Electronic device

Abstract

An electronic device includes a first mirror display, a second mirror display, and a reflection component. The second mirror display is disposed adjacent to the first mirror display. The reflection component is disposed between the first mirror display and the second mirror display.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to a mirror display device. Background Technology

[0002] With the development of digital technology, display devices have been widely used in all aspects of daily life, such as modern information products like televisions, computers, and mobile phones. In addition, display devices with a mirror effect have emerged and gradually become more common in recent years; however, mirrored display devices may exhibit visual discontinuities at the edges or seams. Summary of the Invention

[0003] This invention provides an electronic device that can provide a reflective effect at the edges or seams of a mirror display device, effectively reducing visual discontinuity.

[0004] An electronic device according to the present invention includes a first mirror display, a second mirror display, and a reflective component. The second mirror display is disposed adjacent to the first mirror display; the reflective component is disposed between the first mirror display and the second mirror display.

[0005] According to another electronic device of the present invention, a first substrate, a second substrate, a light-emitting unit, a reflective layer, an adhesive layer, and a reflective component are included. The second substrate is disposed relative to the first substrate; the light-emitting unit is disposed on the first substrate; the reflective layer is disposed between the first substrate and the second substrate and includes an opening overlapping the light-emitting unit; the adhesive layer is disposed between the first substrate and the second substrate; and the reflective component is disposed on the side of the reflective layer and the side of the adhesive layer. Attached Figure Description

[0006] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein:

[0007] Figure 1 This is a schematic diagram illustrating the manufacturing process of an electronic device according to an embodiment of the present invention.

[0008] Figure 2 This is a cross-sectional schematic diagram of the electronic device according to the first embodiment of the present invention.

[0009] Figure 3 This is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention.

[0010] Figure 4 This is a schematic diagram illustrating the manufacturing process of an electronic device according to a third embodiment of the present invention.

[0011] Figure 5 This is a schematic diagram of an electronic device according to a fourth embodiment of the present invention.

[0012] Figure 6 This is a schematic diagram of an electronic device according to the fifth embodiment of the present invention.

[0013] Figure 7 This is a schematic diagram of an electronic device according to the sixth embodiment of the present invention.

[0014] Figures 8A to 8C This is a schematic diagram illustrating different embodiments of the electronic device according to the seventh embodiment of the present invention.

[0015] Figures 9A to 9B This is a schematic diagram illustrating different embodiments of the electronic device according to the eighth embodiment of the present invention.

[0016] Figures 10A to 10B This is a schematic diagram illustrating different embodiments of the electronic device according to the ninth embodiment of the present invention.

[0017] Figures 11A to 11B This is a schematic diagram illustrating different embodiments of the electronic device according to the tenth embodiment of the present invention.

[0018] Figures 12A to 12B This is a schematic diagram illustrating different embodiments of the electronic device according to the eleventh embodiment of the present invention. Detailed Implementation

[0019] The following description, with reference to the accompanying drawings, illustrates an electronic device according to a preferred embodiment of the present invention, wherein the same components are described using the same reference numerals. It should be understood that the following description provides many different embodiments for implementing various embodiments of the present invention. The specific components and arrangements described below are merely for the simple and clear description of some embodiments of the present invention. Of course, these embodiments are illustrative only and not intended to limit the scope of the invention. Furthermore, repeated reference numerals or designations may be used in different embodiments; these repetitions are merely for the simple and clear description of some embodiments of the present invention and do not represent any association between the different embodiments and / or structures discussed. Moreover, when it is mentioned that a component is located on or above another component, this includes a situation where one component is in direct contact with another component; or, it may also include a situation where one or more other components are spaced apart, in which case one component may not be in direct contact with another component.

[0020] Furthermore, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one component of the figures to another component. It is understood that if the apparatus in the figures is flipped so that it is upside down, the component described as being on the "lower" side will become the component on the "higher" side.

[0021] Here, the terms "about," "approximately," and "roughly" generally indicate within 20% of a given value or range, preferably within 10%, and even more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. The quantities given here are approximate quantities, meaning that the meaning of "about," "approximately," and "roughly" may be implied even without specific mention of them.

[0022] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, constituent parts, regions, layers, and / or portions, these components, constituent parts, regions, layers, and / or portions should not be limited by these terms, and these terms are only used to distinguish different components, constituent parts, regions, layers, and / or portions. Therefore, a first component, constituent part, region, layer, and / or portion discussed below may be referred to as a second component, constituent part, region, layer, and / or portion without departing from the teachings of some embodiments of the present invention.

[0023] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of the invention.

[0024] Some embodiments of the present invention can be used in conjunction with the appendix. Figure 1 It should be understood that the accompanying drawings of the embodiments of the present invention are also considered part of the description of the embodiments of the present invention. It should be understood that the drawings of the embodiments of the present invention are not shown to scale of the actual devices and components. The shape and thickness of the embodiments may be exaggerated in the drawings to clearly illustrate the features of the embodiments of the present invention. Furthermore, the structures and devices in the drawings are shown schematically to clearly illustrate the features of the embodiments of the present invention.

