Communication module testing device, testing method, device and medium of communication module
By using communication module testing equipment and diagnostic models, combined with module data and thermal imaging images, the problem of low diagnostic accuracy in the thermal design verification of communication modules was solved, and accurate analysis and efficient diagnosis of abnormal temperature rise were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI RUIYUAN INTELLIGENT TECHNOLOGY CO LTD
- Filing Date
- 2026-05-15
- Publication Date
- 2026-06-19
Smart Images
Figure CN122247888A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of mobile communication technology, and more particularly to the field of mobile device technology, specifically to a communication module testing device, a testing method for a communication module, an equipment, and a medium. Background Technology
[0002] With the rapid development of communication technology, communication modules have been widely used in various electronic devices such as smartphones, IoT terminals, automotive equipment, and industrial control systems, becoming a core component for realizing the communication functions of terminal devices. During operation, communication modules continuously generate heat due to their internal chips, radio frequency devices, and other components. Especially in scenarios such as high-load transmission and operation on specific frequency bands, heat accumulation can lead to excessive temperature rise in the communication module. This not only affects the radio frequency performance and power consumption stability of the communication module, but in severe cases, it can also damage the internal components of the communication module and shorten the lifespan of the terminal device. Therefore, thermal design verification for communication modules has become an indispensable and critical step in the research and development and production of communication modules.
[0003] Currently, the verification of the thermal design of communication modules mainly relies on engineers observing the temperature rise of the communication module using terminal devices such as infrared thermal imagers or thermocouple collectors to determine the rationality of the thermal design scheme. However, in existing verification methods, the thermal imaging data acquired by infrared thermal imagers or thermocouple collectors is isolated. It only presents the temperature distribution on the surface of the communication module by obtaining thermal images, making it difficult to synchronize and correlate with the real-time operating status of the module. This makes it impossible to accurately analyze and trace the specific causes of abnormal temperature rise in the communication module, resulting in low diagnostic accuracy for thermal verification of communication modules and affecting the efficiency of thermal verification analysis and diagnosis. Summary of the Invention
[0004] This application provides a communication module testing device, a testing method for communication modules, equipment, and a medium. It can accurately analyze and trace the root cause of abnormal temperature rise by combining the actual operating conditions of the communication module, significantly improve the diagnostic accuracy of thermal verification of the communication module, and effectively improve the overall analysis and diagnostic efficiency of thermal verification.
[0005] On one hand, this application provides a communication module testing device, which includes a module carrier and a thermal imaging device. The module carrier is used to place the communication module, and the communication module is communicatively connected to a controller through the module carrier. The module carrier is configured to receive a test command from the controller for at least one target communication module, to control the target communication module to enter a test state, and to collect module data generated by the target communication module in the test state, and to send the module data of the target communication module to the controller. The thermal imaging device is configured to capture images of the target communication modules in the test state to obtain thermal images of each target communication module, and to send the thermal images of each target communication module to the controller so that the controller can analyze the thermal images and module data corresponding to each target communication module to obtain the analysis results of the target communication modules.
[0006] In some embodiments, the module carrier includes a module carrier plate for placing at least one communication module so that the communication module can communicate with the controller through the module carrier plate.
[0007] In some embodiments, the communication module testing equipment further includes a mobile device connected to the thermal imaging device and communicatively connected to the controller; the mobile device is configured to receive a movement command issued by the controller to control the mobile device to move the thermal imaging device to the target position corresponding to the movement command.
[0008] In some embodiments, the moving device includes a first slide bar slidably connected to the thermal imaging device, such that the thermal imaging device moves on the first slide bar when it receives a first moving command from the controller; The two ends of the first slide rod are respectively located in the first slide rail and the second slide rail, so that the first slide rod moves on the first slide rail and the second slide rail when it receives the second movement command issued by the controller; The two ends of the first slide rail are respectively located in the third slide rail and the fourth slide rail, so that the first slide rail moves on the third slide rail and the fourth slide rail when it receives the third movement command issued by the controller; The two ends of the second slide rail are located in the fifth slide rail and the sixth slide rail respectively, so that the second slide rail moves on the fifth slide rail and the sixth slide rail when it receives the fourth movement command issued by the controller.
[0009] On the other hand, embodiments of this application provide a testing method for a communication module, applied to the communication module testing equipment described above, the method comprising: Receive test commands sent by the controller for at least one target communication module, and control the target communication module to enter the test state; Collect module data generated by the target communication module under the test state, and send the module data of the target communication module to the controller; The thermal imaging device of the communication module testing equipment is controlled to take pictures of the target communication module in the test state to obtain thermal images of each target communication module. The thermal images of each target communication module are sent to the controller, so that the controller can analyze the thermal images and module data corresponding to each target communication module to obtain the analysis results of the target communication module.
[0010] In some embodiments, the module carrier device of the communication module testing equipment includes multiple test areas, and each test area includes at least one communication module; The thermal imaging device controlling the communication module testing equipment takes pictures of the target communication modules in the testing state to obtain thermal images of each target communication module, including: Based on the target test area where the target communication module is located, control the thermal imaging device of the communication module test equipment to move to the target position corresponding to the target test area; The thermal imaging device of the communication module testing equipment is controlled to take pictures of the target communication module in the test state at the target location to obtain thermal images of each target communication module.
[0011] In some embodiments, sending the thermal images of each of the target communication modules to the controller, so that the controller can analyze the thermal images and module data corresponding to each target communication module to obtain the analysis results of the target communication modules, includes: The thermal images of each target communication module are sent to the controller, so that the controller can use a target diagnostic model to diagnose the thermal images of each target communication module, filter out the target thermal images with anomalies from each thermal image, and determine the abnormal communication module and the corresponding anomaly information based on the target thermal images; the controller analyzes the module data and anomaly information corresponding to the target thermal images based on the target knowledge graph to determine the analysis results of the abnormal communication module corresponding to the target thermal images.
