Mobile phone frame CNC machining hole precision detection method based on machine vision

By using image processing and gradient analysis under multi-angle illumination, the micro-flanging and reflective structures of CNC-machined holes in the mobile phone frame are identified and corrected, solving the error problem in hole detection and achieving high-precision hole center coordinate calculation and stability of detection results.

CN122244159APending Publication Date: 2026-06-19SHANDONG MAITAO TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANDONG MAITAO TECHNOLOGY CO LTD
Filing Date
2026-03-23
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In the existing technology, the hole position detection method after CNC machining of the mobile phone frame cannot effectively identify the sub-pixel level offset error of the hole position center caused by micro-flanging or reflective structure, resulting in cumulative assembly deviation in the high-density hole array structure.

Method used

By acquiring multiple frames of images under a multi-angle ring light source, pixel-level registration is performed to generate composite images of the apertures. Brightness change gradient analysis is performed to identify abnormal gradient regions, the contours are decomposed and boundary continuity and curvature consistency analysis is performed to construct a geometric reconstruction model, correct abnormally offset aperture positions, and establish the topological relationship of the aperture array.

🎯Benefits of technology

It improves the anti-interference ability and accuracy of borehole detection, significantly enhances the stability of borehole center coordinate calculation and the reliability of overall detection results, and suppresses the influence of local abnormal boundaries on the detection results.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a machine vision-based method for detecting the accuracy of holes in CNC machining of mobile phone frames, specifically relating to the field of mobile phone frame machining and inspection technology. First, images of the mobile phone frame under multi-angle lighting conditions are acquired and composite images of the holes are generated to identify abnormal contour regions caused by micro-flanging or reflective structures. Then, the composite images of the holes are decomposed into contour layers to extract candidate true hole boundaries. The continuity and curvature consistency of the boundaries are analyzed, and the true boundary curves of the holes are selected. A geometric reconstruction model of the holes is established, and the true boundary curves are geometrically fitted to obtain the center coordinates of the holes. A topological relationship of the hole array is constructed, and abnormally offset holes are corrected. Finally, the corrected hole coordinates are compared with preset standard hole coordinates to calculate the hole deviation and output the detection results. This invention can effectively suppress interference from micro-flanging and reflective structures at the holes, improving the stability and accuracy of hole accuracy detection in CNC machining of mobile phone frames.
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