adjusting the arrangement density to change the heat concentration intensity distribution per unit length; adjusting the corresponding area to change the effective range of heat concentration; and adjusting the distance to change the degree of heat concentration, multi-dimensional and precise control of the temperature gradient is achieved. When local temperature deviations occur during the experiment, they can be corrected by adjusting the above parameters in real time to maintain long-term stability of the temperature field.
[0046] Reference Figure 1 and Figure 2 In this embodiment, the heat gathering element 200 is configured such that, through directional feedback, the total temperature difference of the temperature gradient is greater than 100°C, and the temperature control deviation during the test is less than ±5°C.
[0047] Reference Figure 1 and Figure 2 In this embodiment, the sample 20 has an inner cavity 21; the loading assembly 300 includes a pressurization line 310, and the heating assembly 100 includes a heating electrode 110. The pressurization line 310 is connected to the inner cavity of the sample 20 and is used to fill the sample 20 with high-pressure gas to apply internal pressure; the heating electrode 110 is electrically connected to the sample 20 and is used to input heating current to the sample 20.
[0048] The pressurization line 310 and the heating electrode 110 are set separately, each performing an independent function, avoiding mutual interference that may be caused by integrated design, resulting in a simple and reliable structure. The loading pressure and heating current can be adjusted independently without affecting each other, facilitating the separate optimization of the loading and heating regimes.
[0049] In other embodiments, the heating electrode 110 may be configured as a hollow structure, pressurized through a central hole.
[0050] Reference Figure 1 and Figure 2In this embodiment, the deformation measuring device 400 includes a laser diameter gauge 410, which is used to scan along the length direction of the sample 20 to continuously acquire the outer diameter change data within the temperature gradient range.
[0051] Laser scanning can acquire outer diameter data at all locations across the entire temperature gradient, rather than being limited to individual points, providing a large amount of information and enabling high-throughput data acquisition. Laser non-contact measurement avoids the additional stress or damage that traditional extensometers may cause to the sample 20, making it particularly suitable for thin-walled pipes. Laser diameter measurement technology has micron-level spatial resolution and second-level temporal resolution, enabling it to capture minute changes in creep deformation.
[0052] In this embodiment, the scanning length of the laser diameter gauge 410 is not less than 10 cm, preferably 10 cm to 50 cm. The spatial resolution of the laser diameter gauge 410 is 0.01 mm, and the temporal resolution is 1 second.
[0053] In this embodiment, the high-throughput high-temperature creep testing device 10 further includes a temperature measuring device 500 and a controller 600. The temperature measuring device 500 is used to monitor the temperature distribution along the length of the sample 20 in real time. The controller 600 is communicatively connected to the temperature measuring device 500, the heating component 100 and / or the heat converging element 200, respectively. The controller 600 is used to dynamically adjust the heating power of the heating component 100 and / or the heat converging parameters of the heat converging element 200 according to the monitored temperature distribution.
[0054] Through real-time monitoring and dynamic feedback control, the effects of environmental temperature changes and power grid fluctuations on the temperature field can be offset, ensuring that the temperature gradient remains stable during tests lasting hundreds of hours. The controller 600 acts simultaneously on the heating component 100 and the heat-concentrating element 200, adjusting the overall heat generation and correcting localized temperature distortions. The control system can automatically adapt to the needs of different samples 20 and different target temperature distributions without manual intervention.
[0055] In this embodiment, the controller 600 is configured to: adjust the heating power of the heating component 100 when the overall temperature distribution deviates from the target value; and adjust the heat convergence parameters of the heat convergence element 200 when a local deviation from the target value is detected. The adjustment of the heat convergence parameters includes adjustable arrangement density of the heat convergence element 200, adjustable corresponding area between the heat convergence element 200 and the sample 20, and adjustable distance between the heat convergence element 200 and the sample 20. Overall deviation is adjusted by heating power, resulting in a fast response and wide impact range; local deviation is adjusted by heat convergence parameters, providing targeted control without affecting other areas. The two work together to achieve efficient and precise control of the temperature field.
