Diaphragm, loudspeaker and electronic device

Abstract

The application discloses a vibrating diaphragm, a loudspeaker and an electronic device. The vibrating diaphragm comprises a plurality of diaphragm layers, the diaphragm layers are stacked, each diaphragm layer comprises a substrate and silica gel, the substrate is a porous structure, a first part of the silica gel is inlaid in the substrate, and the modulus of the silica gel is different from that of the substrate; at least one damping layer is arranged between any two adjacent diaphragm layers, and the damping layer is composed of a material with a pressure-sensitive damping function; and a second part of the silica gel covers one side of the substrate away from the damping layer.

Description

Technical Field

[0001] This application belongs to the field of loudspeaker technology, specifically relating to a diaphragm, loudspeaker, and electronic device. Background Technology

[0002] Electronic devices include loudspeakers. With the development of electronic devices, the requirements for loudspeakers' resistance to high and low temperatures and their acoustic performance are also increasing.

[0003] In related technologies, the diaphragm of a loudspeaker is made of silicone, which has good resistance to both low and high temperatures. However, the low damping of silicone diaphragm material leads to insufficient damping of the diaphragm. As a result, the diaphragm cannot suppress the resonance amplitude at the resonant frequency, and the frequency response curve will show a peak, affecting the listening experience. In addition, due to insufficient damping, the diaphragm is prone to exceeding its linear motion range at large amplitudes, resulting in large distortion. Summary of the Invention

[0004] This application aims to provide a diaphragm, loudspeaker, and electronic device that at least solves one of the problems of insufficient damping of the diaphragm due to the diaphragm being made of silicone, resulting in a peak in the frequency response curve, and the diaphragm easily exceeding the linear motion range at large amplitudes.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] The first aspect of this application provides a diaphragm for a loudspeaker, the diaphragm comprising: multiple diaphragm layers stacked together, each diaphragm layer comprising a substrate and silicone, the substrate having a porous structure, a first portion of the silicone being embedded in the substrate, the silicone and the substrate having different moduli; at least one damping layer, wherein a damping layer is connected between any two adjacent diaphragm layers, the damping layer being made of a material having pressure-sensitive damping function; and in the diaphragm layers, a second portion of the silicone covering the side of the substrate opposite to the damping layer.

[0007] A second aspect of this application provides a loudspeaker comprising a diaphragm as described in the first aspect.

[0008] A third aspect of this application provides an electronic device comprising: a loudspeaker as described in the second aspect. In embodiments of this application, a diaphragm is used for the loudspeaker, the diaphragm comprising a plurality of diaphragm layers and at least one damping layer.

[0009] The membrane consists of a substrate and silicone. The substrate has a porous structure, and the first part of the silicone is embedded in the substrate.

[0010] Specifically, before the film is formed, the silicone is liquid at room temperature. Taking advantage of the good fluidity of liquid silicone, the liquid silicone is poured, coated or pressed onto the substrate. Under the pressure of the mold, the liquid silicone flows fully into the substrate. Since the substrate has a porous structure, the liquid silicone flows fully into the deep gaps of the substrate, rather than adhering to the surface of the substrate. Then, after high-temperature vulcanization, the silicone penetrates and wraps in the gaps of the substrate and tightly adheres to the micro-rough surface of the substrate. The silicone and the substrate are anchored into a whole, and the silicone and the substrate are tightly bonded, achieving the purpose of silicone embedding in the substrate.

[0011] The modulus of the substrate differs from that of the silicone rubber; that is, there is a difference between their moduli. Therefore, during diaphragm vibration, the deformation between the substrate and the silicone rubber differs, leading to repeated friction between their contact surfaces, resulting in losses and structural damping. Furthermore, a damping layer is placed between adjacent diaphragm layers. This damping layer is made of a pressure-sensitive damping material and not only connects the two adjacent diaphragm layers but also exhibits high damping at room temperature. The combination of multiple diaphragm layers and at least one damping layer enhances the overall damping of the diaphragm, thereby increasing the smoothness of the frequency response curve, preventing peaks and ensuring a good listening experience. Simultaneously, due to the increased overall damping, the diaphragm does not exceed its linear range at larger amplitudes, thus improving speaker distortion.

