Power battery bdu module, manufacturing method and vehicle

Abstract

This invention discloses a power battery BDU module, including a housing, a copper busbar, multiple relays, a current sensor, a pre-charge resistor, a pre-charge relay, and a BMS mainboard. The BMS mainboard is integrated with the housing, replacing the separate BMS housing and achieving an integrated BMS and BDU design. Multiple relays are horizontally mounted within the housing. The pre-charge relay and pre-charge resistor are directly mounted on the BMS mainboard, with their communication connectors penetrating the mainboard pads and then soldered in place. The copper busbar and housing are integrally injection molded. The communication contacts between the relays and the BMS mainboard are selectively wave soldered. This design, through BMS and BDU integration, integral copper busbar injection molding, lateral insertion and bonding of relays, and wireless pre-charge circuit, significantly reduces the number of components and assembly wiring harnesses, lightens the module weight, improves electrical integration and space utilization, and lowers manufacturing costs. This invention also discloses a method for manufacturing a power battery BDU module and a vehicle thereof.

Description

Technical Field

[0001] This invention belongs to the field of automotive technology. Specifically, this invention relates to a power battery BDU module, its manufacturing method, and a vehicle. Background Technology

[0002] As the energy source for new energy vehicles, the performance and integration level of power batteries directly affect the vehicle's range, safety, and cost control. Currently, integration and modularization have become the core development trends of power battery systems. Among them, the integrated design of high-voltage electrical components (such as high-voltage electrical boxes composed of high-voltage relays, fuses, and high-voltage connectors) and battery management systems (BMS) is one of the key research directions for improving the space utilization of power batteries, reducing overall costs, and optimizing system reliability.

[0003] During the operation of a power battery system, the Battery Management System (BMS) undertakes core functions such as battery status monitoring (e.g., voltage, current, and temperature monitoring), charge and discharge control, safety protection, and fault diagnosis. The high-voltage electrical box, on the other hand, is a key component for high-voltage power distribution, circuit on / off control, and overcurrent / short-circuit protection. Both must work together to ensure the stable operation of the power battery system. However, in existing technologies, the BMS and high-voltage electrical box generally adopt an independent arrangement: specifically, the BMS and high-voltage electrical box are arranged separately within the battery pack, each individually fixed to different areas of the battery housing by its own fixing structure. Furthermore, to achieve signal transmission and control command interaction, the BMS and high-voltage electrical box need to be connected via multiple sets of wiring harnesses.

[0004] The aforementioned traditional solutions have significant defects and shortcomings, which have become a major bottleneck restricting the integrated development of power battery systems. Specifically, these shortcomings are reflected in the following aspects: 1. Low space utilization and difficulty in adapting to modular design requirements: Since the BMS and high-voltage electrical box are independent components, they each require separate installation space within the battery pack, resulting in a significant reduction in internal space. This not only squeezes the layout space of the battery modules and limits the increase in power battery capacity, but also makes it difficult for the power battery system to form a standardized modular structure, which is not conducive to the adaptation and rapid iteration of different vehicle platforms.

[0005] 2. Overall cost is high and economic efficiency is poor: The independent design requires separate housings, fixing brackets and protective structures for the BMS and high-voltage electrical box, which increases the design and manufacturing cost of components.

[0006] 3. Increased system weight affects vehicle range performance: The independent housing, brackets, and redundant wiring harnesses all contribute to the weight of the power battery system.

[0007] This invention provides a power battery BDU module, specifically addressing how to improve integration, reduce weight, and lower cost. Summary of the Invention

[0008] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention provides a power battery BDU module, with the aim of improving integration, reducing weight, and lowering cost.

[0009] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a power battery BDU module, including a BDU housing, copper busbars, multiple relays, a shunt, a pre-charge resistor, a pre-charge relay, and a battery management system mainboard (BMS mainboard); wherein, The BMS motherboard and the BDU housing are integrated into one unit. The BMS motherboard is used to replace the independent BMS housing, realizing the integrated design of BMS and BDU. The precharge relay and precharge resistor are mounted on the BMS motherboard. The communication plug between them and the BMS motherboard penetrates the pads of the BMS motherboard and is fixed by welding. The precharge relay and precharge resistor are bonded to the contact surface of the BMS motherboard with structural adhesive to form an integrated component. The copper busbar and the BDU housing are integrally injection molded; The multiple relays are soldered and fixed on the BMS mainboard.