[0012] In some embodiments, the anomaly information includes anomaly location information and anomaly type information, wherein the anomaly location information is used to indicate the location where an anomaly exists in the anomaly communication module.
[0013] In some embodiments, the target knowledge graph includes network nodes, node attributes, and network edges. A network node is used to indicate a type of communication module information, the node attributes of the network node are used to indicate module details, and the network edges are used to indicate the association relationships between connected network nodes.
[0014] In some embodiments, the step of analyzing the module data and anomaly information corresponding to the target thermal imaging image based on the target knowledge graph by the controller to determine the analysis results of the abnormal communication module corresponding to the target thermal imaging image includes: The controller finds at least one target network node that matches the module data and the anomaly information from the target knowledge graph based on the module data and anomaly information corresponding to the target thermal image. Based on the target network node, the target node attributes corresponding to the target network node, and the target network edge, the abnormal analysis information of the abnormal communication module is output as the analysis result.
[0015] On the other hand, embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps: Receive test commands sent by the controller for at least one target communication module, and control the target communication module to enter the test state; Collect module data generated by the target communication module under the test state, and send the module data of the target communication module to the controller; The thermal imaging device of the communication module testing equipment is controlled to take pictures of the target communication module in the test state to obtain thermal images of each target communication module. The thermal images of each target communication module are sent to the controller, so that the controller can analyze the thermal images and module data corresponding to each target communication module to obtain the analysis results of the target communication module.
[0016] On the other hand, embodiments of this application also provide a computer program product, including a computer program or instructions, which, when executed by a processor, implement the steps in the testing method for any communication module provided in embodiments of this application.
[0017] On the other hand, embodiments of this application also provide a computer-readable storage medium storing a computer program or instructions thereon, including a computer program or instructions that, when executed by a processor, implement the steps in the testing method for any communication module provided in embodiments of this application.
[0018] The communication module testing method provided in this application acquires module data and thermal imaging images of target communication modules through communication module testing equipment. The controller then analyzes the thermal imaging images and module data corresponding to each target communication module to obtain the analysis results. This effectively breaks down the isolation barrier of thermal imaging data during thermal verification and diagnostic analysis. While collecting temperature distribution and thermal imaging information of the communication module, it also collects module data during operation, achieving synchronous linkage between temperature data and the real-time operating status of the module. It can accurately analyze and trace the root cause of abnormal temperature rise by combining the actual operating conditions of the communication module, significantly improving the diagnostic accuracy of communication module thermal verification and effectively enhancing the overall efficiency of thermal verification analysis and diagnosis. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 A schematic diagram of the structure of a communication module testing device provided in an embodiment of this application; Figure 2 This is a flowchart illustrating a testing method for a communication module provided in an embodiment of this application; Figure 3 This is a schematic diagram of a scenario for testing a communication module provided in the embodiments of this application; Figure 4 This is a schematic diagram of another scenario for the testing method of the communication module provided in the embodiments of this application; Figure 5 This is a schematic diagram of another scenario for the testing method of the communication module provided in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation
[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0022] In the following description, specific embodiments of the invention will be illustrated with reference to steps and symbols performed by one or more computers, unless otherwise stated. Therefore, these steps and operations will be referred to several times as being performed by a computer, and computer execution as referred to herein includes operations by a computer processing unit representing electronic signals of data in a structured format. This operation transforms the data or maintains it at a location in the computer's memory system, which can be reconfigured or otherwise alter the operation of the computer in a manner well known to those skilled in the art. The data structure maintained by the data is the physical location of the memory, which has specific characteristics defined by the data format. However, the principles of the invention described above are not intended to be limiting, and those skilled in the art will understand that many of the steps and operations described below can also be implemented in hardware.
[0023] The terms "module" or "unit" as used herein can be considered as software objects executing on the computing system. The various components, modules, engines, and services described herein can be considered as implementations on the computing system. While the apparatus and methods described herein are preferably implemented in software, they can also be implemented in hardware, both of which are within the scope of this invention.
[0024] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when an element is “connected” or “coupled” to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein may include wireless connections or wireless coupling. The term “and / or” as used herein includes all or any units and all combinations of one or more associated listed items.
[0025] Figure 1 This is a schematic diagram of a communication module testing device provided in an embodiment of this application. Please refer to... Figure 1 The communication module testing equipment 10 may include: a module carrier 101 and a thermal imaging device 102. The module carrier 101 is used to place the communication module, and the communication module is connected to the controller 109 through the module carrier 101.
[0026] The module carrier device 101 is configured to receive test instructions from the controller 109 for at least one target communication module 1013, to control the target communication module 1013 to enter the test state, and to collect module data generated by the target communication module 1013 in the test state, and to send the module data of the target communication module 1013 to the controller 109.
[0027] The thermal imaging device 102 is configured to capture images of the target communication modules 1013 in the test state to obtain thermal images of each target communication module 1013, and to send the thermal images of each target communication module 1013 to the controller 109 so that the controller 109 can analyze the corresponding thermal images and module data of each target communication module 1013 to obtain the analysis results of the target communication module 1013.
[0028] Among them, the thermal imaging device 102 can be a high-precision thermal imaging device, which is a professional testing instrument capable of acquiring the surface temperature distribution of an object and generating an infrared thermal imaging spectrum with high resolution, high temperature measurement accuracy, and high spatial positioning accuracy. The thermal imaging device 102 can accurately acquire temperature distribution data of various areas on the surface of the communication module placed on the module carrier board 1011, realize device-level micro-temperature rise detection and identification of abnormal heating points, and is suitable for communication module thermal design verification, temperature rise fault diagnosis, and reliability testing scenarios.
