Mobile phone frame CNC machining hole precision detection method based on machine vision
By using image processing and gradient analysis under multi-angle illumination, the micro-flanging and reflective structures of CNC-machined holes in the mobile phone frame are identified and corrected, solving the error problem in hole detection and achieving high-precision hole center coordinate calculation and stability of detection results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANDONG MAITAO TECHNOLOGY CO LTD
- Filing Date
- 2026-03-23
- Publication Date
- 2026-06-19
AI Technical Summary
In the existing technology, the hole position detection method after CNC machining of the mobile phone frame cannot effectively identify the sub-pixel level offset error of the hole position center caused by micro-flanging or reflective structure, resulting in cumulative assembly deviation in the high-density hole array structure.
By acquiring multiple frames of images under a multi-angle ring light source, pixel-level registration is performed to generate composite images of the apertures. Brightness change gradient analysis is performed to identify abnormal gradient regions, the contours are decomposed and boundary continuity and curvature consistency analysis is performed to construct a geometric reconstruction model, correct abnormally offset aperture positions, and establish the topological relationship of the aperture array.
It improves the anti-interference ability and accuracy of borehole detection, significantly enhances the stability of borehole center coordinate calculation and the reliability of overall detection results, and suppresses the influence of local abnormal boundaries on the detection results.
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