[0010] The multiple relays are installed horizontally inside the BDU housing and are fixed to the BDU housing by structural adhesive. The communication contacts between the multiple relays and the BMS motherboard are soldered using selective wave soldering to avoid damage to the motherboard caused by the insertion force.

[0011] The relay has a horizontal insertion structure. After insertion, it is guided, positioned and initially fixed by the BDU housing. After bonding, a stable connection is formed, thus eliminating the need for relay fixing bolts.

[0012] The BMS mainboard is fixedly connected to the BDU housing by bolts. The BDU housing is provided with a fixing bracket, and the fixing bracket is embedded with a nut. The BMS mainboard is provided with through holes to achieve detachable fixing.

[0013] A support layer is provided below the precharge relay and the precharge resistor. The support layer is made of foam. The support layer is bonded to the precharge relay and the precharge resistor by double-sided adhesive. After assembly, the support layer contacts the inner wall of the BDU housing and is compressed.

[0014] The splitter is arranged vertically and fixed to the BDU housing and copper busbar by bolts. Its output end is connected to the BMS acquisition board by a floating plug.

[0015] The BMS mainboard is located on the upper part of the BDU housing, and the relay is arranged horizontally in the space below the BMS mainboard, thereby reducing the size of the BDU in the X direction and improving the space utilization in the Z direction.

[0016] The present invention also provides a vehicle including the aforementioned power battery BDU module.

[0017] The structural adhesive is a two-component epoxy or silicone adhesive, which has electrical insulation and high temperature stability, and is used for fixing and stress buffering of relays and pre-charged components.

[0018] The BMS motherboard, relays, and copper busbars are fixed together through potting, solder joint positioning, and curing processes. After the welding is completed, structural adhesive is cured to release solder joint stress and prevent welding failure.

[0019] This invention also provides a method for manufacturing a power battery BDU module, including the following steps: The copper busbar and the BDU housing are integrally injection molded to form an integrated structure; The relay is installed inside the BDU housing, and the communication contacts between the relay and the BMS mainboard are soldered. The precharge relay and the precharge resistor are mounted on the BMS motherboard, and their communication plugs penetrate the pads of the BMS motherboard and are soldered. Structural adhesive is then applied to the bonding surface for fixation. A support layer is provided below the precharge relay and the precharge resistor; The BMS motherboard is fixed to the lower mounting bracket of the BDU housing with bolts.

[0020] The installation process of the relay includes: The relay is pre-installed inside the BDU housing and inserted laterally into the BDU housing. Structural adhesive is injected between the relay and the BDU housing for bonding. The communication contacts between the relay and the BMS main board are selectively wave soldered. After welding is completed, structural adhesive is cured to release stress at the weld points and prevent welding failure due to long-term stress.

