Electronic device electrical property testing method and system based on track flow, and storage medium

Abstract

The application relates to the technical field of electronic component testing, and discloses an electronic device electrical property testing method and system based on track flow and a storage medium. The method comprises the following steps: applying a first voltage at a first work station, releasing after outputting first data; calculating a first voltage adjustment value according to the first data and first standard data, and positively correlatively adjusting a second voltage; applying the second voltage at a second work station; releasing after outputting second data; calculating a second adjustment value according to the second data and second standard data, and positively correlatively adjusting a first current; applying the first current at a third work station, releasing after outputting third data; calculating a third adjustment value according to the third data and third standard data, and adjusting a signal frequency of a first signal; and applying the first signal at a fourth work station, releasing after outputting fourth data. The adaptability of a triode testing process is improved.

Description

Technical Field

[0001] This application relates to the technical field of electronic component testing, and in particular, to an electronic device electrical property testing method, system and storage medium based on track rotation. Background Art

[0002] As a core semiconductor device in electronic circuits, a triode has functions of current amplification and switch control. Its structure is mainly composed of three parts: an emitter, a base, and a collector, and is commonly made of silicon or germanium materials. In various electronic devices, triodes are widely used in key modules such as signal amplification, power supply voltage regulation, and logic control. Their electrical properties directly determine the working stability and reliability of electronic devices. Therefore, strict electrical parameter detection is required during the production process. Currently, after batch production of triodes, electrical parameter detection needs to be completed through specialized testing equipment. This process mostly uses a track rotation and conveying method to achieve continuous testing of triodes. Specifically, driving cylinders are fixedly installed on both sides of the testing track. The end of the cylinder piston rod is connected to a testing pin. When a triode moves to a working position along the track, the cylinder drives the testing pin to move inward, making the testing pin accurately contact the emitter, base, and collector pins of the triode. Then, electrical parameters are collected through a testing circuit. After the test, the triodes are then conveyed to a sorting mechanism and divided into two categories: qualified and unqualified according to the test results. During the existing triode track rotation testing process, electrical testing parameters are mostly fixedly set. That is, the testing circuit always detects triodes with a preset fixed voltage and fixed current, and at the same time, an image detection module with a fixed algorithm is used to assist in judging the appearance and position of the pins. However, there may be slight parameter differences between different batches and different models of triodes, and factors such as fluctuations in the track conveying speed and pin oxidation during the testing process will also affect the testing effect. Currently, each testing link is independent, and the parameters cannot be dynamically adjusted according to the actual testing situation, resulting in the need to improve the adaptability of the testing process. Summary of the Invention

[0003] In order to improve the adaptability of the triode testing process, this application provides an electronic device electrical property testing method, system and storage medium based on track rotation.

[0004] In the first aspect, this application provides an electronic device electrical property testing method based on track rotation, adopting the following technical solutions: An electronic device electrical property testing method based on track rotation includes the following steps: Obtain a position trigger signal of an electronic device on a testing track and testing parameters corresponding to the electronic device. The testing parameters include a first voltage, a second voltage, a first current, and a first signal; In response to a position trigger signal, the first pressure bar on one side of the test track is controlled to press the electronic device; the electrical test assembly is controlled to apply a first voltage at the first station, and after outputting first data, the electronic device is released; a first adjustment value is calculated based on the first data and a preset first standard data, and a second voltage is adjusted in a positive correlation with the first adjustment value; The second pressure bar on the other side of the control test track presses the electronic device; the electrical test assembly is driven to apply a second voltage at the second station, wherein the first voltage is lower than the second voltage; the electronic device is released after the second data is output; a second adjustment value is calculated based on the second data and the preset second standard data, and the first current is adjusted in a positive correlation with the second adjustment value; The first pressure bar under the control test track presses the electronic device; the electrical test assembly is driven to apply the first current at the third station to perform current testing, and the electronic device is released after the third data is output; the third adjustment value is calculated based on the third data and the preset third standard data, and the signal frequency of the first signal is adjusted according to the positive correlation of the third adjustment value; The control test track is followed by a second pressure bar that presses down on the electronic device; the control electrical test assembly is then positioned at the fourth station to apply a first signal for signal testing, and after outputting the fourth data, the electronic device is released. An electrical test report is generated based on the first, second, third, and fourth data.

[0005] By adopting the above technical solution, the first pressure bar is controlled by the response position trigger signal to press the electronic device. The electrical testing component applies a first voltage and outputs first data at the first station. After release, the first voltage adjustment value is calculated based on the first data and the preset first standard data. The second voltage is positively adjusted to adapt the second voltage to the characteristics of the current electronic device. Then, the second pressure bar is controlled to press the electronic device. The electrical testing component applies a second voltage and outputs second data at the second station. The second adjustment value is calculated based on the second data and the preset second standard data. The first current is positively adjusted to improve the matching degree between the current test and the actual state of the electronic device. Next, the next first pressure bar is controlled to press the electronic device. The electrical testing component applies a first current and outputs third data at the third station. The third adjustment value is calculated based on the third data and the preset third standard data. The signal frequency of the first signal is positively adjusted to optimize the adaptability of the signal test. Subsequently, the next second pressure bar is controlled to press the electronic device. The electrical testing component applies a first signal and outputs fourth data at the fourth station. Finally, the first data, second data, third data, and fourth data are combined to generate an electrical test report, realizing dynamic linkage adjustment of parameters in each test link and greatly improving the adaptability of the test.

[0006] Optionally, after the signal testing step, the following steps are also included: Based on the image detection component, the package and pin parts of electronic devices are detected, and the corresponding package data and pin data are generated. If the encapsulation data is outside the preset encapsulation standard range, an encapsulation image warning will be issued. Otherwise, determine whether the pin data is outside the preset pin standard range; If the pin data is outside the preset pin standard range, a pin image warning is issued; otherwise, a fourth adjustment value is calculated based on the fourth data and the preset fourth standard data, and a signal adjustment value is calculated by weighting the third and fourth adjustment values. The clamping pressure of the electronic device pin is then adjusted according to the negative correlation of the signal adjustment value.

[0007] By adopting the above technical solution, the image detection component is used to detect the package and pin parts, which can increase the identification of abnormalities and provide early warning, improve the reliability of test results, calculate adjustment values ​​based on the required data and adjust the clamping pressure to adapt the clamping force to the state of the device, and reduce the adverse effects caused by pin contact.

[0008] Optionally, the step of pressing the electronic device may further include the following sub-steps: The electrical testing assembly clamps the pins of the electronic device at the first station for a first duration, clamps the pins of the electronic device at the second station for a second duration, clamps the pins of the electronic device at the third station for a third duration, and clamps the pins of the electronic device at the fourth station for a fourth duration. The voltage regulation value is calculated by weighting the first and second regulation values, and the third duration is adjusted based on the negative correlation of the voltage regulation value. The fourth duration is adjusted based on the negative correlation of the third adjustment value.

[0009] By adopting the above technical solution, the stability of the electrical testing component testing process is ensured by setting the clamping time corresponding to each workstation; the voltage regulation value is calculated by weighting the adjustment value and the third time is negatively adjusted, and the fourth time is negatively adjusted by the third adjustment value, so that the time adapts to the parameter changes.

