A high-voltage control unit box and a manufacturing method thereof

Abstract

The application discloses a high-voltage control unit box and a manufacturing method thereof, and relates to the technical field of control boxes. The high-voltage control unit box comprises a shell assembly, an external copper bar, an electronic assembly and a circuit board. The shell assembly comprises an upper cover assembly, a middle shell and a lower shell assembly. The lower shell assembly comprises a lower shell and an internal copper bar integrally injection molded in the lower shell. One end of the external copper bar is connected with the internal copper bar, and the other end is positioned on the middle shell. The external copper bar is welded with the internal copper bar to form a first welding point. The electronic assembly at least comprises a relay, a fuse and a shunt. The relay is welded with the internal copper bar to form a second welding point. The circuit board is assembled with a nickel sheet. The nickel sheet is used to connect the circuit board and the internal copper bar. The nickel sheet is welded with the internal copper bar to form a third welding point. The first welding point, the second welding point and the third welding point are coplanar. The high-voltage control unit box can realize screwless and wireless harness, and has simple structure and convenient assembly.

Description

Technical Field

[0001] This invention relates to the field of control box technology, and specifically to a high-voltage control unit box and its manufacturing method. Background Technology

[0002] The high-voltage control unit box, also known as the high-voltage power distribution unit or power distribution unit, is the core high-voltage power distribution device for new energy electric vehicles. It is mainly used in electric passenger vehicles, light buses, commercial vehicles and other fields.

[0003] Currently, high-voltage control unit boxes use screws to connect relays to copper busbars, fuses to copper busbars, and shunts to copper busbars to ensure smooth circuit connections. The wiring harness assembly controls the on / off switching of relays, collects high-voltage sampling information, shunt monitoring information, and ensures the electrical connection of the pre-charge circuit. Screw connections occupy a large space, hindering the miniaturization design of the high-voltage control unit box; the wiring harness assembly is complex, increasing assembly steps, and the wiring harness is prone to wear, short circuits, and other faults, reducing product reliability.

[0004] Therefore, current high-voltage control unit boxes suffer from technical problems such as complex structure, large space occupation, and low assembly efficiency. Summary of the Invention

[0005] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose a high-voltage control unit box and its manufacturing method, thereby solving the technical problems of complex structure, large space occupation, and low assembly efficiency of the high-voltage control unit box in the prior art.

[0006] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides a high-voltage control unit box, which includes a housing assembly, an external copper busbar, electronic components, and a circuit board. The housing assembly includes an upper cover assembly and a lower housing assembly that overlap each other, and a middle housing located between the upper cover assembly and the lower housing assembly and positioned on the lower housing assembly. The lower housing assembly includes a lower housing and an internal copper busbar integrally injection molded within the lower housing. The lower housing has multiple pre-set slots, and the internal copper busbar located below the slots is exposed at the bottom of the slots. One end of the external copper busbar is connected to the internal copper busbar, and the other end is positioned on the middle housing. The external copper busbar is welded to the internal copper busbar to form a first welding point. The electronic components include at least a relay, a fuse, and a shunt, wherein the relay is welded to the internal copper busbar to form a second welding point. A nickel sheet is assembled on the circuit board to connect the circuit board and the internal copper busbar, and the nickel sheet is welded to the internal copper busbar to form a third welding point. The first welding point, the second welding point, and the third welding point are coplanar.

[0008] In some embodiments, the fuse is welded to the internal copper busbar to form a fourth welding point; the shunt is welded to the internal copper busbar to form a fifth welding point, and the fourth welding point, the fifth welding point, and the third welding point are coplanar.

[0009] In some embodiments, the outer copper busbar and the inner copper busbar are laser-welded together, and there are multiple first welding points, which are collinear.

[0010] In some embodiments, the relay and the internal copper busbar are laser-welded together, and there are multiple second welding points, which are collinear.

[0011] In some embodiments, the nickel sheet and the internal copper busbar are laser-bonded together, and there are multiple third welding points, which are collinear.