[0025] In some embodiments of the present invention, relative terms such as "down," "up," "parallel," "vertical," "below," "above," "top," "bottom," etc., should be understood as the orientation shown in the paragraph and related drawings. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation. Terms related to joining or connecting, such as "connected" or "linked," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact but with another structure disposed between them. Furthermore, these terms related to joining or connecting may also include cases where both structures are movable or both structures are fixed.

[0026] It should be understood that, without departing from the spirit of the present invention, features in several different embodiments can be replaced, recombined, or mixed to complete other embodiments.

[0027] Please refer to Figure 1 As shown, Figure 1 This is a schematic diagram illustrating the manufacturing process of an electronic device according to an embodiment of the present invention.

[0028] like Figure 1 As shown, the electronic device of the present invention includes a first mirror display 20, a second mirror display 30, and a reflective component. For example, in the manufacturing process of the electronic device, the first mirror display 20 and the second mirror display 30 can be manufactured separately first, and then the first mirror display 20 and the second mirror display 30 can be fixedly mounted on a mold 90, such as a carrier mold. At this time, the first mirror display 20 and the second mirror display 30 can be arranged adjacent to each other along a first direction X, and a gap G can be reserved between the first mirror display 20 and the second mirror display 30; wherein, the first direction X is, for example, parallel to the surface of the mold 90, the first mirror display 20, or the second mirror display 30. Then, the reflective material used to form the reflective component is filled into the gap G along arrow A (parallel to the second direction Y). Depending on the different ways the reflective material is filled into the gap G, reflective components of different shapes and / or positions can be formed between the first mirror display 20 and the second mirror display 30. The second direction Y is, for example, perpendicular to the mold 90, the surface of the first mirror display 20, or the second mirror display 30. The reflective material used can include, for example, a polymer adhesive containing metal powder. The polymer adhesive can be, for example, but not limited to, optically transparent adhesive (OCA) or optically transparent resin (OCR). The metal powder material can be, for example, but not limited to, aluminum (Al), molybdenum (Mo), chromium (Cr), silver (Ag), iron (Fe), gold (Au), nickel (Ni), or any combination of the aforementioned materials; this invention is not limited thereto. After the reflective component is formed, that is, after the polymer adhesive has cured, the mold 90 can be removed, and electronic devices of different embodiments and different implementations can be manufactured, as detailed below. It should be noted that the electronic device may be, for example, but not limited to, a splicing display device, and the gap G may define the splicing seam between any two adjacent mirror displays; furthermore, the electronic device may be composed of two or more mirror displays spliced ​​together, and the present invention does not limit this.

[0029] Figure 2This is a cross-sectional schematic diagram of the electronic device 10 according to a first embodiment of the present invention. In this embodiment, the electronic device 10 includes a first mirror display 20, a second mirror display 30, and a reflective component 40. The first mirror display 20 and the second mirror display 30 are disposed adjacent to each other, and the reflective component 40 is disposed between the first mirror display 20 and the second mirror display 30. The first mirror display 20 includes a first substrate 21, a second substrate 22, a light-emitting unit 23, and a reflective layer 24. The first substrate 21 and the second substrate 22 are disposed opposite to each other. The light-emitting unit 23 is disposed on the first substrate 21, and the reflective layer 24 is disposed between the first substrate 21 and the second substrate 22, and includes an opening O1 overlapping the light-emitting unit 23. In addition, the first mirror display 20 further includes, for example, a light-absorbing layer 25 and an adhesive layer 26. The light-absorbing layer 25 is disposed on the side of the reflective layer 24 adjacent to the first substrate 21, and the adhesive layer 26 is disposed between the first substrate 21 and the second substrate 22. Similarly, the second mirror display 30 includes a first substrate 31, a second substrate 32, a light-emitting unit 33, a reflective layer 34, a light-absorbing layer 35, and an adhesive layer 36. The first substrate 31 and the second substrate 32 are disposed opposite to each other. The light-emitting unit 33 is disposed on the first substrate 31. The reflective layer 34 is disposed between the first substrate 31 and the second substrate 32 and includes an opening O2 overlapping the light-emitting unit 33. The light-absorbing layer 35 is disposed on the side of the reflective layer 34 adjacent to the first substrate 31. The adhesive layer 36 is disposed between the first substrate 31 and the second substrate 32.

[0030] As described above, the first substrates 21 and 31 may include, but are not limited to, transparent or opaque organic and / or inorganic materials, which may include rigid materials or flexible soft materials. Organic materials may include polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other known suitable materials, or combinations thereof, but are not limited thereto. Inorganic materials may include glass, quartz, sapphire, or ceramic, but are not limited thereto. In this embodiment, the first substrates 21 and 31 are exemplified by glass; that is, the first substrates 21 and 31 are each a glass substrate.

[0031] It should be noted that circuit layers (not shown) may be respectively disposed on the first substrates 21 and 31. These circuit layers may include various passive and / or active components, such as resistors, capacitors, inductors, diodes, MOSFETs, CMOS transistors, BJTs, lateral diffusion MOSFETs, high-power MOSFETs, thin-film transistors (TFTs), or other types of transistors. The first substrates 21 and 31 and their circuit layers can together constitute a driving substrate for driving the light-emitting units 23 and 33 to emit light. For example, they may be CMOS substrates, liquid crystal on silicon (LCOS) substrates, thin-film transistor substrates, or other circuit substrates with operating circuits; this invention is not limited thereto. In this embodiment, the first substrates 21 and 31 and their circuit layers constitute, for example, a thin-film transistor substrate. The above description is merely illustrative and not intended to limit the scope of the invention.