[0029] Furthermore, the module carrier device 101 includes a module carrier plate 1011 and a platform 1012. The platform 1012 is a test platform inside a constant temperature chamber. The module carrier plate 1011 is placed above the platform 1012. The module carrier plate 1011 is used to place at least one communication module so that the communication module can communicate with the controller 109 through the module carrier plate 1011.
[0030] Specifically, the module carrier board 1011 includes placement locations for multiple communication modules, such as... Figure 1 The positions shown in the diagram, from #1 to #20, can each accommodate one communication module.
[0031] The connection between each communication module under test and the module carrier board 1011 is as follows: the communication module under test is soldered onto the printed circuit board assembly (PCBA) to form a complete TE-A adapter board (TE-A type adapter board). The soldering process employs a precision reflow soldering process to ensure precise and secure alignment between the pins of the communication module and the pads on the PCBA, avoiding signal transmission abnormalities caused by cold solder joints or false solder joints. Simultaneously, it ensures heat dissipation performance at the solder joint, preventing damage to the communication module from high soldering temperatures. Then, the male terminals of the board-to-board connector (BTB) are pre-soldered on the TE-A adapter board, and the female terminals of the BTB connector are soldered to the corresponding positions on the module carrier board 1011. This ensures that the pin definitions and spacing of the male and female terminals match the signal requirements of the communication module. The module carrier board 1011 can be a large board for Mean Time Between Failures (MTBF) testing, and the connector installation position is precise, facilitating subsequent connection. Next, the TE-A adapter board with the male BTB connector soldered on it is aligned with the female BTB connector on the module carrier board 1011. Slowly press to ensure precise mating of the male and female ends, completing the initial mechanical fixation and signal conduction between the TE-A adapter board and the module carrier board 1011. Finally, the final connection and fixation are completed through a slot-pressing connection method, achieving stable communication between the communication module and the module carrier board 1011. Specifically, a matching slot structure is provided on the mating edge of the TE-A adapter board and the module carrier board 1011. After the male and female BTB connectors are properly aligned, the TE-A adapter board is pressed along the slot direction to lock the slot in place, further strengthening the connection stability and preventing loosening due to vibration or movement during testing. This also ensures stable transmission of communication signals, providing a reliable connection foundation for subsequent thermal imaging and performance testing.
[0032] The above connection method enables a reliable connection between the communication module under test and the module carrier board 1011. This solves the problem that the communication module pins are too fine to be directly connected to the module carrier board 1011. Furthermore, the dual fixation of the connector and the card slot ensures the stability of the connection and the accuracy of signal transmission during the test, making it suitable for various scenarios such as communication module thermal design verification and reliability testing.
[0033] Optionally, the communication module testing equipment 10 further includes a mobile device 103, which is connected to the thermal imaging device 102 and is communicatively connected to the controller 109. The mobile device 103 is configured to receive a movement command issued by the controller 109 to control the mobile device 103 to move the thermal imaging device 102 to the target position corresponding to the movement command.
[0034] Specifically, the moving device 103 includes a first slide bar 1031, which is slidably connected to the thermal imaging device 102, so that the thermal imaging device 102 moves on the first slide bar 1031 when it receives a first moving command from the controller 109; the two ends of the first slide bar 1031 are respectively located in the first slide rail 1032 and the second slide rail 1033, so that the first slide bar 1031 moves on the first slide rail 1032 and the second slide rail 1033 when it receives a second moving command from the controller 109. The two ends of the first slide rail 1032 are respectively located in the third slide rail 1034 and the fourth slide rail 1035, so that the first slide rail 1032 moves on the third slide rail 1034 and the fourth slide rail 1035 when it receives the third movement command issued by the controller 109; the two ends of the second slide rail 1033 are respectively located in the fifth slide rail 1036 and the sixth slide rail 1037, so that the second slide rail 1033 moves on the fifth slide rail 1036 and the sixth slide rail 1037 when it receives the fourth movement command issued by the controller 109.
[0035] The thermal imaging device 102 can be moved along the first slide bar 1031 to adjust its horizontal position. The first slide bar 1031, located at both ends of the first slide rail 1032 and the second slide rail 1033, serves as a horizontal sliding fixed node. The horizontal position of the thermal imaging device 102 can be adjusted by adjusting the position of these horizontal sliding fixed nodes within the first and second slide rails 1032 and 1033. The first slide rail 1032, located at both ends of the third slide rail 1034 and the fourth slide rail 1035, and the second slide rail 1033, located at both ends of the fifth slide rail 1036 and the sixth slide rail 1037, serve as lifting fixed nodes. The height of the thermal imaging device 102 can be adjusted by adjusting the position of these lifting fixed nodes.
[0036] The communication module testing equipment 10 also includes a constant temperature chamber 104, a power supply 105, and a controller 109. The acrylic constant temperature chamber ensures a stable temperature environment for testing, reducing external interference. The mobile device 103 is mounted on top of the acrylic constant temperature chamber 104. The controller 109 controls the operating mode of the communication module under test, collects power consumption data generated during testing, and controls the intelligent model to analyze thermal spectrum diagnostics and automatically generate a visual report.
