A kind of cell protection film burr-free die cutting process

Abstract

This invention discloses a burr-free die-cutting process for battery cell protective film, comprising a base, a die-cutting frame, an upper seat plate, a cylinder seat, a lower seat plate, side plates, a film body, a chip removal frame, a waste box, and buffer rods. The die-cutting frame is positioned above the base, the upper seat plate is positioned above the inner side of the die-cutting frame, the cylinder seat is positioned on top of the upper seat plate, the lower seat plate is positioned above the middle of the base, side plates are positioned on both sides of the outer wall of the lower seat plate, and the film body is placed on the surface of the lower seat plate. The chip removal frame is positioned in the middle of the rear side of the die-cutting frame, the waste box is positioned on the front side of the lower seat plate, and buffer rods are positioned at the four corners of the upper seat plate and the four inner corners of the die-cutting frame. This invention further ensures a burr-free effect and improves tool life. The cylinder-driven pressing, electric push rod feeding, and linear motor chip removal mechanisms work together to achieve continuous die-cutting operations, making it suitable for large-scale production while balancing processing quality and capacity.

Description

Technical Field

[0001] This invention relates to the field of battery cell protective film processing equipment technology, specifically to a burr-free die-cutting process for battery cell protective films. Background Technology

[0002] Cell protective film is a high-performance insulating protective film that covers the outside of lithium batteries. It is a key material to ensure the safe and stable operation of batteries. Therefore, a die-cutting equipment is needed to process cell protective film.

[0003] Existing devices of this type suffer from significant vibration and poor stability during die-cutting, lacking buffering and stabilization. The die-cutting blades lack calibration functions, and the film cannot be leveled and pressed before cutting. Furthermore, the devices cannot perform post-die-cutting chip removal, leading to chip accumulation, which affects the quality of the die-cutting operation, requires frequent manual cleaning, and reduces continuous production efficiency.

[0004] Therefore, it is necessary to invent a burr-free die-cutting process for battery cell protective film to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a burr-free die-cutting process for battery cell protective films to solve the problems mentioned above.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a burr-free die-cutting process for battery cell protective film, comprising a base, a die-cutting frame, an upper seat plate, a cylinder seat, a lower seat plate, side plates, a film body, a chip removal frame, a waste box, and buffer rods. The die-cutting frame is arranged above the base, the upper seat plate is arranged above the inner side of the die-cutting frame, the cylinder seat is arranged on the top of the upper seat plate, the lower seat plate is arranged above the middle of the base, side plates are arranged on both sides of the outer wall of the lower seat plate, the film body is placed on the surface of the lower seat plate, the chip removal frame is arranged in the middle of the rear side of the die-cutting frame, the waste box is arranged on the front side of the lower seat plate, and buffer rods are arranged at the four corners of the upper seat plate and the four inner corners of the die-cutting frame. Preferably, the upper seat plate is located at the upper end of the buffer rod and above the inner side of the die-cutting frame.

[0007] Preferably, a pressing seat is provided below the center of the bottom surface of the upper seat plate, the pressing seat is positioned corresponding to the lower seat plate and the side plate, and the output end of the cylinder seat passes through the center of the upper seat plate to the center of the top surface of the pressing seat.

[0008] Preferably, the bottom surface of the pressing seat is provided with a flat plate, the two ends of the pressing seat are provided with mating plates, the inner side of the two mating plates is provided with a die-cutting blade, the die-cutting blade is located on both sides of the bottom surface of the pressing seat, the lower seat plate is matched with the size of the pressing seat, and the side plate corresponds to the mating plate.

[0009] Preferably, a docking groove is provided below the docking plate, the docking groove is opened at the corresponding position in the middle of the surface of the side plate, and die-cutting grooves are opened on both sides of the surface edge of the lower seat plate where it connects with the side plate.

[0010] Preferably, the lower base plate is provided with slide rail seats on both sides below the bottom, the two slide rail seats are respectively located on both sides of the surface of the base, a movable seat is provided above the slide rail seats, and an electric push rod is provided at the middle of the rear side of the two slide rail seats.

[0011] Preferably, the output end of the electric push rod is connected to the middle of the rear end of the lower seat plate.