[0012] In the membrane layer, the second part of the silicone covers the side of the substrate facing away from the damping layer, with the substrate located between the second part of the silicone and the damping layer. The second part of the silicone seals the end face of the substrate facing away from the damping layer, which not only provides dust and moisture protection but also introduces a damping structure on that side. This absorbs vibration energy, making the vibration displacement more continuous, reducing nonlinear distortion caused by local stiffness abrupt changes, reducing high-frequency vibration peaks, and improving frequency response smoothness.

[0013] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 This is a partial structural schematic diagram of the diaphragm according to the first embodiment of the present invention;

[0016] Figure 2 This is a partial structural schematic diagram of the diaphragm according to the second embodiment of the present invention;

[0017] Figure 3 This is an exploded view of a loudspeaker according to an embodiment of the present invention;

[0018] Figure 4 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention;

[0019] Figure 5 This is a schematic diagram of the sound pressure level changing with frequency according to embodiments and related technologies of the present invention;

[0020] Figure 6 This is a schematic diagram of the total harmonic distortion as a function of frequency according to embodiments of the present invention and related technologies.

[0021] Figure label:

[0022] 10 Diaphragm, 100 Diaphragm Layer, 110 Substrate, 120 Silicone, 122 First Part of Silicone, 124 Second Part of Silicone, 126 Third Part of Silicone, 200 Damping Layer, 30 Speaker, 301 Grille, 302 Back Magnet, 303 Center Magnet, 304 Side Magnet, 305 Center Magnet, 306 Side Magnet, 307 Bracket, 308 Voice Coil, 309 Conductive Support, 310 Top Plate, 40 Electronic Devices. Detailed Implementation

[0023] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0024] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0025] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0026] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0027] The following is combined Figures 1 to 6 The diaphragm 10, speaker 30, and electronic device 40 of embodiments of the present invention are described.

[0028] like Figure 1 and Figure 2 As shown, in some feasible embodiments, the diaphragm 10 is used for the loudspeaker 30. The diaphragm 10 includes: a plurality of membrane layers 100 stacked together, each membrane layer 100 including a substrate 110 and silicone 120. The substrate 110 has a porous structure, and a first portion 122 of the silicone is embedded in the substrate 110. The silicone 120 and the substrate 110 have different moduli; at least one damping layer 200, with a damping layer 200 connecting any two adjacent membrane layers 100. The damping layer 200 is made of a material with pressure-sensitive damping function; in the membrane layer 100, a second portion 124 of the silicone covers the side of the substrate 110 opposite to the damping layer 200.

[0029] When there are two membrane layers 100, there is one damping layer 200, and a damping layer 200 is connected between the two membrane layers 100.

[0030] When the number of membrane layers 100 is greater than two, the number of damping layers 200 is multiple, and the number of damping layers 200 is less than the number of membrane layers 100. A damping layer 200 is connected between any two adjacent membrane layers 100.

[0031] The membrane 100 includes a substrate 110 and a silicone 120. The substrate 110 has a porous structure, and the first part 122 of the silicone is embedded in the substrate 110.

[0032] Specifically, before the film layer 100 is formed, the silicone 120 is in a liquid state at room temperature. Taking advantage of the good fluidity of the liquid silicone 120, the liquid silicone 120 is poured, coated or pressed onto the substrate 110. Under the pressure of the mold, the liquid silicone 120 flows fully into the substrate 110. Since the substrate 110 has a porous structure, the liquid silicone 120 flows fully into the deep gaps of the substrate 110, instead of adhering to the surface of the substrate 110. Then, after high-temperature vulcanization, the silicone 120 is inserted and wrapped in the gaps of the substrate 110 and tightly adheres to the micro-rough surface of the substrate 110. The silicone 120 and the substrate 110 are anchored into a whole, and the silicone 120 and the substrate 110 are tightly bonded, achieving the purpose of embedding the silicone 120 into the substrate 110.

[0033] The modulus of the substrate 110 differs from that of the silicone 120. Therefore, when the diaphragm 10 vibrates, the deformation between the substrate 110 and the silicone 120 of the membrane layer 100 differs. Repeated friction between the contact surfaces of the substrate 110 and the silicone 120 generates losses and structural damping. Furthermore, a damping layer 200 is provided between two adjacent membrane layers 100. The damping layer 200 is made of a material with pressure-sensitive damping function. The damping layer 200 not only connects the two adjacent membrane layers 100 but also exhibits high damping at room temperature. The combination of multiple diaphragm layers 100 and at least one damping layer 200 can enhance the overall damping of the diaphragm 10, thereby increasing the smoothness of the frequency response curve and preventing peaks in the frequency response curve, thus ensuring a good listening experience. At the same time, due to the enhanced overall damping of the diaphragm 10, the diaphragm 10 will not exceed the linear motion range when the amplitude is large, which can improve the distortion of the speaker 30.