[0010] Optionally, the first pressure rod and the second pressure rod are grouped together and staggered on both sides of the test track. The first pressure rod and the second pressure rod are both fixedly connected to the same actuator. The first pressure rod and the second pressure rod remain relatively stationary and move simultaneously. The number of first pressure rods is greater than the number of stations in the electrical test assembly. The coverage areas of the first pressure rod and the second pressure rod on the test track both surround the coverage area of ​​the electrical test assembly on the test track. When the first pressure bar is inserted into the test track, the electronic device is fixed. When the first pressure bar is removed from the test track, the electronic device moves to the next station and corresponds to the second pressure bar. When the second pressure bar is inserted into the test track, the electronic device is fixed. When the second pressure bar is removed from the test track, the electronic device moves to the next station and corresponds to the next first pressure bar. The first pressure bar and the second pressure bar are not inserted into the test track at the same time.

[0011] By adopting the above technical solution, the first and second pressure rods are grouped and staggered and fixed alternately to ensure that the electronic device is always stably positioned during the flow of the workstation; the linkage of the same actuator makes the pressure rod movement synchronized, and the design covering the workstation can ensure that the electronic device can be positioned in the corresponding workstation.

[0012] Optionally, the step of pressing the electronic device may further include the following sub-steps: Obtain dimensional data based on the model number of the electronic component; The size adjustment value is calculated based on the size data and the preset reference data; the pressing pressure of the first and second pressure rods on the electronic components is adjusted according to the negative correlation of the size adjustment value. The time interval between the first and second pressure rods alternately pressing the electronic device is adjusted according to the size adjustment value.

[0013] By adopting the above technical solution and adjusting the crimping pressure to match the electronic device model, the problem of insufficient pressure and poor contact caused by size differences can be avoided. Combined with the negative correlation adjustment of the matching time interval, the alternation rhythm of the pressure bar is adapted to the size of the electronic device, which helps to ensure the stability of the testing process.

[0014] Optionally, the step of pressing the electronic device may further include the following sub-steps: Based on the acquired test track stop command, identify the stop feeding command from the test track stop command; If a stop feeding command is detected and a new position trigger signal is obtained, an abnormality in the test track is indicated. The first pressure rod is controlled to press the electronic device and keep it fixed, the second pressure rod is controlled to press the electronic device and keep it fixed, or the time interval between the first pressure rod and the second pressure rod is controlled to be less than the preset minimum interval, so that the displacement of the electronic device on the test track per unit time is less than the preset set displacement, and an on-site alarm signal is issued.

[0015] By adopting the above technical solution, abnormalities in the test track can be identified and alerted in a timely manner. By shortening the pressure bar interval to control the displacement of electronic components, and in conjunction with on-site alarms, the displacement of electronic components during abnormalities can be effectively avoided, which helps to ensure test safety. Under normal conditions, the electronic components continue to rotate, while under abnormal conditions, the system quickly alternates to keep the electronic components in their current positions.

[0016] Optionally, the method further includes the following steps: The electrical testing assembly has a redundant station after the fourth station, and the redundant station is equipped with a transfer port; the transfer port is electrically connected to the test ports on the first, third and fourth stations. Obtain the test command corresponding to the first, third, or fourth workstation, connect the test port to the test port on the workstation corresponding to the test command, perform redundancy testing, and generate the fifth data. Add the fifth data point to the electrical test report.

[0017] By adopting the above technical solution, supplementary testing can be achieved through redundant workstations and transfer ports, generating the fifth data to complete the electrical test report. Since the second workstation is for high-voltage testing, it is not connected to the redundant workstation for safety reasons.

[0018] Optionally, the step of obtaining the test instruction corresponding to the first station, the third station, or the fourth station may further include the following sub-steps: The workstation corresponding to the test instruction is randomly assigned; Alternatively, the fourth adjustment value can be calculated based on the fourth data and the preset fourth standard data. The smallest value among the first adjustment value, the third adjustment value and the fourth adjustment value can be selected, and the workstation corresponding to the smallest value can be matched. When the electronic device corresponding to the smallest value arrives at the redundant workstation, a matching test instruction can be generated according to the corresponding workstation.

[0019] By adopting the above technical solutions, the stability of electrical testing can be improved by randomly assigning workstations, and workstations matched according to the minimum adjustment value can be used to supplement workstations with potential risks, which is conducive to improving the reliability of electrical test data and the accuracy of results.

[0020] Secondly, this application provides an electronic device electrical testing system based on track flow, which adopts the following technical solution: An electronic device electrical testing system based on track flow includes a processor, wherein the processor executes the steps of the electronic device electrical testing method based on track flow as described in any one of the preceding claims.

[0021] Thirdly, this application provides a storage medium, which adopts the following technical solution: A storage medium storing a program, which, when executed by a processor, implements the steps of the above-described method for electrical testing of electronic devices based on orbital flow.

[0022] In summary, this application includes at least one of the following beneficial technical effects: By positively adjusting the key parameters of the next station based on the test data of the previous station (such as adjusting the second voltage based on the first data and adjusting the first current based on the second data), the system can adapt to the differences in electronic components of different batches / models and interference such as track fluctuations and pin oxidation, thus greatly improving the test adaptability.

[0023] The staggered positioning of the grouped pressure bars, combined with the matching of the crimping pressure and alternation interval with the device model, and the adjustment of the clamping time of each station, ensures the stability of device flow and testing; image detection anomaly warning and redundant station supplementary testing (avoiding the high pressure risk of the second station) reduce test misjudgment and improve data accuracy.

[0024] In case of abnormalities, the displacement of the pressure rod control device and on-site alarms ensure test safety. Automated adjustment and early warning reduce the cost of manual intervention, adapt to the mass production testing needs of electronic components, and indirectly ensure the operational stability of downstream electronic equipment. Attached Figure Description

[0025] Figure 1 This is a flowchart illustrating the steps of an electronic device electrical testing method based on orbital flow.

[0026] Figure 2 This is a partial structural diagram of a transistor electrical performance testing device, with the test track highlighted.

[0027] Figure 3 This is a partial structural diagram of a transistor electrical performance testing device, highlighting the first and second stop levers.

[0028] Figure 4 This is a flowchart illustrating the method steps for testing based on image detection components.

[0029] Figure 5 This is a diagram showing the sub-steps of pressing electronic components.

[0030] Reference numerals in the attached diagram: 1. Test track; 2. First pressure bar; 3. Second pressure bar; 4. Electronic component; 5. First station; 6. Second station; 7. Third station; 8. Fourth station. Detailed Implementation

[0031] The embodiments of this application are described in detail below, and examples of the embodiments are shown in the accompanying drawings.

[0032] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0033] This application discloses an electrical testing method for electronic devices based on orbital flow, referring to... Figure 1-3 It includes the following steps: S1: Parameter and Signal Acquisition The system acquires the position trigger signals and corresponding initial test parameters of electronic devices on the test track in real time. For electronic devices such as transistors, the position trigger signal is generated by a photoelectric sensor or proximity switch installed on the side of the test track. When the electronic device moves along the track to a preset position, the sensor triggers the signal and sends it to the control system. The initial test parameters include: The preset first voltage. For example, the low-voltage test voltage can be set to a range of 0.5-3V; The second voltage, such as the high-voltage test voltage, can be set to a range of 5-20V. The first current, such as the rated operating current, can be set to a range of 1-50mA; and, The first signal, such as a high-frequency test signal, can be set to a frequency of 100kHz-1MHz; These parameters can be pre-configured in the system according to the model and specifications of the electronic devices.