[0012] Preferably, a linear motor is installed at the middle of the rear end of the chip removal frame, and a mounting plate is provided at the output end of the linear motor. Chip removal pushers are provided on both sides of the front section of the mounting plate, and the installation position of the chip removal pushers corresponds to the connection between the lower seat plate and the side plate.

[0013] Preferably, four buffer rods are provided, with the top ends of the buffer rods located at the four corners of the inner top surface of the die-cutting frame and the bottom ends of the buffer rods located at the four corners of the surface of the base.

[0014] Preferably, the steps include the following: Step 1: Equipment inspection and debugging, confirming that all components are securely installed and operating normally, and that the positions of key components such as buffer rods and slide rails are compliant.

[0015] Step 2: Move the lower seat plate using the electric push rod to place and position the membrane body stably, and then reset the lower seat plate.

[0016] Step 3: Start the cylinder seat to push the pressing seat down, press and fix the film body, and at the same time make the docking plate and the side plate accurately dock, ensuring that the die-cutting knife and the die-cutting groove are aligned.

[0017] Step 4: Continue to advance the pressing seat so that the die-cutting blade cuts into the film body into the die-cutting groove. With the help of the buffer rod, the burr-free die-cutting is completed.

[0018] Step 5: Reset the cylinder seat, start the linear motor to drive the chip removal pusher, and push the die-cut waste into the waste box to complete the chip removal.

[0019] Step Six: Move the lower seat plate to remove the finished product and inspect it. Then reset the equipment, clean up any residue, and prepare for the next operation.

[0020] The technical effects and advantages provided by the present invention in the above technical solution are as follows: With the cooperation of the buffer rod, upper seat plate, die-cutting frame and lower seat plate, the die-cutting process runs smoothly with little vibration, which can effectively avoid cut offset and size deviation caused by equipment shaking, ensuring the consistency of die-cutting size of battery cell protective film. The die-cutting blade and die-cutting groove are precisely aligned, and the film body is flattened before cutting with the help of the flat plate, so that the protective film is subjected to uniform force and the cut is straight, reducing problems such as burrs, streaks and debris from the source, meeting the high cleanliness and high flatness requirements of battery cell protective film. The chip removal frame, linear motor and chip removal pusher can automatically push the edge waste generated by die-cutting to the waste box, avoiding the accumulation of debris that affects the die-cutting accuracy and product cleanliness, reducing the frequency of manual cleaning and improving continuous production efficiency. The lower plate moves back and forth via a slide rail, a movable seat, and an electric push rod, facilitating the loading of protective film, loading and unloading of finished products, and maintenance and replacement of molds and cutter holders. This optimizes the operating space and improves ease of use. The precise fit between the docking plate, docking groove, and side plate ensures even force distribution on the die-cutting blade, preventing uneven cutting and blade wear, while maintaining consistent cutting depth. This further guarantees a burr-free finish and extends the lifespan of the cutter. The cylinder-driven pressing, electric push rod feeding, and linear motor chip removal mechanisms work together to enable continuous die-cutting operations, making it suitable for large-scale production and balancing processing quality and capacity. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the front view structure of the present invention; Figure 3 This is a side view of the structure of the present invention; Figure 4 This is a schematic diagram of the pressing seat mounting structure of the present invention; Figure 5 This is a schematic diagram of the lower seat plate mounting structure of the present invention; Figure 6 This is a schematic diagram of the slide rail mounting structure of the present invention.