[0012] In some embodiments, the middle shell is fastened to the lower shell and cooperates with the slot to form a receiving cavity. The electronic components are received and fixed in the receiving cavity. Fixing adhesive is provided between the electronic components and between the electronic components and the lower shell to limit the horizontal movement of the electronic components.

[0013] There are multiple external copper busbars and relays. There are fixing adhesive points between the external copper busbars and the lower housing, and there are fixing adhesive points between the relays and between the relays and the lower housing.

[0014] In some embodiments, the housing assembly further includes an insulating film and a thermal pad, the insulating film being located between the thermal pad and the lower housing, and the thermal pad being used for heat dissipation of the internal copper busbar.

[0015] Secondly, the present invention also provides a method for manufacturing a high-voltage control unit box, applicable to the manufacturing of the aforementioned high-voltage control unit box. The method includes: sequentially inserting electronic components into slots in an integrally injection-molded lower shell; applying adhesive to fix the electronic components between themselves and between themselves and the lower shell; fastening a middle shell onto the lower shell and fixing the electronic components within the slots of the lower shell; connecting one end of an external copper busbar to an internal copper busbar and positioning the other end on the middle shell; welding the external copper busbar to the internal copper busbar located at the bottom of the slot; sequentially welding the electronic components to the internal copper busbar located at the bottom of the slot; welding the nickel sheet of the circuit board to the internal copper busbar located at the bottom of the slot; and finally connecting the upper cover assembly to the lower shell assembly.

[0016] In some embodiments, welding the external copper busbar to the internal copper busbar located at the bottom of the slot includes: sequentially laser welding multiple external copper busbars to multiple internal copper busbars along a straight line; sequentially welding electronic components to the internal copper busbar located at the bottom of the slot includes: sequentially laser welding multiple relays to multiple internal copper busbars along a straight line; welding the nickel sheet of the circuit board to the internal copper busbar located at the bottom of the slot includes: sequentially laser welding multiple nickel sheets to multiple internal copper busbars along a straight line.

[0017] In some embodiments, sequentially laser-welding multiple external copper busbars and multiple internal copper busbars along a straight direction includes: connecting the external copper busbars and internal copper busbars using a laser splicing seam welding method, with the laser welding temperature between 190℃ and 210℃; sequentially laser-welding multiple relays and multiple internal copper busbars along a straight direction includes: connecting the relays and internal copper busbars using a laser splicing seam welding method, with the laser welding temperature between 140℃ and 160℃; sequentially laser-welding multiple nickel sheets and multiple internal copper busbars along a straight direction includes: connecting the nickel sheets of the circuit board and the internal copper busbars using a laser overlay welding method, with the laser welding temperature between 90℃ and 110℃.

[0018] Compared with existing technologies, the high-voltage control unit box provided by this invention improves structural compactness and integration through an integrated design of the lower shell and internal copper busbars by integral injection molding. The external copper busbars, relays, and internal copper busbars are welded together to eliminate screws, reducing parts and assembly processes, eliminating screw loosening and space occupation issues, and ensuring long-term stability and conductivity reliability of circuit connections. For wiring connections, nickel-plated welding replaces traditional wire harness assemblies, achieving internal wire-free wiring. The nickel-plated welding directly connects the circuit board and the internal copper busbars to transmit signals, reducing wire harness failures, improving transmission efficiency and product reliability, and simplifying the internal structure. Furthermore, the internal copper busbars adopt a coplanar welding design, which reduces the movement path of laser welding equipment during the welding process, improving welding efficiency, and thus improving the assembly efficiency of the high-voltage control unit box. Attached Figure Description

[0019] Figure 1 This is an exploded structural diagram of a high-voltage control unit box provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a high-voltage control unit box provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a lower shell assembly provided in an embodiment of the present invention; Figure 4 This is a bottom view of a high-voltage control unit box provided in an embodiment of the present invention; Figure 5 yes Figure 4 Enlarged view of part A in the middle; Figure 6 This is a schematic diagram of the structure of the relay installed in the lower housing assembly provided in an embodiment of the present invention; Figure 7 yes Figure 6 Enlarged view of part B in the middle section; Figure 8 This is the process flow of the high-voltage control unit box manufacturing method provided in the embodiments of the present invention. Figure 1 ; Figure 9This is the process flow of the high-voltage control unit box manufacturing method provided in the embodiments of the present invention. Figure 2 .