[0032] The second substrates 22 and 32 may be, for example, but not limited to, a transparent substrate, such as a glass substrate, and are not limited thereto in this invention.

[0033] Light-emitting units 23 and 33 can be electrically connected to the circuit layers of the first substrates 21 and 31, respectively. In practice, a pixel definition layer can be formed on the first substrates 21 and 31, which can be, for example, a negative photoresist and has multiple accommodating spaces. Each light-emitting unit 23 can, for example, include three light-emitting components 23a, 23b, and 23c, and each light-emitting unit 33 can, for example, include three light-emitting components 33a, 33b, and 33c, which are respectively disposed in the accommodating spaces of the pixel definition layer. For example, each light-emitting component 23a, 23b, 23c, 33a, 33b, and 33c can, for example, include liquid crystal, organic light-emitting diode (OLED), inorganic light-emitting diode (LED) (e.g., mini LED, micro LED), quantum dot light-emitting diode (QLED), fluorescence, phosphorescence, other suitable materials, or combinations of the above materials, but the present invention is not limited thereto. In this embodiment, the three light-emitting components of each light-emitting unit, such as three light-emitting components 23a, 23b, and 23c, or three light-emitting components 33a, 33b, and 33c, can be, for example, a red micro-light-emitting diode, a green micro-light-emitting diode, and a blue micro-light-emitting diode, respectively. The above description is merely illustrative and is not intended to limit the scope of the present invention.

[0034] A reflective layer 24 is disposed on the side of the second substrate 22 adjacent to the first substrate 21, while a reflective layer 34 is disposed on the side of the second substrate 32 adjacent to the first substrate 31. In this embodiment, a reflective material layer can be formed on one side of the second substrate 22 first, and then the portion of the reflective material layer corresponding to the light-emitting components 23a, 23b, and 23c of the light-emitting unit 23 can be removed to form a reflective layer 24 with multiple openings O1; similarly, a reflective material layer can be formed on one side of the second substrate 32 first, and then the portion of the reflective material layer corresponding to the light-emitting components 33a, 33b, and 33c of the light-emitting unit 33 can be removed to form a reflective layer 34 with multiple openings O2. It should be noted that the width of each opening O1, O2 (along the first direction X) can be equal to or slightly greater than the width of the corresponding light-emitting components 23a, 23b, 23c, 33a, 33b, 33c. For example, the distance d4 from the inner edge of opening O1 to the outer edge of each light-emitting component 23a, 23b, 23c and the distance d5 from the inner edge of opening O2 to the outer edge of each light-emitting component 33a, 33b, 33c can be less than or equal to 40μm or less than or equal to 25μm, and this invention does not limit it. The reflective layers 24 and 34 can be made of materials such as a single metal layer, a composite metal layer, a multilayer film material, or other suitable material layers. The single metal layer can include, for example, silver or aluminum. The composite metal layer can include, for example, a composite structure of materials such as metals or metal oxides, such as, but not limited to, indium tin oxide / silver / indium tin oxide (ITO / Ag / ITO), silver / indium tin oxide (Ag / ITO), aluminum / silver / aluminum (Al / Ag / Al), silver / aluminum (Ag / Al), etc. The multilayer film material can include, for example, a multilayer film with at least three overlapping layers of high and low refractive indices, wherein the low refractive index material can be, for example, silicon oxide (SiOx), and the high refractive index material can be, for example, silicon nitride (SiNx), niobium oxide (Nb2O5), etc., but the present invention is not limited thereto.

[0035] The light-absorbing layers 25 and 35 can be, for example, but not limited to, a black photoresist layer. These layers can be formed on the side of the reflective layers 24 and 34 away from the second substrate 22 and 32, in conjunction with the pattern design of multiple openings O1 and O2, thereby forming a black matrix layer (BM). That is, the light-absorbing layers 25 and 35 can also have corresponding openings at the corresponding openings O1 and O2. In this embodiment, as... Figure 2As shown, reflective layers 24 and 34 are respectively stacked on light-absorbing layers 25 and 35. The width of the light-absorbing layers 25 and 35 in the first direction X can, for example, be less than or equal to the width of the reflective layers 24 and 34, and the width of the light-absorbing layers 25 and 35 can, for example, be greater than or equal to 50% of the width of the reflective layers 24 and 34, but this invention is not limited thereto. For example, taking the first mirror display 20 as an example, between the two openings O1, the width W2 of the light-absorbing layer 25 in the first direction X is less than or equal to the width W1 of the reflective layer 24, and the width W2 of the light-absorbing layer 25 is greater than or equal to 50% of the width W1 of the reflective layer 24. In some embodiments, the distance between one side edge of the light-absorbing layers 25 and 35 and the corresponding side edge of the reflective layers 24 and 34 in the first direction X is between 1 μm and 5 μm, but this invention is not limited thereto.