[0021] The power battery BDU module of the present invention has the following beneficial effects: 1. The battery BMS motherboard and BDU housing are fixed together with bolts, realizing the integration of the BMS motherboard and BDU. The integration of BMS and BDU reduces the excessively long communication harness between BMS and BDU. At the same time, after the integration of BMS motherboard and BDU, the original housing of BMS motherboard is eliminated and the BDU housing replaces it for function. 2. After integrating electrical components such as fast charging negative relay, fast charging positive relay, main negative relay, main positive relay, pre-charge resistor, pre-charge relay, shunt, and BMS motherboard, the BDU is smaller in size, more integrated, and occupies less space inside the battery. This allows more space for the power battery to arrange the cells, improving the energy density and space utilization of the power battery. 3. The pre-charge relay and pre-charge resistor are integrated on the BMS mainboard, which reduces the communication wiring between the pre-charge relay and pre-charge resistor and the BMS mainboard, resulting in higher integration. 4. The BMS mainboard is located on top of the integrated BDU, and the relays are arranged horizontally. This solution can effectively reduce the space occupied by the integrated BDU in the X direction of the power battery (BDU width) and make efficient use of the Z direction space, thereby providing more space for cell arrangement and improving the energy density and space utilization of the power battery. 5. The relay is assembled with the BDU housing by horizontal insertion and is bonded to the housing with structural adhesive. This solution can eliminate the need for relay fixing bolts. At the same time, the BDU housing design is simple and does not require a complex relay fixing structure on the BDU housing. It also does not need to consider space avoidance during bolt installation, saving BDU design space. The horizontal insertion assembly of the relay allows the relay to be initially positioned by the BDU housing after insertion, realizing multiple functions of guiding, fixing and positioning. 6. The communication contacts between the relay and the BMS are soldered by selective wave soldering. Conventional solutions often use floating plugs. Because there are many floating plugs, the BMS mainboard is subjected to greater force during insertion, and there is a risk of damage to the BMS board during the insertion process. After selective wave soldering is used, the communication plugs of the relay and the BMS are positioned and assembled in place before soldering. The process is stress-free, which solves the risk of the insertion process. 7. The copper busbar and BDU housing are integrally injection molded. Conventional solutions mostly use copper busbar installation, which is complicated and time-consuming. In addition, the copper busbar design needs to ensure assembly clearance, which occupies a lot of space. The integral injection molding solution integrates the copper busbar and BDU housing, eliminating the assembly process and not occupying assembly space, resulting in a higher degree of integration. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the power battery BDU module of the present invention; Figure 2 This is a schematic diagram showing the integrated state and welding method of the pre-charge relay and pre-charge resistor; Figure 3 This is a schematic diagram showing the disassembled state of the pre-charge resistor and pre-charge relay, as well as the adhesive application area. Figure 4 This is a schematic diagram of the relay and BMS layout; Figure 5 This is a schematic diagram of the arrangement and assembly method of relays and shunts; Figure 6 This is a schematic diagram of a relay in a fixed state; Figure 7 This is a schematic diagram showing the soldering positions of the relay and the BMS communication connector; Figure 8 This is a schematic diagram of the copper busbar and BDU housing being injection molded as a single unit; Figure 9 This is a partial structural diagram of the BDU shell; The markings in the above figures are as follows: 1. BDU top cover; 2. BMS main board; 3. Precharge group; 4. Precharge relay; 5. Shunt; 6. BDU housing; 7. Relay; 8. Copper busbar; 9. Communication plug; 10. Precharge resistor and BMS selectable wave soldering position; 11. Precharge relay and BMS selectable wave soldering position; 12. Adhesive application end face; 13. Relay and BDU housing potting position; 14. Relay and BMS selectable wave soldering position; 15. Guide plate; 16. First potting groove; 17. Second potting groove. Detailed Implementation

[0023] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the accompanying drawings, which illustrate several embodiments of the present invention. However, the present invention can be implemented in different forms and is not limited to the embodiments described in the text. Rather, these embodiments are provided to make the disclosure of the present invention more thorough and complete.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," and similar expressions used in this document are for illustrative purposes only.

[0025] It should be noted that in the following embodiments, the terms "first," "second," and "third" do not represent an absolute distinction in structure and / or function, nor do they represent the order of execution; they are merely for the convenience of description.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly associated with those skilled in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] Firstly, such as Figures 1 to 8As shown, this embodiment of the invention provides a power battery BDU module, including a BDU (Battery Disconnect Unit) housing, a copper busbar 8, multiple relays, a shunt 5, a pre-charge resistor, a pre-charge relay 4, and a BMS mainboard 2 (the mainboard of the battery management system); wherein, The BMS motherboard 2 and the BDU housing 6 are integrated into one unit. The BMS motherboard 2 is used to replace the independent BMS housing, realizing the integrated design of BMS and BDU. The precharge relay 4 and the precharge resistor are mounted on the BMS motherboard 2. The communication plug 9 between the precharge relay 4 and the BMS motherboard 2 penetrates the pads of the BMS motherboard 2 and is fixed by welding. The precharge relay 4 and the precharge resistor are bonded to the contact surface of the BMS motherboard 2 with structural adhesive to form an integrated component. The copper busbar 8 and the BDU housing 6 are integrally injection molded; Multiple relays are soldered and fixed on the BMS mainboard 2.