[0020] Explanation of reference numerals in the attached figures: 100. High-voltage control unit box; 110. Housing assembly; 111. Top cover; 112. Top protective cover; 113. Side protective cover; 114. Bottom shell; 1141. Slot; 115. Internal copper busbar; 116. Middle shell; 117. Insulating film; 118. Thermal pad; 119. Adhesive dispensing; 120. Electronic component; 121. External copper busbar; 1211. First solder joint; 122. Relay; 1221. Second solder joint; 123. Fuse; 1231. Fourth solder joint; 124. Shunt; 1241. Fifth solder joint; 130. Circuit board; 131. Nickel sheet; 1311. Third solder joint; 132. Pre-charged PCBA; 140. Pre-charged high-voltage components; 200. Manufacturing method. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0022] Currently, the circuit connections in high-voltage control unit boxes mainly rely on screw fastening, specifically the electrical connections between relays and copper busbars, fuses and copper busbars, and shunts and copper busbars are all achieved by screw tightening. Simultaneously, circuit signal transmission relies on wiring harness assemblies to perform functions such as relay on / off control, high-voltage sampling information collection, and shunt monitoring information transmission. Therefore, current high-voltage control unit boxes suffer from technical problems such as complex structure, large space occupation, and low assembly efficiency.

[0023] To address the technical problems of high-voltage control unit boxes, such as complex structure, large space occupation, and low assembly efficiency, this invention provides a high-voltage control unit box that can achieve screwless and wireless design, and has a simple structure and is easy to assemble.

[0024] It should be noted that the high-voltage control unit box provided by this invention is used in, but not limited to, new energy vehicles. For ease of explanation, this invention will only use the application of the high-voltage control unit box in new energy vehicles as an example. The principle of the high-voltage control unit box in other types of equipment is essentially the same as that in new energy vehicles, and will not be described in detail here.

[0025] This invention provides a high-voltage control unit box 100, such as... Figures 1 to 4 As shown, the high-voltage control unit box 100 includes a housing assembly 110, an external copper busbar 121, electronic components 120, and a circuit board 130. The housing assembly 110 includes an upper cover assembly and a lower housing assembly that fit together, and a middle housing 116 located between the upper cover assembly and the lower housing assembly and positioned on the lower housing assembly. The lower housing assembly includes a lower housing 114 and an internal copper busbar 115 integrally injection molded within the lower housing 114. The lower housing 114 has multiple slots 1141 pre-set, and the internal copper busbar 115 located below the slots 1141 is exposed at the bottom of the slots 1141. One end of the external copper busbar 121 is connected to the internal copper busbar 115, and the other end... Positioned on the middle shell 116; the outer copper busbar 121 is welded to the inner copper busbar 115 to form a first welding point 1211; the electronic component 120 includes at least a relay 122, a fuse 123 and a shunt 124, wherein the relay 122 is welded to the inner copper busbar 115 to form a second welding point 1221; a nickel sheet 131 is assembled on the circuit board 130, the nickel sheet 131 is used to connect the circuit board 130 and the inner copper busbar 115, and the nickel sheet 131 is welded to the inner copper busbar 115 to form a third welding point 1311; wherein the first welding point 1211, the second welding point 1221 and the third welding point 1311 are coplanar.

[0026] The housing assembly 110 is the outer shell structure of the high-voltage control unit box 100, specifically including the upper cover assembly, the middle shell and the lower shell assembly. The connection method of the upper cover assembly, the middle shell and the lower shell assembly is not limited. For example, the upper cover assembly and the middle shell are connected by a snap-fit ​​method, and the middle shell 116 is fastened to the lower shell 114.