[0036] The adhesive layers 26 and 36 can be, for example, but not limited to, an optically transparent adhesive (OCA) or an optically transparent resin (OCR), etc., and are not limited thereto in this invention. In one embodiment, when manufacturing the first mirror display 20, the light-emitting unit 23 can be disposed on the first substrate 21, and the reflective layer 24 and the light-absorbing layer 25 can be disposed on the second substrate 22. Then, an adhesive material layer can be used to bond the structure of the first substrate 21 and the structure of the second substrate 22. The adhesive material layer can be, for example, an optically transparent adhesive or an optically transparent resin. After curing, the adhesive material layer can form the adhesive layer 26. In addition, the second mirror display 30 can also be manufactured in the same manner as described above, and will not be described in detail here.

[0037] In this embodiment, as Figure 2 As shown, the reflective component 40 is disposed between the second substrate 22 of the first mirror display 20 and the second substrate 32 of the second mirror display 30. It should be noted that in this embodiment, the reflective component 40 may be disposed only in the seam between the second substrate 22 of the first mirror display 20 and the second substrate 32 of the second mirror display 30; however, in other embodiments, the reflective component 40 may be disposed slightly larger than the seam between the second substrate 22 of the first mirror display 20 and the second substrate 32 of the second mirror display 30, that is, the reflective component 40 may partially overlap the reflective layer 24 of the first mirror display 20 and / or the reflective layer 34 of the second mirror display 30 in the first direction X. This is not limited by the present invention. In some embodiments, the reflective component 40 may, for example, contain a compressible material, which is not limited by the present invention. Furthermore, the reflectivity of the reflective component 40 may, for example, be greater than 30%, preferably greater than 60%, while the overall reflectivity of the electronic device 10 may, for example, be greater than 30%.

[0038] It should be noted that, Figure 2The first mirror display 20 is shown to have three light-emitting components 23a, 23b, and 23c, that is, one light-emitting unit 23 or one pixel. However, in practice, the first mirror display 20 can have multiple pixels arranged along the first direction X. Similarly, the second mirror display 30 has the same configuration. Figure 2 The illustrations are for illustrative purposes only and are not intended to be limiting. Furthermore, the electronic device 10 may be composed of two or more mirror displays spliced ​​together; this invention is not limited to this. In this embodiment, the width (along the first direction X) of one or more pixels (e.g., including three light-emitting components 23a, 23b, 23c) is D, that is, the width D can be considered as the width of the light-emitting area of ​​the first mirror display 20 or the second mirror display 30. In each mirror display (e.g., the first mirror display 20 or the second mirror display 30), the distance (along the first direction X) between the pixel closest to the reflective component 40 (or the seam) and the edge of each mirror display (e.g., the first mirror display 20 or the second mirror display 30) is d1, and the width (along the first direction X) of the reflective component 40 is d2. At this time, the distance between the pixel of the first mirror display 20 closest to the reflective component 40 (or the splicing seam) and the pixel of the second mirror display 30 closest to the reflective component 40 (or the splicing seam) can be defined as (2d1+d2). In order to avoid or reduce the impact of the splicing seam between the first mirror display 20 and the second mirror display 30 on the displayed image, the above-mentioned distance (2d1+d2) can be designed to be approximately equal to the distance between any two adjacent pixels in the first mirror display 20 or the second mirror display 30. For example, the two can be equal, or the difference between the two can be within ±10%, which is not limited in this invention.

[0039] Figure 3 This is a cross-sectional schematic diagram of the electronic device 10A according to the second embodiment of the present invention.

[0040] like Figure 3 The configuration and connection relationships of the components of the electronic device 10A shown are as follows: Figure 2The components of the electronic device 10 shown are configured and connected in a generally similar manner. The difference lies in that the electronic device 10A further includes a refractive index matching layer 50, disposed between the second substrate 22 of the first mirror display 20 and the second substrate 32 of the second mirror display 30, while the reflective component 40 is disposed between the reflective layer 24 of the first mirror display 20 and the reflective layer 34 of the second mirror display 30. In this embodiment, the refractive index of the refractive index matching layer 50 mainly corresponds to and matches the refractive index of the second substrates 22 and 32, in order to prevent external light from generating large-angle refracted light at the interface between the second substrates 22 and 32 and the seam (i.e., the refractive index matching layer 50). For example, relative to visible light, the difference between the refractive index of the refractive index matching layer 50 and the refractive index of the second substrates 22 and 32 can be less than or equal to 0.2.

[0041] Other features of the electronic device 10A can be found in the description of the foregoing embodiments, and will not be repeated here.

[0042] Figure 4 This is a schematic diagram of the manufacturing process of the electronic device 10B according to the third embodiment of the present invention.