[0034] In the membrane layer 100, the second portion 124 of the silicone covers the side of the substrate 110 facing away from the damping layer 200, with the substrate 110 located between the second portion 124 of the silicone and the damping layer 200. The second portion 124 of the silicone seals the end face of the substrate 110 facing away from the damping layer 200, which not only provides dust and moisture protection but also introduces a damping structure into the end face of the substrate 110 facing away from the damping layer 200. This absorbs vibration energy, making the vibration displacement more continuous, reducing nonlinear distortion caused by local stiffness abrupt changes, reducing high-frequency vibration peaks, and improving frequency response smoothness.

[0035] For example, when there are two membrane layers 100 and one damping layer 200, the second portion 124 of the silicone covers the side of the substrate 110 away from the damping layer 200.

[0036] For example, when the number of membrane layers 100 is greater than two and the number of damping layers 200 is greater than one, the second portion 124 of silicone is located between the two damping layers 200 in the membrane layer 100 located in the two damping layers 200.

[0037] In some feasible implementations, the substrate 110 is connected to the damping layer 200 via a third portion 126 of silicone.

[0038] Specifically, the mating structure of the film layer 100 and the damping layer 200 is refined. The substrate 110 is connected to the damping layer 200 through the third portion 126 of the silicone, that is, the substrate 110 is indirectly connected to the damping layer 200 through the third portion 126 of the silicone. The substrate 110 and the silicone 120 can form a friction loss interface, and the silicone 120 and the damping layer 200 will also form a new friction loss interface. When the third portion 126 of the silicone is located between the substrate 110 and the damping layer 200, a composite damping interlayer is formed between the substrate 110 and the damping layer 200, which can further enhance the damping loss and improve the overall damping.

[0039] In addition, the substrate 110 is connected to the damping layer 200 through the third part 126 of the silicone, which can increase the contact area between the membrane layer 100 and the damping layer 200, and enhance the assembly reliability of the membrane layer 100 and the damping layer 200. The silicone 120 has a certain elasticity, which can buffer the stress caused by the difference in thermal expansion coefficients between the substrate 110 and the damping layer 200, and improve the service life of the diaphragm 10.

[0040] For example, the silicone 120 of two adjacent film layers 100 are positioned in the same location.

[0041] For example, the silicone 120 of two adjacent membrane layers 100 are positioned differently. For instance, in one membrane layer 100, a first portion 122 of the silicone is embedded in the substrate 110, a second portion 124 of the silicone covers the side of the substrate 110 facing away from the damping layer 200, and the substrate 110 is connected to the damping layer 200 through a third portion 126 of the silicone. In another membrane layer 100, the first portion 122 of the silicone is embedded in the substrate 110, the second portion 124 of the silicone covers the side of the substrate 110 facing away from the damping layer 200, and at least a portion of the end face of the substrate 110 facing the damping layer 200 is connected to the damping layer 200; that is, at least a portion of the substrate 110 is directly connected to the damping layer 200, and the substrate 110 is not entirely connected to the damping layer 200 through the third portion 126 of the silicone.

[0042] In some feasible implementations, at least a portion of the side end face of the substrate 110 facing the damping layer 200 is connected to the damping layer 200.

[0043] Specifically, the mating structure of the diaphragm layer 100 and the damping layer 200 is refined. At least a portion of the end face of the substrate 110 facing the damping layer 200 is connected to the damping layer 200. That is, a portion of the end face of the substrate 110 facing the damping layer 200 is connected to the damping layer 200, or the entire end face of the substrate 110 facing the damping layer 200 is connected to the damping layer 200. Alternatively, at least a portion of the end face of the substrate 110 facing the damping layer 200 is directly connected to the damping layer 200. A portion of the damping layer 200 can penetrate into the porous structure of the substrate 110 to improve peel strength and ensure the performance of the diaphragm 10.