[0022] Explanation of reference numerals in the attached figures: 1. Base; 2. Die-cutting frame; 3. Upper seat plate; 301. Pressing seat; 302. Flat plate; 303. Butt joint plate; 304. Die-cutting knife; 305. Butt joint groove; 4. Cylinder seat; 5. Lower seat plate; 501. Slide rail seat; 502. Moving seat; 503. Electric push rod; 6. Side plate; 7. Membrane body; 8. Chip removal frame; 801. Linear motor; 802. Mounting plate; 803. Chip removal push bar; 9. Waste box; 10. Buffer rod. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0024] This invention provides, for example Figure 1-6 The diagram illustrates a burr-free die-cutting process for a battery cell protective film, comprising a base 1, a die-cutting frame 2, an upper plate 3, a cylinder seat 4, a lower plate 5, a side plate 6, a film body 7, a chip removal frame 8, a waste box 9, and a buffer rod 10. The die-cutting frame 2 is positioned above the base 1, and the upper plate 3 is positioned above the inner side of the die-cutting frame 2. The upper plate 3 is located at the upper end of the buffer rod 10 and above the inner side of the die-cutting frame 2. A pressing seat 301 is positioned below the center of the bottom surface of the upper plate 3, and the pressing seat 301 corresponds to the positions of the lower plate 5 and the side plate 6. The output end of the cylinder seat 4 penetrates through the center of the upper plate 3. The top surface of the pressing base 301 is located at the middle. A flat plate 302 is provided on the bottom surface of the pressing base 301. A mating plate 303 is provided at both ends of the pressing base 301. A die-cutting blade 304 is provided on the inner side of the two mating plates 303. The die-cutting blade 304 is located on both sides of the bottom surface of the pressing base 301. The lower base plate 5 matches the size of the pressing base 301. The side plate 6 corresponds to the mating plate 303. A mating groove 305 is provided below the mating plate 303. The mating groove 305 is opened at the corresponding position in the middle of the surface of the side plate 6. Die-cutting grooves 306 are opened at the connection between the two sides of the surface edge of the lower base plate 5 and the side plate 6. Specifically, the base 1 provides stable support, the die-cutting frame 2 builds the overall working frame, and the upper seat plate 3 is driven by the cylinder seat 4 to be positioned and installed at the four corners of the four buffer rods 10 for smooth lifting and lowering, which drives the pressing seat 301 and the die-cutting knife 304 to work. The flat plate 302 on the bottom surface of the pressing seat 301 presses and fixes the film body 7, and the docking plate 303 is precisely docked with the side plate 6 through the docking groove 305 to ensure that the die-cutting knife 304 is aligned with the die-cutting groove 306 of the lower seat plate 5 to avoid burrs generated during die-cutting. A cylinder seat 4 is provided on the top of the upper seat plate 3. A lower seat plate 5 is provided above the middle of the base 1. Slide rail seats 501 are provided on both sides of the bottom of the lower seat plate 5. The two slide rail seats 501 are located on both sides of the surface of the base 1. A movable seat 502 is provided above the slide rail seats 501. An electric push rod 503 is provided at the middle of the rear side of the two slide rail seats 501. The output end of the electric push rod 503 is connected to the middle of the rear end of the lower seat plate 5. Side plates 6 are provided on both sides of the outer wall of the lower seat plate 5. A film body 7 is placed on the surface of the lower seat plate 5. A chip removal frame is provided at the middle of the rear side of the die-cutting frame 2. 8. A linear motor 801 is installed in the middle of the rear end of the chip removal frame 8. A mounting plate 802 is provided at the output end of the linear motor 801. Chip removal pushers 803 are provided on both sides of the front section of the mounting plate 802. The installation position of the chip removal pushers 803 corresponds to the connection between the lower seat plate 5 and the side plate 6. A waste box 9 is provided on the front side of the lower seat plate 5. Buffer rods 10 are provided at the four corners of the upper seat plate 3 and the four inner corners of the die-cutting frame 2. There are four buffer rods 10. The top of the buffer rods 10 is located at the four corners of the inner top surface of the die-cutting frame 2, and the bottom of the buffer rods 10 is located at the four corners of the surface of the base 1. Specifically, the lower plate 5 moves back and forth via the slide rail 501, the movable seat 502, and the electric push rod 503, facilitating the placement of the membrane body 7 and the unloading of finished products. After die-cutting, the device drives the cleaning pusher 803 via the linear motor 801 on the cleaning frame 8 to push the waste into the waste box 9, achieving burr-free die-cutting and automated cleaning in tandem. The four buffer rods 10 ensure accurate positioning, and the slide rail 501 and the movable seat 502 slide smoothly. The electric push rod 503 drives the lower plate 5 to move forward along the slide rail 501, placing the membrane body 7 stably on the surface of the lower plate 5 and positioning it. Then, the electric push rod 503 is controlled to reset the lower plate 5, and the cylinder seat 4 is activated. Its output end pushes the pressing seat 301 downward, and the flat plate 302 presses and fixes the membrane body 7. At the same time, the docking plate 303 precisely docks with the side plate 6 through the docking groove 305. The steps include the following: Step 1: Equipment inspection and debugging, confirming that all components are securely installed and operating normally, and that the positions of key components such as buffer rod 10 and slide rail seat 501 are compliant.