[0043] like Figure 4 The configuration and connection relationships of the components of the electronic device 10B shown are as follows: Figure 3 The components of the electronic device 10A shown are configured and connected in a generally similar manner. The difference between the two is that the electronic device 10B may be mainly composed of a mirror display (such as the aforementioned first mirror display 20). The reflective component 40 extends downward (along the second direction Y) from the lower surface of the second substrate 22 to the lower surface of the first substrate 21. That is, the reflective component 40 is disposed on the side of the reflective layer 24, the side of the light-absorbing layer 25, the side of the adhesive layer 26, and the side of the first substrate 21. In addition, the first mirror display 20 further includes a compressible layer 27 disposed between the adhesive layer 26 and the reflective component 40. The compressible layer 27 may, for example, contain a compressible material. In addition, the reflective component 40 may also contain a compressible material. This invention does not limit this. In this embodiment, a first mirror display 20 is first obtained, and then a compressible layer 27 is formed on the side of the first mirror display 20, such that the compressible layer 27 is disposed on the side of the light-absorbing layer 25 and the adhesive layer 26; next, a reflective component 40 is formed on the side of the first mirror display 20, such that the reflective component 40 is disposed on the side of the reflective layer 24, the compressible layer 27 and the first substrate 21; finally, a refractive index matching layer 50 is formed on the upper side of the reflective component 40, such that the refractive index matching layer 50 is disposed on the side of the second substrate 22. The above description is only an example and is not intended to limit the scope of the present invention, and other features of the electronic device 10B can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0044] Figure 5This is a schematic diagram of an electronic device 10C according to a fourth embodiment of the present invention.

[0045] like Figure 5 The configuration and connection relationships of the components of the electronic device 10C shown are as follows: Figure 3 The components of the electronic device 10A shown are configured and connected in a generally similar manner. The difference lies in that the reflective component 40 of the electronic device 10C extends downward (along the second direction Y) from the lower surface of the second substrates 22 and 32 to the lower surface of the first substrates 21 and 31. That is, the reflective component 40 is disposed between the reflective layer 24 and the reflective layer 34, between the light-absorbing layer 25 and the light-absorbing layer 35, between the adhesive layer 26 and the adhesive layer 36, and between the first substrate 21 and the first substrate 31. In addition, the first mirror display 20 further includes a compressible layer 27 disposed between the adhesive layer 26 and the reflective component 40, and the second mirror display 30 further includes a compressible layer 37 disposed between the adhesive layer 36 and the reflective component 40. The compressible layers 27 and 37 may, for example, contain a compressible material. Furthermore, the reflective component 40 may, for example, contain a compressible material, which is not limited by this invention. In other words, the electronic device 10C of this embodiment can be assembled from multiple electronic devices 10B of the aforementioned embodiments. In this embodiment, the compressible layers 27 and 37 at the seam can change their width under stress during the splicing process. Therefore, the width of the compressible layers 27 and 37 at the seam can, for example, be smaller than the width of the compressible layers 27 and 37 located at the outermost edge of the electronic device 10C. Specifically, in each mirror display (e.g., the first mirror display 20 or the second mirror display 30), the distance (along the first direction X) between the pixel closest to the reflective component 40 (or the seam) and the edge of each mirror display (e.g., the first mirror display 20 or the second mirror display 30) is d1. The width (along the first direction X) of the reflective component 40 disposed on the side of the first mirror display 20 and the width of the reflective component 40 disposed on the side of the second mirror display 30 are d3 respectively. At this time, after the first mirror display 20 and the second mirror display 30 are spliced, the first mirror display... The distance between the pixel of the first mirror display 20 closest to the reflective component 40 (or the seam) and the pixel of the second mirror display 30 closest to the reflective component 40 (or the seam) can be defined as (2d1 + 2d3). To avoid or reduce the impact of the seam between the first mirror display 20 and the second mirror display 30 on the displayed image, the distance (2d1 + 2d3) can be designed to be approximately equal to the distance between any two adjacent pixels in the first mirror display 20 or the second mirror display 30. For example, they can be equal, or the difference between them can be within ±10%, which is not limited in this invention. Other features of the electronic device 10C can be referred to the description of the foregoing embodiments and will not be repeated here.

[0046] Figure 6This is a schematic diagram of an electronic device 10D according to a fifth embodiment of the present invention.

[0047] like Figure 6 The configuration and connection relationships of the components of the electronic device 10D shown are as follows: Figure 4 The components of the electronic device 10B shown are configured and connected in a largely similar manner. The difference lies in that the electronic device 10D may not have the compressible layer 27. It should be noted that the reflective component 40 in this embodiment may, for example, contain a compressible material. Other features of the electronic device 10D can be found in the description of the foregoing embodiments, and will not be repeated here.

[0048] Figure 7 This is a schematic diagram of an electronic device according to the sixth embodiment of the present invention.

[0049] like Figure 7 The configuration and connection relationships of the components of the electronic device 10E shown are as follows: Figure 5 The components of the electronic device 10C shown are configured and connected in a largely similar manner. The difference lies in that the electronic device 10E may not have the compressible layers 27 and 37. In other words, the electronic device 10E of this embodiment can be assembled from multiple electronic devices 10D of the aforementioned embodiments. It should be noted that the reflective component 40 of this embodiment may, for example, contain a compressible material. Other features of the electronic device 10E can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0050] Figures 8A to 8C This is a schematic diagram illustrating different embodiments of the electronic device according to the seventh embodiment of the present invention.