[0027] The upper cover assembly includes an upper cover 111 and an upper protective cover 112, exemplarily, such as Figure 1 and Figure 2 As shown, the high-voltage control unit box 100 includes a pre-charge high-voltage assembly 140, which is located between the middle shell 116 and the upper cover 111. The upper cover 111 is snapped into the middle shell 116. The upper protective cover 112 is used to protect the fuse 123 and the shunt 124. For example, the upper protective cover 112 is also provided with a product label and a warning label.

[0028] The lower housing assembly includes a lower housing 114 and an internal copper busbar 115, such as Figure 3 As shown, the internal copper busbar 115 is embedded in the lower housing 114 during injection molding of the lower housing assembly. The lower housing 114 has corresponding slots according to the structural shape of the external copper busbar 121, relay 122, fuse 123, shunt 124, and circuit board 130. The bottom of the slots is where the internal copper busbar 115 is embedded, and the internal copper busbar 115 is exposed at the bottom of the slot 1141. It should be noted that the difference between the internal copper busbar 115 and the external copper busbar 121 is that the internal copper busbar 115 is embedded during the injection molding process, and the external copper busbar 121 is connected after the injection molding is completed.

[0029] One end of the outer copper busbar 121 is connected to the inner copper busbar 115, and the other end of the outer copper busbar 121 has a bent structure, which is used to position it on the middle shell 116. The other end of the outer copper busbar 121 is provided with a connection hole for connection with the outside. The number of outer copper busbars 121 can be determined according to requirements. Each outer copper busbar 121 is welded to the inner copper busbar 115 to form a welding point, namely the first welding point 1211.

[0030] Electronic components 120 include, but are not limited to, relays 122, fuses 123, and shunts 124. The number of relays 122 can be determined according to requirements. The lower housing 114 is pre-set with slots 1141 for accommodating relays 122, fuses 123, and shunts 124. For example, the lower housing 114 is provided with slots for accommodating relays 122. The contacts of relays 122 are welded to internal copper busbars 115. Each contact of relays 122 is welded to the internal copper busbars 115 to form a welding point, i.e., a second welding point 1221.

[0031] Circuit board 130, or PCBA (Printed Circuit Board Assembly), is an abbreviation for the printed circuit board assembly process. It refers to the process of assembling components on a bare PCB using surface mount technology (SMT) or dual in-line package (DIP) technology. Nickel strips 131 are assembled on circuit board 130. These nickel strips 131 are soldered to internal copper busbars 115. Each nickel strip 131 soldered to an internal copper busbar 115 forms a solder joint, i.e., the third solder joint 1311.

[0032] For example, such as Figure 1 As shown, the circuit board 130 also includes a pre-charge PCBA 132. The pre-charge PCBA integrates components such as a pre-charge resistor, a pre-charge relay, a sampling resistor, a driver chip, and protection devices. Its core function is to achieve soft-start pre-charge of the high-voltage circuit and avoid surge current damage caused by high-voltage electricity directly impacting capacitor-type high-voltage loads.

[0033] For example, such as Figure 1 As shown, the housing assembly 110 also includes a side cover 113, which can be understood as the side wall of the housing assembly 110. The side cover 113 is used to separate the circuit board 130 from the outside to protect the circuit board 130.

[0034] It should be noted that the multiple first welding points 1211 formed by welding each external copper busbar 121 to the internal copper busbar 115, the multiple second welding points 1221 formed by welding each relay 122 contact to the internal copper busbar 115, and the multiple third welding points 1311 formed by welding each nickel sheet 131 to the internal copper busbar 115 are all in the same plane, that is, the welding points are all located on the surface of the internal copper busbar 115 on the side facing away from the slot 1141.

[0035] In this embodiment, the integrated design of the lower shell 114 and the internal copper busbar 115 through integral injection molding improves the structural compactness and integration. The external copper busbar 121, relay 122, and internal copper busbar 115 are welded together to eliminate screws, reduce parts and assembly processes, eliminate screw loosening and space occupation problems, and ensure the long-term stability and conductivity reliability of the circuit connection. In terms of wiring connections, nickel sheets 131 are welded to replace the traditional wire harness assembly, realizing internal wireless wiring. The nickel sheets 131 are directly connected to the circuit board 130 and the internal copper busbar 115 to transmit signals, reducing wire harness failures, improving transmission efficiency and product reliability, and simplifying the internal structure. Furthermore, the internal copper busbar 115 adopts a coplanar welding design, which can reduce the movement path of the laser welding equipment during the welding process, improve welding efficiency, and thus improve the assembly efficiency of the high-voltage control unit box.