[0028] Multiple relays are installed horizontally inside the BDU housing 6 and are fixed to the BDU housing 6 by structural adhesive; The communication contacts between multiple relays and BMS motherboard 2 are soldered using selective wave soldering to avoid damage to the motherboard caused by the insertion force.

[0029] Specifically, considering the existing power battery technology, the BMS and high-voltage box are connected by wiring harnesses, which is costly, occupies a large space, and seriously affects the energy density of the battery pack. The industry has been exploring various solutions to reduce the space occupied by the BMS and wiring harnesses and improve battery energy density. Therefore, in this embodiment of the invention, the BMS mainboard and high-voltage box are integrated by eliminating the BMS metal casing. This integration reduces the amount of electrical wiring harnesses, removes the BMS casing, and achieves a fewer-component design.

[0030] In this embodiment of the invention, a highly integrated design of BMS and BDU is achieved through a combination of methods, including horizontal arrangement of relays, bonding of relays to BDU housing 6, integrated injection molding of copper busbar 8, top-level arrangement of BMS, integration of pre-charge relay 4 and pre-charge resistor with BMS motherboard 2.

[0031] When an integrated BDU integrates a BMS, the communication between the relay and the BMS often uses floating plugs. Because there are many floating plugs, the BMS motherboard 2 is subjected to a large force during the insertion process, and there is a risk of damage to the BMS board during the insertion process. In this embodiment of the invention, after selective wave soldering, the communication plug 9 of the relay and the BMS are positioned and assembled in place, and then soldered. The process is stress-free, which solves the risk brought about by the insertion process. When the BMS motherboard 2 is integrated with the high-voltage box, it needs to be connected to relays, copper busbar 8 voltage sampling devices, etc. Due to tolerance issues, the connection points are prone to long-term stress, leading to poor contact or failure. In this embodiment of the invention, the process of relay pre-installation, potting, solder joint positioning, welding, and structural adhesive curing allows for positioning and welding before structural adhesive curing, releasing stress at the solder joints and preventing welding failure due to prolonged stress.

[0032] like Figure 1 As shown, the power battery BDU module also includes a BDU top cover 1, which is fixedly connected to the BDU housing 6. Multiple relays, including a fast-charging negative relay, a fast-charging positive relay, a main negative relay, and a main positive relay, are integrated on the BDU housing 6. The relays have a horizontal insertion structure; after insertion, they are guided, positioned, and initially fixed by the BDU housing 6. After bonding, a stable connection is formed, thus eliminating the need for relay fixing bolts.

[0033] like Figure 1 As shown, the BDU integrates electrical components such as a fast charging negative relay, a fast charging positive relay, a main negative relay, a main positive relay, a pre-charging resistor, a pre-charging relay 4, a shunt 5, and a BMS mainboard 2. In the prior art, high-voltage electrical components are often arranged separately from the BMS. In this embodiment of the invention, a high degree of integration between the BMS and high-voltage electrical components is achieved.

[0034] After integrating electrical components such as fast charging negative relay, fast charging positive relay, main negative relay, main positive relay, pre-charging resistor, pre-charging relay 4, shunt 5, and BMS mainboard 2, the BDU is smaller in size, more integrated, and occupies less space inside the battery. This allows more space for the power battery to arrange the cells, improving the energy density and space utilization of the power battery.