[0056] Reference Figure 1 and Figure 2In this embodiment, the temperature measuring device 500 includes a multi-point distributed thermocouple or an infrared thermometer 510.
[0057] Multi-point thermocouples provide direct contact measurement, offering high accuracy and fast response, making them suitable for testing scenarios with extremely high temperature accuracy requirements. Infrared thermometry, a non-contact measurement method, does not interfere with the surface condition of the sample and can continuously acquire temperature distribution cloud maps along the entire axis, providing richer information.
[0058] Reference Figure 1 and Figure 2 In this embodiment, the high-throughput high-temperature creep testing device 10 also includes a data acquisition and analysis module 700. The data acquisition and analysis module 700 is communicatively connected to the deformation measurement device 400. The data acquisition and analysis module 700 is used to receive deformation data and convert the deformation data into creep data at different temperatures according to the pre-calibrated correspondence between the axial position of the sample 20 and the temperature.
[0059] Transforming raw physical measurement data into temperature-creep performance data directly usable in engineering bridges the gap between experimentation and modeling. Eliminating the need for manual point-by-point data processing improves post-processing efficiency and reduces human error. The output multi-temperature-point creep data can be directly used to fit creep constitutive model parameters, achieving seamless integration between experimentation and modeling.
[0060] An embodiment of the present invention also provides a high-throughput high-temperature creep testing method, implemented using a high-throughput high-temperature creep testing device 10, comprising the following steps: Step S1: The sample 20 is heated by the heating assembly 100; Step S2: The heat energy radiated by the sample 20 is fed back to a preset area on the sample 20 in a directional manner through the heat focusing element 200, thereby forming a temperature gradient in the length direction of the sample 20. Step S3: Apply a predetermined creep load to the specimen 20 by loading component 300; Step S4: Obtain deformation data at multiple different locations on the sample 20 within the temperature gradient range using the deformation measuring device 400.
[0061] In this embodiment, the high-throughput high-temperature creep test method further includes the following steps: Step S5: Based on the pre-calibrated correspondence between the axial position and temperature of the sample 20, the obtained deformation data is converted into creep data at different temperatures, and a wide-temperature-range creep constitutive model of the material is constructed based on the creep data at different temperatures.
[0062] In this embodiment, in the step of forming a temperature gradient, the total temperature difference of the temperature gradient is greater than 100℃, and the temperature control deviation during the test is less than ±5℃.
[0063] Specifically, before or during the formal test, the temperature values at different axial positions of the sample 20 are acquired using the temperature measuring device 500. A table or fitting curve showing the correspondence between axial position coordinates and temperature is established for subsequent temperature mapping of deformation data. The data acquisition and analysis module 700 is configured to fit the parameters of constitutive models such as the Norton creep equation or the θ projection method based on the creep data acquired at multiple temperature points, using the least squares method or the maximum likelihood estimation method.
[0064] According to the high-throughput high-temperature creep testing device 10 provided in this embodiment, the working principle of the high-throughput high-temperature creep testing device 10 includes: The metal tube sample 20 is heated by the heating component 100, and the heat energy radiated by the sample 20 is directionally fed back to the preset area by the heat focusing element 200, thereby establishing a stable and controllable temperature gradient (temperature difference > 100℃, control deviation < 5℃) along the length of the sample 20. The laser diameter gauge 410 in the deformation measuring device 400 continuously monitors the creep deformation over a long distance (10 cm to 50 cm). High-pressure gas is injected into the inner cavity 21 of the sample 20 through the pressurization pipeline 310 in the loading component 300 to apply internal pressure. The temperature measuring device 500 and the controller 600 monitor and dynamically adjust the heating power and heat focusing parameters in real time to maintain a stable temperature field. Finally, the data acquisition and analysis module 700 converts the deformation data into creep data at different temperatures according to the pre-calibrated axial position and temperature correspondence, realizing the simultaneous acquisition of creep curves and deformation rates at multiple temperature points within an average temperature range of ±50℃ in a single internal pressure creep test, which significantly improves the efficiency of material creep model development.