[0044] In some feasible embodiments, a first portion of the substrate 110 is connected to the damping layer 200 via a third portion 126 of silicone, and a second portion of the substrate 110 is connected to the damping layer 200 via one end face facing the damping layer 200. That is, the second portion of the substrate 110 is directly connected to the damping layer 200, and the first portion of the substrate 110 is indirectly connected to the damping layer 200 via the third portion 126 of silicone.

[0045] In some feasible implementations, the substrate 110 is made of a porous material.

[0046] Specifically, the material of the substrate 110 is refined. The substrate 110 is made of a porous material, which gives it the advantage of low density. The modulus of the substrate 110 differs from that of the silicone 120. Therefore, when the diaphragm 10 vibrates, the deformation of the substrate 110 and the silicone 120 differs, and repeated friction occurs between the contact surfaces of the substrate 110 and the silicone 120, resulting in losses and structural damping. Simultaneously, the porous material of the substrate 110 ensures that it has a large number of interconnected or closed micropores, providing structural support for the silicone 120 to penetrate.

[0047] In some feasible implementations, the substrate 110 is a mesh substrate.

[0048] Specifically, the structure of the substrate 110 is refined to be a mesh substrate. This reduces the mass of the substrate 110 while maintaining its stiffness, which is beneficial for improving the sensitivity and transient response of the diaphragm 10. When the diaphragm 10 is working, the structure of the substrate 110 between two adjacent mesh openings serves as a force transmission path, allowing vibrational energy to be transmitted along this path, and then lost through interfacial friction between the silicone 120 and the substrate 110. Simultaneously, since the substrate 110 is a mesh substrate, the deformation between the substrate 110 and the silicone 120 differs during diaphragm 10 vibration. Repeated friction between the contact surfaces of the substrate 110 and the silicone 120 generates losses and produces structural damping.

[0049] In some feasible implementations, when the substrate 110 is made of a porous material, the pore size of the substrate 110 is greater than or equal to 1 μm and less than or equal to 200 μm.

[0050] Specifically, when the substrate 110 is made of a porous material, the pore size of the substrate 110 is greater than or equal to 1 μm and less than or equal to 200 μm to meet the usage requirements of the silicone 120 embedded in the substrate 110. If the pore size of the substrate 110 is less than 1 μm, the pore size is too small, causing the silicone 120 to be unable to effectively penetrate the substrate 110, unable to form an interpenetrating structure, and unable to meet the usage requirements of the silicone 120 embedded in the substrate 110. If the pore size of the substrate 110 is greater than 200 μm, the contact area between the silicone 120 and the substrate 110 is small, which will weaken the friction effect and result in an insignificant increase in damping.

[0051] For example, when the substrate 110 is made of a porous material, the pore size of the substrate 110 includes 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm and 190μm, etc., which will not be listed here.

[0052] In some feasible implementations, when the substrate 110 is a mesh substrate, the pore size of the substrate 110 is greater than or equal to 1 μm and less than or equal to 300 μm.

[0053] Specifically, when the substrate 110 is a porous substrate, the pore size of the substrate 110 is greater than or equal to 1 μm and less than or equal to 300 μm to meet the usage requirements of embedding silicone 120 in the substrate 110. If the pore size of the substrate 110 is less than 1 μm, the pore size is too small, causing the silicone 120 to be unable to effectively penetrate the substrate 110, resulting in unstable permeability and a small increase in effective damping. If the pore size of the substrate 110 is greater than 300 μm, it will reduce the effective volume of the substrate 110, decrease the bonding degree between the silicone 120 and the substrate 110, weaken the frictional effect, and result in an insignificant increase in damping.

[0054] For example, when the substrate 110 is a mesh substrate, the pore size of the substrate 110 includes 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm, 200μm, 210μm, 220μm, 230μm, 240μm, 250μm, 260μm, 270μm, 280μm and 290μm, etc., which will not be listed here.

[0055] In some feasible embodiments, the material of the substrate 110 includes any one or a combination of the following: silicone, polyurethane, thermoplastic polyether ester elastomer, nitrile rubber, acrylic rubber, nylon, aramid fiber, polyethylene terephthalate, and polybutylene terephthalate.