[0035] like Figure 1 , Figure 4 , Figure 5 , Figure 6 and Figure 9As shown, the relay is assembled with the BDU housing 6 via a horizontal insertion method and is bonded to the housing with structural adhesive. The horizontal direction refers to the width of the BDU housing 6. The BDU housing 6 has a rectangular structure and multiple positioning slots for accommodating the relays. These positioning slots are arranged sequentially along the length of the BDU housing 6 and are located below the BMS mainboard 2. Each positioning slot houses one relay. A guide structure for guiding the relays is provided within the positioning slot. The guide structure includes guide plates 15, which are disposed on the first and second inner walls of the positioning slot. Multiple guide plates 15 are disposed on the first and second inner walls, with their length parallel to the length of the BDU housing 6. The first and second inner walls are two parallel planes perpendicular to the length of the BDU housing 6. A first injection groove 16 for accommodating structural adhesive is formed between two adjacent guide plates 15 on the first inner wall. A first injection groove 16 for accommodating structural adhesive is formed between two adjacent guide plates 15 on the second inner wall. A first injection groove 16 for receiving structural adhesive is also formed between the guide plates 15. An inclined guide surface is provided at the end of the guide plate 15. This inclined guide surface contacts the outer surface of the relay when it is inserted into the positioning groove, guiding the relay accurately into the precise position within the positioning groove. The inclined extension direction of the inclined guide surface forms an acute angle with the length direction of the guide plate 15. The force component of the inclined surface automatically corrects the relay insertion direction, preventing jamming or misalignment due to operational deviations, ensuring the relay accurately falls into the preset position of the positioning groove, and significantly improving assembly accuracy. These guide plates 15 not only restrict the relay's swing in the width direction but also constrain its displacement through multiple contact points, further enhancing positioning stability. The first injection groove 16 formed between adjacent guide plates 15 allows the adhesive layer to embed into the groove after curing, forming a mechanical interlock. This transforms the adhesive force from simple surface adhesion to a combined effect of bonding and anchoring. This design can improve shear strength to a certain extent, especially in dynamic vibration environments, such as high-frequency impacts during vehicle operation, where the adhesive layer is less prone to peeling or cracking.

[0036] like Figure 9 As shown, a second glue injection groove 17 is provided on the third inner wall surface of the positioning groove. The third inner wall surface is located below the relay. The third inner wall surface is a plane parallel to the length direction of the BDU housing 6 and the length direction of the guide plate 15. The second glue injection groove 17 is used to contain structural glue. The bottom surface of the relay is bonded through the structural components in the second glue injection groove 17 to improve stability.

[0037] In this embodiment of the invention, the relay is assembled with the BDU housing 6 by a horizontal insertion method and is bonded to the housing with structural adhesive. This solution can eliminate the need for relay fixing bolts. At the same time, the design of the BDU housing 6 is simple, and there is no need to design a complex relay fixing structure on the BDU housing 6. It also eliminates the need to consider space avoidance during bolt installation, saving BDU design space. The horizontal insertion method for assembling the relay allows the relay to be initially positioned by the BDU housing 6 after insertion, realizing multiple functions of guiding, fixing and positioning.

[0038] In this embodiment of the invention, the BMS motherboard 2 is fixedly connected to the BDU housing 6 by bolts, thereby realizing the integration of the BMS motherboard 2 and the BDU. The BDU housing 6 is provided with a fixing bracket, and the fixing bracket is embedded with a nut. The BMS motherboard 2 is provided with a through hole. The BMS motherboard 2 is connected and fixed to the integrated BDU housing 6 by bolts, and a detachable connection can be achieved.

[0039] In this embodiment of the invention, the pre-charge relay 4 and the pre-charge resistor are integrated on the BMS mainboard 2. The communication connector 9 of the pre-charge relay 4 is soldered to the mainboard, and adhesive is applied around the pre-charge relay 4 to bond it to the BMS mainboard 2. Similarly, the communication connector 9 of the pre-charge resistor is soldered to the mainboard, and adhesive is applied around the pre-charge relay 4 to bond it to the BMS mainboard 2. A support layer made of foam is provided below the pre-charge relay 4 and the pre-charge resistor. The support layer is bonded to the pre-charge relay 4 and the pre-charge resistor with double-sided adhesive. After the BMS mainboard 2 is assembled in the BDU, the support layer contacts the inner wall of the BDU housing 6 and is slightly compressed, thus supporting the pre-charge resistor and the pre-charge relay 4.

[0040] In this embodiment of the invention, the pre-charge relay 4 and the pre-charge resistor are integrated on the BMS motherboard 2, which reduces the communication wiring between the pre-charge relay 4 and the pre-charge resistor and the BMS motherboard 2, resulting in higher integration.