[0051] like Figure 8A The configuration and connection relationships of the components of the electronic device 10F shown are as follows: Figure 2 The components of the electronic device 10 shown are configured and connected in a generally similar manner. The difference lies in that, in electronic device 10F, the reflective layer 24 of the first mirror display 20 is disposed on the side of the first substrate 21 adjacent to the second substrate 22, the reflective layer 34 of the second mirror display 30 is disposed on the side of the first substrate 31 adjacent to the second substrate 32, the adhesive layer 26 is disposed between the second substrate 22 and the reflective layer 24, and the adhesive layer 36 is disposed between the second substrate 32 and the reflective layer 34. In this embodiment, the reflective component 40 is disposed between the second substrate 22 of the first mirror display 20 and the second substrate 32 of the second mirror display 30. Other features of electronic device 10F can be referred to the description of the foregoing embodiments and will not be repeated here.

[0052] like Figure 8B The configuration and connection relationships of the components of the electronic device 10G shown are as follows: Figure 8AThe components of the electronic device 10F shown are configured and connected in a generally similar manner. The difference lies in that, in the electronic device 10G, the reflective component 40 is disposed between the first substrate 21 and the first substrate 31, between the reflective layer 24 and the reflective layer 34, between the adhesive layer 26 and the adhesive layer 36, and between the second substrate 22 and the second substrate 32. Other features of the electronic device 10G can be found in the description of the foregoing embodiments and will not be repeated here.

[0053] like Figure 8C The configuration and connection relationships of the components of the electronic device 10H shown are as follows: Figure 8A The components of the electronic device 10F shown are configured and connected in a generally similar manner. The difference lies in that, in the electronic device 10H, the reflective component 40 is disposed between the first substrate 21 and the first substrate 31, and between the reflective layer 24 and the reflective layer 34. Furthermore, the electronic device 10H includes a refractive index matching layer 50 disposed between the adhesive layer 26 and the adhesive layer 36, and between the second substrate 22 and the second substrate 32. Other features of the electronic device 10H can be found in the description of the foregoing embodiments and will not be repeated here.

[0054] Figures 9A to 9B This is a schematic diagram illustrating different embodiments of the electronic device according to the eighth embodiment of the present invention.

[0055] like Figure 9A The configuration and connection relationships of the components of the electronic device 10I shown are as follows: Figure 2 The components of the electronic device 10 shown are configured and connected in a generally similar manner. The difference lies in that, in electronic device 10I, the reflective component 40 extends downward (along the second direction Y) from the upper surface of the second substrates 22 and 32 to the lower surface of the first substrates 21 and 31. That is, the reflective component 40 is disposed between the second substrates 22 and 32, between the reflective layer 24 and 34, between the light-absorbing layer 25 and 35, between the adhesive layer 26 and 36, and between the first substrates 21 and 31. Other features of electronic device 10I can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0056] like Figure 9B The configuration and connection relationships of the components of the electronic device 10J shown are as follows: Figure 9AThe components of the electronic device 10I shown are configured and connected in a generally similar manner. The difference lies in that, in electronic device 10J, the reflective component 40 is disposed between reflective layers 24 and 34, between light-absorbing layers 25 and 35, between adhesive layers 26 and 36, and between the first substrate 21 and 31. Furthermore, electronic device 10J includes a refractive index matching layer 50 disposed between the second substrate 22 and 32. Additionally, the distance between the pixel of the first mirror display 20 closest to the reflective component 40 (or the seam) and the pixel of the second mirror display 30 closest to the reflective component 40 (or the seam) can be defined as (2d1 + d2). It should be noted that although... Figure 9B The structural design of the electronic device 10J shown is the same as described above. Figure 7 The electronic devices 10E shown have a largely similar structural design, but they can be manufactured in different ways, for example, Figure 9B The electronic device 10J shown can be used Figure 1 The manufacturing method shown involves placing the first mirror display 20 and the second mirror display 30 on the mold 90, and then filling the gap G between the first mirror display 20 and the second mirror display 30 with the reflective component 40 and the refractive index matching layer 50. Figure 7 The electronic device 10E shown has reflective components 40 and refractive index matching layers 50 formed on both sides of the first mirror display 20 and the second mirror display 30, respectively. Figure 6 (as shown), and then the two are spliced ​​together. Other features of the electronic device 10J can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0057] Figures 10A to 10B This is a schematic diagram illustrating different embodiments of the electronic device according to the ninth embodiment of the present invention.