[0056] Specifically, the material of the substrate 110 includes any one or a combination of the following: silicone, polyurethane, thermoplastic polyether elastomer, nitrile rubber, acrylic rubber, nylon, aramid fiber, polyethylene terephthalate, and polybutylene terephthalate. That is, the material of the substrate 110 is refined so that there is a difference in modulus between the substrate 110 and the silicone 120 in the film layer 100. Therefore, when the diaphragm 10 vibrates, the deformation occurring between the substrate 110 and the silicone 120 differs, and repeated friction occurs between the contact surfaces of the substrate 110 and the silicone 120, resulting in losses and structural damping.

[0057] For example, in the film layer 100, there is a difference between the modulus of the substrate 110 and the modulus of the silicone 120, and there is a difference between the elasticity of the substrate 110 and the elasticity of the silicone 120.

[0058] In some feasible implementations, the material of the damping layer 200 includes any one or a combination of the following: acrylate, silicone, and polyurethane.

[0059] Specifically, the material of the damping layer 200 includes any one or a combination of the following: acrylate, silicone and polyurethane. That is, the material of the damping layer 200 is refined so that the damping layer 200 has high damping at room temperature. The combination of the film layer 100 and the damping layer 200 can improve the overall damping of the diaphragm 10, thereby increasing the smoothness of the frequency response curve and improving the distortion of the speaker 30.

[0060] In some feasible embodiments, the material of the substrate 110 includes any one or a combination of the following: silicone, polyurethane, thermoplastic polyether elastomer, nitrile rubber, acrylic rubber, nylon, aramid fiber, polyethylene terephthalate and polybutylene terephthalate, and the material of the damping layer 200 includes any one or a combination of the following: acrylic, silicone and polyurethane.

[0061] In some feasible implementations, such as Figure 1 and Figure 2 As shown, the thickness of the membrane layer 100 is t1, the thickness of the damping layer 200 is t2, and 0.5≤t1 / t2≤10.

[0062] Specifically, the relationship between the thicknesses of the diaphragm 100 and the damping layer 200 is refined. The thickness of the diaphragm 100 is denoted as t1, and the thickness of the damping layer 200 is denoted as t2. The relationship between t1 and t2 satisfies 0.5≤t1 / t2≤10 to ensure the performance of the diaphragm 10.

[0063] By matching the relationship between t1 and t2, the stiffness and damping of the Gu Zhen diaphragm 10 can be balanced to ensure uniform distribution of the overall modes and reduce the distortion performance of the speaker 30.

[0064] By matching the relationship between t1 and t2, both mass distribution and sensitivity can be taken into account.

[0065] Examples include t1 / t2=1, t1 / t2=1.5, t1 / t2=2, t1 / t2=2.6, t1 / t2=3, t1 / t2=3.5, t1 / t2=4, t1 / t2=4.8, t1 / t2=5, t1 / t2=5.2, t1 / t2=6, t1 / t2=6.5, t1 / t2=7, t1 / t2=7.5, t1 / t2=8, t1 / t2=8.8, and t1 / t2=9, etc., which will not be listed here one by one.

[0066] In some feasible implementations, the damping factor of the damping layer 200 is greater than or equal to 0.5.

[0067] Specifically, the damping factor of the damping layer 200 is greater than or equal to 0.5 to ensure that the damping layer 200 has high damping. The combination of the membrane layer 100 and the damping layer 200 can suppress interlayer resonance and frequency response peaks, reduce distortion, and provide support for ensuring the performance of the diaphragm 10.

[0068] In some feasible implementations, the thickness of the membrane layer 100 is t1, the thickness of the damping layer 200 is t2, 0.5≤t1 / t2≤10, and the damping factor of the damping layer 200 is greater than or equal to 0.5.

[0069] In some feasible embodiments, the number of substrates 110 in the film layer 100 is at least one; when the number of substrates 110 is multiple, the multiple substrates 110 are stacked.

[0070] Specifically, in the membrane layer 100, the number of substrates 110 is at least one. That is, the membrane layer 100 has one substrate 110. Or the membrane layer 100 has multiple substrates 110.

[0071] When there are multiple substrates 110, the stacking and cooperation of multiple substrates 110 can improve the stiffness and shape stability of the membrane layer 100, which is beneficial to increasing structural damping. In addition, the thickness and size of the substrates 110 at different locations can be set according to specific actual use requirements, thereby achieving the purpose of adjusting the mass distribution of the membrane layer 100 and optimizing the mass distribution.