[0065] Specifically, the heating assembly 100 is electrically connected to the sample 20, and generates Joule heat in the sample 20 by direct energization; the heat converging element 200 is disposed on one side of the sample 20, including multiple sub-elements spaced apart along the length direction. The sub-elements can use a heat-reflecting mirror 220 (such as a curved mirror) to reflect infrared heat energy to a preset area, and the arrangement density, corresponding area, and distance of the heat converging element 200 from the sample 20 are adjustable to achieve fine control of the temperature gradient; the loading assembly 300 includes a pressurization line 310 communicating with the inner cavity 21 of the sample 20, and the heating assembly 100 includes heating electrodes 110 electrically connected to the sample 20, used for applying internal pressure and inputting current, respectively; the deformation measuring device 400 uses a laser diameter gauge 410 to scan a length of not less than 10 cm to 50 cm along the length direction of the sample 20. In a sample area of cm, the outer diameter change data within a temperature gradient range is continuously acquired to calculate radial creep strain and creep rate. The temperature measuring device 500 uses a multi-point distributed thermocouple or infrared thermometer 510 to monitor the axial temperature distribution in real time. The controller 600 dynamically adjusts the heating power and heat convergence parameters according to the monitoring results to ensure long-term stability of the temperature field. The data acquisition and analysis module 700 is connected to the deformation measuring device 400 to receive deformation data and convert it into creep data at different temperatures based on the axial position-temperature correspondence.
[0066] The specific steps are as follows: Install the metal tube sample 20 and connect the pressurization line 310 to the heating electrode 110; through the synergistic action of the heating component 100 and the heat-concentrating element 200, a target axial temperature gradient is set and formed; after the temperature field stabilizes, internal pressure is applied through the loading component 300 to begin the creep test; the outer diameter of the specified axial region (temperature distribution within ±50℃ of the target average temperature) is continuously scanned and recorded over time using a laser diameter gauge 410; based on the temperature-position mapping relationship, the deformation data is processed according to temperature zones, and creep strain-time data for each temperature point is extracted; finally, a classical creep model (such as the Norton equation) is used to fit the model parameters and construct a full-temperature-range creep constitutive model of the material. A classical creep model (such as the Norton creep relation dε / dt=Aexp(-Q / T)σ) is adopted. n We used the least squares method and other methods to fit the creep model parameters and construct a full-temperature-range creep constitutive model for the material.
[0067] The high-throughput high-temperature creep testing device 10 provided in this embodiment has at least the following advantages: An axial temperature gradient is constructed by a heat-concentrating element 200 set on one side of the heated sample 20. Combined with multi-point deformation measurement, creep data of multiple temperature points within an average temperature range of ±50℃ can be obtained in a single test, improving efficiency by more than 100 times.
[0068] The heating component 100 and the heat concentrating element 200 work together to achieve a stable temperature field with an axial temperature difference of >100℃ and a control deviation of <5℃, meeting the requirements of wide-temperature-range high-precision creep testing.
[0069] The laser diameter gauge 410 continuously scans along the axial direction of the sample 20 to obtain the outer diameter change at all positions within the temperature gradient range, breaking through the limitations of local measurement by traditional extensometers.
[0070] A single small-sized tubular sample of 20 can complete a wide temperature range test, which greatly saves material usage and is especially suitable for scarce samples such as irradiated materials and new alloys.
[0071] It can be extended to study non-uniform creep behavior under the coupling effect of temperature gradient and stress, and serve the life assessment of key components such as nuclear power plant heat transfer tubes and main steam pipes.
[0072] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.