[0058] like Figure 10A The configuration and connection relationships of the components of the electronic device 10K shown are as follows: Figure 9AThe components of the electronic device 10I shown are configured and connected in a generally similar manner. The difference lies in that, in the electronic device 10K, the reflective component 40 extends downward (along the second direction Y) from the upper surface of the second substrates 22 and 32 to the lower surface of the reflective layers 24 and 34. That is, the reflective component 40 is disposed between the second substrates 22 and 32, and between the reflective layers 24 and 34. However, in other embodiments, the reflective component 40 may only be disposed between the second substrates 22 and 32, and not between the reflective layers 24 and 34. Furthermore, the first mirror display 20 further includes a color filter unit 28 disposed in the opening O1 between the reflective layer 24 and the light-absorbing layer 25, and corresponding to the light-emitting unit 23. For example, in one pixel, the color filter unit 28 may include three color filter components 28a, 28b, and 28c, such as a red filter component, a green filter component, and a blue filter component, respectively corresponding to the three light-emitting components 23a, 23b, and 23c below. Similarly, the second mirror display 30 further includes a color filter unit 38 disposed in the opening O2 between the reflective layer 34 and the light-absorbing layer 35, and corresponding to the light-emitting unit 33. For example, in one pixel, the color filter unit 38 may include three color filter components 38a, 38b, and 38c, such as a red filter component, a green filter component, and a blue filter component, respectively corresponding to the three light-emitting components 33a, 33b, and 33c below. Other features of the electronic device 10K can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0059] like Figure 10B The configuration and connection relationships of the components of the electronic device 10L shown are as follows: Figure 10A The components of the electronic device 10K shown are configured and connected in a generally similar manner. The difference lies in that, in electronic device 10L, the reflective component 40 is disposed between reflective layer 24 and reflective layer 34, and electronic device 10L further includes a refractive index matching layer 50 disposed between second substrate 22 and second substrate 32. Other features of electronic device 10L can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0060] Figures 11A to 11B This is a schematic diagram illustrating different embodiments of the electronic device according to the tenth embodiment of the present invention.

[0061] like Figure 11A The configuration and connection relationships of the components of the electronic device 10M shown are as follows: Figure 10AThe components of the electronic device 10K shown are configured and connected in a generally similar manner. The difference lies in that, in the electronic device 10M, the reflective component 40 extends downward (along the second direction Y) from the upper surface of the second substrates 22 and 32 to the lower surface of the first substrates 21 and 31. That is, the reflective component 40 is disposed between the second substrates 22 and 32, between the reflective layer 24 and 34, between the light-absorbing layer 25 and 35, between the adhesive layer 26 and 36, and between the first substrates 21 and 31. Other features of the electronic device 10M can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0062] like Figure 11B The configuration and connection relationships of the components of the electronic device 10N shown are as follows: Figure 11A The components of the electronic device 10M shown are configured and connected in a generally similar manner. The difference lies in that, in the electronic device 10N, the reflective component 40 is disposed between the reflective layer 24 and the reflective layer 34, between the light-absorbing layer 25 and the light-absorbing layer 35, between the adhesive layer 26 and the adhesive layer 36, and between the first substrate 21 and the first substrate 31. Furthermore, the electronic device 10N includes a refractive index matching layer 50 disposed between the second substrate 22 and the second substrate 32. Other features of the electronic device 10N can be found in the description of the foregoing embodiments and will not be repeated here.

[0063] Figures 12A to 12B This is a schematic diagram illustrating different embodiments of the electronic device according to the eleventh embodiment of the present invention.

[0064] like Figure 12A The configuration and connection relationships of the components of the electronic device 10O shown are as follows: Figure 10AThe components of the electronic device 10K shown are configured and connected in a generally similar manner. The difference lies in that, in the electronic device 10K, the first mirror display 20 further includes a light conversion unit 29, which is disposed on the side of the color filter unit 28 adjacent to the first substrate 21 and corresponds to the light-emitting unit 23. For example, in one pixel, the light conversion unit 29 may include three light conversion components 29a, 29b, and 29c, and the corresponding three light-emitting components 23a, 23b, and 23c are, for example, blue micro light-emitting diodes. In this case, the three light conversion components 29a, 29b, and 29c may be, for example, respectively These are red light conversion components, green light conversion components, and light diffusion components. Similarly, the second mirror display 30 further includes a light conversion unit 39, which is disposed on the side of the color filter unit 38 adjacent to the first substrate 31 and corresponds to the light emission unit 33. For example, in one pixel, the light conversion unit 39 may include three light conversion components 39a, 39b, and 39c, and the corresponding three light emission components 33a, 33b, and 33c are, for example, blue light micro-light emission diodes. In this case, the three light conversion components 39a, 39b, and 39c may be, for example, a red light conversion component, a green light conversion component, and a light diffusion component, respectively. For example, the light conversion components 29a, 29b, 29c, 39a, 39b, and 39c of this embodiment may include, for example, phosphors for converting the light emitted by the light-emitting components 23a, 23b, 23c, 33a, 33b, and 33c into red, green, blue, or other suitable colors of light, respectively. In some other embodiments, the light conversion components 29a, 29b, 29c, 39a, 39b, and 39c may, for example, contain quantum dot materials. The quantum dot materials may, for example, have a core-shell structure. The core may contain CdSe, CdTe, CdS, ZnS, ZnSe, ZnO, ZnTe, InAs, InP, GaP, other suitable materials, or combinations of the above materials, but the present invention is not limited thereto. Furthermore, in this embodiment, the distance from the inner edge of opening O1 to the outer edge of each light-emitting component 23a, 23b, 23c and the distance from the inner edge of opening O2 to the outer edge of each light-emitting component 33a, 33b, 33c can be, for example, less than or equal to 40 μm or less than or equal to 25 μm, and this invention is not limited thereto. Other features of the electronic device 10O can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0065] Furthermore, in the electronic device 10O, the first mirror display 20 further includes a pixel definition layer 230 (PDL) formed on the first substrate 21. The pixel definition layer 230 has multiple openings O3, and the light-emitting components 23a, 23b, and 23c are respectively disposed in the multiple openings O3. Similarly, the second mirror display 30 further includes a pixel definition layer 330 formed on the first substrate 31. The pixel definition layer 330 has multiple openings O4, and the light-emitting components 33a, 33b, and 33c are respectively disposed in the multiple openings O4. In some embodiments, the material layer of the pixel definition layer 230, 330, such as an organic photoresist material layer, can be first formed on the first substrates 21 and 31 using a coating process, and then the material layer can be patterned using, for example, a photolithography process to form a pixel definition layer 230, 330, such as an organic photoresist material layer. Figure 12A The structure shown includes multiple openings O3 and O4. It should be noted that the above description is merely illustrative and not intended to limit the scope of the invention; the invention is not limited thereto. In the electronic device 10O, the reflective component 40 is disposed between the second substrate 22 and the second substrate 32, and between the reflective layer 24 and the reflective layer 34. However, in other embodiments, the reflective component 40 may only be disposed between the second substrate 22 and the second substrate 32, and not between the reflective layer 24 and the reflective layer 34.