[0072] In some feasible implementations, the loudspeaker 30 includes the diaphragm 10 of any of the above-described implementations.

[0073] The loudspeaker 30 provided in this application includes the diaphragm 10 of any of the above embodiments, and therefore has all the beneficial effects of the diaphragm 10, which will not be described in detail here.

[0074] In some feasible implementations, the electronic device 40 includes the speaker 30 in any of the above implementations.

[0075] like Figure 4 As shown, the electronic device 40 provided in this application includes the speaker 30 of any of the above embodiments, and therefore has all the beneficial effects of the speaker 30, which will not be described one by one here.

[0076] For example, the electronic device 40 can be a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM or self-service machine, etc. The embodiments of this application do not make specific limitations.

[0077] For example, taking two membrane layers 100 and one damping layer 200 as an example, along the thickness direction of the diaphragm 10, the diaphragm 10 sequentially includes membrane layer 100, damping layer 200, and membrane layer 100. Membrane layer 100 includes a substrate 110 and silicone 120, wherein the substrate 110 has a porous structure. For example, the substrate 110 is made of a porous material. For example, the substrate 110 is a mesh substrate. The substrate 110 and the silicone 120 interpenetrate and rub against each other to provide damping, and the damping layer 200 itself has high damping.

[0078] For example, at room temperature, silicone 120 is liquid. Silicone 120 has low viscosity. Under high pressure within the mold, silicone 120 can enter or permeate the substrate 110. After high-temperature vulcanization, silicone 120 and substrate 110 are tightly bonded. Because the modulus and elasticity of substrate 110 differ from those of silicone 120, the deformation of silicone 120 and substrate 110 differs when the diaphragm 10 vibrates. Repeated friction between the contact surfaces of silicone 120 and substrate 110 generates losses and structural damping. Furthermore, the damping layer 200 located between two adjacent membrane layers 100 is a high-damping film. At room temperature, the damping layer 200 has high damping, with a damping factor greater than or equal to 0.5. The membrane layers 100 and damping layer 200 work together to improve the overall damping of the diaphragm 10 through material and structural improvements, thereby increasing the smoothness of the frequency response curve and improving the distortion of the speaker 30.

[0079] For example, taking a membrane layer 100 including a substrate 110 as an example, damping is generated by the friction between molecular chains and fillers. The diaphragm 10 of this application is a multi-layered composite structure, with a damping layer 200 connecting two adjacent membrane layers 100. The damping layer 200 has good damping. Furthermore, the silicone 120 and the substrate 110 permeate each other and are mutually stretched and rubbed, resulting in high damping.

[0080] For example, when the substrate 110 is made of a porous material, the pore size of the substrate 110 is greater than or equal to 1 μm and less than or equal to 200 μm. If the pore size of the substrate 110 is less than 1 μm, the pore size of the substrate 110 is too small, and the silicone 120 cannot enter the pores of the substrate 110, thus failing to form an interpenetrating structure. If the pore size of the substrate 110 is greater than 200 μm, the contact area between the substrate 110 and the silicone 120 is small, the frictional effect is weakened, and the improvement in damping is not significant.

[0081] For example, when the substrate 110 is a mesh substrate, the pore size of the substrate 110 is greater than or equal to 1 μm and less than or equal to 300 μm. For instance, the substrate 110 is a mesh fabric. If the pore size of the substrate 110 is less than 1 μm, the pore size is too small, resulting in low permeability of the silicone 120, unstable permeability, and minimal improvement in effective damping. If the pore size of the substrate 110 is greater than 300 μm, the pore size is too large, reducing the effective volume of the mesh fabric, decreasing the bonding strength between the silicone 120 and the mesh fabric, and resulting in insignificant improvement in damping.

[0082] For example, the material of the substrate 110 includes any one or a combination of the following: silicone, polyurethane, thermoplastic polyether ester elastomer, nitrile rubber, acrylic rubber, nylon, aramid fiber, polyethylene terephthalate and polybutylene terephthalate.

[0083] For example, the material of the damping layer 200 includes any one or a combination of the following: acrylate, silicone, and polyurethane. The damping factor of the damping layer 200 is greater than or equal to 0.5.