[0025] Step 2: Move the lower seat plate 5 using the electric push rod 503 to place and position the membrane body 7 stably, and then reset the lower seat plate 5.

[0026] Step 3: Start the cylinder seat 4 to push the pressing seat 301 down, press and fix the film body 7, and at the same time make the docking plate 303 and the side plate 6 accurately dock, ensuring that the die-cutting knife 304 and the die-cutting groove 306 are aligned.

[0027] Step 4: Continue to advance the pressing seat so that the die-cutting blade 304 cuts into the film body 7 to the die-cutting groove 306. With the help of the buffer rod 10, the burr-free die-cutting is completed.

[0028] Step 5: The cylinder seat 4 is reset, and the linear motor 801 is started to drive the chip removal pusher 803 to push the die-cut waste into the waste box 9 to complete the chip removal.

[0029] Step 6: Move the lower seat plate 5 to remove the finished product and inspect it. Then reset the equipment, clean up any residue, and prepare for the next operation.

[0030] The cylinder base 4, electric push rod 503 and linear motor 801 mentioned above are all existing technology products, and their specific structures and functions will not be described in detail here.

[0031] Working principle of this invention: Refer to the instruction manual appendix Figure 1-6When using this invention, the base 1 first provides stable support, the die-cutting frame 2 builds the overall working frame, and the upper seat plate 3 is driven by the cylinder seat 4 to be positioned and installed at the four corners of the four buffer rods 10 for smooth lifting and lowering, driving the pressing seat 301 and the die-cutting knife 304 to work. The lower seat plate 5 moves back and forth through the slide rail seat 501, the moving seat 502 and the electric push rod 503 to facilitate the placement of the film body 7 and the unloading of finished products. The flat plate 302 on the bottom surface of the pressing seat 301 presses and fixes the film body 7. The docking plate 303 is precisely docked with the side plate 6 through the docking groove 305 to ensure that the die-cutting knife 304 is aligned with the die-cutting groove 306 of the lower seat plate 5 to avoid burrs from die-cutting. After die-cutting, the linear motor 801 on the chip removal frame 8 drives the chip removal pusher 803 to push the waste into the waste box 9, realizing the coordinated operation of burr-free die-cutting and automated chip removal. Before using this device, first check and debug the equipment to ensure that all components, such as the base 1 and die-cutting frame 2, are securely installed, that the cylinder seat 4, electric push rod 503, and linear motor 801 are operating normally, that the four buffer rods 10 are accurately positioned, and that the slide rail seat 501 and moving seat 502 slide smoothly. Drive the lower seat plate 5 along the slide rail seat 501 using the electric push rod 503 to smoothly place and position the membrane body 7 on the surface of the lower seat plate 5. Then, control the electric push rod 503 to reset the lower seat plate 5, start the cylinder seat 4, and its output end pushes the pressing seat 301 downwards, pressing and fixing the membrane body 7 onto the flat plate 302. Simultaneously, the docking plate 303 precisely docks with the side plate 6 through the docking groove 305, ensuring that the die-cutting blade 304 is aligned with the die-cutting groove 306. The cylinder seat 4 continues to be driven, causing the die-cutting blade 304 to cut into the film body 7 to the die-cutting groove 306. With the help of the buffer rod 10, the pressure is reduced and the burr-free die-cutting is completed. The cylinder seat 4 is controlled to reset, and the linear motor 801 is started, driving the chip removal pusher 803 to move along the connection between the lower seat plate 5 and the side plate 6, pushing the waste into the waste box 9. The lower seat plate 5 is moved forward by the electric push rod 503 to take out the finished product and inspect it. Then the equipment is reset, the residue is cleaned, and it is ready for the next operation.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A burr-free die-cutting process for a battery cell protective film, comprising a base (1), a die-cutting frame (2), an upper seat plate (3), a cylinder seat (4), a lower seat plate (5), a side plate (6), a film body (7), a chip removal frame (8), a waste box (9), and a buffer rod (10), characterized in that, A die-cutting frame (2) is provided above the base (1). An upper seat plate (3) is provided on the upper inner side of the die-cutting frame (2). A cylinder seat (4) is provided on the top of the upper seat plate (3). A lower seat plate (5) is provided above the middle part of the base (1). Side plates (6) are provided on both sides of the outer wall of the lower seat plate (5). A film body (7) is placed on the surface of the lower seat plate (5). A chip removal frame (8) is provided in the middle of the rear side of the die-cutting frame (2). A waste box (9) is provided on the front side of the lower seat plate (5). Buffer rods (10) are provided at the four corners of the upper seat plate (3) and the four corners of the inner side of the die-cutting frame (2).