[0034] S2: Low-pressure test and parameter adjustment at the first station After the control system responds to the position trigger signal, the first pressure rod driven by the pneumatic actuator on one side of the control test track extends inward until it presses against the housing of the electronic device, achieving mechanical positioning. The probes of the electrical test assembly contact the emitter, base, and collector pins of the electronic device at the first station and apply a first voltage to perform low-voltage electrical tests, such as forward voltage drop and initial conduction characteristic detection. After the test is completed, the first data is output, such as the measured voltage drop value and conduction resistance.

[0035] The first pressure lever is released and reset, and the electronic device moves to the next position along the track. At this time, the system compares the first data with the preset first standard data, such as the nominal voltage drop range in the device manual. The first adjustment value is calculated using the formula: such as Δ1=|measured value-standard value| / standard value, and the second voltage is adjusted positively according to this adjustment value. For example, if the first data deviates more from the standard value, the first adjustment value is higher, and the adjustment range of the second voltage is also larger. For example, if the original second voltage is 10V, it can be increased to 12V or reduced to 8V after adjustment, so that the subsequent high voltage test is more adapted to the actual characteristics of the current device.

[0036] S3: High-voltage testing and parameter adjustment at the second station When the electronic device moves to the second station, a second pressure bar extends from the other side of the test track and presses the device down. The second pressure bar has the same structure as the first pressure bar and is symmetrically distributed. The electrical test assembly switches to high-voltage test mode and applies a second voltage adjusted in step S2. This voltage value is always higher than the first voltage and is used to detect parameters such as the device's withstand voltage and leakage current under high voltage. After the test is completed, second data, such as leakage current value and breakdown voltage, is output.

[0037] When the second pressure bar is released, the system compares the second data with the preset second standard data, such as the maximum allowable leakage current. The system calculates the second adjustment value, which is similar to Δ1, and adjusts the first current accordingly. For example, if the second data shows that the device leakage current is too large, the second adjustment value is increased, and the first current can be appropriately reduced, such as from 10mA to 8mA, to avoid damage or misjudgment of the device during subsequent current testing.

[0038] S4: Current testing and parameter adjustment at the third station When the electronic device moves to the third station, the next first pressure bar on the test track extends and presses the device. The next first pressure bar and the first pressure bar in S2 are in the same group and alternate. The electrical test assembly applies the first current adjusted in step S3 to test parameters such as current amplification factor and saturation current, and outputs third data, such as hFE value and ICEO value.

[0039] After the first pressure bar is released, the system compares the third data with the preset third standard data. If the third standard data is within the amplification range, the system calculates the third adjustment value and adjusts the signal frequency of the first signal according to the positive correlation of the adjustment value. For example, if the third data shows that the high-frequency response of the device is weak, the third adjustment value is increased, and the frequency of the first signal can be appropriately reduced, such as from 500kHz to 300kHz, to ensure the accuracy of subsequent signal tests.

[0040] S5: Signal Test at Fourth Station When the electronic device reaches the fourth station, the next second pressure bar on the test track extends and clamps the device. The electrical testing assembly applies the first signal, adjusted in step S4 (such as a high-frequency pulse signal), to test the device's switching speed, frequency response, and other dynamic characteristics, outputting fourth data, such as rise time and cutoff frequency. After the test is completed, the second pressure bar releases, and the electronic device continues to the subsequent processing stage.

[0041] S6: Generate an electrical test report The system generates an electrical test report based on the first, second, third, and fourth data obtained in steps S2 to S5, combined with the unique identifier of the electronic device (such as a QR code or serial number). The report includes the measured values ​​of various parameters, deviations from standard values, and records of the adjustment process. It also determines whether the device is qualified based on preset thresholds, facilitating subsequent sorting and rework.

[0042] S7: Image Detection and Clamping Pressure Adjustment Reference Figure 4 After the signal test in step S5 is completed, the electronic device moves along the test track to the image detection area, and the system starts the image detection process to further ensure the accuracy of the test results. S7.1: Image Data Acquisition and Inspection Components include a high-definition industrial camera, a ring light source, and an image processor. The camera captures images of the electronic device from both a vertical and a 45° tilt angle. Vertical imaging focuses on the packaged portion, such as the plastic casing of a transistor and the marking printing area, generating package data including quantitative parameters such as package size deviation, surface cracks, and marking blurriness. Tilted imaging focuses on the pin portion, including the emitter, base, and collector pins, generating pin data including quantitative parameters such as pin spacing deviation, curvature, and oxide area ratio. The image processor processes the raw images using algorithms such as edge detection and grayscale analysis, converting the above parameters into comparable numerical data.

[0043] S7.2: The packaging data judgment and early warning system compares the packaging data generated in S7.1 with the preset packaging standard range, such as packaging size deviation ≤ 0.1mm, no cracks longer than 0.5mm, and marking clarity score ≥ 80 points. If the packaging data exceeds this range, for example, a crack with a length of 0.8mm is detected, the packaging is judged to be abnormal, and the control system immediately triggers a packaging image early warning prompt; specifically, the warning light at the corresponding station on the test track lights up red, the human-machine interface displays a magnified image of the abnormal packaging and specific deviation parameters, and records the unique identifier of the electronic device for subsequent traceability.

[0044] S7.3: Pin Data Judgment and Early Warning If the package data in S7.2 is within the standard range, the system further compares the pin data with the preset pin standard range, such as pin curvature ≤1°, oxide area ratio ≤5%, and pitch deviation ≤0.05mm. If the pin data exceeds this range, for example, if a pin curvature reaches 2.5°, the pin is determined to be abnormal, and the control system triggers a pin image early warning; at this time, the warning light illuminates yellow, the human-machine interface displays the image and quantization deviation value of the abnormal pin, and the device identifier is also recorded.

[0045] S7.4: Dynamic Adjustment of Clamping Pressure. If the pin data in S7.3 is within the standard range, the system enters the parameter adjustment phase. Calculate the fourth adjustment value: Based on the fourth data output from step S5, such as signal response time and frequency attenuation rate, and based on the preset fourth standard data, such as standard response time range and maximum allowable attenuation rate, calculate the fourth adjustment value using the formula Δ4 = (measured value - standard median) / standard fluctuation range. The result is a positive or negative value, which respectively indicates that the measured value is higher or lower than the standard median. Calculate the signal conditioning value: Use a weighted algorithm to fuse the third and fourth conditioning values ​​from step S4. For example, the signal conditioning value = 0.6 × |Δ3| + 0.4 × |Δ4|, and the weights can be preset according to the device type. Clamping pressure adjustment: The pressure of the pin clamping mechanism in the electrical test assembly is negatively adjusted according to the signal adjustment value. Specifically, a larger signal adjustment value indicates a more significant deviation of the test data from the standard, which may be due to insufficient pin contact stability. In this case, the clamping pressure should be appropriately reduced. For example, if the original pressure is 5N, the pressure should be reduced by 0.2N for every 0.1N increase in the adjustment value to avoid over-clamping and pin deformation. Conversely, a smaller signal adjustment value allows the clamping pressure to be maintained or slightly increased, such as not lower than 3N, to ensure good contact. Specifically, the clamping pressure is adjusted by regulating the air pressure of the cylinder in the pin clamping mechanism.