[0084] In Embodiment 1 of this application, the substrate 110 of the diaphragm 100 is a nylon mesh, with one nylon mesh, a thickness of 10 μm, and a pore size of 100 μm. The thickness of the diaphragm 100 is 20 μm, and the overall thickness of the diaphragm 10 is 90 μm. The loudspeaker F0 is 788 Hz, which is the lowest natural resonant frequency of the loudspeaker 30 when it vibrates in free air.

[0085] In Embodiment 2 of this application, the substrate 110 of the membrane layer 100 is thermoplastic polyurethane foam, the damping layer 200 is an acrylic film, the number of thermoplastic polyurethane foams is one, the thickness of the thermoplastic polyurethane foam is 40 μm, the pore size of the thermoplastic polyurethane foam is 8 μm, the thickness of the acrylic film is 10 μm, and the overall thickness of the diaphragm 10 is 130 μm. The loudspeaker F0 is 776 Hz.

[0086] In the related technology, the diaphragm is a silicone diaphragm with a thickness of 120μm, and the speaker F0 is 782Hz.

[0087] This application effectively improves damping by rationally configuring the structure of the diaphragm 10. The testing equipment is a dynamic thermomechanical analysis system, with a test frequency of 1 Hz, a test temperature of 23°C, a test standard of ASTM D4065, an amplitude of 0.2%, and a tensile mode.

[0088] like Figure 5 As shown, the frequency response curves of Embodiment 1 and Embodiment 2 of this application are flatter, and no obvious peaks were found in the low frequency region, while the curves in the related art show irregular peaks near the speaker F0.

[0089] like Figure 6 As shown, Embodiment 1 of this application has the lowest total harmonic distortion, Embodiment 2 of this application has the second lowest total harmonic distortion, while the related technologies have the highest total harmonic distortion, indicating that this application can effectively reduce distortion and provide a better listening experience.

[0090] For example, such as Figure 3 As shown, the loudspeaker 30 includes a grille 301, a back magnetic plate 302, a center magnet 303, a side magnet 304, a center magnetic plate 305, a side magnetic plate 306, a bracket 307, a voice coil 308, a conductive support plate 309, a top plate 310, and a diaphragm 10.

[0091] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0092] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A diaphragm, characterized in that, For a loudspeaker, the diaphragm includes: Multiple membrane layers are stacked together. Each membrane layer includes a substrate and a silicone substrate. The substrate has a porous structure. A first portion of the silicone substrate is embedded in the substrate. The silicone substrate and the substrate have different moduli. At least one damping layer, wherein a damping layer is connected between any two adjacent membrane layers, and the damping layer is made of a material with pressure-sensitive damping function; In the film layer, a second portion of the silicone covers the side of the substrate opposite to the damping layer.

2. The diaphragm according to claim 1, characterized in that, The substrate is connected to the damping layer via a third portion of the silicone; and / or At least a portion of the side face of the substrate facing the damping layer is connected to the damping layer.

3. The diaphragm according to claim 1 or 2, characterized in that, The substrate is made of a porous material; or The substrate is a mesh substrate.

4. The diaphragm according to claim 3, characterized in that, When the substrate is made of a porous material, the pore size of the substrate is greater than or equal to 1 μm and less than or equal to 200 μm; When the substrate is a mesh substrate, the pore size of the substrate is greater than or equal to 1 μm and less than or equal to 300 μm.

5. The diaphragm according to claim 1 or 2, characterized in that, The substrate material includes any one or a combination of the following: silicone, polyurethane, thermoplastic polyether elastomer, nitrile rubber, acrylic rubber, nylon, aramid fiber, polyethylene terephthalate, and polybutylene terephthalate; and / or The damping layer is made of any one or a combination of the following: acrylate, silicone, and polyurethane.

6. The diaphragm according to claim 1 or 2, characterized in that, The thickness of the membrane layer is t1, and the thickness of the damping layer is t2, where 0.5 ≤ t1 / t2 ≤ 10.

7. The diaphragm according to claim 1 or 2, characterized in that, The damping factor of the damping layer is greater than or equal to 0.

5.

8. The diaphragm according to claim 1 or 2, characterized in that, In the membrane layer, the number of substrates is at least one; When there are multiple substrates, the multiple substrates are stacked.

9. A loudspeaker, characterized in that, include: The diaphragm as described in any one of claims 1 to 8.

10. An electronic device, characterized in that, include: The loudspeaker as described in claim 9.

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