[0041] In the prior art, the BMS is connected to the precharge relay 4 and the precharge resistor via a wiring harness. In this embodiment of the invention, as... Figure 2 and Figure 3 As shown, the pre-charge relay 4 and pre-charge resistor are mounted on the BMS motherboard 2. The communication connectors 9 of the pre-charge relay 4 and pre-charge resistor penetrate the pads of the BMS motherboard 2 and are soldered to the pads. The pads of the BMS motherboard 2 have multiple first through holes and second through holes through which the communication connectors 9 of the pre-charge relay 4 and pre-charge resistor pass, with four of each type. Through this connector-type structure, the connectors penetrate the pads of the BMS motherboard 2 for soldering. Simultaneously, the pre-charge relay 4 and pre-charge resistor are bonded to the contact surfaces of the BMS motherboard 2 using structural adhesive, integrating them as a whole. This achieves a wireless design, improves integration, and simplifies the structure.

[0042] The pre-charge relay 4, pre-charge resistor, and BMS mainboard 2 are bonded together with structural adhesive to form an assembly. This assembly can be installed as a single independent module within the battery pack, replacing the multiple scattered components found in traditional solutions. A plug-in welding process is used to achieve low-impedance connections, effectively protecting the relay contacts and battery module. Combined with the mechanical locking of the plug-in welding, a dual fixing structure of welding and adhesive bonding is formed, improving the vibration resistance of the pre-charge relay 4 and pre-charge resistor.

[0043] In embodiments of the present invention, such as Figure 1 As shown, the splitter 5 is arranged vertically and is fixedly connected to the BDU housing 6 and copper busbar 8 by bolts. The output end of the splitter 5 is connected to the BMS acquisition board by a floating plug.

[0044] In embodiments of the present invention, such as Figure 1 As shown, the BMS mainboard 2 is located on the upper part of the BDU housing 6, and the relay is arranged horizontally in the space below the BMS mainboard 2, thereby reducing the space occupied by the BDU in the X direction of the power battery (BDU width), improving the space utilization rate in the Z direction (i.e., the vertical direction, the Z direction is perpendicular to the X direction), making efficient use of the Z direction space, thereby providing more space for cell arrangement, and improving the energy density and space utilization rate of the power battery.

[0045] In this embodiment of the invention, the structural adhesive is a two-component epoxy adhesive or silicone adhesive, which has electrical insulation and high temperature stability, and is used for fixing and stress buffering of relays and pre-charged components.

[0046] In this embodiment of the invention, the BMS motherboard 2 and the relay are fixed together by potting, solder joint positioning and curing processes. After the welding is completed, structural adhesive is cured to release the stress of the solder joint and prevent welding failure.

[0047] Existing conventional solutions for the connection between relays and BMS mainboard 2 mostly use floating connectors. Because there are many floating connectors, the BMS mainboard 2 is subjected to significant force during insertion, leading to a risk of damage during the connection process. In this embodiment of the invention, as... Figure 7 As shown, the communication contacts between the relay and the BMS main board 2 are soldered using selective wave soldering. With selective wave soldering, the relay's communication connector 9 is positioned and assembled with the BMS main board 2 before soldering, a process free from stress and eliminating the risks associated with the insertion process. The BMS main board 2 has a third through hole through which the relay's communication connector 9 passes.

[0048] Existing conventional solutions mostly employ independent installation of the copper busbar 8, which is complex, time-consuming, and requires significant space due to the need to ensure assembly clearance during the design of the copper busbar 8. In this embodiment of the invention, the copper busbar 8 and the BDU housing 6 are integrally injection molded. This integral injection molding approach integrates the copper busbar 8 and the BDU housing 6, eliminating the assembly process and saving assembly space, resulting in higher integration. During manufacturing, an injection mold is used, with a positioning groove and injection channel for the copper busbar 8 within the mold cavity. The pre-treated copper busbar 8 is pre-fixed as an insert in the mold cavity, and then molten plastic is injected. The high-temperature molten plastic fills the mold cavity and encapsulates the copper busbar 8. After cooling, the copper busbar 8 and the BDU housing 6 are tightly bonded together, forming an integrated structure.