[0046] Through step S7, the system adds appearance quality inspection to the electrical parameter test, realizing dual verification of electrical and appearance. At the same time, by dynamically adjusting the clamping pressure, the test error caused by contact problems is reduced, further improving the adaptability of the test system.

[0047] S8: Pin clamping time control at each station Reference Figure 5 In steps S2 to S5, the clamping action of the electrical test assembly on the pins of the electronic device needs to be coordinated with a specific duration to ensure stable test data. This embodiment further adapts to the actual test state of the electronic device by dynamically adjusting the clamping duration of each station. The specific steps are as follows: S8.1: Initial Clamping Time Setting System pre-configures the initial clamping time for four stations: the first station's low-voltage test first time is set to T1, e.g., 100ms; the second station's high-voltage test second time is set to T2, e.g., 120ms; the third station's current test third time is set to T3, with an initial value of 150ms; and the fourth station's signal test fourth time is set to T4, with an initial value of 180ms. This initial time is set based on the test response characteristics of conventional electronic devices, ensuring that the electrical test components can stably acquire parameters such as voltage drop and current change curves during basic testing, avoiding incomplete data acquisition due to excessively short clamping times or reduced test efficiency due to excessively long clamping times.

[0048] S8.2: Voltage Regulation Value Calculation and Third Duration Adjustment After the first regulation value Δ1 is calculated in step S2 and the second regulation value Δ2 is calculated in step S3, the system enters the third duration adjustment stage: Based on the testing priority of electronic devices, such as the fact that high voltage test data has a greater impact on current test, weighting coefficients are assigned to Δ1 and Δ2; for example, the weighting coefficient of Δ1 is set to 0.3 and the weighting coefficient of Δ2 is set to 0.7. The comprehensive voltage adjustment value is calculated using the formula: voltage adjustment value V_adjust=0.3×|Δ1|+0.7×|Δ2|. The third duration T3 is negatively adjusted based on V_adjust: if V_adjust is larger, it indicates that the parameters in the preceding low-voltage and high-voltage tests deviate more significantly from the standard values, and the electrical response of the electronic device may be slower. In this case, T3 needs to be extended to ensure sufficient current parameter acquisition. For example, for every 0.1 increase in V_adjust, T3 is extended by 10ms, up to a maximum of 200ms. If V_adjust is smaller, it indicates that the preceding test parameters are closer to the standard values, and the device response speed is normal. T3 can be appropriately shortened to improve efficiency. For example, when V_adjust is less than 0.05, T3 is shortened to 120ms.

[0049] For example, when Δ1=0.08 (the first data deviates slightly from the standard) and Δ2=0.15 (the second data deviates more significantly), V_adjust=0.3×0.08+0.7×0.15=0.129. At this time, T3 is extended from the initial 150ms to 150ms+0.129×100ms≈163ms, ensuring that the current test at the third station can fully capture the current change characteristics of the device.

[0050] S8.3: After the third adjustment value Δ3 is calculated in step S4, the system adjusts the fourth duration T4 negatively based on Δ3: Δ3 reflects the deviation between the current test data and the standard value. The larger the deviation, the more unstable the dynamic signal response of the electronic device may be, such as large fluctuations in the current amplification factor. In this case, T4 needs to be extended to ensure the stability of data acquisition in high-frequency signal testing. For example, for every 0.1 increase in Δ3, T4 is extended by 15ms, up to a maximum of 250ms. If Δ3 is smaller, it indicates that the current characteristics of the device are more stable and the signal response speed is more controllable. T4 can be shortened to optimize the test rhythm. For example, when Δ3 is less than 0.05, T4 is shortened to 150ms.

[0051] For example, when Δ3=0.06, the current test data deviates slightly from the standard, and T4 is extended from the initial 180ms to 180ms+0.06×150ms=189ms to ensure that the fourth station can accurately collect dynamic parameters such as the rise time and cutoff frequency of the signal; if Δ3=0.03, the current test data is close to the standard, and T4 is shortened to 150ms, which improves the efficiency of batch testing while ensuring test accuracy.

[0052] Through the S8 step, the pin clamping time of each station is no longer fixed, but dynamically adapted based on the adjustment value of the preceding test. This avoids the test data deviation caused by a one-size-fits-all approach to the time, while also taking into account test efficiency and stability. It is especially suitable for mixed testing scenarios of different batches and models of electronic devices.

[0053] S9: Strut Structure Design and Motion Control To ensure that electronic devices maintain stable positioning throughout the test track and testing process at each station, this embodiment optimizes the structural layout and operational logic of the first and second pressure rods, as detailed below: S9.1: Pressure Bar Structure and Installation Layout The first and second pressure bars are designed in groups, with each group containing one first pressure bar and one second pressure bar. All pressure bars are installed on both sides of the test track. The first pressure bars are uniformly fixed to the left-side bracket of the test track, and the second pressure bars are uniformly fixed to the right-side bracket. The spacing between adjacent pressure bars on the same side is adapted to the length of the electronic device. For example, a spacing of 15mm is suitable for transistors with a length of 10-12mm. Simultaneously, the first and second pressure bars are staggered: based on the flow direction of the test track, the installation position of the second pressure bar in each group is 1 / 2 the distance between the first and second pressure bars. For example, if the distance between the first and second pressure bars is 20mm, the second pressure bar is 10mm ahead, ensuring that there is no positioning gap when the electronic device flows from the positioning area of ​​the first pressure bar on the left to the positioning area of ​​the second pressure bar on the right.

[0054] Furthermore, all the first and second pressure rods are fixedly connected to the same pneumatic actuator, such as a dual-axis cylinder, via rigid connectors. The output shaft of this actuator and the axis of the pressure rod are parallel to the radial direction of the test track, that is, perpendicular to the direction of rotation of the electronic device. This ensures that the first and second pressure rods remain relatively stationary under the drive of the actuator and can simultaneously extend (insert into the test track) and retract (remove from the test track). In terms of quantity, the total number of first pressure rods is set to 1.5 times the number of electrical test component stations. For example, if there are 4 stations, then there are 6 first pressure rods. The extra pressure rods are used to cover the feed and discharge areas of the test track to prevent the electronic device from becoming loose before entering the first station or after leaving the last station.

[0055] In terms of coverage, the axial coverage length of the first and second pressure bars on the test track, i.e., the length along the direction of electronic device flow, is set to 1.2 times the coverage length of the electrical test component station. For example, if the station coverage length is 80mm, the pressure bar coverage length is set to 96mm, and the coverage area of ​​the pressure bar completely surrounds the station coverage area. Specifically, the coverage area of ​​the first pressure bar extends from the first station at the feeding end to the last 5mm at the middle station, and the coverage area of ​​the second pressure bar extends from the first 5mm at the middle station to the last 10mm at the discharging end, ensuring that the electronic device is always within the positioning range of the pressure bar when it flows between stations.

[0056] S9.2: The control logic for the lever's action is based on alternating positioning and asynchronous insertion. The specific process is as follows: When the electronic device moves along the test track to the coverage area of ​​the first pressure bar on the left, the pneumatic actuator drives all the first pressure bars on the left to extend synchronously and insert into the test track. The end of the pressure bar contacts the left side of the electronic device's housing and presses it against the right side positioning block of the test track, thus achieving the positioning of the low-pressure test at the first station. At this time, the second pressure bar on the right remains retracted to avoid mechanical interference with the first pressure bar.