[0036] In some embodiments, such as Figure 1 and Figure 4 As shown, the fuse 123 is welded to the internal copper busbar 115 to form the fourth welding point 1231; the shunt 124 is welded to the internal copper busbar 115 to form the fifth welding point 1241, and the fourth welding point 1231, the fifth welding point 1241 and the third welding point 1311 are coplanar.

[0037] In this embodiment, the lower shell 114 is provided with a slot for accommodating the fuse 123. The fuse 123 is welded to the internal copper busbar 115 to form a welding point, namely the fourth welding point 1231. The lower shell 114 is provided with a slot for accommodating the shunt 124. The shunt 124 is welded to the internal copper busbar 115 to form a welding point, namely the fifth welding point 1241. By designing the first welding point 1211, the second welding point 1221, the third welding point 1311, the fourth welding point 1231, and the fifth welding point 1241 to be coplanar, the movement path of the laser welding equipment during the welding process can be further reduced, enabling the laser welding equipment to weld components on the same side of the internal copper busbar 115, greatly improving the welding efficiency.

[0038] In some embodiments, such as Figure 4 and Figure 5 As shown, the outer copper busbar 121 and the inner copper busbar 115 are laser-welded together, and there are multiple first welding points 1211, which are collinear.

[0039] In this embodiment, laser welding is used to connect the outer copper busbar 121 and the inner copper busbar 115. This process results in high welding strength, a small heat-affected zone, and avoids deformation of the copper busbar, ensuring the stability of its conductivity. Furthermore, multiple first welding points 1211 are arranged collinearly, allowing automated laser welding equipment to complete the welding of multiple sets of outer copper busbars 121 in one go along a straight trajectory. This significantly improves welding efficiency, ensures consistency in welding positions, reduces product defect rates, and the collinear welding design also simplifies the connection layout of the outer copper busbars 121.

[0040] In some embodiments, such as Figure 4 and Figure 5 As shown, the relay 122 and the internal copper busbar 115 are laser-welded together, and there are multiple second welding points 1221, which are collinear.

[0041] In this embodiment, laser welding replaces the traditional screw connection of the relay 122, eliminating the problem of poor contact caused by loose screws at the relay 122 contacts and improving the reliability of the control circuit. Furthermore, multiple second welding points 1221 are arranged collinearly, allowing multiple sets of relays 122 to be welded quickly along a straight trajectory using automated laser welding equipment, improving production efficiency, ensuring the consistency of the relay 122 installation position, reducing the product defect rate, and facilitating subsequent debugging and maintenance.

[0042] In some embodiments, such as Figure 4 and Figure 5 As shown, the nickel sheet 131 and the internal copper busbar 115 are laser-welded together, and there are multiple third welding points 1311, which are collinear.

[0043] In this embodiment, the laser cladding process can improve the connection strength and conductivity between the nickel sheet 131 and the internal copper busbar 115, avoid the problem of excessive contact resistance during signal transmission, and ensure the accurate transmission of low-voltage control signals and high-voltage sampling signals. Furthermore, multiple third welding points 1311 are arranged collinearly, and multiple third welding points 1311 can be quickly welded at one time along a straight trajectory by an automated laser welding device, which greatly improves welding efficiency and ensures the consistency of signal transmission paths, thereby improving the accuracy of signal acquisition and control.

[0044] In some embodiments, such as Figure 1 , Figure 6 and Figure 7 As shown, the middle shell 116 is fastened to the lower shell 114 and cooperates with the slot 1141 to form a receiving cavity. The electronic component 120 is received and fixed in the receiving cavity. Fixing adhesive 119 is provided between the electronic components 120 and between the electronic components 120 and the lower shell 114 to limit the horizontal movement of the electronic components 120.