[0037] In this embodiment, the controller 109 can communicate with the thermal imaging device 102 and the mobile device 103 via a first communication control line 106 to transmit control commands to them, ensuring that the controller 109 controls the thermal imaging device's operating trajectory and performs intelligent diagnostic analysis of the thermal spectrum. The controller 109 can also communicate with the power supply 105 and the module carrier board 1011 via a second communication control line 107. The second communication control line 107 can be a General Purpose Interface Bus (GPIB), and the GPIB communication control harness is used to monitor and collect power consumption data generated by the communication module during testing. Finally, the controller 109 communicates with the module carrier board 1011 via a third communication control line 108 to ensure that the controller 109 controls the communication module under test to operate in different working scenarios.
[0038] In one specific embodiment, by placing the communication module under test in an acrylic transparent constant temperature chamber 104, interference factors caused by unstable ambient temperature are reduced. The module carrier board 1011 provided in this application embodiment can simultaneously mount multiple communication modules under test (such as RedCap modules). The module carrier board 1011 can also synchronously collect the real-time power consumption current of the communication modules and the monitoring point current of key chips. The controller 109 is connected to the module carrier board 1011 through a communication harness to control all communication modules under test to operate in different working modes, such as power-on sleep standby mode, active state, specified frequency band (such as n78), maximum (MaxPower) power transmission, maximum load, and other multi-modal test scenarios. The controller 109 is connected to and controls the horizontal and vertical sliding rods and other moving devices 103 through the communication harness to adjust the shooting position of the thermal imaging device 102, thereby realizing the acquisition of module data of the communication modules during the test.
[0039] Figure 2 This is a flowchart illustrating a testing method for a communication module provided in an embodiment of this application. Please refer to... Figure 2 The testing method for this communication module can be applied to Figure 1 In the processing system of the operating system shown, for example, the test method for the communication module can be provided by... Figure 1 The operating system shown interacts with terminal devices and / or servers within the processing system. For example... Figure 2 As shown, the testing method for this communication module includes the following steps (steps S110 to S140): Step S110: Receive a test command sent by the controller for at least one target communication module, and control the target communication module to enter the test state.
[0040] Step S120: Collect module data generated by the target communication module in the test state, and send the module data of the target communication module to the controller.
[0041] Step S130: Control the thermal imaging device of the communication module testing equipment to take pictures of the target communication modules in the test state to obtain thermal images of each target communication module.
[0042] Step S140: Send the thermal images of each target communication module to the controller so that the controller can analyze the thermal images and module data corresponding to each target communication module and obtain the analysis results of the target communication module.
[0043] In this embodiment, the thermal imaging device is mounted on the top moving device of the acrylic constant temperature chamber. The sliding trajectory of the device above the module carrier is controlled by the software program issued by the controller to ensure that the lens of the thermal imaging device is directly above each communication module under test during the actual test.
[0044] Optionally, the thermal spectrum monitored by the thermal imaging device can be modeled and analyzed according to the operating module scenario of the communication module under test, and the highest temperature (T_max), average temperature (T_avg), and temperature difference with the environment (ΔT) of the area can be marked.
[0045] In some embodiments, the module carrier of the communication module testing equipment includes multiple test areas, each test area including at least one communication module; the above step S130, "controlling the thermal imaging device of the communication module testing equipment to take pictures of the target communication modules in the test state to obtain thermal images of each target communication module", may include: Based on the target test area where the target communication module is located, control the thermal imaging device of the communication module test equipment to move to the target position corresponding to the target test area; The thermal imaging device of the control communication module testing equipment is positioned at the target location to capture images of the target communication modules under test, thereby obtaining thermal images of each target communication module.
[0046] The target location can be either directly above the target communication module or directly above the test area of the target communication module.
[0047] For details, please refer to Figure 3 , Figure 3 A schematic diagram of a thermal image of the target communication module; Figure 3 The image on the left is the original thermal image of the target communication module. Figure 3 The image on the right is a schematic diagram showing that after the target communication module has been aligned with the CAD file, different chip areas are distinguished by different colored outlines and labeled with names.
[0048] In some embodiments, step S140 above, "sending the thermal imaging images of each target communication module to the controller so that the controller can analyze the thermal imaging images and module data corresponding to each target communication module to obtain the analysis results of the target communication module", may include: The thermal images of each target communication module are sent to the controller, which then uses a target diagnostic model to diagnose the thermal images of each target communication module. The controller filters out the target thermal images that contain anomalies and determines the abnormal communication modules and corresponding anomaly information based on the target thermal images. The controller then analyzes the module data and anomaly information corresponding to the target thermal images based on the target knowledge graph to determine the analysis results of the abnormal communication modules corresponding to the target thermal images.
[0049] In some embodiments, the anomaly information includes anomaly location information and anomaly type information, wherein the anomaly location information is used to indicate the location where an anomaly exists in the anomaly communication module.
[0050] For example, please refer to Figure 4 The abnormal target thermal image can be input into the target diagnostic model. The target diagnostic model processes the data to identify the abnormal segmentation mask at the abnormal location and analyze the current waveform. The controller analyzes the module data and abnormal information corresponding to the target thermal image based on the target knowledge graph to determine the analysis result of the abnormal communication module corresponding to the target thermal image: "Power amplifier (PA) overcurrent fault detected (confidence 94%); Recommendation: Immediately check the PA power supply circuit, reduce the transmission power, and monitor temperature changes; Prediction: If not handled, thermal protection shutdown may be triggered within 15 minutes."
[0051] In this embodiment of the application, a target diagnostic model can be constructed and trained first. For example, a hierarchical fusion diagnostic model can be trained as the target diagnostic model. The specific training steps are as follows: (1) Anomaly detection layer (unsupervised) training: Based on the regional and global features of normal samples, a diagnostic model is trained to identify thermal images that deviate from the normal pattern.