[0057] After the first station test is completed, the pneumatic actuator drives the first pressure rod to retract synchronously and detach from the test track. The electronic device continues to flow forward under the drive of the track. Due to the staggered and advanced layout of the second pressure rod, the electronic device immediately enters the coverage area of ​​the second pressure rod on the right side as soon as it leaves the positioning range of the first pressure rod. At this time, the actuator drives all the second pressure rods on the right side to extend synchronously, pressing the right side housing of the electronic device and fixing it on the positioning block on the left side of the test track, thus achieving the positioning of the high-pressure test at the second station. During this process, the first pressure rod always remains retracted, and there is no synchronous insertion between the two.

[0058] After the second station test is completed, the second pressure bar retracts synchronously, and the electronic device continues to flow into the coverage area of ​​the next group of first pressure bars. Since the number of first pressure bars is greater than the number of stations, the next group of first pressure bars is already in a positioning state. The actuator drives the first pressure bars of this group to extend, realizing the positioning of the current test at the third station. The positioning logic from the third station to the fourth station and from the fourth station to the discharge end follows the same pattern, that is, the cycle of first pressure bar positioning → retraction → second pressure bar positioning → retraction → next first pressure bar positioning, ensuring that the electronic device is always in a stable positioning state throughout the entire testing process.

[0059] Through the structural layout of S9.1 and the motion control of S9.2, the first pressure rod and the second pressure rod can avoid mechanical interference through synchronous action, and eliminate positioning gaps through misalignment and coverage design, effectively solving the problem of electronic components being easily misaligned during workstation transfer.

[0060] S10: Crimping parameter adjustment based on electronic component model Considering the differences in dimensions among various electronic components, such as NPN and PNP transistors, or TO-92 and SOT-23 devices with different package specifications (e.g., varying lengths, widths, and pin pitch), using a fixed interval between the pressing pressure and the pressure bar can easily lead to insufficient pressure causing loose positioning, or improper intervals causing flow jamming. Therefore, this embodiment incorporates a size adaptation adjustment based on the component model into the pressing process. The specific steps are as follows: S10.1: Obtain electronic component model and size data The system obtains the model number and corresponding size data of electronic components in two ways: Pre-stored database retrieval: The system's parameter configuration module pre-stores standard dimension data for mainstream electronic device models, including key parameters such as the overall device length L (e.g., 9.5mm for TO-92 transistors and 3.0mm for SOT-23), width W (6.5mm for TO-92 transistors and 1.8mm for SOT-23 transistors), and the distance D from the pin root to the package edge. When the operator inputs the model of the device to be tested through the human-machine interface, such as "2N3904," or identifies the model QR code on the device surface through the barcode scanning module at the track entrance, the system automatically retrieves the corresponding standard dimension data for that model from the database.

[0061] Real-time measurement and calibration: If the model of the device to be tested is not in the pre-stored database, or if further improvement of dimensional accuracy is required, the system activates the laser rangefinder at the track entrance to measure the length and width of the electronic device in real time, generate measured dimensional data, and store it in association with the model information entered by the operator.

[0062] S10.2: Calculate the dimensional adjustment value The system compares the dimensional data obtained in S10.1 with the preset reference data and calculates the dimensional adjustment value. The dimensional data uses length L as an example; when considering the influence of width W, a weighted average can be used. The preset reference data is the system-defined baseline device size, such as the size of the most widely used TO-92 transistor, where L_ref = 9.5mm and W_ref = 6.5mm. The formula for calculating the dimensional adjustment value is: Size adjustment value K = (actual size value - reference size value) / reference size value; For example, when the device under test is of type SOT-23, the actual L = 3.0 mm, and K = (3.0 - 9.5) / 9.5 ≈ -0.684, indicating that the actual size is smaller than the reference size. If the device under test is of type TO-126, the actual L = 15.0 mm, then K = (15.0 - 9.5) / 9.5 ≈ 0.579, indicating that the actual size is larger than the reference size. The sign of this adjustment value K reflects the relationship between the actual size and the reference size, and the absolute value reflects the degree of difference.

[0063] S10.3: Negative correlation adjustment of crimping pressure The system adjusts the crimping pressure of the first and second pressure rods in a negative correlation based on the size adjustment value K. The core logic is: the larger the size, the more positive and absolute K is, and the crimping pressure is appropriately reduced; the smaller the size, the more negative and absolute K is, and the crimping pressure is appropriately increased, so as to avoid damage to the device or positioning failure due to improper pressure.

[0064] The specific adjustment process is as follows: The system presets a reference crimping pressure P_ref, such as 10N, based on the stable positioning requirements of the reference-sized device. Set the pressure adjustment coefficient α, such as α=5N, and calibrate according to the material of the pressure bar and the hardness of the device package. Then the formula for calculating the actual pressing pressure P is: P=P_ref-K×α; For example, for TO-126 type devices, K≈0.579, P=10-0.579×5≈7.1N. Due to the large size of the device and the wide contact surface, a smaller pressure can achieve stable positioning, avoiding excessive pressure that could cause package deformation. For SOT-23 type devices, K≈-0.684, P=10-(-0.684)×5≈13.4N. Due to the small size of the device and the narrow contact surface, a larger pressure is required to ensure firm positioning and prevent displacement during testing.

[0065] The crimping pressure is adjusted by controlling the air pressure of the pneumatic actuator: the system sends a control signal to the air pressure regulating valve based on the calculated P value to adjust the pressure of the compressed air. If the air pressure and crimping pressure have a linear relationship, 0.2MPa corresponds to 5N and 0.4MPa corresponds to 10N, thereby precisely controlling the crimping force of the pressure rod.

[0066] S10.4: Positive correlation adjustment lever alternation time interval As the size of electronic components increases, the friction between them and the track surface also increases. At the same track driving speed, the time it takes for the components to move from the previous pressure bar to the next pressure bar is longer. Therefore, the system adjusts the time interval between the alternating pressure of the first and second pressure bars based on the size adjustment value K. Specifically, the larger the component, the larger and positive the absolute value of K, and the longer the time interval; conversely, the smaller the component, the larger and negative the absolute value of K, and the shorter the time interval. This ensures that the component's rotation rhythm matches its size.

[0067] The specific adjustment process is as follows: The system presets a reference time interval T_ref, such as 0.5s, which is based on the flow rate of the reference size device. That is, the time required for the device to move to the positioning position of the second pressure bar after the first pressure bar retracts. Set the time interval adjustment coefficient β, such as β = 0.3s, and calibrate according to the track drive speed and the friction coefficient of the device. Then, the formula for calculating the actual alternation time interval T is: T = T_ref + K × β; For example, for TO-126 type devices, K≈0.579, T=0.5+0.579×0.3≈0.67s, the interval is extended to ensure that the device has enough time to move to the second pressure bar positioning area, avoiding premature extension of the pressure bar that could cause mechanical collision; for SOT-23 type devices, K≈-0.684, T=0.5+(-0.684)×0.3≈0.30s, the interval is shortened to avoid excessive movement of the device beyond the positioning range, while also improving testing efficiency.