[0045] In this embodiment, the electronic component 120 is fixed by the cooperation design of the middle shell 116 and the lower shell 114, which avoids the use of screws for fixing, saves internal space, and adopts a snap-fit ​​connection method that is simple and convenient to operate. At the same time, fixing adhesive 119 is provided between the electronic components 120 and between the electronic components 120 and the lower shell 114, thereby improving the stability of the electronic component 120 installation. For example, adhesive is applied to fix adjacent relays 122 and between the relays 122 and the lower shell 114. The location of the adhesive 119 can be determined according to requirements. For example, a dedicated adhesive mounting position is provided in the middle or upper part of the slot 1141 of the lower shell 114, and adhesive 119 is applied to this mounting position. The use of adhesive dispensing 119 for fixing can further improve the installation stability of electronic components 120 and enhance reliability. Moreover, this process is simple to operate, low in cost, does not interfere with the subsequent soldering process, and facilitates the disassembly and maintenance of components, thus balancing installation convenience and structural stability.

[0046] In some embodiments, such as Figure 1 and Figure 2 As shown, the housing assembly 110 also includes an insulating film 117 and a thermal pad 118. The insulating film 117 is located between the thermal pad 118 and the lower housing 114, and the thermal pad 118 is used for heat dissipation of the internal copper busbar 115.

[0047] In this embodiment, the insulating film 117 is disposed between the thermal pad 118 and the internal copper busbar 115 of the lower shell 114, achieving electrical isolation between the two, effectively preventing leakage and short circuits, and improving the electrical safety performance of the product; any insulating film that can achieve insulation is acceptable, such as polyester film, polyvinyl chloride film, etc. The thermal pad 118 can quickly dissipate the working heat of the internal copper busbar 115, reduce the working temperature of the copper busbar, prevent its performance degradation due to overheating, and ensure the long-term stable operation of the high-voltage control unit box; the thermal pad 118 is, for example, a silicone-based thermal pad. Through the layered design of the insulating film 117 and the thermal pad 118, the structure is reasonably arranged while taking into account both the product's electrical safety and efficient heat dissipation requirements, without occupying additional internal space, and adapting to the product's miniaturization design requirements.

[0048] This invention also provides a method 200 for manufacturing a high-voltage control unit box, such as... Figure 8 As shown, the manufacturing method 200 is applied to the manufacturing of the aforementioned high-voltage control unit box 100, and the manufacturing method 200 includes: Step S210: The electronic components are sequentially installed into the slots of the one-piece injection-molded lower shell.

[0049] Step S220: Apply adhesive to fix the electronic components between each other and between the electronic components and the lower shell.

[0050] Specifically, the relay 122, fuse 123, and shunt 124 are sequentially installed into the slot 1141 of the lower housing 114, and the initial fixation between the relays 122 and between the relays 122, fuse 123, shunt 124 and the lower housing 114 is completed by applying glue 119.

[0051] Step S230: Attach the middle shell to the lower shell and fix the electronic components in the slot of the lower shell; Specifically, the middle shell 116 is fastened onto the lower shell 114, and components such as the relay 122, fuse 123, and shunt 124 are fixed in the slot 1141 of the lower shell 114 to prevent the electronic components 120 from moving.

[0052] Step S240: Connect one end of the external copper busbar to the internal copper busbar, and position the other end on the middle shell.

[0053] Step S250: Then weld the outer copper busbar to the inner copper busbar located at the bottom of the slot.

[0054] Step S260: The electronic components are sequentially soldered to the internal copper busbar located at the bottom of the card slot.

[0055] Specifically, the relay 122, fuse 123, and shunt 124 are sequentially laser-welded to the internal copper busbar 115 at the bottom of the slot 1141.

[0056] Step S270: Solder the nickel sheet assembled on the circuit board to the internal copper busbar located at the bottom of the slot.

[0057] Specifically, multiple nickel sheets 131 assembled on the circuit board 130 are laser welded to the internal copper busbar 115 at the bottom of the slot 1141.