[0049] Secondly, embodiments of the present invention also provide a vehicle including a power battery BDU module with the above-described structure. The vehicle is a new energy vehicle, and this power battery BDU module can be referred to... Figures 1 to 9 Further details will not be elaborated here. Since the vehicle of the present invention includes the power battery BDU module described in the above embodiments, it possesses all the advantages of the aforementioned power battery BDU module.

[0050] Thirdly, embodiments of the present invention also provide a method for manufacturing a power battery BDU module, comprising: The copper busbar 8 and the BDU housing 6 are integrally injection molded to form an integrated structure; Install the relay inside the BDU housing 6 and solder the communication contacts between the relay and the BMS main board 2. The precharge relay 4 and the precharge resistor are installed on the BMS motherboard 2. The communication plug 9 penetrates the pad of the BMS motherboard 2 and is soldered. Structural adhesive is then applied to the mating surface for fixation. A support layer is provided below the precharge relay 4 and the precharge resistor; The BMS motherboard 2 is fixed to the lower mounting bracket of the BDU housing 6 with bolts.

[0051] In this embodiment of the invention, the relay installation process includes the following steps: (1) Pre-install a relay inside the BDU housing 6 and insert the relay horizontally into the BDU housing 6; (2) Structural adhesive is injected between the relay and the BDU housing 6 for bonding; (3) The communication contacts between the relay and the BMS main board 2 are selectively wave soldered; (4) After welding is completed, structural adhesive is cured to release the stress at the weld point and prevent long-term stress from causing welding failure.

[0052] In step (1) of the relay installation described above, the relay is inserted into the positioning slot provided on the BDU housing 6 to complete the pre-installation of the relay.

[0053] In step (2) of the relay installation described above, structural adhesive is injected into the injection tank, and the relay is bonded to the BDU housing 6 by the injected structural adhesive.

[0054] In step (3) of the relay installation described above, the communication plug 9 of the relay is inserted into the third through hole on the BMS main board 2, and then the communication plug 9 of the relay and the BMS main board 2 are selectively wave soldered.

[0055] The power battery BDU module and manufacturing method described in the above embodiments have the following advantages: 1. The battery BMS motherboard 2 and BDU housing 6 are fixed together by bolts, realizing the integration of BMS motherboard 2 and BDU. Through the integration of BMS and BDU, the excessively long communication harness between BMS and BDU is reduced. At the same time, after the integration of BMS motherboard 2 and BDU, the original housing of BMS motherboard 2 is eliminated and replaced by BDU housing 6. 2. After integrating electrical components such as fast charging negative relay, fast charging positive relay, main negative relay, main positive relay, pre-charging resistor, pre-charging relay 4, shunt 5, BMS mainboard 2, etc., the BDU is smaller in size, more integrated, occupies less space in the battery, and can give more space to the power battery for cell arrangement, thus improving the energy density and space utilization of the power battery. 3. The pre-charge relay 4 and the pre-charge resistor are integrated on the BMS motherboard 2, which reduces the communication wiring between the pre-charge relay 4 and the pre-charge resistor and the BMS motherboard 2, resulting in higher integration. 4. The BMS motherboard 2 is located on the top of the integrated BDU, and the relays are arranged horizontally. This solution can effectively reduce the space occupied by the integrated BDU in the X direction of the power battery (BDU width) and make efficient use of the Z direction space, thereby providing more space for cell arrangement and improving the energy density and space utilization of the power battery. 5. The relay is assembled with the BDU housing 6 by a horizontal insertion method and is bonded to the housing with structural adhesive. This solution can eliminate the need for relay fixing bolts. At the same time, the design of the BDU housing 6 is simple, and there is no need to design a complex relay fixing structure on the BDU housing 6. It also eliminates the need to consider space avoidance during bolt installation, saving BDU design space. The horizontal insertion method for assembling the relay allows the relay to be initially positioned by the BDU housing 6 after insertion, realizing multiple functions of guiding, fixing and positioning. 6. The communication contacts between the relay and the BMS are soldered by selective wave soldering. Conventional solutions often use floating plugs. Because there are many floating plugs, the BMS main board 2 is subjected to greater force during insertion, and there is a risk of damage to the BMS board during the insertion process. After selective wave soldering is adopted, the communication plug 9 of the relay and the BMS are positioned and assembled in place before soldering. The process is stress-free, which solves the risk brought about by the insertion process. 7. The copper busbar 8 and the BDU housing 6 are integrally injection molded. Conventional solutions often use the copper busbar 8 for installation, which is complicated and time-consuming. In addition, the copper busbar 8 needs to ensure the assembly gap during design, which occupies a lot of space. By adopting the integral injection molding solution, the copper busbar 8 and the BDU housing 6 are integrated, eliminating the assembly process and not occupying assembly space, resulting in a higher degree of integration.