[0068] The time interval is adjusted by the system's timer: when the first or second lever sends a retraction completion signal, the timer starts counting. When the calculated T value is reached, an extension and pressing signal is immediately sent to the second lever or the next first lever, thus achieving precise control of alternating actions.

[0069] Through step S10, the crimping pressure and alternation time interval can be dynamically adapted according to the electronic device model. This solves the positioning stability problem of devices of different sizes, such as insufficient pressure for small-sized devices and overload pressure for large-sized devices. It also avoids jamming or collision caused by improper flow rhythm, further improving the compatibility of the test system with multiple device models and the stability of the test process.

[0070] S11: Test Track Anomaly Identification and Emergency Control During electronic device testing, if the test track issues a stop command due to a malfunction (such as a drive motor failure or sensor abnormality) or manual operation (such as pausing for maintenance), the electronic devices already on the track may lose drive and shift, affecting subsequent testing or causing device damage. Therefore, this embodiment adds anomaly identification and emergency control logic to the step of clamping the electronic devices. The specific steps are as follows: S11.1: Obtain and parse the test track stop command The system receives track status signals in real time through a communication interface (such as RS485 or Ethernet) with the test track control system. When a stop command is received, the system first parses the command type. Stop commands are divided into two categories: Normal stop command: such as the end stop command after the test task is completed. At this time, there are no electronic devices to be tested on the track, and only the track stop procedure needs to be executed. Stop feeding instruction: such as an emergency stop instruction triggered by track failure or manual maintenance. In this case, the instruction includes a stop feeding indicator, such as the instruction code "STOP-FEED", which means that the feeding of new components to the track must be stopped immediately, and there are still electronic components on the track that have not been tested.

[0071] The system uses flag bits in the command, such as the 5th binary number "1" to represent stopping material feeding and "0" to represent normal stopping, to accurately identify whether it is a stop material feeding command. If it is a normal stop command, the system will execute the normal shutdown procedure; otherwise, it will enter the anomaly monitoring stage.

[0072] S11.2: Abnormal State Judgment After recognizing a stop-feed command, the system continuously monitors the position trigger signal on the test track, generated by a photoelectric sensor on the side of the track, to indicate that the electronic device has reached a preset position. Under normal circumstances, after the stop-feed command is issued, the track should stop driving, and the electronic device should no longer move, thus no new position trigger signal will be generated. If, within 100ms after recognizing the stop-feed command, the system obtains a new position trigger signal based on the track speed (e.g., at a track speed of 10mm / s, the theoretical displacement of the device is 1mm within 100ms), then the test track is determined to be in an abnormal state. Possible causes include: the track drive not completely stopping (e.g., motor brake failure), electronic device slipping due to inertia, or sensor malfunction. In this case, emergency control must be initiated immediately.

[0073] S11.3: Emergency lever control In response to the abnormal state determined in S11.2, the system controls the first and second pressure rods in three selectable ways to ensure that the displacement of the electronic device on the track per unit time is less than a preset displacement, such as a preset displacement ≤ 0.5 mm / s, to prevent the device from deviating beyond the test station range. Single pressure bar holding fixed: If the electronic device is currently in the first pressure bar positioning area, such as the first or third station, the system sends a holding extension signal to the pneumatic actuator to control the first pressure bar to continuously press the electronic device until the abnormality is resolved; if the electronic device is currently in the second pressure bar positioning area, such as the second or fourth station, the system controls the second pressure bar to maintain the pressed state and restricts the movement of the device by mechanical clamping; High-frequency alternating clamping with dual clamping rods: If the electronic device is in the transition zone between the two clamping rods, the system controls the alternation time interval between the first and second clamping rods to be shortened to the preset minimum interval, such as 50ms, which is much smaller than the normal interval of 0.3-0.67s. The extension / retraction of the first or second clamping rod can provide audible and vibration alerts. High-frequency alternating clamping can control the instantaneous displacement of the electronic device within a very small range through short-term clamping and rapid switching, such as displacement ≤0.05mm within each clamping interval. At the same time, the audible and vibration alerts facilitate on-site personnel to quickly detect abnormalities. Hybrid control: If there are multiple electronic devices on the track, the system uses a single pressure bar to hold the device in the positioning area in place, and a double pressure bar to alternately press the device in the transition section at high frequency, based on the position trigger signal of each device, to ensure that all devices are in a controllable state.

[0074] S11.4: On-site alarm signal output Upon initiating the S11.3 emergency lever control, the system triggers the on-site alarm mechanism, specifically including: Visual alarm: The three-color alarm indicator light next to the test track switches to solid red and flashes at a frequency of 1Hz. At the same time, an abnormality pop-up window appears on the human-machine interface, displaying the abnormality type (such as "the track still moves after the material is stopped"), the time of the abnormality, and the identification of the electronic components involved (such as the QR code number). Audible alarm: In addition to the prompt sound of the pressure rod vibration, the on-site audible and visual alarm will emit a continuous high-decibel alarm sound, such as 80dB, at a frequency of 1kHz, until the abnormality is cleared. Remote notification: The system sends anomaly notifications to equipment administrators via SMS, WeChat, and other means, including the location of the anomaly and handling suggestions, such as "check the brake of the track drive motor", to ensure that the anomaly can be handled in a timely manner.

[0075] Through step S11, the system can quickly identify abnormal shutdown status of the test track, limit the displacement of electronic components through precise lever control, and effectively avoid component displacement, damage or test data failure caused by abnormalities, in conjunction with multi-dimensional alarm prompts.

[0076] S12: Redundancy Workstation Setup and Redundancy Testing Procedures Considering that the testing of electronic devices at the first, third, and fourth stations may be affected by factors such as contact stability and signal interference, leading to deviations in single test data, and that the second station is a high-voltage test (e.g., 5-20V), repeated high-voltage testing may increase the risk of device breakdown, this embodiment adds a redundant station after the fourth station to supplement and verify the test data from the non-high-voltage stations. The specific steps are as follows: S12.1: Hardware Configuration of Redundant Workstations and Adapter Ports Downstream of the fourth station of the electrical testing components, along the flow direction of the test track, there is a redundant station. The structure of this station is the same as other non-high-voltage stations, equipped with liftable test probes, positioning brackets and data acquisition modules. The key difference is the addition of an adapter port. The adapter port is a multi-channel electrical interface, such as a 16-pin industrial connector. It establishes electrical connections with the test ports of the first station (low-voltage test), the third station (current test), and the fourth station (signal test) through shielded cables. Each connection line is connected in series with an independent electromagnetic relay for controlling the on / off state of the line and a surge protector to prevent interference with the test signal.

[0077] The test port for the high-voltage test at the second station is not connected to the adapter port for the following reasons: First, high-voltage testing has a potential impact on the insulation performance of the device, and repeated testing may damage the insulation layer of the device, increasing the false positive rate of defective products; second, high-voltage testing requires a dedicated high-voltage protection module, and if connected to the redundant station, the test voltage may be unstable due to changes in line impedance, which may affect the accuracy of the data; third, from a safety perspective, the redundant station is close to the feed rail end, where personnel operate frequently, and avoiding high-voltage lines can reduce the risk of electric shock.