[0058] Step S280: Finally, connect the upper cover assembly to the lower shell assembly.

[0059] Specifically, after welding is completed, other components, such as insulating film and thermal pads, are installed to connect the upper cover assembly and the lower shell assembly, thus completing the overall assembly of the high-voltage control unit box.

[0060] In some embodiments, such as Figure 9 As shown, step S250, welding the outer copper busbar to the inner copper busbar located at the bottom of the slot, includes: Step S251: Laser weld multiple external copper busbars to multiple internal copper busbars sequentially along a straight line.

[0061] Step S260, sequentially soldering the electronic components to the internal copper busbar located at the bottom of the card slot includes: Step S261: Laser weld multiple relays to multiple internal copper busbars sequentially along a straight line.

[0062] Step S270, soldering the nickel sheet assembled on the circuit board to the internal copper busbar located at the bottom of the slot includes: Step S271: Laser weld multiple nickel sheets to multiple internal copper busbars sequentially along a straight line.

[0063] Specifically, the welding sequence is as follows: first, weld the outer copper busbar 121 to the inner copper busbar 115; then, weld the contacts of the relay 122 to the inner copper busbar 115; and finally, weld the nickel sheet 131 of the circuit board 130 to the inner copper busbar 115. Using a sequential welding method along a straight line simplifies welding trajectory planning, facilitates continuous welding with automated welding equipment, and improves welding efficiency and consistency. Specifically, the first welding point 1211 is located at one end of the inner copper busbar 115, the second welding point 1221 is located in the middle of the inner copper busbar 115, and the third welding point 1311 is located at the other end of the inner copper busbar 115. Welding the outer copper busbar 121, relay 122, and nickel sheet 131 in that order creates a continuous welding structure on the inner copper busbar 115, arranged in an orderly manner from one end to the other, further improving welding efficiency.

[0064] In some embodiments, such as Figure 9 As shown, step S251, which involves sequentially laser welding multiple external copper busbars to multiple internal copper busbars along a straight direction, includes: Step S2511: Connect the outer copper busbar and the inner copper busbar using laser splicing seam welding. The laser welding temperature is between 190℃ and 210℃. The specific temperature can be determined according to actual needs, such as 190℃, 200℃, 210℃, etc.

[0065] Step S261, sequentially laser welding multiple relays to multiple internal copper busbars along a straight direction, includes: Step S2611: Connect the relay to the internal copper busbar using laser splicing seam welding. The laser welding temperature is between 140℃ and 160℃. The specific temperature can be determined according to actual needs, such as 140℃, 150℃, 160℃, etc.

[0066] Step S271, soldering the nickel strip of the circuit board to the internal copper busbar located at the bottom of the slot, includes: Step S2711 involves connecting the nickel strips of the circuit board to the internal copper busbars using laser welding. The laser welding temperature is between 90℃ and 110℃. The specific temperature can be determined according to actual needs, such as 90℃, 100℃, 110℃, etc.

[0067] In this embodiment, different welding temperatures and processes are matched to the different materials and connection requirements of the components. This ensures the welding strength and conductivity of each component while avoiding deformation and performance damage to the copper busbars, nickel sheets, or relays due to excessive temperature. The laser splicing seam welding and lap welding processes are differentiated to adapt to the connection requirements of the external copper busbars, relays, and nickel sheets, thereby improving welding reliability. The precise temperature control range makes the manufacturing process more standardized and refined, reduces the product defect rate, and improves the consistency and reliability of the high-voltage control unit box 100.

[0068] The specific embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made in accordance with the technical concept of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A high-voltage control unit box, characterized in that, include: The housing assembly includes an upper cover assembly and a lower housing assembly that fit together, and a middle housing located between the upper cover assembly and the lower housing assembly and positioned on the lower housing assembly. The lower housing assembly includes a lower housing and an internal copper busbar integrally injection molded inside the lower housing. The lower housing has a plurality of slots, and the internal copper busbar located below the slots is exposed at the bottom of the slots. An external copper busbar, one end of which is connected to the internal copper busbar, and the other end of which is positioned on the middle shell; the external copper busbar and the internal copper busbar are welded to form a first welding point; An electronic component, comprising at least a relay, a fuse, and a shunt, wherein the relay is welded to the internal copper busbar to form a second welding point; A circuit board, wherein nickel sheets are assembled on the circuit board, the nickel sheets are used to connect the circuit board and the internal copper busbar, and the nickel sheets are welded to the internal copper busbar to form a third welding point; The first welding point, the second welding point, and the third welding point are coplanar.