[0056] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, are all within the protection scope of the present invention.

Claims

1. A power battery BDU module, characterized in that, Includes BDU housing, copper busbar, multiple relays, shunt, pre-charge resistor, pre-charge relay and BMS mainboard; The BMS motherboard and the BDU housing are integrated into one unit; The precharge relay and precharge resistor are mounted on the BMS motherboard, and the communication connector between them and the BMS motherboard penetrates the pads of the BMS motherboard and is fixed by soldering. The copper busbar and the BDU housing are integrally injection molded; The multiple relays are soldered and fixed on the BMS mainboard.

2. The power battery BDU module according to claim 1, characterized in that, The multiple relays are mounted horizontally inside the BDU housing; The communication contacts between the multiple relays and the BMS mainboard are soldered using selective wave soldering.

3. The power battery BDU module according to claim 2, characterized in that, The relay has a horizontal insertion structure. After insertion, it is guided, positioned and initially fixed by the BDU housing. After bonding, a stable connection is formed, thus eliminating the need for relay fixing bolts.

4. The power battery BDU module according to any one of claims 1 to 3, characterized in that, The BMS mainboard is fixedly connected to the BDU housing by bolts. The BDU housing is provided with a fixing bracket, and the fixing bracket is embedded with a nut. The BMS mainboard is provided with through holes to achieve detachable fixing.

5. The power battery BDU module according to any one of claims 1 to 3, characterized in that, A support layer is provided below the precharge relay and the precharge resistor. The support layer is bonded to the precharge relay and the precharge resistor by double-sided adhesive. After assembly, the support layer contacts the inner wall of the BDU housing and is compressed.

6. The power battery BDU module according to any one of claims 1 to 3, characterized in that, The splitter is arranged vertically and fixed to the BDU housing and copper busbar by bolts. Its output end is connected to the BMS acquisition board by a floating plug.

7. The power battery BDU module according to any one of claims 1 to 3, characterized in that, The BMS mainboard is located on the upper part of the BDU housing, and the relay is arranged horizontally in the space below the BMS mainboard.

8. A vehicle, characterized in that, Includes the power battery BDU module as described in any one of claims 1 to 7.

9. A method for manufacturing a power battery BDU module according to any one of claims 1 to 7, characterized in that, Including the following steps: The copper busbar and the BDU housing are integrally injection molded to form an integrated structure; The relay is installed inside the BDU housing, and the communication contacts between the relay and the BMS mainboard are soldered. The precharge relay and the precharge resistor are mounted on the BMS motherboard, and their communication plugs penetrate the pads of the BMS motherboard and are soldered. Structural adhesive is then applied to the bonding surface for fixation. A support layer is provided below the precharge relay and the precharge resistor; The BMS motherboard is fixed to the lower mounting bracket of the BDU housing with bolts.

10. The manufacturing method according to claim 9, characterized in that, The installation process of the relay includes: The relay is pre-installed inside the BDU housing and inserted laterally into the BDU housing. Structural adhesive is injected between the relay and the BDU housing for bonding. The communication contacts between the relay and the BMS main board are selectively wave soldered. After welding is completed, structural adhesive is cured to release stress at the weld points and prevent welding failure due to long-term stress.

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