[0078] S12.2: Obtaining Redundancy Test Commands The system obtains redundant test instructions for the first, third, and fourth workstations in two ways to ensure the retesting is targeted and flexible: Automatic trigger command: After generating the preliminary electrical test report, the system performs deviation analysis on the data of each station based on the first to fourth data of S2-S5; if the deviation of the test data of a certain station from the standard value is within the critical range, such as the deviation value being 80%-100% of the standard fluctuation range, such as the standard current range being 10±2mA and the critical range being 11.6-12mA or 8-8.4mA, then the system automatically generates a redundant test command for that station, for example, performing a redundant current test on the device numbered T20250601 at the third station; Manual trigger command: On-site operators can manually select the electronic device number to be tested and the target workstation through the redundancy test function of the human-machine interface. Only the first, third and fourth workstations can be selected. After receiving the operation command, the system generates the corresponding redundancy test task. For example, the redundancy test of the device with the number T20250602 is performed on the first and fourth workstations.

[0079] Regardless of the method used to obtain the instruction, the system will store the instruction information, including the device number, target workstation, and instruction trigger time, in the database for easy traceability later.

[0080] S12.3: Redundancy Test Execution and Fifth Data Generation When electronic components are transferred to the redundant workstation along the test track, the system performs redundancy testing according to the following procedure: Port continuity control: According to the target station in the redundant test instruction, the system sends a control signal to the electromagnetic relay corresponding to the transfer port; if the target is the first station, the line between the transfer port and the test port of the first station is connected; if the target is the third or fourth station, the line between the transfer port and the test port of the third or fourth station is connected accordingly, ensuring that the test probe of the redundant station is connected to the test circuit of the target station through the transfer port. After the line is connected, the system verifies the line impedance through the voltage detection module. If the impedance is ≤5Ω, it is normal, avoiding poor contact that may lead to test failure. Repeated test operation: After the circuit is successfully connected, the test probes of the redundant station rise and contact the pins of the electronic components, and the test is repeated according to the test procedure of the target station; for example, for the redundancy test of the first station, the same first voltage as in step S2 is applied, and the redundancy test data is collected and output; for the redundancy test of the third station, the same first current as in step S4 is applied, and the corresponding current parameters are collected; during the test, the sampling frequency of the data acquisition module is kept consistent with that of the original station, such as 1kHz, to ensure data comparability; Fifth data generation: After the redundancy test is completed, the system will mark the collected redundant data as the fifth data and store it in association with the test data of the original station. For example, the original data of the third station of device number T20250601 is 11.8mA, and the fifth data is 11.7mA.

[0081] S12.4: Fifth data incorporated into the electrical test report The system adds a section on redundant test results to the final electrical test report, which includes the following content: Redundancy test triggering reasons (automatic critical deviation triggering / manual triggering); Target workstation, redundancy test time, and specific values ​​for the fifth data point; The deviation of the fifth data point from the original workstation data is compared. For example, the original data of the third workstation is 11.8mA, and the fifth data point is 11.7mA, with a deviation of 0.1mA, which is less than the allowable deviation of 0.2mA. The final judgment result is as follows: if the deviation between the fifth data and the original data is within the allowable range, such as ≤10% of the standard fluctuation range, then the original data shall be used as the judgment basis; if the deviation exceeds the allowable range, then a redundant test shall be performed again, and the average of the two fifth data shall be used as the final basis to ensure the accuracy of the test results.

[0082] Through step S12, redundant workstations can perform supplementary tests on non-high-voltage workstations that have the risk of data deviation. The generated fifth data can effectively verify the reliability of the original test data, while avoiding the safety and device damage risks caused by repeated high-voltage testing, and further improving the rigor of the electrical test report.

[0083] S12.2.1: Method for determining the workstation corresponding to the redundancy test command Based on the redundant test instructions obtained in S12.2, the system determines the target workstation corresponding to the instructions in two specific ways: the first, third, or fourth workstation, to balance test coverage and risk targeting. The specific steps are as follows: S12.2.1.1: Workstations are randomly assigned. When the system is in batch routine testing mode, such as large-scale testing of electronic devices of the same model and batch, a random workstation assignment strategy is adopted to ensure that redundant testing can evenly cover all non-high voltage workstations, avoiding risk omissions caused by supplementary testing at fixed workstations. The specific implementation logic is as follows: Random algorithm configuration: The system has a built-in pseudo-random number generation algorithm, such as the Mason swirl algorithm, and maps the first, third, and fourth workstations to the numbers "1", "3", and "4" respectively, as the target values ​​for random selection; to ensure uniform randomness, the algorithm seed value is associated with the unique identifier of the electronic device in real time, such as the last 6 digits of the QR code number, to avoid the occurrence of a fixed sequence; Station selection and execution: After the electronic device completes the fourth station test, the system calls the random number generation algorithm to randomly select one number from "1", "3", and "4". The station corresponding to this number is the target station of the redundancy test instruction. For example, if the number "3" is selected, the instruction "Execute the third station (current test) redundancy test on the current device" will be generated. Sampling result verification: To avoid uneven coverage caused by repeatedly sampling the same workstation, the system sets a continuous repetition limit; if the same workstation is sampled 3 times in a row, such as sampling "1" in a row, the workstation will be automatically excluded in the next sampling, and a random sample will be drawn from the remaining two workstations to ensure that the deviation of the proportion of redundant test times for each workstation in batch testing does not exceed 5%; Instruction generation and storage: After determining the target workstation, the system generates redundant test instructions containing the device number, target workstation, and random sampling basis (algorithm seed value), and stores them in the task queue, waiting for the device to be transferred to the redundant workstation before execution.

[0084] S12.2.1.2: Determining workstations based on adjustment values When the system is in precise risk control mode, such as when testing batches with large fluctuations in test data or testing new model trial production devices, a strategy based on adjustment value screening is adopted to prioritize redundant testing of the workstations with the highest potential risk. The specific implementation logic is as follows: Fourth adjustment value calculation: First, the system calculates the fourth adjustment value based on the fourth data output from step S5 and the preset fourth standard data. The fourth data is signal test data, such as signal response time and frequency attenuation rate. The preset fourth standard data is such as standard response time range of 100-200μs and maximum allowable frequency attenuation rate of 10%. The fourth adjustment value Δ4 is ​​calculated using the formula: Fourth adjustment value Δ4 = |(Measured value of fourth data - Median value of fourth standard data) / Fluctuation amplitude of fourth standard data|. For example, if the measured value of the fourth data is 220μs, the median value of the standard is 150μs, and the fluctuation amplitude is 50μs (150±50μs), then Δ4 = |(220-150) / 50| = 1.4. Adjustment value summarization and filtering: The system retrieves the first adjustment value Δ1 (low-voltage test adjustment value) calculated in step S2 and the third adjustment value Δ3 (current test adjustment value) calculated in step S4 from the database, and summarizes them with Δ4 calculated in this step to form the adjustment value set {Δ1, Δ3, Δ4}; then, it filters out the adjustment value with the smallest value in the set; here, the smallest adjustment value represents the smallest deviation between the test data of this station and the standard value, which seems to be highly stable, but there may be random errors caused by the data being too close to the standard value, such as the test probe making a momentary poor contact, which may cause the data to be misjudged as qualified. Therefore, it is necessary to verify its authenticity through redundant testing; Target workstation matching: Match the target workstation according to the type corresponding to the minimum adjustment value; if the minimum adjustment value is Δ1, the target workstation is the first workstation; if it is Δ3, the target workstation is the third workstation; if it is Δ4, the target workstation is the fourth workstation; for example, if the set of adjustment values ​​is {0.3, 0.8, 1.4}, and the minimum adjustment value is Δ1 = 0.3, then the target workstation is the first workstation; Command Triggering and Association: The system generates redundant test commands containing the device number, target station, and adjustment value selection criteria (specific values ​​of Δ1 / Δ3 / Δ4), and associates them with the device's position signal. When the system detects that the device has arrived at the redundant station through the track sensor, it immediately triggers the command execution to ensure timely supplementary testing. At the same time, the selection process and results are stored in the database for subsequent analysis of the test stability of each station.