2. The high-voltage control unit box according to claim 1, characterized in that, The fuse is welded to the internal copper busbar to form a fourth welding point; the shunt is welded to the internal copper busbar to form a fifth welding point, and the fourth welding point, the fifth welding point and the third welding point are coplanar.

3. The high-voltage control unit box according to claim 1, characterized in that, The outer copper busbar and the inner copper busbar are laser-welded together, and there are multiple first welding points, which are collinear.

4. The high-voltage control unit box according to claim 1, characterized in that, The relay and the internal copper busbar are laser-welded together, and there are multiple second welding points, which are collinear.

5. The high-voltage control unit box according to claim 1, characterized in that, The nickel sheet and the internal copper busbar are laser-bonded together, and there are multiple third welding points, which are collinear.

6. The high-voltage control unit box according to claim 1, characterized in that, The middle shell is fastened to the lower shell and cooperates with the slot to form a receiving cavity. The electronic components are received and fixed in the receiving cavity. Fixing adhesive is provided between the electronic components and between the electronic components and the lower shell to limit the horizontal shaking of the electronic components.

7. The high-voltage control unit box according to claim 1, characterized in that, The housing assembly also includes an insulating film and a thermal pad, the insulating film being located between the thermal pad and the lower housing, and the thermal pad being used for heat dissipation of the internal copper busbar.

8. A method for manufacturing a high-voltage control unit box, applied to the manufacturing of the high-voltage control unit box according to any one of claims 1-7, characterized in that, The manufacturing method includes: The electronic components are sequentially inserted into the slots of the one-piece injection-molded lower shell; Adhesive is applied between the electronic components and between the electronic components and the lower housing to fix them in place. The middle shell is fastened onto the lower shell, and the electronic components are fixed in the slots of the lower shell; One end of the external copper busbar is connected to the internal copper busbar, and the other end is positioned on the middle shell; Then, the outer copper busbar is welded to the inner copper busbar located at the bottom of the slot; The electronic components are sequentially soldered to the internal copper busbar located at the bottom of the card slot; The nickel sheet assembled on the circuit board is welded to the internal copper busbar located at the bottom of the slot; Finally, the upper cover assembly is connected to the lower shell assembly.

9. The manufacturing method according to claim 8, characterized in that, The step of welding the outer copper busbar to the inner copper busbar located at the bottom of the slot includes: Multiple external copper busbars and multiple internal copper busbars are sequentially laser-welded along a straight direction; The step of sequentially welding the electronic components to the internal copper busbar located at the bottom of the card slot includes: The relays and internal copper busbars are sequentially laser-welded along a straight line. The step of welding the nickel sheet of the circuit board to the internal copper busbar located at the bottom of the slot includes: Multiple nickel sheets are sequentially laser-welded to multiple internal copper busbars along a straight line.

10. The manufacturing method according to claim 9, characterized in that, The step of sequentially laser welding the plurality of external copper busbars to the plurality of internal copper busbars along a straight direction includes: The outer copper busbar and the inner copper busbar are connected by laser splicing seam welding, and the laser welding temperature is between 190℃ and 210℃. The step of sequentially laser welding the plurality of relays to the plurality of internal copper busbars along a straight direction includes: The relay is connected to the internal copper busbar by laser splicing seam welding, and the laser welding temperature is between 140℃ and 160℃. The step of sequentially laser welding multiple nickel sheets to multiple internal copper busbars along a straight direction includes: The nickel sheet of the circuit board is connected to the internal copper busbar by laser welding, with the laser welding temperature between 90℃ and 110℃.

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