[0052] i. Objective: To automatically identify samples that deviate significantly from normal thermal imaging patterns without pre-defining anomaly types; ii. Preliminary sample preparation: Input a large number of infrared thermal images labeled only as normal / good, which can be single images or sequences; iii. Data preprocessing: Image alignment is performed to ensure that the shooting angles and positions of all communication modules are consistent; temperature value normalization is performed to eliminate the influence of minor environmental fluctuations; and ROI extraction is performed by pre-defining chip areas, such as PMIC, PA, BB, etc. iv. Build a feature embedding-based model using a CNN (such as ResNet) pre-trained on a large image dataset as a feature extractor. Input normal samples to obtain their feature vectors, and then use a one-class classifier (such as One-Class SVM, Isolation Forest, or Gaussian Mixture Model) to model the distribution of these normal vectors in the feature space. The feature vectors of anomalous samples will fall outside the normal distribution region. Finally, output a global anomaly score. Calculate the distribution of the anomaly score on the validation set (normal samples) and set a confidence interval (such as the 99th percentile). During testing, an anomaly alert is triggered if the score exceeds this threshold.
[0053] (2) Anomaly classification and localization layer (supervised) training: Data labeled with anomaly categories (such as “PA local overheating”, “PMIC diffused heat generation”, “insufficient memory temperature rise”) and regions.
[0054] i. Objective: Based on the anomaly detection layer confirming the presence of anomalies in the thermal imaging image, accurately identify the anomaly type (i.e., the specific thermal anomaly problem of the communication module), locate the specific chip or area (such as PA, PMIC, etc.), and output structured anomaly information to help engineers quickly troubleshoot the causes of thermal anomalies in the communication module during MTBF testing and optimize the thermal design scheme.
[0055] ii. Data Preparation: Input a dataset of precisely labeled thermal images. Each thermal image corresponds to one or more anomaly category labels. Based on common thermal anomaly types in MTBF testing, the defined anomaly categories include "PA local overheating," "PMIC diffused heating," and "insufficient memory temperature rise," while retaining the "no anomaly" label as a control. For locatable anomalies (such as PA local overheating and PMIC diffused heating), the bounding box of the anomaly region should be marked on the thermal image, or a pixel-level segmentation mask should be provided to clearly indicate the specific location of the abnormal heating, ensuring the accuracy and completeness of the labeling.
[0056] iii. Model Selection and Training: A multi-task learning network is used to construct an anomaly classification and localization model, achieving end-to-end joint training of anomaly classification and region localization, as detailed below: Backbone network: The same deep CNN as the anomaly detection layer is selected as the shared backbone network, preferably ResNet-50 or EfficientNet, to extract general features of thermal images, realize feature reuse, reduce model training load, and ensure the consistency of feature extraction. Task 1: Connect a fully connected layer after sharing features to output the classification probability of each anomaly category, thereby achieving accurate judgment of anomaly type; Task 2: Connect a U-Net or DeepLab-style segmentation head after sharing features to output pixel-level "abnormal / normal" segmentation maps, or directly segment the regions corresponding to different abnormal categories to achieve accurate localization of abnormal regions; Training: End-to-end joint training is performed using labeled data for classification and localization. The loss function is a weighted sum of classification loss (such as cross-entropy) and localization loss (such as Smooth L1 Loss for bounding box regression or Dice Loss for segmentation). Specifically, end-to-end joint training is performed using the labeled dataset mentioned above. During training, a weighted loss function is used, consisting of classification loss and localization loss: cross-entropy loss is used for classification to optimize the classification accuracy of anomaly categories; Smooth L1 Loss for bounding box regression (suitable for bounding box annotation) or Dice Loss for segmentation (suitable for pixel-level segmentation mask annotation) is used for localization to optimize the localization accuracy of anomaly regions; by adjusting the weights of the two types of losses, the model is ensured to achieve optimal performance in both classification and localization tasks. iv. Output: The final output of this layer is structured information consisting of (anomaly category, confidence level, anomaly region coordinates / mask). Specifically, after model training is complete, this layer receives the thermal imaging images of anomaly samples output by the anomaly detection layer. After processing, it outputs structured anomaly information, including anomaly category (e.g., "PA local overheating"), anomaly confidence level (characterizing the reliability of the model's judgment of the anomaly category), and anomaly region coordinates (boundary box coordinates) or segmentation mask. This provides direct evidence for the diagnosis and analysis of thermal anomalies in the communication module during testing.
[0057] This embodiment constructs a layered fusion diagnostic model through layered training of the two-layer model described above. This model can perfectly adapt to the thermal anomaly diagnosis requirements of communication modules. It can automatically screen for thermal anomalies under long-term and multi-condition testing through the anomaly detection layer, and accurately locate the root cause of anomalies through the anomaly classification and location layer. This greatly improves the diagnostic efficiency and accuracy of thermal verification of communication modules, shortens the testing cycle, and provides strong support for the thermal design optimization and reliability improvement of communication modules.
[0058] In some embodiments, the target knowledge graph includes network nodes, node attributes, and network edges. A network node is used to indicate a type of communication module information, the node attributes of the network node are used to indicate module details, and the network edges are used to indicate the association between connected network nodes.
[0059] For example, a diagnostic knowledge graph can be established as the target knowledge graph. This diagnostic knowledge graph associates thermal anomaly patterns, corresponding electrical load characteristics (such as PA overheating), and typical hardware / software root causes (such as "PA mismatch circuit misalignment," "partial short circuit in solder joints," etc.). After the classification layer of the target diagnostic model outputs its results, the most likely root cause chain can be recommended based on the diagnostic knowledge graph and synchronized electrical data. The specific steps are as follows: i. Objective: To deduce the most likely physical layer root cause by combining thermal anomaly patterns, synchronous electrical data, and historical knowledge.