Claims
1. A high-throughput high-temperature creep testing device for performing creep tests on samples, characterized in that, include: A heating assembly for heating the sample; A heat-gathering element is disposed on one side of the sample. The heat-gathering element is used to directionally feed back the heat energy radiated by the sample to a predetermined area on the sample, thereby forming a temperature gradient along the length of the sample. A loading component, which is connected to the specimen, is used to apply a predetermined creep load to the specimen; And a deformation measuring device, which is used to acquire deformation data at multiple different locations on the sample within the temperature gradient range.
2. The high-throughput high-temperature creep testing device according to claim 1, characterized in that: The heating component is electrically connected to the sample, and the heating component is used to directly energize the sample so that the sample itself generates Joule heat.
3. The high-throughput high-temperature creep testing device according to claim 1, characterized in that: The heat-gathering element includes multiple sub-elements, which are arranged at intervals along the length of the sample, and each sub-element corresponds to a preset area.
4. The high-throughput high-temperature creep testing device according to claim 3, characterized in that: The sub-element includes at least one thermal reflective mirror, which is used to reflect the infrared thermal energy radiated by the sample to the preset area.
5. The high-throughput high-temperature creep testing device according to claim 4, characterized in that: The heat-reflecting mirror is a curved mirror, which is arranged around at least a portion of the outer periphery of the sample.
6. The high-throughput high-temperature creep testing apparatus according to any one of claims 3-5, characterized in that: The arrangement density of the heat-gathering elements is adjustable, the corresponding area of the heat-gathering elements and the sample is adjustable, and the distance between the heat-gathering elements and the sample is adjustable, so as to regulate the temperature of the preset area.
7. The high-throughput high-temperature creep testing device according to claim 1, characterized in that: The sample has an inner cavity; the loading assembly includes a pressurization line, the heating assembly includes a heating electrode, the pressurization line is connected to the inner cavity of the sample and is used to pressurize the sample with high-pressure gas to apply internal pressure; the heating electrode is electrically connected to the sample and is used to input a heating current to the sample.
8. The high-throughput high-temperature creep testing device according to claim 1, characterized in that: The deformation measuring device includes a laser diameter gauge, which is used to scan along the length direction of the sample to continuously acquire data on the outer diameter change within the temperature gradient range.
9. The high-throughput high-temperature creep testing device according to claim 1, characterized in that: The high-throughput high-temperature creep testing device further includes a temperature measuring device and a controller. The temperature measuring device is used to monitor the temperature distribution along the length of the sample in real time. The controller is communicatively connected to the temperature measuring device, the heating component, and / or the heat focusing element. The controller is used to dynamically adjust the heating power of the heating component and / or the heat focusing parameters of the heat focusing element according to the monitored temperature distribution.
10. The high-throughput high-temperature creep testing device according to claim 9, characterized in that: The temperature measuring device includes a multi-point distributed thermocouple or an infrared thermometer.
11. The high-throughput high-temperature creep testing device according to claim 9, characterized in that: The high-throughput high-temperature creep testing device also includes a data acquisition and analysis module, which is communicatively connected to the deformation measurement device. The data acquisition and analysis module is used to receive the deformation data and convert the deformation data into creep data at different temperatures according to the pre-calibrated correspondence between the axial position of the specimen and the temperature.
12. A high-throughput high-temperature creep testing method, implemented using the high-throughput high-temperature creep testing apparatus according to any one of claims 1-11, characterized in that, Includes the following steps: The sample is heated by the heating assembly. The heat-concentrating element directs the heat energy radiated by the sample back to a predetermined area on the sample, thereby creating a temperature gradient along the length of the sample. A predetermined creep load is applied to the specimen by the loading component; The deformation measurement device acquires deformation data at multiple different locations on the sample within the temperature gradient range.
13. The high-throughput high-temperature creep testing method according to claim 12, characterized in that, The high-throughput high-temperature creep test method further includes the following steps: Based on the pre-calibrated correspondence between the axial position and temperature of the sample, the obtained deformation data is converted into creep data at different temperatures, and a wide-temperature-range creep constitutive model of the material is constructed based on the creep data at different temperatures.