[0066] like Figure 12B The configuration and connection relationships of the components of the electronic device 10P shown are as follows: Figure 12A The components of the electronic device 10O shown are configured and connected in a generally similar manner. The difference lies in that, in electronic device 10P, the reflective component 40 is disposed between the reflective layer 24 and the reflective layer 34, and electronic device 10P further includes a refractive index matching layer 50 disposed between the second substrate 22 and the second substrate 32. Other features of electronic device 10P can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0067] In summary, the electronic device of the present invention includes a first mirror display, a second mirror display, and a reflective component. The second mirror display is disposed adjacent to the first mirror display, and the reflective component is disposed between the first and second mirror displays. Each mirror display includes a first substrate, a second substrate disposed opposite to the first substrate, a light-emitting unit disposed on the first substrate, and a reflective layer. The reflective layer is disposed between the first and second substrates and includes an opening overlapping the light-emitting unit. The reflective component can be disposed on the side of each mirror display. By disposing the reflective component between the first and second mirror displays (i.e., at the seam), a reflective effect can be provided in areas where no reflective layer is provided, such as the edges of the mirror displays or at the seams, effectively reducing visual discontinuity.

[0068] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the claims.

Claims

1. An electronic device comprising: A first mirror display; A second mirror display is disposed adjacent to the first mirror display; and A reflective component is disposed between the first mirror display and the second mirror display.

2. The electronic device as claimed in claim 1, characterized in that, The first mirror display and the second mirror display each include: First substrate; A second substrate is disposed relative to the first substrate; A light-emitting unit is disposed on the first substrate; and A reflective layer is disposed between the first substrate and the second substrate, and includes an opening overlapping the light-emitting unit.

3. The electronic device as claimed in claim 2, characterized in that, The reflective component is disposed between the second substrate of the first mirror display and the second substrate of the second mirror display.

4. The electronic device as claimed in claim 2, characterized in that, The reflective component is disposed between the reflective layer of the first mirror display and the reflective layer of the second mirror display.

5. The electronic device as claimed in claim 4, characterized in that, It further includes a refractive index matching layer disposed between the second substrate of the first mirror display and the second substrate of the second mirror display.

6. The electronic device as claimed in claim 2, characterized in that, In the first mirror display and / or the second mirror display, the reflective layer is disposed on the side of the second substrate adjacent to the first substrate.

7. The electronic device as claimed in claim 6, characterized in that, The first mirror display and the second mirror display each further include a light-absorbing layer disposed on the side of the reflective layer adjacent to the first substrate.

8. The electronic device as claimed in claim 2, characterized in that, The first mirror display and the second mirror display each further include: An adhesive layer is disposed between the first substrate and the second substrate; The reflective component is disposed between the reflective layer of the first mirror display and the reflective layer of the second mirror display, and between the adhesive layer of the first mirror display and the adhesive layer of the second mirror display.

9. The electronic device as claimed in claim 8, characterized in that, The first mirror display and the second mirror display each further include a compressible layer disposed between the adhesive layer and the reflective component.

10. The electronic device as claimed in claim 8, characterized in that, The reflective component contains a compressible material.

11. An electronic device comprising: First substrate; A second substrate is disposed relative to the first substrate; A light-emitting unit is disposed on the first substrate; A reflective layer is disposed between the first substrate and the second substrate, and includes an opening overlapping the light-emitting unit; An adhesive layer is disposed between the first substrate and the second substrate; and A reflective component is disposed on the side of the reflective layer and the side of the adhesive layer.

12. The electronic device as claimed in claim 11, characterized in that, The reflective component contains a compressible material.

13. The electronic device as claimed in claim 11, characterized in that, It also includes: A compressible layer is disposed between the adhesive layer and the reflective component.

14. The electronic device as claimed in claim 11, characterized in that, The reflective layer is disposed on the side of the second substrate adjacent to the first substrate.

15. The electronic device as claimed in claim 14, characterized in that, It also includes: A light-absorbing layer is disposed on the side of the reflective layer adjacent to the first substrate.

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