[0060] ii. Knowledge graph construction: Identify core entities (i.e., network nodes): thermal anomaly patterns, electrical characteristics, hardware components, potential faults, process steps, and test scenarios.
[0061] Determine the attributes (i.e., node attributes): thermal anomaly mode - max_temp, electrical characteristics - PA current, potential fault - probability.
[0062] Determine the relationship: accompanying occurrence, causing, occurring at, related checkpoints.
[0063] Identify structured sources: Product BOM (e.g., Bill of Materials), Chip Specifications (e.g., Safety Temperature), Test Case Documentation.
[0064] Identify unstructured sources: Extract the "fault phenomenon - intermediate data - root cause" triples from historical failure analysis reports, engineer experience, and maintenance records using natural language processing (NLP) or manual analysis. For example, from an FA report, you can extract: [Phenomenon: Local hot spot in PA area] - (accompanying) - [Electrical characteristics: n78 band current is 20% higher than standard] - (root cause) - [Fault: Poor soldering of capacitor in PA output matching circuit].
[0065] Build graphs and visualizations: Use graph databases (such as Neo4j, Nebula Graph) for storage and develop visualization interfaces to facilitate reading and knowledge supplementation.
[0066] The aforementioned relationships, structured sources, and unstructured sources can all serve as associations for network edge indications.
[0067] In some embodiments, the step "analyzing the module data and anomaly information corresponding to the target thermal imaging image based on the target knowledge graph by the controller, so as to determine the analysis results of the abnormal communication module corresponding to the target thermal imaging image" may include: Based on the module data and anomaly information corresponding to the target thermal imaging image, the controller finds at least one target network node that matches the module data and anomaly information from the target knowledge graph. Based on the target network node, the target node attributes corresponding to the target network node, and the target network edge, the abnormal analysis information of the abnormal communication module is output as the analysis result.
[0068] For example, based on the module data and anomaly information corresponding to the target thermal imaging image, the root cause of thermal anomalies can be inferred and analyzed, generating accurate root cause hypothesis chains and inspection suggestions, as follows: (1) Node matching query: The input "thermal anomaly category" and "electrical characteristics" are used as joint query conditions to search for matching starting nodes (i.e., network nodes) in the pre-constructed diagnostic knowledge graph. Among them, electrical characteristics are extracted from the current / voltage and real-time power consumption data of each chip monitoring point in the communication module collected by the module carrier board. For example, when the anomaly category output by the target diagnostic model is PA local overheating, and the current of the PA chip monitoring point collected by the module carrier board is significantly higher, PA local overheating and PA current higher can be used as joint query conditions to accurately match the corresponding starting node in the diagnostic knowledge graph, ensuring the relevance of the query results.
[0069] (2) Related node traversal: After finding the matching starting node, perform a depth traversal along the preset relationship types such as "cause" and "related" in the diagnostic knowledge graph to filter out all "potential fault" nodes associated with the starting node. For example, taking "PA local overheating + PA current too large" as the starting node, traversing the related nodes in the knowledge graph that "cause" this abnormality can yield multiple potential fault nodes such as "PA matching circuit misalignment", "abnormal impedance of power supply line PCB trace", and "performance degradation of PA chip itself", thus achieving comprehensive discovery of potential faults.
[0070] (3) Assigning confidence weights to relationships: Confidence weights are assigned to the relationships between nodes in the diagnostic knowledge graph. The weights are determined based on the frequency of fault occurrence in historical thermal anomaly diagnostic data, combined with industry expert scores, to ensure the rationality and reliability of the weights. For example, in historical data, the frequency of PA mismatch leading to PA local overheating and PA current overheating is 90%, and the expert score is 95, so the confidence weight of this relationship is set to 0.92; the frequency of abnormal impedance of power supply line PCB traces is 70%, and the expert score is 75, so the confidence weight is set to 0.72. The higher the weight value, the stronger the reliability of the relationship.
[0071] (4) Root cause probability calculation and ranking: Using the Personalized PageRank graph algorithm or Bayesian inference network, the input anomaly category, anomaly region and synchronous multimodal data are used as observation evidence to calculate the subsequent verification probability of each potential fault node. All potential fault nodes are ranked according to their probability to generate a complete root cause hypothesis chain and provide corresponding inspection suggestions.
[0072] For example, when the input data is: anomaly category "PA local overheating", anomaly area "PA chip surface", test scenario "high load emission", PA chip monitoring point current is too high, real-time power consumption is too high, and ambient temperature is normal, after the above inference process, the model outputs the following root cause hypothesis chain and suggestions: most likely root cause (95%): PA matching circuit misalignment; second most likely root cause (70%): abnormal impedance of power supply line PCB trace; suggested checkpoints: 1. Check whether there is cold solder joint or false solder joint of C201 capacitor to ensure good capacitor contact; 2. Measure whether the L5 inductance value meets the design standard and check for abnormal inductance parameters; 3. Check the PCB trace impedance of PA chip power supply line to confirm whether there are abnormalities such as excessively thin traces or short circuits.
[0073] (5) Continuous learning and system evolution: After each diagnosis, the diagnostic knowledge graph feeds back the final root cause confirmed by actual maintenance / FA to the system. If the diagnosis is correct, the confidence weight of the corresponding path is strengthened; if the diagnosis is wrong or a new root cause is found, the engineer reviews it and enters the new knowledge (new entities, relationships, cases) into the diagnostic knowledge graph to achieve continuous learning and performance improvement of the system.