[0085] With the two workstation determination methods in S12.2.1, the system can flexibly select redundancy strategies according to the test scenario: random assignment can ensure uniform coverage of batch tests and improve overall test stability; filtering based on adjustment values ​​can accurately locate potential risk workstations and reduce misjudgments caused by accidental errors.

[0086] This application also discloses an electronic device electrical testing system based on track flow, including a processor, wherein the processor executes the steps of the electronic device electrical testing method based on track flow as described in any of the above embodiments.

[0087] This application also discloses a storage medium storing a program that, when executed by a processor, implements the steps of the above-described method for electrical testing of electronic devices based on orbital flow.

[0088] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A method for electrical testing of electronic devices based on orbital flow, characterized in that, Includes the following steps: The position trigger signal of the electronic device on the test track and the test parameters corresponding to the electronic device are obtained. The test parameters include a first voltage, a second voltage, a first current and a first signal. In response to a position trigger signal, the first pressure bar on one side of the test track is controlled to press the electronic device; the electrical test assembly is controlled to apply a first voltage at the first station, and after outputting first data, the electronic device is released; a first adjustment value is calculated based on the first data and a preset first standard data, and a second voltage is adjusted in a positive correlation with the first adjustment value; The second pressure bar on the other side of the control test track presses the electronic device; the electrical test assembly is driven to apply a second voltage at the second station, wherein the first voltage is lower than the second voltage; the electronic device is released after the second data is output; a second adjustment value is calculated based on the second data and the preset second standard data, and the first current is adjusted in a positive correlation with the second adjustment value; The first pressure bar under the control test track presses the electronic device; the electrical test assembly is driven to apply the first current at the third station to perform current testing, and the electronic device is released after the third data is output; the third adjustment value is calculated based on the third data and the preset third standard data, and the signal frequency of the first signal is adjusted according to the positive correlation of the third adjustment value; The control test track is followed by a second pressure bar that presses down on the electronic device; the control electrical test assembly is then positioned at the fourth station to apply a first signal for signal testing, and after outputting the fourth data, the electronic device is released. An electrical test report is generated based on the first, second, third, and fourth data.

2. The method for electrical testing of electronic devices based on track flow according to claim 1, characterized in that, Following the signal testing steps, the following steps are also included: Based on the image detection component, the package and pin parts of electronic devices are detected, and the corresponding package data and pin data are generated. If the encapsulation data is outside the preset encapsulation standard range, an encapsulation image warning will be issued. Otherwise, determine whether the pin data is outside the preset pin standard range; If the pin data is outside the preset pin standard range, a pin image warning is issued; otherwise, a fourth adjustment value is calculated based on the fourth data and the preset fourth standard data, and a signal adjustment value is calculated by weighting the third and fourth adjustment values. The clamping pressure of the electronic device pin is then adjusted according to the positive correlation of the signal adjustment value.

3. The method for electrical testing of electronic devices based on orbital flow according to claim 1 or 2, characterized in that, The process of pressing electronic components also includes the following sub-steps: The electrical testing assembly clamps the pins of the electronic device at the first station for a first duration, clamps the pins of the electronic device at the second station for a second duration, clamps the pins of the electronic device at the third station for a third duration, and clamps the pins of the electronic device at the fourth station for a fourth duration. The voltage regulation value is calculated by weighting the first and second regulation values, and the third duration is adjusted based on the negative correlation of the voltage regulation value. The fourth duration is adjusted based on the negative correlation of the third adjustment value.

4. The method for electrical testing of electronic devices based on track flow according to claim 3, characterized in that, The first and second pressure rods are grouped together and staggered on both sides of the test track. The first and second pressure rods are fixedly connected to the same actuator. The first and second pressure rods remain relatively stationary and move simultaneously. The number of first pressure rods is greater than the number of workstations in the electrical test assembly. The coverage areas of the first and second pressure rods on the test track both surround the coverage area of ​​the electrical test assembly on the test track. When the first pressure bar is inserted into the test track, the electronic device is fixed. When the first pressure bar is removed from the test track, the electronic device moves to the next station and corresponds to the second pressure bar. When the second pressure bar is inserted into the test track, the electronic device is fixed. When the second pressure bar is removed from the test track, the electronic device moves to the next station and corresponds to the next first pressure bar. The first pressure bar and the second pressure bar are not inserted into the test track at the same time.

5. The method for electrical testing of electronic devices based on track flow according to claim 4, characterized in that, The process of pressing electronic components also includes the following sub-steps: Obtain dimensional data based on the model number of the electronic component; The size adjustment value is calculated based on the size data and the preset reference data; the pressing pressure of the first and second pressure rods on the electronic components is adjusted according to the positive correlation of the size adjustment value. The time interval between the first and second pressure rods alternately pressing the electronic device is adjusted according to the negative correlation of the size adjustment value.

6. The method for electrical testing of electronic devices based on track flow according to claim 5, characterized in that, The process of pressing electronic components also includes the following sub-steps: Based on the acquired test track stop command, identify the stop feeding command from the test track stop command; If a stop feeding command is detected and a new position trigger signal is obtained, an abnormality is indicated on the test track. The control is adjusted so that the time interval between the first and second pressure rods is less than the preset minimum interval, so that the displacement of the electronic device on the test track per unit time is less than the preset set displacement, and an on-site alarm signal is issued.

7. The method for electrical testing of electronic devices based on orbital flow according to claim 1 or 2, characterized in that, The method also includes the following steps: The electrical testing assembly has a redundant station after the fourth station, and the redundant station is equipped with a transfer port; the transfer port is electrically connected to the test ports on the first, third and fourth stations. Obtain the test command corresponding to the first, third, or fourth workstation, connect the test port to the test port on the workstation corresponding to the test command, perform redundancy testing, and generate the fifth data. Add the fifth data point to the electrical test report.

8. The method for electrical testing of electronic devices based on track flow according to claim 7, characterized in that, The step of obtaining the test instruction corresponding to the first, third, or fourth station also includes the following sub-steps: The workstation corresponding to the test instruction is randomly assigned; Alternatively, the fourth adjustment value can be calculated in real time based on the fourth data and the preset fourth standard data. The minimum value among the first adjustment value, the third adjustment value and the fourth adjustment value can be selected, and the workstation corresponding to the minimum value can be matched. When the electronic device corresponding to the minimum value arrives at the redundant workstation, a matching test instruction can be generated according to the corresponding workstation.

9. An electrical testing system for electronic devices based on track flow, characterized in that, Includes a processor, wherein the steps of the method for electrical testing of electronic devices based on orbital flow as described in any one of claims 1-8 are executed.

10. A storage medium, characterized in that, The storage medium stores a program that, when executed by a processor, implements the steps of the electronic device electrical testing method based on orbital flow as described in any one of claims 1-8.

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