2. The burr-free die-cutting process for battery cell protective film according to claim 1, characterized in that: The upper seat plate (3) is located at the upper end of the buffer rod (10) and above the inner side of the die-cutting frame (2).

3. The burr-free die-cutting process for battery cell protective film according to claim 1, characterized in that: A pressing seat (301) is provided below the middle of the bottom surface of the upper seat plate (3). The pressing seat (301) corresponds to the position of the lower seat plate (5) and the side plate (6). The output end of the cylinder seat (4) passes through the middle of the upper seat plate (3) to the middle of the top surface of the pressing seat (301).

4. The burr-free die-cutting process for battery cell protective film according to claim 3, characterized in that: The bottom surface of the pressing base (301) is provided with a flat plate (302), and the two ends of the pressing base (301) are provided with mating plates (303). Die-cutting blades (304) are provided on the inner side of the two mating plates (303). The die-cutting blades (304) are located on both sides of the bottom surface of the pressing base (301). The lower base plate (5) matches the size of the pressing base (301), and the side plate (6) corresponds to the mating plate (303).

5. The burr-free die-cutting process for a battery cell protective film according to claim 4, characterized in that: A docking groove (305) is provided below the docking plate (303). The docking groove (305) is opened at the corresponding position in the middle of the surface of the side plate (6). Die-cutting grooves (306) are opened on both sides of the surface edge of the lower seat plate (5) at the connection with the side plate (6).

6. The burr-free die-cutting process for a battery cell protective film according to claim 1, characterized in that: The lower base plate (5) is provided with slide rail seats (501) on both sides below the bottom. The two slide rail seats (501) are located on both sides of the surface of the base (1). A movable seat (502) is provided above the slide rail seat (501). An electric push rod (503) is provided at the middle of the rear side of the two slide rail seats (501).

7. The burr-free die-cutting process for a battery cell protective film according to claim 6, characterized in that: The output end of the electric push rod (503) is connected to the middle of the rear end of the lower seat plate (5).

8. The burr-free die-cutting process for battery cell protective film according to claim 1, characterized in that: A linear motor (801) is installed in the middle of the rear end of the chip removal frame (8). A mounting plate (802) is provided at the output end of the linear motor (801). Chip removal pushers (803) are provided on both sides of the front section of the mounting plate (802). The installation position of the chip removal pushers (803) corresponds to the connection between the lower seat plate (5) and the side plate (6).

9. The burr-free die-cutting process for a battery cell protective film according to claim 1, characterized in that: The buffer rod (10) is provided in four parts. The top of the buffer rod (10) is located at the four corners of the inner top surface of the die-cutting frame (2), and the bottom of the buffer rod (10) is located at the four corners of the surface of the base (1).

10. The burr-free die-cutting process for a battery cell protective film according to claim 1, characterized in that: The steps include the following: Step 1: Check and debug the equipment to confirm that all components are securely installed and operating normally, and that the positions of key components such as buffer rod (10) and slide rail seat (501) are compliant. Step 2: Move the lower plate (5) using the electric push rod (503) to place and position the membrane body (7) stably, and then reset the lower plate (5). Step 3: Start the cylinder seat (4) to push the pressing seat (301) down and press and fix the film body (7). At the same time, make the docking plate (303) and the side plate (6) accurately dock to ensure that the die-cutting knife (304) and the die-cutting groove (306) are aligned. Step 4: Continue to advance the pressing seat so that the die-cutting blade (304) cuts into the film body (7) to the die-cutting groove (306). With the help of the buffer rod (10), the burr-free die-cutting is completed. Step 5: Reset the cylinder seat (4), start the linear motor (801) to drive the chip removal pusher (803), and push the die-cut waste into the waste box (9) to complete the chip removal. Step 6: Move the lower seat plate (5) to remove the finished product and inspect it. Then reset the equipment, clean up the residue, and prepare for the next operation.

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