[0074] For example, please refer to Figure 5 The results of the "PA local overheating" network node being associated with multiple electrical and root cause nodes such as "high load current", "n41 / n78 frequency band", "solder joint voids", and "insufficient thermal paste" can be displayed in the form of a graph, along with root cause diagnosis suggestions.
[0075] The hierarchical fusion diagnostic model in this embodiment significantly improves the diagnostic efficiency and accuracy of communication module thermal verification through multimodal data synchronous fusion and graph inference. It effectively shortens the thermal anomaly diagnosis time during the testing process, reduces R&D costs, and provides strong data support and directional guidance for the thermal design optimization and reliability improvement of communication modules, ensuring the operational stability of communication modules under various working conditions.
[0076] In this embodiment, online automated diagnostics and visualization report generation are possible. Specifically, for communication modules in production lines or R&D testing (internal R&D phase thermal testing or reliability testing), thermal images of the modules under the target testing scenario can be acquired, and module data corresponding to their working status can be synchronized. Then, the thermal images are input into the deployed target diagnostic model, and a diagnostic report is automatically output. The output content may include: (1) Abnormal alarm: Is there an abnormality? Set a safe upper limit temperature based on the specifications of each chip in the module or experience (such as junction temperature Tj max - safety margin). Identify any point in the chip area under test that exceeds this threshold, which is a serious abnormal point.
[0077] (2) Visualized thermal imaging: The thermal imaging image of the target communication module under test is compared with the baseline thermal imaging model generated by big data at the pixel level or region level. On the original thermal imaging image, abnormal heating areas are accurately outlined with a highlight outline, and different abnormal categories are marked with different colors.
[0078] (3) Quantitative diagnostic conclusion: Determine the anomaly category, which may include local hot spots, local cold spots, and overall temperature rise anomalies. For example, it may be "A 'local hot spot' anomaly was detected in the BB chip area, with a T_max of 95°C, which is 15°C higher than that of good products in the same batch. Based on the synchronization data, this anomaly occurred during high-power transmission in the n41 band. It is recommended to prioritize checking the back solder joints and heat dissipation design of BB".
[0079] (4) Trend analysis and early warning: For the target communication module under continuous testing, a historical trend chart of temperature rise in its key chip area can be drawn to provide early warning when there are small but continuous abnormal changes in the shape.
[0080] In summary, the communication module testing method provided in this application acquires module data and thermal imaging images of the target communication module through a communication module testing device. This allows the controller to analyze the thermal imaging images and module data corresponding to each target communication module, obtaining the analysis results. This effectively breaks down the isolation barrier of thermal imaging data during thermal verification and diagnostic analysis. While collecting temperature distribution and thermal imaging information of the communication module, it also collects module data during operation, achieving synchronous linkage between temperature data and the module's real-time operating status. By combining the actual operating conditions of the communication module, it can accurately analyze and trace the root cause of abnormal temperature rise, significantly improving the diagnostic accuracy of communication module thermal verification and effectively enhancing the overall efficiency of thermal verification analysis and diagnosis.
[0081] Figure 6 This is a schematic diagram of the structure of an electronic device provided in some embodiments of this application. Figure 6 The dashed line in the text indicates that the unit or module is optional. Figure 6The electronic device 400 can be used to implement the methods described in the above method embodiments. The electronic device 400 can be a chip, a terminal device, or a first server.
[0082] Electronic device 400 may include one or more processors 410. The processor 410 may support the electronic device 400 in implementing the methods described in the preceding method embodiments. The processor 410 may be a general-purpose processor or a special-purpose processor. For example, the processor may be a Central Processing Unit (CPU). Alternatively, the processor may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.
[0083] The electronic device 400 may also include one or more memories 420. Computer programs are stored on the memories 420. The memories 420 may be independent of the processor 410 or integrated into the processor 410.
[0084] Electronic device 400 may also include transceiver 430. Processor 410 can communicate with other devices or chips via transceiver 430. For example, processor 410 can send and receive data with other devices or chips via transceiver 430.
[0085] The computer program in memory 420 can be executed by processor 410, causing processor 410 to perform the following steps: If the target operating system cannot be booted based on the first system file, operation prompts are displayed through the graphical user interface of the terminal device. The operation prompts are used to prompt the user to trigger a system recovery operation for the target operating system. In response to a system recovery operation targeting the target operating system, read the second system files from the storage partition; The first system file is adjusted based on the data in the second system file in order to restore the target operating system.
[0086] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be performed by instructions, or by instructions controlling related hardware. These instructions can be stored in a computer-readable storage medium and loaded and executed by a processor.
[0087] Therefore, embodiments of this application provide a computer-readable storage medium storing a computer program thereon. The computer program is loaded by a processor to execute the steps described in the above-described method embodiments of this application. For example, the computer program loaded by the processor can execute the following steps: If the target operating system cannot be booted based on the first system file, operation prompts are displayed through the graphical user interface of the terminal device. The operation prompts are used to prompt the user to trigger a system recovery operation for the target operating system. In response to a system recovery operation targeting the target operating system, read the second system files from the storage partition; The first system file is adjusted based on the data in the second system file in order to restore the target operating system.
[0088] For details on the implementation of each of the above operations / steps, please refer to the previous examples, which will not be repeated here.
[0089] The computer-readable storage medium may include: read-only memory (ROM), random access memory (RAM), disk or optical disk, etc.
[0090] Since the computer program stored in the computer-readable storage medium can execute the steps in any of the above method embodiments provided in the embodiments of this application, the beneficial effects that the methods described in any of the above method embodiments can achieve can be realized, as detailed in the preceding embodiments, and will not be repeated here.
[0091] This application also provides a computer program product or computer program that includes computer instructions stored in a computer-readable storage medium. A processor of an electronic device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the electronic device to perform the methods provided in the various optional implementations of the above embodiments.
[0092] The foregoing has provided a detailed description of a communication module testing device, a testing method for a communication module, the device itself, and the medium provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.
Claims
1. A communication module testing device, characterized in that, The communication module testing equipment includes a module carrier and a thermal imaging device. The module carrier is used to place the communication module, and the communication module is connected to the controller through the module carrier. The module carrier is configured to receive a test command from the controller for at least one target communication module, to control the target communication module to enter a test state, and to collect module data generated by the target communication module in the test state, and to send the module data of the target communication module to the controller. The thermal imaging device is configured to capture images of the target communication modules in the test state to obtain thermal images of each target communication module, and to send the thermal images of each target communication module to the controller so that the controller can analyze the thermal images and module data corresponding to each target communication module to obtain the analysis results of the target communication modules.
2. The communication module testing equipment according to claim 1, characterized in that, The module carrier includes a module carrier plate, which is used to place at least one communication module so that the communication module can communicate with the controller through the module carrier plate.
3. The communication module testing equipment according to claim 1, characterized in that, The communication module testing equipment also includes a mobile device, which is connected to the thermal imaging device and is communicatively connected to the controller. The mobile device is configured to receive a movement command issued by the controller to control the mobile device to move the thermal imaging device to the target position corresponding to the movement command.
4. The communication module testing equipment according to claim 3, characterized in that, The moving device includes a first slide bar, which is slidably connected to the thermal imaging device so that the thermal imaging device moves on the first slide bar when it receives a first moving command from the controller. The two ends of the first slide rod are respectively located in the first slide rail and the second slide rail, so that the first slide rod moves on the first slide rail and the second slide rail when it receives the second movement command issued by the controller; The two ends of the first slide rail are respectively located in the third slide rail and the fourth slide rail, so that the first slide rail moves on the third slide rail and the fourth slide rail when it receives the third movement command issued by the controller; The two ends of the second slide rail are located in the fifth slide rail and the sixth slide rail respectively, so that the second slide rail moves on the fifth slide rail and the sixth slide rail when it receives the fourth movement command issued by the controller.
5. A testing method for a communication module, characterized in that, The method, applied to the communication module testing equipment as described in any one of claims 1 to 4, comprises: Receive test commands sent by the controller for at least one target communication module, and control the target communication module to enter the test state; Collect module data generated by the target communication module under the test state, and send the module data of the target communication module to the controller; The thermal imaging device of the communication module testing equipment is controlled to take pictures of the target communication module in the test state to obtain thermal images of each target communication module. The thermal images of each target communication module are sent to the controller, so that the controller can analyze the thermal images and module data corresponding to each target communication module to obtain the analysis results of the target communication module.
6. The method according to claim 5, characterized in that, The module carrier device of the communication module testing equipment includes multiple test areas, and each test area includes at least one communication module. The thermal imaging device controlling the communication module testing equipment takes pictures of the target communication modules in the testing state to obtain thermal images of each target communication module, including: Based on the target test area where the target communication module is located, control the thermal imaging device of the communication module test equipment to move to the target position corresponding to the target test area; The thermal imaging device of the communication module testing equipment is controlled to take pictures of the target communication module in the test state at the target location to obtain thermal images of each target communication module.
7. The method according to claim 5, characterized in that, The step of sending thermal images of each of the target communication modules to the controller, so that the controller can analyze the thermal images and module data corresponding to each target communication module to obtain the analysis results of the target communication modules, including: The thermal images of each target communication module are sent to the controller, so that the controller can use a target diagnostic model to diagnose the thermal images of each target communication module, filter out the target thermal images with anomalies from each thermal image, and determine the abnormal communication module and the corresponding anomaly information based on the target thermal images; the controller analyzes the module data and anomaly information corresponding to the target thermal images based on the target knowledge graph to determine the analysis results of the abnormal communication module corresponding to the target thermal images.
8. The method according to claim 7, characterized in that, The abnormal information includes abnormal location information and abnormal type information. The abnormal location information is used to indicate the location where an abnormality exists in the abnormal communication module.
9. The method according to claim 7, characterized in that, The target knowledge graph includes network nodes, node attributes, and network edges. A network node is used to indicate information about a type of communication module. The node attributes of the network node are used to indicate module details. The network edges are used to indicate the relationships between connected network nodes.
10. The method according to claim 9, characterized in that, The step of analyzing the module data and anomaly information corresponding to the target thermal imaging image based on the target knowledge graph by the controller to determine the analysis results of the abnormal communication module corresponding to the target thermal imaging image includes: The controller finds at least one target network node that matches the module data and the anomaly information from the target knowledge graph based on the module data and anomaly information corresponding to the target thermal image. Based on the target network node, the target node attributes corresponding to the target network node, and the target network edge, the abnormal analysis information of the abnormal communication module is output as the analysis result.
11. An electronic device, characterized in that, It includes a memory and a processor, wherein the memory stores computer programs or instructions, and when the computer programs or instructions are executed by the processor, the processor causes the processor to perform the following steps: Receive test commands sent by the controller for at least one target communication module, and control the target communication module to enter the test state; Collect module data generated by the target communication module under the test state, and send the module data of the target communication module to the controller; The thermal imaging device of the control communication module testing equipment takes pictures of the target communication module in the test state to obtain thermal images of each target communication module. The thermal images of each target communication module are sent to the controller, so that the controller can analyze the thermal images and module data corresponding to each target communication module to obtain the analysis results of the target communication module.
12. A computer-readable storage medium, characterized in that, It stores a computer program or instructions thereon, which, when executed by a processor, implement the steps in the test method for the communication module as described in any one of claims 5 to 10.